KR20020056002A - Field Emission Display and Method of Ventilating and Sealing The Same - Google Patents

Abstract

PURPOSE: A field emission display device, and evacuation and sealing method for the same are provided to achieve an improved efficiency for exhausting air from the panel and reduce evacuation time, while easily obtaining a low level of vacuum within the panel. CONSTITUTION: An evacuation apparatus for field emission display device, comprises a plurality of spacers(53) for maintaining a gap between an upper glass substrate(51) and a lower glass substrate(52); a frit glass disposed at the edges of the upper and lower substrate, and which binds two substrates; a hole formed at the frit glass so as to be opposed to the flow channel formed between spacers; and an evacuation member having an air inlet port and an air outlet port with different sizes, and which is attached to the frit glass in such a manner that the air inlet port is opposed to the hole formed at the frit glass.

Description

Field Emission Display and Method of Ventilating and Sealing The Same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a field emission display device and an exhaust and sealing method thereof, and more particularly, to a field emission display device and an exhaust and sealing method thereof capable of improving exhaust efficiency.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes (CRTs). Such flat panel displays include liquid crystal displays (LCDs), field emission displays (FEDs), plasma display panels (PDPs), and electroluminescence (Electro). -luminescence (EL). In order to improve the display quality, research and development are being actively conducted to increase the brightness, contrast and color purity of flat panel displays.

The FED concentrates a high field on a sharp cathode (emitter), emits electrons by a quantum mechanical tunnel effect, and displays an image by exciting the phosphor using the emitted electrons.

1 and 2, an FED having an upper glass substrate 2 on which an anode electrode 4 and a phosphor 6 are stacked, and a field emission array 32 formed on the lower glass substrate 8. Is shown. The field emission array 32 includes a cathode electrode 10 and a resistive layer 12 formed on the lower glass substrate 8, an emitter 22 and a gate insulating layer 14 formed on the resistive layer 12. ), A gate electrode 16 formed on the gate insulating layer 14, and a focusing insulating layer (not shown) formed on the gate electrode 16. The cathode electrode 10 supplies a current to the emitter 22, and the resistive layer 12 limits the overcurrent applied from the cathode electrode 10 toward the emitter 22 to uniform the emitter 22. It serves to supply current. The gate insulating layer 14 insulates between the cathode electrode 10 and the gate electrode 16. The gate electrode 16 is used as an extraction electrode for extracting electrons. A spacer 40 is installed between the upper glass substrate 2 and the lower glass substrate 8 to withstand the external atmospheric pressure.

In order to display an image, a negative (-) cathode voltage is applied to the cathode electrode 10 and a positive (+) anode voltage is applied to the anode electrode 4. A gate voltage of positive polarity (+) is applied to the gate electrode 16. The electron beam 30 emitted from the emitter 22 is then accelerated toward the anode electrode 4. The electron beam 30 collides with the phosphor 6 of red, green, and blue (R, G, B) to excite the phosphor 6.

This will be described in detail with reference to FIG. 3. As shown in FIG. 1, the FED is formed in a matrix structure for controlling each pixel. The cathode electrode 10 and the gate electrode 16 are electrically independent of the gate insulating layer 14, and each has a line shape in the horizontal or vertical direction and is formed to cross each other when viewed from above. In addition, a gate hole 61 is formed in the gate electrode 16, and an emitter 22 is formed on the cathode electrode 10 corresponding to each gate hole 61. When the cathode electrode 10 formed as described above is applied as the ground potential and a voltage of about +100 V is applied to the gate electrode 16, the peaks of the emitters 22 located at the intersection of the two electrodes are subjected to a high electric field. The electron 50 is emitted by the. At this time, the voltage of the gate electrode 16 for emitting electrons 50 decreases as the size of the gate hole 61 decreases, and depends on the material properties of the emitter 22. In addition, by applying voltage to the cathode electrodes 10 and the gate electrodes 16 sequentially, the electrons 50 are emitted from the emitters 22 at the point where the two electrodes intersect to face the phosphor 6. Each pixel is sequentially emitted by emitting light. A high voltage of several kV or more is applied to the anode electrode 4 coated with the phosphor 6 to accelerate the electrons 50 emitted from the emitter 22 to collide with the corresponding phosphor 6.

