KR102653197B1 - Probe installaition system, probe unit and test apparatus for electirical characteristics - Google Patents

Abstract

A probe installation system, a probe unit, and an electrical properties inspection device are disclosed. A probe installation system according to an aspect of the present invention includes an upper substrate and a lower substrate, first to fourth probes respectively coupled to the upper substrate and protruding from one side of the upper substrate, and installed between the upper substrate and the lower substrate to It includes an elastic part that elastically moves the lower substrate, and a flexible connection part that electrically connects each of the first to fourth probes with the lower substrate.

Description

Probe installation system, probe unit and electrical properties inspection device {PROBE INSTALLAITION SYSTEM, PROBE UNIT AND TEST APPARATUS FOR ELECTIRICAL CHARACTERISTICS}

The present invention relates to a probe installation system, a probe unit, and an electrical properties inspection device.

Electronic devices such as MLCC are mainly selected by measuring and evaluating capacitance (C), loss (Dissipation Factor (DF)), and insulation resistance (IR).

Conventionally, the equivalent series resistance (ESR) of electronic devices is an item that has not been measured separately.

However, as the capacity and operating frequency of electronic devices increase, the equivalent series resistance (ESR) of electronic devices and the deviation of its value have reached a level that cannot be ignored.

Accordingly, the demand for accurately measuring the equivalent series resistance (ESR) of electronic devices is increasing.

Japanese Patent Publication No. 2002-131332 (published on May 9, 2002)

According to an embodiment of the present invention, an ESR measurement unit can be provided that can accurately measure the equivalent series resistance (ESR) of an electronic device at high frequencies by eliminating various errors.

1 is a perspective view showing a probe installation system according to an embodiment of the present invention.
Figure 2 is a cross-sectional view taken along line A-A' of Figure 1.
Figure 3 is a diagram showing a probe unit according to an embodiment of the present invention.
Figure 4 is a diagram showing the interior of Figure 3.
Figure 5 is a diagram showing an electrical characteristics inspection device according to an embodiment of the present invention.
Figure 6 is a diagram showing an equivalent circuit of an MLCC.
Figure 7 is a diagram showing the frequency dependence of the equivalent series resistance of the MLCC.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof. And, throughout the specification, “on” means located above or below the object part, and does not necessarily mean located above the direction of gravity.

In addition, bonding does not mean only the case where there is direct physical contact between each component, in the contact relationship between each component, but also when another component is interposed between each component, and the component is in that other component. It should be used as a concept that encompasses even the cases where each is in contact.

In addition, if there is a need to distinguish between plural components, a modifier such as 'first' will be added, and if there is no need to distinguish between them, they will be referred to collectively. For example, the probes to be described later are composed of a plurality of probes. When there is a need to distinguish a plurality of probes from each other, they are called a first probe, a second probe, a third probe, and a fourth probe, and there is no need to distinguish them from each other. In this case, it is collectively referred to as a probe.

Since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, the present invention is not necessarily limited to what is shown.

Hereinafter, embodiments of the probe unit, the probe unit, and the electrical property inspection device according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, identical or corresponding components are denoted by the same drawing numbers. will be given and any redundant explanation will be omitted.

probe installation system

Figure 1 is a perspective view showing a probe installation system according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line A-A' of FIG. 1. Figure 6 is a diagram showing the equivalent circuit of an MLCC. Figure 7 is a diagram showing the frequency dependence of the equivalent series resistance of the MLCC.

1 and 2, the probe installation system 100 according to an embodiment of the present invention includes probes 11, 12, 13, and 14, an upper substrate 20, a lower substrate 30, and an elastic portion ( 40) and a flexible connection portion 50, and further includes an insertion portion 60.

Each of the probes 11, 12, 13, and 14 contacts a terminal of the electronic device. Here, the first probe 11 and the second probe 12 are probes for measuring current, and the third probe 13 and fourth probe 14 are probes for measuring voltage. That is, in the case of the probe installation system according to this embodiment, the current and voltage of the electronic device are measured using four terminals, that is, the first to fourth probes 11, 12, 13, and 14, respectively.

