KR102509707B1 - Display apparatus and electrical appliance comprising the same - Google Patents

Abstract

An example of the present invention includes a display panel and a heat dissipation buffering substrate disposed under the display panel and made of a porous metal material, wherein the heat dissipation buffering substrate faces a middle frame disposed thereunder and includes a first region having a first thickness; and a second region facing the adhesive pattern disposed between the middle frame and the heat dissipation buffer substrate and having a second thickness smaller than the first thickness.
Since the heat dissipation buffer substrate can dissipate heat and mitigate physical shock to the display panel, the heat dissipation member and the buffer member, which are separate components, can be replaced with the heat dissipation buffer substrate, thereby making the display device slimmer.

Description

Display device and electronic device including the same {DISPLAY APPARATUS AND ELECTRICAL APPLIANCE COMPRISING THE SAME}

The present invention relates to a display device that outputs light for displaying an image and an electronic device having the same.

Display devices include mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation systems, ultra mobile PCs (UMPCs), mobile phones, smart phones, tablet PCs (personal computers), watch phones, and electronic devices. It is widely used for image display functions of various electronic devices such as pads, wearable devices, watch phones, portable information devices, navigation devices, vehicle control display devices, televisions, laptop computers, and monitors. Research is being conducted to improve the thinning, lightening, and low power consumption of such a display device and an electronic device having the same.

Examples of the display device include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), and an electro-wetting display device. Display device: EWD) and Electro-Luminescence Display Device (ELDD).

The display device includes a display panel for outputting light of each pixel area for displaying an image and a driver for driving the display panel.

Meanwhile, driving heat is generated from the display panel or the driver during a turn-on operation of the display device. When an element of a display panel or an element of a driving unit in which such driving heat is continuously concentrated is damaged or deformed, driving stability and lifespan of the display device may be rapidly deteriorated.

In addition, since the display panel is formed in the form of a thin film, it may be vulnerable to external physical impact due to an assembly process or an installation process.

The display device may further include a heat dissipation member for dispersing driving heat of the display panel or driving heat of the driving unit in order to slow down the speed of deterioration of driving stability and lifespan.

In addition, the display device may further include a buffer member that alleviates external physical impact to protect the display panel.

When the heat dissipation member and the buffer member are provided as such, there is a problem in that there is a limitation in slimming the display device and the electronic device having the same.

SUMMARY OF THE INVENTION The present invention is to provide a display device capable of radiating heat and mitigating physical shock to a display panel and being advantageous in slimming, and an electronic device having the same.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention not mentioned above can be understood by the following description and will be more clearly understood by the examples of the present invention. It will also be readily apparent that the objects and advantages of the present invention may be realized by means of the instrumentalities and combinations indicated in the claims.

One example of the present invention provides a display device including a display panel and a heat dissipation buffer substrate disposed under the display panel and made of a porous metal material.

As such, since the heat dissipation buffer substrate is made of a metal material having a relatively high thermal conductivity, it is possible to dissipate heat from the display panel due to the heat dissipation buffer substrate.

In addition, since the heat dissipation buffering substrate is porous, physical impact to the display panel can be buffered.

In this way, since the heat dissipation buffering substrate can replace the heat dissipation member and the buffer member, which are separate components, a slimming display device can be advantageous compared to having the heat dissipation member and the buffer member separately.

The heat dissipation buffer substrate includes a first region having a first thickness and facing a middle frame disposed thereunder, and a second region having a second thickness smaller than the first thickness and facing an adhesive pattern disposed between the middle frame and the heat dissipation buffer substrate. It contains 2 areas.

In this way, a portion of the heat dissipation buffer substrate facing the adhesive pattern is formed with a relatively small thickness, so that an increase in the distance between the heat dissipation buffer substrate and the middle frame due to the thickness of the adhesive pattern can be prevented. As a result, slimming of the electronic device having the display device can be advantageous.

And, another example of the present invention provides an electronic device including the above display device, a transparent cover substrate disposed on the display panel, and a back cover fastened to the transparent cover substrate. Such an electronic device may be advantageous for slimming while being capable of radiating heat and mitigating physical shock to the display panel.

According to one embodiment of the present invention, a heat dissipation buffering substrate made of a porous metal material is disposed below the display panel. That is, since the heat dissipation buffer substrate is made of a metal material, it is possible to dissipate heat from the display panel due to the heat dissipation buffer substrate. In addition, since the heat dissipation buffering substrate is porous and has elasticity or shock absorbing power, physical shock to the display panel can be alleviated by the heat dissipation buffering substrate.

In this way, since the heat dissipation buffer substrate can replace the heat dissipation member for heat dissipation of the display panel and the buffer member for protection of the display panel, there is an advantage in that the slimness of the display device can be advantageous.

In addition, the heat dissipation buffer substrate is fastened to the middle frame disposed below the heat dissipation buffer substrate through an adhesive pattern. Among these heat dissipation buffering substrates, a portion corresponding to the adhesive pattern has a thinner thickness than other portions facing the middle frame.

