KR102497187B1 - Organic Emitting Light Display device having an organic insulating layer - Google Patents

Abstract

The present invention relates to an organic light emitting display device including an organic insulating film containing an organic material, wherein an organic insulating film such as an overcoat layer, a bank insulating film, and a capping layer extends onto a non-display area of a lower substrate, and A technical feature is that the organic insulating film contacts an encapsulation layer containing a hygroscopic material on a non-display area to block a moisture permeation path by the organic insulating film.

Description

Organic light emitting display device having an organic insulating layer

The present invention relates to an organic light emitting display device including at least one organic insulating layer for insulating adjacent components.

In general, electronic devices such as monitors, TVs, laptops, digital cameras, and the like include display devices for realizing images. For example, the display device may include a liquid crystal display device and an organic light emitting display device.

The organic light emitting diode display may include a plurality of pixel areas. A light emitting structure may be positioned on each pixel area. For example, the light emitting structure may include a lower light emitting electrode, a light emitting layer, and an upper light emitting electrode sequentially stacked.

The light emitting layer may be very vulnerable to moisture. Accordingly, the manufacturing method of the organic light emitting diode display may include an encapsulation process to prevent penetration of external moisture. For example, the manufacturing method of the organic light emitting diode display includes forming an upper passivation layer containing an inorganic material on a light emitting structure and attaching an upper substrate to a lower substrate on which the upper passivation layer is formed by using an encapsulation layer. can do.

The organic light emitting diode display may include at least one organic insulating layer. For example, a bank insulating layer including an mn organic material may be positioned between lower light emitting electrodes of light emitting structures positioned in adjacent pixel regions. The organic insulating layer may be formed by a deposition process using a mask. In the deposition process, a deposition shadow may be generated due to deformation of a mask or the like. For example, the organic insulating layer may include a tail region formed outside a display region in which a plurality of pixel regions are located. Accordingly, the tail region of the organic insulating layer may not be completely covered by the upper passivation layer. Accordingly, in the organic light emitting diode display, the tail region of the organic insulating layer acts as a moisture transmission path.

In addition, the organic insulating layer may be formed relatively thick for high insulating properties. Step coverage of the upper passivation layer including an inorganic material may be relatively low. Accordingly, air bubbles may be generated in the stepped region by the organic insulating layer. Therefore, in the organic light emitting display device, there is a problem in that air bubbles generated by the organic insulating layer act as a moisture permeation path.

An object to be solved by the present invention is to provide an organic light emitting display device capable of blocking a moisture permeation path by an organic insulating layer.

Another object to be solved by the present invention is to provide an organic light emitting display device capable of preventing an organic insulating layer extending onto a non-display area of a lower substrate from acting as a moisture permeation path.

Another problem to be solved by the present invention is to provide an organic light emitting display device capable of preventing generation of air bubbles by an organic insulating layer.

The problems to be solved by the present invention are not limited to the aforementioned problems. Subjects not mentioned herein will become clear to those skilled in the art from the following description.

An organic light emitting display device according to the technical idea of the present invention for achieving the above object includes a lower substrate. The lower substrate includes a display area and a non-display area. The non-display area is positioned outside the display area. A light emitting structure is positioned on the display area of the lower substrate. The light emitting structure includes a lower light emitting electrode, a light emitting layer, and an upper light emitting electrode stacked in order. An edge of the lower light emitting electrode is covered by the first region of the bank insulating film. The bank insulating layer includes a second region overlapping the non-display region of the lower substrate. An encapsulation layer is positioned on the light emitting structure and the bank insulating film. The encapsulation layer includes a hygroscopic material. An upper substrate is positioned on the encapsulation layer. An upper surface of the second region of the bank insulating film facing the upper substrate is in contact with the encapsulation layer.

A side surface of the bank insulating layer facing a side surface of the lower substrate may be vertically aligned with a side surface of the encapsulation layer.

A capping layer may be positioned between the light emitting structure and the encapsulation layer. The capping layer may include an organic material. The encapsulation layer may contact an upper surface of the capping layer facing the upper substrate.

A side of the capping layer facing the side of the lower substrate may be located on the display area of the lower substrate.

An overcoat layer may be positioned between the lower substrate and the light emitting structure. The overcoat layer may include an organic material. The overcoat layer may extend between the non-display area of the lower substrate and the second area of the bank insulating layer.

A side surface of the overcoat layer facing a side surface of the lower substrate may be vertically aligned with a side surface of the encapsulation layer.

