KR102237990B1 - Flexible display device laminating system and flexible display device laminating method using thereof - Google Patents

Abstract

Disclosed are a flexible display device bonding system and a flexible display device bonding method using the same. According to an embodiment of the present invention, in the flexible display device bonding system for bonding a panel constituting a flexible display device and a panel to be bonded different from each other, the flexible display device bonding system comprises: a stage; at least two upper pads spaced apart from each other on the stage to support a panel to be bonded and to be rotatable; and a lower pad supporting the panel and rotatable, wherein the lower pad is engaged with the upper pad at the same time to attach the panel to be bonded to the panel from one end along the other end. Therefore, transport efficiency of the panel can be improved.

Description

FLEXIBLE DISPLAY DEVICE LAMINATING SYSTEM AND FLEXIBLE DISPLAY DEVICE LAMINATING METHOD USING THEREOF}

The present invention relates to a flexible display device bonding system and a flexible display device bonding method using the same, and more particularly, a flexible display device bonding system for bonding bendable or unfoldable panels constituting a flexible display device to each other, and a display device using the same It relates to the cementation method.

Display devices include liquid crystal displays (LCDs), organic light emitting diode displays (OLED displays), plasma display panels (PDPs), and micro light-emitting display devices according to light emission methods. -LED).

Recently, display devices are becoming thin flat panel display devices with emphasis on portability. Recently, among flat panel display devices, flexible display devices having flexibility and high elasticity are in the spotlight so that they can be bent or folded in a desired direction.

Since the flat panel display device has a large screen, is thin, and has a light weight, the flexible display device is easily bent or bent by an external force, so care is also required in the manufacturing process.

In a general display device bonding system, a panel is mounted on a flat plate or a curved jig having a large radius of curvature while supporting and fixing the panel. In a general display device bonding system, when the flexible display devices are flatly facing each other, the elastic modulus between the panels is different in a situation where they are bent or folded, so that the durability of the flexible display device is lifted or bubbles are formed inside the panel. There was a problem that hindered it.

The necessity of manufacturing a flexible display device in consideration of variations in the manufacturing process of the flexible display device is being emphasized.

Korean Patent Publication (Registration Publication No.: 10-2031684, “Curved Display Panel Manufacturing Equipment and Curved Display Panel Manufacturing Method”) discloses a roller for bonding a panel substrate and a window substrate, but the window panel and the panel substrate Separate window stage and panel stage are required to seat the panel, and there is no disclosure regarding a method of continuously bonding a plurality of panels on a series of systems.

Korean Registered Gazette No. 10-2031684 (Announcement date: 2019.10.14.)

One technical problem to be solved by the present invention is a flexible display device bonding system that uses the characteristic of bending or bending a plurality of panels constituting a flexible display substrate, and bonding by unifying the bonding process, and a display device bonding using the same. There is a way to provide.

In order to solve the above technical problem, the present invention provides a flexible display device bonding system.

In the flexible display device bonding system according to an embodiment of the present invention, there is provided a flexible display panel bonding system for bonding a panel constituting the flexible display device and different panels to be bonded together, comprising: a stage; At least two or more spaced apart on the stage to support the bonded panel and rotatable upper pad; And a lower pad that supports the panel and is rotatable, and the lower pad is engaged with the upper pad at the same time, and the bonded panel may be bonded to the panel from one end to the other end.

According to an embodiment, the position may be moved according to the rotation of the stage and may further include an upper pad shaft that provides a rotational force to the upper pad.

According to an embodiment, an inkjet head may further include an inkjet head provided at one end of the stage to be spaced apart from the upper pad and movable to discharge an adhesive layer to the panel according to the rotation of the stage.

According to an embodiment, a protective film separation pad may be further provided adjacent to the stage to recover the protective film from the adhered panel on the upper pad.

According to an embodiment, it may further include a lifting lift for lifting the lower pad in a vertical direction so that the panel engages the panel to be bonded.

According to an embodiment, it may further include an alignment unit for adjusting the positional movement of the upper pad so as to correspond to the lower pad.

