KR102219198B1 - Holding arrangement for substrates and apparatus and method using the same - Google Patents

Abstract

A holding arrangement 10 is provided for holding the substrate 20 during vacuum layer deposition. The retaining arrangement 10 comprises a frame 30 having two or more frame elements 31, 32, 33, 34-the frame elements 31, 32, 33, 34 having an aperture opening. Forming-and an elastic means 40 configured to provide a clamping force acting against portions of the substrate edges to clamp the substrate 20 at the substrate edges.

Description

Holding arrangement for substrates, and apparatus and method using the same TECHNICAL FIELD

[0001] Embodiments of the invention relate to a holding arrangement for holding a substrate during processing, such as layer deposition, and a method for holding a substrate during the processing. Embodiments of the present invention particularly relate to a holding arrangement for holding a substrate during vacuum layer deposition, and a method for holding a substrate during the vacuum layer deposition.

[0002] Several methods are known for depositing material on a substrate. For example, substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, or the like. Typically, the process is carried out in a process apparatus or process chamber in which the substrate to be coated is located. A vapor deposition material is provided to the device. A plurality of materials, as well as oxides, nitrides, or carbides of such materials, may be used for deposition on a substrate. Additionally, other processing steps such as etching, structuring, annealing, etc. may be performed in the processing chambers.

[0003] Coated materials can be used in several applications, and in several technical fields. Applications exist in the field of microelectronics, such as creating semiconductor devices, for example. Also, substrates for displays are often coated by a PVD process. Additional applications include insulating panels, organic light emitting diode (OLED) panels, substrates with TFTs, color filters, and the like.

Typically, glass substrates may be supported on carriers, during processing of the glass substrates. The carrier drives the glass or substrate through the processing machine. Carriers typically form a frame or plate, which frame or plate supports the surface of the substrate along the periphery of the substrate, or, in the latter case, such a surface. In particular, the frame-shaped carrier can also mask the glass substrate, wherein the aperture in the carrier, surrounded by the frame, can cause the coating material to be deposited on the exposed substrate portion. It provides an aperture for, or other processing steps acting on the portion of the substrate exposed by the aperture. Additionally, retaining arrangements are provided to hold the substrate in place during the deposition process and to secure the substrate to the frame.

[0005] In some areas, for example, for mobile application displays (eg, liquid crystal displays), for example in display touch panel manufacturing using physical vapor deposition (PVD), manufacturers are using a larger mother glass ), and then cutting those larger mother glasses to the final mobile phone size, the substrates to be coated are previously already similar to the final device size (e.g. mobile phone size), a one glass substrate (OGS) solution ( solution).

The available holding arrangements hold the substrates by applying a holding force to the elongating surfaces of the substrate, ie, also on the elongating surface to be coated. For example, a clamp contacts both the elongating surfaces to hold or clamp the substrate. Thus, at least some of the above requirements, particularly associated with the OGS approach, cannot be satisfied.

[0007] In view of the above, it is an object of the present invention to provide a holding arrangement that overcomes at least some of the problems in the art, in particular, a holding arrangement for holding a substrate during vacuum layer deposition.

[0008] In view of the above, there is provided a holding arrangement for holding a substrate during vacuum layer deposition, according to independent claim 1, and a method for holding a substrate during vacuum layer deposition, according to independent claim 15 do. Additional aspects, advantages, and features of the invention will become apparent from the dependent claims, the detailed description, and the accompanying drawings.

[0009] According to one embodiment, a holding arrangement for holding a substrate during vacuum layer deposition includes a frame having two or more frame elements, the frame elements forming an aperture opening, and And elastic means configured to provide a clamping force acting against the substrate edges to clamp the substrate at the substrate edges.

[0010] According to another embodiment, a holding arrangement for holding a substrate during vacuum layer deposition may include a frame having two or more frame elements, the frame elements forming an aperture opening, and two or more thereof. And resilient means for connecting the excess frame elements. The two or more frame elements are movable with respect to each other and are configured to vary the size of the aperture opening. The elastic means provide a retracting force acting on the two or more frame elements to clamp the substrate at the substrate edges.