Accordingly, the distance between the heat dissipation buffering substrate and the middle frame may be smaller than the thickness of the adhesive pattern. That is, the distance between the heat dissipation buffering substrate and the middle frame may not be limited to the thickness of the adhesive pattern. Therefore, there is an advantage in that slimming of an electronic device having a display device can be advantageous.

1 is a diagram showing an example of an electronic device having a display device according to an embodiment of the present invention.
FIG. 2 is an exploded view of an example of a cross section in the XY direction of the electronic device shown in FIG. 1 .
3 is a view showing a XY-direction cross-section of the electronic device shown in FIG.
FIG. 4 is a view illustrating a display panel and a driving unit of FIG. 2 .
FIG. 5 is a diagram illustrating an example of an equivalent circuit corresponding to the sub-pixel area of FIG. 4 .
FIG. 6 is a view showing an example of a cross section corresponding to a part of a display area in the display device of FIG. 3 .
FIG. 7 is a view showing a middle frame and an adhesive pattern of FIG. 2 .
8 is a view showing the heat dissipation buffer substrate of FIG. 3 according to the first embodiment of the present invention.
9 is a view showing a heat dissipation buffer substrate of FIG. 3 according to a second embodiment of the present invention.

The above objects, features and advantages will be described later in detail with reference to the accompanying drawings, and accordingly, those skilled in the art to which the present invention belongs will be able to easily implement the technical spirit of the present invention. In describing the present invention, if it is determined that the detailed description of the known technology related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

In addition, when a component is described as "connected", "coupled" or "connected" to another component, the components may be directly connected or connected to each other, but other components may be "interposed" between each component. ", or each component may be "connected", "coupled" or "connected" through other components.

Hereinafter, a display device and an electronic device including the display device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

First, an electronic device according to an embodiment of the present invention will be described.

1 is a diagram showing an example of an electronic device having a display device according to an embodiment of the present invention. FIG. 2 is an exploded view of an example of an X-Y direction cross section of the electronic device shown in FIG. 1 . 3 is a view showing a cross section in the X-Y direction of the electronic device shown in FIG.

As shown in FIG. 1 , the electronic device 10 according to an embodiment of the present invention may have a shape in which a relatively long edge (a corner in the Y direction in FIG. 1 ) of the display surface is bent downward.

Accordingly, the display area AA of the electronic device 10 where the light LIGHT for image display is output includes a flat display area (FDA in FIG. 2 ) and a bending display area (BDA in FIG. 2 ).

As shown in FIG. 2 , the electronic device 10 may include a display device 10a and a housing 10b.

The process of preparing the electronic device 10 may include a process of preparing the display device 10a and a process of fastening the display device 10a and the housing 10b.

The display device 10a may include a transparent cover substrate 11 , a display panel 100 , and a heat dissipation buffer substrate 200 .

For example, the process of preparing the display device 10a includes preparing the display panel 100, disposing the transparent cover substrate 11 on the display panel 100, and dissipating heat under the display panel 100. This may be achieved by arranging the buffer substrate 200 .

In the process of disposing the transparent cover substrate 11 on the display panel 100, the display panel 100 is attached to the transparent cover substrate through a transparent adhesive member (not shown) between the display panel 100 and the transparent cover substrate 11. (11) can be concluded.

In the process of arranging the heat buffer substrate 200 under the display panel 100, the display panel 100 moves through the adhesive layer (not shown) between the display panel 100 and the heat buffer substrate 200. (200) can be concluded.

The housing 10b may include a middle frame 12 and a back cover 14 .

For example, the process of fastening the display device 10a and the housing 10b includes a process of disposing the middle frame 12 under the heat dissipation buffer substrate 200 of the display device 10a, and a process of disposing the middle frame 12 under the middle frame 12. It may be made by a process of fastening the disposed back cover 14 and the transparent cover substrate 11 of the display device 10a.

In the process of arranging the middle frame 12 under the heat radiation buffer substrate 200 of the display device 10a, the heat radiation buffer substrate 200 has an adhesive pattern disposed between the heat radiation buffer substrate 200 and the middle frame 12. It can be fastened with the middle frame 12 through (13).

The adhesive pattern 13 may be disposed adjacent to both ends of edges of the long axis parallel to the Y-axis direction among the edges of the middle frame 12 .

In the process of fastening the back cover 14 disposed under the middle frame 12 and the transparent cover substrate 11 of the display device 10a, the transparent cover substrate 11 is formed between the transparent cover substrate 11 and the back cover ( 14) can be fastened to the back cover 14 through the connecting means between them. For example, the connection means may be implemented with adhesive, bolts and nuts, and rail grooves and slides.

As shown in FIG. 3 , the electronic device 10 includes a display panel 100, a heat dissipation buffer substrate 200 disposed below the display panel 100, and a transparent cover substrate 11 disposed above the display panel 100. , The middle frame 12 disposed under the heat dissipation buffer substrate 200, the adhesive pattern 13 disposed between the heat dissipation buffer substrate 200 and the middle frame 12, and the bag fastened with the transparent cover substrate 11 Cover 14 is included.

