KR20020071393A - Automatic continue wafer processing system and method for using the same - Google Patents

Abstract

PURPOSE: An automatic continuous wafer processing system and a method for processing a wafer using the same are provided to reduce a total size of processing modules occupied in production line by forming the processing modules with one body. CONSTITUTION: Two or more polygon module units(10,20) includes a polygon main body having the first polygon paths, a plurality of process modules for processing wafers, and polygon fixing robot. A wafer distribution tower(30) includes a tower main body having distribution paths, an aligner for generating wafer information, and an elevation robot for elevating the wafers from the aligner to corresponding distribution paths. A load lock unit(40,400) is used for keeping temporarily the wafers and separating the polygon units(10,20) from the wafer distribution tower(30). One or more load port module is installed in the wafer distribution tower(30). A fan filter is used for removing particles from air of the wafer distribution tower(30).

Description

Automatic continue wafer processing system and method for using the same}

The present invention relates to an automatic continuous wafer processing system and a wafer processing method using the same, which continuously perform a series of processes for processing a wafer without exposing the wafer to the atmosphere.

In order to produce a semiconductor chip, a series of processes are required to continuously process a wafer. These processes are roughly divided into four processes: photo, etching, diffusion, and thin film processes. Since each of these processes must be carried out under different conditions, a number of process modules for performing the above processes are required. The process modules are typically arranged efficiently in process categories in a large space to form a process module line.

The wafer is sequentially passed from one process module to another process module by a person or a robot in the production line, and the above processes are performed in this process.

The present invention was created to promote productivity in the above fields, and can integrate a plurality of process modules that perform a series of processes in a semiconductor manufacturing process to reduce the size of the area occupied by the modules in a production line. An object of the present invention is to provide an automatic continuous wafer processing system and a wafer processing method using the same, which can reduce the time required for transferring a wafer from one process module to another process module.

Still another object of the present invention is to provide an automatic continuous wafer processing system and a wafer using the same, which can minimize the exposure of the wafer to the outside to minimize the number of particles falling on the wafer and the formation of an oxide film on the wafer by the atmosphere. It is to provide a processing method.

1 is a perspective view of an automatic continuous wafer processing system according to the present invention;

Figure 2 is a perspective view of the automatic continuous wafer processing system of Figure 1 seen from another angle,

3 is an excerpt perspective view of the wafer distribution tower of FIG. 1;

Figure 4 is an excerpt perspective view of the polygon body of Figure 2,

5 is an internal perspective view of the polygon body of FIG. 4;

6 is an internal perspective view of the load lock unit of FIG.

7 is a view illustrating a state in which an embodiment of the process module of FIG. 1 is coupled to a polygon body;

8 is an exploded perspective view of the process module of FIG. 7;

9 is a cross-sectional view of the process module of FIG.

<Code Description of Main Parts of Drawing>

10, 20 ... upper and lower polygon module unit

11, 21 ... upper, lower polygon body

12a, 12b ... upper first polygon passage

22a, 22b ... lower first polygon passage

13a, 13b, 13c, 13d ... upper second polygon passage

23a, 23b, 23c, 23d ... lower second polygon passage

15 ... polygon fixed robot 15a ... robot body

15b ... first arm 15c ... second arm

15d ... Finger 16 ... Polygon Vacuum Pump

30 ... Wafer Distribution Tower 31 ... Tower Body

31a, 31a '... upper distribution passage 31b, 31b' ... lower distribution passage

32 ... aligner 32a ... slot

34a ... Cylinder 34a '... Vertical Coaxial

35 ... lifting robot 35a ... robot body

35b ... axis of rotation 35c ... arm

35d ... Finger 36 ... First Loadport Module

36a ... Loosen 37 ... Second Mode Port Module

37a ... loose 38 ... panel

39 ... Fan filter 40, 400 ... Top load lock unit

50, 500 ... lower load lock unit 41 ... load lock body

42 ... Cool Station 43 ... Inert gas inlet pipe

44 ... elevator 45 ... first load lock valve

46 ... second load lock valve 47 ... load lock vacuum pump

100a, 100b, 100c, 100d ... 1st, 2nd, 3rd, 4th process module

105a, 105b, 105c, 105d ... 1, 2, 3, 4 process module

101 ... modular batter valve 110 ... reactor block

111 ... first connection pipe 112 ... second connection pipe

115 ... pumping port 116 ... wafer transfer hole

117, 118 ... exhaust hole 120 ... showerhead plate

121 ... first connection line 122 ... second connection line

130 ... diffuser 131 ... nozzle

133 ... Nozzle 140 ... Wafer Block

200 ... system control unit

In order to achieve the above object, the automatic continuous wafer processing system according to the present invention,

