KR20030038048A - Laminator apparatus for grinding of wafer backside and operation method thereof - Google Patents
Laminator apparatus for grinding of wafer backside and operation method thereof Download PDFInfo
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- KR20030038048A KR20030038048A KR1020010069458A KR20010069458A KR20030038048A KR 20030038048 A KR20030038048 A KR 20030038048A KR 1020010069458 A KR1020010069458 A KR 1020010069458A KR 20010069458 A KR20010069458 A KR 20010069458A KR 20030038048 A KR20030038048 A KR 20030038048A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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Abstract
Description
본 발명은 반도체 소자의 제조에 사용되는 장비에 관한 것으로, 더욱 상세하게는 웨이퍼를 이면 연마하는데 사용되는 라미네이터(laminator) 장비 및 그 운용방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to equipment used in the manufacture of semiconductor devices, and more particularly, to laminator equipment used for backside polishing wafers and a method of operating the same.
최근들어 전자장치들이 소형화를 추구함에 따라, 전자장치에 사용되는 반도체 소자 역시 경박 단소화를 위해 변신을 거듭하고 있다. 이에 따라 반도체 패키지에 있어서는, 반도체 패키지의 두께를 감소시키기 위해 새로운 형태의 반도체 패키지의 개발이 계속 진행이다. 또한, 일반적인 반도체 패키지, 예를 들면, TSOP(Thin Small Out-line Package), TQFP(Thib Quad Flat Package)등에서는, 와이어 본딩 공정에서 와이어의 루프 높이(loop height: 와이어 본딩이 되는 높이)를 낮추고, 반도체 칩의 이면(backside)을 연마(grinding)하는 공정 등이 반도체 패키지의 두께를 감소시키기 위해 채택되고 있다.In recent years, as electronic devices are pursuing miniaturization, semiconductor devices used in electronic devices are also being transformed for light and small size. Accordingly, in the semiconductor package, development of a new type of semiconductor package continues to reduce the thickness of the semiconductor package. In addition, in a general semiconductor package, for example, a thin small out-line package (TSOP), a thin quad flat package (TQFP), and the like, the loop height of the wire in the wire bonding process is reduced. For example, a process of grinding the backside of the semiconductor chip is adopted to reduce the thickness of the semiconductor package.
일반적으로 반도체 칩의 이면 연마는, 웨이퍼 단위로 수행되어지며, 반도체 소자의 조립 공정(assembly process) 이전에 수행된다. 이러한 웨이퍼 이면 연마공정은, 크게 ① 웨이퍼 전면에 테이프를 접착하는 공정, ② 상기 테이프가 접착된 웨이퍼의 이면을 연마하는 공정 및 ③ 상기 연마가 완료된 웨이퍼로부터 테이프를 제거하는 공정으로 이루어진다. 이때, 웨이퍼 전면에 테이프를 부착하는 이유는,웨이퍼 이면에 대한 연마가 진행되는 동안에 웨이퍼 전면에 오염물질 및 기타 이물질이 부착되어 반도체 소자의 특성이 열화되는 것을 방지하기 위한 목적이다.In general, the backside polishing of the semiconductor chip is performed on a wafer basis and is performed before the assembly process of the semiconductor device. This wafer backside polishing step is largely composed of 1) a step of adhering a tape to the front surface of the wafer, 2) a step of polishing the back side of the wafer to which the tape is adhered, and 3) a step of removing the tape from the wafer on which the polishing is completed. In this case, the reason why the tape is attached to the front surface of the wafer is to prevent contaminants and other foreign matters from adhering to the front surface of the wafer during polishing of the back surface of the wafer to prevent deterioration of characteristics of the semiconductor device.
