KR20010002192A - Method of Fabricating Barrier Rib and Mold for Forming Barrier Rib - Google Patents

Abstract

PURPOSE: A method for producing a barrier rib and a metal mold for forming the barrier rib are provided to form the barrier rib having the high aspect ratio. CONSTITUTION: A dielectric layer(42) is formed on a substrate(40). An electrode layer is formed on the dielectric layer(42). A metal mold(58) is located on the substrate(40). The liquid glass(56) is injected to the metal mold(58) from a nozzle(54) by locating the nozzle on the metal mold(58). The liquid glass is injected to the metal mold(58) through a through hole in the metal mold. A crack and a transformation of materials are prevented by preheating the substrate at 300-350deg.C. A barrier rib is formed by removing the metal mold(58). The metal mold(58) is removed by cooling at a room temperature under 5deg.C/min. Thereby, the barrier rib having the high aspect ratio is produced.

Description

Method of Fabricating Barrier Rib and Mold for Forming Barrier Rib}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device manufacturing method and a mold for forming partition walls.

Recently, Liquid Crystal Display (hereinafter referred to as "LCD"), Field Emission Display (hereinafter referred to as "FED") and Plasma Display Panel (hereinafter referred to as "PDP") Flat display devices such as PDP have been actively developed. Among them, PDP is easy to manufacture due to its simple structure, high brightness and high luminous efficiency, memory function, and has a wide viewing angle of 160 ° or more, and realizes a large screen of 40 inches or more. It has the advantage of being able to.

Referring to FIG. 1, the PDP according to the related art is coated with a predetermined thickness on the lower glass plate 14 having the address electrode 2 mounted thereon, and formed on the upper portion of the lower glass plate 14 to form a wall charge. The dielectric layer 18, the partition wall 8 formed on the dielectric layer 18 to divide each discharge cell, the phosphor 6 excited and emitted by the light generated by the plasma discharge, and the upper glass plate ( A transparent electrode pair 4 formed on the upper portion of the upper surface 16, a dielectric layer 12 forming a wall charge by applying a predetermined thickness on the upper glass plate 16 and the transparent electrode pair 4, and the dielectric layer 12. The protective film 10 which protects the dielectric layer 12 from sputtering by the discharge | coating apply | coated on the upper part of () is provided. When a driving voltage having a predetermined voltage level is applied between any one of the transparent electrode pairs 4 and the address electrode 2, plasma discharge is caused to occur inside the cell by electrons emitted from the address electrode 2. do. Subsequently, a driving voltage having a predetermined voltage level is applied between the pair of transparent electrodes 4 so that the plasma discharge is continued in the discharge cell. At this time, the electrons emitted from the pair of transparent electrodes 4 collide with atoms of the mixed gas of He + Xe or Ne + Xe injected into the discharge cell to cause the atoms of the mixed gas to ionize and the secondary electrons. Will be released. Secondary electrons collide with atoms in other gas mixtures, causing atoms in other gas mixtures to ionize. The avalanche phenomenon, in which electrons and gas ions increase due to the repetitive collision between the secondary elements and the atoms of the mixed gas, occurs. Ultraviolet rays are generated by the avalanche phenomenon, and the ultraviolet rays are red (hereinafter referred to as "R"), green (hereinafter referred to as "G"), and blue (hereinafter referred to as "B"). When the phosphors emit light, visible light of R, G, and B is emitted. The visible light is emitted through the upper glass plate 16, so that an image including a character or a graphic is displayed.

On the other hand, with the trend of applying PDP to high-definition display devices, the bulkhead has become high definition and demands high aspect ratio. In response to these demands, a low temperature cofired ceramic on metal (LTCCM) method for simplifying a process and manufacturing a high-definition, high aspect ratio partition wall has been proposed. Hereinafter, a method of manufacturing a partition wall using the LTCCM method will be described.

Referring to Figure 2, the procedure of the partition wall manufacturing method according to the prior art is shown.

