KR102461695B1 - Backlight unit and liquid crystal display device comprising the same - Google Patents

Abstract

The present invention relates to a backlight and a display device having a multi-chip structure using two or more light emitting diode chips for realizing a high color gamut, and is an invention for preventing poor visibility at both lower edges of the display device.
To this end, an optical member capable of adjusting the color of light emitted from the light emitting diode package disposed at both ends of the light emitting diode may be included.
In addition, it may include an optical member to which a painted film capable of adjusting the color of light emitted from the light emitting diode package is added.

Description

A backlight unit and a liquid crystal display including the same

The present invention relates to a backlight unit and a liquid crystal display including the same.

A general liquid crystal display displays an image by using a thin film transistor as a switching element. Such a liquid crystal display device is widely used as a display device for a notebook computer, a tablet computer, a smart phone, a portable display device, a portable information device, etc. in addition to a display device for a television or a monitor. Since such a liquid crystal display is not a self-luminous method, an image is displayed using light irradiated from a backlight unit disposed under the liquid crystal display panel.

Recently, a backlight unit using a light emitting diode (LED), which has a long lifespan, low power consumption, and can be miniaturized, has been developed as a light source, and the backlight unit is being applied from a small liquid crystal display to a large liquid crystal display.

The backlight unit is classified into a direct type and an edge type according to the arrangement position of the light source. Recently, the edge type backlight unit has been widely applied to slim the liquid crystal display device.

In addition, for high color reproduction, a light emitting diode package having a multi-chip structure comprising two or more light emitting diode chips and including a phosphor in an encapsulation layer is being developed.

1 is a view showing a backlight unit using a light emitting diode package having a general multi-chip structure for high color reproduction, FIG. 2 is a view showing a general display device for high color reproduction shown in FIG. 1, and FIGS. 3A and 3B are It is a diagram for explaining a problem of the display device illustrated in FIG. 2 .

Referring to FIG. 1 , a backlight unit using a light emitting diode package having a general multi-chip structure for high color reproduction includes a light emitting diode package 10 , a light guide plate 20 , and a rear cover 30 .

The light emitting diode package 10 includes first and second light emitting diode chips 1 and 2 , an encapsulation layer 3 , and a frame 5 . In this conventional light emitting diode package, the first color light is emitted by the light emission of the first light emitting diode chip 1 according to the driving power applied to the first and second terminals (not shown), and the second light emitting diode chip ( The second color light is emitted by the light emission of 2). The first color light and the second color light thus emitted are converted into white light by light absorption by the phosphor mixed in the encapsulation layer 3 , and are emitted to the light exit surface of the encapsulation layer 3 , and are emitted to the light incident portion of the light guide plate. are investigated

The light guide plate 20 internally refracts and reflects the light incident from the light emitting diode package 10 through a planar light incident part provided on one side, and emits it in the upper surface direction.

As shown in FIG. 1 , in such a general edge-type backlight unit, the first light emitting diode chip 1 disposed at the outer edge of the display device emits second color light from the same light emitting diode package 10 . 2 The light does not mix with the light emitting diode chip 2 and only the phosphor mixed in the encapsulation layer 3 passes through and is irradiated to the light incident part of the light guide plate. Similarly, the second light emitting diode chip 2 disposed at the outer edge of the display device does not mix with the first light emitting diode chip 1 emitting the first color light in the same light emitting diode package 10, and is encapsulated. Only the phosphor mixed in the layer 3 passes through and is irradiated to the light incident part of the light guide plate.

As described above, the light emitting diode chips 1 and 2 disposed at the outer edge of the display device irradiate the light guide plate with the color light of the light emitting diode chips 1 and 2 mixed with the phosphor, rather than white light.

Referring to FIG. 2 , poor visibility due to such color variations appears at both lower edge portions of the display device on which the light emitting diode package 10 is disposed.