That is, the electronic device 10 includes the display panel 100, the heat dissipation buffer substrate 220, and the middle frame 12 accommodated between the transparent cover substrate 11 and the back cover 14 fastened to each other.

And, the electronic device 10 may further include various circuit components 15 disposed between the middle frame 12 and the back cover 14 .

The transparent cover substrate 11 may be made of materials such as plastic, glass, and tempered glass. For example, the transparent cover substrate 11 may be made of any one plastic material selected from polyethyleneterephthalate (PET), polycarbonate (PC), polyethersulfone (PES), polyethylenapthanate (PEN), and polynorborneen (PNB).

The transparent cover substrate 11 includes a flat cover part 11a and a curved cover part 11b disposed on both sides of the flat cover part 11a. Each curved cover part 11b has a curved surface shape bent with a predetermined radius of curvature from one side of the flat cover part 11a toward the back cover 12 .

The curved cover portion 11a may be disposed side by side at each of the long axis edges (edges in the Y direction) of the flat cover portion 11a.

Due to the transparent cover substrate 11, the aesthetics of the electronic device 10 may be improved, and the visibility of the bezel of the electronic device 10 may be reduced.

Although not shown in FIG. 3 , the display panel 100 and the transparent cover substrate 11 may be coupled to each other through a transparent adhesive member (not shown) disposed between the display panel 100 and the transparent cover substrate 11 . For example, the transparent adhesive member may be made of pressure sensitive adhesive (PSA), optical clear adhesive (OCA), and optical clear resin (OCR).

The display panel 100 includes a display area AA that outputs light for displaying an image.

The display panel 100 is formed in the form of a flexible flat plate. The display panel 100 may be deformed into the same shape as the transparent cover substrate 11 by being closely attached to the bottom of the transparent cover substrate 11 .

That is, the display area AA of the display panel 100 is a flat display area (FDA) corresponding to the flat cover portion 11a of the transparent cover substrate 11 and the curved cover of the transparent cover substrate 11. A bending display area (BDA) corresponding to the portion 11b is included.

The heat dissipation buffer substrate 200 is disposed below the display panel 100 .

Although not shown in FIG. 3 , the heat dissipation buffer substrate 200 may be fixed under the display panel 100 through an adhesive layer (not shown) disposed between the display panel 100 and the heat dissipation buffer substrate 200 . For example, the adhesive layer may be made of pressure sensitive adhesive (PSA), optical clear adhesive (OCA), and optical clear resin (OCR).

The heat dissipation buffer substrate 200 is made of a porous metal material 200', thereby protecting the display panel 100 from thermal damage and physical impact.

The porous metal material 200' may include a sponge-like metal material 201 and pores 202 distributed in the metal material 201. The metal material 201 may be any metal having relatively high thermal conductivity. For example, the metal material 201 may be copper (Cu).

As the porous metal material 200' is made of a metal material with relatively high thermal conductivity, heat can be quickly dispersed. Accordingly, since the heat dissipation buffering substrate 200 made of the porous metal material 200' can disperse driving heat generated from the display panel 100, damage or characteristic deformation of the display panel 100 due to concentration of driving heat is prevented. can be prevented

Also, since the porous metal material 200' is porous, it may have some elasticity and some shock absorption. Accordingly, since the heat dissipation buffering substrate 200 made of the porous metal material 200' can buffer external physical impact toward the display panel 100, the display panel 100 can be protected from external physical impact. there is.

Illustratively, the external physical impact may be divided into a drop type that applies an instantaneous blow and a drag type that continuously moves and applies pressure.

A drop-type physical impact may be prevented by an embossed buffer member having a predetermined impact absorbing power.

A drag-type physical impact may be prevented by a porous buffer member having predetermined rigidity and elasticity.

Accordingly, the existing electronic device 10 includes an embossed buffer member for mitigating physical shock, a porous buffer member, and a heat dissipation member for heat dissipation. Therefore, there is a problem in that there is a limit to slimming.

In contrast, according to an embodiment of the present invention, the heat dissipation buffer substrate 200 is made of a porous metal material 200', and the porous metal material 200' has a predetermined shock absorption capacity and a predetermined elasticity according to the porous form. In addition, it has a certain stiffness and a certain thermal conductivity due to the metal material. Therefore, the heat dissipation buffering substrate 200 can replace a plurality of buffer members and heat dissipation members provided in the existing electronic device 10 .

Accordingly, since the electronic device 10 according to an embodiment of the present invention includes the heat dissipation buffering substrate 200 made of the porous metal material 200', it is possible to mitigate physical impact and dissipate heat from the display panel 100. However, since a plurality of buffer members and heat dissipation members can be removed, there is an advantage in slimming.