[0011] According to one embodiment, an apparatus for depositing a layer on a substrate includes: a chamber adapted for layer deposition therein, in the chamber, a holding arrangement as described above, and depositing a material forming the layer And a deposition source for

[0012] According to one embodiment, a method for holding a substrate during vacuum layer deposition includes providing a frame for forming an aperture opening, positioning a substrate at the aperture opening, and removing the substrate at the substrate edges. And providing a clamping force acting against the substrate edges to clamp.

[0013] According to another embodiment, a method for holding a substrate during vacuum layer deposition includes increasing the size of an aperture opening formed by two or more frame elements of a frame. Moving relative to each other, positioning the substrate at the aperture opening, and releasing two or more frame elements to clamp the substrate at the substrate edges.

[0014] In a way that the above-listed features of the present invention can be understood in detail, a more specific description of the present invention briefly summarized above may be made with reference to embodiments. The accompanying drawings relate to embodiments of the present invention, and are described below.
1 illustrates a holding arrangement according to embodiments described herein and provided with a substrate at an aperture opening of the holding arrangement.
2 illustrates a holding arrangement in accordance with embodiments described herein and with the substrate provided at the aperture opening of the holding arrangement released.
3 shows a detailed view of a holding arrangement according to embodiments described herein.
4 illustrates another holding arrangement according to embodiments described herein, and a substrate to be positioned in the aperture opening of the holding arrangement.
FIG. 5 illustrates the retaining arrangement of FIG. 4 in accordance with embodiments described herein and in which the substrate is received and clamped in the aperture opening.
6 illustrates a holding arrangement according to embodiments described herein.
7 illustrates a detailed view of the holding arrangement of FIG. 6 in accordance with embodiments described herein.
8 illustrates a schematic view of a frame protruding over a substrate surface, according to embodiments described herein.
9 shows a diagram of an apparatus for depositing a layer of material on a substrate, utilizing a holding arrangement according to embodiments described herein.
10 shows a flow diagram of a method for holding a substrate during vacuum layer deposition, in accordance with embodiments described herein.

[0015] Reference will now be made in detail to various embodiments of the present invention, and one or more examples of such various embodiments are illustrated in the drawings. Within the following description of the drawings, like reference numbers refer to like components. In general, only the differences for the individual embodiments are described. Each example is provided as a description of the invention and is not intended as a limitation of the invention. Additionally, features illustrated or described as part of one embodiment may be used for other embodiments, or in conjunction with other embodiments, to yield another embodiment. The description is intended to include such modifications and variations.

[0016] According to typical embodiments that can be combined with other embodiments described herein, the substrate thickness may be 0.1 to 1.8 mm, and the holding arrangement, and in particular, the holding devices will be adapted for such substrate thicknesses. I can. However, it is particularly advantageous that the substrate thickness is about 0.9 mm or less, such as 0.5 mm or 0.3 mm, and that the holding arrangement and, in particular, the holding devices are adapted for such substrate thicknesses.

According to some embodiments, large area substrates, or carriers supporting one or more substrates, ie, large area carriers, may have a size of at least 0.174 m ² . Typically, the size of the carrier can be about 1.4 m ² to about 8 m ² , more typically about 2 m ² to about 9 m ² , or even up to 12 m ² . Typically, the rectangular area on which the substrates are supported, provided with holding arrangements, devices, and methods, according to embodiments described herein, are carriers with sizes for large area substrates as described herein. . For example, a large area carrier, which will correspond to the area of a single large area substrate, corresponds to GEN 5, which corresponds to substrates of about 1.4 m ² (1.1 mx 1.3 m), and substrates of about 4.29 m ² (1.95 mx 2.2 m) It can be GEN 7.5, GEN 8.5, corresponding to substrates of about 5.7 m ² (2.2 mx 2.5 m), or even GEN 10, corresponding to substrates of about 8.7 m ² (2.85 m × 3.05 m). Even larger generations, such as GEN 11 and GEN 12, and the corresponding substrate areas can be similarly implemented.

Typically, the substrate can be made of any material suitable for material deposition. For example, the substrate may be glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound materials, carbon fiber materials, or any other material that can be coated by a deposition process. , Or a material selected from the group consisting of combinations of materials.

1 illustrates a holding arrangement 10 according to embodiments described herein and provided with a substrate 20 at the aperture opening of the holding arrangement 10.

