KR102123052B1 - Test handler - Google Patents

Abstract

The test handler is started. The test handler according to an embodiment may include a loading device for loading an electronic component, a soak chamber for precooling or preheating the electronic component so that the electronic component having a loading has a test set temperature, and the electronic component for preheating or precooling. A test chamber for testing, the temperature of the electronic component, which has been tested, is restored to a predetermined level, and a flow path is formed inside one side wall, but the flow path includes a first inlet, an outlet, and a second intake chamber adjacent to the outlet. , A circulating device that allows air inside the de-soaking chamber to circulate through the flow path, and an unloading device that unloads the electronic component whose temperature has been restored to a predetermined level.

Description

Test handler {TEST HANDLER}

The following description relates to the test handler.

A test handler is a device that supports testing of electronic components such as semiconductor devices manufactured through a predetermined manufacturing process, and classifies electronic components according to test results and loads them in a customer tray. .

1 is a plan view of a test handler 300 according to Korean Patent Application Publication No. 10-2013-0105265 (hereinafter referred to as prior art) filed by the applicant, referring to this, the test handler 300 is a loading device 320, It may include a soak chamber (330, soak chamber), test chamber (340, test chamber), de-soak chamber (350, desoak chamber), the unloading device 380, and the like.

The test tray 310 has a plurality of inserts on which electronic components can be seated and can circulate along a closed path (C) defined by a plurality of transfer devices (not shown).

The loading device 320 loads the electronic component in the untested state loaded on the customer tray (not shown) into the test tray 310 in the loading position.

The soak chamber 330 may preheat or precool the electronic components so that the electronic components have a test set temperature prior to testing the electronic components loaded on the transported test tray 310. have.

The test chamber 340 may test electronic components loaded on the test tray 310 that has been preheated or precooled in the soak chamber 330 and then transferred to the test location.

The de-soak chamber 350 cools the electronic components in the test-completed state loaded in the test tray 310 transferred from the test chamber 340 to have a temperature at which the electronic components have no problem at room temperature or unloading. Can be done. Alternatively, the de-soak chamber 350 may heat the electronic component in a test-completed state so that the electronic component has a temperature at which it does not have room temperature or condensation.

The unloading device 380 may classify the electronic components from the test tray 310 in the unloading position according to the test results according to the test results, and unload the electronic components into empty customer trays.

As described above, the electronic component passes through the unloading position and the loading position sequentially through the soak chamber 330, the test chamber 340, and the desoak chamber 350 in a state loaded on the test tray 310 and then again. It can be circulated along the closed path (C) leading to the soak chamber 330.

On the other hand, the test handler 300 is provided with a number of test trays 310 that circulate along the closed path (C), and as described above, the soak chamber 330 prior to the start of the electronic component temperature according to the test conditions The desoak chamber 350 restores the temperature of the electronic component to a predetermined level in advance of unloading after the test is performed, which is ultimately increased by increasing the utilization rate of the tester and unloading device 380. This is to improve the processing capacity of the equipment.

Specifically, if the electronic component tested at a low temperature is sent directly to the unloading position, moisture may be formed on the surface of the electronic component by air at room temperature, thereby causing damage to the electronic component, and the unloading device 380 When the pad of the device grips the electronic component, a pad mark may remain on the surface of the electronic component. In addition, when the electronic component tested at a high temperature is sent directly to the unloading position, the pad of the unloading device 380 may melt or stick to the heat remaining in the electronic component. Therefore, as described above, it is necessary to dispose the desoak chamber 350 to restore the electronic component, which has been tested, to room temperature or a constant temperature.

