KR20000000118U - Heat dissipation and heating device for communication equipment enclosure - Google Patents

Abstract

Disclosed is a heat dissipation and heating device for a communication equipment enclosure. The heat dissipation device is a communication equipment enclosure in which a plurality of PCBs and devices are mounted, and includes an outer air passage formed in the left and right side walls, the left and right side walls of the triple manufactured enclosure, the inner air passage formed in the left and right side walls, and the outside air, respectively. A top shelf fan operated to flow only from the bottom of the enclosure to the top through the outer air passage, and a system shelf top fan operated to flow only from the top of the enclosure to the bottom through the inner air passage. In addition, the heat generating device has a triple left and right side wall, and is a communication equipment enclosure in which a plurality of PCBs and devices are mounted.The heat generating plate is arranged at the bottom of a heat exchanger plate and a heat exchanger plate at regular intervals surrounding the system shelf and the system shelf. And a heater for protecting the devices.

Description

Heat dissipation and heating device for communication equipment enclosure

The present invention relates to a heat dissipation and heat generating device for a communication equipment enclosure. In particular, the communication equipment is equipped with a triple wall cooling system that provides stable heat dissipation in relatively low power consumption systems by using a new heat dissipation convection structure using only the fan and the fan itself. It is about enclosure.

1 is a front view of a conventional communication equipment enclosure. Referring to the conventional communication equipment enclosure with reference to this, the conventional housing is the upper shelf 70 and the lower shelf 80, on which the various printed circuit board (PCB), the unit (Unit) is mounted, the air heated in the shelf An internal blower (Fan: 60) for convection, a cooling air flow passage 10 through which the air for cooling the heated air flows, an air intake unit 20 located on the side of the housing receiving the cooling air, and the cooling Air outlet 30 located on the enclosure roof for discharging the heated air to the outside after the air is cooled, the external blower 40 for quickly moving the heated air and the enclosure roof (50) to protect the enclosure from rain ) Is made.

The cooling process of the enclosure is described with reference to FIG. 1. The air warmed by various PCBs and devices mounted on the upper and lower shelves 70 and 80 is convection by an internal blower 60 existing inside the enclosure. do. The convective warmed air is cooled through a heat exchange plate between the shelves 70, 80 and the air flow passage 10. At this time, the air for cooling the warmed air is supplied from the outside through the air inlet 20 is present at the bottom of the enclosure.

When the hot air of the shelf and the cold air of the outside are heat exchanged through the heat exchange plate, forced air convection caused by the blower causes the shelf air to go down, and the outside air goes up. At this time, if the blowers 60, 40 are attached to the shelf and the enclosure roof, rapid cooling and convection occur.

2 is a right side view of another conventional communication equipment enclosure and FIG. 3 is a right side view of a mass communication equipment enclosure. Referring to the configuration of another conventional housing with reference to this, the conventional housing 150 is a variety of communication PCB, device (190, 200) mounted on the upper, middle, lower shelf (200, 210, 180), the more coming out of the device Blower 120 for drawing the warmed air to the cooling device 110, the heat dissipation pipe 130 constituting the cooling device 110 for cooling the warmed air, the outside of the cold air to the heat dissipation pipe 130 It is provided with a rear door 140 to attract, the support 160 supporting the enclosure, the front door 170 and the enclosure roof 100 to protect the enclosure from snow and rain.

In addition, a large-capacity enclosure applied to a system with high power consumption as shown in FIG. 3 is one additional upper cooling unit 230 attached to the roof 240 of the general enclosure, and the heat radiation principle of the cooling unit is applied to the general enclosure. It is identical to the principle of the cooling device used.

Referring to FIG. 2, the enclosure 150 includes a plurality of shelves 220, 210, and 180 that are mounted up and down successively, and the PCBs and devices 190 and 200 are left and right inside the shelf. Many are mounted side by side. The cooling device 110 is mounted on the rear door 140 of the enclosure such that heat inside the enclosure is transferred to the exterior of the enclosure as shown in FIG. 2.

The air flow and the heat dissipation structure are heat exchanged inside and outside the enclosure by a heat dissipation pipe 130 assembled inside the cooling device 110. The heat generated from each PCB and the devices 190 and 200 is cooled by the cooling device 110. Blown by the blower 120 attached to the flow proceeds in the direction of the arrow. The heat passing through the heat dissipation pipe 130 inside the cooling apparatus 110 is cooled by the external low temperature air flow and continues to move to the lower end of the enclosure. In addition, the air flow is circulated while the air is continuously blown by the blower 120 inside the cooling apparatus 110, and thus heat exchange is performed with the outside of the enclosure.