In order to solve the above technical problem, the present invention provides a method for bonding a flexible display device.

A method of bonding a flexible display device according to an embodiment of the present invention includes a flexible display for bonding a panel constituting the flexible display device and at least two different bonded panels of a first bonded panel and a second bonded panel. A panel bonding system, comprising: a first bonding panel bonding step of bonding the first panel to be bonded to the panel from one end to the other; A stage rotation movement step of rotating the stage so that the first panel to be bonded and the second panel to be bonded spaced apart from the panel are rotated to face the panel; And a second bonded panel bonding step of bonding the second bonded panel on the panel from one end to the other.

According to an embodiment, prior to the step of attaching the second panel to be bonded, the step of adjusting the height of the panel to increase or decrease so as to correspond to the second panel to be bonded may be further included.

According to an exemplary embodiment of the present invention, there is an advantage in that the characteristic of a flexible display device that is bent or folded is combined with a manufacturing process by engaging and bonding from one end to the other end while supporting the panel and the panel to be bonded, respectively, while the upper pad and the lower pad respectively support the panel and the panel to be bonded.

According to an embodiment of the present invention, there is an advantage in that the number of process parts is reduced and the process volume is lowered by pressing the upper pad at the same time as the upper pad supports the bonded panel.

According to another embodiment of the present invention, since a plurality of upper pads are provided on a stage that is driven to rotate, there is an advantage that a series of bonding processes can be simultaneously performed by sequentially supplying different types of panels to be bonded. .

According to another embodiment of the present invention, an inkjet head capable of forming an adhesive layer is provided on the stage, thereby unifying the adhesive layer forming process and the bonding process, minimizing shape deformation due to transfer of the adhesive layer after forming the adhesive layer, leading to bonding after bonding. There is an advantage of improving product yield by reducing time.

According to another embodiment of the present invention, depending on the type of flexible display device, it is possible to increase or decrease the number of installations of the upper pads on the stage, and the panel to be bonded moves according to the rotation of the stage, thereby shortening the movement line between the panels, thereby reducing the process efficiency. Of course, there is an advantage of improving the transfer efficiency of the panel.

1 is a diagram illustrating a flexible display device in a state in which a plurality of panels are bonded together according to an exemplary embodiment of the present invention.
2 is a view showing a flexible display device bonding system according to an embodiment of the present invention.
3 is a view showing a flexible display device bonding system according to another embodiment of the present invention.
4A and 4B are views sequentially showing an adhesive layer forming process and a bonding process of FIG. 5.
5(a) is a view showing a bonded panel wound around an upper panel according to an embodiment of the present invention, and FIG. 5(b) is It is a diagram showing the supply path of the bonding panel and the path through which the protective film is recovered.
6 is a flowchart illustrating a method of bonding a flexible display device according to an exemplary embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical idea of the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed contents may be thorough and complete, and the spirit of the present invention may be sufficiently conveyed to those skilled in the art.

In the present specification, when a component is referred to as being on another component, it means that it may be formed directly on the other component or that a third component may be interposed therebetween. In addition, in the drawings, the shape and size are exaggerated for effective description of the technical content.

In addition, in various embodiments of the present specification, terms such as first, second, and third are used to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, what is referred to as a first component in one embodiment may be referred to as a second component in another embodiment. Each embodiment described and illustrated herein also includes its complementary embodiment. In addition, in the present specification,'and/or' has been used to mean including at least one of the elements listed before and after.

In the specification, expressions in the singular include plural expressions unless the context clearly indicates otherwise. In addition, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, components, or a combination thereof described in the specification, and one or more other features, numbers, steps, or configurations. It is not to be understood as excluding the possibility of the presence or addition of elements or combinations thereof. In addition, in the present specification, "connection" is used to include both indirectly connecting a plurality of constituent elements and direct connecting.

In addition, in the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted.

