KR102211483B1 - Information estimation apparatus and mothod of the object based on the laser pattern analysis - Google Patents

Abstract

Provided are an apparatus for estimating object information based on a laser pattern array pattern analysis and a method thereof. According to the present invention, the apparatus comprises: a laser unit irradiating laser light of a predetermined array pattern; a pattern image aquisition unit which acquires a pattern image including a plurality of optical pixels by photographing an array pattern formed by irradiating laser light; and an object information acquisition unit comparing a previously acquired and stored initial pattern image with the currently acquired pattern image to determine a change in two-dimensional (2D) position coordinates of the plurality of optical pixels in the array pattern, and calculating three-dimensional (3D) coordinates of the plurality of optical pixels from the determined 2D position coordinate change to estimate object information. Accordingly, various pieces of object information such as the distance and size of an object entering an array pattern area and the like can be accurately acquired at low costs.

Description

Object information estimation apparatus and method based on laser array pattern analysis {INFORMATION ESTIMATION APPARATUS AND MOTHOD OF THE OBJECT BASED ON THE LASER PATTERN ANALYSIS}

The present invention relates to an apparatus and method for estimating object information, and to an apparatus and method for estimating object information based on laser array pattern analysis.

Recently, the spread of devices that detect surrounding objects by themselves, such as autonomous vehicles and autonomous robots, and perform various tasks by analyzing the location, size, and shape of the detected objects, are spreading. Interest in object detection technology is also rapidly increasing.

Currently, in object detection technology, ultrasonic sensors and radar sensors are typically used. However, since ultrasonic sensors and radar sensors are expensive sensors, they are difficult to use in low-cost equipment.

On the other hand, Lidar sensor technology is the technology that attracts the most attention as an object detection technology using a laser. The configuration of the lidar sensor system is divided into a laser transmission unit, a laser detection unit, a signal collection and processing, and a part for transmitting and receiving data.

Similar to radar sensors, the lidar sensor modulates the waveform or wavelength of laser light to irradiate it as a beam signal, and detects an object by analyzing the reflected beam signal. In this case, according to the modulation method of the laser signal, it may be classified into a time-of-flight (TOF) method and a phase-shift method. In the TOF method, it is possible to measure the distance by measuring the time when the beam signals reflected from objects within the measurement range arrive at the receiver by emitting a beam signal modulated with a pulse waveform. The phase shifting method is a method of calculating time and distance by emitting laser light that is continuously modulated with a specific frequency and measuring the amount of phase change of laser light reflected from objects within a measurement range and returned.

However, in the case of the lidar sensor, because of the nature of the non-diffused laser light, it can only detect an object in a designated one-point area at a point in time. To detect an object over a large area, the laser irradiation angle is changed and irradiated continuously. In addition, it is necessary to quickly analyze the reflected and incident optical signal to detect an object, which requires high performance and expensive equipment.

Korean Registered Patent No. 10-1440085 (2014.09.03 registered)

An object of the present invention is to filter and irradiate the laser light to have a predetermined pattern, analyze the image of the pattern area of the irradiated laser light, and obtain object information from the change in the pattern according to the distance and size of the object entering the pattern area. It is to provide an apparatus and method for estimating object information based on laser array pattern analysis that can be obtained.

Another object of the present invention is to provide an apparatus and method for estimating object information based on laser array pattern analysis capable of acquiring information on an object entering a designated area at low cost.

Object information estimation apparatus according to an embodiment of the present invention for achieving the above object includes a laser unit for irradiating the laser light of a predetermined array pattern; A pattern image acquisition unit for obtaining a pattern image including a plurality of optical pixels by photographing the array pattern formed by irradiating the laser light; And comparing the previously acquired and stored initial pattern image with the currently acquired pattern image to determine changes in 2D position coordinates of the plurality of optical pixels of the array pattern, and 3 of the plurality of optical pixels from the determined 2D position coordinate change. An object information acquisition unit for estimating object information by calculating dimensional coordinates; Includes.