[0020] According to some embodiments, the holding arrangement 10 for holding the substrate 20 during vacuum layer deposition has two or more frame elements 31, 32, 33, and 34. , Carrier or frame 30-frame elements 31, 32, 33, and 34 form aperture openings-and act against the substrate edges to clamp the substrate 20 at the substrate edges. And resilient means configured to provide a clamping force. In the example illustrated in FIG. 1, the frame has four frame elements 31, 32, 33, and 34.

In the case of the OGS approach, the PVD process (eg, magnetron cathode sputtering process) used to coat films on the substrates keeps the substrates inside the carrier, such as masking of the substrates It needs to be applied on the complete substrate surface from rim to rim, without any disturbance or interference of the film coating from any holding arrangements that allow it. In particular, in this OGS solution, the following aspects need to be considered: The holding arrangement may not cover the substrate rim region on the substrate front (ie, no edge exclusion). The front side of the substrate should be coated from rim to rim. The retaining arrangement may not protrude above the substrate rim height, and this protrusion will impede the surface coating. The retaining arrangement should protect the substrate backside from any (visible) coating remnants (i.e., no backside coating), and the retaining arrangement should be any (visible) coating remnants. ) The substrate rims should be protected from coating residues (ie no rim coating).

The term “substrate edge” or “substrate edges” as used herein refers to lateral surfaces of the substrate, ie, surfaces extending along the thickness direction of the substrate 20. For example, the edge may be the surface of the substrate connecting the rear side of the substrate and the front side of the substrate. In addition to the side surfaces, the substrate 20 has two extending surfaces. One of the elongating surfaces of the substrate 20 may be the surface to be processed, eg coated, and may be referred to as the front side of the substrate 20. The other elongating surface opposite the elongated surface to be processed may be referred to as the back side of the substrate 20. However, according to some embodiments, also, both of the elongating surfaces can be processed. Thus, it is understood that the substrate has four side surfaces.

[0023] The term "elastic means" as used herein may refer to the singular and plural, ie, one elastic means and a plurality of elastic means. This in particular depends on the specific embodiments, where in some embodiments, one elastic means is provided, and in some embodiments, a plurality of elastic means are provided.

According to some embodiments that may be combined with other embodiments described herein, the aperture opening is configured to receive or house the substrate 20. According to some embodiments, two or more frame elements 31, 32, 33, and 34 are movable with respect to each other and are configured to vary the size of the aperture opening. This has the particular advantage that the substrates 20 can be easily loaded into the frame 30 and unloaded from the frame 30. Additionally, thermal elongations of the substrate 20, the frame 30, and the mounting plate (see, e.g., FIGS. 4 and 5) on which the frame 30 may be mounted, such as during coating, will be compensated. I can.

According to some embodiments, when the substrate 20 is loaded into the frame 30, in order to expand or increase the size of the aperture opening, two or more frame elements 31 , 32, 33, and 34) are moved. Once the substrate 20 is positioned within the aperture opening, two or more frame elements 31, 32, 33, and 34 are moved to reduce the size of the aperture opening again. Thereby, the substrate 20 is clamped in the aperture opening by providing a clamping force acting against the substrate edges to clamp the substrate 20 at the substrate edges. According to some embodiments, the elastic means cause the two or more frame elements 31, 32, 33, and 34 to move back, reducing the size of the aperture opening. Thus, forces act against the substrate edges, ie against the portions of the side surfaces that are essentially parallel to the extending surfaces, for example the front side and the rear side.

[0026] When the substrate 20 is unloaded from the frame 30, to increase the size of the aperture opening and to release the clamping force acting on the substrate edges, two or more frame elements Fields 31, 32, 33, and 34 can be moved. Thereafter, the substrate 20 can be removed from the aperture opening.

According to some embodiments, which may be combined with other embodiments described herein, the frame 30 does not cover any portion of the extending surface to be processed. That is, the frame 30 does not touch the extending surface to be processed, around the perimeter of the substrate. This allows the processing of the fully elongated surface. Additionally, for example, the coating quality is not hindered or degraded by the frame 30.

According to some embodiments, two or more frame elements 31, 32, 33, and 34 at least partially cover the substrate edges. By way of example, two or more frame elements 31, 32, 33, and 34 completely cover the substrate edges, i.e., there is a substrate edge or rim coating, to prevent any coating of the substrate edges. And, in particular, there is no visible substrate edge or rim coating. This is particularly advantageous in LCD manufacturing in which additional process steps to remove any undesired coating residues on such substrate edges, which will become visible on the final device (eg, mobile phone), must be avoided. This is because, in some cases, due to design considerations, the display is glued onto the mobile phone housing, thus making the small display rim visible.

