KR20000017865U - Device for cooling the radio frequency board of communication equipment - Google Patents
Device for cooling the radio frequency board of communication equipment Download PDFInfo
- Publication number
- KR20000017865U KR20000017865U KR2019990003546U KR19990003546U KR20000017865U KR 20000017865 U KR20000017865 U KR 20000017865U KR 2019990003546 U KR2019990003546 U KR 2019990003546U KR 19990003546 U KR19990003546 U KR 19990003546U KR 20000017865 U KR20000017865 U KR 20000017865U
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- South Korea
- Prior art keywords
- radio frequency
- frequency board
- board
- electronic equipment
- communication electronic
- Prior art date
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/035—Cooling of active equipments, e.g. air ducts
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q2201/00—Constructional details of selecting arrangements
- H04Q2201/80—Constructional details of selecting arrangements in specific systems
- H04Q2201/808—Constructional details of selecting arrangements in specific systems in wireless transmission systems
Abstract
본 고안은 통신전자장비의 무선주파수를 송수신받기 위한 무선주파수보드에 관한 것으로, 통신전자장비의 몸체를 이루는 함체(100)의 수용공간에 무선주파수를 송수신하기 위한 무선주파수보드(110)가 장착된 구조로 이루어진 무선주파수보드의 방열장치에 있어서, 함체(100)의 상하부에 무선주파수보드(110)로부터 발생된 열과의 접촉면적을 증대시키기 위한 요철면(11,12)이 연속적으로 구비된 히트싱크(10)가 장착된 구조로 이루어져, 무선주파수보드로부터 발생된 열이 외부로 원활히 배출되므로, 무선주파수보드들의 수명이 연장되게 한 것이다.The present invention relates to a radio frequency board for receiving and transmitting the radio frequency of the communication electronic equipment, the radio frequency board 110 for transmitting and receiving radio frequency in the receiving space of the housing 100 constituting the body of the communication electronic equipment In the heat dissipation device of the radio frequency board having a structure, a heat sink continuously provided with the uneven surface (11, 12) for increasing the contact area with heat generated from the radio frequency board 110 in the upper and lower portions of the housing 100 10, the structure is mounted, since the heat generated from the radio frequency board is smoothly discharged to the outside, so that the life of the radio frequency board is extended.
Description
본 고안은 통신전자장비의 무선주파수를 송수신받기 위한 무선주파수보드에 관한 것으로, 특히 무선주파수보드의 소정우치에 히트싱크를 설치하여, 무선주파수보드의 방열면적을 극대화시킬 수 있도록 된 통신전자장비의 무선주파수보드 방열장치에 관한 것이다.The present invention relates to a radio frequency board for receiving and transmitting radio frequency of communication electronic equipment. In particular, by installing a heat sink in a predetermined space of the radio frequency board, it is possible to maximize the heat radiation area of the radio frequency board. It relates to a radio frequency board radiator.
일반적으로, 통신전자장비 예컨대, 무선통신단말기(Wireless Local Loop), 개인휴대통신(PCS), 이동통신단말기 등에는 뼈대를 이루게 되는 함체(RF unit)에 각종 무선주파수를 송수신하기 위한 다수개의 무선주파수보드가 설치되는데, 이러한 무선주파수보드는 지지베이스를 통해 함체내로 고정설치된다.In general, a plurality of radio frequencies for transmitting and receiving various radio frequencies to and from the RF unit, which forms a skeleton in communication electronic equipment, such as a wireless local loop, a personal mobile communication (PCS), and a mobile communication terminal The board is installed, and this radio frequency board is fixedly installed into the enclosure through the support base.
즉, 상기한 기능을 수행할 수 있도록 된 종래의 통신전자장비는 도 1의 단면도에 도시된 바와 같이, 통신전자장비의 내부로 실장되는 함체(100)에 가로방향으로 플레이트형상의 지지베이스(120)가 장착되며, 지지베이스(120)에 안테나로를 통해 무선주파수를 송수신받기 위한 무선주파수보드(110)이 스크류와 같은 체결수단을 통해 고정설치되어 있다.That is, the conventional communication electronic equipment capable of performing the above function is a plate-shaped support base 120 in the horizontal direction on the housing 100 mounted inside the communication electronic equipment, as shown in the cross-sectional view of FIG. ) Is mounted, the radio frequency board 110 for receiving and transmitting the radio frequency through the antenna path to the support base 120 is fixed through a fastening means such as a screw.
따라서, 함체(100)내에 장착된 지지베이스(120)상에 스크류와 같은 체결수단을 통해 안테나로부터 전송된 주파수를 송신받기 위한 무선주파수보드(110)를 장착되는 것이다.Therefore, the radio frequency board 110 is mounted on the support base 120 mounted in the enclosure 100 to receive the frequency transmitted from the antenna through a fastening means such as a screw.