In this case, the luminance and the color implementation of the individual pixels can be adjusted by using the principle that the amount of current emitted by the voltage difference applied between the emitter 22 and the gate electrode 16 can be adjusted. Color realization is possible by controlling the luminance of the pixel.

In addition, the FED must maintain a high vacuum state in which the field emission space inside the panel is 10 ^-6 Torr or more due to its driving characteristics. This is because a high electric field of about 10 ⁷ V / cm is applied between the emitter 22 and the gate electrode 16 at a submicron interval and the emitter 22 and the gate electrode 16 are spaced apart. This is because if the space between the 22 and the gate electrode 16 is not maintained in a high vacuum, discharge may occur between the emitter 22 and the gate electrode 16 or breakdown may occur. In addition, when the field emission space is not maintained at high vacuum, the neutral particles present in the panel collide with the electrons 50 to generate cations. The cations thus generated impair the emitter 22 to degrade the emitter 22 or collide with the electron 50 to attenuate the acceleration energy of the electron 50 to lower the brightness. In order to prevent this, a vacuum process for making the inside of the panel in a vacuum state is required in the manufacturing process of the FED.

4 and 5, on the upper glass substrate 2 on which the anode electrode 4 and the phosphor 6 are stacked, on the cathode electrode 10 and the resistive layer 12, and on the resistive layer 12. And a lower glass substrate 8 having a gate electrode 16 formed thereon and a focusing insulating layer (not shown) formed on the gate electrode 16. The getter 40 is installed inside the panel before the upper glass substrate 2 and the lower glass substrate 8 are configured to absorb the gas generated during the FED manufacturing process.

In general, as described above, the getter 40 has a method of mounting the getter 40 inside the panel before the substrate is bonded and the method of mounting the getter 40 just above the pinch-off point in the exhaust pipe 7 after the substrate is bonded. have. The method of pre-mounting the getter 40 in the panel has an advantage in that the gas adsorption efficiency for the field emission array 32 is relatively high by mounting the getter 40 in the panel close to the field emission array 32. However, in the method of pre-mounting the getter 40 inside the panel, the getter 40 is adhered to the upper glass substrate 2 so that one surface of the getter 40 adhered to the upper glass substrate 2 adsorbs gas. Since it is impossible to increase the gas adsorption efficiency above a certain limit, there is a disadvantage that the getter 40 may be contaminated by O ₂ or C during the main sintering of the frit glass 34 performed in the atmosphere. In the method of mounting the getter 40 in the exhaust pipe 7 after the substrate is bonded, since the getter 40 is mounted after the main sintering, the contamination is minimized, while the getter 40 is mounted in the confined space in the tube. There is a problem that the surface area is limited and the gas adsorption efficiency is low. In order to reduce the disadvantages of the conventional getter mounting methods, the panel bonding process can be performed in a vacuum atmosphere without using the exhaust pipe 7 instead of the exhaust process performed through the exhaust pipe 7. Development of the Vacuum-in-line sealing process is actively underway.