An organic light emitting display device according to the technical idea of the present invention for achieving another object to be solved by the present invention includes a lower substrate. The lower substrate includes a display area and a non-display area. The non-display area is positioned outside the display area. An upper substrate is positioned on the display area and the non-display area of the lower substrate. An encapsulation layer is positioned between the lower substrate and the upper substrate. The encapsulation layer includes a hygroscopic material. A first organic insulating film is positioned between the lower substrate and the encapsulation layer. The first organic insulating layer includes an organic material. An upper passivation layer is positioned between the first organic insulating layer and the encapsulation layer. The upper passivation layer includes an inorganic material. A side of the upper passivation layer facing the side of the lower substrate is positioned on the display area of the lower substrate.

On the non-display area of the lower substrate, the encapsulation layer may directly contact the first organic insulating layer.

A second organic insulating layer may be positioned between the display area of the lower substrate and the first organic insulating layer. The second organic insulating layer may extend between the non-display area of the lower substrate and the first organic insulating layer. The second organic insulating layer may include an organic material. An organic material of the second organic insulating film may be different from that of the first organic insulating film.

On the non-display area of the lower substrate, a side surface of the second organic insulating layer may be continuous with a side surface of the first organic insulating layer.

A light emitting structure may be positioned between the first organic insulating layer and the second organic insulating layer. The light emitting structure may overlap the display area of the lower substrate. The light emitting structure may include a lower light emitting electrode, a light emitting layer, and an upper light emitting electrode sequentially stacked. The second organic insulating layer may cover an edge of the lower light emitting electrode.

On the non-display area of the lower substrate, the first organic insulating layer may contact an upper surface of the second organic insulating layer facing the upper substrate.

A third organic insulating layer may be positioned between the lower substrate and the light emitting structure. The third organic insulating layer may include an organic material. The third organic insulating layer may extend between the non-display area of the lower substrate and the second organic insulating layer.

An organic material of the third organic insulating film may be different from that of the second organic insulating film.

On the non-display area of the lower substrate, a side surface of the third organic insulating layer may be continuous with a side surface of the second organic insulating layer.

An organic light emitting display device according to the technical idea of the present invention for achieving another object to be solved by the present invention includes an upper substrate positioned on a lower substrate. A light emitting structure is positioned between the lower substrate and the upper substrate. The light emitting structure includes a lower light emitting electrode, a light emitting layer, and an upper light emitting electrode stacked in order. An upper passivation layer is positioned between the light emitting structure and the upper substrate. The upper passivation layer includes an inorganic material. An overcoat layer is positioned between the lower substrate and the light emitting structure. The overcoat layer extends outwardly of the upper protective film. An encapsulation layer is positioned between the upper passivation layer and the upper substrate. The encapsulation layer contacts the overcoat layer on the outside of the upper protective film. The encapsulation layer includes a hygroscopic material.

An edge of the lower light emitting electrode may be covered by a bank insulating layer. The bank insulating layer may extend outward from the upper passivation layer. A side surface of the bank insulating layer outside the upper passivation layer may be positioned between a side surface of the overcoat layer and a side surface of the upper passivation layer.

The encapsulation layer may contact the side surface of the overcoat layer from the outside of the upper protective film.

A capping layer may be positioned between the light emitting structure and the upper passivation layer. The capping layer may extend outward of the upper passivation layer. On the outside of the upper passivation layer, the capping layer may contact the encapsulation layer.

A side surface of the bank insulating layer outside the upper passivation layer may be positioned between a side surface of the overcoat layer and a side surface of the capping layer.

An organic light emitting display device according to the technical concept of the present invention may block a moisture permeation path by an organic insulating layer by using an encapsulation layer containing a moisture absorbing material. Accordingly, in the organic light emitting diode display according to the technical idea of the present invention, damage to the light emitting structure due to external moisture can be minimized. Accordingly, lifespan and reliability of the organic light emitting display device according to the technical concept of the present invention may be improved.

1 is a diagram schematically illustrating an organic light emitting display device according to an exemplary embodiment of the present invention.
2 to 14 are views illustrating an organic light emitting display device according to another exemplary embodiment of the present invention.

The above objects and technical configurations of the present invention and details of the operation and effect thereof will be more clearly understood by the following detailed description with reference to the drawings illustrating the embodiments of the present invention. Here, since the embodiments of the present invention are provided to sufficiently convey the technical spirit of the present invention to those skilled in the art, the present invention may be embodied in other forms so as not to be limited to the embodiments described below.

Also, parts denoted by the same reference numerals throughout the specification mean the same components, and the length and thickness of a layer or region in the drawings may be exaggerated for convenience. In addition, when a first component is described as being “on” a second component, the first component is not only located on the upper side in direct contact with the second component, but also the first component and the second component. A case where the third component is located between the second components is also included.

Here, terms such as first and second are used to describe various components, and are used for the purpose of distinguishing one component from another. However, the first component and the second component may be named arbitrarily according to the convenience of those skilled in the art within the scope of the technical idea of the present invention.