여기서, 라미네이터(laminator) 장비는 상기 웨이퍼 전면에 오염방지를 위한 테이프를 접착하는 공정에 사용되는 장비이다. 도 1은 종래 기술에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비의 개략적인 블록도이고, 도 2는 종래기술에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비의 개략적인 작업진행도(flow chart)이다.Here, the laminator (laminator) equipment is used in the process of adhering the tape for preventing contamination on the front surface of the wafer. 1 is a schematic block diagram of a laminator equipment for polishing the wafer back surface according to the prior art, and FIG. 2 is a schematic flow chart of the laminator equipment for polishing the wafer back surface according to the prior art.
도 1 및 도 2를 참조하면, 종래기술에 의한 라미네이터 장비(10)는 크게 적재 및 하역부(loading & unloading unit, 12), 정렬부(alignment unit, 14), 트랜스퍼 암(transfer arm, 16), 테이프 접착부(tape attachment unit, 18), 테이프 커팅부(tape cutting unit, 20) 및 로봇 암(robot arm)으로 구성된다.1 and 2, the laminator equipment 10 according to the prior art is largely loaded and unloading unit (loading & unloading unit, 12), alignment unit (alignment unit, 14), transfer arm (transfer arm, 16), A tape attachment unit 18, a tape cutting unit 20, and a robot arm.
이러한 라미네이터 장비(10)를 이용한 테이프 접착공정은, 먼저 웨이퍼가 적재된 카세트(cassette)를 라미네이터 장비(10)의 적재 및 하역부로 로딩(loading)한다. 그러면, 라미네이터 장비(10)의 로봇 암(22)이 카세트로부터 웨이퍼를 꺼내 정렬부(14)로 이송(도1의 ①)시킨다. 그러면 정렬부(14)에서는 웨이퍼를 오른쪽 혹은 왼쪽으로 회전시키면서 웨이퍼에 있는 플랫 존(웨이퍼의 상하 방향을 구별하기 위해 형성한 직선영역)을 찾아서 정렬을 완료한다.In the tape bonding process using the laminator equipment 10, first, a cassette loaded with a wafer is loaded into the loading and unloading portion of the laminator equipment 10. Then, the robot arm 22 of the laminator equipment 10 removes the wafer from the cassette and transfers it to the alignment unit 14 (1 in Fig. 1). The alignment unit 14 then completes the alignment by finding the flat zone (linear region formed to distinguish the vertical direction of the wafer) on the wafer while rotating the wafer to the right or left.
상기 정렬이 완료된 웨이퍼는 트랜스퍼 암(16)에 의해 테이프 접착부(18)로 이송(도1의 ②)된다. 상기 테이프 접착부(18)에서는 웨이퍼의 전면에 오염 방지용 테이프를 부착하는데, 통상 롤러(roller)를 사용해 접착시킨다. 접착이 완료된 웨이퍼는 다시 로봇 암(22)에 의해 테이프 커팅부(20)로 이송(도1의 ③)되어 웨이퍼의 크기 즉 원주면을 따라 테이프를 절단하게 된다. 절단이 완료된 웨이퍼는 다시 로봇 암(22)에 의해 적재 및 하역부(12)로 이송(도1의 ④)되어 카세트의 슬롯(slot)에 넣어진다.The wafer after the alignment is completed is transferred to the tape attaching portion 18 by the transfer arm 16 (2 in FIG. 1). In the tape adhesive portion 18, a tape for preventing contamination is attached to the entire surface of the wafer, and is usually adhered using a roller. The bonded wafer is transferred back to the tape cutting unit 20 by the robot arm 22 (3 in FIG. 1) to cut the tape along the size of the wafer, that is, the circumferential surface. The wafer which has been cut is again transferred to the loading and unloading part 12 by the robot arm 22 (4 in Fig. 1) and put into the slot of the cassette.
그러나, 상술한 종래 기술에 의한 라미네이터 장비는 다음과 같은 문제점을 지니고 있다.However, the above-described laminator equipment according to the prior art has the following problems.
첫째, ①~④에 이르는 너무 잦은 웨이퍼 이동으로 인하여 웨이퍼가 가공 중에 깨질 수 있는 문제점이 발생한다.First, there is a problem that the wafer may be broken during processing due to too many wafer movements ranging from ① to ④.
