KR20020011759A - Field emission display having an united spacer assembly for high voltage screen and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A field emission display having a united spacer assembly for a high voltage screen and a manufacturing method thereof are provided, where an assembled spacer having a high intensity and a high aspect ratio is united with a spacer holder. CONSTITUTION: A united spacer assembly is formed by uniting high aspect ratio spacers and a spacer holder(120), and is fixed to a side glass frame(117) formed on an anode plate(111) out of a pixel region. Stripe type Getters(116) are further arranged on the anode plate or on a cathode plate(100) between outer sides of the spacer holder in the inside of a side bar(114) between the anode plate and the cathode plate, and are supported by a getter holder(115).

Description

Field emission display having an united spacer assembly for high voltage screen and manufacturing method

Field of the Invention The present invention relates to a high voltage field emission display having an integrated spacer assembly in which an assembled spacer and a spacer holder are integrally manufactured in a display device which is an important part of an information transmission medium, and a method of manufacturing the same. united spacer assembly for high voltage screen and Manufacturing method.

As a representative application field, a display device is mainly applied to a monitor and a television receiver of a personal computer, and recently, new application fields have been widely created. Existing display devices can be broadly classified into CRT displays, also known as CRT displays, and flat panel display devices showing rapid technological advances.

In particular, recently attracting attention as a flat panel display device, a liquid crystal display (LCD), a plasma display (PDP), a fluorescent display (VFD), a field emission display ( Field emission display (FED) is being actively researched and developed.

Among the flat panel display devices, the field emission display device is a high-resolution large display device, which is a representative flat panel display device that can be applied to the next-generation display device having low power consumption and high brightness. At present, it is in the process of preparing its practical use. However, the practical use of the field emission display device has yet to overcome the problems of many technologies, its manufacturing process needs to simplify the process to enable mass production, and also has the problems that require long-term reliability. have.

Research into field emission display devices has been largely classified into high voltage FEDs having a voltage of more than 3kV and low voltage FEDs of 3kV or less. In the case of a high voltage FED, a high voltage is applied to an anode plate, and a light emission luminance is very good by using a high voltage phosphor on an anode screen.

However, a distance between the cathode plate and the anode screen plate in which the micro-tip is integrated, which is the electron emission source in the vacuum region, is required to be 1 to 2 mm or more. In order to form a spacer for the spacer, a spacer must be formed within a very fine interval between the high-definition phosphor patterns on the anode screen, that is, a line width of 40 to 70 μm, thereby preventing the problem of material selection and structural limitations. Have.

In addition, spacers have sufficient strength to withstand high vacuum breakdown pressures, and high aspect ratio spacers need to be developed to maintain a gap of 1 mm or more between the positive electrode plate and the negative electrode plate. The spacer width required for the development of a high-definition display device is required to be 70 μm or less. However, when the spacer width is 70 μm or less, a problem occurs that the spacer bends.

1 is a perspective plan view showing a schematic structure of a conventional field emission display device. As shown in the drawing, in the conventional field emission display device, the spacer 10 has an active area () of the positive electrode screen plate 11 so as to maintain a constant distance between the negative electrode plate 1 and the positive electrode screen plate 11. 19 is fitted to the spacer holder 20 provided at both edges. 2 shows an enlarged view of the spacer 10 fitted to the spacer holder 20 and fixed by the fixing adhesive 14.

In addition, as the thickness of the spacer is less than 70㎛, the spacer does not maintain a straight line, causing a problem that is difficult to apply to high-definition image display, and because the spacer is installed separately, it takes a long time in the panel manufacturing process. In the spacer manufacturing process, a separate heat firing process is required, which increases the process step. Here, in the case of the adhesive used to fix the spacer, there is a problem of thermal deformation of the negative electrode plate (back substrate) and the positive electrode plate (front substrate) as it is fixed by heat firing at a high temperature of 470 ° C. or higher.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and a high-strength high aspect ratio spacer and an spacer holder are integrally integrated in a high-resolution large display device having low power consumption and high brightness. SUMMARY OF THE INVENTION An object of the present invention is to provide a high voltage field emission display device having a fabricated integrated spacer assembly and a method of manufacturing the same.