[0029] According to some embodiments that may be combined with other embodiments described herein, two or more frame elements 31, 32, 33, and 34 may include a surface of the substrate 20 It is configured to clamp the substrate 20 against the substrate edges while being aligned with the surface of the two or more frame elements 31, 32, 33, and 34. None of the frame elements 31, 32, 33, and 34 protrude above the surface to be processed, i.e., above the edge or rim height, the frame 30 or the frame elements 31, 32, 33 , And 34), the coating quality is not hindered or deteriorated. According to some other embodiments, at least a portion of at least one of the frame elements 31, 32, 33, and 34 protrudes above the substrate surface. This aspect is illustrated in FIG. 8 and described later.

[0030] According to some embodiments that may be combined with other embodiments described herein, two or more frame elements 31, 32, 33, and 34 act on the substrate edges. In order to provide a clamping force that is in contact with the substrate edges. By way of example, two or more frame elements 31, 32, 33, and 34 are, as described above, to prevent any coating of the substrate edges, the substrate edges, i.e. the side surface of the substrate. Contacting the substrate edges, so as to partially or completely cover them, wherein one dimension of the side surface corresponds to the substrate thickness.

[0031] According to some embodiments that can be combined with other embodiments described herein, the frame 30 has two first side sections (ie, frame elements 31 and 33), for example With vertical sections, and two second side sections (i.e. frame elements 32 and 34), such as horizontal sections, such two first side sections 31 and 33 and two second side Sections 32 and 34 are configured to loop around, encapsulate, or surround the substrate 20. The terms horizontal and vertical sections refer to the construction of a deposition device for vertically oriented substrates. In such a configuration, the extending surfaces of the substrate 20 are substantially parallel to the direction of gravity.

According to some embodiments that may be combined with other embodiments described herein, the frame 30 is substantially rectangular in shape.

[0033] According to some embodiments, which may be combined with other embodiments described herein, the elastic means is two or more frame elements 31, 32, 33, and, to provide a clamping force. 34) It is configured to provide a retracting force acting on the phase. By way of example, the elastic means may be configured to pull two or more frame elements 31, 32, 33, and 34 towards each other. Thereby, the substrate 20 can be clamped and held in the aperture opening.

According to some embodiments, which may be combined with other embodiments described herein, two or more frame elements 31, 32, 33, and 34 are connected by elastic means. Thereby, in particular, a retracting force acting on two or more frame elements 31, 32, 33 and 34 can be provided. According to some embodiments, each two of the two or more frame elements 31, 32, 33, and 34 are connected by means of a respective one of the elastic means. According to some other embodiments, more than two of the two or more frame elements 31, 32, 33, and 34 are connected by means of a respective one of the elastic means. According to some other embodiments, all two or more frame elements 31, 32, 33, and 34 are connected by one elastic means.

According to some embodiments, which may be combined with other embodiments described herein, the resilient means 40 comprises one or more springs. In the above example, according to some embodiments, each two of the two or more frame elements 31, 32, 33, and 34 are elastic means having one or more springs. Each of them is connected by an elastic means. According to some other embodiments, more than two of the two or more frame elements 31, 32, 33, and 34 are each one of the elastic means having one or more springs. Are connected by means of elasticity. According to some other embodiments, all two or more frame elements 31, 32, 33, and 34 are connected by one elastic means with one or more springs.

According to some embodiments, which may be combined with other embodiments described herein, the elastic means comprises one or more elastic bands, such as rubber bands. Referring back to the above example, according to some embodiments, each of the two frame elements of the two or more frame elements 31, 32, 33, and 34 is one or more elastic bands. Each of the elastic means having them is connected by one of the elastic means. According to some other embodiments, more than two of the two or more frame elements 31, 32, 33, and 34 are each of the elastic means having one or more elastic bands. It is connected by one elastic means. According to some other embodiments, all two or more frame elements 31, 32, 33, and 34 are connected by one elastic means with one or more elastic bands.