In addition, an exhaust unit 48 is formed at one side of the lower glass substrate 8, and the exhaust pipe 7 is connected to the exhaust unit 48 by frit glass 34. Subsequently, a spacer 9 and frit glass 34 are formed between the upper glass substrate 2 and the lower glass substrate 8 with the exhaust pipe 7 interposed therebetween. These spacers 9 and the frit glass 34 are each sintered. Upon plastic sintering, the binder of the organic component contained in the frit glass 34 is burned out. Here, since the sintering temperature characteristics are different according to the composition of the frit glass 34, an appropriate temperature must be selected and heat-treated for plasticization. After the sintering, the upper glass substrate 2 and the lower glass substrate 8 are joined and aligned and subjected to main sintering at approximately 450 ° C. higher than the sintering temperature, thereby allowing the upper glass substrate 2 and the lower glass substrate 8 to sinter. ) Is completely attached. After the sintering / bonding process, the gas inside the panel is exhausted to the outer chamber by using a pump (not shown) while the panel is heated to remove moisture (H ₂ O) components inside the panel in the exhaust pipe 7. When evacuation reaches the desired level, the pinch-off process cuts the middle of the exhaust pipe 7 using a local heating device (not shown) installed adjacent to the exhaust pipe 7. The panel and outer chamber are isolated. At this time, since the internal vacuum degree of the insulated panel falls again at the time of pinching-off, the process of restoring the vacuum degree again by activating the getter 40 at a high temperature is continued.

As described above, in the manufacturing of the FED, the exhaust process is close to about 1 to 2 mm between the upper glass substrate 2 and the lower glass substrate 8. In addition, a plurality of spacers 9 are installed inside the gap between the upper glass substrate 2 and the lower glass substrate 8 and for maintaining the vacuum stress therein. In the structure of the rotor 22 and the gate 16, since the phosphor 6 and the black matrix 7 are formed on the upper glass substrate 2, the exhaust time is long and it is very difficult to make a low degree of vacuum.

This will be described in detail with reference to FIG. 6, which shows an exhaust characteristic curve when the conventional CRT and FED are exhausted by the exhaust pump. In general CRT, the time required to lower the vacuum (log P) in the CRT to about 10 ^-5 Torr by the exhaust pump (Te) is usually 2 to 3 hours, and about 10 ^-6 Torr required by the getter activation. It is possible to obtain the degree of vacuum, but in the case of the conventional FED, even in the case of the small 4-5 "panel, it takes more than 10 hours to obtain a log P of about 10 ^-5 Torr, and it is very important to obtain the desired degree of vacuum. The reason why the exhaust efficiency of the FED is low starts from the structural problem of the FED, as shown in Fig. 7. In the conventional exhaust method, a small circular exhaust portion 48 is usually formed at the edge of the outside of the effective screen of the lower glass substrate 8. A pipe-shaped exhaust pipe 7 having a circular cross section is drilled in. In this state, the air in the panel is discharged out of the panel using a pump system, and when the inside of the panel reaches a predetermined vacuum pressure, the exhaust is exhausted. This process proceeds to the process of cutting out unnecessary parts while melting and attaching a predetermined portion of the pipe 7. At this time, the air inside the panel receives a lot of resistance to move toward the exhaust pipe 7. In this case, the upper glass substrate ( 2) the distance between the lower glass substrate 8 is close, the panel size is increased, the surface resistance by structures such as the emitter 22 and the gate electrode 16 is increased and increases as the number of spacers 9 increases In addition, the cause of the increase in the exhaust resistance in connection with the above-mentioned structural causes is a movement pattern of air molecules in the FED. Since the movement of air molecules in the zirconia is irregular and has no directional movement, in order for the air inside the panel to be discharged out through the exhaust pipe (7), the zigzag movement (3) And so it should move towards the exhaust pipe (7) receive a lot of resistance.

In addition to the above cause, as the installation direction of the spacer 9 becomes perpendicular to the flow of air, the exhaust resistance is increased. In the exhaust process of the conventional FED, the exhaust pipe 7 is inevitably installed at an edge outside the effective surface of the screen. Due to this point, the movement direction of the overall air and the direction of the spacer have to be in the direction intersecting by the oblique line 5, which leads to a problem that the exhaust resistance increases.

In addition, the direction of air movement in the exhaust pipe 7 of the FED is vertical, and the direction of movement of air in the inside of the FED is perpendicular to each other as a horizontal direction to increase the exhaust resistance.

On the other hand, there is a limit to the degree of vacuum that can be lowered by the pump system, so it is necessary to lower the degree of vacuum inside the FED through the getter activation. However, in the conventional FED structure, it is common practice to provide a getter in an empty space outside the screen effective surface. In this case, the emitter, the gate, etc. are contaminated by scattering used as a getter material.