1 is a perspective plan view showing an arrangement relationship of spacers employed in a conventional field emission display device;

FIG. 2 is a plan view illustrating in detail a state in which a space is assembled to a spacer holder in FIG. 1;

3 is a vertical cross-sectional view showing a schematic structure of a high-voltage field emission display device having a spacer assembly in which a high aspect ratio spacer and a spacer holder are integrally formed according to the present invention;

4A is a perspective plan view of a field emission display device employing the integrated spacer assembly of FIG. 3;

4B is a vertical cross-sectional view showing a cut along the line AA ′ of FIG. 3;

4C is an enlarged view illustrating a spacer arrangement relationship of a utilization area in FIG. 4A;

5 is a plan view illustrating a spacer assembly shape of the integrated spacer assembly employed in the field emission display of FIG. 3.

FIG. 6 is a perspective view illustrating the external appearance of spacers employed in the field emission display of FIG. 3. FIG.

FIG. 7 is a perspective view illustrating a shape of a spacer holder disposed on a bipolar plate outside the pixel area to fix an integrated spacer assembly employed in the field emission display of FIG. 3.

8 is a perspective view illustrating an arrangement of spacers fixed to the spacer holder of FIG. 7;

9 is a perspective view illustrating a shape in which spacers are alternately arranged in the integrated spacer assembly employed in the field emission display of FIG. 3.

<Description of the symbols for the main parts of the drawings>

1.Negative plate 10.Spacer

11. Positive plate 14. Spacer fixing groove

17. Side glass rod, glass paste 20. Spacer holder

100.Negative plate 102.Negative electrode

103. Insulation layer 104. Microtip

105. Vacuum area 106. Insulation layer hole

107. Gate 108. Gate Opening

110 Spacer 111.Polar plate

112. Anode 113. Color phosphor layer

114. Side glass bar 115. Striped getter holder

116. Striped getter 117. Frit (glass paste)

118. Exhaust Tube 119. Exhaust Hole

120. Spacer holder 121. Through hole

In order to achieve the above object, the field emission display device having the integrated spacer assembly according to the present invention includes: a positive electrode plate and a negative electrode plate disposed to face each other at a predetermined interval over a predetermined distance; Stripe-shaped cathodes formed on the cathode plate; An insulating layer stacked to have holes formed at regular intervals on the cathodes and the anode plate exposed by the cathodes; Microtips formed on the cathode exposed by the holes of the insulating layer; Gates formed on the insulating layer to have openings corresponding to the holes on a stripe in a direction crossing the cathodes; Positive electrodes formed on the positive electrode plate in a stripe direction in parallel with the negative electrode; A phosphor layer coated on the anodes; And a side bar sealing four edges between the positive electrode plate and the negative electrode plate, wherein the field emission display device is driven by applying a strong electric field to emit electrons from the microtips according to a distance between the positive electrode plate and the negative electrode plate. A high aspect ratio spacer comprising: a high aspect ratio spacer having an aspect ratio of a predetermined value or more for maintaining a gap between the positive electrode plate and the negative electrode plate; And a spacer holder having grooves into which the spacers are fitted and fixed and through holes for fixing to the substrate; an integrated spacer assembly in which the spacers are integrally assembled. The integrated spacer assembly includes a spacer holder between the positive electrode plate and the negative electrode plate. It is fixed by being fixed to the positive electrode plate by the glass paste filled in the through holes on the positive electrode plate between the outer side of the utilization region where the microtips are disposed inside the side bar.

In the present invention, the positive electrode plate, the negative electrode plate and the side frame are each formed of glass, the edges of the negative electrode plate and the positive electrode plate is sealed by melt bonding by frit powder applied to the upper and lower portions of the glass frame, the negative electrode plate and the positive electrode plate 1mm The high aspect ratio spacers having a height: width of at least 10: 1, wherein the high aspect ratio spacers are disposed in parallel with the anodes on a black matrix region where the anodes are not formed. The high aspect ratio spacers are disposed in a direction parallel to the gates on the insulating layer where the gates are not formed, and the high aspect ratio spacers have a thick portion having a cylindrical columnar shape thicker than the thickness of the high aspect ratio spacers at regular intervals and at the same time in the height direction. Formed to have an uneven portion, and The sidewalls of the high aspect ratio spacers are further formed with a metal wiring to prevent the accumulation of charge, the getter in the form of a stripe on the anode plate or cathode plate between the outer side of the spacer holder inside the side bar between the anode plate and the cathode plate; It is preferable to form more.