Referring to FIGS. 3A and 3B , the poor visibility indicated at both lower edge portions of the display device may vary depending on the inherent color light of the light emitting diode chips 1 and 2 . For example, if the blue light emitting diode chip 1 does not mix colors and is irradiated to the light guide plate through only the red phosphor, the lower both edges of the display device may have poor visibility (region A) in pink. In addition, if the green light emitting diode chip 2 is irradiated to the light guide plate through only the red phosphor without mixing colors, poor visibility (region B) in which the lower both edges of the display device appear green may appear.

Therefore, the present inventors have devised an invention for a backlight structure that uses a multi-chip light emitting diode package for high color reproduction and prevents poor visibility due to color variations.

The present invention has been devised to solve the above-described problems, and it is a technical task to provide a display device capable of realizing a high color gamut using a light emitting diode package having a multi-chip structure.

In addition, it is another technical task to provide a backlight unit capable of realizing a high color gamut and preventing poor visibility due to color variations of a display device.

A backlight unit according to the present invention for achieving the above-described technical problem changes the color of light emitted from a light guide plate having first to third light incident parts and a light emitting diode package disposed at both ends of a light emitting diode array while supporting the light guide plate It may further include an optical member that can do it.

According to the means for solving the above problems, the present invention has the following effects.

First, a display device capable of realizing a high color gamut (99% or more) can be obtained.

Second, it is possible to obtain a display device having improved visibility due to color variations while realizing a high color gamut.

Third, it is possible to obtain a display device with improved aesthetics by reducing the size of the bezel compared to the conventional display device implementing a high color gamut.

In addition to the effects of the present invention mentioned above, other features and advantages of the present invention will be described below or will be clearly understood by those skilled in the art from such description and description.

1 is a diagram illustrating a general backlight unit for realizing a high color gamut.
2 is a diagram illustrating a general display device for realizing a high color gamut.
3A and 3B are diagrams illustrating problems of the display device shown in FIG. 2 .
4 is a view showing a backlight unit according to the present invention.
5 is a diagram schematically illustrating a light emitting diode chip according to the present invention.
6 is a perspective view showing an optical member according to the present invention;
7 is an exploded perspective view of the optical member and the rear cover according to the present invention.
8 is a diagram illustrating a color wheel table.
9 is a perspective view illustrating an optical member according to another example of the present invention.
10 is a cross-sectional view schematically illustrating a display device according to the present invention.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative and the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless specifically stated otherwise.

In interpreting the components, it is interpreted as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between two parts unless 'directly' is used.

In the case of a description of a temporal relationship, for example, 'immediately' or 'directly' when a temporal relationship is described as 'after', 'following', 'after', 'before', etc. It may include cases that are not continuous unless this is used.

Although the first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be implemented independently of each other or may be implemented together in a related relationship. may be

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 4 is a view showing a backlight unit according to the present invention, FIG. 5 is a view showing a light emitting diode chip according to the present invention, FIG. 6 is a view for explaining an optical member according to the present invention, and FIG. 7 is a view showing the present invention It is an exploded perspective view of the optical member and the rear cover according to FIG.

4 to 7 , the backlight unit according to the present invention includes a light emitting diode array 100 , first to third light emitting diode packages 110 , 115 , 117 , a light guide plate 200 , an optical member 300 , and a rear surface. and a cover 500 .

The light emitting diode array 100 is disposed to face the first light incident part 201 of the light guide plate 200 , and a plurality of light emitting diode packages 110 , 115 , and 117 are mounted thereon.

The first light emitting diode package 110 is disposed at one end of the light emitting diode array 100 and includes a first light emitting diode chip 110a and a second light emitting diode chip 110b.

The second light emitting diode package 115 is disposed at the other end of the light emitting diode array 100 and includes a first light emitting diode chip 115a and a second light emitting diode chip 115b.