1 is a view showing a flexible display device in a state in which a plurality of panels P1, P2, P3, and P4 are bonded together according to an embodiment of the present invention, and FIG. 2 is a flexible display according to an embodiment of the present invention. A diagram showing a device bonding system 10, FIG. 3 is a view showing a flexible display device bonding system 10 according to another embodiment of the present invention, and FIGS. 4A and 4B are a bonding layer forming process and bonding process of FIG. 5 5(a) is a view showing a bonded panel wound around an upper panel according to an exemplary embodiment of the present invention, and FIG. 5(b) is a flexible display device according to an exemplary embodiment of the present invention. It is a diagram showing the supply path of the panel to be bonded on the panel and the path through which the protective film is recovered in the bonding system.

As illustrated in FIG. 1, the flexible display device may include a panel P1, a touch panel, a polarizer, a cover window, and the like panels P2, P3, and P4. At this time, an adhesive layer (R, R, R) may be interposed between the panels P1, P2, P3, and P4 to be bonded.

According to an embodiment, the panel P1 means a display panel or a display film. The panel P1 may be a panel on which an image is displayed. The panel P1 is made of a flexible material and can be bent or deformed by a constant external force, and specifically, an OLED panel and a Micro-LED panel correspond to this, but are not limited thereto.

According to an embodiment, the bonded panels P2, P3, and P4 may include a touch panel, a polarizing layer, and a cover window. The number and type of panels to be bonded may vary according to the characteristics of the flexible display device.

Hereinafter, each component constituting the flexible display device bonding system 10 according to an exemplary embodiment will be described in detail.

Referring to FIGS. 2 to 5, the flexible display device bonding system 10 includes a panel P1 constituting the flexible display device and each of the panels P2, P3, and P4 to be bonded in multiple layers. I can. The flexible display device bonding system 10 includes a stage 100, an upper pad 200, and a lower pad 600, and includes an upper pad shaft 300, an inkjet head 400, and a protective film separation pad 500. , An elevating lift 800, and an alignment unit 900 may be further included.

Stage (100)

Referring back to FIGS. 2 to 5, the stage 100 may support a plurality of upper pads 200 spaced at random intervals. The stage 100 may position the upper pad 200 including the pads P2, P3, and P4 to be bonded to a position facing the panel P1. That is, the panels to be bonded (P2, P3, P4) are mounted on a plurality of upper pads 200, the upper pads 200 move along the stage 100, and the panels to be bonded (P2, P3, P4) are moved in position. I can.

A plurality of bonded panels P2, P3, and P4 on the stage 100 may be supported by each of the upper pads 200, and different processes may be simultaneously performed.

Upper pad (200)

Referring back to FIGS. 2 to 5, the upper pad 200 supports the panels P2, P3, and P4 to be bonded, and provides the panels P2, P3, and P4 to be bonded to face the panel P1. I can. At least two or more of the upper pads 200 may be disposed along the edge of the stage 100. The upper pad 200 may rotate about an upper pad shaft 300, which will be described later, while supporting the adhered panels P2, P3, and P4. That is, a plurality of bonded panels P2, P3, and P4 may be supported by the upper pad 200 on the flexible display device bonding system 10 to perform a bonding process.

The number and type of panels constituting the flexible display device, the number of processes, the control unit, and the number of upper pads 200 mounted on the stage 100 are increased or decreased according to the operating policy of the flexible display device bonding system 10 in all processes. Can be. In FIG. 2, four upper pads 200 are mounted on the stage 100 as an example. 2 illustrates an example, and the number of upper pads 200 may vary.

The upper pad 200 supports one side of the bonded panels P2, P3, P4 or the adhesive layer R, and may have a width corresponding to the bonded panels P2, P3, P4 or the adhesive layer R. have. The upper pad 200 has a circular shape and can be rotated by a driving force of a motor (not shown). The upper pad 200 may have a certain level of elasticity. For this reason, it is possible to have a buffering effect during the bonding process of the panels P2, P3, and P4 to be bonded.

The upper pad 200 may fixably support the adhered panels P2, P3, and P4 by vacuum adsorption or adhesion of a certain viscosity. The fixing force of the upper pad 200 is not separated from the panel to be bonded (P2, P3, P4) or the adhesive layer (R) during the process operation, and is easily from the upper pad 200 during bonding to the panel (P1) during the bonding process. It may be enough to be eliminated.

