KR200363858Y1 - Film typed thermistor temperature sensor - Google Patents

Abstract

A pair of first conductive terminals formed at one end of the surface of the polyimide base film, a conductive pattern extending in the longitudinal direction from each of the conductive terminals, and having at least one branch terminal, and a first conductive terminal at one end of the back surface of the polyimide base film A second conductive terminal is formed to correspond to the polyimide cover film is bonded to the polyimide base film to expose the other end of the first conductive terminal and the conductive pattern, and thermistor chip is fixed to the other end of the conductive pattern in a surface mount method The film type thermistor temperature sensor which apply | coated the polymer resin protective film to the other end of the conductive pattern containing a thermistor chip is disclosed.

Description

Film type thermistor temperature sensor

The present invention relates to a film type thermistor temperature sensor, and more particularly, to protect a pair of polyimide film and thermistor chip for protecting the conductive pattern and the conductive pattern electrically connected to the thermistor chip for surface mounting and the thermistor chip. The present invention relates to a thermistor temperature sensor of a film type, which is composed of a polymer resin for the purpose of making the manufacturing process simple and inexpensive and highly reliable.

In addition, the present invention relates to a film type thermistor temperature sensor that forms conductive terminals on both sides of the polyimide film and is difficult to be cut even by external physical force.

Referring to the structure of a conventional film type thermistor temperature sensor, taking the thermistor temperature sensor (JT Series) of Semitec, Japan as follows.

A thermistor chip was inserted between the metal leads at one end of the two metal leads using a metal frame by a metal press, and heat and pressure were applied in a vacuum to bond two polyimide films up and down to prepare a film type thermistor temperature sensor.

However, conventional thermistor thermostats having such a configuration have various disadvantages.

Since there is a difference in height between the area where the thermistor chip is located between the two polyimide films and the area where the thermistor chip is located, it is difficult to attach the film by applying a constant force to all parts, which requires expensive equipment and mass production.

In addition, since the metal lead must be protruded to the outside of the film in order to be connected to an external electronic circuit, the metal lead protruded to the outside may be cut when the force is repeatedly applied from the outside.

In addition, when attaching the thermistor chip to the metal lead, the thermistor chip must be sandwiched between the metal leads and the soldering process must be performed, so it is difficult to produce a product having a certain size or less because the metal lead must maintain a certain size or more. It is difficult to provide products of various shapes.

In addition, since the protective film material and dimensions are the same for all parts of the film type thermistor temperature sensor, it is always covered with the same protective film on the thermistor chip that exhibits the characteristics of the temperature sensor. The disadvantage is that there is no special way to protect the thermistor chip from external physical shocks.

In addition, since it is impossible to form another conductive pattern on the thermistor temperature sensor, there is a disadvantage in that a simple electronic circuit may be formed by mounting a simple electronic component on the thermistor temperature sensor to make a film type thermistor temperature sensor module.

Accordingly, an object of the present invention is to provide a film type thermistor temperature sensor having a low cost and high reliability due to a simple manufacturing process.

In addition, another object of the present invention is to provide a film type thermistor temperature sensor which improves the response speed of the thermistor chip.

In addition, another object of the present invention is to provide a thermistor temperature sensor of the film type is difficult to cut the metal lead by the force applied from the outside.

Other objects and features of the present invention will be clearly understood through the preferred embodiments described below.

1 is a perspective view showing a film type thermistor temperature sensor according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of portion A of FIG. 1.

3 is an enlarged perspective view illustrating a mounting portion of a thermistor chip in the thermistor temperature sensor of FIG. 1.

4 is a cross-sectional view showing an actual use example of the present invention.

According to an aspect of the present invention, the first protective film; A pair of first conductive terminals formed at one end of the surface of the first passivation layer and conductive patterns extending in the longitudinal direction from the first conductive terminals, respectively; A second conductive terminal formed at one end of a rear surface of the first passivation layer corresponding to the pair of first conductive terminals; A second passivation layer adhered to a surface of the first passivation layer so that the other end of the first conductive terminal and the conductive pattern is exposed; A thermistor chip fixed to the other end of the conductive pattern by a surface mount method; And a third protective film coated on the other end of the conductive pattern including the thermistor chip.