In consideration of shock absorption, elasticity, thermal conductivity, and rigidity of the heat radiation buffer substrate 200, the porosity of the porous metal material 200' constituting the heat radiation buffer substrate 200 may be 50% to 76%. Here, the porosity corresponds to the ratio of the voids 202 to the total volume.

The heat dissipation buffer substrate 200 is fastened to the middle frame 12 through the adhesive pattern 13 .

The heat dissipation buffer substrate 200 has a first area 200a facing the middle frame 12 and having a first thickness, and a second area facing the adhesive pattern 13 and having a second thickness smaller than the first thickness ( 200b). The first and second regions 200a and 200b will be described in detail below.

The middle frame 12 is disposed below the heat dissipation buffer substrate 200 and supports the display panel 100 and the heat dissipation buffer substrate 200 .

One side of the middle frame 12 facing the transparent cover substrate 11 has a flat support portion 12a facing the flat cover portion 11a of the transparent cover substrate 11, and a curved cover portion of the transparent cover substrate 11. Corresponds to (11b) and includes curved support portions 12b disposed on both sides of the flat support portion 12a.

As such, since one surface of the middle frame 12 is formed in a shape corresponding to the transparent cover substrate 11, the display panel 100 interposed between the transparent cover substrate 11 and the middle frame 12 is the transparent cover substrate. It may be easy to maintain the shape corresponding to (11).

That is, the display area AA of the display panel 100 interposed between the transparent cover substrate 11 and the middle frame 12 is a flat display area disposed between the flat cover portion 11a and the flat support portion 12a ( FDA), and a bending display area BDA disposed between the curved cover part 11b and the curved surface support part 12b.

The adhesive pattern 13 is disposed between the curved surface support 12b of the middle frame 12 and the heat dissipation buffer substrate 200 . That is, the adhesive pattern 13 is not disposed between the flat support 12a of the middle frame 12 and the heat dissipation buffer substrate 200 . In this way, the driving heat of the circuit component 15 disposed under the part 12c corresponding to the flat support part 12a among the other surfaces of the middle frame 12 can be blocked by the heat dissipation buffer substrate 200. . Accordingly, the influence of driving heat of the circuit component 15 on the display panel 100 can be reduced.

In addition, the middle frame 12 may further include a groove portion 12c disposed on the other surface facing the back cover 14 .

The groove portion 12c is for accommodating various circuit components 15 of the electronic device 10. In this way, when the middle frame 12 includes the groove portion 12c, the effect of the thickness of the circuit component 15 on the overall thickness of the electronic device 10 can be reduced. That is, it may be advantageous for slimming the electronic device 10 .

The circuit component 15 is disposed between the middle frame 12 and the back cover 14. As an example, the circuit component 15 includes at least one circuit in which a driving unit (GDR, DDR, TC in FIG. 4) of the display panel 100, a host system for controlling the electronic device 10, a memory and a power supply unit, etc. are mounted. It may include a substrate and a battery.

In addition, although not shown in detail in FIG. 3 , the middle frame 12 may further include a hole for drawing out a flexible circuit board (not shown) connecting the display panel 100 and the circuit component 15 .

The back cover 14 may be made of materials such as plastic, metal, and glass.

Although not shown in detail in FIG. 3 , the back cover 14 is formed from a flat surface facing the flat cover part 11a of the transparent cover substrate 11 and a transparent cover substrate 11 from both sides of the minor edge (X-axis edge) of the flat surface. ) may include a side portion bent to the side.

Alternatively, unlike the illustration of FIG. 3 , the electronic device 10 may further include a side cover (not shown) disposed between the transparent cover substrate 11 and the back cover 14 .

FIG. 4 is a view illustrating a display panel and a driving unit of FIG. 2 . FIG. 5 is a diagram illustrating an example of an equivalent circuit corresponding to the sub-pixel area of FIG. 4 . FIG. 6 is a view showing an example of a cross section corresponding to a part of a display area in the display device of FIG. 3 .

As shown in FIG. 4 , the display panel 100 includes a display area AA where light for displaying an image is output, and a plurality of sub-pixel areas (SPA) arranged in the display area AA. and signal lines GL and DL connected to the plurality of sub-pixel areas SPA. The signal wires GL and DL of the display panel 100 transfer driving signals supplied from the panel driving units TC, GDR, and DDR to each sub-pixel area SPA.

When the display panel 100 displays a color image, each of the plurality of sub-pixel areas SPA emits light in a wavelength range corresponding to one color among a plurality of different colors. Here, the plurality of colors may include red, green, and blue. Alternatively, the plurality of colors may further include white. To this end, the display panel 100 may include a color filter (not shown).

The signal lines GL and DL of the display panel 100 include a gate line GL that transmits the scan signal SCAN of the gate driver GDR and a data signal VDATA of the data driver DDR. A data line DL may be included.

When the display panel 100 includes light emitting devices (not shown) corresponding to each sub-pixel area SPA, the display panel 100 includes first and second driving power sources VDD and VSS for driving the light emitting devices. ) may further include first and second driving power lines for transmitting.