First, a green sheet 20 is formed. The green sheet 20 is prepared by preparing a slurry, and then forming the slurry using a tape casting apparatus to have a predetermined thickness. At this time, the slurry is formed by mixing the organic material in the glass powder at a predetermined ratio. In this case, the organic substance means a binder for maintaining the viscosity of the glass powder, a plasticizer for preventing the curing of the slurry to have a predetermined flexibility, a solvent for dissolving the binder and the plasticizer, and a predetermined amount of additives. The slurry is used for tape casting while maintaining a liquid state. Thus, the manufacturing method of forming a slurry to predetermined thickness using a tape casting apparatus is called "doctor braid method." The green sheet 20 formed by the above process is shown in FIG.

Next, the green sheet 20 is laminated on the substrate 22. After the green sheet 34 is separated from the tape casting apparatus, the green sheet 34 is laminated and attached to the upper portion of the substrate 22 having a predetermined thickness. The substrate 22 may be made of glass, glass-ceramic, ceramic, metal, or the like. Particularly in the case of metal, titanium is mainly used. At this time, the green tape 20 stacked on the substrate 22 is shown in Figure 2 (b).

Next, the electrode 24 is formed on the green sheet 20. The green sheet 20 stacked on the substrate 22 is introduced into a printer (not shown) to form the electrode 24 by printing. At this time, the electrode 24 formed on the upper portion of the green sheet 20 is shown in (c) of FIG.

Subsequently, the electrode protective layer 26 is formed on the electrode 24. An electrode protective layer 26 is formed on the electrode 24 to protect the electrode. At this time, the electrode protective layer 26 formed on the electrode 24 is shown in Fig. 2 (d).

Finally, after the partition 28 is placed on top of the substrate 22, the partition wall 30 is formed by applying a predetermined pressure. After placing the mold 28 having the grooves 28a having the opposite shape of the partition wall on the substrate 22, the partition wall is applied to the green sheet 20 by applying a predetermined pressure (for example, 100 kgf / cm 2). 30 is molded. In this case, a predetermined pressure is applied between the mold 28 and the substrate 22 or by using a roller or the like. At this time, the green sheet 20 is molded into the shape of the partition wall by the mold 28 of the partition opposite shape. At this time, the process of forming the partition wall is shown in (e) of FIG. In addition, the partition 30 in which the molding is completed is fired at a predetermined temperature. At this time, the partition 30 formed by baking is shown in FIG.2 (f). Meanwhile, in the molding process illustrated in FIG. 2E, the surface of the mold 28 and the green sheet 20 are thermocompressed by being pressed by a predetermined pressure. Due to this, the partition 30 is in a state of being fitted into the partition forming groove 28a, so that a part of the partition 30 is separated from the green sheet 20 in the process of separating the partition 30 and the mold 28. Being derived. Accordingly, there is a demand for a method for improving a process yield and producing a high-definition bulkhead having a high aspect ratio.

Accordingly, it is an object of the present invention to provide a method for manufacturing partition walls for forming a high definition partition wall having a high aspect ratio.

It is also an object of the present invention to provide a mold for forming a partition wall for forming a high-definition partition wall having a high aspect ratio.

1 is a diagram showing the structure of a conventional plasma display device.

2 is a view for explaining a method of manufacturing a plasma display device.

Figure 3 is a view showing for explaining a partition wall manufacturing method according to an embodiment of the present invention.

4 is a view showing a mold used in FIG.

5 is a view showing for explaining a partition manufacturing method according to another embodiment of the present invention.

6 is a view showing a mold used in FIG.

<Description of the code | symbol about the principal part of drawing>

2,24,46: address electrode 4: transparent electrode pair

6: phosphor 8,30,60: bulkhead

10: protective layer 12,18,42: dielectric thick film

14,22,42: lower substrate 16: upper substrate

26: electrode protective layer 28, 50, 58: mold

52: release film 54: nozzle

56: liquid glass 58a: through groove

In order to achieve the above object, the barrier rib manufacturing method of the present invention comprises the steps of forming a high-temperature fired dielectric layer on the substrate, forming an electrode layer on the dielectric layer, and forming a low-temperature fired barrier on the dielectric layer. It includes.