Terms used in the specification of the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. For example, a component expressed in the singular number includes a plurality of components unless the context clearly indicates only the singular number. In addition, in the specification of the present invention, terms such as "comprise" or "having" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or It should be understood that it does not preclude the possibility of the presence or addition of more other features, numbers, steps, operations, components, parts, or combinations thereof.

In addition, unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the specification of the present invention, in an ideal or excessively formal meaning. not interpreted

(Example)

1 is a diagram schematically illustrating an organic light emitting display device according to an exemplary embodiment of the present invention.

Referring to FIG. 1 , an organic light emitting display device according to an exemplary embodiment of the present invention includes a lower substrate 100, an upper substrate 200, a thin film transistor 300, an overcoat layer 400, a light emitting structure 500, and a bank. An insulating film 600 and an encapsulation layer 700 may be included.

The lower substrate 100 may support the thin film transistor 300 and the light emitting structure 500 . The lower substrate 100 may include a display area AA and a non-display area NA. The non-display area NA may be located outside the display area AA. For example, the non-display area NA may be located close to the side surface 100e of the lower substrate 100 .

The lower substrate 100 may include an insulating material. The lower substrate 100 may include a transparent material. For example, the lower substrate 100 may include glass or plastic.

The upper substrate 200 may be positioned on the lower substrate 100 . For example, the upper substrate 200 may be positioned on the display area AA and the non-display area NA of the lower substrate 100 . An area of the upper substrate 200 may be smaller than that of the lower substrate 100 . For example, a side surface of the upper substrate 200 may be positioned on the non-display area NA of the lower substrate 100 .

The upper substrate 200 may include an insulating material. The upper substrate 200 may include a material different from that of the lower substrate 100 . The rigidity of the upper substrate 200 may be greater than that of the lower substrate 100 . For example, the upper substrate 200 may include a metal such as aluminum (Al) or copper (Cu).

The thin film transistor 300 may be positioned between the lower substrate 100 and the upper substrate 200 . For example, the thin film transistor 300 may be positioned on the display area AA of the lower substrate 100 .

In the organic light emitting diode display according to the exemplary embodiment of the present invention, the thin film transistor 300 contacts the lower substrate 100 . However, the organic light emitting diode display according to another embodiment of the present invention may further include a buffer layer positioned between the lower substrate 100 and the thin film transistor 300 . The buffer layer may include an insulating material. For example, the buffer layer may include silicon oxide or silicon nitride.

The thin film transistor 300 may include a semiconductor pattern 310 , a gate insulating layer 320 , a gate electrode 330 , an interlayer insulating layer 340 , a source electrode 350 and a drain electrode 360 .

The semiconductor pattern 310 may include a semiconductor material. For example, the semiconductor pattern 310 may include amorphous silicon or polycrystalline silicon. The semiconductor pattern 310 may be an oxide semiconductor. For example, the semiconductor pattern 310 may include IGZO.

The semiconductor pattern 310 may include a source region, a drain region, and a channel region. The channel region may be positioned between the source region and the drain region. Conductivity of the channel region may be lower than conductivities of the source region and conductivities of the drain region. For example, the source region and the drain region may include conductive impurities.

The gate insulating layer 320 may be positioned on the semiconductor pattern 310 . A size of the gate insulating layer 320 may be smaller than that of the semiconductor pattern 310 . For example, the gate insulating layer 320 may vertically overlap the channel region of the semiconductor pattern 310 .

The gate insulating layer 320 may include an insulating material. For example, the gate insulating layer 320 may include silicon oxide and/or silicon nitride. The gate insulating layer 320 may include a high-K material. For example, the gate insulating layer 320 may include hafnium oxide (HfO) or titanium oxide (TiO). The gate insulating layer 320 may have a multi-layer structure.

The gate electrode 330 may be positioned on the gate insulating layer 320 . The gate insulating layer 320 may insulate between the semiconductor pattern 310 and the gate electrode 330 . The gate electrode 330 may vertically overlap the channel region of the semiconductor pattern 310 . For example, a side surface of the gate insulating layer 320 may be vertically aligned with a side surface of the gate electrode 330 . The gate insulating layer 320 may include a side surface continuous with a side surface of the gate electrode 330 .

The gate electrode 330 may include a conductive material. For example, the gate electrode 330 may include a metal such as aluminum (Al), chromium (Cr), molybdenum (Mo), or tungsten (W).

The interlayer insulating layer 340 may be positioned between the semiconductor pattern 310 and the gate electrode 330 . The interlayer insulating layer 340 may extend in an outward direction of the semiconductor pattern 310 . A side surface of the semiconductor pattern 310 may be covered by the interlayer insulating layer 340 . For example, a side surface of the interlayer insulating layer 340 facing the side surface 100e of the lower substrate 100 is a boundary between the display area AA and the non-display area NA of the lower substrate 100. can be vertically aligned with

The interlayer insulating layer 340 may include an insulating material. For example, the interlayer insulating layer 340 may include silicon oxide and/or silicon nitride. The interlayer insulating film 340 may have a multilayer structure.