The object information obtaining unit calculates the three-dimensional coordinates of the plurality of optical pixels by using setting information obtained in advance according to the arrangement condition of the laser unit and the pattern image obtaining unit and a change in the two-dimensional position coordinates of the plurality of optical pixels. , From the calculated 3D coordinates, information on the location, size, and shape of the object can be estimated.

The setting information may include a height and angle at which the pattern image acquisition unit is disposed, an angle of view, and distance (L) information from the pattern image acquisition unit to a predetermined reference optical pixel among a plurality of optical pixels of the pattern array in the initial pattern image. have.

The pattern image acquisition unit includes an image acquisition unit that acquires an image of an array pattern formed by irradiating the laser light; And an image processing unit that filters the image obtained by the image acquisition unit to remove a background image excluding a plurality of optical pixels to obtain a pattern image. It may include.

A laser module generating and outputting laser light; And a pattern generation module configured to receive the laser light output from the laser module, convert it to have a predetermined array pattern, and output it. It may include.

The object information estimation method according to another embodiment of the present invention for achieving the above object is to irradiate a predetermined array pattern of laser light in a predetermined test environment, and photograph an array pattern formed by irradiating the laser light to obtain a plurality of light. Storing an initial pattern image including pixels and setting information on a test environment: irradiating laser light of the array pattern in a predetermined direction to obtain object information; Capturing an array pattern to obtain a pattern image; Comparing the pattern image with an initial pattern image to determine changes in 2D positional coordinates of a plurality of optical pixels of the array pattern; And estimating object information by calculating 3D coordinates of the plurality of optical pixels from the determined 2D positional coordinate change. Includes.

Therefore, the object information estimation apparatus and method according to an embodiment of the present invention is a pattern obtained by filtering and irradiating the laser light emitted from the laser module to have a predetermined array pattern, and photographing a pattern area formed by the irradiated laser light. By analyzing changes in the image, various object information such as distance and size of an object entering the pattern area can be accurately obtained at low cost.

1 shows a schematic structure of an apparatus for estimating object information based on laser array pattern analysis according to an embodiment of the present invention.
2 shows an example of a configuration of a laser unit and a laser array pattern generated by laser light emitted from the laser unit.
FIG. 3 shows an example of an arrangement structure of a laser unit and an image acquisition unit of FIG. 1 and a laser array pattern generated by laser light emitted from the laser unit.
4 is a diagram for explaining a relationship between a laser array pattern generated by laser light and an array pattern image.
5 to 7 are diagrams for explaining a change in a laser array pattern that occurs when an object enters the laser array pattern of FIG. 2.
8 shows a method of estimating object information based on laser array pattern analysis according to an embodiment of the present invention.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the implementation of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by describing a preferred embodiment of the present invention with reference to the accompanying drawings. However, the present invention may be implemented in various different forms, and is not limited to the described embodiments. In addition, in order to clearly describe the present invention, parts irrelevant to the description are omitted, and the same reference numerals in the drawings indicate the same members.

Throughout the specification, when a part "includes" a certain component, it means that other components may be further included, rather than excluding other components unless specifically stated to the contrary. In addition, terms such as "... unit", "... group", "module", and "block" described in the specification mean units that process at least one function or operation, which is hardware, software, or hardware. And software.

1 shows a schematic structure of an apparatus for estimating object information based on laser array pattern analysis according to an embodiment of the present invention, and FIG. 2 shows an example of a configuration of a laser unit and a laser array pattern generated by laser light emitted from the laser unit. 3 shows an arrangement structure of a laser unit and an image acquisition unit of FIG. 1 and an example of a laser array pattern generated by laser light emitted from the laser unit.

Referring to FIG. 1, the object information estimation apparatus according to the present embodiment includes a laser unit 110, a pattern image acquisition unit 120, an object information acquisition unit 130, and a memory unit 140.

Referring to FIG. 2, the laser unit 110 is arranged to be directed at a predetermined angle θ ₂ , and irradiates the laser light to form a predetermined pattern in a predetermined angle range. The laser unit 110 may include a laser module 111 that generates and radiates laser light, and a pattern generation module 113 that converts the laser light emitted from the laser module to be irradiated with a predetermined pattern.