그런데, 함체(100)의 내부공간에 무선주파수보드(110)로부터 발생된 열을 효과적으로 제거할 만한 어떠한 수단도 강구되지 않아, 무선주파수보드(110)들을 열적손상시키게 되는 문제점이 있었다.However, no means for effectively removing heat generated from the radio frequency board 110 in the inner space of the enclosure 100 has been devised, thereby causing thermal damage to the radio frequency boards 110.
또한, 함체(100)의 내부공간에 무선주파수보드(110)을 방열시키기 위한 수단으로 냉각팬과 같은 별도의 냉각장치를 설치하게 되는 경우에는, 무선주파수보드(110)들의 부피가 커지면서 설치공간이 증대되므로, 통신전자장비의 부피가 증대되는 문제점이 있었다.In addition, in the case where a separate cooling device such as a cooling fan is installed as a means for dissipating the RF board 110 in the inner space of the enclosure 100, the installation space is increased while the volume of the RF board 110 is increased. Since it is increased, there is a problem that the volume of communication electronic equipment is increased.
이에, 본 고안은 상기한 바와 같은 문제점을 해결하기 위하여 안출된 것으로서, 통신전자장비의 함체에 장착된 지지베이스에 무선주파수보드의 방열면적을 증대시키기 위한 별도의 히트싱크를 설치하여, 무선주파수보드들의 방열성능을 극대화시킬 수 있도록 된 통신전자장비의 무선주파수보드 방열장치를 제공하는 데에 그 목적이 있다.Therefore, the present invention was devised to solve the problems as described above, by installing a separate heat sink to increase the heat dissipation area of the radio frequency board on the support base mounted on the housing of the communication electronic equipment, radio frequency board The purpose is to provide a radio frequency board heat dissipation device for communication electronic equipment that can maximize their heat dissipation performance.
도 1은 종래 기술에 따른 통신전자장비에 무선주파수보드 방열장치가 장착된 상태를 도시한 단면도,1 is a cross-sectional view showing a state in which a radio frequency board heat dissipation device is mounted in communication electronic equipment according to the prior art;
도 2는 본 고안에 따른 통신전자장비에 무선주파수보드 방열장치가 장착된 상태를 도시한 사시도이다.2 is a perspective view illustrating a state in which a radio frequency board heat dissipation device is mounted in communication electronic equipment according to the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
100 : 함체 110 : 무선주파수보드100: enclosure 110: radio frequency board
120 : 지지베이스120: support base
10 : 히트싱크 11,12 : 요철면10: heat sink 11,12: uneven surface
이하, 본 고안에 따른 실시예를 첨부된 예시도면을 참조로하여 상세하게 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings illustrating an embodiment according to the present invention in detail as follows.
도 2는 본 고안에 따른 통신전자장비에 무선주파수보드 방열장치가 장착된 상태를 도시한 사시도로서, 통신전자장비의 몸체를 이루는 함체(100)에 안테나로부터 송신된 무선주파수신호를 전송받기 위한 무선주파수보드(110)가 내장설치된 구조로 이루어진 통신전자장비의 무선주파수보드 방열장치에 있어서,Figure 2 is a perspective view showing a state in which the radio frequency board heat dissipation device is mounted on the communication electronic equipment according to the present invention, the radio for receiving the radio frequency signal transmitted from the antenna to the housing 100 forming the body of the communication electronic equipment In the radio frequency board heat dissipation device of communication electronic equipment consisting of a structure in which the frequency board 110 is installed,
함체(100)의 상하부에 무선주파수보드(110)로부터 발생된 열과의 접촉면적을 증대시키기 위한 요철면(11,12)이 연속적으로 구비된 히트싱크(10)가 장착된 구조로 되어 있다.Upper and lower portions of the enclosure 100 are provided with heat sinks 10 having continuous concave-convex surfaces 11 and 12 for increasing the contact area with heat generated from the radio frequency board 110.
여기서, 통신전자장비에 뼈대를 이룸과 동시에 일정크기의 수용공간을 갖는 다수개의 함체(110)가 장착되며, 함체(110)의 수용공간에 무선주파수보드 고정용 지지베이스(120)가 고정설치되고, 지지베이스(120)에 스크류와 같은 체결수단을 매개로 안테나를 통해 무선주파수를 송수신받기 위한 무선주파수보드(110)이 장착되어 있다.Here, a plurality of housings 110 having a receiving space of a certain size at the same time as the skeleton to the communication electronic equipment is mounted, the support base 120 for fixing the radio frequency board fixed to the receiving space of the housing 110 is installed On the support base 120, a radio frequency board 110 is mounted to receive and transmit radio frequency through an antenna through a fastening means such as a screw.