In relation to the desoak chamber 350, the present applicant has developed a test handler 300 including a desoak chamber 350 that brings about an improvement in stability and reliability of equipment compared to the existing desoak chamber. 2 is a front view of the side wall 351 of the desoak chamber 350 of the test handler 300 according to the prior art, and FIG. 3 is a diagram showing the flow of air inside the desoak chamber 350. Briefly explaining the prior art with reference to FIGS. 1 to 3, first, an empty space is provided inside one side wall 351 of the desoak chamber 350, and the empty space may be used as a flow path 351a. Inlet 351a-1 and outlet 351a-2 may be provided at upper and lower portions of the flow path 351a, and a fan 362 may be provided at each inlet 351a-1 and outlet 351a-2. By doing so, the air inside the de-soak chamber 350 may be introduced into the flow path 351a through the inlet 351a-1 and then discharged again into the de-soak chamber 350 through the outlet 351a-2. Through the forced circulation of air, the temperature of the electronic component loaded in the test tray 310 located inside the desoak chamber 350 can be effectively recovered.

However, since the number of electronic components to be processed per unit time has been increasing in recent years, the efficiency of cooling or heating the electronic components in the desoak chamber is very important. In the case of the prior art, this problem has been solved to a large extent, but the higher the cooling or heating efficiency of the electronic component is, the more preferable the applicant has sought to improve the prior art.

In particular, due to the structure of the de-soak chamber, the upper side space is often insufficient compared to the lower side space, so the number of inlets and fans provided on the upper side may also be small, and eventually, the amount of air discharged due to the small amount of air introduced There is also a small amount, which may limit the efficiency of electronic component temperature management (forming the inlet on the top is advantageous in terms of miniaturization of the entire equipment). Accordingly, the present applicant has been conducting research on a method for effectively cooling or heating an electronic component even in such a case.

Korean Patent Publication No. 10-2013-0105265

Embodiments described herein are to provide a test handler that can increase the efficiency of air circulation in the space inside the desoak chamber by increasing the flow rate and flow rate of the air discharged to the desoak chamber.

In addition, the present invention is to provide a test handler capable of reducing the temperature variation of electronic components by uniformly discharging air into the space inside the desoak chamber.

The test handler according to an embodiment may include a loading device for loading an electronic component, a soak chamber for precooling or preheating the electronic component so that the electronic component after loading has a test set temperature, and the electronic component for preheating or precooling completed. A test chamber for testing, the temperature of the electronic component, which has been tested, is restored to a predetermined level, and a flow path is formed inside one side wall, but the flow path includes a first inlet, an outlet, and a second intake chamber adjacent to the outlet. , A circulating device that allows air inside the de-soaking chamber to circulate through the flow path, and an unloading device that unloads the electronic component whose temperature has been restored to a predetermined level.

In addition, the circulating device, the air circulating the flow passage through the outlet to the discharge chamber to the interior space and includes a discharge fan spaced a predetermined distance from the outlet to the interior space of the discharge chamber, The second inlet port may include a space between the outlet port and the outlet fan.

Further, the discharge fan may include a main body, a fan provided inside the main body, and a fan cover in which only a central portion corresponding to the wing is opened and an edge portion not corresponding to the wing is closed.

Further, the second inlet port may include a plurality of through holes formed around the outlet port and communicating between the space inside the de-soak chamber and the flow path.

In addition, the circulation device includes a plurality of discharge fans disposed adjacent to each other, and the test handler further includes a guide device provided inside the flow passage to guide the air circulating the flow passage to each of the plurality of discharge fans. It can contain.

In addition, the plurality of discharge fans form a plurality of rows, and the guide device extends in a horizontal direction at a height corresponding to a lower end of a group of discharge fans forming each row so that the air flows in the horizontal direction. Inducing the air to each discharge fan of the, the guide device is provided in each row is provided in each row, both ends of the guide device provided in the bottom row is in contact with the inner surface of the flow path, the rest of the rows except the bottom row Both ends of the guide device provided in may be spaced a predetermined distance from the inner surface of the flow path.

In addition, the outlet may be formed to discharge the air between a plurality of test trays located inside the de-soak chamber.