Accordingly, it is an object of the present invention to provide an exhaust device of a field emission display device and an exhaust and sealing method thereof which can improve the exhaust efficiency.

1 is a perspective view showing a conventional field emission display device.

FIG. 2 is a cross-sectional view illustrating a method of driving the field emission display shown in FIG. 1.

3 is a plan view showing in detail the portion "A" shown in FIG.

4 is a cross-sectional view showing a field emission display device according to the prior art.

FIG. 5 is a side view illustrating an exhaust port formed on one side of the field emission display shown in FIG. 4; FIG.

6 is a characteristic diagram of the field emission display shown in FIG. 4.

FIG. 7 is a plan view illustrating the field emission display of FIG. 5. FIG.

8A and 8B are perspective and side views illustrating an exhaust port and exhaust characteristics formed on one side of the field emission display device according to the first embodiment of the present invention.

9 is a view illustrating exhaust characteristics of a field emission display device according to a second exemplary embodiment of the present invention.

10 is a side view illustrating exhaust characteristics of the field emission display device according to the third exemplary embodiment of the present invention.

11 is a view illustrating exhaust pipes and exhaust characteristics of the field emission display device according to the fourth embodiment of the present invention.

12A to 12D illustrate exhaust pipes and exhaust characteristics of the field emission display device according to the fifth embodiment of the present invention.

13A and 13B illustrate exhaust and coalescence of the portion “B” shown in FIG. 12.

14 shows a getter in the auxiliary chamber shown in FIG. 12;

<Description of Symbols for Main Parts of Drawings>

2,51: upper glass substrate 4: anode electrode

6: phosphor 8,52: lower glass substrate

7,58: exhaust pipe 9,53: spacer

10 cathode electrode 12 resistive layer

14 gate insulating layer 16 gate electrode

22 emitter 32 field emission array

34,54: fritted glass 40,80: getter

48,55: exhaust 50: electron

56, 60 opening 66 panel

68: auxiliary chamber 70: active layer

In order to achieve the above object, an exhaust device of a field emission display device according to an embodiment of the present invention is a device for exhausting a field emission display device for displaying an image by emitting electrons between two substrates, the substrate; A plurality of spacers for maintaining a gap between the two substrates, frits for joining the two substrates at the edges of the two substrates, holes formed in the fritglass to face the flow path between the spacers, The air inlet and the air outlet having different sizes are formed, and the air inlet is provided with an exhaust port attached to the frit glass so as to face the hole.

In order to achieve the above object, an exhaust method of a field emission display device according to an exemplary embodiment of the present invention provides a field emission display device having a frit glass having a hole facing a flow path between spacers, and an exhaust port attached to the hole to face the hole. A method of evacuating a gas, comprising: vertically erecting a panel on which the spacer and frit glass are formed so that an air outlet of the exhaust port faces the ground, and discharging air inside the panel to the outside by connecting a vacuum pump to the exhaust port It includes.

In order to achieve the above object, an exhaust method of a field emission display device according to an exemplary embodiment of the present invention provides a field emission display device having a frit glass having a hole facing a flow path between spacers, and an exhaust port attached to the hole to face the hole. A method of evacuating a method comprising: connecting an auxiliary chamber having an air inlet and an air outlet smaller than the air inlet to any one of an air outlet of the exhaust port and a hole of the frit glass, and an air outlet of the auxiliary chamber And vertically erecting the panel on which the spacer and the frit glass are formed to face, and connecting a vacuum pump to the auxiliary chamber to discharge the air inside the panel to the outside.

Other objects and features of the present invention in addition to the above object will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 8 to 14.

FIG. 8 is a perspective view illustrating an FED according to a first embodiment of the present invention, and FIG. 9 is a plan view illustrating the FED illustrated in FIG. 8 in detail.