The source electrode 350 may be positioned on the interlayer insulating layer 340 . For example, the source electrode 350 may vertically overlap the source region of the semiconductor pattern 310 . The source electrode 350 may be electrically connected to the source region of the semiconductor pattern 310 . For example, the interlayer insulating layer 340 may include a contact hole exposing the source region of the semiconductor pattern 310 .

The source electrode 350 may include a conductive material. For example, the source electrode 350 may include a metal such as aluminum (Al), chromium (Cr), molybdenum (Mo), or tungsten (W). The source electrode 350 may include a material different from that of the gate electrode 330 .

The drain electrode 360 may be positioned on the interlayer insulating layer 340 . For example, the drain electrode 360 may vertically overlap the drain region of the semiconductor pattern 310 . The drain electrode 360 may be spaced apart from the source electrode 350 . The drain electrode 360 may be electrically connected to the drain region of the semiconductor pattern 310 . For example, the interlayer insulating layer 340 may include a contact hole exposing the drain region of the semiconductor pattern 310 .

The drain electrode 360 may include a conductive material. For example, the drain electrode 360 may include a metal such as aluminum (Al), chromium (Cr), molybdenum (Mo), or tungsten (W). The drain electrode 360 may include a material different from that of the gate electrode 330 . For example, the drain electrode 360 may include the same material as the source electrode 350 .

An organic light emitting diode display according to an exemplary embodiment of the present invention is described as including the thin film transistor 300 in which the semiconductor pattern 310 is located close to the lower substrate 100 . However, in the organic light emitting diode display according to another embodiment of the present invention, the semiconductor pattern 310 may include the thin film transistor 300 positioned between the gate electrode 330, the source electrode 350, and the drain electrode 360. can

The overcoat layer 400 may be positioned on the thin film transistor 300 . The overcoat layer 400 may remove a step caused by the thin film transistor 300 . For example, an upper surface of the overcoat layer 400 facing the upper substrate 200 may be a flat surface. The top surface of the overcoat layer 400 may be parallel to the surface of the lower substrate 100 .

The overcoat layer 400 may extend along the interlayer insulating layer 340 . For example, the side surface of the overcoat layer 400 facing the side surface 100e of the lower substrate 100 is between the display area AA and the non-display area NA of the lower substrate 100. It can be located close to the border.

The overcoat layer 400 may include an insulating material. For example, the overcoat layer 400 may be an organic insulating layer containing an organic material.

In the organic light emitting diode display according to the exemplary embodiment of the present invention, the overcoat layer 400 directly contacts the thin film transistor 300 . However, the organic light emitting diode display according to another embodiment of the present invention may further include a lower passivation layer positioned between the thin film transistor 300 and the overcoat layer 400 . The lower passivation layer may include an inorganic material. The lower passivation layer may have a multi-layer structure.

The light emitting structure 500 may generate light implementing a specific color. For example, the light emitting structure 500 may include a lower light emitting electrode 510, a light emitting layer 520, and an upper light emitting electrode 530 sequentially stacked. The light emitting structure 500 may be positioned on the overcoat layer 400 . The light emitting structure 500 may be controlled by the thin film transistor 300 . For example, the lower light emitting electrode 510 of the light emitting structure 500 may be electrically connected to the drain electrode 360 of the thin film transistor 300 . The overcoat layer 400 may include a contact hole exposing the drain electrode 360 .

The lower light emitting electrode 510 may include a conductive material. The lower light emitting electrode 510 may include a transparent material. For example, the lower light emitting electrode 510 may include ITO or IZO.

The light emitting layer 520 may generate light having a luminance corresponding to a voltage difference between the lower light emitting electrode 510 and the upper light emitting electrode 530 . Light generated by the light emitting layer 520 may implement a specific color. For example, the light emitting layer 520 may generate light implementing one of red, green, blue, and white. Light emitting structures 500 located in adjacent pixel areas may implement different colors. For example, the light emitting layers 520 of each pixel area may be separated from each other.

The light emitting layer 520 may include an emitting material layer (EML) including a light emitting material. The light-emitting material may be an organic material. The light emitting layer 520 may have a multilayer structure for high light emitting efficiency. For example, the light emitting layer 520 may include a hole injection layer (HIL), a hole transporting layer (HTL), an electron transporting layer (ETL), and an electron injection layer (EIL). ), at least one of which may be further included.