The mold for forming a partition wall of the present invention includes a plurality of through holes formed to inject liquid glass.

Other objects and features of the present invention other than the above object will become apparent from the description of the embodiments with reference to the accompanying drawings.

With reference to Figures 3 to 6 will be described a preferred embodiment of the present invention.

Referring to FIG. 3, there is shown a diagram for describing a method of manufacturing a partition wall according to an exemplary embodiment.

First, the dielectric layer 42 and the electrode layer 46 are sequentially formed on the substrate 40. As the substrate 40, a metal substrate having a relatively high thermal shock resistance is used. As a material of the board | substrate 40, Ti, Mo, etc. are preferable. As shown in FIG. 3A, a dielectric layer 42 having a predetermined thickness is formed on the substrate 40. In this case, the dielectric layer 42 is preferably made of a material having a high baking temperature so as to increase the bonding force between the substrate 40 and the partition wall 60. To this end, the dielectric layer 42 is made of glass-ceramic material having a firing temperature of 700 to 800 ° C. to withstand thermal shock during the fabrication of partition walls and to increase adhesion to the metal substrate. In addition, the dielectric layer 42 is formed using a paste or slurry. At this time, the paste or slurry is formed by mixing the organic solvent in the glass-ceramic powder without an alkali component in order to prevent the diffusion of the electrode material when forming the partition wall. In addition, the electrode layer 46 is introduced into an electrode printer (not shown) as shown in FIG. 3B to be formed on the dielectric layer 42.

Subsequently, a barrier material is applied on the dielectric layer 42 to a predetermined thickness. At this time, the partition material is to use a partition paste (Paste) or a partition slurry (Slurry). The partition material paste is applied to the upper portion of the dielectric layer 42 at a predetermined thickness by using a method such as a screen printing method. In addition, the partition wall slurry laminates a green tape formed on the top of the dielectric layer 42 by using the doctor blade method. At this time, the green tape is pressed and baked at a predetermined temperature (for example, 100 ° C.) using a flat die to increase the adhesion between the dielectric layer 42 and the green tape. In addition, it is possible to use a cylindrical roll mold according to the manufacturer's intention to increase the adhesion of the green tape. In this case, the electrode may be applied to the upper surface of the dielectric layer and then pressed and fired. At this time, it is preferable that the firing temperature of the partition material is maintained below the firing temperature of the electrode material when forming the partition wall. In this way, deterioration of the electrode material is prevented by using a material which can maintain the firing temperature of the partition material below the firing temperature of the electrode material (for example, 550 ° C).

Next, the partition wall 60 is shape | molded using the metal mold | die of a partition opposite shape. The partition wall 60 is formed by a stamping method using a mold having a partition opposite shape. In the production of the partition wall, the substrate 40 coated with the partition material 48 is held at a heating rate of 10 ° C./min at a predetermined firing temperature (eg, 550 ° C.) for at least 1 minute. At this time, the partition material 48 is to maintain the liquid state in physical properties. As shown in (d) of FIG. 3, the mold is cooled to room temperature at a pressure of 50 kgf / cm 2 or less for 1 minute or more, and then the mold is removed. When the molded substrate is cooled to room temperature at a rate of 5 ° C./min or less, partition walls are completed as shown in FIG. By the above method, the partition wall 60 having a thickness of 50 μm or less is formed. At this time, according to the intention of the manufacturer may be installed a separate cooling device in the mold to prevent the temperature rise of the mold. In this case, the releasability between the partition and the mold is increased after molding by having a temperature difference between the partition material to be molded and the mold. In addition, it is preferable to use a mold as shown in FIG. 4 to increase the releasability. As described above, the partition wall manufacturing method according to the embodiment of the present invention increases the releasability of the mold 50 and the partition wall 60 to increase the process yield and to form a high-definition PDP partition wall having a high aspect ratio.