8A and 8B, first, an FED according to a first embodiment of the present invention includes an upper glass substrate 51 on which an anode electrode and a phosphor, not shown, a cathode electrode and a resist layer, and a resistor, And a lower glass substrate 52 having a gate electrode formed on the layer and a focusing insulating layer formed on the gate electrode. In addition, a plurality of spacers 53 are formed on the lower glass substrate 52 to maintain a gap between the lower glass substrate 52 and the upper glass substrate 51 when bonding to the upper glass substrate 51 and to withstand the vacuum stress. do. In addition, the frit glass 54 is formed at the edge of the lower glass substrate 52 so that the field emission array is not exposed to the outside. A rectangular exhaust part 55 is formed on one side of the frit glass 54 formed on the long axis direction of the spacer 53 among the frit glass 54 formed on the lower glass substrate 52. Thus, the funnel-shaped exhaust port 62 is located on one side of the frit glass 54 in which the rectangular exhaust part 55 is formed. The exhaust port 62 is formed with an exhaust pipe 58 having a rectangular opening 16 corresponding to the exhaust part 55 and an opening 60 having a circular pipe shape. In addition, the exhaust port 62 is bonded to the exhaust part 55 of the frit glass 54 using frit glass or the like so that the exhaust part 55 and the rectangular opening 60 of the exhaust pipe 58 coincide with each other.

As such, the exhaust port 62 is positioned in the exhaust part 55 formed on one side of the frit glass 54 in the long axis direction of the spacer 53, thereby moving the air 64 remaining in the panel 66. ) And the movement direction of air in the exhaust pipe 58 are the same. As a result, the exhaust efficiency during the air removal process remaining in the panel 66 is increased. This means that the moving direction 64 of the air inside the panel 66 is moved in a direction parallel to the spacer 53 so that the spacer ( This is because the exhaust resistance by 53) is minimized, and the moving direction 64 of the air moving in the panel 66 and the moving direction of the air in the exhaust pipe 58 are the same. That is, by reducing the exhaust resistance that attenuates the movement of the air moving in the panel 66, the exhaust efficiency is increased.

In addition, in order to increase the exhaust efficiency, after the upper glass substrate 51 and the lower glass substrate 52 are bonded together, a getter (not shown) may be mounted in the exhaust pipe 58. The getter may be applied inside the exhaust pipe 58 or may be installed in a mesh shape. By doing so, the exhaust efficiency can be increased and the getter area can be enlarged as compared with the case where the getter is installed in a narrow space inside the panel 66. In addition, the problem of contaminating the emitter, the phosphor and the like can be reduced.

9 illustrates an exhaust port and exhaust characteristics of the FED according to the second embodiment of the present invention.

Referring to FIG. 9, an FED is formed on an upper glass substrate 51 on which an anode electrode and a phosphor are not shown, a cathode electrode and a resist layer, not shown, a gate electrode formed on the resist layer, and a gate electrode. And a lower glass substrate 52 having a focusing insulating layer formed thereon. In addition, a plurality of spacers 53 are formed on the lower glass substrate 52 to maintain a gap between the lower glass substrate 52 and the upper glass substrate 51 when bonding to the upper glass substrate 51 and to withstand the vacuum stress. do. In addition, a 2 mm frit glass 54 is formed between the upper glass substrate 51 and the lower glass substrate 52. Here, the upper glass substrate 51 and the lower glass substrate 52 are joined by the frit glass 54 without using the exhaust pipe 58, but the upper glass substrate is opened with one side or part of one side of the exhaust exhausted. 51 and the lower glass substrate 52 themselves are used as the exhaust passage 58. This is vertically placed on the auxiliary chamber 68 installed for evacuation to vacuum the inside of the FED through the exhaust passage 72 of the lower open FED.

The FED configured as described above has an air outlet 62 positioned so that the panel 66 is vertically placed when the exhaust is exhausted, and the exhaust pipe 56 is directed downward so that the air in the panel 66 is exhausted downward. The direction in which the self-weight of the (63) and the moving direction of the air (64) is to match. By doing so, the self-weighting effect is superimposed on the air in random motion, and the velocity component is increased in the downward direction to increase the exhaust efficiency. As described above, a method of increasing the velocity component in the downward direction by superimposing the self-weighting effect on air may be as follows.

FIG. 10 illustrates a method of increasing the exhaust efficiency of air in the panel in the FED panel and the exhaust port illustrated in FIGS. 8 and 9 as a third embodiment of the present invention.

Referring to FIG. 10, a third embodiment of the present invention first heats an upper portion of a panel 66 so that the upper portion of the panel 66 is maintained at a temperature higher than the lower portion of the panel 66 to increase air mobility. It includes. That is, the upper part of the panel 66 is predetermined so that the upper part of the panel 66 is maintained at a higher temperature than the lower part of the panel 66 in order to increase the mobility of the air remaining in the panel 66 in the downward direction. Heated to a temperature of. By doing so, the air which is enclosed near the upper portion of the panel 66 has more directivity in the downward direction 64, thereby increasing the exhaust efficiency.

FIG. 11 illustrates a method for increasing the exhaust efficiency of air in the panel in the FED panel and the exhaust port illustrated in FIGS. 8 and 9 as a fourth embodiment of the present invention.

Referring to FIG. 11, first, a fourth embodiment of the present invention is to ionize air remaining in an upper portion of a panel 66 by using an ionizer outside the panel 66 to increase air mobility, and ionization. Moving the air in a downward direction 64 inside the panel 66 by using an electromagnetic field applying device installed under the panel 66. In the step of ionizing the air inside the panel 66, the air may be ionized by using a harmonic or other method. In the step of moving the ionized air downward in the panel 66, the ionized air is moved downward in the panel 66 by using an electromagnetic field applying device. That is, the air remaining in the panel 66 is ionized by the ionizer located outside the panel 66 and the ionized air is guided by the electromagnetic field applying device in the direction in which the exhaust port 55 is located. The exhaust efficiency of the air inside the panel 66 can be increased.

12A and 12D illustrate a method of exhausting an FED using an auxiliary chamber according to a fifth embodiment of the present invention.

12A and 12B, the spacer 53 is formed using the auxiliary chamber so that the direction of the spacer 53 does not interfere with the air traveling direction 64 when the air is exhausted, and a flow path of air that can flow into the auxiliary chamber is widely distributed. Exhaust speed and efficiency are improved. If the secondary chamber 68 first becomes a high vacuum, the vacuum inside the FED package is also improved. By forming the auxiliary chamber 68, the movement of air or gas particles is active, so the speed and efficiency of the exhaust are improved.

12C and 12D, by connecting a plurality of FEDs in the vertical direction with the auxiliary chamber 68, the plurality of FEDs can be exhausted at the same time, depending on the size of the sub-chambers. The efficiency is improved.

FIG. 13 illustrates a method of bonding the upper glass substrate and the lower glass substrate after exhausting the FED package using the auxiliary chamber illustrated in FIG. 12.

Referring to FIG. 13, instead of the exhaust pipe 58, one side of the frit glass 54, which fixes the upper glass substrate 51 and the lower glass substrate 52, is directly exhausted using an exhaust passage and then exhausted by applying heat. The passage 72 is melt-bonded. Since the distance between the upper glass substrate 51 and the lower glass substrate 52 is within 2mm, when the pressure is applied to the glass while applying a flame, the glass melts and contacts.

FIG. 14 illustrates a cross-sectional view in which a getter is installed in the auxiliary chamber shown in FIG. 12.

Referring to FIG. 14, a getter 80 is installed inside the auxiliary chamber 68. When the auxiliary chamber 68 is used, various kinds and sizes of getters 80 can be easily installed in the auxiliary chamber 68, so that the degree of vacuum can be increased to the maximum. In addition, compared to the case where the getter 80 is installed in a narrow space inside the panel 66, the area of the getter 80 may be increased. In addition, since the foreign matter scattered by the getter 80 only affects the interior of the auxiliary chamber 68 and hardly affects the interior of the FED, the fugitive material such as the explosive getter may be used in selecting the getter 80.