The upper light emitting electrode 530 may include a conductive material. The upper light emitting electrode 530 may include a material different from that of the lower light emitting electrode 510 . For example, the upper light emitting electrode 530 may include a metal such as aluminum (Al). The reflectance of the upper light emitting electrode 530 may be higher than that of the lower light emitting electrode 510 .

In the organic light emitting diode display according to the embodiment of the present invention, it is described that the upper substrate 200 and the upper light emitting electrode 530 of the light emitting structure 500 include metal. However, in the organic light emitting diode display according to another embodiment of the present invention, light generated by the light emitting layer 520 of the light emitting structure 500 may be emitted toward the upper substrate 200 . For example, in an organic light emitting diode display according to another embodiment of the present invention, the upper substrate 200 and the upper light emitting electrode 530 may include a transparent material.

The bank insulating layer 600 may insulate between light emitting structures 500 in adjacent pixel areas. For example, the bank insulating layer 600 may cover an edge of the lower light emitting electrode 510 . In each pixel area, a side surface of the emission layer 520 may be positioned on the bank insulating layer 600 . The upper light emitting electrode 530 may extend over the light emitting layer 520 and the bank insulating layer 600 .

The bank insulating layer 600 may extend onto the non-display area NA of the lower substrate 100 . For example, the bank insulating layer 600 may include a first area 601 covering an edge of the lower light emitting electrode 510 and a second area vertically overlapping the non-display area NA of the lower substrate 100 . area 602 . A side surface of the interlayer insulating layer 340 facing the side surface 100e of the lower substrate 100 and a side surface of the overcoat layer 400 may contact the bank insulating film 600 .

The bank insulating layer 600 may include an insulating material. For example, the bank insulating layer 600 may be an organic insulating layer containing an organic material. The organic material of the bank insulating layer 600 may be different from that of the overcoat layer 400 . For example, the bank insulating layer 600 may include one of benzocyclobutene (BCB), poly-imide, and photo-acryl.

In the organic light emitting diode display according to the exemplary embodiment of the present invention, the bank insulating layer 600 that is an organic insulating layer may extend onto the non-display area NA of the lower substrate 100 . Accordingly, in the organic light emitting diode display according to the exemplary embodiment of the present invention, a level difference due to the organic insulating layer may be greatly reduced. Therefore, in the organic light emitting diode display according to the exemplary embodiment of the present invention, air bubbles may not be generated in the stepped region formed by the organic insulating layer.

The encapsulation layer 700 may be positioned between the light emitting structure 500 and the upper substrate 200 . The encapsulation layer 700 may extend onto the non-display area NA of the lower substrate 100 . For example, the encapsulation layer 700 may extend between the second region 602 of the bank insulating layer 600 and the upper substrate 200 . The light emitting structure 500 may be surrounded by the encapsulation layer 700 .

The encapsulation layer 700 may include an adhesive material. The upper substrate 200 may directly contact the encapsulation layer 700 . For example, the upper substrate 200 may be combined with the lower substrate 100 on which the light emitting structure 500 and the bank insulating layer 600 are formed by the encapsulation layer 700 .

The size of the encapsulation layer 700 may be smaller than that of the upper substrate 200 . For example, the side surface of the upper substrate 200 may be positioned between the side surface 100e of the lower substrate 100 and the side surface of the encapsulation layer 700 . A side surface of the bank insulating layer 600 facing the side surface 100e of the lower substrate 100 may be vertically aligned with a side surface of the encapsulation layer 700 . The bank insulating film 500 may include a side surface continuous with a side surface of the encapsulation layer 700 .

The encapsulation layer 700 may directly contact the bank insulating layer 600 on the non-display area NA of the lower substrate 100 . For example, an upper surface of the second region 602 of the bank insulating layer 600 facing the upper substrate 200 may contact the encapsulation layer 700 . The encapsulation layer 700 may include a moisture absorbing material 710 . Accordingly, in the organic light emitting diode display according to the exemplary embodiment of the present invention, moisture moving through the second region 602 of the bank insulating layer 600 is collected by the hygroscopic material 710 of the encapsulation layer 700. It can be. Therefore, in the organic light emitting diode display according to the exemplary embodiment of the present invention, the bank insulating layer 600 extending onto the non-display area NA of the lower substrate 100 may be prevented from acting as a moisture transmission path.

The moisture absorption rate of the encapsulation layer 700 may be higher than the moisture vapor transmission rate of the bank insulating layer 600 . Accordingly, in the organic light emitting diode display according to the exemplary embodiment of the present invention, a moisture permeation path by the bank insulating layer 600 may be effectively blocked.