The panel drivers TC, GDR, and DDR include a gate driver (GDR) connected to the gate line GL of the display panel 100 and a data driver connected to the data line DL of the display panel 100. A Data Driver (DDR) and a Timing Controller (TC) controlling driving timings of the gate driver (GDR) and the data driver (DDR).

The timing controller TC rearranges the digital video data RGB input from the outside according to the resolution of the display panel 100 and supplies the rearranged digital video data RGB' to the data driver DDR.

The timing controller TC determines the operation timing of the data driver DDR based on timing signals such as the vertical synchronization signal Vsync, the horizontal synchronization signal Hsync, the dot clock signal DCLK, and the data enable signal DE. A data control signal (DDC) for controlling and a gate control signal (GDC) for controlling the operation timing of the gate driver (GDR) are supplied.

The gate driver GDR sequentially supplies the scan signal SCAN to the plurality of gate lines GL during one frame period for displaying an image based on the gate control signal GDC. That is, the gate driver GDR supplies the scan signal SCAN to each gate line GL during each horizontal period corresponding to each gate line GL during one frame period. Here, the gate line GL may correspond to sub-pixel areas SPA disposed side by side in a horizontal direction among a plurality of sub-pixel areas SPA.

The data driver (DDR) converts the rearranged digital video data (RGB') into an analog data voltage based on the data control signal (DDC). The data driver DDR transmits data signals VDATA corresponding to sub-pixel areas SPA corresponding to each gate line GL during each horizontal period based on the rearranged digital video data RGB' to the data line. (DL).

As shown in FIG. 5 , each sub-pixel area SPA includes a light emitting element OLED and a pixel driving circuit (PDC) for supplying a driving signal to the light emitting element OLED.

For example, the pixel driving circuit PDC may include a driving transistor (DT), a switching transistor (ST), and a storage capacitor (Cst).

In addition, although not shown in FIG. 5 , each subpixel area SPA may further include a compensation circuit (not shown) for compensating for deterioration of at least one of the driving transistor DT and the light emitting element OLED. The compensation circuit may include at least one transistor (not shown) for sensing the degree of deterioration or supplying a reference power source (not shown).

The driving transistor DT includes a first driving power line VDDL supplying the first driving power supply VDD and a second driving power supply supplying the second driving power supply VSS having a lower potential than the first driving power supply VDD. It is arranged in series with the light emitting element OLED between the lines VSSL.

That is, one end of the driving transistor DT is connected to the first driving power line VDDL, and the other end of the driving transistor DT is connected to one end of the light emitting element OLED. And, the other end of the light emitting element OLED is connected to the second driving power supply line VSSL.

The switching transistor ST is disposed between the data line DL supplying the data signal VDATA of each sub-pixel area SPA and the first node ND1. The first node ND1 is a contact point between the gate electrode of the driving transistor DT and the switching transistor ST. Also, the gate electrode of the switching transistor ST is connected to the gate line GL.

The storage capacitor Cst is disposed between the first node ND1 and the second node ND2. The second node ND2 is a contact point between the driving transistor DT and the light emitting element OLED.

An operation of the pixel driving circuit (PDC) will be described below.

The switching transistor ST is turned on based on the scan signal SCAN of the gate line GL. At this time, the data signal VDATA of the data line DL is supplied to the gate electrode of the driving transistor DT and the storage capacitor Cst through the turned-on switching transistor ST and the first node ND1.

The storage capacitor Cst is charged with the data signal VDATA.

The driving transistor DT is turned on based on the data signal VDATA and the charging voltage of the storage capacitor Cst, thereby generating a driving current corresponding to the data signal VDATA. As a result, the driving current by the turned-on driving transistor DT can be supplied to the light emitting element OLED.

As shown in FIG. 6 , the display panel 100 includes a support substrate 110, a transistor array 120 disposed on the support substrate 110, a light emitting array 130 disposed on the transistor array 120, and an encapsulation film 140 disposed on the light emitting array 130 .

The support substrate 110 may be made of a flexible insulating material. For example, the support substrate 110 may include polyimide (PI), polycarbonate (PC), polyethyleneterephthalate (PET), polymethylpentene (PMP), polymethylmethacrylate (PMMA), polynorborneen (PNB), polyethylenapthanate (PEN), polyethersulfone (PES), and COS. (cycloolefin copolymer).

The transistor array 120 includes a pixel driving circuit (PDC in FIG. 5 ) corresponding to each of the plurality of sub-pixel areas SPA. As shown in FIG. 5 , the pixel driving circuit PDC is turned on and off based on the scanning signal of the driving transistor DT and the gate line GL connected to the light emitting device OLED, and the data line DL A switching transistor ST transmitting the data signal VDATA to a gate electrode of the driving transistor DT and a storage capacitor Cst connected to the gate electrode of the driving transistor DT may be included. The transistor array 120 further includes signal wires GL and DL connected to the pixel driving circuit PDC of each sub-pixel area SPC.