According to the embodiments described herein, it is possible to provide a test handler capable of increasing the efficiency of air circulation in the space inside the desoak chamber by increasing the flow rate and flow rate of the air discharged to the desoak chamber.

In addition, it is possible to provide a test handler capable of reducing the temperature deviation of the electronic components by discharging the air evenly into the space inside the desoak chamber.

1 is a plan view of a test handler according to the prior art.
FIG. 2 is a front view of one side wall of the desoak chamber of the test handler of FIG. 1;
Figure 3 is a view showing the flow of air inside the desoak chamber of the test handler of Figure 1;
4 is a view schematically showing a side wall of a desoak chamber of a test handler according to an embodiment and its surroundings.
5A and 5B are views illustrating a state of a fan cover according to a comparative example and a fan cover according to the embodiment of FIG. 4, respectively.
6 is a front view of one side wall of the desoak chamber of the test handler according to another embodiment.
7 is a view showing the internal appearance of one side wall of the discharging chamber of FIG. 6;
8 is a plan view of the discharging chamber of FIG. 4;

Hereinafter, specific embodiments of the present technology will be described in detail with reference to the accompanying drawings. In addition, when it is determined that a detailed description of a related known configuration or function may obscure the gist of the technical idea, the detailed description will be omitted.

The test handler according to an embodiment may include a loading device, a soak chamber, a test chamber, a desoak chamber, a circulation device, and an unloading device. Since these configurations have been described in detail in FIG. 1, the overlapping description will be omitted below, and the difference part, the de-chamber and the circulating device will be mainly described.

The discharging chamber of the test handler according to the present embodiment may be formed with an empty space inside one side wall, as in the discharging chamber of the test handler according to the prior art described with reference to FIG. 2, and the empty space may be used as a flow path. . The air in the interior space of the desoak chamber may be introduced into the first inlet of the flow path by a separately provided circulation device, and then flow along the flow path and discharged back to the interior space of the desoak chamber through the outlet. As such, the temperature of the electronic component can be efficiently recovered by forcibly circulating the air inside the desoak chamber.

The configuration of the desoak chamber, the flow path, the first inlet, and the outlet of the present embodiment may be similar to that of the prior art. That is, as illustrated in FIGS. 2 and 3, the first inlet port may be formed on the upper side of one side wall of the desoak chamber, and the outlet port may be formed on the lower side of one side wall of the desoak chamber. As described above, when the first inlet is formed on the upper side and the outlet is formed on the lower side, it may be advantageous in terms of miniaturization of the entire equipment. As described in the prior art, a heating device such as a heater should be disposed adjacent to the first inlet. If the heating device is provided at a location other than the upper side of the desoak chamber (for example, the side), the overall size of the equipment There may be a growing problem. However, this does not mean that the positions of the first inlet and outlet of this embodiment are limited to those described above. The first inlet and the outlet are basically spaced apart from each other, and the first inlet can be formed at a point adjacent to a heating device such as a heater, and the outlet is located at a point adjacent to the point where the test tray is located in the desoak chamber. Can be formed.

On the other hand, due to the structure of the de-soak chamber, the upper side space may be smaller than the lower side space. In this case, there may be a limit to increase the amount of air flowing into the flow path by simply increasing the size of the first inlet port and the number of inlet fans provided to the first inlet port. This can lead to a limit in the amount of air discharged, and ultimately can act as an obstacle to efficiently recovering the temperature of the electronic component.

In this embodiment, a method for efficiently recovering the temperature of the electronic component is presented even in the above case. First, it is possible to increase the flow rate of air flowing into the flow path through the first inlet by connecting a plurality of inlet fans in series rather than one inlet fan to the first inlet side.

Alternatively, even if the flow rate and speed of the air flowing through the first inlet are limited, additional air is introduced through the second inlet adjacent to the outlet so that air having a high flow rate and flow rate can be discharged from the outlet. Can be. 4 is presented for a detailed description of the second inlet.