A wafer which is introduced into a single leaf by a polygonal body having two polygonal bodies each having two first polygonal passages through which the wafer w enters and exits, and two on each of the remaining surfaces except for the surface on which the first polygonal passage is formed on the polygonal body. at least two polygon module units including a plurality of process modules for processing (w) and a polygonal fixed robot 15 fixed in the polygon body to transfer wafers (w) to the plurality of process modules ( 10) (20);

Determine the tower body 31 having the same number of distribution passages 31a, 31a ', 31b and 31b' as the first polygon paths, and the degree of distortion of the wafer fixed and pinched inside the tower body. And an aligner 32 which generates information corresponding thereto, and a liftable inside of the tower body 31 to extract the wafer w from the aligner 32 to correspond to the distribution passages. A wafer distribution tower 30 having a lifting robot 35 that lifts and lowers the furnace;

Corresponding to the first polygon passages and the distribution passages 31a, 31a ', 31b and 31b', respectively, between the polygon module units 10 and 20 and the wafer distribution tower 30. The load lock unit 40 is installed so as to temporarily store the wafer (w) entering and exiting the first polygon passage and the distribution passage, and space-separates the polygon module units 10 and 20 and the wafer distribution tower 30. 400, 50, 500; characterized by including.

In the present invention, the wafer distribution tower 30 includes at least one load port module in which a pull is installed to wait for the process or to receive the processed wafer w. At this time, the wafer distribution tower 30, the fan filter 39 for removing the foreign matter particles contained in the incoming air is installed.

In the present invention, the elevating robot 35, the robot main body 35a which is transferred in the vertical direction in the tower body 31, the rotating shaft 35b for rotating in the robot body 35a, and the rotating shaft And an arm 35c provided at 35b, and a finger 35d which articulates with respect to the arm 35c and extracts the wafer w.

In the present invention, the load lock unit, the load lock main body 41 is installed so that the first polygonal passage and the distribution passage, and the plurality of wafers (w) installed in the load lock body 41 is accommodated Slots are formed and the cool station 42 cools the received wafer w, and the polygon stationary robot 15 or the lifting robot 35 extracts the wafer w from the cool station 42. And an elevator (44) for elevating to a suitable height, a first load lock valve (45) for opening and closing the distribution passage, and a second load lock valve (46) for opening and closing the first polygon passage.

In the present invention, the polygonal fixed robot 15, the robot body 15a fixed in the polygon body (11) (21), and the first arm (15b) for horizontal rotational movement in the robot body (15a) And a second arm 15c articulating relative to the first arm 15b, and a finger 15d articulating relative to the second arm 15c and extracting the wafer w.

In order to achieve the above object, a wafer processing method using a wafer processing system according to the present invention, the polygon body main body each formed with two first polygon passages through which the wafer (w) enters and exits, A plurality of process modules for processing the wafer (w) is coupled to each of the remaining surfaces other than the surface on which the first polygonal passage is formed, and the wafer (w) is introduced, and the plurality of wafers (w) is fixed inside the polygon body At least two or more polygonal module units (10, 20) comprising a polygonal fixed robot (15) for transferring to a process module; And a plurality of load lock units installed in the polygon module units 10 and 20 so as to correspond to each of the first polygon paths, and a wafer w temporarily entering and exiting the first polygon paths. The plurality of process modules have a sequential process relationship for wafer processing and are applied to a wafer processing system sequentially arranged in the polygonal body in a clockwise or counterclockwise direction.

Transferring the wafer (w) by the polygon fixing robot (15) to the first process module in which the specific process is performed in the load lock unit (40) in which the wafer (w) is temporarily stored; The polygon fixing robot (15) sequentially transferring clockwise or counterclockwise from the first process module to the next process modules for which a specific process is performed; And a polygon fixing robot 15 extracting the wafer w from the last process module to the load lock unit.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the automatic continuous wafer processing system and a wafer processing method using the same according to the present invention.