In addition, in order to achieve the above object, a method of manufacturing a field emission display device having an integrated spacer assembly according to the present invention includes: a positive electrode plate and a negative electrode plate disposed to face each other at regular intervals over a predetermined distance; Stripe-shaped cathodes formed on the cathode plate; An insulating layer stacked to have holes formed at regular intervals on the cathodes and the anode plate exposed by the cathodes; Microtips formed on the cathode exposed by the holes of the insulating layer; Gates formed on the insulating layer to have openings corresponding to the holes on a stripe in a direction crossing the cathodes; Positive electrodes formed on the positive electrode plate in a stripe direction in parallel with the negative electrode; Phosphor layers coated on the anodes; Side bars for sealing the four edges between the positive and negative plates; High aspect ratio spacers having an aspect ratio of a predetermined value or more for maintaining a gap between the positive electrode plate and the negative electrode plate; And a spacer holder having grooves into which the spacers are inserted and fixed and through holes for fixing to the substrate; an integrated spacer assembly in which the spacers are integrally assembled. Forming the cathodes, insulating layer, microtips and gates on a cathode plate; Forming the anodes and the phosphor layers on the anode plate; Forming the unitary spacer assembly; The integrated spacer assembly is aligned such that the spacer holder is positioned on the positive electrode plate between the outer side of the utilization area where the microtips are disposed inside the side bar between the positive electrode plate and the negative electrode plate, and heat the positive electrode plate to 320 ° C. to 350 ° C. Simultaneously melting and firing the low melting glass paste inserted into the through hole with a laser to fix the integrated spacer assembly on the positive electrode plate; And sealing the positive electrode plate to which the integrated spacer assembly is fixed by using the side bar to face the negative electrode plate.

In the present invention, the forming of the unitary spacer assembly may include: fabricating the high aspect ratio spacers into horizontal spacers and vertical spacers; Forming grooves and through holes for fixing the spacer in the horizontal direction on the pair of first bars facing each other; Forming grooves and through holes for fixing the spacers in the vertical direction on the pair of second bars opposed to each other; And arranging the first and second bars in a quadrangular shape, inserting the horizontal spacers and the vertical spacers into grooves formed in the first and second bars, and inserting a low melting glass paste. It includes; firing the melt with a laser.

In addition, in the present invention, the negative electrode plate and the positive electrode plate is formed to have a spacing of 1mm or more, the aspect ratio of the high aspect ratio spacer is a height: width of 10: 1 or more, the high aspect ratio spacers of the high aspect ratio spacer at regular intervals It is formed to have a thicker portion of the cylindrical columnar shape than the thickness and the uneven portion in the height direction at regular intervals, and to form a metal wiring on the side of the high aspect ratio spacer to prevent the accumulation of charge, between the positive electrode plate and the negative electrode plate The method may further include forming a getter in a stripe shape on the positive electrode plate or the negative electrode plate between the outer side of the spacer holder inside the side bar.

Hereinafter, a field emission display device having an integrated spacer assembly according to the present invention and a method of manufacturing the same will be described in detail with reference to the accompanying drawings.

In the field emission display device having the integrated spacer assembly according to the present invention, the integrated spacer assembly includes a high-strength high aspect ratio spacer and an spacer spacer holder, which are essential for high-definition large flat display devices having low power consumption and high brightness. It is made in one piece.