Each of the pads to be bonded (P2, P3, P4) or the adhesive layer (R) has a protective film (PF) attached on both sides to protect the surface from contamination during manufacturing or transportation. 200).

Upper pad shaft (300)

Referring back to FIGS. 2 to 5, the upper pad shaft 300 may provide rotational force to the upper pad 200 by driving a motor (not shown). The upper pad shaft 300 may be positioned in a concentric circle along the edge of the stage 100 by rotation of the stage 100.

As shown in FIGS. 3 to 4B, the upper pad shaft 300 may serve as a gantry for moving the inkjet head 400 and the UV curing machine 410 to be described later along the axial direction.

Inkjet head 400

As another embodiment of the present invention, when bonding a flexible display device having a droplet-shaped adhesive layer R not a film-type adhesive layer R as one configuration, the flexible display device bonding system further includes an inkjet head 400 can do.

Referring again to FIGS. 3 to 4B, the inkjet head 400 may form an adhesive layer R on the panel P1 by discharging an adhesive in the form of droplets. The inkjet head 400 may be provided at one end of the stage 100 to be spaced apart from the upper pad 200. The inkjet head 400 may include a nozzle (not shown).

The nozzle (not shown) may discharge a fine-sized adhesive to form a continuous or layer on the panel P1 in a direct manner. For the nozzle (not shown), a driving voltage and a voltage pulse time for each characteristic of each adhesive R may be adjusted according to programming data. Programming data may be stored in a memory module (not shown). The programming data may include content for controlling a movement operation of the inkjet head 400 and a discharge operation of a nozzle (not shown). For example, the programming data may control a discharge amount that is discharged once, or whether or not a nozzle (not shown) is opened and discharged so as to vary the thickness of the adhesive layer R for each positional coordinate several times.

The inkjet head 400 may be positioned to face the panel P1 in a vertical direction according to the rotation of the stage 100. The inkjet head 400 may be positioned along the upper pad shaft 300 in a direction parallel to the stage 100. That is, while the lower pad 600 rotates at a constant speed while supporting the panel P1, the inkjet head 400 connected to the upper pad shaft 300 discharges the adhesive on the panel P1 to provide an adhesive layer. (R) can be formed.

The adhesive in the form of droplets may be an optical clear resin (OCR). The liquid type adhesive may be any one of acrylic, epoxy, silicone, or rubber resins, or a mixture thereof, and preferably, a UV curable resin.

In order to control the fluidity of the liquid type adhesive, a UV curing machine 410 may be provided on the upper pad shaft 300 in parallel with the inkjet head 400.

The UV curing machine 410 may irradiate UV light at the same time as the inkjet head 400 is discharged or at a time difference after discharge. In the UV curing machine 410, the curing time and temperature may be adjusted according to the characteristics of the adhesive layer R by programming data.

Protective film separation pad (500)

FIG. 5(a) is a side view showing the protective film PF stacked up and down of the bonded panel P2 on any one of the upper pads 200 before the bonding process, and FIG. 5(b) is a side view showing the bonded panel ( It is a side view showing a process in which P2) is laminated and bonded on the panel P1.

5(b) shows the bonding process of the panel P2 and the panel P1 on the upper pad 200, and a process of bonding and forming other panels P3 and P4 or an adhesive layer R Also, since the process is the same as that of the bonding process of the panel P2, a description thereof will be omitted.

Referring to FIG. 5B, the protective film separation pad 500 may recover the protective film PF from the adhered panels P2, P3, and P4 or the film-type adhesive layer R. The protective film separation pad 500 may be positioned to be adjacent to the side surface of the stage 100, that is, to each of the upper pads 200. The protective film separation pad 500 separates and recovers the protective film PF wound on the upper pad 200 during the bonding process, and only the panels P2, P3, and P4 to be bonded are provided on the lower pad 400. can do.

As shown in FIG. 5(b), the upper pad 200 has the protective film PF stacked on both sides as the bonding process proceeds, the protective film separating pad 500 protects each The film PF may be separated from the upper and lower portions of the bonded panel P2, and may be bonded to the panel P1 on the lower pad 600 to be described later while the bonded panel P2 is exposed to the outside.