1 is a perspective view of an automatic continuous wafer processing system according to the present invention, Figure 2 is a perspective view of the automatic continuous wafer processing system of Figure 1 from another angle, Figure 3 is an excerpt perspective view of the wafer distribution tower of Figure 1, 4 is an excerpt perspective view of the polygon body of FIG. 2, FIG. 5 is an internal perspective view of the polygon body of FIG. 4, and FIG. 6 is an internal perspective view of the load lock unit of FIG. 2.

As shown, the automatic continuous wafer processing system includes a plurality of process modules, in this embodiment, at least two or more polygonal module units 10 and 20 in which the first, second, third and fourth process modules are installed, and the polygon module. The plurality of load lock units 40 and 400 are installed between the wafer distribution tower 30 in which the unit and the double distribution paths are formed, and each polygon module unit 10 and 20 and the wafer distribution tower 30. 50, 500). At this time, the wafer distribution tower 30 is between the load lock units 40, 400, 50, 500 and the pools 36a and 37a installed in the first and second load port modules 36 and 37 to be described later. For transporting wafers. Each of the load lock units 40, 400, 50 and 500 is present for wafer transfer between the wafer distribution tower in the standby state and the polygon module unit maintained in vacuum at all times, and furthermore, the polygon module unit and It is to separate the wafer distribution tower.

In the present embodiment, for the sake of simplicity, the upper polygonal module unit 10 and the lower polygonal module unit 20 are defined by limiting the polygonal module unit to two, and the upper distribution channel is defined by four distribution channels. 31) 31a 'and the lower distribution passages 31b and 31b', and four load lock units, the upper load lock units 40 and 400 and the lower load lock units 50 and 500, respectively. To be defined). However, three or four or more polygonal module units may be possible, and accordingly, the number of distribution passages and load lock units may increase proportionally.

The upper polygon module unit, as shown in Figs. 4 and 5, has an upper polygon body 11 having a polygonal columnar shape and, in this embodiment, a quadrangular columnar shape. One surface of the upper polygon body 11 is formed with two upper first polygonal passages 12a and 12b through which the wafer w enters and exits, except for a surface on which the first polygonal passages 12a and 12b are formed. On each of the surfaces, two upper second polygonal passages 13a, 13b, 13c, and 13d into which the wafers W enter and exit are formed. The other side is omitted for ease of explanation, but it is also possible to create two polygonal passages as described above.

Inside the upper polygon body 11, a polygonal fixing robot 15 for transporting the wafer w is installed. As shown in FIG. 5, the polygon fixing robot 15 includes a robot main body 15a fixed in the upper polygon main body 11, a first arm 15b horizontally rotating in the robot main body 15a, and The second arm 15c articulates with respect to one arm 15b, and the finger 15d articulates with respect to the second arm 15c and extracts the wafer w. The polygon fixing robot 15 transfers the supplied wafer w to the upper first polygon paths 12a and 12b or the upper second polygon paths 13a, 13b, 13c, and 13d.

On the side of the upper polygon body 11, a plurality of process modules for processing the incoming wafer w have a sequential process relationship for wafer processing and are sequentially arranged in a clockwise or counterclockwise direction. In the present embodiment, the first, second, third and fourth process modules are installed in the upper polygon body in a clockwise direction. That is, the first, second, third and fourth process modules 100a, 100b, 100c and 100d are The upper second polygon paths 13a, 13b, 13c, and 13d are coupled to each other by a cluster. At this time, between the upper polygon body 11 and each of the first, second, third and fourth process modules 100a, 100b, 100c and 100d, the wafer transfer hole 116 and the upper second polygon path ( The module boat valve 101 for opening and closing between 13a, 13b, 13c, and 13d is provided. The process modules are determined in function and structure according to the continuous process.

Polygon vacuum pump 16 for forming a vacuum therein is connected to the upper polygon body 11 through a pumping line (not shown). Polygon vacuum pump 16, for example, slightly above the 10 ^-2Torr the vacuum degree of the inside of the upper polygon body 11 when the degree of vacuum within the process module to be maintained and the 10 ^-2Torr. In this way, when the module batter valve 101 is opened after the completion of the process, residual gas inside the process module may be prevented from going out of the upper polygon body 11, thereby preventing the upper polygon body 11 from being contaminated. Since this polygon vacuum pump 16 uses a well-known thing, detailed description is abbreviate | omitted.