The laser module 111 generates laser light and radiates it to the pattern generating device 113. In this case, the laser module 111 may generate laser light having a uniform wavelength and intensity.

The pattern generation module 113 filters the laser light irradiated by the laser module 111 to be irradiated with laser light having a predetermined pattern. The pattern generation module 113 may filter the laser light so that the laser light applied from the laser module 111 is irradiated into an array pattern, as shown in FIG. 2 for example. Here, the pattern generation module 113 irradiates the laser light as an array pattern to facilitate estimation of the position and structure of the object.

At this time, the pattern generation module 113 may disperse the incident laser light into a predetermined pattern and filter the dispersed laser light so that it is irradiated into an array pattern. That is, the pattern generation module 113 may be implemented as a laser pattern filter that filters and diffuses the incident laser light so that it is irradiated with a required pattern.

In order for the conventional pattern generation module 113 to irradiate the laser light in a specific pattern, the irradiation angle of the incident laser light was continuously changed. That is, the irradiation angle of the laser light so that the position to which the continuously applied laser light is irradiated is continuously changed from the designated initial position to the final position in the pattern, and when the laser light is irradiated to the final position, the laser light is irradiated from the initial position again. Was adjusted. Therefore, the irradiation angle of the laser light had to be continuously varied very quickly, and precise control of the irradiation angle was required in order to allow the laser light to be irradiated at the same position within the pattern.

However, recently, as shown in FIG. 2, a pattern filter having a simple structure, which is coupled to the front end of the laser module 111 from which the laser light is output, diffuses and irradiates the laser light in a required pattern, has been developed in various fields. It is being used. This is simply a structure using light reflection, refraction, and diffusion, and has the advantage that not only laser light is always irradiated in a uniform pattern, but also is very cheap compared to conventional laser pattern generators that control the irradiation angle of laser light.

In this embodiment, unlike the lidar sensor, the laser unit 110 does not need to modulate and irradiate the laser, and does not need to receive the reflected light reflected by the irradiated laser light again.

As described above, in the case of the lidar sensor, since the difference between the emitted laser light signal and the reflected and incident signal must be determined, the laser light must be modulated into a pulse waveform or phase modulated to be irradiated.

On the other hand, in the object information estimating apparatus of the present embodiment, an image of the laser light of the array pattern irradiated by the laser unit 110 is obtained by using the pattern image acquisition unit 120. Accordingly, the laser unit 110 only irradiates the laser light in a predetermined angular range, and does not need to receive the reflected light.

This is because it does not compare the difference between the irradiated laser light and the received laser light. Therefore, the laser unit 110 can emit laser light as it is without modulating it separately. That is, the laser unit 110 does not need to have a separate modulating means. In addition, a receiving configuration for receiving reflected light of the irradiated laser light is not required.

Therefore, the laser unit 110 of this embodiment can be configured with a very simple structure and can be manufactured at low cost.

The pattern image acquisition unit 120 acquires a pattern image of an array pattern formed by laser light irradiated from the laser unit 110. Like the laser unit 110, the pattern image acquisition unit 120 is also arranged to face a predetermined angle θ ₁ . The pattern image acquisition unit 120 is disposed to direct the specified angle θ ₁ so that all array patterns formed by laser light are included within a field of view (FOV).

In this case, the pattern image acquisition unit 120 may be disposed to have a directing angle (θ ₁ = θ ₂ = θ) equal to the directing angle θ ₂ of the laser unit 110. The orientation angle (θ ₁ ) of the pattern image acquisition unit 120 is not necessarily the same as the orientation angle (θ ₂ ) of the laser unit 110, but the orientation angle (θ ₁ ) of the pattern image acquisition unit 120 When the directing angle θ ₂ of the laser unit 110 is the same, calculation becomes easy when estimating object information later.