The transistor array 120 may further include a planarization layer 121 disposed on the support substrate 110 and flatly covering the pixel driving circuit PDC.

The light emitting array 130 may be disposed on the planarization layer 121 of the transistor array 120 .

The light emitting array 130 includes a light emitting element (ED; OLED in FIG. 5 ) corresponding to each of the plurality of sub-pixel areas SPA.

Each light emitting element ED may include a first electrode 131 and a second electrode 132 facing each other, and a light emitting structure 133 disposed between them.

For example, the light emitting array 130 is disposed on the planarization film 121 and the first electrode 131 corresponding to each sub-pixel area SPA is disposed on the planarization film 121 and corresponds to each sub-pixel area SPA. ) Corresponding to the outside of the bank 134 covering the edge of the first electrode 131, the light emitting structure 133 disposed on the first electrode 131, and on the bank 134 and the light emitting structure 133 It may include a second electrode 132 disposed thereon.

The sealing film 140 is disposed on the light emitting array 130 and seals the light emitting array 130 .

The sealing film 140 may have a structure in which a plurality of protective films 141, 142, and 143 having different insulating materials or different thicknesses are sequentially stacked.

For example, the plurality of protective films 141, 142, and 143 cover the second electrode 132 and are flatly disposed on the first protective film 141 made of an inorganic insulating material and the first protective film 141 made of an organic insulating material. and a third protective layer 143 disposed on the second protective layer 142 and made of an inorganic insulating material.

Due to the sealing film 140 , penetration of moisture or oxygen into the light emitting array 130 may be delayed, and the influence of foreign substances may be reduced.

The display panel 100 includes a touch electrode array 150 disposed on a sealing film 140, a polarizer 160 disposed on the touch electrode array 150, and a reinforcing substrate disposed under the support substrate 110 ( 170) may be further included.

The touch electrode array 150 is for touch sensing, and detects a position where a touch operation is performed in the display area AA by sensing an element that is changed by a touch.

For example, the touch electrode array 150 may include first and second touch electrodes that cross each other. In this case, the location where the touch operation occurred may be detected by detecting the location where the capacitance change occurred among the intersection points of the first and second touch electrodes.

The polarizer 160 may be provided to reduce reflection of external light in the display area AA.

The reinforcing substrate 170 is for increasing the rigidity of the display panel 100 and may be omitted depending on the material of the support substrate 110 .

The heat dissipation buffer substrate 200 may be fixed under the reinforcing substrate 170 through the adhesive layer 210 .

Meanwhile, the middle frame 12 of the housing 10b of the electronic device 10 is disposed between the display device 10a and the back cover 14.

FIG. 7 is a view showing a middle frame and an adhesive pattern of FIG. 2 .

As shown in FIG. 7, one surface of the middle frame 12 facing the transparent cover substrate 11 is disposed on the flat support 12a and the long axis edge (Y axis edge) of the flat support 12a, respectively. and includes a curved support portion 12b.

The middle frame 12 may further include a groove 12c disposed on the other surface facing the back cover 14 . The groove portion 12c may correspond to at least a portion of the flat support portion 12a.

When the middle frame 12 includes the groove portion 12c, the circuit component 15 can be accommodated easily and has advantages in slimming the electronic device.

The adhesive pattern 13 is for fixing the middle frame 12 below the display device 10a.

The adhesive pattern 13 is disposed within the curved surface support 12b of one surface of the middle frame 12 .

That is, the adhesive pattern 13 is not disposed on the flat support portion 12a of the middle frame 12 . In this way, the impact caused by the circuit component 15 disposed on the other surface of the middle frame 12 can be prevented from being aggravated by the adhesive pattern 13 .

Next, the heat dissipation buffer substrate 200 according to each embodiment of the present invention will be described.

8 is a view showing the heat dissipation buffer substrate of FIG. 3 according to the first embodiment of the present invention.

As shown in FIG. 8, the heat dissipation buffer substrate 200 according to the first embodiment EM1 of the present invention has a first region 200a facing the middle frame 12 and having a first thickness TH1 and and a second region 200b facing the adhesive pattern 13 disposed between the heat dissipation buffering substrate 200 and the middle frame 12 and having a second thickness TH2 smaller than the first thickness TH1. .

An adhesive pattern 13 is disposed in the second region 200b of the heat dissipation buffer substrate 200 . Therefore, for easy arrangement of the adhesive pattern 13, the width (200bW) of the second region 200b may be equal to or greater than the width (13W) of the adhesive pattern 13.

For example, the width 200bW of the second region 200b may be derived as a sum of the width 13W of the adhesive pattern 13 and a process error. Here, the process error may be 0.2 mm or more.