According to an embodiment, while the protective film separating pad 500 rotates, the protective film PF on the adhered panels P2, P3, P4 or the adhesive layer R is transferred from the upper pad 200 to the protective film separating pad 500. ), the protective film PF can be removed from the adhered panels P2, P3, P4 or the adhesive layer R.

Lower pad 600

Referring back to FIGS. 2 to 5, the lower pad 600 may support one surface of the panel P1 and provide the panel P1 so as to face the bonded panels P2, P3, and P4. The lower pad 600 may rotate while supporting the panel P1.

On the flexible display device bonding system 10, the panel P1 is supported by the lower pad 600 to perform a bonding process. The lower pad 600 may be engaged with the upper pad 200 at the same time, and the panels P2, P3, and P4 to be bonded may be bonded to the panel P1 from one end to the other end. In some cases, the film-type adhesive layer R may also be bonded while being engaged with the panel P1 from one end to the other.

The lower pad 600 may have a width corresponding to the panel P1. According to an embodiment, the lower pad 600 has a circular shape and may be rotated by a driving force of a motor (not shown). The lower pad 600 may fix and support the panel P1 by vacuum adsorption or adhesion of a certain viscosity.

The fixing force of the lower pad 600 may be stronger than that of the upper pad 200 during a process operation. That is, the panel P1 does not come off during the bonding process, and the panel P2, P3, and P4 or the adhesive layer R is attached to the panel P1 during the bonding process. However, after the bonding process is all completed, the vacuum suction force may be removed or the flexible display device may have an adhesive force sufficient to easily separate the flexible display device by a predetermined external force.

The lower pad 600 may have a certain level of elasticity. As a result, during the bonding process of the panel P1, it is possible to absorb the shock caused by the external force as a buffer effect.

Lower pad shaft 700

Referring back to FIGS. 2 to 5, the lower pad shaft 700 may provide rotational force to the lower pad 600 by driving a motor (not shown). The lower pad shaft 700 is provided extending at one end of the lifting lift 800, which will be described later, and can be moved up and down in a vertical direction.

Elevating Lift(800)

Referring back to FIGS. 2 to 4B, the lifting lift 800 may vertically move the lower pad 600 so that the panel P1 engages the adhered panels P2, P3, and P4.

Alignment unit (900)

The alignment unit 900 may adjust the positions of the lower pad 600 and the upper pad 200 so that the lower pad 600 and the upper pad 200 correspond to each other. The alignment unit 900 can check the location path of each of the adhered panels P2, P3, and P4 and the elevation height of the panel P1 to align the location, and provide location information for the operator to check each process state. To be able to do it. The alignment unit 900 may check the position values of each of the panels P1, P2, and P3 in real time to control the bonding process of the flexible display device bonding system 10 as a whole. According to an embodiment, the upper pad 200 and the lower pad 600 may include alignment marks (not shown) for facilitating process control. The alignment unit 900 may check the alignment mark (not shown) and control the bonding process of the panels P1, P2, P3, and P4.

The alignment unit 900 may drive and control the upper pad 200 so that the upper pad 200 supporting the bonded panels P2, P3, and P4 or the adhesive layer R faces the lower pad 600. I can. The alignment unit 900 may drive and control the lift lift 800 so that the panel P1 can be adjacent to or adhere to the adhered panels P2, P3, and P4 or the adhesive layer R. The alignment unit 900 applies a rotational force from one end to the other end of the upper pad 200 and the lower pad 600 during the bonding process of the panel P1 and the panels P2, P3, and P4, or the adhesive layer R. You can make them stick together. The alignment unit 900 according to an embodiment controls the discharge amount of the adhesive R in the form of droplets of the inkjet head 400 and the degree of curing of the UV curing machine 410 to control the adhesive layer R laminated on the panel P1. The formation can be controlled.