3 is a vertical cross-sectional view showing a schematic configuration of a high-voltage field emission display having an integrated spacer assembly in which a high aspect ratio spacer and a spacer holder are integrally assembled. As shown, in the field emission display device having the integrated spacer assembly according to the present invention, a spacer 110 having a high aspect ratio is fixed between the anode plate 100 and the anode screen plate 111 facing each other. It is disposed between three pixels to maintain a space between the two electrode plates 100 and 111 so as to display a high resolution image and maintain a high vacuum internal space. These high aspect ratio spacers 110 are assembled to a spacer holder (not shown) to form an integrated spacer assembly (see FIG. 5). The high-definition pixels may include micro tips 104 formed in an array form on lines 102 of the cathode 102 formed in a stripe shape on the cathode plate 100, and correspondingly, anodes 112 formed in a stripe shape on the anode plate 111. It is formed by the phosphors 113 applied on the lines. That is, in the microtips 104, the emitted electrons collide with the phosphor 113 to generate light. For this electron emission, gates 107 are formed on the insulating layer 103, which are disposed on a stripe in a direction in which the microtips 104 cross the cathode 102 line. A microtip 104 is disposed in the hole 106 of the insulating layer 103, and an opening 108 corresponding to the hole 106 is formed in the gate 107 to allow electrons to be emitted.

In particular, an integral spacer assembly in which the high aspect ratio spacers 110 and the spacer holder 120 are integrally assembled is arranged as shown in FIG. 4A. That is, the integrated spacer assembly is fixed to the inner surface of the side glass frame 117 formed on the positive electrode plate 111 outside the active area, that is, the pixel area 190 as shown in FIG. 4B. do. 4B is a cross-sectional view taken along the line AA ′ of FIG. 3, that is, along one spacer in FIG. 4A. 4C is an enlarged view of a portion of the pixel region of FIG. 4A, showing the arrangement relationship of the spacers 110 more reliably. Referring to this, it is clear that the spacers 110 are disposed between the electrodes.

In addition, stripe-type getters 116 are further disposed on the positive electrode plate 111 or the negative electrode plate 100 between the outer side of the spacer holder 120 inside the side bar 114 between the positive electrode plate 111 and the negative electrode plate 100. Supported by a getter holder 115.

5 is a plan view showing the formation of an integrated spacer assembly employed in the high voltage field emission display device according to the present invention. As shown, the spacers 110 are arranged in a vertical direction as well as in the horizontal direction to more firmly maintain the internal spacing of the two electrode plates (see 100 and 111 of FIG. 4B). The spacer 110 is fixed by the glass paste 120 ′ preheated to the side glass rod 117.

FIG. 6 is a perspective view of the spacers of the integrated spacer assembly employed in the field emission display of the present invention. FIG. As illustrated, a conductive metal electrode 110 ′ is formed on the side surface of the spacer 110 to suppress charge of the spacer.

7 is a perspective view showing the shape of the spacer holder 120 of the integrated spacer assembly employed in the field emission display of the present invention. As shown in the drawing, the spacer holder 120 is provided with fixing grooves 120a for fixing the spacer 110. And low-melting-point glass paste (refer 120 of FIG. 5) is pre-heated up and down as an adhesive agent. The arrangement of the spacers 110 fixed to the spacer holder 120 is shown in FIG. 8.

9 is a perspective view illustrating a shape in which spacers employed in the field emission display device of the present invention are arranged crosswise. 4A, 4C, and 5, the spacers are cross-assembled in detail. As shown in FIG. 4C, the spacer 110 has a cylindrical thick portion 110a with a predetermined number of pixel intervals. In order to increase the gap retention strength between the two electrode plates, the spacer 110 also has a structure in which the uneven portions are formed at regular intervals. These cylindrical coarse portions 110a are disposed at regions where the portions where electrodes are not formed cross each other, as shown in FIG. 4A during assembly.

The manufacturing process of the field emission display device employing the integrated spacer assembly in which the high aspect ratio spacer and the spacer holder are integrally assembled as described above is as follows.

First, as shown in FIG. 3, the cathode 102, the insulator layer 103, and the gate chromium layer 107 are formed on the glass substrate 100. In this case, the cathode 102 and the gate 107 are formed to be in the form of a plurality of line electrodes having an x-y matrix shape while being opposed to each other with the insulator layer 103 interposed therebetween.

Next, a circular opening pattern (not shown) mask is formed on the portion where the microtip 104 is to be formed using the photoresist layer, which is a photosensitive material, to prepare the opening 108 of the gate. At this time, the diameter of the opening pattern is formed so that the diameter of the opening 108 of the gate is about 1.2 μm.

Next, the opening 108 of the chrome gate 107 is formed by dry etching using a reactive ion etching (RIE) method using a mask. Cl2 and O2 are used as the etching gas of the chromium gate 107. The hole 106 of the insulator layer 103 is formed by wet etching.