As mentioned above, the circuit component 15 has a relatively large weight and is disposed on a portion of the other surface of the middle frame 12 corresponding to the flat support portion 12a. Also, a predetermined gap (GAP) may be disposed between the middle frame 12 and the heat dissipation buffer substrate 200 . Therefore, when the relatively heavy circuit component 15 is shaken due to an external physical shock, a physical shock weighted by the weight of the circuit component 15 may be applied to the display panel 100 .

In order to prevent this, according to the first embodiment of the present invention, the first region 200a facing the flat support 12a of the middle frame 12 among the heat dissipation buffering substrate 200 is sufficient to relieve physical shock. It is made of a first thickness (TH1) of.

That is, since the shock absorbing power of the porous metal material 200 ′ constituting the heat radiation buffering substrate 200 corresponds to the volume of the air gap, the heat radiation buffering substrate 200 can provide shock absorbing power corresponding to the thickness. Therefore, the minimum value of the first thickness TH1 of the heat dissipation buffer substrate 200 is derived in consideration of the magnitude of physical impact applied to the flat display area FDA of the display panel 100 due to the circuit component 15 and the like. It can be.

In addition, since the overall thickness of the electronic device 10 increases as the first thickness TH1 of the heat dissipation buffer substrate 200 increases, the first thickness of the heat dissipation buffer substrate 200 is reduced in consideration of slimming of the electronic device 10. The maximum value of (TH1) can be derived.

For example, the first thickness TH1 may be in the range of 70 μm to 200 μm.

In addition, the adhesive pattern 13 is disposed on the curved support portion 12b of the middle frame 12 . Accordingly, the second area TH2 of the heat dissipation buffer substrate 200 facing the adhesive pattern 13 corresponds to at least a portion of the bending display area BDA of the display area AA.

For example, the thickness 13T of the adhesive pattern 13 may be in the range of 30 μm to 300 μm.

As the adhesive pattern 13 is disposed between the middle frame 12 and the heat dissipation buffer substrate 200, the thickness 13T of the adhesive pattern 13 is the distance between the middle frame 12 and the heat dissipation buffer substrate 200. (GAP). Therefore, the thickness 13T of the adhesive pattern 13 affects the overall thickness of the electronic device 10 .

However, according to the first embodiment EM1 of the present invention, the second area TH2 facing the adhesive pattern 13 of the heat dissipation buffer substrate 200 has a second thickness TH2 smaller than the first thickness TH1. ) is made up of Accordingly, since the gap (GAP) between the middle frame 12 and the heat dissipation buffer substrate 200 may be smaller than the thickness 13T of the adhesive pattern 13, the thickness 13T of the adhesive pattern 13 may be The effect on the overall thickness of the device 10 can be reduced.

Unlike the flat display area FDA of the display panel 100 , the bending display area BDA of the display panel 100 is relatively less affected by shock caused by shaking of the circuit component 15 . Therefore, even if the second thickness TH2 of the heat dissipation buffering substrate 200 is smaller than the first thickness TH1, the display panel 100 can be sufficiently protected.

For example, the second thickness TH2 of the heat dissipation buffer substrate 200 may be in a range of 50 μm or more and less than the first thickness TH1.

In addition, if the width at which the middle frame 12 is shaken by the physical impact is smaller than the gap (GAP) between the heat dissipation buffer substrate 200 and the middle frame 12, the gap between the heat dissipation buffer substrate 200 and the middle frame 12 (GAP) can be a factor in mitigating physical impact.

Therefore, it is necessary to maintain the gap (GAP) between the heat dissipation buffering substrate 200 and the middle frame 12 in consideration of the stiffness of the middle frame 12 . To this end, the difference THD between the first thickness TH1 and the second thickness TH2 may be 50% or more and less than 100% of the thickness 13T of the adhesive pattern 13 .

Alternatively, when the rigidity of the middle frame 12 is sufficient not to increase the physical impact, the difference THD between the first thickness TH1 and the second thickness TH2 is equal to the thickness 13T of the adhesive pattern 13 can be the same

As described above, according to the first embodiment of the present invention, the second region 200a corresponding to the adhesive pattern 13 of the heat dissipation buffer substrate 200 faces the flat support 12a of the middle frame 12. It is made of a smaller thickness than the first region 200a. Accordingly, since the gap (GAP) between the heat dissipation buffering substrate 200 and the middle frame 12 may be smaller than the thickness 13T of the adhesive pattern 13, slimming of the electronic device 10 may be further advantageous.

Further, according to the first embodiment of the present invention, the second region 200b of the heat dissipation buffer substrate 200 is not removed and is maintained at a second thickness TH2 smaller than the first thickness TH1. Therefore, it is advantageous for the slimming of the electronic device 10, physical shock mitigation and heat dissipation for the bending display area BDA of the display panel 100 can be performed, and the presence or absence of the heat dissipation buffering substrate 200 can be recognized. This can prevent display quality deterioration.

On the other hand, according to the first embodiment (EM1) shown in FIG. 8, the second area 200b of the heat dissipation buffer substrate 200 is the curved support portion 12b of the middle frame 12 among the edges of the heat dissipation buffer substrate 200. ) are placed on both edges corresponding to That is, the heat dissipation buffer substrate 200 according to the first embodiment (EM1) includes a second region 200b formed of a part adjacent to each long side corner and a first region 200a formed of the remaining part.