Referring to Figure 6, the equivalent series resistance (ESR) of a multi-layered ceramic capacitor (MLCC) is the resistance component R _d due to the dielectric material constituting the MLCC and the resistance component R due to the conductive material constituting the MLCC. It can be expressed as a combination of _e . Referring to FIG. 7, the equivalent series resistance (ESR) of the MLCC is greatly affected by R _d at low frequencies, but as the frequency increases, it is greatly affected by R _e . In practice, the R _e component includes not only the resistance of the conductor material constituting the MLCC, but also the self-resistance and contact resistance of the conductor of the measurement system. Therefore, in order to accurately measure the equivalent series resistance (ESR) of an MLCC at high frequencies, the conductor resistance and contact resistance of the measurement system must be minimized. Reference symbols R _p , C , and L _s shown in FIG. 6 represent the insulation resistance, capacitance, and inductance components of the MLCC, respectively.

When measuring the equivalent series resistance (ESR) of electronic devices, the two-terminal method of simultaneously measuring voltage and voltage using two probes cannot exclude the resistance of the conductor itself and contact resistance from the measured values. Therefore, the two-terminal method is not a problem in the low frequency range, but it cannot accurately measure the equivalent series resistance of electronic devices in the high frequency range.

The probe installation system 100 according to this embodiment uses the four-terminal method to minimize factors caused by the resistance of the conductor itself and contact resistance. That is, in this embodiment, the current is measured using two current measurement probes, the first probe 11 and the second probe 12, and the two voltage measurement probes, the third probe 13 and the fourth probe. Measure the voltage using (14).

Probes 11, 12, 13, 14 are made of conductive material. Specifically, the probes 11, 12, 13, and 14 may be formed of copper (Cu) or an alloy containing copper, but are not limited thereto, and the probes 11, 12, 13, and 14 may be formed according to design needs. Accordingly, materials other than copper may be included to ensure appropriate ductility and rigidity.

The upper substrate 20 is coupled to the probes 11, 12, 13, and 14. That is, the upper substrate 20 is a member that fixes and supports the probe. The probes 11, 12, 13, and 14 are coupled to the upper substrate 20, and one end of the probes 11, 12, 13, and 14 that contacts the terminal of the electronic device protrudes from the upper substrate 20. The other ends of the probes 11, 12, 13, and 14 coupled to the upper substrate 20 are connected to flexible connectors, which will be described later, and are electrically connected to the lower substrate, which will be described later.

First terminals T1-1 and T1-2 and second terminals T2-1 and T2-2 are formed on the lower substrate 30. The first terminals (T1-1, T1-2) electrically connect the probes 11, 12, 13, 14 and the lower substrate 30, and the second terminals (T2-1, T2-2) are connected to the lower substrate. (30) and the flexible cable to be described later are electrically connected. Accordingly, like the probes 11, 12, 13, and 14, each of the first terminals T1-1 and T1-2 and the second terminals T2-1 and T2-2 is formed in four pieces.

The upper substrate 20 and lower substrate 30 may be ordinary printed circuit boards. The first terminals T1-1 and T1-2 and the second terminals T2-1 and T2-2 may be formed on the lower substrate 30 through a typical circuit pattern forming process. For example, the first terminal (T1-1, T1-2) and the second terminal (T2-1, T2-2) are each formed by one of the subtractive method, full-additive method, semi-additive method, or modified additive method. It can be.

Meanwhile, the shapes of the upper substrate 20 and lower substrate 30 shown in FIG. 1 are merely exemplary, and the shapes of the upper substrate 20 and lower substrate 30 may be modified in various ways as needed. . For example, the upper substrate 20 and the lower substrate 30 may be circular in shape.