FIG. 4A is a view showing a process of forming an adhesive layer in which the adhesive layer R in the form of droplets is stacked on the panel P1, and FIG. 4B is a panel P2 to be bonded to the panel P1 in which the adhesive layer R in the form of droplets is stacked. ) Is a diagram showing the bonding process of additional bonding.

After forming the adhesive layer R in the form of droplets on the panel P1, the operational relationship in the bonding process of the panel P2 to be bonded will be described according to the time series as follows.

As shown in FIG. 4A, the stage 100 may be rotated so that the inkjet head 400 faces the lower pad 600. After the inkjet head 400 discharges the adhesive R in the form of droplets and forms an adhesive layer R in the form of droplets on the panel P1 supported by the lower pad 600, the UV curing machine 410 forms an adhesive layer in the form of droplets. By curing (R), it is possible to reduce the fluidity of the droplet-shaped adhesive layer R to prevent the droplet-shaped adhesive layer R from flowing down from the panel P1.

As shown in FIG. 4B, the stage 100 is moved so that the upper pad 200 faces the lower pad 600 in order to attach the adhered panel P2 to the panel P1 on which the adhesive layer R in the form of droplets is formed. It can be rotated and moved. A lifting lift 800, which will be described later, may lift and move the lower pad 600 to a position where the panel P1 on which the adhesive layer R in the form of droplets is formed and the panel P2 to be bonded contact each other. In a state in which the upper pad 200 and the lower pad 600 can be bonded to each other, the panel P1 on which the adhesive layer R in the form of a droplet is formed and the panel P2 to be bonded may be bonded from one end to the other. The bonded panel P2 is separated from the upper pad 200 in the direction from one end to the other end and may be moved to the panel P1 on the lower pad 600.

In conjunction with the lower pad 600 to be described later, the bonding process of the panel P1 and the bonded panel P2 is performed, or after the bonding process, the bonded panel P2 to be used for the subsequent bonding process is additionally supplied to the upper pad 200 after the bonding process. As such, while the plurality of upper pads 200 are mounted on the stage 100, different processes may be simultaneously performed.

6 is a flowchart illustrating a method of bonding a flexible display device according to an exemplary embodiment of the present invention.

Hereinafter, each step of configuring a method for bonding a display panel according to an embodiment of the present invention will be described in detail. In this case, in explaining the method of bonding the display panel, each will be described in a time-series order.

2 to 6, the display device bonding method includes a first bonding panel bonding step (S10), a stage rotation moving step (S20), and a second bonding panel bonding step (S40), and a loading step ( S00) and the lifting adjustment step (S30), it may further include an unloading step (S50).

In the method of bonding the display device, a panel constituting the flexible display device and at least two or more different panels to be bonded may be bonded together.

The bonding method of the display device below describes the bonding process of the panel and the panel to be bonded, but the same proceeds when bonding the adhesive layer interposed between the panel and the panel to be bonded to the panel, and the method is the same, so the bonding layer on the panel. A description of how to bond them will be omitted.

In the loading step (S00), the adhered panel may be loaded on each upper pad, and the panel may be loaded on the lower pad. In the loading step S00, the upper pad may rotate and move along the edge of the stage.

In the first bonding panel bonding step (S10 ), the first bonding panel may be bonded to the panel from one end to the other. In the first bonding step S10, the stage may be rotated so that the upper pad is parallel to the lower pad. In the first bonding of the panels to be bonded (S10), the lift lift may adjust the height of the lower pad so that the bonded panels and the panels can be adjacent to each other or adhere to each other. In the first panel bonding step (S10 ), the first panel to be bonded may be bonded to the panel from one end to the other end while the upper pad and the lower pad are engaged.

In the first bonded panel bonding step (S10), the upper pad, the protective film separation pad, and the lower pad rotate in synchronization with each other, and the first bonded panel on the upper pad is bonded to the panel on the lower pad. The protective film laminated on the upper and lower surfaces of the device can be recovered and removed with a protective film separation pad.

In the stage rotation movement step S20, the stage may be rotated so that the second panel to be bonded faces the panel. In this case, the second bonded panel may be supported by the upper pad on the stage. In addition, another upper pad that provided the first panel to be bonded and the upper pad that supported the second panel to be bonded may be provided spaced apart from each other.