As an example, the elastic band may be configured to completely surround the frame 30, in order to connect all the frame elements 31, 32, 33, and 34 of the frame 30. In this case, the elastic band may form a closed loop. According to some embodiments, any combination of different elastic means such as springs and elastic bands may be used.

According to some embodiments, which may be combined with other embodiments described herein, the elastic means is covered by two or more frame elements 31, 32, 33, and 34. According to some embodiments, which may be combined with other embodiments described herein, the elastic means are incorporated into two or more frame elements 31, 32, 33, and 34. The elastic means can be covered by a frame, or can be incorporated into the frame body, to protect the elastic means from stray coating and subsequent particle peeling.

[0039] According to some embodiments that may be combined with other embodiments described herein, the two or more frame elements 31, 32, 33, and 34 are made of metal or plastic, or Or metal or plastic. By way of example, two or more frame elements 31, 32, 33, and 34 can be made of any machinable material, such as metals (e.g., aluminum, stainless steel) or vacuum capable) plastics (eg PEEK).

[0040] According to some embodiments that may be combined with other embodiments described herein, at least some of the surfaces of the two or more frame elements 31, 32, 33, and 34 are roughened. Become roughened. Thus, the stray coating and undesirable particles adhere to the roughened surface, whereby deterioration of the quality of the coated films is prevented.

2 illustrates a holding arrangement 10 in accordance with embodiments described herein and with the substrate 20 provided at the aperture opening of the holding arrangement 10 released.

According to some embodiments, when the substrate 20 is loaded into the frame 30, in order to increase the size of the aperture opening, two or more frame elements 31, 32, 33 , And 34) can be moved. When the substrate 20 is positioned within the aperture opening, two or more frame elements 31, 32, 33, and 34 are moved back to reduce the size of the aperture opening again. Thereby, a clamping force is provided that acts against the substrate edges to clamp the substrate 20 at the substrate edges. According to some embodiments, the elastic means allows the two or more frame elements 31, 32, 33, and 34 to return, to reduce the size of the aperture opening and to clamp the substrate 20. Let them move.

[0043] When the substrate 20 is unloaded from the frame 30, as shown in FIG. 2, in order to increase the size of the aperture opening, two or more frame elements 31, 32 , 33, and 34) can be moved. The movement is indicated by arrows marked with reference numeral 39. The two or more frame elements 31, 32, 33, and 34 are separated from each other in separation zones indicated by reference numerals 35, 36, 37, and 38. In Fig. 2, four frame elements and four corresponding separation zones 35, 36, 37, and 38 are shown, but the embodiments described herein are not limited thereto. There may be any number of frame elements and corresponding separation zones, such as two frame elements and two separation zones. In the example of FIG. 2, the separation zones 35, 36, 37, and 38 are corner zones of the frame 30.

[0044] To separate two or more frame elements 31, 32, 33, and 34, by moving the two or more frame elements 31, 32, 33, and 34 , The size of the aperture opening is increased, and thus, the clamping force acting on the substrate edges is released. Thereafter, the substrate 20 can be removed from the aperture opening.

[0045] FIG. 3 shows a detailed view of the holding arrangement illustrated in FIG. 2, according to embodiments described herein. 3 shows the holding arrangement in the open position, in the open position the substrate 20 is no longer clamped, and in particular, is no longer clamped by the frame element 34.

As shown in FIG. 3, according to some embodiments that may be combined with other embodiments described herein, two or more frame elements 31, 32, 33, and 34 The silver can be further connected by tongue and groove connections (marked by reference numeral 41 ), dowels, or key and/or slot joints. By way of example, two or more frame elements 31, 32, 33, and 34 are, by means of the tongue connections 41, dowels, or key and/or slot joints, relative to each other. Can be aligned.

In the example shown in Figure 3, the elastic means 40 is an elastic band, for example a rubber band. An elastic band may be provided to connect only the two frame elements 33 and 34, or may be provided to completely surround the frame to connect all frame elements of the frame. In the latter case, the elastic band may be a closed loop.

[0048] According to some embodiments that can be combined with other embodiments described herein, even when the substrate 20 is clamped to the aperture opening, two or more, similar to the gap shown in FIG. 3 A gap may remain between the excess frame elements 31, 32, 33, and 34. The existence of the gap and the size of the gap may depend on at least one of the minimum size of the aperture opening, the size of the substrate 20, and thermal conditions. In the latter case, the columns of the substrate 20, the frame 30, and the mounting plate on which the frame can be mounted (see, for example, FIGS. 4 and 5, and the mounting plate is indicated by reference numeral 50). Includes kidneys. According to some embodiments, the gaps are small enough not to interfere with the substrate coating quality.

FIG. 4 illustrates another holding arrangement 10 according to embodiments described herein, and a substrate 20 to be located in the aperture opening of the holding arrangement 10.

According to some embodiments that may be combined with other embodiments described herein, the frame 30 is mounted on the mounting plate 50. The mounting plate 50 may be configured to be attached to a substrate transport device of a deposition chamber, for example, as shown in FIG. 9, for example. In this regard, the mounting plate 50 may have attachment means 51 such as holes for insertion of fastening elements such as screws, for example. According to some embodiments, at least one of the frame elements 31 and 32 of the frame 30 is a frame element to change the size of the aperture opening to load and/or unload the substrate 20. In order to allow the movement of the at least one of the s 31 and 32, it is provided to be movable relative to the mounting plate 50.

The frame 30 shown in FIG. 4 has a substantially rectangular shape. According to some embodiments, elastic means are provided in the corner regions of the frame 30. According to some embodiments, the elastic means connect two or more frame elements 31, 32. In the example of Fig. 4, two frame elements 31 and 32 are provided. The gap between the frame elements 31 and 32 is oriented at an angle of approximately 45° with respect to the extension of the frame elements 31 and 32. However, the frame 30 shown in FIG. 4 may have any other configuration, such as the configuration of any of the other embodiments disclosed herein.

[0052] FIG. 5 illustrates the holding arrangement of FIG. 4 according to embodiments described herein with the substrate clamped. The substrate 20 is positioned at the aperture opening of the frame 30 and is clamped at the substrate edges of the substrate, and thus remains rigidly within the aperture opening. As shown in Fig. 5, the frame elements provide a pushing force against the substrate edges, ie against the side surfaces of the substrate. Thereby, in particular, the front side is not covered by clamps or other holding means, and the entire front side of the substrate can be coated.

[0053] According to some embodiments that may be combined with other embodiments described herein, the entire edge of the substrate, ie all side surfaces, possibly excluding the gaps between the frame elements, is an edge, ie To prevent coating of the side surfaces, they are covered by frame elements. However, in the case where the coating of the edges may be acceptable, only portions of the edge of the substrate, i.e., two or more of the side surfaces, may be contacted by the frame elements, relative to the substrate edges. An acting clamping force is provided.

6 illustrates a holding arrangement similar to the holding arrangement represented in FIGS. 4 and 5, and FIG. 7 illustrates a detailed view of the holding arrangement of FIG. 6.

6 and 7 show a holding arrangement, in particular a case in which the frame 30 is in an open state. The gap 42 between the frame elements 31 and 32 is denoted by reference numeral 42. In the example of FIGS. 6 and 7 the gap 42 between the frame elements 31, 32 is oriented at an angle of approximately 45° with respect to the extension of the two or more frame elements 31, 32. do. In the example illustrated in FIGS. 6 and 7, the frame has two frame elements 31 and 32. However, the frame 30 shown in FIGS. 6 and 7 may have any other configuration, such as that of any of the other embodiments disclosed herein.

[0056] According to some embodiments that may be combined with other embodiments described herein, the gap shown in FIGS. 6 and 7 between the frame elements 31 and 32, even when the substrate is clamped. A gap similar to (42) may remain. The existence of the gap and the size of the gap 42 in the clamped state may depend on at least one of the minimum size of the aperture opening, the size of the substrate, and thermal conditions. The latter case includes thermal extensions of the substrate, frame 30, and mounting plate on which the frame 30 can be mounted. According to some embodiments, the gap is small enough not to interfere with the substrate coating quality.

[0057] According to some embodiments that may be combined with other embodiments described herein, at least one of the frame elements is fixedly attached to the mounting plate 50, and at least one of the frame elements is a mounting plate It is configured to be movable with respect to 50. In the example shown in FIGS. 6 and 7, the frame element 32 is fixedly attached to the mounting plate 50, where the frame element 31 is, as indicated by the arrow in FIG. 6, the mounting plate ( 50) is configured to be movable.