The hygroscopic material 710 may include a metal powder such as alumina, a metal oxide, a metal salt, or a mixture thereof. For example, the hygroscopic material 710 may include lithium oxide (LiO), sodium oxide (NaO), barium oxide (BaO), calcium oxide (CaO), or magnesium oxide (MgO). For example, the hygroscopic material 710 may include lithium sulfate (LiSO), sodium sulfate (NaSO), calcium sulfate (CaSO), magnesium sulfate (MgSO), cobalt sulfate (CoSO), gallium sulfate (GaSO), titanium sulfate ( TiSO), nickel sulfate (NiSO), calcium chloride (CaCl), sodium chloride (MgCl), strontium chloride (SrCl), yttrium chloride (YCl), copper chloride (CuCl), cesium fluoride (CsF), fluoride Tantalum (TaF), niobium fluoride (NbF), lithium bromide (LiBr), calcium bromide (CaBr), cesium bromide (CeBr), selenium bromide (SeBr), vanadium bromide (VBr), magnesium bromide (MgBr), barium iodide ( BaI), a metal halide such as magnesium iodide (MgI), and a metal chlorate such as barium perchlorate (BaClO) and magnesium perchlorate (MgClO).

An organic light emitting display device according to an embodiment of the present invention includes a capping layer 800 positioned between a light emitting structure 500 and an encapsulation layer 700 and a capping layer 800 positioned between the capping layer 800 and the encapsulation layer 700. An upper passivation layer 900 may be further included. The capping layer 800 and the upper protective layer 900 may prevent damage to the light emitting structure 500 due to moisture or foreign substances. The upper passivation layer 900 may include a material different from that of the capping layer 800 . For example, the capping layer 800 may be an organic insulating layer containing an organic material. The upper passivation layer 900 may be an inorganic insulating layer containing an inorganic material. The capping layer 800 may be covered by the upper passivation layer 900 . For example, a side surface of the capping layer 800 may directly contact the upper passivation layer 900 .

In the organic light emitting diode display according to an embodiment of the present invention, the upper passivation layer 900 including an inorganic material is positioned between the capping layer 800 including an organic material and the encapsulation layer 700 including a moisture absorbing material. do. However, as shown in FIG. 2 , in an organic light emitting diode display according to another embodiment of the present invention, the upper surface of the capping layer 800 facing the upper substrate 200 may directly contact the encapsulation layer 700. . Accordingly, in the organic light emitting diode display according to another exemplary embodiment of the present invention, a moisture permeation path by the organic insulating layer is blocked, and a process of forming the upper passivation layer 900 may be omitted. Accordingly, lifespan, reliability, and production efficiency of the organic light emitting display device according to another embodiment of the present invention may be improved.

In the organic light emitting diode display according to the embodiment of the present invention, the side of the bank insulating layer 600 facing the side 100e of the lower substrate 100 is vertically aligned with the side of the encapsulation layer 700 . However, in the organic light emitting diode display according to another embodiment of the present invention, the encapsulation layer 700 on the non-display area NA of the lower substrate 100 may not be continuous with the side surface of the bank insulating film 600 . For example, in an organic light emitting diode display according to another embodiment of the present invention, as shown in FIG. 3 , the side of the bank insulating film 600 facing the side 100e of the lower substrate 100 is the encapsulation layer 700. can be covered by For example, in an organic light emitting diode display according to another embodiment of the present invention, as shown in FIG. 4 , the bank insulating film 600 is disposed between the side surface 100e of the lower substrate 100 and the side surface of the encapsulation layer 700. It may include the side located on. Therefore, in the organic light emitting diode display according to another embodiment of the present invention, a process margin of an encapsulation process may increase.

In the organic light emitting diode display according to the exemplary embodiment of the present invention, the bank insulation layer 600 contacts the encapsulation layer 700 on the non-display area NA of the lower substrate 100 . However, as shown in FIGS. 5 and 6 , in the organic light emitting diode display according to another embodiment of the present invention, the overcoat layer 400 is formed on the encapsulation layer 700 on the non-display area NA of the lower substrate 100. can come into contact with The overcoat layer 400 may include an organic material. The encapsulation layer 700 may include a hygroscopic material. For example, in an organic light emitting diode display according to another embodiment of the present invention, as shown in FIG. ) can be vertically aligned with the side of For example, in an organic light emitting diode display according to another embodiment of the present invention, as shown in FIG. 6 , the side surface of the overcoat layer 400 facing the side surface 100e of the lower substrate 100 is the encapsulation layer 700. ) can be covered by Therefore, in the organic light emitting diode display according to another embodiment of the present invention, the moisture permeation path by the organic insulating layer can be effectively blocked.