4 is a view schematically showing a side wall 10 and its surrounding configuration of a desoak chamber of a test handler according to the present embodiment. Here, the second inlet port may include a space 14 between the outlet port 13 and the outlet fan 30.

Specifically, as shown in Figure 4, the air inside the de-soak chamber may be introduced into the flow path 11 through the first inlet by a circulator (for example, an inlet fan) provided on the first inlet side. It may flow through the flow path 11 and be discharged through the discharge port 13 by a circulation device. Here, the circulation device may include a discharge fan 30 provided on the discharge port 13 side as in the prior art. The discharge fan 30 includes a main body 31, a wing (not shown) provided inside the main body 31, and a fan cover 32 provided on one side (left side in FIG. 4) of the main body 31. can do. The fan cover 32 can be fastened to the main body 31 by a fastening member 33. In the case of this embodiment, the discharge fan 30 as described above may be spaced a predetermined distance from the discharge port 13 rather than blocking the discharge port 13. To this end, a connecting member 34 may be provided between the rear surface of the main body 31 of the discharge fan 30 (the right side in FIG. 4) and the inner surface of one side wall 11 of the desoak chamber. The shape, size, and connection method of the connection member 34 may vary. The air flowing into the flow path 11 through the first inlet and discharged through the outlet 13 may pass through the discharge fan 30 (central dotted line). In addition to this, in this embodiment, the air that has not been introduced into the first inlet, that is, the air around the outlet 13, is a space 14 between the outlet 13 and the outlet fan 30 by the operation of the outlet fan 30. ), and as soon as it flows in, it can be directly passed through the discharge fan 30 (dashed line up and down) and discharged into the internal space of the de-sock chamber with a flow rate of a certain level or higher. Accordingly, the flow rate and flow rate of air discharged through the discharge fan 30 may be increased. As the flow rate and flow rate increase, the flow rate of the air inside the de-soak chamber increases, and air can be evenly discharged inside the de-soak chamber, so that the temperature of the electronic parts can be quickly restored as well as the temperature deviation between the electronic parts. Can also be minimized.

5A and 5B are views illustrating a state of the fan cover according to the comparative example and the fan cover 32 according to the embodiment of FIG. 4, respectively. The fan cover of FIG. 5A is a fan cover that has been applied to a conventional exhaust fan.

In the case of the fan cover shown in FIG. 5A, not only the central portion of the circle but also the edge portion is open, so that air does not collect and rather some air may be discharged to the edge portion. Therefore, the straightness of the discharged air may be weakened, and the flow rate and flow rate may be reduced. The decrease in flow rate and flow rate may mean that sufficient air cannot be evenly discharged into the space inside the desoak chamber.

On the other hand, the fan cover 32 of the present embodiment shown in FIG. 5B has only a circular central portion 32a that is a portion corresponding to the blade open, and other portions, that is, an edge portion 32b that does not correspond to the blade. Can be closed. Accordingly, the surrounding air can be collected, the straightness of the discharged air is improved, and the flow rate and flow rate can be increased. Ultimately, sufficient air can be evenly discharged into the interior space of the desoak chamber, thereby efficiently recovering the temperature of the electronic component and minimizing the temperature deviation between the electronic components.

Tables 1 and 2 below summarize the results of measuring the flow rate and flow rate of air discharged from the prior art and this embodiment. In the case of the prior art, the discharge fan is arranged to close the discharge port, and the fan cover has a shape in which the edge portion is opened as shown in FIG. example

In the case of the embodiment, as shown in Figure 4, the discharge fan 30 is spaced a predetermined distance from the outlet 13 (set to 5 mm in the experiment), and the fan cover 32 has an edge portion closed as shown in Figure 5b. Form. In both the prior art and this embodiment, the number of discharge fans was 5, and the arrangement was as shown in FIG. 6. For convenience, the left outlet fan in the top row is called 1, the right outlet fan is called 2, the left outlet fan in the bottom row is called 3, the central outlet fan is called 4, and the right outlet fan is called 5. The flow rate was measured for the circular portion corresponding to the vane of the discharge fan, and the unit of flow rate was m3/h and the unit of flow rate was m/s.