Next, while using the aluminum to rotate the substrate to lift-off separation layer (not shown) by the electron beam evaporator so that the electron beam at a constant angle (θ≤15 °) on the substrate surface is carried out inclined deposition While depositing the gate opening 108 until the diameter of the gate opening 108 decreases to about 0.2 μm.

Next, as a process of forming the molybdenum tip, the deposition in the vertical direction is performed while the substrate is rotated using the molybdenum source for electron beam deposition while the vacuum state is maintained in the vacuum evaporator. In this way, an unnecessary molybdenum layer is deposited on a separation layer (not shown) of aluminum, and at the same time, a molybdenum tip 104 having a very sharp tip is formed in the hole 106 of the insulating layer 103. .

Next, when the aluminum separation layer is subjected to the etching process using a lift-off process, the fabrication of the negative electrode plate 100 in which the micro tip 104 for field emission is integrated is completed.

Then, the fabrication of the anode screen plate 111 is performed as follows.

First, the anode 112 of the line electrode pattern is formed using a photolithography process. Since the anode material is formed on the screen, a transparent material is used, and indium tin oxide (ITO) is a representative material. A black matrix is formed between the anodes.

Next, a color phosphor layer 113 of R (red), G (green), and B (blue) is formed on the anode plate 111 by using a slurry process used in a cathode ray tube (CRT) manufacturing process. To form a screen.

Next, stripe-type getters 116 are further formed on the positive electrode plate 111 or the negative electrode plate 100 between the outer side of the spacer holder 120 inside the side bar 114 between the positive electrode plate 111 and the negative electrode plate 100. It may be to be supported by the getter holder 115.

Next, as a step of assembling the integrated spacer assembly which is a feature of the present invention, the spacer fixing groove 120a as shown in FIG. 7 is machined in the horizontal and vertical directions of the rectangular spacer holder as shown in FIG. After assembling the high aspect ratio spacer 110, a low melting glass paste (120 ′ in FIG. 5) is inserted with an adhesive and melted with a laser to assemble the spacer 110 and the spacer holder 120. Complete Completed in this manner is an integrated spacer assembly as shown in FIG. 5. The actual assembly is shown in part in FIGS. 8 and 9.

Next, the previously completed integrated spacer assembly is aligned on the negative electrode plate 100 or the positive electrode plate 111. At this time, the low melting point glass paste is inserted into a plurality of through holes (see 121 of FIG. 5) formed in the spacer holder 120 of the integrated spacer assembly, and the cathode plate 100 or the anode plate 111 is formed at 320 ° C. to 350 ° C. The low melting glass paste is melt baked using a laser while heating to the base temperature.

Next, as shown in FIG. 3, a side glass bar 114 in which a low melting point glass 117 is pre-heat-melted is assembled on the outer surface between the negative electrode plate 100 and the positive electrode plate 111. Subsequently, the field emission display device is completed by performing the sealing process and the heat exhaust process of the field emission display device. At this time, the getter 116, which is a residual gas adsorption material, is mounted in the stripe getter holder 115 in the vacuum area of the field emission display device, and the getter 116 is activated at the final stage of the heat exhaust process.

In order to drive the field emission display device fabricated as described above, first, a voltage of about 70V to 100V is applied between the cathode and the gate electrode, and a potential difference of about 3kV is maintained between the cathode 102 and the anode 112. Then, electrons are emitted from the micro tip 104 and pass through the vacuum region to impinge on the screen of the phosphor layer 113 on the anode 112 and the desired portion begins to emit light. Here, the cathode and the gate are in the form of line electrodes having a predetermined interval and line width, and have a X-Y matrix structure facing each other with the insulator 103 interposed therebetween, so that only selected regions emit light. At this time, the distance between the glass cathode plate 100 on which the field emitter array is formed and the anode plate 111 on which the phosphor screen is formed may be maintained by the high-definition spacer 110. At this time, the holding interval is about 1 mm. Here, the voltage of the gate electrode at which electrons start to be emitted from the micro tip 104 is different from the tip diameter of the micro tip 104 by about ≤ 400 kV and the cross section of the opening 108 formed in the gate electrode and the tip of the micro tip. It is mainly determined by the difference between the distances (about 0.5 μm).