Preferably, the first and second protective films are polyimide films and the third protective film is a polymer resin.

The thermally conductive ceramic powder may be uniformly mixed with the polymer resin to improve the response speed of the thermistor chip.

In addition, via holes penetrating each other are formed in the first and second conductive terminals, and U-cuts are formed in the outermost side surfaces of the first and second conductive terminals.

According to another aspect of the present invention, a polyimide base film; A conductive pattern extending in a longitudinal direction from each of a pair of first conductive terminals and first conductive terminals formed at one end of a surface of the polyimide base film and having at least one branch terminal; A second conductive terminal formed at one end of the back surface of the polyimide base film corresponding to the pair of first conductive terminals; An electronic component device electrically connected to the branch terminal of the conductive pattern; A polyimide cover film adhered to the polyimide base film to expose the other end of the first conductive terminal and the conductive pattern; A thermistor chip fixed to the other end of the conductive pattern by a surface mount method; And a thermistor temperature sensor module of the film type comprising a polymer resin protective film is applied to the other end of the conductive pattern including a thermistor chip.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention.

1 is a perspective view showing a film type thermistor temperature sensor according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view of part A of FIG. 1, and FIG. 3 is a mounting of the thermistor chip in the thermistor temperature sensor of FIG. 1. It is the perspective view which expanded the part to become.

As shown, the film type thermistor temperature sensor according to an embodiment of the present invention is the first protective film 20 and the first protective film formed with a conductive pattern 30 on one surface and the conductive terminal 32 on the opposite surface. A second passivation layer 10 is bonded to expose the conductive pattern 30 and the thermistor chip on one surface of the 20, and a third passivation layer 40 covering the thermistor chip at one end of the second passivation layer 10.

Referring to FIG. 2, conductive patterns 30 and second conductive terminals 32a and 32b having first conductive terminals 30a and 30b formed at ends thereof are formed on the front and rear surfaces of the first passivation layer 20, respectively.

Via holes 34 are formed in the first and second conductive terminals 30a, 30b, 32a, and 32b, respectively, and are aligned to penetrate up and down. When soldering, the lower solder rises through the via holes 34. The first and second conductive terminals are electrically connected. Furthermore, the solder filled in the via hole 34 serves as an anchor for the object to be fixed by strengthening the mechanical coupling of the first and second conductive terminals. Preferably, the via holes 34 allow at least one to be formed.

In addition, preferably, the U cut 36 is formed on the outermost side surfaces of the first and second conductive terminals, and as will be described later, the lower portion of the solder is U-cut to the first conductive terminals 30a and 30b. Make it easy to climb through (36).

The conductive pattern 30 and the second conductive terminals 32a and 32b may be formed through a chemical etching process. The polyimide film 20 having copper foil layers formed on both surfaces thereof may be processed into a desired pattern through a photo etching process. .

In the etching process, the conductive pattern 30 and the second conductive terminals 32a and 32b are left to be etched. If necessary, the etching may be performed to form a separate terminal for connecting other passive elements.

Referring to FIG. 3, the other end of the conductive pattern 30 is mounted in the surface mount method of the thermistor chip 1.

The first passivation layer 10 is bonded to the second passivation layer 20 by using a hot melt adhesive or the like, and the first conductive terminals 30a and 30b and the conductive pattern 30 are exposed at both ends of the first passivation layer 10. To be adhered to. In this case, since the thermistor chip 1 is not mounted on the conductive pattern 30, the overall height is almost uniform, so that mass production can be easily performed.

Subsequently, the electrode 1a of the surface mount thermistor chip 1 is mounted using the surface mount mounter so that the electrode 1a is placed on the conductive pattern 30 and then electrically connected and fixed through a reflow process.

Thereafter, a polymer resin 40 such as an epoxy resin or a silicone resin is applied and cured. As a coating method, a dispensing or a dipping method can be used.

By using the polymer resin as the third protective film 30 to protect the thermistor chip, the thickness and the material of the coating can be easily selected according to the use environment. For example, uniform thermal conductive ceramic powder such as boron nitride or aluminum oxide is uniform. Mixing can be used to improve the response speed of the thermistor chip. It may also be coated thicker than the polyimide film thickness to physically protect the thermistor chip.