According to different embodiments, the holding arrangement 10 is for PVD deposition processes, CVD deposition process, structuring edging, heating (eg, annealing), or any kind of substrate processing. Can be utilized. Embodiments of holding arrangements 10 as described herein, and methods of utilizing such holding arrangements 10, are, in particular, non-stationary of vertically oriented large area glass substrates. In other words, it is useful for continuous substrate processing. Non-stop processing typically requires that the holding arrangement also provides masking elements for the process.

[0059] FIG. 8 illustrates a schematic view of a frame 30 protruding over a substrate surface, according to embodiments described herein. According to some embodiments, which may be combined with other embodiments described herein, at least a portion of at least one of the frame elements 31, 32, 33, and 34 is the substrate surface to be processed, i.e., the substrate coating area. Protrudes upward. The protruding frame elements 31, 32, 33, and 34 are configured so as not to interfere with the coating or coating quality. According to some embodiments, frame 30 includes an inclined surface having an angle 11 relative to the substrate surface. As an example, the angle 11 is equal to or less than 45°. According to some embodiments, the sloped surface is substantially aligned with the substrate edge such that no step occurs between the sloped surface of the frame 30 and the substrate surface.

9 shows a schematic diagram of a deposition chamber 600 according to embodiments. The deposition chamber 600 is adapted for a deposition process, such as a PVD or CVD process. The substrate 20 is shown positioned on a substrate transport device 620, in or within a holding arrangement or carrier having a frame 30 according to embodiments described herein. A deposition material source 630 is provided to the processing chamber 612, facing the side of the substrate 20 to be coated. The deposition material source 630 provides a deposition material to be deposited on the substrate 20.

In FIG. 9, the source 630 may be a target having a deposition material thereon, or any other arrangement that allows the material to be released for deposition on the substrate 20. Typically, the material source 630 may be a rotatable target. According to some embodiments, the material source 630 may be movable to replace and/or position the source. According to other embodiments, the material source may be a flat target.

According to some embodiments, the deposition material may be selected depending on the deposition process and the future application of the coated substrate. For example, the deposition material of the source may be a material selected from the group consisting of metals such as aluminum, molybdenum, titanium, copper, etc., silicon, indium tin oxide, and other transparent conductive oxides. Typically, oxide-, nitride-, or carbide-layers, which may include such materials, by providing material from a source, or by reactive vapor deposition, i.e., the material from the source is oxygen from the processing gas, By reacting with elements such as nitride, or carbon, it can be deposited. According to some embodiments, thin film transistor materials such as silicon oxides, silicon oxynitrides, silicon nitrides, aluminum oxide, and aluminum oxynitrides may be used as the deposition material.

Typically, a substrate 20 is provided within the aperture opening of the frame 30 of the holding arrangement 10. Lines 665 exemplarily show the path of the deposition material during operation of the chamber.

9, the holding arrangement 10 does not cover any part of the surface to be coated. This protects the substrate rims from any coating residues, ie no rim coating is present. Additionally, the front side of the substrate can be coated from rim to rim. Thus, the holding arrangement 10 according to the embodiments described herein is suitable, for example, for a one glass substrate (OGS) solution.

[0065] FIG. 10 shows a flow diagram of a method 100 for holding a substrate during vacuum layer deposition, in accordance with embodiments described herein.

[0066] According to some embodiments that may be combined with other embodiments described herein, a method for holding a substrate during vacuum layer deposition includes providing 101 a frame defining an aperture opening, Positioning (102) a substrate in the aperture opening, and providing (103) a clamping force acting against the substrate edges to clamp the substrate at the substrate edges.

[0067] According to some embodiments that may be combined with other embodiments described herein, positioning 102 of the substrate in the aperture opening comprises aligning the surface of the substrate with the surface of the frame. do. According to some embodiments, which may be combined with other embodiments described herein, positioning 102 of the substrate 20 in the aperture opening includes at least a portion of the frame 30 protruding above the surface of the substrate. While, positioning the substrate.

[0068] According to some embodiments, which may be combined with other embodiments described herein, a method for holding a substrate during vacuum layer deposition includes two or more frame elements of a frame. Moving relative to each other, in order to expand the size of the aperture opening formed by them-the frame elements are connected by elastic means, the elastic means acting on two or more frame elements. Providing a force—positioning the substrate in the aperture opening, and releasing the two or more frame elements to clamp the substrate at the substrate edges.