The third light emitting diode package 117 is disposed between the first light emitting diode package 110 and the second light emitting diode package 115 and may be configured in plurality. The third light emitting diode package 117 includes a first light emitting diode chip 117a and a second light emitting diode chip 117b.

As such, the light emitting diode packages 110, 115, and 117 each include a first light emitting diode chip 110a, 115a, 117a and a second light emitting diode chip 110b, 115b, 117b, and additionally an encapsulation layer 130, The phosphor 140 , the frame 150 , and the wire 160 may be additionally included.

The first light emitting diode chips 110a, 115a, and 117a and the second light emitting diode chips 110b, 115b, and 117b may emit light of different colors, respectively. For example, each of the first and second light emitting diode chips 110a and 110b may be formed of a blue light emitting diode chip and a green light emitting diode chip.

Referring to FIG. 5, each of the first light emitting diode chips 110a, 115a, 117a and the second light emitting diode chips 110b, 115b, 117b according to an embodiment of the present invention includes a substrate 121, a buffer layer 122, It includes a first semiconductor layer 123 , an active layer 124 , a second semiconductor layer 125 , a first electrode 127 , a second electrode 126 , and a reflective layer 128 .

The substrate 121 may be made of a material such as sapphire (Al2O3), silicon carbide (SiC), zinc oxide (ZnO), silicon (Si), or gallium arsenide (GaAs). Here, in the case of sapphire, it is relatively easy to grow a GaN-based semiconductor material and is stable at a high temperature, so it is mainly used as a substrate for a blue or green light emitting device. Accordingly, the substrate 121 may be a sapphire substrate.

The buffer layer 122 is formed between the substrate 121 and the first semiconductor layer 123 to reduce a difference in lattice constant between the substrate 121 and the first semiconductor layer 123 , and is made of a material of GaN or AlN. can

The first semiconductor layer 123 is formed on the buffer layer 122 to provide electrons to the active layer 124 . The first semiconductor layer 123 according to an example may be made of an n-GaN-based semiconductor material, and the n-GaN-based semiconductor material may be GaN, AlGaN, InGaN, AlInGaN, or the like. Here, Si, Ge, Se, Te, or C may be used as the impurity used for doping the first semiconductor layer 123 .

The active layer 124 is formed on the first semiconductor layer 123 to emit light. Here, the active layer 124 is formed on the remaining portion except for one edge portion of the first semiconductor layer 123 . The active layer 124 has a multi-quantum well (MQW) structure having a well layer and a barrier layer having a band gap higher than that of the well layer. For example, the first light emitting diode chips 110a, 115a, 117a and the second light emitting diode chips 110b, 115b, and 117b may have a multi-quantum well structure such as InGaN/GaN.

The second semiconductor layer 125 is formed on the active layer 124 to provide holes to the active layer 124 . The second semiconductor layer 125 according to an example may be made of a p-GaN-based semiconductor material, and the p-GaN-based semiconductor material may be GaN, AlGaN, InGaN, AlInGaN, or the like. Here, as an impurity used for doping the second semiconductor layer 124 , Mg, Zn, Be, or the like may be used.

A transparent electrode layer (not shown) may be additionally formed on the second semiconductor layer 125 . The transparent electrode layer reduces contact resistance with the second semiconductor layer 125 having a relatively high energy band gap. The transparent electrode layer may be made of a light-transmitting material so that light generated in the active layer 124 may be emitted upward.

The second electrode 126 is formed on the first semiconductor layer 123 . The second electrode 126 may have a single-layer structure or a multi-layer structure made of any one material selected from Ti, Cr, Al, and Au or an alloy material of two or more.

The first electrode 127 is formed on the active layer 124 . The first electrode 127 is provided on the other surface spaced apart from one surface of the light emitting diode chip 110 while stepping from the second electrode 126 . The first electrode 127 may have a single-layer structure or a multi-layer structure made of any one material selected from Ti, Cr, Al, and Au or an alloy material of two or more.