In addition, preferably, after the third protective film 40 is applied to physically protect the thermistor chip when exposed to the outside, a thermal conductive epoxy resin or the like may be applied and the metal case may be covered to cover the third protective film 40. Can be.

4 is a cross-sectional view showing an actual use example of the present invention.

When an IC such as a microprocessor is mounted on a printed circuit board PCB, a film type thermistor temperature sensor according to the present invention may be used to check the temperature of the IC by the heat generated from the IC.

At this time, the film type thermistor temperature sensor according to the present invention is thin and flexible, and because the conductive terminal is mounted in a surface-mounted manner on the printed circuit board PCB, it can be inserted between the IC and the printed circuit board without bending and thus accurate temperature measurement is possible. Can be.

On the other hand, as described above, the thermistor temperature sensor module of the film type can also be manufactured by designing the conductive pattern so that the electronic component element can be electrically connected to and mounted on the conductive pattern on the polyimide film.

In the above described with reference to a preferred embodiment of the present invention, various changes or modifications can be made within the scope without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be limited to the above embodiment, but should be determined by the utility model registration claims described below.

As described above, the present invention has various advantages.

First, since the conductive terminals exposed to the outside are fixed to both surfaces through a polyimide film, cutting is difficult even if external physical force is applied. In particular, after being mounted on an object such as a printed circuit board, the conductive terminals fixed to both sides are physically coupled to each other by solder filled through via holes formed in the conductive terminals.

In addition, by applying the thermistor chip using a protective film of a different material at the portion where the thermistor chip is attached, it is possible to adjust the coating thickness according to the use environment or to add a material to add functional properties.

In addition, by forming the conductive pattern and the conductive terminal by an etching process, the thickness and size of the conductive pattern can be freely adjusted, and fine patterns can be formed.

Furthermore, in the step before attaching the thermistor chip, the overall height is uniform, and by mounting the thermistor chip in the surface mount method through the reflow process, mass production is possible and the resulting manufacturing cost can be reduced.

In addition, the thermistor temperature sensor module of the film type may be manufactured by designing the conductive pattern so that the electronic component element may be electrically connected to and mounted on the conductive pattern on the polyimide film.

Claims (6)

A first protective film; A conductive pattern extending in a longitudinal direction from the pair of first conductive terminals and the first conductive terminal formed at one end of the surface of the first passivation layer, respectively; A second conductive terminal formed at one end of the rear surface of the first passivation layer corresponding to the pair of first conductive terminals; A second passivation layer adhered to a surface of the first passivation layer to expose the first conductive terminal and the other end of the conductive pattern; A thermistor chip fixed to the other end of the conductive pattern by a surface mount method; And And a third passivation layer applied to the other end of the conductive pattern including the thermistor chip. 2. The film type thermistor temperature sensor as claimed in claim 1, wherein the first and second protective films are polyimide films, and the third protective film is a polymer resin. The film type thermistor temperature sensor according to claim 2, wherein the polymer resin is uniformly mixed with thermally conductive ceramic powder to improve the response speed of the thermistor chip. The film-type thermistor temperature sensor according to claim 1 or 2, wherein the first and second conductive terminals are formed with via holes penetrating each other. 5. The film type thermistor temperature sensor of claim 4, wherein a U-cut is formed on outermost side surfaces of the first and second conductive terminals. Polyimide base film; A conductive pattern extending from the first conductive terminal and a pair of first conductive terminals formed at one end of the surface of the polyimide base film and having at least one branch terminal; A second conductive terminal formed at one end of a rear surface of the polyimide base film corresponding to the pair of first conductive terminals; An electronic component device electrically connected to a branch terminal of the conductive pattern; A polyimide cover film bonded to the polyimide base film to expose the first conductive terminal and the other end of the conductive pattern; A thermistor chip fixed to the other end of the conductive pattern by a surface mount method; And Thermistor temperature sensor module of the film type comprising a polymer resin protective film is applied to the other end of the conductive pattern including the thermistor chip.