물론, 지지베이스(120)의 몸체 상하면에 무선주파수보드(110)의 열을 방열시키기 위한 히트싱크(10)가 장착되되, 히트싱크(10)에는 무선주파수보드(110)로부터 발생된 열과의 접촉면적을 극대화시키기 위한 요철면(11,12)이 연속적으로 형성되어 있다.Of course, the heat sink 10 for radiating heat of the radio frequency board 110 is mounted on the upper and lower surfaces of the body of the support base 120, the heat sink 10 is in contact with the heat generated from the radio frequency board 110 Concave-convex surfaces 11 and 12 are formed continuously to maximize the area.
이하, 본 고안에 따른 작용을 첨부된 예시도면을 참조로하여 상세하게 설명하면 다음과 같다.Hereinafter, described in detail with reference to the accompanying drawings illustrating the operation according to the present invention.
먼저, 통신전자장비의 몸체를 이루는 함체(100)의 수용공간에 플레이트형상의 지지베이스(120)를 장착한 후에, 지지베이스(120)의 몸체 상면에 무선주파수보드(110)을 맞댄 상태에서 스크류와 같은 체결수단으로 고정한다.First, after mounting the plate-shaped support base 120 in the receiving space of the housing 100 constituting the body of the communication electronic equipment, the screw on the radio frequency board 110 on the upper surface of the body of the support base 120 Secure with fastening means such as
물론, 함체(100)의 몸체 상하부에는 다수개의 요철면(11,12)이 연속적으로 형성된 히트싱크(10)가 장착된 상태이다.Of course, the heat sink 10 in which a plurality of uneven surfaces 11 and 12 are continuously formed is mounted on upper and lower parts of the enclosure 100.
즉, 함체(100)의 지지베이스(120)의 상면에 무선주파수보드(110)가 고정된 상태에서, 무선주파수보드(110)의 상하부면에 히트싱크(10)가 위치하고 있는 상태이다.That is, in the state where the radio frequency board 110 is fixed to the upper surface of the support base 120 of the housing 100, the heat sink 10 is located on the upper and lower surfaces of the radio frequency board 110.
만일, 통신전자장비를 가동하는 도중에 무선주파수보드(110)로부터 열이 발생되는 경우, 무선주파수보드(110)에서 발생된 열은 히트싱크(10)를 이루는 요철면(11,12)을 통해 냉각되면서 외부로 방출되는 것이다.If heat is generated from the radio frequency board 110 during the operation of the communication electronic equipment, the heat generated from the radio frequency board 110 is cooled through the uneven surfaces 11 and 12 forming the heat sink 10. As it is emitted to the outside.
즉, 무선주파수보드(110)에서 발생된 열이 히트싱크(10)를 통해 외부로 신속하게 배출되므로, 무선주파수보드가 항상 적정온도로 유지되는 것이다.That is, since the heat generated from the radio frequency board 110 is quickly discharged to the outside through the heat sink 10, the radio frequency board is always maintained at an appropriate temperature.
이상에서 설명한 바와 같이 본 고안에 따른 통신전자장비의 무선주파수보드 방열장치에 의하면, 통신전자장비의 지지베이스에 무선주파수보드의 방열면적을 극대화시키기 위한 히트싱크를 설치하여, 무선주파수보드로부터 발생된 열을 외부로 원활하게 배출시키게 되므로, 무선주파수보드들의 수명이 연장되는 효과가 있다.As described above, according to the radio frequency board heat dissipation device of the communication electronic device according to the present invention, a heat sink for maximizing the heat dissipation area of the radio frequency board is installed on the support base of the communication electronic device, Since the heat is smoothly discharged to the outside, there is an effect of extending the life of the radio frequency boards.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-1999-0003546U KR200345361Y1 (en) | 1999-03-06 | 1999-03-06 | Device for cooling the radio frequency board of communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-1999-0003546U KR200345361Y1 (en) | 1999-03-06 | 1999-03-06 | Device for cooling the radio frequency board of communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000017865U true KR20000017865U (en) | 2000-10-05 |
| KR200345361Y1 KR200345361Y1 (en) | 2004-03-19 |
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ID=49344463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20-1999-0003546U KR200345361Y1 (en) | 1999-03-06 | 1999-03-06 | Device for cooling the radio frequency board of communication equipment |
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| Country | Link |
|---|---|
| KR (1) | KR200345361Y1 (en) |
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1999
- 1999-03-06 KR KR20-1999-0003546U patent/KR200345361Y1/en not_active IP Right Cessation
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| KR200345361Y1 (en) | 2004-03-19 |
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