둘째, 웨이퍼의 이동은 대부분 로봇 암에 의해 이루어지는데, 로봇 암(robot arm)은 타이밍 밸트(timing belt)와 같은 기계적 장치에 의해 구동된다. 이에 따라, 라미네이터 장비가 노후화 됨에 따라 로봇 암의 잦은 괘도 이탈, 그리고 로봇 암을 구동하는 진공압력의 변동, 로봇 암에 있는 핑거(finger)의 휘어짐 등에 기인하여 웨이퍼를 이동시켜 지정된 위치로 놓는데 편차가 발생하게 된다. 이러한 편차는 커지면 커질수록 웨이퍼가 이동간 깨질 수 있는 위험이 증대하고, 공정 결함이 발생될 확률 역시 높아지는 문제점이 있다.Second, the movement of the wafer is mostly done by a robot arm, which is driven by a mechanical device such as a timing belt. Accordingly, as the laminator equipment ages, the wafer is moved to a specified position due to frequent deviation of the robot arm, fluctuations in the vacuum pressure driving the robot arm, and bending of the finger on the robot arm. Will occur. The larger the deviation, the greater the risk that the wafer may break during movement, and the higher the probability that a process defect may occur.
셋째, 라미네이터 장비 내에서 웨이퍼를 움직이는 동선이 너무 길어, 가공시간이 길어지기 때문에 장비의 효율이 저하되는 문제가 발생한다.Third, the copper wire that moves the wafer in the laminator equipment is too long, and the processing time becomes long, which causes a problem that the efficiency of the equipment is lowered.
넷째, 정렬부, 테이부 접착부 및 테이프 커팅부가 각각 별개의 위치에 존재하기 때문에 장비의 크기가 커져 공간 활용에 제약을 가져온다.Fourth, since the alignment portion, the tape portion adhesive portion and the tape cutting portion are present in separate positions, the size of the equipment is increased, which causes a limitation in space utilization.
본 발명이 이루고자 하는 기술적 과제는 상술한 문제점을 해결할 수 있는 웨이퍼 이면(backside) 연마를 위한 라미네이터 장비를 제공하는데 있다.An object of the present invention is to provide a laminator for wafer backside polishing that can solve the above problems.
본 발명이 이루고자 하는 다른 기술적 과제는 상기 라미네이터 장비의 운용방법을 제공하는데 있다.Another object of the present invention is to provide a method of operating the laminator equipment.
도 1은 종래 기술에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비의 개략적인 블록도이다.1 is a schematic block diagram of a laminator equipment for polishing a wafer backside according to the prior art.
도 2는 종래 기술에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비의 개략적인 작업진행도(flow chart)이다.Figure 2 is a schematic flow chart of the laminator equipment for polishing the wafer back surface according to the prior art.
도 3은 본 발명에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비의 개략적인 블록도이다.Figure 3 is a schematic block diagram of a laminator equipment for polishing the back surface of the wafer according to the present invention.
도 4는 본 발명에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비의 정렬 테이블(alignment table)을 도시한 평면도이다.4 is a plan view showing an alignment table of the laminator equipment for polishing the wafer back surface according to the present invention.
도 5는 본 발명에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비의 개략적인 작업진행도(flow chart)이다.5 is a schematic flow chart of a laminator equipment for polishing a wafer back surface according to the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
100: 라미네이터 장비, 102: 적재 및 하역부,100: laminator equipment, 102: loading and unloading unit,
104: 로봇 암, 106: 정렬/접착/커팅부,104: robotic arm, 106: alignment / adhesion / cutting part,
110: 정렬테이블, 112: 웨이퍼 플랫 존(flat zone),110: alignment table, 112: wafer flat zone,
114: 웨이퍼 적재 척(chuck), 116: 테이프 절단선,114: wafer loading chuck, 116 tape cutting line,
118: 플랫 존 감지 센서, 108: 진공 홀(Vacuum hole).118: flat zone detection sensor, 108: vacuum hole.