In the elevating adjustment step S30, the height of the panel may be elevated so as to correspond to the second panel to be bonded. In the elevating adjustment step S30, the elevation of the lower panel is adjusted by the elevating lift to adjust the position of the panel so that the second adhered panel and the panel abut each other. In the elevating adjustment step (S30), the panel to which the first panel to be adhered is attached may be elevated and lowered.

In the second bonding of the panel to be bonded (S40), the second panel to be bonded may be bonded on the panel from one end to the other.

In the second bonding panel bonding step (S40), the upper pad, the protective film separation pad, and the lower pad rotate in synchronization with each other, and the second panel to be bonded on the upper pad is bonded to the panel on the lower pad, and the second panel to be bonded The protective film laminated on the upper and lower surfaces of the device can be recovered and removed with a protective film separation pad.

After the second bonded panel bonding step (S40), the first bonded panel and the second bonded panel may be sequentially laminated and bonded on the panel.

In the unloading step, the panel may be unloaded from the lower pad.

According to a method of bonding a flexible display device according to another embodiment of the present invention, a step of forming an adhesive layer may be further included.

In the step of forming the adhesive layer, the inkjet head may be moved to face the panel in the vertical direction. In the step of forming the adhesive layer, the inkjet head may discharge an adhesive in the form of droplets to form an adhesive layer on the panel. In addition, in the adhesive layer forming step, the UV curing machine may irradiate UV to the adhesive layer laminated on the panel at the same time as the inkjet head or at a time difference.

As described above, the present invention has been described in detail using preferred embodiments, but the scope of the present invention is not limited to specific embodiments, and should be interpreted by the appended claims. In addition, those who have acquired ordinary knowledge in this technical field should understand that many modifications and variations are possible without departing from the scope of the present invention.

10: Flexible display panel bonding system
100: stage
200: upper pad
300: upper pad shaft
400: inkjet head
500: protective film separation pad
600: lower pad
700: lower pad shaft
800: elevating lift
900: Alignment unit
P1: Panel
P2, P3, P4: Panel to be bonded
R: adhesive layer

Claims (8)

In a flexible display panel bonding system for bonding a panel constituting a flexible display device and a panel to be bonded different from each other,
stage;
At least two or more spaced apart on the stage to support the bonded panel and rotatable upper pad; And
And a lower pad rotatable while supporting the panel,
The flexible display panel bonding system, wherein the lower pad is simultaneously engaged with the upper pad and bonds the bonded panel to the panel from one end to the other end.
The method of claim 1,
The flexible display panel bonding system further comprising an upper pad shaft capable of moving in position according to the rotation of the stage and providing a rotational force to the upper pad.
The method of claim 1,
The flexible display panel bonding system further comprising an inkjet head provided at one end of the stage to be spaced apart from the upper pad and movable to discharge an adhesive layer on the panel according to the rotation of the stage.
The method of claim 1,
The flexible display panel bonding system further comprising a protective film separation pad provided adjacent to the stage and recovering the protective film from the adhered panel on the upper pad.
The method of claim 1,
The flexible display panel bonding system further comprising a lifting lift for lifting the lower pad in a vertical direction so that the panel is engaged with the panel to be bonded.
The method of claim 1,
The flexible display panel bonding system further comprising an alignment unit for adjusting a positional movement of the upper pad so as to correspond to the lower pad.
In the flexible display panel bonding system for bonding a panel constituting a flexible display device and at least two different bonded panels of a first bonded panel and a second bonded panel,
A first bonded panel bonding step of bonding the first bonded panel to the panel from one end to the other;
A stage rotation moving step of rotating the stage so that the first panel to be bonded and the second panel to be bonded spaced apart from each other are to face the panel; And
And a second bonded panel bonding step of bonding the second bonded panel from one end to the other on the panel.
The method of claim 7,
Before the step of bonding the second panel to be bonded,
A method of bonding a flexible display panel, further comprising an elevation adjustment step of elevating and adjusting the height of the panel to correspond to the second panel to be bonded.

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