The reflective layer 128 is interposed between the active layer 124 and the first electrode 127 to reflect the light generated from the active layer 124 toward the substrate 121 to improve the light output efficiency of the light emitting diode chip 110 . Here, the reflective layer 128 has at least one via hole, and the first electrode 127 penetrates the reflective layer 128 , ie, is electrically connected to the active layer 124 through the via hole. In order to improve reflection efficiency, the reflective layer 128 according to an example may have a distributed Bragg reflector structure, and may have a stacked structure of SiO2 and TiO2. The reflective layer 128 may be formed to a thickness of 100 nm or less.

As described above, each of the first light emitting diode chips 110a, 115a, and 117a and the second light emitting diode chips 110b, 115b, and 117b is disposed in one light emitting diode package 110 , 115 , 117 . As described above, it may be composed of a blue light emitting diode chip or a green light emitting diode chip, but is not limited thereto. However, in this specification, for convenience of explanation, it is assumed that the first light emitting diode chips 110a, 115a, 117a are blue light emitting diode chips, and the second light emitting diode chips 110b, 115b and 117b are green light emitting diode chips. to assume

The encapsulation layer 130 is provided to cover the entire surface except for the lower surfaces of the first light emitting diode chips 110a, 115a, 117a and the second light emitting diode chips 110b, 115b, 117b, and the first light emitting diode chip (110a, 115a, 117a) and the second light emitting diode chip (110b, 115b, 117b) is encapsulated. The encapsulation layer 130 is made of white silicone, white solder resist, white epoxy, polyphthalamide (PPA), liquid crystal polymer (LCP), and syngeotactic polystyrene (SPS). It may be formed of a material such as, but is not limited thereto.

In addition, the encapsulation layer 130 may include a phosphor 140 . The phosphor 140 serves to convert the intrinsic color light emitted from the first light emitting diode chips 110a, 115a, and 117a and the second light emitting diode chips 110b, 115b, and 117b into white light. For example, when the first light emitting diode chip 110a on the first light emitting diode package 110 emits blue light and the second light emitting diode chip 110b emits green light, the phosphor 140 emits a red material. In addition, color light emitted from the first and second light emitting diode chips 110a and 110b may be converted into white light.

In addition, when the first light emitting diode chip 110a on the first light emitting diode package 110 emits blue light and the second light emitting diode chip 110b emits red light, the phosphor 140 contains a green material. Color light emitted from the first and second light emitting diode chips 110a and 110b may be converted into white light. In the present specification, for convenience of description, it is assumed that the phosphor 140 includes a red material.

The frame 150 supports the first light emitting diode chips 110a, 115a, 117a and the second light emitting diode chips 110b, 115b, 117b, and the first light emitting diode chips 110a, 115a, 117a and A lead electrode (not shown) for transmitting an electrical signal to the second light emitting diode chips 110b, 115b, and 117b may be included.

The wire 160 serves to connect the first light emitting diode chips 110a, 115a, and 117a and the second light emitting diode chips 110b, 115b, and 117b to the lead electrode (not shown). For example, the first light emitting diode chips 110a, 115a, 117a and the second light emitting diode chips 110b, 115b, 117b are connected as lead electrodes by a reverse wire bonding process using a wire 160 . electrically connected to

The light guide plate 200 includes a first light incident part 201 irradiated with light from the light emitting diode packages 110 , 115 , and 117 , and a second and third light incident part irradiated with light from the optical member 300 to be described later. (203, 205), and has a rectangular plate shape. The light guide plate 200 may include an optical pattern (not shown) for emitting light incident from the light incident units 201 , 203 , and 205 in the upper surface direction.

The optical member 300 may be disposed on one side of the light guide plate 200 to support the light guide plate 200 , and may adjust the color of light irradiated to the second and third light incident parts 203 and 205 . It is divided into a first optical member 310 and a second optical member 320 according to the arrangement position. That is, the first and second optical members 310 and 320 are disposed at a corner portion where the bottom portion 501 and the side portion 503 of the rear cover contact each other to support the light guide plate 200 .