division Prior art This example One 6588.6 12003.0 2 3615.8 10371.7 3 2574.6 10371.7 4 2636.7 10175.1 5 8076.9 6197.7 Average 4968.5 9823.8

division Prior art This example One 0.99 4.59 2 1.39 4.46 3 1.23 4.23 4 1.15 3.30 5 1.11 3.70 Average 1.17 4.06

In the case of the flow rate, it was found that the flow rate increased in all of the other discharge fans except one of the five discharge fans, and on average, it was confirmed that the flow rate increased by about 2 times. In the case of the flow rate, it was found that the flow rate was increased in all the exhaust fans, and on average, it was found to be increased by about 4 times.

6 is a front view of one side wall 10 of a desoak chamber of a test handler according to another embodiment. In the present embodiment, the second inlet port may include a plurality of through holes 15 formed around the outlet port (discharge fan 30).

In detail, a first inlet port may be formed at an upper side of one side wall 10 of the desoak chamber, and an inlet fan 20 may be provided at the first inlet side. In addition, an outlet may be formed at a lower side of the one side wall 10, and an outlet fan 30 may be provided at the outlet side. Details of the discharge fan 30 are as described in FIGS. 4 to 5B. A plurality of discharge fans 30 may be provided, and the plurality of discharge fans 30 may form a plurality of rows. In this embodiment, a total of five discharge fans 30 were provided, and two of these five discharge fans 30 were arranged in the upper row and three in the lower row.

The air in the interior space of the desoak chamber introduced into the first inlet port by the inlet fan 20 may descend along the flow path and be discharged back into the interior space of the desoak chamber through the outlet port by the outlet fan 30. In the present embodiment, a plurality of through holes 15 may be formed around the outlet, and the plurality of through holes 15 may function as a second inlet. The air around the outlet that has not flowed into the first inlet flows into the flow path inside the one side wall 10 through the plurality of through holes 15 by the operation of the discharge fan 30, and then the outlet and the discharge fan 30 again. Through it can be discharged to the interior space of the discharging chamber. As a result, the flow rate and flow rate of air discharged into the space inside the desoak chamber may be increased. In addition, by forming the plurality of through holes 15 as described above, it is possible to improve the vortex phenomenon due to the difference in air pressure.

Meanwhile, in FIG. 6, a plurality of 50 through holes 15 are illustrated. However, the number of through holes 15 may be changed depending on the situation. That is, ten of the through-holes 15 in two of the middle of the four through-holes 15 in the total of four rows may not be formed. Alternatively, the through-hole 15 may be formed only around a part of the outlet and the through-hole 15 may not be formed around the other outlet. In addition, it is also possible to form a through-hole 15 as shown in Figure 6, and close some of the through-hole 15 as necessary.

7 is a view showing the internal appearance of the side wall 10 of the discharging chamber by removing the discharge fan 30 in FIG. The outlet 13 may be a single polygon as shown in FIG. 7, or may be individually formed in a circle or polygon and a discharge fan 30 may be provided in each of these individual outlets. In addition, as described above, a plurality of discharge fans 30 may be provided, and the plurality of discharge fans 30 may form a plurality of rows (two rows in this embodiment).

In the case of this embodiment, the guide device 40 may be provided inside the flow path. A plurality of guide devices 40 may be provided for each row of the discharge fan 30. The guide device 40 may extend in a horizontal direction (horizontal direction) at a height corresponding to the lower end of the discharge fan 30. Accordingly, the air flowing from the top to the bottom in the flow path can be guided to each of a group of discharge fans 30 forming one row after being divided in the horizontal direction by the guide device 40.