상기 기술적 과제를 달성하기 위하여 본 발명은, 웨이퍼가 들어있는 카세트가 놓이는 적재 및 하역부와, 상기 적재 및 하역부로부터 카세트의 웨이퍼를 옮기는 역할을 수행하는 로봇 암(robot arm)과, 상기 로봇 암에 의해 옮겨진 웨이퍼를 정렬 테이블에서 가공하되, 정렬/테이프 접착/ 테이프 커팅을 한 곳(position)에서 수행하는 정렬/접착/커팅부를 구비하는 것을 특징으로 하는 웨이퍼 이면 연마를 위한 라미네이터(Laminator) 장비를 제공한다.In order to achieve the above technical problem, the present invention provides a loading and unloading portion on which a cassette containing a wafer is placed, a robot arm which serves to move a wafer of the cassette from the loading and unloading portion, and the robot arm. Provides a laminator for processing the wafer back surface, wherein the wafer is processed on an alignment table, and the alignment / adhesion / cutting unit performs alignment / tape adhesion / tape cutting in one position. .
상기 다른 기술적 과제를 달성하기 위하여 본 발명은, 웨이퍼가 적재된 카세트를 웨이퍼 이면 연마를 위한 라미네이터 장비의 적재 및 하역부로 로딩하는 제1 단계와, 상기 라미네이터 장비의 로봇 암이 상기 적재 및 하역부에 있는 카세트의 웨이퍼를 정렬/접착/커팅부로 이동시키는 제2 단계와, 상기 정렬/접착/커팅부에서 웨이퍼를 정렬하고, 테이프를 웨이퍼 전면에 부착하고, 테이프를 커팅하는 제3 단계와, 상기 가공이 끝난 웨이퍼를 적재 및 하역부로 언로딩하는 제4 단계를 구비하는 것을 특징으로 하는 웨이퍼 이면 연마를 위한 라미네이터 장비의 운용방법을 제공한다.In order to achieve the above another technical problem, the present invention provides a first step of loading a cassette loaded with a wafer into the loading and unloading portion of the laminator equipment for polishing the wafer back surface, and the robot arm of the laminator equipment is located at the loading and unloading portion. A second step of moving the wafer of the cassette to the alignment / gluing / cutting section, a third step of aligning the wafer at the alignment / gluing / cutting section, attaching the tape to the front surface of the wafer, cutting the tape, And a fourth step of unloading the finished wafer into the loading and unloading unit.
본 발명의 바람직한 실시예에 의하면, 상기 제3 단계는 웨이퍼를 이동시키지않고 정렬/접착/커팅부에 있는 정렬 테이블에서만 수행하는 것이 적합하다.According to a preferred embodiment of the present invention, the third step is suitably performed only at the alignment table in the alignment / adhesion / cutting portion without moving the wafer.
본 발명에 따르면, 라미네이터 장비 내에서 웨이퍼를 이동시키지 않고 한 위치에서 정렬/테이프 접착/테이프 커팅을 수행하여, 웨이퍼 깨짐과 같은 공정 결함을 억제하고, 설비의 크기를 축소시키고, 하나의 웨이퍼를 처리하는데 소요되는 작업시간을 단축할 수 있다.According to the present invention, alignment / tape adhesion / tape cutting is performed at one position without moving the wafer in the laminator equipment, thereby suppressing process defects such as wafer cracking, reducing the size of equipment, and processing one wafer. This can shorten the work time required to do this.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다. 그러나, 아래의 상세한 설명에서 개시되는 실시예는 본 발명을 한정하려는 의미가 아니라, 본 발명이 속한 기술분야에서 통상의 지식을 가진 자에게, 본 발명의 개시가 실시 가능한 형태로 완전해지도록 발명의 범주를 알려주기 위해 제공되는 것이다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments disclosed in the following detailed description are not meant to limit the present invention, but to those skilled in the art to which the present invention pertains, the disclosure of the present invention may be completed in a form that can be implemented. It is provided to inform the category.