6 and 7, each of these first and second optical members 310 and 320 is in contact with the light guide plate 200 and supports the light guide plate 200 while supporting the first surfaces 311 and 321 and the rear cover ( 500) and includes second surfaces 312 and 322 and third surfaces 313 and 323 in contact with each other. The optical members 310 and 320 may be made of the same material as the rear cover, but is not limited thereto. The optical members 310 and 320 have the first surfaces 311 and 321 located on one side of the light guide plate 200 fixing the light guide plate 200, thereby reducing the separation and preventing color defects due to the deviation of the light path. have. In addition, visibility defects caused by the first light emitting diode chip 110a of the first light emitting diode package 110 and the second light emitting diode chip 115b of the second light emitting diode package 115 disposed on both edges, which have been a problem in the prior art can be prevented A detailed description thereof will be described later with reference to FIG. 8 .

The rear cover 500 includes a bottom portion 501 and a side portion 503 .

The bottom part 501 supports an edge portion of one side of the reflector 800 . At this time, the bottom part 501 supports the remaining middle part except for the both-side corner part among the one side edge part of the reflection plate 800 . To this end, both edge portions of the bottom portion 501 overlapping one edge portion of the reflection plate 800 may be removed in a polygonal shape.

The side wall portion 503 is bent from the lower side of the bottom portion 501 so as to surround one side portion of the guide frame 400 . The side wall portion 503 is detachably coupled to the guide frame 400 by a fastening member such as a screw and/or a hook.

In the rear cover 500 according to an embodiment of the present invention, one side of the bottom part 501 is in contact with the second surface 312 of the first optical member 310 and the other side of the bottom part 501 is the second side. The second surface 322 of the optical member 320 may be in contact. In addition, one side of the side portion 503 may be in contact with the third surfaces 313 and 323 of the first and second optical members 310 and 320 . That is, the first and second optical members 310 and 320 are disposed at a corner portion where the bottom portion 501 and the side portion 503 of the rear cover contact each other to support the light guide plate 200 . However, the present invention is not limited thereto, and the first and second optical members 310 and 320 may be coupled to the rear cover 500 in various forms depending on a product model or product size.

As described above, the backlight unit provided with the optical member 300 according to the present invention can prevent poor visibility due to color variations at the lower edge of the display device, unlike a general high-color reproduction backlight unit. Hereinafter, the effects according to the present invention will be described.

A portion of the light emitted from the first light emitting diode chip 110a of the first light emitting diode package 110 emitting blue light constituting the left end of the general light emitting diode array 100 is the first light emitting diode package emitting green light ( The first surface 311 of the first optical member 310 is irradiated through the encapsulation layer 130 without being mixed with the second light emitting diode chip 110b of the 110 . In this way, the blue light of the first light emitting diode chip 110a that is not mixed with the green light of the second light emitting diode chip 110b meets the red phosphor 140 and changes to pink light. When the pink light is irradiated to the first surface of the first optical member 310 and then reflected again and is irradiated to the second light incident part 203 of the light guide plate 200 , the lower edge of the display panel 700 is It may cause poor visibility.

Similarly, part of the light emitted from the second light emitting diode chip 115b of the second light emitting diode package 115 emitting green light constituting the right end of the light emitting diode array 100 emits blue light from the second light emitting diode package ( It is reflected on the first surface 321 of the second optical member 320 through the encapsulation layer 130 without mixing with the first light emitting diode chip 115a of the 115 . In this way, the green light of the second light emitting diode chip 115b that is not mixed with the blue light of the first light emitting diode chip 115a meets the red phosphor 140 and changes to dark green light. When the dark green light is irradiated to the first surface of the second optical member 310 and then reflected again and irradiated to the third light incident part 205 of the light guide plate 200 , the lower edge of the display panel 700 . It may cause poor visibility.