In this case, even if a process error occurs in alignment between the heat dissipation buffering substrate 200 and the adhesive pattern 13, it may be difficult to easily detect it.

To solve this problem, a second embodiment of the present invention is provided.

9 is a view showing a heat dissipation buffer substrate of FIG. 3 according to a second embodiment of the present invention.

As shown in FIG. 9, the second embodiment EM2 of the present invention is the same as the first embodiment of FIG. 8 except that the heat dissipation buffer substrate 200 further includes a third region 200c. Therefore, redundant description will be omitted below.

The heat dissipation buffer substrate 200 according to the second embodiment (EM2) of the present invention is disposed at both edges corresponding to the curved support parts 12b of the middle frame 12 among the edges of the heat dissipation buffer substrate 200 and has a first thickness A third region 200c made up of (TH1) is further included. That is, the second region 200b is disposed between the first region 200a and the third region 200c.

In this way, a process error in alignment between the heat dissipation buffering substrate 200 and the adhesive pattern 13 can be easily detected through whether or not the adhesive pattern 13 is positioned within the second region 200b.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope of the technical spirit of the present invention. Conventionally in the art to which the present invention belongs It will be clear to those who have knowledge of

10: electronic device AA: display area
10a: display device 10b: housing
100: display panel 200: heat dissipation buffer substrate
11: transparent cover substrate 12: middle frame
13: adhesive pattern 14: back cover
FDA: flat display area BDA: bending display area
15: circuit component
200 ': porous metal material 202: voids

Claims (15)

a display panel including a display area for outputting light for image display;
a heat dissipation buffer substrate disposed under the display panel and made of a porous metal material including a metal material and pores distributed in the metal material;
The heat dissipation buffer board
a first region facing the middle frame disposed under the heat dissipation buffer substrate and having a first thickness; and
and a second region facing the adhesive pattern disposed between the middle frame and the heat dissipation buffer substrate and having a second thickness smaller than the first thickness.
According to claim 1,
The porous metal material is made of copper,
A display device in which a distribution ratio of voids in the metal material to the total volume of the metal material is 50% to 76%.
According to claim 1,
The second thickness is in a range of 50 μm or more and less than the first thickness.
According to claim 3,
A difference between the first thickness and the second thickness is 50% or more of the thickness of the adhesive pattern.
According to claim 3,
The first thickness is in the range of 70 μm to 200 μm.
According to claim 2,
a transparent cover substrate disposed on the display panel and transmitting light of the display panel;
The transparent cover substrate
A flat cover portion of a flat shape; and
Including a curved cover portion disposed on each side of the flat cover portion,
One side of the middle frame facing the transparent cover substrate is
a flat support portion corresponding to the flat cover portion; and
A display device comprising a curved support portion corresponding to the curved cover portion and disposed on both sides of the flat support portion.
According to claim 6,
The display area of the display panel is
a flat display area disposed between the flat cover part and the flat support part;
A display device comprising a bending display area disposed between the curved surface cover part and the curved surface support part.
According to claim 6,
The adhesive pattern is disposed between the curved support and the heat dissipation buffer substrate.
According to claim 6,
A width of the second region of the heat dissipation buffering substrate is greater than or equal to a width of the adhesive pattern.
According to claim 9,
The second region is disposed at both edges of the middle frame corresponding to the curved support part among edges of the heat dissipation buffer substrate.
According to claim 9,
The heat dissipation buffer board
A third region disposed at both edges of the middle frame corresponding to the curved support portion among the edges of the heat dissipation buffering substrate and having the first thickness;
The second area is disposed between the first area and the third area.
a display panel including a display area outputting light for displaying an image;
a heat dissipation buffer substrate disposed under the display panel and made of a porous metal material including a metal material and pores distributed in the metal material;
a middle frame disposed under the heat dissipation buffer substrate;
a transparent cover substrate disposed on the display panel and transmitting light of the display panel; and
A back cover disposed below the middle frame and coupled to the transparent cover substrate;
The heat dissipation buffer substrate may include a first region facing the middle frame and having a first thickness; and a second region facing the adhesive pattern disposed between the middle frame and the heat dissipation buffer substrate and having a second thickness smaller than the first thickness;
The display panel, the heat dissipation buffer substrate, and the middle frame are accommodated between the transparent cover substrate and the back cover.
According to claim 12,
A width of the second region of the heat-absorbing substrate is greater than or equal to a width of the adhesive pattern.
According to claim 12,
The second region is disposed at both corners of the middle frame among edges of the heat dissipation buffer substrate.
According to claim 12,
The heat dissipation buffer board
A third region disposed at both edges of the middle frame among edges of the heat dissipation buffer substrate and having the first thickness;
The second area is disposed between the first area and the third area.

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