The pattern image acquisition unit 120 includes an image acquisition unit 121 and an image processing unit 123, and the image acquisition unit 121 is implemented with an image sensor, etc. to acquire an image by photographing an array pattern formed by laser light. do.

In addition, the image processing unit 123 removes noise by performing image processing on the image acquired by the image acquisition unit 121 in a known manner. In addition, the image processing unit 123 may filter and extract laser light having a predetermined wavelength so that the array pattern can be easily analyzed. That is, the pattern image may be obtained by extracting only the array pattern formed by the laser light from the acquired image and removing the rest.

In addition, the image processing unit 123 may obtain a pattern image from which the surrounding background is removed by subtracting the image obtained before the laser light is irradiated from the image after the array pattern is formed by irradiating the laser light.

The object information acquisition unit 130 obtains object information by analyzing the pattern image acquired by the pattern image acquisition unit 120. The object information acquisition unit 130 compares the array pattern of the previously acquired initial pattern image with the array pattern of the currently acquired pattern image and analyzes a difference, thereby acquiring information on the location and shape of the object.

The laser light emitted from the laser unit 110 is irradiated to the ground in an array pattern, and if an object does not enter the array pattern area, it is always maintained in the same shape. However, when the object enters the array pattern area, a part of the laser light emitted from the laser unit 110 is irradiated to the ground, while the object is irradiated in the area where the object enters. That is, as an object enters the array pattern area, a change occurs in the array pattern. In addition, the pattern image acquisition unit 120 acquires a pattern image that changes due to the entry of the object, and the object information acquisition unit 130 analyzes a change in the pattern array included in the pattern image to determine whether the object enters. have.

In particular, when an object enters and the position of at least one light point (or optical pixel) is changed, the object information acquisition unit 130 analyzes the amount of change in the x direction and y direction of the changed optical pixel, Size and shape can be determined. A detailed method of extracting object information from a change in the pattern array included in the pattern image by the object information acquisition unit 130 will be described later.

The memory unit 140 stores the initial pattern image or the initial array pattern extracted from the initial pattern image as a criterion for determining a change in the pattern, and transfers the stored initial pattern image or the initial array pattern to the object information acquisition unit 130 Thus, the object information acquisition unit 130 can analyze a change in the pattern array. Here, for convenience of description, the memory unit 140 is separately illustrated, but the memory unit 140 may be included in the object information acquisition unit 130 and configured.

That is, in this embodiment, the laser unit 110 irradiates laser light having an array pattern, and the pattern image acquisition unit 120 acquires a pattern image of the laser light irradiated with the array pattern from the laser unit 110, and , The object information acquisition unit 130 may accurately extract object information such as a location, size, and shape of an object disposed in the array pattern area by analyzing the change in the array pattern of laser light appearing in the pattern image.

Therefore, unlike the lidar sensor, it is not necessary to modulate and irradiate the laser light, and since there is no need to receive the reflected light of the irradiated laser light, the structure of the laser unit 110 is simple and can be manufactured at low cost.

Meanwhile, various methods of extracting information on an object by acquiring an image of an object using an image sensor and analyzing the image of the acquired object have been proposed. However, when extracting information about an object from an image acquired by an image sensor, it is necessary to be able to identify the object and its surrounding environment, and a very complex post-processing process is required to accurately acquire information such as the size or shape of the identified object. Demand. In some cases, artificial neural networks are used for post-processing, and in general, high-performance computing devices with high cost are often used.

In contrast, the apparatus for estimating object information based on laser array pattern analysis according to the present embodiment does not directly identify and analyze the object in the image, but analyzes the change in the array pattern generated by the laser light, and provides information on the object with a relatively very simple operation. Can be extracted. That is, information about an object can be accurately extracted even with a low-cost computing device. In particular, when the image acquisition unit 121 obtains a pattern image by filtering only the wavelength of laser light from the image acquired, information on the object may be obtained more simply.

4 is a diagram for explaining a relationship between a laser array pattern generated by laser light and an array pattern image.