In the organic light emitting diode display according to the exemplary embodiment of the present invention, only the bank insulating layer 600 extends onto the non-display area NA of the lower substrate 100 . However, as shown in FIGS. 7 and 8 , in the organic light emitting diode display according to another embodiment of the present invention, the overcoat layer 400 and the bank insulating layer 600 are formed on the lower substrate 100 on the non-display area NA. can be extended to A side surface of the overcoat layer 400 facing the side surface 100e of the lower substrate 100 may be vertically aligned with a side surface of the encapsulation layer 700 . For example, in an organic light emitting diode display according to another embodiment of the present invention, as shown in FIG. 7 , the side of the bank insulating film 600 facing the side 100e of the lower substrate 100 is It may be continuous with the side surface of the overcoat layer 400 facing the side surface 100e. For example, in an organic light emitting diode display according to another embodiment of the present invention, as shown in FIG. 8 , the side of the bank insulating film 600 facing the side 100e of the lower substrate 100 is the encapsulation layer 700. can be covered by Therefore, in the organic light emitting diode display according to another embodiment of the present invention, generation of air bubbles by the overcoat layer 400 and the bank insulating layer 600 can be effectively prevented.

In the organic light emitting diode display according to example embodiments, the bank insulation layer 600 and/or the overcoat layer 400 extend onto the non-display area NA of the lower substrate 100 . However, the organic light emitting diode display according to another embodiment of the present invention may include a capping layer 800 directly contacting the encapsulation layer 700 outside the upper passivation layer 900 . For example, as shown in FIG. 9 , in an organic light emitting diode display according to another embodiment of the present invention, a capping layer directly contacts the lower substrate 100 and the encapsulation layer 700 outside the upper passivation layer 900 . (800). Accordingly, in the organic light emitting diode display according to another embodiment of the present invention, generation of air bubbles due to a step in the organic insulating layer may be prevented, and a moisture permeation path by the organic insulating layer may be blocked.

In the organic light emitting diode display according to another embodiment of the present invention, the side of the capping layer 800 facing the side 100e of the lower substrate 100 is continuous with the side of the encapsulation layer 700 . However, the organic light emitting diode display according to another embodiment of the present invention may include an encapsulation layer 700 contacting the lower substrate 100 outside the capping layer 800 . For example, as shown in FIG. 10 , in the organic light emitting diode display according to another embodiment of the present invention, the capping layer 800 is positioned on the non-display area NA of the lower substrate 100 in a tail area. (800t). Accordingly, in the organic light emitting diode display according to another embodiment of the present invention, the capping layer 800 may be formed in a conventional manner. Therefore, in the organic light emitting diode display according to another embodiment of the present invention, the degree of freedom in the formation process of the capping layer 800 can be improved.

In the organic light emitting diode display according to another embodiment of the present invention, the capping layer 800 contacts the non-display area NA of the lower substrate 100 . However, in the organic light emitting diode display according to another embodiment of the present invention, another organic insulating layer may extend between the non-display area NA of the lower substrate 100 and the capping layer 800 . For example, in an organic light emitting diode display according to another embodiment of the present invention, as shown in FIG. 11 , the side surface of the overcoat layer 400 facing the side surface 100e of the lower substrate 100 is the encapsulation layer ( 700) may be vertically aligned with the sides. The overcoat layer 400 may contact the encapsulation layer 700 on the non-display area NA of the lower substrate 100 . For example, the encapsulation layer 700 may cover the side surface of the capping layer 800 facing the side surface 100e of the lower substrate 100 . For example, in an organic light emitting diode display according to another embodiment of the present invention, as shown in FIG. 12 , the bank insulating layer 600 may extend onto the non-display area NA of the lower substrate 100. . Therefore, in the organic light emitting diode display according to another embodiment of the present invention, generation of air bubbles due to a step in the organic insulating layer can be effectively prevented.

In the organic light emitting diode display according to example embodiments, some of the organic insulating layers extend onto the non-display area NA of the lower substrate 100 . However, in the organic light emitting diode display according to another embodiment of the present invention, all of the organic insulating layers may extend onto the non-display area NA of the lower substrate 100 . For example, as shown in FIG. 13 , in an organic light emitting diode display according to another embodiment of the present invention, an overcoat layer 400, a bank insulating layer 600, and a capping layer 800 each include an encapsulation layer 700 ) may include a side surface vertically aligned with the side surface of the For example, as shown in FIG. 14 , in an organic light emitting diode display according to another embodiment of the present invention, an overcoat layer 400, a bank insulating layer 600, and a capping layer 800 are formed on the lower substrate 100. It may have a step shape on the non-display area NA of . Accordingly, in the organic light emitting diode display according to another embodiment of the present invention, the overcoat layer 400, the bank insulating layer 600, and the capping layer 800 are an encapsulation layer on the non-display area NA of the lower substrate 100. (700) can be contacted. Therefore, in the organic light emitting diode display according to another embodiment of the present invention, the moisture permeation path by the organic insulating layer can be effectively blocked.