The elastic portion 40 is installed between the upper substrate 20 and the lower substrate 30 and elastically moves the upper substrate 20 and the lower substrate 40. That is, the elastic part 40 separates the upper substrate 20 and the lower substrate 30 and elastically changes the separation distance between the upper substrate 20 and the lower substrate 30. The elastic portion 40 may be a spring, but is not limited thereto.

The elastic portion 40 may be formed in plural pieces. Preferably, as shown in FIG. 1, the plurality of elastic parts 40 may be formed in total of four and disposed at the corners of the square-shaped upper substrate 20 and lower substrate 30, respectively. However, it is not limited to the above-described example.

Depending on the shape of the terminal surface of the electronic device and/or the degree of wear of each of the first to fourth probes (11, 12, 13, and 14), each of the first to fourth probes (11, 12, 13, and 14) is in contact with each other. The pressures may be different. For example, if the degree of wear of one end of the first probe 11 is minor compared to the degree of wear of one end of the second to third probes 12, 13, and 14, even if the terminal surface of the electronic device is flat, the first probe 11 and Contact pressure between the second to fourth probes 12, 13, and 14 may be different. The elastic portion 40 can resolve uneven contact pressure that occurs between the probes 11, 12, 13, and 14. That is, the elastic portion 40 of the probes 11, 12, 13, and 14 on the side where the contact pressure is relatively high may be compressed, and the elastic portion 40 on the side where the contact pressure is relatively low may be tensioned.

Installation grooves G1 and G2 in which the elastic portion 40 is installed are formed in each of the upper substrate 20 and the lower substrate 30. As shown in FIG. 2, installation grooves G1 and G2 are formed on surfaces where the upper substrate 20 and the lower substrate 30 face each other. The installation groove G1 of the upper substrate 20 and the installation groove G2 of the lower substrate 30 are formed at positions corresponding to each other. One end of the elastic portion 40 is received in the installation groove G1 of the upper substrate 20, and the other end of the elastic portion 40 is accommodated in the installation groove G2 of the lower substrate 30.

When the elastic portion 40 is formed in plurality, the installation grooves G1 and G2 are also formed in plurality. The installation grooves G1 and G2 may have various shapes. The inner diameter of the installation grooves (G1, G2) may be equal to or larger than the outer diameter of each end of the elastic portion (40).

The flexible connection portion 50 is coupled to the upper substrate 20 and the lower substrate 30 and electrically connects each of the probes 11, 12, 13, and 14 to the lower substrate 30. The first probe 11 is electrically connected to the first terminal T1-1 of the lower substrate 30 by a flexible connection portion 50. The second probe 12 is electrically connected to the first terminal T1-2 of the lower substrate 30 by a flexible connection portion 50. Although not shown in FIG. 2, the third and fourth probes 13 and 14 are also the same.

The flexible connection portion 50 is curved to maintain the electrical connection between the probes 11, 12, 13, and 14 and the lower substrate 30 even if the separation distance between the upper substrate 20 and the lower substrate 30 changes. It can be formed into a shape. That is, the flexible connection portion 50 is formed to have a length greater than the maximum separation distance between the upper substrate 20 and the lower substrate 30 and is flexible, so it can be curved.

The flexible connection portion 50 may be either a flexible substrate or metal foil on which a circuit pattern is formed. The metal foil may include copper, but is not limited thereto.

At least a portion of the probe coupling portions 61, 62, 63, and 64 is embedded in the upper substrate 20, and each of the probes 11, 12, 13, and 14 is detachably coupled therein. The probe coupling portions 61, 62, 63, and 64 detachably couple the probes 61, 62, 63, and 64 to the upper substrate 20. The outer peripheral surfaces (11, 12, 13, 14) of the probe are coupled to the inner peripheral surfaces of the probe coupling portions (61, 62, 63, and 64). The coupling structure of the probe coupling portions 61, 62, 63, and 64 and the probes 11, 12, 13, and 14 can be variously changed, such as screw coupling or fitting coupling. The probe coupling portions 61, 62, 63, and 64 facilitate replacement of the probes 11, 12, 13, and 14, respectively.