도 3은 본 발명에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비의 개략적인 블록도이다.Figure 3 is a schematic block diagram of the laminator equipment for polishing the wafer back surface according to the present invention.
도 3을 참조하면, 본 발명에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비(100)의 구성은, ① 웨이퍼가 들어간 카세트가 놓이는 적재 및 하역부(102)와, ② 상기 적재 및 하역부(102)로부터 카세트의 웨이퍼를 옮기는 역할을 수행하는 로봇 암(robot arm, 104)과, ③ 상기 로봇 암(104)에 의해 옮겨진 웨이퍼를 정렬 테이블에서 가공하되, 정렬/테이프 접착/ 테이프 커팅을 한 곳(position)에서 수행하는 정렬/접착/커팅부(106)로 이루어진다.Referring to Figure 3, the configuration of the laminator equipment 100 for polishing the wafer back surface according to the present invention, ① the loading and unloading portion 102, the cassette is placed into the wafer, ② the loading and unloading portion 102 of the cassette Robot arm 104 which performs the function of moving the wafer, and ③ process the wafer transferred by the robot arm 104 at the alignment table, but performs alignment / tape adhesion / tape cutting in one place. Consisting of an alignment / adhesion / cutting part 106.
종래의 기술과 비교할 때의 차이점은, 정렬부, 테이프 접착부 및 테이트 커팅부가 별개로 존재하지 않고 통합되어 존재한다는 것이다. 따라서, 웨이퍼 가공을 위해 웨이퍼를 이송하는 절차를 최소화(도면의 ① 및 ②)시킬 수 있으며, 이에 따라 장비에 기인하여 공정간에 발생하는 웨이퍼 깨짐을 억제하고, 장비의 크기를 축소하고, 작업시간의 단축이 가능하게 된다.The difference compared to the prior art is that the alignment, the tape adhesive and the tate cutting are present separately and not in isolation. Therefore, the process of transferring wafers for wafer processing can be minimized (1 and 2 in the drawing), thereby suppressing wafer cracking occurring between processes due to the equipment, reducing the size of the equipment, and reducing the working time. Shortening is possible.
도 4는 본 발명에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비의 정렬 테이블(alignment table)을 도시한 평면도이고, 도 5는 본 발명에 의한 웨이퍼 이면 연마를 위한 라미네이터 장비의 개략적인 작업진행도(flow chart)이다.4 is a plan view showing an alignment table of the laminator equipment for wafer backside polishing according to the present invention, and FIG. 5 is a schematic flowchart of the laminator equipment for wafer backside polishing according to the present invention. )to be.
도 4 및 도 5를 참조하면, 웨이퍼가 적재된 카세트가 라미네이터 설비의 적재 및 하역부로 로딩(lading)된 후, 로봇 암에 의해 웨이퍼가 정렬/접착/커팅부로 이송된다. 그 후, 상기 정렬/접착/커팅부(도3의 106)에 있는 정렬 테이블에서는, 웨이퍼가 웨이퍼 적재 척(chuck) 위에 놓여져 진공 홀(108)에 의해 흡착된다. 상기 흡착된 웨이퍼는 다시 좌측 혹은 우측으로 회전되면서 플랫 존(112)이 플랫 존 센서(118)에 의해 감지되어 정렬이 완료된다. 그 상태에서 웨이퍼 전면에 오염을 방지하기 위한 테이프를 롤러(roller, 미도시)를 사용하여 부착한다. 그리고 테이프는 테이프 절단선(116)에 의해 1차 절단된 후, 다시 웨이퍼의 원주면을 따라 웨이퍼의 크기와 동일한 형태로 2차 절단된다. 따라서, 정렬/접착/커팅부에 있는 정렬 테이블 내에서만 웨이퍼의 이동이 없는 상태로 정렬공정과, 테이프 접착공정과 테이프 커팅 공정이 한 위치에서만 이루어지게 된다.4 and 5, after the cassette on which the wafer is loaded is loaded into the loading and unloading portion of the laminator facility, the wafer is transferred to the alignment / adhesion / cutting portion by the robot arm. Then, in the alignment table in the alignment / adhesion / cutting portion (106 in FIG. 3), the wafer is placed on the wafer loading chuck and sucked by the vacuum hole 108. The adsorbed wafer is rotated to the left or right again and the flat zone 112 is detected by the flat zone sensor 118 to complete the alignment. In this state, a tape is attached to the front surface of the wafer using a roller (not shown) to prevent contamination. The tape is first cut by the tape cut line 116, and then secondly cut along the circumferential surface of the wafer in the same shape as the size of the wafer. Therefore, the alignment process, the tape bonding process, and the tape cutting process are performed only in one position without moving the wafer only in the alignment table in the alignment / adhesion / cutting unit.