The region in which the color variation of the lower edge of the display device appears is not recognized because it is a region corresponding to the bezel part of the conventional display device, and thus there is no problem. However, when the size of the bezel is reduced as in the display device according to the present invention, the above-described color variation occurs in the active area, which may cause poor visibility.

8 is a color wheel diagram illustrating a method of changing a color in the optical member 300 according to the present invention.

8 and 4 , the optical member 300 according to an example changes the color of the first light emitted from the first light emitting diode package 110 to the second light incident part 203 of the light guide plate 200 . White light can be irradiated. For example, if the light irradiated to the first optical member 310 is purple (5RP) light, the optical member 310 is painted with purple (5RP) and green (5G) in a complementary color relationship, The purple light may be changed to white light. For example, if the light irradiated from the second light emitting diode package 115 to the second optical member 320 is light green (5GY), the second optical member 320 has a complementary relationship with the light green (5GY). It is possible to change the light green light into white light by painting it with purple (5P) placed on it.

As described above, in the optical member 300 according to an embodiment of the present invention, the light emitted from the first and second light emitting diode packages 110 and 115 disposed at the end of the light emitting diode array 100 passes through the phosphor 130 . By painting with a color that is in a complementary color relationship with the color of the light irradiated to the optical member 300 , the above-described poor visibility can be prevented. However, the above description corresponds to an example of the present invention, and by painting the optical member 300 with a color placed in a complementary color relationship according to color variations, poor visibility can be prevented.

9 is a perspective view illustrating an optical member according to another example of the present invention.

The optical member 330 of FIG. 9 may include a film 331 . As a part of the configuration of the optical member 300 described in FIG. 6 is changed, the overlapping description will be omitted.

Referring to FIG. 9 , in the optical member 330 according to an example of the present invention, unlike the optical member 300 according to the first embodiment, other parts except for the film 331 are not painted and the film 331 is not painted. ) is painted only. That is, the second surface 332 and the third surface 333 supporting one side of the light guide plate 200 and one side and the other side of the rear cover 500 are not painted, and the first and second light emitting diode packages 110, A film 331 in a complementary color relationship with the color of the light emitted from the first and second light emitting diode packages 110 and 115 is disposed only on the light incident portion irradiated with light from 115 . The film 331 may have a better reflection effect on light than the optical member 300 made of a metal material, and may be advantageous in terms of cost compared to painting the entire optical member.

At this time, when expressed as the first optical member 310 and the second optical member 320 as in the first embodiment of the optical member 330 according to the second embodiment, the film 331 is the first film ( 331a) may be expressed as a second film 331b. The first film 331a is painted with a color that is in a complementary color relationship with the light irradiated from the first light emitting diode package 110 , and the second film 331b is the second light emitting diode package 115 . It is painted with a color that is in a complementary color relationship with the light irradiated from it. Therefore, the first film 331a and the second film 331b may be painted in different colors, but is not limited thereto. For example, the first light emitting diode package 110 and the second light emitting diode package 115 may be painted in the same color according to the configuration and type.

10 is a cross-sectional view schematically illustrating a display device including an optical member of the present invention. A description of the parts overlapping with the above will be omitted.

The display device according to the present invention may further include a guide frame 400 , a light source housing 450 , optical sheets 600 , a display panel 700 , and a reflector 800 .

The guide frame 400 is supported by the rear cover 500 to support a lower edge portion of the liquid crystal display panel 700 . The guide frame 400 according to an example includes a panel support portion 401 , a guide sidewall 402 , and a bottom portion 403 .

The panel support 401 is formed in a rectangular band shape and is disposed under the display panel 700 to support a rear edge portion of the display panel 700 .