A ground pattern (GP) surrounding the probe coupling portions 61, 62, 63, and 64 may be formed on the upper substrate 20. The probe coupling portions 61, 62, 63, and 64 are formed of an insulator (IM) whose inner peripheral surface is coupled to the probes (11, 12, 13, and 14) and a conductor layer (CM) surrounding the outer peripheral surface of the insulator (IM). It can be. The ground pattern (GP) forms a common reference potential between the probes (11, 12, 13, and 14) by electrically connecting the conductor layers (CM) to each other.

probe Unit and electrical characteristics inspection device

Figure 3 is a diagram showing a probe unit according to an embodiment of the present invention. FIG. 4 is a diagram showing the interior of FIG. 3. Figure 5 is a diagram showing an electrical characteristics inspection device according to an embodiment of the present invention.

Referring to Figures 3 and 4, the probe unit 1000 according to an embodiment of the present invention includes a probe installation system 100, a support part 200, a coaxial cable (310, 320, 330, 340), and a flexible cable. (410, 420, 430, 440) and a shielding case (500).

Since the probe installation system 100 applied to the probe unit 1000 according to this embodiment has been described above, a detailed description will be provided.

The support portion 200 is configured to support a coaxial cable, which will be described later. The shape of the support portion 200 shown in FIG. 1 is exemplary and may be formed in a shape including a polygonal column rather than a cylinder.

The support portion 200 may be formed of various materials according to design needs as long as it satisfies the rigidity required for the probe unit 1000 according to this embodiment. For example, it may be made of a metal material, but is not limited thereto and may be made of ceramics, polymer materials, and/or composite materials.

The coaxial cables 310, 320, 330, and 340 each include a signal line and a ground line, and are each coupled to the support portion 200 to connect the probe installation system 100 and the probes 11, 12, and 13 through a flexible cable to be described later. , 14) is electrically connected to. The ground lines of the coaxial cables 310, 320, 330, and 340 can be electrically connected to each other to match the reference potential.

Flexible cables (410, 420, 430, and 440) connect the probe installation system 100 and the signal lines of the coaxial cables (310, 320, 330, and 340), respectively. Specifically, the first flexible cable 410 connects the first probe 11 of the probe installation system 100 and the signal line of the first coaxial cable 310. The flexible cables 410, 420, 430, and 440 may distribute contact pressure between the probe installation system 100 and the electronic device.

Flexible cables 410, 420, 430, and 440 may be rigid flexible cables. In the case of the rigid flexible cable, since it has both a certain rigidity and a certain elasticity, it can support the probe installation system 100 and distribute the contact pressure between the probes 11, 12, 13, and 14 and the electronic device.

The shielding case 500 has an opening exposing one end of each of the probes 11, 12, 13, and 14, and includes a probe installation system 100, a support unit 200, and first to fourth coaxial cables 310 and 320. , 330, 340) and the first to fourth flexible cables 410, 420, 430, 440. The shielding case 500 protects the probe unit 1000 according to this embodiment from external shock and blocks external noise.

The shielding case 500 may include aluminum, but is not limited thereto, and can be used as a shielding case as long as it has rigidity and external noise blocking characteristics above a certain level.

The opening formed in the shielding case 500 exposes one end of each of the probes 11, 12, 13, and 14 to the outside of the shielding case 500. Each of the probes 11, 12, 13, and 14 may contact the electronic device through the opening. Each of the probes 11, 12, 13, and 14 may be replaced through the opening depending on the shape and size of the electronic device or the degree of wear of the probes 11, 12, 13, and 14.