On the other hand, referring to Figure 4, there is shown a mold for forming a partition wall used in the partition wall manufacturing method of the present invention. The mold for forming a partition wall of the present invention includes a release film 52 which is applied to its inner wall to facilitate separation of the partition wall 60 and the mold 50. At this time, the material of the mold 50 is preferably WC, high tensile steel, brass, cast iron. In addition, the release film 52 may be formed of a carbon-based thin film such as DLC (Diamond Like Carbon), DLN or CN _X , a ceramic thin film such as SiC or Si ₃ N ₄ , or a metal thin film such as Pt, W or Cr. It is formed by coating on the surface. Accordingly, the mold for forming the partition wall improves the releasability of the partition 60 and the mold 50 and forms a high-definition PDP partition wall having a high aspect ratio.

Referring to FIG. 5, there is shown a diagram for describing a method of manufacturing a partition wall according to another exemplary embodiment.

The dielectric layer 42 and the electrode layer 46 are sequentially formed on the substrate 40. As the substrate 40, a metal substrate having a relatively high thermal shock resistance is used. The material of the metal substrate 40 is preferably Ti, Mo, or the like. As shown in FIG. 5A, the dielectric layer 42 is formed on the substrate 40. In this case, the dielectric layer 42 is preferably made of a material having a high baking temperature so as to increase the bonding force between the substrate 40 and the partition wall 60. Since the description of the dielectric layer 42 has been described fully in FIG. 3, a detailed description thereof will be omitted. As shown in FIG. 5B, an electrode layer 46 is formed on the dielectric layer 42. In addition, the electrode layer 46 is introduced into an electrode printer (not shown) to be formed on the dielectric layer 42.

The mold 58 is placed on the substrate 40 and the liquid glass is injected. As shown in FIG. 5C, after the nozzle 54 is positioned on the upper portion of the mold 58, the liquid glass 56 is sprayed from the nozzle 54 to the mold 58. The through grooves 58a are formed in the mold so that the liquid glass is injected into the mold 58. In this case, when the liquid partition material is injected, cracking and deformation due to thermal shock of the partition material may be prevented by injecting the liquid material while the substrate temperature is preheated at a temperature of 300 to 350 ° C.

The mold 58 is removed to form the partition wall 60. After the liquid material is injected as shown in FIG. 5 (d), the mold 58 is removed by cooling to room temperature at a rate of 5 ° C./min or less. By this process, a high-definition bulkhead having a high aspect ratio is formed.

Referring to Figure 6, there is shown a mold for forming a partition wall of the present invention. The mold for forming a partition wall of the present invention includes a plurality of through grooves 58a formed in a stripe shape at the end so that the liquid glass is injected. The through groove 58a is provided with a stripe-shaped groove at the end to correspond to the position where the partition wall is to be formed. At this time, the liquid glass is injected into the mold 58 via the through grooves 58a to form a partition wall 60. Accordingly, a high-definition PDP partition wall having a high aspect ratio is formed.

As described above, the barrier rib manufacturing method of the present invention has the advantage of forming a high-definition PDP barrier rib having a high aspect ratio.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (8)

Forming a hot-fired dielectric layer on top of the substrate, Forming an electrode layer on top of the dielectric layer; And forming a low temperature fired bulkhead on the dielectric layer. The method of claim 1, Forming the low-temperature fired bulkhead, Applying a partition material on the dielectric layer to a predetermined thickness; Maintaining the partition material at a predetermined temperature and then forming a partition wall; And cooling the molded partition wall to room temperature to form a partition wall. The method of claim 1, Forming the low-temperature fired bulkhead, Heating the substrate to maintain the predetermined temperature; Positioning the mold on the upper portion of the substrate and injecting liquid glass; And forming the injected liquid glass by cooling it to room temperature. The method of claim 1, And a material having a high firing temperature so that the dielectric layer increases adhesion between the substrate and the partition wall. The method of claim 4, wherein And the material of the dielectric layer is a glass-ceramic having a firing temperature of 700-800 ° C. The method of claim 1, And a material having a low firing temperature so as to prevent deterioration of the electrode material. In the partition molding die for molding the partition for the plasma display device, A mold for forming a partition wall, comprising a plurality of through holes formed to inject liquid glass. The method of claim 7, wherein Partition die forming mold, characterized in that the through groove is formed in a stripe shape in the longitudinal direction of the mold.