[0069] In accordance with embodiments described herein, the holding arrangement holds the substrate rigidly, particularly during the deposition process. The holding arrangement protects the substrate rims from any coating residues, i.e. no rim coating is present. According to some embodiments, the retaining arrangement does not cover the substrate rim region on the front of the substrate (ie, there is no edge exclusion), so that the substrate front side can be coated from rim to rim. In the case where the holding arrangement does not protrude above the substrate rim height, the surface coating is not disturbed. In addition, the holding arrangement can protect the substrate back side from any (visible) coating residues. Thus, the holding arrangement according to the embodiments described herein is suitable, for example, for a one glass substrate (OGS) solution.

[0070] Although the foregoing relates to embodiments of the present invention, other and additional embodiments of the present invention can be devised without departing from the basic scope of the present invention, and the scope of the present invention is determined by the following claims. Is determined.

Claims (15)

A holding arrangement 10 for holding a substrate 20 during vacuum layer deposition,
Frame 30 with two or more frame elements 31, 32, 33, 34, the frame elements 31, 32, 33, 34 forming an aperture opening; ; And
Elastic means (40) configured to provide a clamping force acting against portions of the substrate edges to clamp the substrate (20) at the substrate edges
Including,
The two or more frame elements 31, 32, 33, 34 are movable with respect to each other and are configured to change the size of the aperture opening,
The resilient means (40) is configured to provide a retracting force acting on the two or more frame elements (31, 32, 33, 34) to provide the clamping force. felled,
Keeping arrangement. The method of claim 1,
The aperture opening is configured to receive the substrate 20,
Keeping arrangement. The method according to claim 1 or 2,
The two or more frame elements (31, 32, 33, 34) are connected by the elastic means (40),
Keeping arrangement. The method according to claim 1 or 2,
The two or more frame elements 31, 32, 33, 34 covering the substrate edges,
Keeping arrangement. The method according to claim 1 or 2,
The two or more frame elements (31, 32, 33, 34), the surface of the substrate 20 is the surface of the two or more frame elements (31, 32, 33, 34) Aligned with and configured to clamp the substrate 20 at the substrate edges, or the two or more frame elements 31, 32, 33, 34, the frame elements 31, 32 , 33, and 34) are configured to clamp the substrate 20 at the substrate edges while some or all of the frame elements protrude above the surface of the substrate,
Keeping arrangement. The method according to claim 1 or 2,
The two or more frame elements 31, 32, 33, 34 are made of metal or plastic,
Keeping arrangement. The method according to claim 1 or 2,
At least a portion of the surface of the two or more frame elements 31, 32, 33, 34 is roughened,
Keeping arrangement. The method according to claim 1 or 2,
Said elastic means (40) comprises one or more springs,
Keeping arrangement. The method according to claim 1 or 2,
The elastic means 40 comprises one or more elastic bands,
Keeping arrangement. The method according to claim 1 or 2,
Said elastic means (40) is incorporated into said two or more frame elements (31, 32, 33, 34),
Keeping arrangement. An apparatus for depositing a layer on a substrate 20, comprising:
A chamber configured for layer deposition therein;
A holding arrangement (10) according to claim 1 or 2, in the chamber; And
A deposition source for depositing the material forming the layer
Containing,
Apparatus for depositing a layer. As a method 100 for holding a substrate 20 during vacuum layer deposition,
Frame 30 with two or more frame elements 31, 32, 33, 34, the frame elements 31, 32, 33, 34 forming an aperture opening; Providing (101);
Positioning (102) the substrate (20) in the aperture opening; And
Providing (103) a clamping force acting against the substrate edges to clamp the substrate (20) at the substrate edges by means of elastic means (40).
Including,
The two or more frame elements 31, 32, 33, 34 are movable with respect to each other and are configured to change the size of the aperture opening,
The elastic means (40) is configured to provide a retracting force acting on the two or more frame elements (31, 32, 33, 34) to provide the clamping force,
Method for holding a substrate. The method of claim 12,
Positioning (102) the substrate 20 at the aperture opening comprises aligning the surface of the frame 30 with the surface of the substrate 20, or the substrate at the aperture opening. Positioning (102) of (20) comprises positioning the substrate while at least a portion of the frame (30) protrudes above the surface of the substrate,
Method for holding a substrate. delete delete

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