Referring to FIG. 4, laser light irradiated from the laser unit 110 arranged at a predetermined angle with a predetermined array pattern in a specified angle range may generate a plurality of light points on the ground. In this case, the plurality of light points may be generated in a circle or ellipse pattern as illustrated in FIG. 4, but is not limited thereto. That is, the pattern of the light point can be variously adjusted.

In addition, the pattern image acquisition unit 120 acquires a pattern image by capturing an array pattern area in which a plurality of light points as shown in FIG. 4 are generated. At this time, the pattern image is an image in which the image processing unit 123 performs pre-treatment such as noise removal and filtering on the image acquired by the image acquisition unit 121, and here, only the light points according to the wavelength of the laser light are left and the rest are filtered. It is shown assuming that it is excluded through.

The object information acquisition unit 130 sets each of the plurality of light points of the pattern image acquired by the pattern image acquisition unit 120 as an optical pixel, and sets an array pattern area including the array pattern as an ROI. At this time, the object information acquisition unit 130 includes a height (H) and an angle (θ) at which the pattern image acquisition unit 120 is disposed, a field of view (FOV) at which the pattern image acquisition unit 120 photographs an array pattern, and an initial pattern image. The distance L to at least one of the plurality of optical pixels of the pattern array is measured and stored in advance. Here, the at least one optical pixel may be, for example, an optical pixel located in the center of the pattern array as a reference optical pixel, but is not limited thereto.

In addition, the object information acquisition unit 130 sets an optical pixel whose distance L is measured in advance among a plurality of optical pixels of the pattern array as a reference optical pixel, and coordinates for the distance from the reference optical pixel to the remaining optical pixels ( x, y) is determined and stored. That is, the object information acquisition unit 130 may pre-acquire and store the relative positions of the remaining optical pixels as coordinates (x, y) by using the reference optical pixel whose distance is measured as the zero point (0, 0).

Thereafter, when the object enters the pattern array and the position of at least one of the plurality of optical pixels changes, the object information acquisition unit 130 uses the position of the object and the position of the plurality of optical pixels changed according to the outer shape of the object. Estimate the size. In addition, the shape of the object can be estimated by analyzing the position coordinates of the optical pixel where the change has occurred.

5 to 7 are diagrams for explaining a change in a laser array pattern that occurs when an object enters the laser array pattern of FIG. 2.

6 is a diagram illustrating a change in a laser array pattern according to an arrangement of an object 200 in a three-dimensional space. In FIG. 7, (a) shows the arrangement of optical pixels of the initial pattern image, and (b) shows the arrangement of optical pixels of the pattern image obtained when an object is arranged.

As shown in FIG. 5, when the object 200 is disposed in the array pattern area where the laser light is irradiated with the array pattern, a part of the laser light emitted from the laser unit 110 is incident on the object 200 and irradiated to the ground. It is irradiated to the object without being used. And as the light point is formed on the object 200, a change (Δθ) occurs in the angle at which the image acquisition unit 120 acquires the same light point as the initial pattern image when the image acquisition unit 120 acquires the pattern image. The position of the optical pixel in the pattern image, in this case, appears as a change in the x-axis direction. That is, the position at which the light point is formed varies according to the shape of the object 200.

Comparing (a) and (b) of FIG. 7, the position of the optical pixel is changed only at the position where the optical point is incident on the object. That is, since the light point is irradiated to the ground as it is in the outer part of the object, there is no change in the position of the light pixel. Therefore, since the object is located only in the area where the position change of the optical pixel has occurred, the size of the object can be determined from the size of the area where the change has occurred.

In addition, as the object is arranged in the array pattern area, in the case of the optical pixel for the light point incident on the front surface of the object in the pattern image, the y-axis direction is maintained as it is, whereas the y-axis direction is moved in the -x-axis direction, and the gap becomes narrower Able to know. On the other hand, in the case of the optical pixel incident on the upper surface of the object, it has moved in the -x-axis direction, but as it moves less than the optical pixel incident on the front surface of the object, the distance between the optical pixel incident on the front surface and the x-axis direction increases You can see that you have lost.

This change in the position of the optical pixel means that the change in the angle (Δθ) can be calculated on the contrary, and the three-dimensional position (x, y, z) of each of the plurality of optical pixels is determined using the calculated angle change (Δθ). Can be identified.

The height (H) and angle (θ) and the field of view (FOV) at which the pattern image acquisition unit 120 is disposed, and the distance (L) from the initial pattern image to at least one of the plurality of optical pixels of the pattern array are determined in advance. When known, the three-dimensional position (x, y, z) from the position change of a plurality of optical pixels in the two-dimensional pattern image can be calculated through a simple equation as a known technique, and can be calculated through various methods. It is not described in detail here.

Therefore, not only can the position and size of the object be determined from the change in the position coordinates of the optical pixel, but also the shape of the object can be determined through the change in the distance between adjacent optical pixels. That is, object information can be estimated.

In particular, when the 3D coordinates for each of the plurality of optical pixels are calculated, the outer shape of the object 200 can be visually derived by connecting the 3D coordinates for adjacent optical pixels to each other.

Here, for convenience of explanation, the size of the optical pixel is shown to be very large. However, in actual application, the optical pixel may appear as a very small dot, and the interval between each optical pixel may be very dense. In addition, the smaller the size of the optical pixel and the denser the distance between the optical pixels, the more accurately the information about the object can be estimated.

8 shows a method of estimating object information based on laser array pattern analysis according to an embodiment of the present invention.

Referring to FIGS. 1 to 7, the method of estimating object information of FIG. 8 will be described. First, laser light is irradiated to form a specified pattern within a predetermined angle range at a specified angle in a predetermined test environment, and the irradiated laser light An initial pattern image is obtained by photographing a pattern formed on this surface (S11). At this time, the laser light may be irradiated with a designated uniform wavelength and intensity, and converted into an array pattern by a pattern generation module and irradiated. A plurality of light points are formed in the array pattern, and the size and spacing of the light points may be variously adjusted.

In addition, the pattern image may be obtained by photographing the entire area to which the laser light is irradiated, and may be an image filtered so that only the pattern of the laser light and noise is removed.

In addition, setting information for obtaining the initial pattern image is stored together with the acquired initial pattern image (S12). Here, the setting information includes the height (H), angle (θ) and field of view (FOV) at which the pattern image acquisition unit 120 is disposed, and the distance from the initial pattern image to the reference optical pixel among the plurality of optical pixels in the pattern array (L ) Is included, and location information of the remaining optical pixels based on the reference optical pixel may be further included. Here, the location information of the plurality of optical pixels may be stored in the form of two-dimensional coordinates (x, y).

Thereafter, in an environment for estimating the actual object information, the laser light is converted to have an array pattern and is irradiated at a designated direction angle (S13). Then, an array pattern of the irradiated laser light is photographed to obtain a pattern image (S14). Here, the angle at which the laser light is irradiated and the condition of the pattern image acquisition unit 120 for photographing the array pattern are the same as in the test environment.

When the pattern image is acquired, it is determined whether a change occurs in the positions of each of the plurality of optical pixels of the acquired pattern image and the position coordinates of each of the optical pixels corresponding to the initial pattern image (S15).

If it is determined that a change in the optical pixel position coordinates has occurred, the change in the position coordinates of the optical pixel generated in the 2D pattern image is converted into 3D coordinates using the setting information (S15).

Then, object information is estimated from the three-dimensional coordinates of a plurality of optical pixels (S17). The object information estimated here may be information on the location, size, and shape of the object. In particular, in the case of the shape of an object, it is possible to obtain visual information that can be recognized by a user by connecting the obtained 3D coordinates of a plurality of optical pixels with each other.

The method according to the present invention may be implemented as a computer program stored in a medium for execution on a computer. Here, the computer-readable medium may be any available medium that can be accessed by a computer, and may also include all computer storage media. Computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, and ROM (Read Dedicated memory), RAM (random access memory), CD (compact disk)-ROM, DVD (digital video disk)-ROM, magnetic tape, floppy disk, optical data storage device, and the like.