The connector 210 is coupled to the support portion 200 and connects the external measurement equipment (OS in FIG. 5) and the first to fourth coaxial cables 310, 320, 330, and 340. The connector 210 may be formed in plural and connected to each of the first to fourth coaxial cables 310, 320, 330, and 340. External measurement equipment (OS in FIG. 5) such as an oscilloscope may be coupled to the connector 210.

Referring to FIG. 5, an electrical characteristics inspection device 3000 according to an embodiment of the present invention includes a probe unit and a main body. Since the probe unit 1000 has been described above, detailed description will be omitted.

The main body 2000 is a member on which the probe unit 1000 is installed and includes a component for fixing the probe unit 1000 and a component for placing an electronic device on the probe unit 1000. The shape of the main body shown in FIG. 5 is an example and may be modified in various ways depending on the type and number of electronic devices to be measured.

By doing this, the electrical characteristics inspection device according to this embodiment can more accurately measure the equivalent series resistance (ESR) of electronic devices in the high frequency range by minimizing the conductor resistance, contact resistance, and stray capacitance of the measuring system.

In the above example, for convenience of explanation, MLCC is used as an example of an electronic device, and equivalent series resistance (ESR) is used as an example of a measurement item, but the scope of the present invention is not limited thereto. In other words, the probe installation system 100, probe unit 1000, or electrical characteristics inspection device 3000 according to an embodiment of the present invention does not limit the measurement object to MLCC, but measures the measurement item as equivalent series resistance (ESR). It is not limited to.

Above, an embodiment of the present invention has been described, but those skilled in the art will understand that addition, change or deletion of components can be made without departing from the spirit of the present invention as set forth in the patent claims. The present invention may be modified and changed in various ways, and this will also be included within the scope of the rights of the present invention.

G1, G2: Installation groove
GP: Ground pattern
T1-1, T1-2: 1st terminal
T2-1, T2-2: 2nd terminal
IM: insulator
CM: conductor layer
11, 12, 13, 14: Probe
20: upper substrate
30: lower substrate
40 elastic part
50: flexible connection
61, 62, 63, 64: Probe coupling part
100: Probe installation system
200: support part
210: connector
310, 320, 330, 340: Coaxial cable
410, 420, 430, 440: flexible cable
500: Shielding case
1000: Probe unit
2000: Main body
OC: external measuring equipment

Claims (10)

upper and lower substrates;
first to fourth probes each coupled to the upper substrate and protruding from one surface of the upper substrate;
an elastic portion installed between the upper substrate and the lower substrate to elastically move the upper substrate and the lower substrate;
a flexible connector electrically connecting each of the first to fourth probes and the lower substrate; and
a probe coupling portion at least partially embedded in one surface of the upper substrate, into which the first to fourth probes are detachably coupled; Including,
Probe installation system.
delete According to paragraph 1,
A probe installation system in which a ground pattern surrounding the probe coupling portion is formed on the upper substrate.
According to paragraph 1,
A probe installation system wherein the elastic portion is formed in plurality.
According to paragraph 1,
A probe installation system in which an installation groove in which the elastic part is installed is formed in each of the upper substrate and the lower substrate.
According to paragraph 1,
A probe installation system wherein the flexible connection part is either a flexible substrate or a metal foil on which a circuit pattern is formed.
A probe installation system according to any one of claims 1 and 3 to 6;
support part;
First to fourth coaxial cables each coupled to the support and including a signal line and a ground line;
first to fourth flexible cables connecting the probe installation system and each of the signal lines of the first to fourth coaxial cables; and
a shielding case having an opening exposing one end of the first to fourth probes and covering the probe installation system, the support part, the first to fourth coaxial cables, and the first to fourth flexible cables;
A probe unit comprising a.
In clause 7,
At least one of the first to fourth flexible cables is a rigid flexible cable.
In clause 7,
A connector coupled to the support unit to connect external measuring equipment and the first to fourth coaxial cables; A probe unit further comprising:
A probe unit according to claim 9; and
a main body to which the probe unit is coupled to support the shielding case;
An electrical properties inspection device comprising: