KR102515663B1 - optical integrated circuit package - Google Patents

Abstract

An optical integrated circuit package of the present invention includes an optical integrated circuit including an optical integrated circuit board; an electrical integrated circuit element positioned on the optical integrated circuit board; at least one optical element positioned on the optical integrated circuit board apart from the electrical integrated circuit element; an optical interface positioned on one side of the optical integrated circuit board; an electrical interface located on the other side of the optical integrated circuit board; and a sealing member sealing the optical integrated circuit, the electrical integrated circuit device, the optical device, the optical interface, and the electrical interface, wherein the electrical interface is formed of a flexible printed circuit board.

Description

Optical integrated circuit package

The technical idea of the present invention relates to an optical integrated circuit package, and more particularly, to an optical integrated circuit package implemented on an optical integrated circuit board.

In order to respond to the demand for miniaturization and high-speed electronic devices, high-speed signal transmission is required. Electrical signals are transmitted through wires such as copper wires, and there is a limit to high-speed, so a signal transmission method through optical signals is required. Accordingly, an optical integrated circuit package for transmitting an optical signal is required.

An object to be solved by the technical idea of the present invention is to provide an optical integrated circuit package that can meet the needs of miniaturization and high-speed electronic devices.

In order to solve the above problems, an optical integrated circuit package according to an embodiment of the technical idea of the present invention includes an optical integrated circuit including an optical integrated circuit board; an electrical integrated circuit element positioned on the optical integrated circuit board; at least one optical element positioned on the optical integrated circuit board apart from the electrical integrated circuit element; an optical interface positioned on one side of the optical integrated circuit board; an electrical interface located on the other side of the optical integrated circuit board; and a sealing member sealing the optical integrated circuit, the electrical integrated circuit device, the optical device, the optical interface, and the electrical interface, wherein the electrical interface is formed of a flexible printed circuit board.

In one embodiment of the technical idea of the present invention, the optical integrated circuit board may be composed of a silicon semiconductor substrate. The optical integrated circuit board may be composed of a III-V group semiconductor substrate.

In one embodiment of the technical idea of the present invention, the optical integrated circuit may include a wiring pad formed on the optical integrated circuit board. The electrical interface may be electrically connected to the wiring pad.

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In one embodiment of the technical idea of the present invention, the optical integrated circuit may include an optical waveguide and an optical coupler formed on the optical integrated circuit board. The optical interface may be optically connected to the optical waveguide through the optical coupler.

In one embodiment of the technical concept of the present invention, the optical element may include an electro-optical conversion element, a photoelectric conversion element, or a light modulation element. The electro-optical conversion element may be formed inside the optical integrated circuit board.

In one embodiment of the technical idea of the present invention, the optical interface may be one optical fiber or an optical fiber array including a plurality of optical fibers. The optical fiber may include an inclined cross-section for changing a path of input/output light.

In one embodiment of the technical idea of the present invention, the optical interface may be composed of a receptacle connector and an alignment element.

In one embodiment of the technical concept of the present invention, a heat sink contacting a lower portion of the optical integrated circuit board may be further installed. The sealing member may seal the heat sink while contacting both sides of the heat sink. The inside of the sealing member may be filled with an air layer, a nitrogen layer or a vacuum layer. The sealing member may be filled with a transparent material layer.

In one embodiment of the technical concept of the present invention, the optical integrated circuit is located in a base printed circuit board, the electrical interface is electrically connected to a wiring pad of the base printed circuit board, and the optical interface is connected to the base printed circuit board. It can be located on a substrate.

An optical integrated circuit package according to one embodiment of the technical idea of the present invention includes an optical integrated circuit including an optical integrated circuit board; an electric integrated circuit element positioned on the optical integrated circuit board and electrically connected to a wiring line of the optical integrated circuit board; at least one optical element for processing an optical signal and an electrical signal in the optical integrated circuit; an optical interface positioned on one side of the optical integrated circuit board and optically connected to the optical integrated circuit and the optical element; an electrical interface located on the other side of the optical integrated circuit board and electrically connected to the electrical integrated circuit element and the optical element; and a sealing member sealing the optical integrated circuit, the electric integrated circuit element, the optical element, the optical interface, and the electrical interface, wherein the optical interface includes a receptacle connector into which a plug connector can be inserted from the outside, and the optical interface. and an alignment element for aligning light entering and exiting through the receptacle connector.

In one embodiment of the technical idea of the present invention, the electrical interface may be electrically connected to a circuit wiring line of the optical integrated circuit board.

The alignment element may be a planar optical waveguide element. The alignment element may include an optical multiplexer and a demultiplexer.

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In one embodiment of the technical concept of the present invention, the optical element may include an electro-optical conversion element, a photoelectric conversion element, or a light modulation element. The optical interface may transmit an optical signal modulated by the optical modulation device to the outside or receive an externally modulated optical signal by the photoelectric conversion device. The electrical interface may transmit an electrical signal converted by the photoelectric conversion device to the outside or receive an external electrical signal to the electronic integrated circuit device.

In one embodiment of the technical concept of the present invention, a heat sink contacting a lower portion of the optical integrated circuit board may be further installed.

An optical integrated circuit package according to one embodiment of the technical idea of the present invention includes an optical integrated circuit including an optical integrated circuit board; an electric integrated circuit element positioned on the optical integrated circuit board and electrically connected to a wiring line of the optical integrated circuit board; a first optical element capable of generating an optical signal integrated inside the optical integrated circuit board; a second optical element disposed on the optical integrated circuit board to process an optical signal and an electrical signal; an optical interface positioned on one side of the optical integrated circuit board and optically connected to the optical integrated circuit, the first optical element, and the second optical element; an electrical interface located on the other side of the optical integrated circuit board and electrically connected to the electrical integrated circuit, the first optical element, and the second optical element; and a sealing member sealing the optical integrated circuit, the electric integrated circuit element, the first optical element, the second optical element, the optical interface, and the electrical interface.

In one embodiment of the technical concept of the present invention, an optical waveguide and an optical coupler are included in the optical integrated circuit board, and the first optical element is an electro-optical conversion element that is optically aligned with the optical waveguide through the optical coupler. can be configured.

In one embodiment of the technical concept of the present invention, the second optical device may include a light modulation device and a photoelectric conversion device.

In one embodiment of the technical concept of the present invention, a heat sink contacting a lower portion of the optical integrated circuit board is further installed, and the sealing member can seal the heat sink while contacting both sides of the heat sink. .

An optical integrated circuit package of the technical concept of the present invention is an optical integrated circuit including an optical integrated circuit board. It may include an electrical integrated circuit located on an optical integrated circuit board, and an optical interface and an electrical interface implemented on the optical integrated circuit board.

Accordingly, the optical integrated circuit package of the technical concept of the present invention can mount various optical elements on an optical integrated circuit board, easily perform optical and electrical connection with external devices, and It can meet the demand for miniaturization and high speed.

1 is a cross-sectional view of an optical integrated circuit package according to an embodiment of the technical idea of the present invention.
FIG. 2 is a perspective view illustrating a connection relationship between an optical integrated circuit, an optical interface, and an electrical interface of the optical integrated circuit package of FIG. 1 .
FIG. 3 is a plan view illustrating an embodiment of electrical and optical connection between optical devices and electronic integrated circuit devices of the optical integrated circuit package of FIG. 1 .
4 to 6 are plan views illustrating various embodiments of an optical waveguide of the optical integrated circuit package of FIG. 1 .
FIG. 7 is a cross-sectional view illustrating an embodiment of an optical coupler of the optical integrated circuit package of FIG. 1 .
FIG. 8 is a diagram for explaining the principle of optical coupling through the optical coupler of FIG. 7 .
9 is a plan view illustrating an optical integrated circuit package according to an exemplary embodiment of the inventive concept.
FIG. 10 is a diagram for explaining signal flows of optical elements and electric integrated circuit elements located in the optical integrated circuit of FIG. 9 .
11 is a cross-sectional view of an optical integrated circuit package according to an exemplary embodiment of the inventive concept.
12 is a cross-sectional view of an optical integrated circuit package according to an exemplary embodiment of the inventive concept.
13 is a perspective view illustrating an example of the alignment element of FIGS. 11 and 12;
14 is a plan view illustrating an optical integrated circuit package according to an exemplary embodiment of the inventive concept.
15 is a cross-sectional view illustrating an optical integrated circuit package according to an embodiment of the technical concept of the present invention.
16 is a cross-sectional view illustrating an optical integrated circuit package according to an exemplary embodiment of the inventive concept.
17 is a diagram for explaining an optical integrated circuit system including an optical integrated circuit package according to an exemplary embodiment of the inventive concept.
18 is a diagram for explaining an optical integrated circuit system including an optical integrated circuit package according to an exemplary embodiment of the inventive concept.
19 is a diagram for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment according to the technical concept of the present invention.
20 is a diagram for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment according to the technical concept of the present invention.
21 is a block diagram for explaining a computer system including an optical integrated circuit package according to an embodiment according to the technical concept of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art, and the following examples may be modified in many different forms, and the scope of the present invention is as follows It is not limited to the examples. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the spirit of the invention to those skilled in the art. In addition, the thickness or size of each layer in the drawings is exaggerated for convenience and clarity of explanation.

Throughout the specification, when referring to an element, such as a film, region, or substrate, being located “on,” “connected to,” or “coupled to” another element, the one element is referred to directly. It can be interpreted that there may be other components that are in contact with, “on,” “connected to,” or “coupled to” other components, or that are interposed therebetween. On the other hand, when an element is said to be located "directly on," "directly connected to," or "directly coupled to," another element, it is interpreted that there are no intervening elements. do. Like symbols refer to like elements.

In this specification, terms such as first and second are used to describe various members, components, regions, layers and/or portions, but these members, components, regions, layers and/or portions are limited by these terms. It is self-evident that no These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described in detail below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "over" or "above" and "bottom" or "below" may be used herein to describe the relationship of some elements to other elements as illustrated in the figures. Relative terms can be understood as intended to include other orientations of the element in addition to the orientation depicted in the figures. For example, if an element is turned over in the figures, elements that are depicted as being on the face of the other elements will have orientation on the face of the bottom of the other elements. Thus, the term "top" as an example may include both "bottom" and "top" directions, depending on the particular orientation of the figure. If the element is oriented in another direction (rotated 90 degrees relative to the other direction), relative statements used herein may be interpreted accordingly.

Terms used in this specification are used to describe specific embodiments and are not intended to limit the present invention. As used herein, the singular form may include the plural form unless the context clearly indicates otherwise. Also, when used herein, "comprise" and/or "comprising" specifies the presence of the recited shapes, numbers, steps, operations, elements, elements, and/or groups thereof. and does not exclude the presence or addition of one or more other shapes, numbers, operations, elements, elements and/or groups.

Embodiments of the present invention are described below with reference to drawings schematically showing ideal embodiments of the present invention. In the drawings, variations of the depicted shape may be expected, depending on, for example, manufacturing techniques and/or tolerances. Therefore, embodiments of the inventive concept should not be construed as being limited to the specific shape of the region shown in this specification, but should include, for example, a change in shape caused by manufacturing.

The following embodiments of the present invention may be implemented with only one, and also, the following embodiments may be implemented in combination of one or more. Therefore, the technical spirit of the present invention should not be construed as being limited to one embodiment.

1 is a cross-sectional view of an optical integrated circuit package according to an embodiment of the technical idea of the present invention.

Specifically, the optical integrated circuit package 1000 may include an optical integrated circuit (100) including an optical integrated circuit board 102. The optical integrated circuit 100 may be referred to as an interposer. The optical integrated circuit board 102 may be composed of a silicon semiconductor substrate. The optical integrated circuit board 102 may be composed of a III-V semiconductor substrate. An optical waveguide 104 and an optical coupler 106 may be formed on the optical integrated circuit board 102 .

The optical waveguide 104 and the optical coupler 106 are shown as being formed inside the optical integrated circuit board 102 as shown in the cross-sectional view of FIG. 1, but the optical waveguide 104 and the optical coupler 106 are 102) may be formed on the surface. The optical coupler 106 may be a vertical optical coupler. The optical waveguide 104 may be a passage through which light (or an optical signal) travels. The optical coupler 106 may couple light traveling in a horizontal direction of the optical integrated circuit board 102 in a vertical direction.

An electronic integrated circuit device (EICD) 200 may be positioned on the optical integrated circuit board 102 . The electronic integrated circuit device 200 may be attached to the optical integrated circuit board 102 using an adhesive layer 202 . The connection pad 204 of the electronic integrated circuit device 200 may be electrically connected to the first wiring pad 108 formed on a portion of the optical integrated circuit board 102 .

At least one optical device 300 (optical device, OD) may be installed on the optical integrated circuit board 102 apart from the electric integrated circuit device 200 . The optical device 300 may be attached to the optical integrated circuit board 102 using an adhesive layer 302 . The optical device 300 may include an electro-optical conversion device, a photoelectric conversion device, or an optical modulation device. The optical device 300 of FIG. 1 may include an electro-optical conversion device 310, for example, a laser diode device. Light (or an optical signal) generated by the electro-optical conversion element 310 may be transmitted to the optical waveguide 104 through the optical coupler 106 .

An optical interface 400 may be installed on one side of the optical integrated circuit board 102 . The optical interface 400 may be adhered to the optical integrated circuit board 102 using an adhesive layer 402 . The optical interface 400 may be optically connected to the optical integrated circuit board 102 . The optical interface 400 may be optically connected to the optical waveguide 104 through the optical coupler 106 .

The optical interface 400 may be composed of one optical fiber 404 . The optical fiber 404 may be protected with a protective layer 406 . As will be described later, the optical interface 400 may be an optical fiber array including a plurality of optical fibers. The optical fiber 404 may include an inclined cross-section 408 for changing the path of input/output light as indicated by arrows.

An electrical interface 500 may be installed on the other side of the optical integrated circuit board 102 . The electrical interface 500 may be electrically connected to the second wiring pad 110 formed on the optical integrated circuit board 102 . The electrical interface 500 may be comprised of a flexible printed circuit board 502 . The first connection pad 504 formed on one side of the flexible printed circuit board 502 may be electrically connected to the second wiring pad 110 .

The first wiring pad 108 and the second wiring pad 110 may or may not be electrically connected to each other through a circuit wiring line (not shown). The second connection pad 506 formed on the other side of the flexible printed circuit board 502 may be connected to an external base printed circuit board. The second connection pad 506 may be electrically connected to the second wiring pad 110 . An electrical signal through the second connection pad 506 can be transferred to the second wiring pad 110 through the flexible printed circuit board 502 .

If necessary, a heat sink 700 contacting the optical integrated circuit board 102 may be installed under the optical integrated circuit board 102 . The heat sink 700 may serve to dissipate heat generated in the optical integrated circuit 100 to the outside.

The optical integrated circuit package 1000 includes an optical integrated circuit 100, an electrical integrated circuit device 200, an optical device 300, an optical interface 400, and an encapsulation member 600 sealing the electrical interface 500. can include In one embodiment, the inside of the sealing member 600 may be filled with an air layer, a nitrogen layer, or a vacuum layer. In one embodiment, the sealing member 600 may be filled with a transparent material layer. When the heat sink 700 is installed, the sealing member 600 may seal the heat sink 700 while contacting both sides of the heat sink 700 .

As described above, the optical integrated circuit package 1000 is an optical integrated circuit 100 including an optical integrated circuit board 102. It may include an electrical integrated circuit device 200 located on the optical integrated circuit board 102 , and an optical interface 400 and an electrical interface 500 formed on the optical integrated circuit board 102 .

Accordingly, the optical integrated circuit package 1000 can mount various optical elements on the optical integrated circuit board 102, can easily perform optical and electrical connection with external devices, and also can perform an optical interface ( 400), it is possible to meet the demand for miniaturization and high-speed electronic devices. In addition, the optical integrated circuit package 1000 improves optical and electrical connections between the optical integrated circuit board 102 and the optical interface 400 and the electrical interface 500 to improve signal transmission quality.

FIG. 2 is a perspective view illustrating a connection relationship between an optical integrated circuit, an optical interface, and an electrical interface of the optical integrated circuit package of FIG. 1 .

Specifically, the optical interface 400 may be installed on one side of the optical integrated circuit board 102 constituting the optical integrated circuit 100 . A plurality of optical couplers 106 may be formed on the optical integrated circuit board 102 . The optical interface 400 may be an optical fiber array 408 including a plurality of optical fibers 404 . The optical fiber array 408 may be protected with a protective layer 406 .

Accordingly, the optical fiber array 408 may be optically connected to the optical couplers 106 . In other words, the optical fiber array 408 and the optical couplers 106 may transfer light (or optical signals) to each other.

An electrical interface 500 may be installed on the other side of the optical integrated circuit board 102 . The electrical interface 500 may be composed of a flexible printed circuit board. A plurality of second wiring pads 110 may be formed on the other side of the optical integrated circuit board 102 .

First connection pads 504 and second connection pads 506 may be installed on one side and the other side of the flexible printed circuit board 502 , respectively. The first connection pads 504 may be electrically connected to the second wiring pads 110 . The second connection pads 506 may be connected to an external base printed circuit board. The base printed circuit board may be a circuit board of an application module (or application device). The first connection pads 504 and the second connection pads 506 may be electrically connected through an interface wiring line (not shown).

Accordingly, the electrical interface 500 may be electrically connected to the optical integrated circuit board 102 . In other words, an electrical signal through the second connection pad 506 of the electrical interface 500 can be transferred to the second wiring pad 110 through the flexible printed circuit board 502 .

FIG. 3 is a plan view illustrating an embodiment of electrical and optical connection between optical devices and electronic integrated circuit devices of the optical integrated circuit package of FIG. 1 .

Specifically, as described above, the optical integrated circuit package 1000 includes the optical integrated circuit 100, the electrical integrated circuit device 200 and the optical device 300, the electrical interface 500, the optical interface 400, and the heat sink. (700).

Electrical signals transmitted through the interface wiring line 503 of the electrical interface 500 may be received by the electronic integrated circuit device 200 and the optical device 300 through the circuit wiring line 103 . When the optical device 300 is an electro-optical conversion device, for example, a laser diode device, the optical signal generated from the optical device 300 passes through the optical waveguide 104 to the optical fiber array 408 of the optical interface 400 or the optical fiber ( 404) may be transmitted to the outside.

Meanwhile, an optical signal received from the outside through the optical fiber array 408 or optical fiber 404 constituting the optical interface 400 is received by the optical element 300, for example, a photoelectric conversion element, through the optical waveguide 104. It can be. The photoelectric conversion element may be a photodiode element. The electrical signal converted by the optical device 300 may be transferred to the outside through the interface wiring line 503 of the electrical interface 500 through the electronic integrated circuit device 200 .

4 to 6 are plan views illustrating various embodiments of an optical waveguide of the optical integrated circuit package of FIG. 1 .

Specifically, the optical waveguide 104 of FIG. 1 may include the optical waveguides 104a, 104b, and 104c of FIGS. 4 to 6 . 4 to 6, Y may be a depth direction and X may be a width direction.

Referring to FIG. 4 , the optical waveguide 104a may include a lower cladding layer 1002a and a core layer 1004a disposed on the lower cladding layer 1002a in a one-dimensional planar slab shape, An air layer may be used as the upper cladding layer, but is not limited thereto. In this case, since the refractive index change occurs only in the depth direction Z, the optical signal passing through the optical waveguide 104a is refracted only in the depth direction Z. In FIG. 4 , an optical signal input from one side may be output from the other side.

Referring to FIG. 5 , the optical waveguide 104b may include a lower cladding layer 1002b and a core layer 1004b arranged in a channel shape in the lower cladding layer 1002b, and an air layer may be used as an upper cladding layer. However, it is not limited thereto. In this case, the refractive index is changed in the depth direction (Z) and width direction (X) of the channel. In FIG. 5 , an optical signal input from one side may be output from the other side.

Referring to FIG. 6 , the optical waveguide 104c may include a lower cladding layer 1002c and a core layer 1004c disposed in a channel shape branching from the lower cladding layer 1002c, and an air layer may be formed on the upper portion. It can be used as a cladding layer, but is not limited thereto. In FIG. 6 , an optical signal input from one side is output to the other side, and the optical waveguide 104c may split the input optical signal into two.

FIG. 7 is a cross-sectional view illustrating an embodiment of an optical coupler of the optical integrated circuit package of FIG. 1 .

Specifically, the optical coupler 106 may be a grating coupler. The optical coupler 106 can be implemented by forming gratings, that is, gratings G1 and G2 at one end of the optical waveguide. The optical coupler 106 may transmit/receive light using a diffraction characteristic of light while encountering the gratings G1 and G2, and may filter light by adjusting the spacing between the gratings G1 and G2.

The size of the grating formed in the optical coupler 106, that is, the period of the grating, may be determined by the width w of the incident light and the wavenumber vector k-vector. Accordingly, by forming an appropriate grating on the optical coupler 106 , the incident light can be optically coupled to the optical coupler 106 with high optical coupling efficiency.

FIG. 8 is a diagram for explaining the principle of optical coupling through the optical coupler of FIG. 7 .

Specifically, optical coupling conditions using the optical coupler 106 of FIG. 7 will be described below. First of all, in order for incident light to be optically coupled to the optical coupler 106 with high optical coupling efficiency, the phases of the incident light must match. Such a phase matching condition is represented by Equation 1 below.

[Equation 1]

βν = β0 + ν2π/Λ

Here, ν is an integer, Λ represents the period of the grating, βν represents the phase of the νth mode, and β0 represents the phase of the fundamental mode.

In addition, a guiding condition, which is a condition for confining incident light to the waveguide, is expressed as Equation 2 below.

[Equation 2]

αm =κn3sinθm=(2π/λn3)sinθm

Here, m is an integer, λ represents the wavelength of the m-th mode light, and κ is a wave number, which is the reciprocal of the wavelength. In addition, αm is a refractive index condition value of the m-th mode light, and θm is an incident angle of the m-th mode light. 8, w represents the width of the incident light, n1 represents the refractive index of the lower cladding layer, n2 represents the refractive index of the core layer, and n3 represents the refractive index of the outer waveguide or upper cladding layer. In order for the incident light to be guided to the waveguide, the relation κn3<αm<κn2 must be satisfied.

9 is a plan view illustrating an optical integrated circuit package according to an exemplary embodiment of the inventive concept.

Specifically, the optical integrated circuit package 1100 of FIG. 9 may be identical to the optical integrated circuit package 1000 of FIGS. 1 to 8 except for the optical devices 300-1 and 300-2. The optical integrated circuit package 1100 of FIG. 9 is for explaining electrical and optical connections between the optical devices 300-1 and 300-2 and the electric integrated circuit device 200. In FIG. 9, the same reference numerals as those in FIGS. 1 to 8 denote the same members, and for convenience, overlapping descriptions are simply described or omitted.

The optical integrated circuit package 1100 includes an optical integrated circuit 100, an electrical integrated circuit device 200, optical devices 300-1 and 300-2, an electrical interface 500, an optical interface 400, and a heat sink ( 700) may be included. The optical devices 300-1 and 300-2 can be classified into a first optical device 300-1 and a second optical device 300-2 for convenience.

The first optical device 300-1 may be an electro-optical conversion device (LD) capable of generating light (or an optical signal), for example, a laser diode device. The second optical device 300 - 2 may include an optical modulator device (MOD) 320 capable of processing optical and electrical signals and a photoelectric conversion device (PD) 330 . The photoelectric conversion element 330 may be a photodiode element.

Electrical signals transmitted through the interface wiring line 503 of the electrical interface 500 are transferred to the electronic integrated circuit element 200, the electro-optical conversion element 310, and the optical modulator element 320 through the circuit wiring line 335. It can be. The electro-optical conversion element 310 may generate an optical signal and transmit it to the optical modulator element 320 .

The optical modulator element 320 may modulate an optical signal according to an electrical signal transmitted through the circuit wiring line 335 and transmit the modulated optical signal to the optical interface 400 through the optical waveguide 104 . The modulated optical signal may be transferred to the outside through the optical fiber array 408 or the optical fiber 404 of the optical interface 400 . If necessary, the electronic integrated circuit device 200 may control the electro-optical conversion device 310 through the circuit wiring line 335 .

Meanwhile, an optical signal received from the outside through the optical fiber array 408 or the optical fiber 404 constituting the optical interface 400 may be received by the photoelectric conversion element 330 through the optical waveguide 340 . The photoelectric conversion device 330 may convert an optical signal into an electrical signal and transmit the electrical signal to the electrical interface 500 through the electronic integrated circuit device 200 and the circuit wiring line 335 . Electrical signals may be transferred to the outside through the interface wiring line 503 of the electrical interface 500 .

As such, the optical integrated circuit package 1100 may be used as an optical transceiver that transmits or receives an optical signal. In addition, the optical integrated circuit package 1100 includes a plurality of optical devices 300-1 and 300-2 to facilitate optical and electrical connection with external devices and includes an optical interface 400 to provide electronic It can meet the demand for miniaturization and high speed of the device.

FIG. 10 is a diagram for explaining signal flows of optical elements and electric integrated circuit elements located in the optical integrated circuit of FIG. 9 .

Specifically, an electric integrated circuit device 200 (EICD), an electro-optical conversion device 310 (LD), and an optical modulator device (MOD) 320 may be installed in the optical integrated circuit 100. As described above, the electronic integrated circuit device 200 (EICD), the electro-optical conversion device 310 (LD), and the optical modulator device (MOD) 320 may be attached to the optical integrated circuit board.

The electronic integrated circuit device 200 may generate transmission electrical signals VD based on the received transmission data MI. The light modulator element 320 may modulate the light signal LI received from the electro-optical conversion element 310 according to the transmitted electrical signals VD to generate the modulated light signal LM. The modulated optical signal LM may be transferred to an external device or a base printed circuit board.

11 is a cross-sectional view of an optical integrated circuit package according to an exemplary embodiment of the inventive concept.

Specifically, the optical integrated circuit package 1200 may be the same as the optical integrated circuit package 1000 of FIGS. 1 to 8 except for the optical interface 400-1. In FIG. 11, the same reference numerals as those in FIGS. 1 to 8 denote the same members, and overlapping descriptions for convenience are simply described or omitted.

The optical integrated circuit package 1200 includes an optical integrated circuit 100, an electrical integrated circuit device 200, an optical device 300, an electrical interface 500, an optical interface 400-1, and a heat sink 700. can do.

The optical interface 400 - 1 may be adhered to the optical integrated circuit board 102 using an adhesive layer 402 . The optical interface 400-1 may include a receptacle connector 414, a lens 412, and an alignment element 410. A lens 412 may be optionally installed.

Receptacle connector 414 may be located on alignment element 410 . A plug connector (not shown) may be inserted into the receptacle connector 414 from the outside to transmit an optical signal. The alignment element 410 may align light input and output through the receptacle connector 414 . The alignment element 410 may be a planar optical waveguide element. The alignment element 410 may include an optical waveguide having a refractive index similar to that of the core layer of the optical fiber. The alignment element 410 may include an inclined cross section 408 that changes the path of input/output light. As will be described later, an optical multiplexer and a demultiplexer may be installed in the alignment element 410 .

Light (or an optical signal) transmitted through the receptacle connector 414 may be transmitted to the optical coupler 106 through the lens 412 and the alignment element 410 as shown by arrows. Accordingly, the optical interface 400 - 1 may be optically connected to the optical waveguide 104 through the optical coupler 106 . The optical interface 400 - 1 may be optically connected to the optical integrated circuit board 102 .

12 is a cross-sectional view of an optical integrated circuit package according to an exemplary embodiment of the inventive concept.

Specifically, the optical integrated circuit package 1300 may be the same as the optical integrated circuit package 1000 of FIGS. 1 to 8 except for the optical interface 400-2. In FIG. 12, the same reference numerals as those in FIGS. 1 to 8 denote the same members, and overlapping descriptions for convenience are simply described or omitted.

The optical integrated circuit package 1300 includes an optical integrated circuit 100, an electrical integrated circuit device 200, an optical device 300, an electrical interface 500, an optical interface 400-2, and a heat sink 700. can do.

The optical interface 400 - 2 may be adhered to the optical integrated circuit board 102 using an adhesive layer 402 . The optical interface 400-1 may include a receptacle connector 414-1 and an alignment element 410-1.

The receptacle connector 414-1 may be located on one side of the alignment element 410-1. When the receptacle connector 414-1 is not located on the alignment element 410 as shown in FIG. 11, the package height can be reduced and optical alignment can be facilitated.

A plug connector may be inserted into the receptacle connector 414-1 from the outside to transmit an optical signal. The alignment element 410 - 1 may align light input and output through the receptacle connector 414 . The alignment element 410-1 may be a planar optical waveguide element. The alignment element 410-1 may include an inclined cross section 408 that changes the path of input/output light.

Light (or an optical signal) transmitted through the receptacle connector 414-1 may be transmitted to the optical coupler 106 through the alignment element 410-1 as indicated by an arrow. Accordingly, the optical interface 400 - 2 may be optically connected to the optical waveguide 104 through the optical coupler 106 . The optical interface 400 - 2 may be optically connected to the optical integrated circuit board 102 .

13 is a perspective view illustrating an example of the alignment element of FIGS. 11 and 12;

Specifically, as described above, the alignment elements 410 and 410-1 may be composed of planar optical waveguide elements. The alignment elements 410 and 410-1 may include a lower cladding layer 431, a plurality of alignment optical waveguides 433, an upper cladding layer 435, and a lid 437. The alignment elements 410 and 410-1 may be formed of a transparent material in a wavelength range of 1300 nm to 1600 nm, such as silicon nitride or silicon oxide. The optical waveguides of the alignment elements 410 and 410-1 may have a refractive index similar to that of the core layer of the optical fiber.

The alignment elements 410 and 410-1 may be referred to as alignment chips. The alignment optical waveguide 433 may be implemented on the lower cladding layer 431 . The lead 437 may or may not be formed as needed.

A receptacle connector 414 may be positioned on the alignment element 410 as shown in FIG. 11 . As shown in FIG. 12, a receptacle connector 414-1 may be positioned on one side of the alignment element 410-1.

As described above, the optical signal transmitted through the receptacle connector 414-1 may be transmitted to the optical waveguide formed on the optical integrated circuit board through the alignment optical waveguide 435.

14 is a plan view illustrating an optical integrated circuit package according to an exemplary embodiment of the inventive concept.

Specifically, the optical integrated circuit package 1400 may be the same as the optical integrated circuit package 1100 of FIG. 9 except for the optical interface 400-2. The optical integrated circuit package 1400 is used to describe electrical and optical connections between the optical devices 300 - 1 and 300 - 2 and the electrical integrated circuit device 200 .

The optical integrated circuit package 1400 is for explaining optical connection using the optical interface 400-2 of FIG. 13 . In FIG. 14, the same reference numerals as those in FIG. 9 denote the same members, and for convenience, overlapping descriptions are simply described or omitted.

The optical integrated circuit package 1400 includes an optical integrated circuit 100, an electrical integrated circuit device 200, optical devices 300-1 and 300-2, an electrical interface 500, an optical interface 400-2, and a heat A sink 700 may be included. The optical devices 300-1 and 300-2 can be classified into a first optical device 300-1 and a second optical device 300-2 for convenience.

The first optical device 300-1 may be an electro-optical conversion device (LD) capable of generating light (or an optical signal), for example, a laser diode device. The second optical device 300 - 2 may include an optical modulator device (MOD) 320 capable of processing optical and electrical signals and a photoelectric conversion device (PD) 330 . The photoelectric conversion element 330 may be a photodiode element.

Electrical signals transmitted through the interface wiring line 503 of the electrical interface 500 are transferred to the electronic integrated circuit element 200, the electro-optical conversion element 310, and the optical modulator element 320 through the circuit wiring line 335. It can be. The electro-optical conversion element 310 may generate an optical signal and transmit it to the optical modulator element 320 .

The optical modulator element 320 may modulate an optical signal according to an electrical signal transmitted through the circuit wiring line 335 and transmit the modulated optical signal to the optical interface 400 - 2 through the optical waveguide 104 . The modulated optical signal may be transferred to the outside through the alignment element 410-1 and the receptacle connector 414-1 of the optical interface 400-2. If necessary, the electronic integrated circuit device 200 may control the electro-optical conversion device 310 through the circuit wiring line 335 .

Meanwhile, an optical signal received from the outside through the receptacle connector 414-1 and the alignment element 410-1 constituting the optical interface 400 is received by the photoelectric conversion element 330 through the optical waveguide 340. can The photoelectric conversion device 330 may convert an optical signal into an electrical signal and transmit the electrical signal to the electrical interface 500 through the electronic integrated circuit device 200 and the circuit wiring line 335 . Electrical signals may be transferred to the outside through the interface wiring line 503 of the electrical interface 500 .

15 is a cross-sectional view illustrating an optical integrated circuit package according to an exemplary embodiment of the inventive concept.

Specifically, the optical integrated circuit package 1500 may be the same as the optical integrated circuit package 1000 of FIG. 1 except for the optical elements 310 - 1 and 300 . In FIG. 15, the same reference numerals as those in FIG. 1 denote the same members, and for convenience, overlapping descriptions are simply described or omitted.

The optical integrated circuit package 1500 includes an optical integrated circuit 100, an electrical integrated circuit device 200, optical devices 310-1 and 300, an electrical interface 500, an optical interface 400, and a heat sink 700. can include

At least one optical device 300 (optical device, OD) may be installed inside the optical integrated circuit board 102 . The optical devices 310-1 and 300 may include an electro-optical conversion device 310, for example, a laser diode device. Light (or an optical signal) generated by the electro-optical conversion device 310 - 1 may be transmitted to the optical waveguide 104 through the optical coupler 106 .

In this way, when the optical devices 310-1 and 300 are formed in the optical integrated circuit board 102, optical alignment between the optical waveguide 104 and the optical devices 310-1 and 300 can be facilitated, and On the integrated circuit board 102, an optical element formation area or an electric integrated circuit element formation area can be secured.

16 is a cross-sectional view illustrating an optical integrated circuit package according to an exemplary embodiment of the inventive concept.

Specifically, the optical integrated circuit package 1600 may be the same as the optical integrated circuit package 1000 of FIG. 1 except for further including a base printed circuit board 710 . In FIG. 16 , the same reference numerals as those in FIG. 1 denote the same members, and for convenience, overlapping descriptions are simply described or omitted.

The optical integrated circuit package 1600 may further include a base printed circuit board 710 . The base printed circuit board 710 may be a circuit board of an application module (or application device). The optical integrated circuit 100 may be positioned within the base printed circuit board 710 . The second connection pad 506 of the electrical interface 500 may be electrically connected to the wiring pad 720 of the base printed circuit board 710 . The optical interface 400 may be located on the base printed circuit board 700 .

In this way, the optical integrated circuit package 1600 can be mounted on the base printed circuit board 710, and various optical elements and electrical elements can be mounted on the base circuit board 710 to be modularized.

17 is a diagram for explaining an optical integrated circuit system including an optical integrated circuit package according to an exemplary embodiment of the inventive concept.

Specifically, FIG. 15 may be provided to describe an optical integrated circuit system 1700 including the optical integrated circuit packages 1200 , 1300 , and 1400 of FIGS. 11 to 14 . The optical integrated circuit system 1700 includes a plurality of electrical integrated circuit elements (EICD, 200_1 to 200_n), a plurality of light modulator elements (MOD, 320_1 to 320_n), a plurality of photoelectric conversion elements (PD. 330_1 to 330_n), Alignment elements 410 and 410-1, and receptacle connectors 414 and 414-1 may be included.

The alignment elements 410 and 410-1 may include an optical signal multiplexer 461 (MUX) and an optical signal demultiplexer 464 (DEMUX). In the optical integrated circuit system 1700, for convenience, the electro-optical conversion element is not shown.

The plurality of light modulator elements (MOD, 320_1 to 320_n) transmit optical signals modulated based on the transmission electrical signals (MI_1 to MI_n) received from the plurality of electronic integrated circuit elements (EICD, 200_1 to 200_n), respectively. (LT_1 to LT_n) can be generated respectively. In this case, each of the modulated transmission optical signals LT_1 to LT_n may be an optical signal having a different wavelength.

The optical signal multiplexer 461 (MUX) included in the alignment elements 410 and 410-1 generates multiplexed optical signals using the modulated transmission optical signals LT_1 to LT_n, and receptacle connectors 414, 414-1), the multiplexed optical signal may be transmitted to an external device or a base printed circuit board.

Multiplexed optical signals transmitted from external devices through the receptacle connectors 414 and 414-1 may be provided to the optical signal demultiplexers 464 and DEMUX included in the alignment elements 410 and 410-1. The optical signal demultiplexer 464 may demultiplex the multiplexed optical signals received from the receptacle connectors 414 and 414-1 into modulated received optical signals LR_1 to LR_n. In this case, each of the modulated received optical signals LR_1 to LR_n may be an optical signal having a different wavelength.

The plurality of photoelectric conversion elements PD. 330_1 to 330_n generate modulated reception electrical signals MO_1 to MO_n based on the modulated reception optical signals LR_1 to LR_n, respectively, to form a plurality of electronic integrated circuits. It may be provided as elements EICD, 200_1 to 200_n.

18 is a diagram for explaining an optical integrated circuit system including an optical integrated circuit package according to an exemplary embodiment of the inventive concept.

Specifically, the optical integrated circuit system 2000 includes a central processing unit (CPU) 2002 capable of communicating with at least one memory module 2008 via a connection system 2013. Memory module 2008 may be, for example, a dual inline memory module (DIMM). DIMMs may be DRAM modules. Memory module 2008 may include a plurality of individual memory circuits 2020, such as DRAM memory circuits.

In this embodiment, CPU 2002 and memory module 2008 generate or process electrical signals. The connection system 2013 may include an optical communication channel 2012, such as an optical fiber, that carries optical signals between the CPU 2002 and the memory module 2008.

Since the CPU 2002 and the memory module 2008 use electrical signals, electrical-to-optical conversion is required to convert the electrical signals of the CPU 2002 and the memory module 2008 into optical signals for transmission over an optical communication channel. Further, photoelectric conversion is required to convert an optical signal on the optical communication channel 2012 into an electrical signal for processing in the CPU 2002 and memory module 2008.

The access system 2013 may include optical integrated circuit packages 2004 and 2006 according to one embodiment of the technical idea of the present invention on both sides of the optical communication channel 2012 . The optical communication channel 2012 may be an optical interface of an optical integrated circuit package of the technical idea of the present invention.

The CPU 2002 may transmit and receive electrical signals to and from the optical integrated circuit package 2004 via the electrical bus 2010 . The memory module 2008 transmits and receives electrical signals to and from the optical integrated circuit package 2006 via the electrical bus 2014. The optical integrated circuit packages 2004 and 2006 may transmit and receive optical signals to and from each other. The electrical buses 2010 and 2014 may be electrical interfaces of the optical integrated circuit package of the technical concept of the present invention.

The optical integrated circuit package 2004 may include a photoelectric conversion element 2016 and an electro-optical conversion element 2017 . The optical integrated circuit package 2006 may include a photoelectric conversion element 2018 and an electro-optical conversion element 2019 . The electro-optical conversion devices 2017 and 2019 may transmit optical signals toward an optical communication channel 2012, for example, an optical fiber. The photoelectric conversion elements 2016 and 2018 may receive optical signals from the optical communication channel 2012 .

19 is a diagram for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment according to the technical concept of the present invention.

Specifically, the optical integrated circuit system 2050 includes a CPU 2052 capable of communicating with at least one memory module 2058 via a connection system 2063 . Memory module 2058 may be, for example, a dual inline memory module (DIMM). Memory module 2058 may be, for example, a DRAM module. The memory module 2058 can include a plurality of individual memory circuits 2070, such as DRAM memory circuits.

In this embodiment, the CPU 2052 and memory module 2058 may generate or process electrical and optical signals. In the embodiment of FIG. 19 , optical integrated circuit packages 2076 and 2082 of the technical concept of the present invention are implemented in a CPU 2052 and a memory module 2058 .

The CPU 2052 may include an optical integrated circuit package 2076 , and the memory module 2058 may include an optical integrated circuit package 2082 . The optical integrated circuit package 2076 may include a photoelectric conversion element 2077 and an electro-optical conversion element 2079 . The optical integrated circuit package 2082 may include a photoelectric conversion element 2083 and an electro-optical conversion element 2081 .

The CPU 2052 includes an electrical circuit 2078 and communicates electrical signals to and from the optical integrated circuit package 2076 via an electrical bus 2080. Memory module 2058 includes memory circuitry 2070 and communicates electrical signals to and from optical integrated circuit package 2082 via electrical bus 2084 . The electrical buses 2080 and 2084 may be electrical interfaces of the optical integrated circuit package of the technical idea of the present invention.

The connection system 2063 includes an optical communication channel 2062 , and the optical communication channel 2062 carries optical signals between the CPU 2052 and the memory module 2058 . The optical communication channel 2062 may be, for example, an optical fiber. The optical communication channel 2062 may be an optical interface of an optical integrated circuit package of the technical concept of the present invention.

The CPU 2052 may include an optical connector 2072 . The optical connector may be a receptacle connector of the technical concept of the present invention. An optical signal is transmitted from the optical integrated circuit package 2076 toward the optical communication channel 2062 through the optical connector 2072 . In addition, an optical signal is transmitted from the optical communication channel 2062 side to the optical integrated circuit package 2076 through the optical connector 2072 .

The memory module 2058 includes an optical connector 2074. An optical signal is transmitted from the optical integrated circuit package 2082 toward the optical communication channel 2062 through the optical connector 2074 . In addition, an optical signal may be transmitted from the optical communication channel 2062 to the optical integrated circuit package 2082 through the optical connector 2074 .

20 is a diagram for explaining an optical integrated circuit system including an optical integrated circuit package according to an embodiment according to the technical concept of the present invention.

Specifically, the optical integrated circuit system 2100 may include a CPU 2102 capable of communicating with at least one memory module 2108 through a connection system 2113 . The memory module 2108 may be, for example, a dual inline memory module (DIMM). The memory module 2108 can be a DRAM module. The memory module 2108 may include a plurality of individual memory circuits 2120, such as DRAM memory devices.

In this embodiment, CPU 2102 and memory module 2108 may generate or process electrical and optical signals. In the embodiment of FIG. 20 , the optical integrated circuit packages 2115 and 2121 of the present invention are implemented in the CPU 2102 and individual memory devices 2120 .

The optical integrated circuit package 2115 may include a photoelectric conversion element 2116 and an electro-optical conversion element 2117 . The optical integrated circuit package 2121 may include a photoelectric conversion element 2123 and an electro-optical conversion element 2126 .

The CPU 2102 includes an optical integrated circuit package 2115 , and each of the memory circuits 2120 may include an optical integrated circuit package 2121 . CPU 2102 includes electrical circuitry 2128 and communicates electrical signals to and from optical integrated circuit package 2115 via electrical bus 2130 .

Each memory circuit 2120 includes an electrical circuit 2127 and communicates electrical signals to and from the optical integrated circuit package 2121 via an electrical bus 2125 . The electrical buses 2125 and 2130 may be electrical interfaces of the optical integrated circuit package of the technical idea of the present invention.

The wiring system 2113 includes an optical communication channel 2112, and the optical communication channel 2112 carries optical signals between the CPU 2102 and the memory module 2108. The optical communication channel 2112 may be, for example, an optical fiber. The optical communication channel 2112 may be an optical interface of an optical integrated circuit package of the technical concept of the present invention. The CPU 2102 includes an optical connector 2122 .

An optical signal is transmitted from the optical integrated circuit package 2115 toward the optical communication channel 2112 through the optical connector 2122 . In addition, an optical signal is transmitted from the optical communication channel 2112 side to the optical integrated circuit package 21115 through the optical connector 2122 .

The memory module 2108 includes an optical connector 2124 . An optical signal is transmitted from the optical integrated circuit package 2121 toward the optical communication channel 2112 through the optical connector 2124 and the optical bus 2134 . In addition, an optical signal is transmitted from the optical communication channel 2112 side to the optical integrated circuit package 2121 through the optical connector 2124 .

21 is a block diagram for explaining a computer system including an optical integrated circuit package according to an embodiment according to the technical concept of the present invention.

Specifically, computer system 2200 may include any kind of signal processing system, display system, communication system, or other system in which signals may be transmitted optically.

Computer system 2200 can include a processor 2210 that can communicate with other elements by way of an optical bus 2250 . The processor 2210 may include an optical integrated circuit package 2202 according to the technical spirit of the present invention.

A semiconductor memory device 2220 is coupled to the optical bus 2250 . The semiconductor memory device 2220 may include an optical integrated circuit package according to the inventive concept. Accordingly, the semiconductor memory device 2220 may communicate with other elements through the optical bus 2250 . Power supply 2240 may communicate with other elements by way of optical bus 2250 . User interface 2230 can provide input/output to and from the user.

Although the present invention has been described with reference to the embodiments shown in the drawings, it is only exemplary, and those skilled in the art will understand that various modifications, substitutions, and equivalent other embodiments are possible therefrom. will be. It should be understood that the embodiments described above are illustrative in all respects and not restrictive. The true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

1000: optical integrated circuit package, 102: optical integrated circuit board, 100: optical integrated circuit, 104: optical waveguide, 106: optical coupler, 200: electrical integrated circuit element, 300: optical element, 400: optical interface, 404: optical Fiber, 500: electrical interface, 502: flexible printed circuit board, 600: encapsulation member, 700: heat sink,

Claims (20)

an optical integrated circuit including an optical integrated circuit board;
an electrical integrated circuit element positioned on the optical integrated circuit board;
at least one optical element positioned on the optical integrated circuit board apart from the electrical integrated circuit element;
an optical interface positioned on one side of the optical integrated circuit board;
an electrical interface located on the other side of the optical integrated circuit board; and
A sealing member sealing the optical integrated circuit, the electrical integrated circuit element, the optical element, the optical interface, and the electrical interface,
The optical integrated circuit package, characterized in that the electrical interface is composed of a flexible printed circuit board. The optical integrated circuit package according to claim 1, wherein the optical integrated circuit board is composed of a silicon semiconductor substrate or a III-V group semiconductor substrate. The optical integrated circuit package according to claim 1, wherein the optical integrated circuit includes a wiring pad formed on the optical integrated circuit board, and the electrical interface is electrically connected to the wiring pad. delete The optical integrated circuit of claim 1, wherein the optical integrated circuit includes an optical waveguide and an optical coupler formed on the optical integrated circuit board, and the optical interface is optically connected to the optical waveguide through the optical coupler. integrated circuit package. The optical integrated circuit package according to claim 1, wherein the optical element includes an electro-optical conversion element, a photoelectric conversion element, or a light modulation element. 7. The optical integrated circuit package according to claim 6, wherein the electro-optical conversion element is formed inside the optical integrated circuit board. The optical integrated circuit package according to claim 1 , wherein the optical interface is one optical fiber or an optical fiber array including a plurality of optical fibers, and the optical fiber includes an inclined cross section for changing a path of input/output light. . The optical integrated circuit package according to claim 1, wherein the optical interface is composed of a receptacle connector and an alignment element. The optical integrated circuit package according to claim 1 , wherein a heat sink contacting a lower portion of the optical integrated circuit board is further provided, and the sealing member seals the heat sink while contacting both sides of the heat sink. . The optical integrated circuit package according to claim 1, wherein the sealing member is filled with an air layer, a nitrogen layer, a vacuum layer, or a transparent material layer. The method of claim 1, wherein the optical integrated circuit is located in a base printed circuit board, the electrical interface is electrically connected to a wiring pad of the base printed circuit board, and the optical interface is located on the base printed circuit board. Characterized by an optical integrated circuit package. an optical integrated circuit including an optical integrated circuit board;
an electric integrated circuit element positioned on the optical integrated circuit board and electrically connected to a wiring line of the optical integrated circuit board;
at least one optical element for processing an optical signal and an electrical signal in the optical integrated circuit;
an optical interface positioned on one side of the optical integrated circuit board and optically connected to the optical integrated circuit and the optical element;
an electrical interface located on the other side of the optical integrated circuit board and electrically connected to the electrical integrated circuit element and the optical element; and
A sealing member sealing the optical integrated circuit, the electrical integrated circuit element, the optical element, the optical interface, and the electrical interface,
The optical integrated circuit package of claim 1 , wherein the optical interface includes a receptacle connector into which a plug connector can be inserted from the outside and an alignment element for aligning light entering and exiting through the receptacle connector. The optical integration according to claim 13, wherein the electrical interface is electrically connected to a circuit wiring line of the optical integrated circuit board, and the optical interface is optically connected to an optical waveguide of the optical integrated circuit board. circuit package. delete 14. The optical integrated circuit package according to claim 13, wherein the alignment element is a planar optical waveguide element. 14. The method of claim 13, wherein the optical element includes an electro-optical conversion element, a photoelectric conversion element, or an optical modulation element, and the optical interface transmits an optical signal modulated by the optical modulation element to the outside or an externally modulated optical signal. to the photoelectric conversion element, and the electrical interface transmits an electrical signal converted by the photoelectric conversion element to the outside or receives an external electrical signal to the electronic integrated circuit element. an optical integrated circuit including an optical integrated circuit board;
an electric integrated circuit element positioned on the optical integrated circuit board and electrically connected to a wiring line of the optical integrated circuit board;
a first optical element capable of generating an optical signal integrated inside the optical integrated circuit board;
a second optical element disposed on the optical integrated circuit board to process an optical signal and an electrical signal;
an optical interface positioned on one side of the optical integrated circuit board and optically connected to the optical integrated circuit, the first optical element, and the second optical element;
an electrical interface located on the other side of the optical integrated circuit board and electrically connected to the electrical integrated circuit, the first optical element, and the second optical element; and
The optical integrated circuit package comprising the optical integrated circuit, the electrical integrated circuit element, the first optical element, the second optical element, the optical interface, and a sealing member sealing the electrical interface. 19. The method of claim 18, wherein an optical waveguide and an optical coupler are included in the optical integrated circuit board, and the first optical element is composed of an electro-optical conversion element that is optically aligned with the optical waveguide through the optical coupler. Optical integrated circuit package. 19. The optical integrated circuit package according to claim 18, wherein the second optical element includes a light modulation element and a photoelectric conversion element.

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