The lower polygon module unit 20 includes a lower polygon body 21, a lower first polygon path 22a and 22b, and a lower second polygon path having the same structure and the same function as the upper polygon module unit 10 described above. First, second, third, and fourth process modules 105a, 105b, 105c, and 105d, which are coupled to each of two sides 23a, 23b, 23c and 23d, the polygon fixing robot 15, and the sides of the lower polygon body. ), Polygonal vacuum pumps (not shown). Since this configuration has the same structure as described above in the upper polygon module unit, further description thereof will be omitted.

The wafer distribution tower 30 includes a tower body 31 having upper and lower distribution passages 31a, 31a ', 31b, 31b' having the wafer w in and out of the inner side, and a tower body 31 inside. Fixed to the aligner 32, which is used to accurately place the wafer w in the load lock units 40, 400, 50 and 500, and is installed in the tower body 31 in the vertical direction and lifted upwards. A cylinder 34a having a vertical coaxial 34a ', a horizontal guide 34b for moving the cylinder 34a in a horizontal direction, and a wafer 34 on the vertical coaxial 34a', The elevating robot 35 extracts w) and elevates to a position corresponding to the upper and lower distribution passages 31a and 31a 'and 31b and 31b', respectively.

The lifting robot 35 includes a robot body 35a fixed on the vertical coaxial shaft 34a ', a rotation shaft 35b for rotating in the robot body 35a, an arm 35c installed on the rotation shaft 35b, And a finger 35d for articulating the arm 35c and extracting the wafer w.

The aligner 32 is formed with a slot 32a into which the wafer w transferred by the lifting robot 35 is fitted. The aligner detects the degree of distortion of the wafer sandwiched in the slot 32a and transmits the corresponding information to the lifting robot 35 so that the lifting robot 35 can accurately transfer the wafer w to the load lock unit. . Since the aligner 32 is well known, further description thereof will be omitted.

The tower body 31 is provided with a panel 38 so that the space inside the tower body 31 is not exposed to the outside. The panel 38 is provided with a plurality of load port modules in which a plurality of load ports 36a and 37a (foups), which are waiting for a process to be processed or in which a wafer (w) having completed a process, is stored, are installed. Modules 36 and 37 are installed. In addition, a predetermined portion of the tower body 31 is provided with a fan filter 39 for removing foreign matter contained in the air flowing into the wafer distribution tower 30.

The upper load lock units 40 and 400 each have an upper polygon module unit 10 and a wafer distribution tower so as to communicate with the upper first polygon paths 12a and 12b and the upper distribution paths 31a and 31a ', respectively. 30 is formed between the load lock body 41 and the load lock body 41, and a plurality of slots formed in the wafer w are formed to cool the metal wafer to cool the accommodated wafer w. Station 42. The cool station 42 is formed with ten or more slots into which the wafers w are sandwiched so as to accommodate a plurality of wafers, in this embodiment, ten or more wafers at once.

As shown in FIG. 6, the upper load lock main body 41 includes an elevator for elevating the cool station 42 to a height suitable for extracting the wafer w from the polygon fixing robot 15 or the lifting robot 35. 44) is installed.

An inert gas inlet tube 43 is installed at the side of the upper load lock body 41, and the inert gas inlet tube 43 injects an inert gas such as Ar into the upper load lock body 41 to cool the station 42. ), The wafer w stored in the wafer is cooled. At this time, the inert gas inlet pipe 43 may be used as a means for making the inside of the upper load lock body 41 to atmospheric pressure.

The upper load lock main body 41 has a first load lock valve 45 for opening and closing the upper distribution passages 31a and 31a ', and a second rod for opening and closing the upper first polygon passages 12a and 12b. The lock boat valve 46 is installed, and a load lock vacuum pump 47 for forming a vacuum in the upper load lock unit 40 is connected to a predetermined portion of the load lock body 41.

The lower load lock units 50 and 500 have a lower polygon module unit 20 and a wafer distribution tower 30 to communicate with the lower first polygon paths 22a and 22b and the lower distribution paths 31b and 31b '. The load lock body is installed between the) and the cool station, elevator, the first load lock boat valve, the second load lock boat valve having the same configuration and operation as described in the upper load lock unit 40 is installed, the lower load lock It is connected to another load lock vacuum pump (not shown), which is the same as that used in the upper load lock unit, for forming a vacuum in the unit 50. Since the description of such a configuration has already been described, a detailed description thereof will be omitted.

All of the above components are all controlled by the system controller 200.

Each process module described above must be structured and function so that a specific process can be performed on the wafer. Therefore, the structure of all process modules may be the same or may be different depending on the process. In the present embodiment, a structure of a thin film forming module capable of performing a thin film forming process will be described with reference to FIGS. 7 to 9 as follows.

7 to 9, upper and lower polygon bodies are provided such that the first process module 100a corresponds to the second polygon passage 13a. The first process module 100a includes a reactor block 110 in which the wafer w transferred through the wafer transfer hole 116 by the polygon fixing robot 15 is positioned when the module boat valve 101 is opened. And a shower head plate 120 coupled to the reactor block 110 and a diffusion plate installed in the shower head plate 120 to inject a reaction gas and / or an inert gas supplied from a reaction gas supply unit (not shown). 130, the wafer block 140 installed inside the reactor block 110, on which the wafer w is seated, and connected to the reactor block 110 to exhaust the gas inside the reactor block 110 to the outside. An exhaust unit (not shown).

The shower head plate 120 includes a first connection line 121 for transferring the supplied first reaction gas and / or inert gas to the diffusion plate 130, and a second reaction gas and / or inert gas. A second connection line 122 is provided to transfer the same to the 130, and the reactor block 110 has a first connection pipe connected to the first connection line 121 and the second connection line 122, respectively. 111 and a second connecting pipe 112 are provided. The first and second connection pipes are connected to a reaction gas supply unit (not shown).

The diffusion plate 130 positioned inside the reactor block 110 when the shower head plate 120 covers the reactor block 110 may include a first reaction gas and / or introduced through the first connection line 121. A plurality of injection holes 131 for injecting an inert gas to the upper portion of the wafer (w) and a plurality of injection of the second reaction gas and / inert gas flowing into the second connection line 122 to the outer peripheral side of the wafer (w) Has a nozzle 133.

In the process module as described above, a plurality of heaters H are installed to increase the temperature therein.

In the process module 100a as described above, the wafer w is transferred through the wafer transfer hole 116 to be seated on the wafer block 140, and the reactor block 110 is heated to a predetermined temperature. The first reaction gas and / or the inert gas is injected onto the wafer w through the first connection pipe 111 → the first connection line 121 → the injection port 131, and the second reaction gas and / or the inert gas The second connection pipe 112 → the second connection line 122 → the nozzle 133 to be sprayed in the direction of the inner surface of the reactor block 110. The first and second reaction gases form a thin film on the wafer w, and gases which are not used for process by-products or thin film deposition are exhausted through the exhaust hole and the pumping port.

According to the present invention, a series of processes can be continuously performed on a wafer by employing a plurality of known process modules having the above structure or another structure, and in this embodiment, eight.

Next, the operation of the automatic continuous wafer processing system having the above structure will be described.

By supplying air from which foreign matters are removed by the fan filter 39 into the wafer distribution tower 30, the inside of the wafer distribution tower 30 is kept clean, and the upper and lower polygon bodies 11 are formed by polygon vacuum pumps. 21 is maintained in a predetermined vacuum state. On the other hand, a plurality of wafers are accommodated in the pull 36a of the first load port module 36.

Next, the lifting robot 35 is moved by the vertical coaxial 34a 'and the horizontal guide 34b to a position corresponding to the first load port module 36, and then the rotating shaft, arm, and finger 35b ( 35c) and 35d are moved to extract one wafer w from the pull 36a of the first load port module 36. Then, the lifting robot 35 moves to the position corresponding to the aligner 32 to insert the wafer w into the slot 32a of the aligner 32. The aligner 32 detects the degree of distortion of the sandwiched wafer w and transfers the corresponding information to the lifting robot 35 so that the lifting robot 35 can accurately transfer the wafer w to the load lock unit. Make sure

Next, the lifting robot 35 extracts the wafer w from the aligner 32 by moving the rotating shaft, the arm, and the fingers 35b, 35c, and 35d, and transfers the wafer w to a position corresponding to the upper distribution passage 31a '. Let's do it.

Next, the first load lock valve 45 is lowered to open the upper distribution passage 31a ', and the lifting robot 35 moves the arms and fingers 35c and 35d to move the wafer through the upper distribution passage 31a. (w) is inserted into the slot of the cool station 42, and the finger 35d is folded out of the upper load lock unit 40.

Next, the first load lock boat valve 45 is raised to close the upper distribution passage (31a '). Then, a valve (not shown) connected to the load lock vacuum pump 47 is opened to make the inside of the load lock body 41 the same vacuum as the upper polygon body 11.

Next, when the inside of the upper load lock unit 40 and the inside of the upper polygon body 11 are in the same vacuum state, the second load lock valve 46 is lowered to open the upper first polygon passage 12a. Then, the polygon fixing robot 15 extends the first and second arms and the fingers 15b, 15c and 15d to extract the wafer w from the slot of the cool station 42. When the polygon fixing robot 15 extracts the wafer w and moves it into the upper polygon body 11, the second load lock valve 46 is raised to close the upper first polygon path 12a.

Next, the polygon fixing robot 15 uses the first, second arms, and the fingers 15b, 15c, and 15d, which are rotated, unfolded, and folded to position the wafer w corresponding to the upper second polygon path 13a. Transfer to.

Next, when the degree of vacuum inside the first process module 100a is the same as that of the upper polygon body 11, the module boat valve 101 of the first process module 100a is lowered to open the wafer transfer hole 116. .

Next, the polygon fixing robot 15 unfolds the first and second arms and the fingers 15b, 15c, and 15d to seat the wafer w on the wafer block 110. After supplying the wafer w, the polygonal fixing robot 15 folds the first, second arm, and the fingers 15b, 15c, and 15d and completely exits from the first process module 100a.

Next, the module boat valve 101 is raised to close the wafer transfer hole 116, and then a specific process is performed in the first process module 100a.

Subsequently, when the process is completed and the vacuum degree in the first process module 100a is equal to the inside of the upper polygon body 11, the module boat valve 101 is lowered to open the wafer transfer hole 116 and the polygon fixing robot 15. ) Extracts the wafer w from the first process module 100a.

Next, the polygon fixing robot 15 moves the wafer w to a position corresponding to the upper second polygon passage 13b, and repeats the above operation to move the wafer w to the second process module 100b. Supply. In the second process module 100b, a specific process subsequent to the process in the first process module is performed.

Next, the polygon fixing robot 15 extracts the wafer w from the second process module 100b and then repeats the above operations to the third and fourth process modules 100c and 100d where specific processes are performed. (w) is fed sequentially.

Next, the polygon fixing robot 15 extracts the wafer w from the fourth process module 100d.

Next, the second load lock boat valve 46 of the 400 load lock unit descends to open the 12b upper distribution passage, and the polygon fixing robot 15 loads the 400 w load lock unit on which the specific process is sequentially performed. Into the slot on the CoolStation. At this time, if another wafer is already inserted in the slot of the cool station, the elevator 44 is operated to insert the wafer w in which specific processes have been sequentially performed into empty slots by elevating the cool station 42.

Next, the second load lock boat valve 46 of the 400 load lock unit is raised to close the upper first polygon passage 12b, and a vent member (not shown) is operated to distribute the wafer distribution tower inside the load lock body 41. (30) It is made into atmospheric pressure which is the internal air pressure.

Next, the first load lock boat valve 45 of the 400 load lock unit is lowered to open the upper distribution passage 31a, and the lifting robot 35 sequentially completes the wafer through the upper distribution passage 31a. After extracting them from the cool station 42, they are moved and accommodated in the unwinding 37a of the second load port module 37 or the unwinding 36a of the first loadport module 36. At this time, the wafers are returned to the same slots in the same pull that were first exited.

Meanwhile, the operation of the lower polygon module unit 20 may be performed independently of the operation of the upper polygon module unit 10 but in the same manner.

Although the above-described embodiment has described one wafer as an example, the wafers are sequentially subjected to continuous process execution. For example, when the wafer on which the specific process is performed in the first process module 100a proceeds to the second process module 100b, a plurality of wafers are continuously received by allowing the new wafer to be stored in the first process module 100a again. It is possible to continue their process.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. will be.

As described above, according to the present invention, by integrating a plurality of process modules performing a series of continuous processes, by stacking a plurality of polygon module unit implemented by combining the process modules to increase productivity by increasing the productivity per unit area Can be.