The uniformity of the current density due to the electron emission from the microtip 104 is greatly influenced by the tip diameter of the microtip 104 and the distance difference between the end surface of the opening 108 of the gate 107 and the tip of the microtip. . Since the uniformity of electron emission current density is represented as the difference in luminance on the screen of the phosphor 113 on the anode 112, it is very important to ensure the uniformity of the current density by electron emission in each region. Display quality will be influenced. In addition, in order to fabricate a field emission display device having reliability in terms of durability of the display device, it is very important to install a spacer having sufficient strength because an external pressure acts as a high vacuum is maintained inside the panel.

As described above, the field emission display device having the integrated spacer assembly in which the high aspect ratio spacer and the spacer holder are integrally assembled is integrated with the spacer holder having the high aspect ratio spacer having a thick cylindrical columnar shape at regular intervals. The low melting point glass paste is inserted into the spacer holder fixing through hole formed in the spacer holder of the integrated spacer assembly, and then aligned on the positive electrode plate (or negative electrode plate) to form the positive electrode plate (or negative electrode plate) at 320 ° C. While heating to a base temperature of 350 ° C., the low melting glass paste is melt-fired using a laser to fix the integral spacer assembly on the positive plate, and then the edge between the positive plate and the negative plate is heated in advance. Molten side glass rod bar) to seal and perform the exhaust process to complete the field emission device.

As such, the field emission device having the integrated spacer assembly according to the present invention has the following advantages.

1. In the method of assembling the spacer on the spacer holder, a very small amount of low melting glass paste is inserted into the spacer fixing groove formed on the spacer holder, and the spacer can be easily assembled to the spacer holder by easily melting and fixing in a short time in a few seconds with a laser. . Therefore, there is an effect that can be performed by shortening the thermosetting process of the adhesive, which took 4 hours in the past, within 1 hour without additional heat treatment process for the thermosetting of the adhesive for fixing the spacer.

2. When assembling the negative plate and the positive plate of the FED panel, the integrated spacer assembly composed of the spacer and the spacer holder is assembled together and the sealing process is performed to facilitate the automation of the spacer mounting process.

3. As there is no out gassing by adhesive without using adhesive for fixing spacers, it is possible to maintain the vacuum inside the FED panel so that the life of the panel can be sufficiently secured.

Claims (19)