As a result, in the organic light emitting diode display according to embodiments of the present invention, at least one of the organic insulating layers such as the overcoat layer 400, the bank insulating layer 600, and the capping layer 800 covers the non-display area of the lower substrate 100 ( NA), and the encapsulation layer 700 including the hygroscopic material 710 may directly contact at least one of the organic insulating layers on the non-display area NA of the lower substrate 100 . Accordingly, in the organic light emitting diode display according to the exemplary embodiments of the present invention, a level difference due to the thickness of the organic insulating film is reduced, and moisture permeation by the organic insulating film extending onto the non-display area NA of the lower substrate 100 is blocked. can Therefore, the lifespan and reliability of the organic light emitting diode display according to the exemplary embodiments of the present invention may be improved.

100: lower substrate 200: upper substrate
300: thin film transistor 400: overcoat layer
500: light emitting structure 600: bank insulating film
700: encapsulation layer 800: capping layer
900: upper protective film

Claims (20)

delete delete delete delete delete delete ◈Claim 7 was abandoned when the registration fee was paid.◈ a lower substrate including a display area and a non-display area positioned outside the display area;
an upper substrate positioned on the display area and the non-display area of the lower substrate;
an encapsulation layer positioned between the lower substrate and the upper substrate;
a hygroscopic material dispersed in the encapsulation layer;
a first organic insulating film positioned between the lower substrate and the encapsulation layer and containing an organic material;
a light emitting structure disposed between the lower substrate and the first organic insulating layer and including a lower light emitting electrode, a light emitting layer, and an upper light emitting electrode sequentially stacked; and
An upper protective film positioned between the first organic insulating film and the encapsulation layer and containing an inorganic material,
A side surface of the upper passivation film facing a side surface of the lower substrate is located on the display area of the lower substrate;
The first organic insulating layer extending outward from the side surface of the upper passivation layer contacts the encapsulation layer on the non-display area of the lower substrate. delete ◈Claim 9 was abandoned when the registration fee was paid.◈ According to claim 7,
a second organic insulating film disposed between the display area of the lower substrate and the first organic insulating film and extending between the non-display area of the lower substrate and the first organic insulating film;
The second organic insulating layer includes an organic material different from the organic material of the first organic insulating layer. ◈Claim 10 was abandoned when the registration fee was paid.◈ According to claim 9,
On the non-display area of the lower substrate, a side surface of the second organic insulating film is continuous with a side surface of the first organic insulating film. ◈Claim 11 was abandoned when the registration fee was paid.◈ According to claim 9,
The second organic insulating layer covers an edge of the lower light emitting electrode. ◈Claim 12 was abandoned when the registration fee was paid.◈ According to claim 11,
On the non-display area of the lower substrate, the first organic insulating layer contacts an upper surface of the second organic insulating layer facing the upper substrate. ◈Claim 13 was abandoned when the registration fee was paid.◈ According to claim 11,
A third organic insulating film disposed between the lower substrate and the light emitting structure and including an organic material,
The third organic insulating layer extends between the non-display area of the lower substrate and the second organic insulating layer. ◈Claim 14 was abandoned when the registration fee was paid.◈ According to claim 13,
The organic material of the third organic insulating layer is different from the organic material of the second organic insulating layer. ◈Claim 15 was abandoned when the registration fee was paid.◈ According to claim 13,
On the non-display area of the lower substrate, a side surface of the third organic insulating film is continuous with a side surface of the second organic insulating film. an upper substrate positioned on the lower substrate;
a light emitting structure disposed between the lower substrate and the upper substrate and including a lower light emitting electrode, a light emitting layer, and an upper light emitting electrode sequentially stacked;
an upper passivation layer disposed between the light emitting structure and the upper substrate and including an inorganic material;
an overcoat layer positioned between the lower substrate and the light emitting structure and extending outwardly of the upper passivation layer;
an encapsulation layer positioned between the upper passivation layer and the upper substrate and contacting the overcoat layer at an outside of the upper passivation layer;
a hygroscopic material dispersed in the encapsulation layer;
a bank insulating layer covering an edge of the lower light emitting electrode and extending outwardly of the upper passivation layer; and
A capping layer disposed between the light emitting structure and the upper protective film and extending in an outward direction of the upper protective film,
A side surface of the bank insulating film outside the upper passivation film is positioned between a side surface of the overcoat layer and a side surface of the upper passivation film;
The capping layer contacts the encapsulation layer outside the upper passivation layer. delete 17. The method of claim 16,
The encapsulation layer contacts a side surface of the overcoat layer from an outside of the upper passivation layer. delete 17. The method of claim 16,
A side surface of the bank insulating layer outside the upper passivation layer is positioned between a side surface of the overcoat layer and a side surface of the capping layer.

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