The present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and those of ordinary skill in the art will appreciate that various modifications and other equivalent embodiments are possible therefrom.

Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

110: laser unit 111: laser module
113: pattern generation module 120: pattern image acquisition unit
121: image acquisition unit 123: image processing unit
130: object information acquisition unit 140: memory unit

Claims (11)

A laser unit for irradiating laser light of a predetermined array pattern;
A pattern image acquisition unit configured to acquire a pattern image including a plurality of optical pixels by photographing an array pattern formed by irradiating the laser light onto an object; And
Compare the previously acquired and stored initial pattern image with the currently acquired pattern image to determine changes in the 2D positional coordinates of the plurality of optical pixels of the array pattern, and the 3D of the plurality of optical pixels from the determined 2D positional coordinate change. An object information acquisition unit that estimates object information by calculating coordinates; Including,
The object information acquisition unit
The three-dimensional coordinates of the plurality of optical pixels are calculated using the setting information obtained in advance according to the arrangement condition of the laser unit and the pattern image acquisition unit and the two-dimensional position coordinates of the plurality of optical pixels, and the calculated 3D Estimate information about the location, size and shape of an object from the coordinates,
The laser unit
A laser module for generating and outputting laser light; And
A pattern generation module that receives the laser light output from the laser module, converts it to have a predetermined array pattern, and outputs it; Including,
The pattern generation module is an object information estimation device that filters and diffuses the laser light so as to be irradiated with a required pattern.

delete The method of claim 1, wherein the setting information
An object information estimation apparatus comprising information about a height, an angle, a field of view at which the pattern image acquisition unit is disposed, and a distance (L) from the pattern image acquisition unit to a predetermined reference light pixel among a plurality of light pixels of the pattern array in the initial pattern image. The method of claim 1, wherein the pattern image acquisition unit
An image acquisition unit that acquires an image of an array pattern formed by irradiating the laser light; And
An image processing unit that filters the image obtained by the image acquisition unit to remove a background image excluding a plurality of optical pixels to obtain a pattern image; Object information estimation apparatus comprising a. delete Irradiating laser light of a predetermined array pattern in a predetermined test environment, photographing an array pattern formed by irradiating the laser light, and storing an initial pattern image including a plurality of optical pixels and setting information on the test environment:
Irradiating the laser light of the array pattern in a direction of a predetermined direction with respect to the object to obtain object information;
Capturing an array pattern to obtain a pattern image;
Comparing the pattern image with an initial pattern image to determine changes in 2D positional coordinates of a plurality of optical pixels of the array pattern; And
Estimating object information by calculating 3D coordinates of the plurality of optical pixels from the determined 2D positional coordinate change; Including,
Estimating the object information
According to the position and angle of the laser light irradiation and the arrangement condition of the pattern image acquisition unit acquiring the pattern image, the setting information stored in advance and the change in the 2D position coordinates of the plurality of optical pixels are used to determine the plurality of optical pixels. Calculating three-dimensional coordinates; And
Estimating information on the location, size, and shape of the object from the calculated 3D coordinates; Including,
The step of irradiating the laser light
Generating and outputting laser light; And
Converting the output laser light to have a predetermined array pattern; Including, by filtering and diffusing the laser light object information estimation method for adjusting to be irradiated in a required pattern.
delete The method of claim 6, wherein estimating information on the shape
An object information estimation method for visually estimating a shape of the object by connecting optical pixels adjacent to each other with lines based on the three-dimensional coordinates calculated for a plurality of optical pixels. The method of claim 6, wherein the setting information
An object information estimation method comprising: height and angle at which the pattern image acquisition unit is disposed, an angle of view, and distance information from the pattern image acquisition unit to a predetermined reference light pixel among a plurality of light pixels of a pattern array in the initial pattern image. The method of claim 6, wherein obtaining the pattern image
Obtaining an image of an array pattern formed by irradiating the laser light; And
Filtering the acquired image to remove a background image excluding a plurality of optical pixels to obtain a pattern image; Object information estimation method comprising a. delete

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