As described above, the field emission display device includes a plurality of spacers for maintaining a gap between two substrates, a frit glass for bonding two substrates at the edge of the two substrates, and a flow path between the spacers. By placing a hole formed in the frit glass, and an air inlet and air outlet having a different size and the air inlet is attached to the frit glass so that the air inlet is opposed to the hole, the remaining air inside the panel to the outside of the panel Exhaust efficiency for evacuating can be increased.

In addition, by heating the upper part with heat or ionizing air close to the upper part through the ionizer so that the temperature of the upper part of the panel is kept higher than the lower part temperature, and directing the ionized air to the exhaust port using the electromagnetic field applying device, The exhaust efficiency for exhausting the air remaining inside the panel to the outside of the panel can be increased. Therefore, a low degree of vacuum inside the panel can be easily obtained within a short time.

In addition, the method of evacuating the field emission display device is to exhaust the exhaust pipe is installed on the auxiliary chamber to increase the vacuum evacuation efficiency, it is possible to exhaust a plurality of panels at the same time to reduce the exhaust time. In addition, since the getter is installed in the auxiliary chamber, it is easy to install and prevents contamination when the getter is activated.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (13)

An apparatus for exhausting a field emission display device for displaying an image by emitting electrons between two sheets of substrates, A plurality of spacers for maintaining gaps between the substrates; A frit glass positioned at an edge of the two substrates to bond the two substrates together; A hole formed in the frit glass so as to face a flow path between the spacers; And an air exhaust port having air inlets and air outlets having different sizes and attached to the frit glass so that the air inlets face the holes. The method of claim 1, And the exhaust port is a funnel shape having a wide air inlet port and a narrow air outlet port. The method of claim 1, And an air inlet of the exhaust port has a rectangular cross section, and the air outlet has a circular cross section. The method of claim 1, And an auxiliary chamber having an air inlet connected to one of the air outlet of the exhaust port and the hole of the frit glass and an air outlet smaller than the air inlet. The method of claim 1, And a getter formed in the exhaust port for adsorbing air. The method of claim 4, wherein And a getter formed in the auxiliary chamber for adsorbing air. An apparatus for exhausting a field emission display device for displaying an image by emitting electrons between two sheets of substrates, A plurality of spacers for maintaining gaps between the substrates; A frit glass positioned at an edge of the two substrates to bond the two substrates together; And an exhaust passage formed by opening one or a part of one surface among the four surfaces bonded by the frit glass. A method of exhausting a field emission display by attaching a frit glass having a hole facing a flow path between spacers and an exhaust port facing the hole, Vertically erecting the panel on which the spacer and the frit glass are formed such that the air outlet of the exhaust port faces the ground; And discharging air inside the panel to the outside by connecting a vacuum pump to the exhaust port. The method of claim 8, And said exhaust port is a funnel shape having a wide air inlet and a narrow air outlet. The method of claim 8, And exhausting the panel to heat the panel to a predetermined temperature to accelerate the air flow in the panel. The method of claim 8, Ionizing the unnecessary gases remaining on the upper portion of the panel; And inducing the ionized air to the exhaust port by using an electromagnetic ionizer installed in the lower portion of the panel. The method of claim 8, And a getter for adsorbing air in the exhaust port. A method of exhausting a field emission display by attaching a frit glass having a hole facing a flow path between spacers and an exhaust port facing the hole, Connecting an auxiliary chamber having an air inlet and an air outlet smaller than the air inlet to any one of an air outlet of the exhaust port and a hole in the frit glass; Vertically erecting the panel on which the spacer and the frit glass are formed such that the air outlet of the auxiliary chamber faces the ground; And discharging air inside the panel to the outside by connecting a vacuum pump to the auxiliary chamber.