The guide sidewall 402 is provided at a constant height at the rear edge of the panel support 401 . The guide sidewall 400 is disposed under the display panel 700 to surround each side of the rear cover 500 . In this case, the guide sidewall 402 may be coupled to the sidewall of the rear cover 500 by a coupling means such as a screw or a hook.

The bottom portion 403 is formed by bending from the guide sidewall 402 . A panel support 401 is attached to an upper portion of the bottom 403 , and a lower portion is formed to surround the light emitting diode package 100 and the light source housing 450 .

The light source housing 450 includes a side portion 451 and a bottom portion 453 .

The side part 451 is formed by bending from one side of the bottom part 453 to the upper surface. In this case, the side portion 451 may support and fix the light emitting diode array substrate (not shown).

The bottom portion 453 supports an edge portion of one side of the reflection plate 800 . Additionally, the bottom portion 453 may support the light guide plate 200 through one edge portion of the reflective sheet 800 .

The light source housing 450 accommodates the light emitting diode array 100 and serves to radiate heat generated from the light emitting diode packages 110 , 115 , and 117 to the outside. Accordingly, the light source housing 450 may be formed of a material having high thermal conductivity, such as aluminum (Al).

The optical sheets 600 are disposed on the light guide plate 200 to improve luminance characteristics of light emitted from the light guide plate 200 . For example, the optical sheets 600 may include, but are not limited to, a lower diffusion sheet, a prism sheet, and an upper diffusion sheet, and a diffusion sheet, a prism sheet, and a dual brightness enhancement film. , and may be made of a laminated combination of two or more selected from lenticular sheets.

The display panel 700 includes a lower substrate 701 and an upper substrate 703 that are bonded to each other with a liquid crystal layer interposed therebetween, and displays a predetermined image using light emitted from the light source module 100 .

The lower substrate 701 is a thin film transistor array substrate and includes a plurality of pixels (not shown) formed in each pixel area intersected by a plurality of gate lines (not shown) and a plurality of data lines (not shown). Each pixel may include a thin film transistor (not shown) connected to a gate line and a data line, a pixel electrode connected to the thin film transistor, and a common electrode formed adjacent to the pixel electrode and supplied with a common voltage.

A pad part (not shown) connected to each signal line is provided on a lower edge of the lower substrate 701 , and the pad part is connected to a panel driver (not shown). Also, a gate driving circuit (not shown) for supplying a gate signal to a gate line of the display panel 700 is formed on the left and/or right edge of the lower substrate 701 . A gate driving circuit is formed together with the thin film transistor manufacturing process of each pixel so as to be connected to each gate line.

The upper substrate 703 includes a pixel defining pattern defining an opening region overlapping each pixel region formed on the lower substrate 701 , and a color filter formed in the opening region. The upper substrate 703 is oppositely bonded to the lower substrate 701 with a liquid crystal layer interposed therebetween by a sealant to cover the entire lower substrate 803 except for the pad portion of the lower substrate 701 .

At least one of the lower substrate 701 and the upper substrate 703 is formed with an alignment layer (not shown) for setting a pretilt angle of the liquid crystal. The liquid crystal layer is interposed between the lower substrate 701 and the upper substrate 703, and liquid crystal molecules are arranged in a horizontal direction according to a transverse electric field formed by a data voltage and a common voltage applied to the pixel electrode for each pixel. made of liquid

A lower polarization member 705 having a first polarization axis is attached to the rear surface of the lower substrate 701 , and upper polarized light having a second polarization axis intersecting the first polarization axis is attached to the front surface of the upper substrate 703 . A member 707 is attached.

As described above, the display panel 700 drives the liquid crystal layer according to the electric field formed for each pixel by the data voltage and the common voltage applied to each pixel, thereby displaying a predetermined color image according to the light transmittance of the liquid crystal layer.

The reflective plate 800 is disposed to cover the lower portion of the light guide plate 200 . The reflective sheet 800 minimizes light loss by reflecting light incident through the lower surface of the light guide plate 200 toward the inside of the light guide plate 200 .