Here, the guide device 40 may have a different length depending on which row is provided. For example, in the case of the row at the bottom, both ends of the guide device 42 provided in the row at the bottom can contact the inner surface of the flow path because the air does not have to go down any more. However, since the air must descend from the corresponding row to the row below it in the remaining rows other than the bottom, both ends of the guide device 41 may be separated from the inner surface of the flow path by a predetermined distance. In other words, air introduced into the first inlet through the inlet fan 20 descends along the flow path and is divided into left and right by a guide device 41 to be guided to a group of outlet fans 30 forming a corresponding row. Subsequently, the rest of the air descends downward through the spaces 16a and 16b between the guide device 41 and the inner surface of the flow path, and then is guided in the horizontal direction again by the guide device 42 to discharge a group of groups forming the corresponding row. It can be guided to the fan 30 side. In the case of this embodiment, the air descending along the flow path may first hit the guide device 41 provided in the first row and then be divided into left and right, and the air directed to the right may face the exhaust fan 30 side of the first row. In addition, the air directed to the left may descend to 2 rows through 16a. The air descending to the second row may be directed to the discharge fan 30 side of the second row by the guide device 42 provided in the second row.

Table 3 below summarizes the results of measuring the flow rate of air discharged from the prior art and this embodiment. In the case of the prior art, the discharge fan is arranged to close the discharge port, and the fan cover has a shape in which the edge portion is opened as shown in FIG. 5A. In the case of this embodiment, as shown in FIG. 4, the discharge fan 30 is spaced a predetermined distance from the outlet 13 (set to 5 mm in the experiment), and the fan cover 32 has an edge portion as shown in FIG. 5B. It is closed. In addition, a guide device 40 as described in FIG. 7 was provided in the flow path, and a plurality of through holes 15 as described in FIG. 6 were formed. In both the prior art and this embodiment, the number of discharge fans was 5, and the arrangement was as shown in FIG. 6. For convenience, the left outlet fan in the top row is called 1, the right outlet fan is called 2, the left outlet fan in the bottom row is called 3, the central outlet fan is called 4, and the right outlet fan is called 5. The flow rate was measured for the circular portion corresponding to the vane of the discharge fan, and the unit of the flow rate was m3/h. As a result of the experiment, it was found that the flow rate of all five discharge fans increased, and on average, it was confirmed that the flow increased by about three times. In addition, even when compared with Table 2 and Table 3, when the guide device 40 is further included, it can be confirmed that an improved effect on the flow rate can be obtained. In addition, the deviation between the amount of air induced in each discharge fan 30 by the guide device 40 as described above may be reduced, and as a result, air may be evenly discharged to the interior space of the de-soak chamber, and thus, between electronic parts. Temperature variation can be minimized.

division Prior art This example One 6588.6 18529.0 2 3615.8 13839.8 3 2574.6 13550.3 4 2636.7 9168.5 5 8076.9 8490.4 Average 4968.5 12715.6

8 is a plan view of the desoak chamber 1 of the test handler described in FIG. 4. The electronic components, which have been tested, are transferred to the de-soak chamber 1 while being loaded in a plurality of test trays 2, and the plurality of test trays 2 can be moved while being arranged side by side in the de-soak chamber 1. have. In the present embodiment, the outlet and the discharge fan 30 may be arranged to discharge air between the plurality of test trays 2, according to this, the flow of air inside the de-soak chamber 1 is more smoothly Ultimately, it is possible to effectively recover the temperature of the electronic component and minimize the temperature deviation between the electronic components.

The embodiments described above are merely for explaining some examples of the technical idea, and the scope of the technical idea is not limited to the described embodiments, and is within the scope of the technical idea by those skilled in the art. Various changes, modifications, or substitutions of will be possible, and all such implementations should be regarded as falling within the scope of the present technical idea.