In addition, it is possible to reduce the number of particles falling on the wafer by preventing the wafer from being exposed to the outside as much as possible, or to minimize the formation of an oxide film on the wafer by the atmosphere, thereby increasing the production yield.

Claims (7)

A wafer which is introduced into a single leaf by a polygonal body having two polygonal bodies each having two first polygonal passages through which the wafer w enters and exits, and two on each of the remaining surfaces except for the surface on which the first polygonal passage is formed on the polygonal body. at least two polygon module units including a plurality of process modules for processing (w) and a polygonal fixed robot 15 fixed in the polygon body to transfer wafers (w) to the plurality of process modules ( 10) (20); Determine the tower body 31 having the same number of distribution passages 31a, 31a ', 31b and 31b' as the first polygon paths, and the degree of distortion of the wafer fixed and pinched inside the tower body. And an aligner 32 which generates information corresponding thereto, and a liftable inside of the tower body 31 to extract the wafer w from the aligner 32 to correspond to the distribution passages. A wafer distribution tower 30 having a lifting robot 35 that lifts and lowers the furnace; Corresponding to the first polygon passages and the distribution passages 31a, 31a ', 31b and 31b', respectively, between the polygon module units 10 and 20 and the wafer distribution tower 30. The load lock unit 40 is installed so as to temporarily store the wafer (w) entering and exiting the first polygon passage and the distribution passage, and space-separates the polygon module units 10 and 20 and the wafer distribution tower 30. Automatic continuous wafer processing system comprising: (400) (50) (500). The method of claim 1, The wafer dispensing tower (30), the automatic continuous wafer processing system, characterized in that it comprises at least one load port module is installed (foup) for receiving the wafer (w) waiting for the process progress or the process is completed. The method of claim 2, The wafer distribution tower (30), the automatic continuous wafer processing system, characterized in that the fan filter (39) for removing the foreign matter particles contained in the air introduced. The method of claim 1, The lifting robot 35 is installed in the robot body 35a, which is transferred in the tower body 31 in the vertical direction, a rotating shaft 35b for rotating in the robot body 35a, and the rotating shaft 35b. And an arm (35c) and a finger (35d) articulating the arm (35c) and extracting the wafer (w). The method of claim 1, The load lock unit may include a load lock body 41 installed to communicate the first polygonal passage and the distribution passage, and a plurality of slots installed in the load lock body 41 to accommodate the wafer w. The cool station 42 for cooling the stored wafer w and the cool station 42 are lifted to a height suitable for the polygon fixing robot 15 or the lifting robot 35 to extract the wafer w. And an elevator 44, a first rod lock boat valve 45 for opening and closing the distribution passage, and a second rod lock boat valve 46 for opening and closing the first polygon passage. Wafer Processing System. The method of claim 1, The polygon fixing robot 15 includes a robot main body 15a fixed in the polygon main bodies 11 and 21, a first arm 15b horizontally rotating in the robot main body 15a, and the first arm. And a second arm 15c articulating with respect to the arm 15b, and a finger 15d articulating with respect to the second arm 15c and extracting the wafer w. Processing system. A wafer which is introduced into a single leaf by a polygonal body having two polygonal bodies each having two first polygonal passages through which the wafer w enters and exits, and two on each of the remaining surfaces except for the surface on which the first polygonal passage is formed on the polygonal body. at least two polygon module units (10) comprising a plurality of process modules for processing (w) and a polygonal fixing robot (15) fixed in the polygon body to transfer wafers (w) to the plurality of process modules (10) 20; And a plurality of load lock units installed in the polygon module units 10 and 20 so as to correspond to each of the first polygon paths, and a wafer w temporarily entering and exiting the first polygon paths. The plurality of process modules have a sequential process relationship for wafer processing and are applied to a wafer processing system sequentially arranged in the polygonal body in a clockwise or counterclockwise direction. Transferring the wafer (w) by the polygon fixing robot (15) to the first process module in which the specific process is performed in the load lock unit (40) in which the wafer (w) is temporarily stored; The polygon fixing robot (15) sequentially transferring clockwise or counterclockwise from the first process module to the next process modules for which a specific process is performed; And extracting a wafer (w) from the final process module and transferring the wafer (w) to the load lock unit. 2.