However, the enclosure uses a cooling device usually an air conditioner (heat conditioner) or a heat exchanger, the air conditioner has a problem in reliability and durability, the air conditioner itself is heavy and expensive, complicated structure and after-service (After-Service) In terms of costs, too much is incurred. The heat exchanger has a problem that reliability and durability are somewhat improved compared to the air conditioner, but are still heavy, complicated in structure, and expensive.

Therefore, to solve the above problems, the present invention is equipped with a triple wall cooling device, which improves the reliability, durability, manufacturing cost of the cooling device, the weight of the cooling device, and the ease of after-sales service. The purpose is to provide.

Another object of the present invention is to realize a new heat dissipation convection structure using only the blower and the wall of the enclosure itself in which the PCB and the device are mounted, and the communication equipment with the triple wall cooling device that provides stable heat dissipation in a system that consumes relatively low power. To provide the enclosure.

Other objects and advantages of the present invention will become more apparent upon reading the following detailed description of the invention and referring to the drawings below.

1 is a front view of a conventional communication equipment enclosure.

2 is a right side view of another conventional communication equipment enclosure.

3 is a right side view of a conventional mass communication equipment enclosure.

4 is a front view of a communication equipment enclosure according to the present invention.

5 is a right side view of the communication equipment housing according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10: cooling air flow passage 20: air intake

30: air outlet 40: external blower

50: enclosure roof 60: internal blower

70: upper shelf 80: lower shelf

100: enclosure roof 110: cooling device

120: blower 130: heat dissipation pipe

140: rear door 150: enclosure

160: base 170: front door

180: lower shelf 190: PCB, device

200: PCB, device 210: suspended shelf

220: upper shelf 230: upper cooling unit

240: enclosure roof 310: enclosure lid

320: Leak prevention rubber, silicone 330: Shelf blower

340: Blower for outer discharge part 360: Leak prevention rubber, silicone

370: enclosure roof 390: leak-proof rubber, silicone

400: inside air passage 410: outside air passage

420: heat exchanger plate 430: heat generator

440: dividing wall 450: enclosure

460: PCB, device 470: support

480: Lower shelf 490: System shelf

500: heat exchange plate 510: outside air passage

520: internal air passage 530: leak-proof rubber, silicone

540: outer discharge portion 550: jaw for rain

560: jaw for rainproof 570: outer discharge part

580: Tailgate 590: Blower

600: front door

In order to achieve the above object, a preferred embodiment of the heat dissipation device for a communication equipment enclosure according to the present invention, in the communication equipment enclosure is equipped with a plurality of PCBs and devices,

Left and right side walls of the enclosure made of triple;

Outer air passages respectively formed in the left and right side walls;

Inner air passages formed in the left and right side walls, respectively;

An upper part fan which operates so that external air flows only from the lower end of the enclosure to the upper end through the outer air passage; And

And a system shelf upper end fan which operates so that the inner air of the enclosure flows only from the upper end to the lower end through the inner air passage.

In this embodiment, it is preferable to seal between the enclosure, the enclosure loop and the outer top to prevent air leakage,

A heat exchange plate surrounding the system shelf at regular intervals for cooling the air exiting the shelf outlet;

An outer air passage, through which air for cooling the heat exchange plate flows from below;

An outer discharge part for discharging the warmed air upward through the outer air passage; And

It is preferable to further include a roof through which the air of the outer discharge portion escapes,

The heat exchange plate is preferably isolated from the outside to protect the PCB and devices from the external environment,

The shelf discharge portion, preferably provided with a blower for the rapid flow of air,

Outside air is preferably introduced into the outer air passage,

The outer exhaust portion is preferably provided with a blower for the rapid flow of air,

The roof is preferably installed on the front and rear surfaces of the enclosure so that air escapes and water does not enter,

The roof is preferably sealed with a sealant such as rubber or silicone on the left and right sides of the enclosure to prevent leakage.

Lower shelf for mounting PCB and devices having a strong structure in the external environment while consuming high power;

An air inlet unit for introducing air from outside of the lower shelf; And

It is preferable to further include an air discharge unit for discharging the introduced air to the outside,

The lower shelf is preferably provided with a partition wall at the upper end of the lower shelf to prevent heat from being transferred to the system shelf,

The air inlet is preferably provided with a blower for the rapid flow of air.