1: De-soak chamber 2: Test tray
10: one side wall of the dissock chamber 11: euro
13: outlet 14, 15: second inlet
20: inlet fan 30: outlet fan
31: body 32: cover
40: guide device

Claims (8)

A loading device for loading electronic components;
A soak chamber for precooling or preheating the electronic component so that the electronic component having a loading has a test set temperature;
A test chamber for testing the electronic component that has been preheated or precooled;
A recovery chamber in which the temperature of the electronic component, which has been tested, is restored to a predetermined level, a flow path is formed inside one side wall, and the flow path includes a first inlet, an outlet, and a second inlet adjacent to the outlet;
A circulation device that allows air inside the de-soaking chamber to circulate the flow path; And
Includes an unloading device for unloading the electronic component whose temperature has been restored to a predetermined level.
The circulation device,
Connecting member; And
The air circulating the flow path discharges through the outlet to the interior space of the de-soak chamber and includes an exhaust fan spaced a predetermined distance from the outlet to the interior space of the de-soak chamber.
The second inlet includes an opening formed in the connecting member,
The discharge fan includes a main body and a wing provided inside the main body,
The main body surrounds one side of the wing so that one side of the wing is closed,
The connecting member is provided between the rear side of the main body of the discharge fan and the inner side surface of the one side wall of the desoak chamber, and the outlet and the outlet from the outside of the flow path of the desoak chamber through the second inlet. Configured to guide the air to the space between the exhaust fans,
Test handler. delete According to claim 1,
The discharge fan, the test handler further comprises a fan cover that only the central portion corresponding to the wing is opened and the edge portion not corresponding to the wing is closed. According to claim 1,
The second inlet, the test handler is formed around the outlet and includes a plurality of through-holes communicating the space between the de-soak chamber and the flow path. According to claim 1,
The discharge fan is provided in plural,
The plurality of discharge fans are disposed adjacent to each other,
The test handler further includes a guide device provided inside the flow path to guide the air circulating in the flow path to each of the plurality of discharge fans. The method of claim 5,
The plurality of discharge fans form a plurality of rows,
The guide device extends in a horizontal direction at a height corresponding to a lower end of a group of exhaust fans forming each row to induce the air in each of the group of exhaust fans by allowing the air to flow in a horizontal direction,
The guide device is provided in plural and provided for each row, both ends of the guide device provided in the bottom row contact the inner surface of the flow path, and both ends of the guide apparatus provided in the remaining rows except the bottom row of the guide device Test handler spaced a predetermined distance from the inner surface. According to claim 1,
The outlet, the test handler is formed to discharge the air between a plurality of test trays located inside the de-soak chamber.
A loading device for loading electronic components;
A soak chamber for precooling or preheating the electronic component so that the electronic component having a loading has a test set temperature;
A test chamber for testing the electronic component that has been preheated or precooled;
A recovery chamber in which the temperature of the electronic component, which has been tested, is restored to a predetermined level, a flow path is formed inside one side wall, and the flow path includes a first inlet, an outlet, and a second inlet adjacent to the outlet;
A circulation device including a plurality of discharge fans disposed adjacent to each other and allowing air inside the desoak chamber to circulate the flow path;
A guide device provided inside the flow path to guide the air circulating in the flow path to each of the plurality of discharge fans; And
Includes an unloading device for unloading the electronic component whose temperature has been restored to a predetermined level.
The plurality of discharge fans form a plurality of rows,
The guide device extends in a horizontal direction at a height corresponding to a lower end of a group of exhaust fans forming each row to induce the air to each of the group of exhaust fans by allowing the air to flow in a horizontal direction,
The guide device is provided in plural and provided for each row, both ends of the guide device provided in the bottom row contact the inner surface of the flow path, and both ends of the guide apparatus provided in the remaining rows except the bottom row of the guide device Spaced a predetermined distance from the inner surface,
Test handler.

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