그 후, 가공이 끝난 웨이퍼는 다시 로봇 암에 의해 적재 및 하역부로 언로딩(unloading)되어 카세트에 꽂아져 라미네이터 장비내에서의 작업이 끝나게 된다.After that, the processed wafer is unloaded into the loading and unloading section again by the robot arm, plugged into a cassette, and the work in the laminator equipment is finished.
본 발명은 상기한 실시예에 한정되지 않으며, 본 발명이 속한 기술적 사상 내에서 당 분야의 통상의 지식을 가진 자에 의해 많은 변형이 가능함이 명백하다. 본 발명은 그 정신 및 필수의 특징을 이탈하지 않고 다른 방식으로도 구현될 수 있다. 예를 들면, 상기 바람직한 실시예에 있어서는 웨이퍼 전면에 테이프를 접착시키는 장비를 중심으로 실시예를 설명하였지만, 이는 웨이퍼의 이면 연마가 끝난 후, 웨이퍼 전면에 있는 테이프를 제거하는 장비에 적용해도 무방하다. 또는 웨이퍼 적재 척(chuck)은 진공방식으로 구동되었으나, 이는 전자석을 이용하여 구동되는 방식으로 치환할 수도 있는 것이다. 따라서, 상술한 바람직한 실시예에 기재한 내용은 예시적인 것이며 한정하는 의미가 아니다.The present invention is not limited to the above embodiments, and it is apparent that many modifications can be made by those skilled in the art within the technical spirit to which the present invention belongs. The invention can be embodied in other ways without departing from its spirit and essential features. For example, in the above preferred embodiment, the embodiment has been described based on the equipment for adhering the tape to the front surface of the wafer. However, this may be applied to the equipment for removing the tape on the front surface of the wafer after polishing the back surface of the wafer. . Alternatively, the wafer loading chuck is driven in a vacuum manner, but this may be replaced in a manner driven by an electromagnet. Accordingly, the contents set forth in the above-described preferred embodiments are exemplary and not intended to be limiting.
따라서, 상술한 본 발명에 따르면, 웨이퍼 이면 연마를 위한 라미네이터 장비의 구성 및 운용방법을 개선하여 웨이퍼 깨짐과 같은 공정 결함을 억제하고, 설비의 크기를 축소시키고, 하나의 웨이퍼를 처리하는데 소요되는 작업시간을 단축할 수 있다.Therefore, according to the present invention described above, by improving the configuration and operation method of the laminator equipment for polishing the wafer back surface to suppress process defects such as wafer cracking, to reduce the size of the equipment, processing of one wafer It can save time.
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| KR101458143B1 (en) * | 2006-03-01 | 2014-11-05 | 씬 머티리얼즈 아게 | Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101458143B1 (en) * | 2006-03-01 | 2014-11-05 | 씬 머티리얼즈 아게 | Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement |
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