In a preferred embodiment of the heating device for a communication equipment enclosure according to the present invention for achieving the above another object, the left and right side wall is made of a triple, in a communication equipment enclosure equipped with a plurality of PCBs and devices,

System shelves;

A heat exchange plate surrounding the system shelf at regular intervals; And

At the bottom of the heat exchanger plate, a heat generator is provided to protect the PCB and the devices during cold weather.

In the present embodiment, it is preferable that the heat generator is formed in a plate shape in order to widen the heat generating area and minimize the installation height.

In the following description, with reference to the accompanying drawings, a communication equipment enclosure having a triple wall cooling apparatus according to a preferred embodiment of the present invention, many specific details such as the structure and function of the triple wall to provide a more comprehensive understanding of the present invention Is shown. However, it will be apparent to those skilled in the art that the present invention can be sufficiently carried out by the technical spirit of the present invention without these detailed items.

In addition, features and functions of well-known communication equipment enclosures are not described in detail in order not to obscure the present invention, and the same terms are used in English initials or Korean interpretation terms for convenience of explanation and understanding.

Figure 4 is a front view of the communication equipment enclosure according to the present invention, Figure 5 is a right side view thereof. Referring to the configuration of the present invention with reference to the drawings, the communication equipment housing 450 having a triple wall cooling apparatus according to the present invention,

System Shelf (490) for mounting PCBs and devices that are sensitive to the external environment, a Shelf Blower (Fan: 330) for blowing hot air from the system shelf to the shelf outlet, and the internal air passages (400, 520) Heat exchange plates 420 and 500 at regular intervals surrounding the system shelf 490 to cool the hot air, external air passages 410 and 510 through which external air passes to cool the hot air, and the outside air. Plinth: 470 is provided with a passage through which the passage is introduced, the outer exhaust fan 340 for blowing the outside air warmed by heat exchange with the internal air on the roof; Outer discharge parts 540 and 570 for discharging the warmed outside air to the outside, a housing lid 310 to cover the upper end of the housing 450, a housing roof 370 to protect the enclosure from snow and rain, and the enclosure Sealing materials 320, 360, 390, 530 such as rainproof jaws (550, 560) present in the lid 370 for preventing the ingress of snow and rain leaking to the roof, rubber / silicone sealing the raincoat, Heater 430 to protect PCBs and devices in cold weather, lower shelf 480 for mounting PCBs and devices 460 that are highly resistant to the external environment, and lower PCBs and devices mounted on the lower shelf Enclosure rear door 580 into which the outside air enters, a blower 590 to increase the cooling efficiency by increasing the flow of the external air, and an enclosure front door 600 and the lower shelf where the air cooled by the lower shelf 480 exits. 480 and a partition wall 440 which prevents heat exchange between the system shelf and the shelf. Achieved.

Referring to FIGS. 4 and 5, the operation of a communication equipment enclosure having a triple wall cooling apparatus according to the present invention is constructed by triple-walling the left and right sides of the enclosure to provide two air flow passages (400, 410, 510). , 520 are formed on the left and right sides, respectively. Here, the outside air passages 410 and 510 flow the outside air only from the bottom of the enclosure to the top by the outer exhaust blower 340, and the inside air passages 400 and 520 are for the shelf discharge portion mounted directly above the system shelf 490. The fan 330 is designed such that the air inside the enclosure flows from the upper end of the enclosure to the lower direction. In this design, the heat exchange efficiency of the heat exchange plates 420 and 500 on the left and right sides of the enclosure can be increased.

In addition, the triple-wall structure and the enclosure roof 370 and the enclosure 450 and the rainproof jaws 550 and 560 are sealed with a sealant such as rubber or silicone to seal the external air flow passages 410 and 510 and the seal structure. Equipped. In addition, in order to prevent water from flowing into the roof through the outer discharge portion (540, 570) in order to enhance the rainproof rainproof jaw (550, 560) is installed on the front and rear surfaces of the enclosure and sealed.

In addition, the heater 430 may be installed under the internal air inlet of the lower end of the system shelf 490 to prepare for the case where the system needs heat in an emergency. At this time, the heat generator uses a plate-shaped heat generator 430 to widen the heating area and minimize the installation height.

As shown in FIG. 5, external air introduced from the base of the enclosure is discharged through the outer discharge parts 540 and 570 of the roof 370 along the left and right passages 410 and 510.