A positive electrode plate and a negative electrode plate disposed to face each other at regular intervals of a predetermined distance or more; Stripe-shaped cathodes formed on the cathode plate; An insulating layer stacked to have holes formed at regular intervals on the cathodes and the anode plate exposed by the cathodes; Microtips formed on the cathode exposed by the holes of the insulating layer; Gates formed on the insulating layer to have openings corresponding to the holes on a stripe in a direction crossing the cathodes; Positive electrodes formed on the positive electrode plate in a stripe direction in parallel with the negative electrode; A phosphor layer coated on the anodes; And And a side bar sealing four edges between the positive electrode plate and the negative electrode plate, and applied to a field emission display device driven by applying a strong electric field that emits electrons from the microtips according to a distance between the positive electrode plate and the negative electrode plate. In High aspect ratio spacers having an aspect ratio of a predetermined value or more for maintaining a gap between the positive electrode plate and the negative electrode plate; And a spacer holder having grooves into which the spacers are inserted and fixed and through holes for fixing to the substrate; an integrated spacer assembly in which the spacers are integrally assembled. The one-piece spacer assembly is secured to the positive electrode plate by means of a glass paste filled in the through-holes on the positive electrode plate between the outer side of the utilization region where the microtips are disposed inside the side bar between the positive electrode plate and the negative electrode plate. A field emission display having an integrated spacer assembly characterized in that it is fixed. The method of claim 1, The positive electrode plate, the negative electrode plate and the side frame are each formed of glass, and the edges of the negative electrode plate and the positive electrode plate are melt-bonded and sealed by frit powder applied to upper and lower portions of the glass frame. Device. The method according to claim 1 or 2, And the cathode and anode plates are formed to have a spacing of 1 mm or more. The method according to claim 1 or 2, And the aspect ratio of the high aspect ratio spacers is a height: width of 10: 1 or more. The method according to claim 1 or 2, And the high aspect ratio spacers are disposed in parallel with the anodes on a black matrix region where the anodes are not formed. The method of claim 5, And the high aspect ratio spacers are further disposed in parallel with the gates on an insulating layer on which the gates are not formed. The method according to claim 1 or 2, And the high aspect ratio spacers have a cylindrical columnar thick portion thicker than the thickness of the high aspect ratio spacers at regular intervals. The method according to claim 1 or 2, And the high aspect ratio spacers are formed to have recesses and protrusions in a height direction at regular intervals. The method according to claim 1 or 2, And sidewalls of the high aspect ratio spacers further comprising metal wires for preventing charge from accumulating therein. The method according to claim 1 or 2, And a stripe-type getter formed on the positive electrode plate or the negative electrode plate between the outer side of the spacer holder inside the side bar between the positive electrode plate and the negative electrode plate. A positive electrode plate and a negative electrode plate disposed to face each other at regular intervals of a predetermined distance or more; Stripe-shaped cathodes formed on the cathode plate; An insulating layer stacked to have holes formed at regular intervals on the cathodes and the anode plate exposed by the cathodes; Microtips formed on the cathode exposed by the holes of the insulating layer; Gates formed on the insulating layer to have openings corresponding to the holes on a stripe in a direction crossing the cathodes; Positive electrodes formed on the positive electrode plate in a stripe direction in parallel with the negative electrode; Phosphor layers coated on the anodes; Side bars for sealing the four edges between the positive and negative plates; And High aspect ratio spacers having an aspect ratio of a predetermined value or more for maintaining a gap between the positive electrode plate and the negative electrode plate; And a spacer holder having grooves into which the spacers are inserted and fixed and through holes for fixing to the substrate; an integrated spacer assembly in which the spacers are integrally assembled. Forming the cathodes, the insulating layer, the microtips and the gates on the cathode plate; Forming the anodes and the phosphor layers on the anode plate; Forming the unitary spacer assembly; The integrated spacer assembly is aligned such that the spacer holder is positioned on the positive electrode plate between the outer side of the utilization area where the microtips are disposed inside the side bar between the positive electrode plate and the negative electrode plate, and heat the positive electrode plate to 320 ° C. to 350 ° C. Simultaneously melting and firing the low melting glass paste inserted into the through hole with a laser to fix the integrated spacer assembly on the positive electrode plate; And Sealing the positive electrode plate to which the integrated spacer assembly is fixed by using the side bar against the negative electrode plate; And a field emission display device having an integrated spacer assembly. The method of claim 11, Forming the unitary spacer assembly comprises: Dividing the high aspect ratio spacers into horizontal spacers and vertical spacers; Forming grooves and through holes for fixing the spacer in the horizontal direction on the pair of first bars facing each other; Forming grooves and through holes for fixing the spacers in the vertical direction on the pair of second bars opposed to each other; And The first and second bars are arranged in a quadrangular shape, the horizontal spacers and the vertical spacers are inserted into grooves formed in the first and second bars, and a low melting glass paste is inserted. Melt firing with a laser; And a field emission display device having an integrated spacer assembly. The method of claim 11, And manufacturing the integrated spacer assembly to the negative electrode plate. The method of claim 11, The cathode and anode plates are formed to have a gap of 1mm or more, the manufacturing method of the field emission display device having an integrated spacer assembly. The method according to claim 11 or 12, wherein The aspect ratio of the high aspect ratio spacer is a height: width of 10: 1 or more method of manufacturing a field emission display having an integrated spacer assembly. The method according to claim 11 or 12, wherein And the high aspect ratio spacers have a cylindrical columnar thick portion that is thicker than the thickness of the high aspect ratio spacers at regular intervals. The method according to claim 11 or 12, wherein And the high aspect ratio spacers are formed to have concave-convex portions in a height direction at regular intervals. The method according to claim 11 or 12, wherein And forming metal wirings on the side surfaces of the high aspect ratio spacers to prevent charge from accumulating therein. The method of claim 11, Forming a getter in the form of a stripe on the positive electrode plate or the negative electrode plate between the outer side of the spacer holder inside the side bar between the positive electrode plate and the negative electrode plate; How to make.