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which the present invention pertains that various substitutions, modifications, and changes are possible without departing from the technical matters of the present invention. It will be clear to those who have the knowledge of Therefore, the scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention.

100: light emitting diode array 110: first light emitting diode package
115: second light emitting diode package 117: third light emitting diode package
110a, 115a, 117a: first light emitting diode chip
110b, 115b, 117b: second light emitting diode chip
130: encapsulation layer 140: phosphor
150: frame 160: wire
200: light guide plate 201: first light incident part
202: second light incident part 203: third light incident part
300: optical member 310: first optical member
320: second optical member 400: guide frame
450: light source housing 500: rear cover
600: optical sheeting 700: display panel
800: reflector

Claims (10)

a light guide plate having a first light incident part, a second light incident part, and a third light incident part;
A bottom portion accommodating the light guide plate, a bottom portion, a sidewall portion bent from one side of the bottom portion, a first protrusion portion protruding from the bottom portion at a position inside a predetermined distance from one end portion of the floor portion, and a portion of the bottom portion opposite to the one end portion a rear cover including a second protrusion protruding from the bottom at a predetermined distance from the other end;
a light emitting diode array disposed to face the first light incident portion of the light guide plate;
a first light emitting diode package irradiated with light to the first light incident part and mounted on one end of the light emitting diode array;
a second light emitting diode package irradiating light to the first light incident part and mounted on the other end of the light emitting diode array;
A first surface facing the one end of the light guide plate and protruding from the first surface toward the light guide plate is disposed at a first corner portion in contact with the bottom portion and the side wall portion at one end of the bottom portion of the rear cover a first side protrusion that supports a portion of the lower end of the light guide plate and is in contact with an upper surface and a side surface of the first protrusion; a second surface having a coupling first groove, a third surface extending from a lower end of the first surface to the outside of the light guide plate and in contact with the bottom of the rear cover, wherein the second surface is the first light emitting diode a first optical member for irradiating the second light incident part by changing the color of the light irradiated from the package; and
a fourth surface opposite to the other end of the light guide plate and protruding from the fourth surface toward the light guide plate; A second side protrusion that supports a portion of the lower end of the light guide plate and contacts the upper and side surfaces of the second protrusion, and a second downward protrusion extending outward from the upper end of the fourth surface and formed on the side wall of the rear cover. a fifth surface having a second groove, a sixth surface extending outside the light guide plate from the lower end of the fourth surface and in contact with the bottom of the rear cover, wherein the fifth surface is the second light emitting diode package and a second optical member for irradiating the light to the third light incident part by changing the color of the light irradiated from the backlight unit. The method of claim 1,
and a plurality of third light emitting diode packages disposed between the first light emitting diode package and the second light emitting diode package. The method of claim 1,
The first surface of the first optical member and the fourth surface of the second optical member are painted with colors complementary to the light irradiated to the first and second optical members. The method of claim 1,
The first surface of the first optical member is made to further include a first film,
The fourth surface of the second optical member further comprises a second film. 5. The method of claim 4,
The first film is painted with a color complementary to the light irradiated to the first optical member,
The second film is a backlight unit painted with a color complementary to the light irradiated to the second optical member. The method of claim 1,
The first and second light emitting diode packages,
At least two or more light emitting diode chips emitting light of different colors and an encapsulation layer encapsulating the light emitting diode chip,
The encapsulation layer further includes a phosphor. 7. The method of claim 6,
The first and second light emitting diode packages include a blue light emitting diode chip and a green light emitting diode chip, and the phosphor is a red phosphor. 7. The method of claim 6,
The first and second light emitting diode packages include a blue light emitting diode chip and a red light emitting diode chip, and the phosphor is a green phosphor. delete display panel;
a backlight unit irradiating light to the display panel;
a guide frame supporting the display panel; and
The display device is the backlight unit according to any one of claims 1 to 8.

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