In addition, the plate-type heater 430 has a partition wall 440 to block the heat transfer to the lower shelf under the enclosure.

Here, the PCB and the device mounted on the lower shelf have a strong structure in the external environment while consuming high power, and directly blows outside air from the rear door 580 to the front door 600 through a blower mounted on the lower shelf, thereby generating a heating device ( 460 directly cool.

In the above description, the present invention has been described and limited by way of example with reference to the drawings. However, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the technical spirit of the present invention. will be. For example, it may be possible to increase the contact surface by increasing the contact surface by pleating the heat exchange plate instead of the flat surface to increase the cooling efficiency.

Accordingly, the present invention should not be construed as limited to the specific forms mentioned in the specification, but rather the invention as defined by the appended claims, including all modifications, equivalents, and modifications within the spirit and scope of the invention. It should be understood to include substitutes.

The present invention operating as described above has high heat exchange efficiency in the heat exchanger plate because heat exchange is performed in the thin heat exchanger plate while the inner and outer air flows in the opposite directions from the left and right sides of the enclosure.

Another effect of the present invention is to cool the enclosure using only the internal and external blowers, so that the reliability of the cooling is increased by a simple cooling device structure, the after-sales service is easy, and a separate heat exchange device is not attached, thereby reducing the cost of the cooling device. It is possible to reduce the weight of the cooling device.

Yet another effect of the present invention is to maximize the use efficiency of the blower by sealing the internal and external air flow passage in the triple-wall structure, it is possible to excellent rain even rain.

Another effect of the present invention is to adopt a plate-type heat generator for warming the system, it is not necessary to greatly increase the height of the enclosure, less air flow resistance, less risk of fire or burn than the coil-type heater.

Claims (14)

In a telecommunications enclosure containing multiple PCBs and devices, Left and right side walls of the enclosure made of triple; Outer air passages respectively formed in the left and right side walls; Inner air passages formed in the left and right side walls, respectively; An upper part fan which operates so that external air flows only from the lower end of the enclosure to the upper end through the outer air passage; And And a system shelf upper end fan operable to allow the interior air of the enclosure to flow only from the top to the bottom of the enclosure through the inner air passages. The heat dissipation device according to claim 1, wherein a seal is sealed between the enclosure, the enclosure loop, and the outer top plate to prevent air leakage. The method of claim 1, A shelf discharge part for discharging hot air of the system shelf upward; A heat exchange plate surrounding the system shelf at regular intervals for cooling the air exiting the shelf outlet; An outer air passage, through which air for cooling the heat exchange plate flows from below; An outer discharge part for discharging the warmed air upward through the outer air passage; And And a roof through which the air of the outer discharge portion escapes. 4. The heat sink of claim 3, wherein the heat exchange plate is isolated from the outside to protect the PCB and the devices from the external environment. The heat dissipation device according to claim 3, wherein the shelf discharge part is provided with a blower for rapid flow of air. The heat shield of claim 1, wherein external air flows into the outer air passage. 4. The heat dissipation device according to claim 3, wherein the outer discharge part has a blower for rapid flow of air. 4. The heat dissipation device according to claim 3, wherein rainproof jaws are installed on the front and rear sides of the enclosure such that air escapes and water cannot enter the roof. The heat dissipation device according to claim 8, wherein the roof is sealed with a sealant such as rubber or silicon on the left and right sides of the enclosure to prevent leakage. The method of claim 1, Lower shelf for mounting PCB and devices having a strong structure in the external environment while consuming high power; An air inlet unit for introducing air from outside of the lower shelf; And And an air discharge unit for discharging the introduced air to the outside. The heat dissipation device according to claim 10, wherein the lower shelf has a partition wall at an upper end of the lower shelf to prevent heat from being transferred to the system shelf. 11. A communication equipment enclosure according to claim 10, wherein said air inlet comprises a blower for rapid flow of air. Heat dissipation device for communication equipment enclosures. In the communication equipment enclosure in which the left and right side walls are tripled and a plurality of PCBs and devices are mounted, System shelves; A heat exchange plate surrounding the system shelf at regular intervals; And Underneath the heat exchange plate, a heating device for a communication equipment housing having a heating device for protecting the PCB and the device in cold weather. The heating device according to claim 13, wherein the heat generator is formed in a plate shape in order to widen the heating area and minimize the installation height.