KR102080867B1 - Heat exchanger for cooling IGBT module - Google Patents

Abstract

An IGBT module cooling heat exchanger according to an embodiment comprises: a plurality of flat tubes having channels through which refrigerant passes; A cooling plate having a plurality of grooves accommodating the flat tube on one surface thereof and having a support portion supporting at least one IGBT module on the other surface thereof; And a cover plate coupled through the cooling plate and the fastening member, wherein the flat tube is fixed between the cooling plate and the cover plate.

Description

IGBT module cooling heat exchanger {Heat exchanger for cooling IGBT module}

The present invention relates to an IGBT module cooling heat exchanger, and more particularly to an IGBT module cooling heat exchanger for efficiently cooling a power converter.

Recently, development of a power conversion system (PCS) for an energy storage system (ESS) has attracted attention.

As energy storage systems diversified from power storage to renewable energy and power frequency regulation (FR), power converters have emerged as a new promising item in the component storage market of energy storage systems that were focused only on large-capacity batteries. As it is a technology area dealing with high voltage and high quality power, competition between domestic and foreign companies is also hot.

The energy storage system is an energy storage system that stores energy produced in each associated system including power plants, substations, and transmission lines, and then selectively and efficiently uses power when necessary to increase energy efficiency.

When the energy storage system improves the overall load rate by leveling the electric load with large fluctuations in time and season, it can lower the cost of generating power and reduce the investment cost and operation cost required for the expansion of electric power facilities. can do.

In addition, energy storage systems are installed and used in power generation, transmission and distribution, and customers in power systems, and include frequency regulation, stabilization of generator output using renewable energy, peak shaving, and load leveling. It is used as a function of emergency power.

In addition, the energy storage system supplies power by discharging charged power when power is needed. This allows the energy storage system to supply power flexibly.

Batteries installed in such a Battery Conditioning System (BCS) are discharged to power the system or charged using power supplied from the system. The power converter may perform a function of managing power of batteries installed in the battery manager, such as performing power conversion (AC / DC) between the system and the battery manager.

High temperature heat is generated in an Insulated Gate Bipolar Transistor (IGBT) that performs power conversion in such a power converter. The heat generated in this way may degrade the performance of the power converter, and may damage or destroy the power converter at high temperatures. Therefore, the development of a technology that can solve the heat generated in the power converter is required.

Republic of Korea Patent Publication No. 10-2001-0104006, "Inverter power stack using HVIGBT"

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and to provide an IGBT module cooling heat exchanger for cooling a high temperature heat generated in the process of converting power of batteries.

In detail, the present invention can provide an optimized structure of an IGBT module cooling heat exchanger that supports and simultaneously cools a power conversion element.

In particular, the present invention can provide a cooling plate structure including a flat tube for efficiently using the high pressure refrigerant.

Furthermore, the present invention can provide a cooling plate structure that assists efficient heat exchange between the IGBT module and the flat tube using the high pressure refrigerant.

The technical problems to be achieved in the proposed embodiment are not limited to the technical problems mentioned above, and other technical problems not mentioned above are clear to those skilled in the art to which the proposed embodiments belong from the following description. Can be understood.

The IGBT module cooling heat exchanger according to the embodiment includes a plurality of flat tubes having a channel through which the refrigerant passes and extending in the vertical direction; A first pipe header provided at an upper end of the flat tube and connected to a first refrigerant inlet pipe for supplying the refrigerant; A second pipe header provided at a lower end of the flat tube and connected to a second refrigerant outlet pipe for discharging the refrigerant; A cooling plate having a plurality of grooves accommodating the flat tube on one surface thereof and having a support portion supporting at least one IGBT module on the other surface thereof; And a cover plate coupled to the cooling plate through the fastening member and having a plurality of protrusions formed at positions corresponding to the plurality of grooves of the cooling plate, wherein the plurality of protrusions are inserted into the plurality of grooves. Is coupled to each other, the inside of the flat tube includes a plurality of micro-channel (Micro-channel) arranged in at least one row, the flat tube is located between the cooling plate and the cover plate, the flat tube, It is pressed between the bottom surface of the groove of the cooling plate and the top surface of the protrusion of the cover plate.

In this case, the IGBT module cooling heat exchanger is disposed on the other surface of the cooling plate, and further includes a plurality of IGBT modules including a power conversion element and a circuit board connected to the power conversion element, and disposed in an upper row of the other side of the cooling plate. The first IGBT module and the second IGBT module arranged in the lower row may be arranged to be staggered with each other.
One surface of the flat tube may contact the bottom surface of the groove of the cooling plate, and the other surface of the flat tube may contact the upper surface of the protrusion of the cover plate.

delete

delete

delete

In addition, the flat tube may be thermally bonded to the upper surface of the protrusion of the cover plate.

delete

The fastening member may include a plurality of bolts passing through the cover plate and the cooling plate, and nuts disposed at both ends of the bolt to provide a tightening force to the cover plate and the cooling plate.

The IGBT module cooling heat exchanger according to the embodiment has the advantage of being able to efficiently control the temperature of the IGBT module due to its small size and high cooling efficiency.

In detail, the IGBT module cooling heat exchanger according to the embodiment has an advantage of lowering the temperature of the IGBT module more effectively by cooling the refrigerant by directly contacting the IGBT module, unlike a cooling fan that indirectly cools the IGBT module.

In addition, the IGBT module cooling heat exchanger according to the embodiment can be compactly configured in a plate-like structure, when the IGBT module is cooled using only the IGBT module cooling heat exchanger, the power converter is made small so that many There is an advantage that can integrate the power converter.

In addition, the IGBT module cooling heat exchanger uses a micro-channel flat tube, the micro-channel flat tube is capable of high-efficiency cooling by using a high pressure refrigerant, and the size is small, there is an advantage that can be formed compactly the IGBT module refrigerant exchanger. .

The IGBT module cooling heat exchanger according to this embodiment can effectively release the high temperature heat generated during the operation of the power conversion element, thereby improving the power conversion efficiency, and is caused by damage or breakage of the power conversion element by heat. By reducing the maintenance work, the operation rate of the power converter can be improved.

1 is a block diagram illustrating a schematic concept of a power providing system including an energy storage system according to an exemplary embodiment of the present invention.
2 is a block diagram showing a schematic configuration of an energy storage system according to an embodiment of the present invention.
3 is a block diagram showing a schematic configuration of a power conversion apparatus according to an embodiment of the present invention.
4 is a flowchart illustrating a cooling process of a power conversion apparatus according to an embodiment of the present invention.
5 is a graph showing the temperature of the power conversion element, respectively, when only the air-cooled cooling means is used, when only the refrigerant-cooling cooling means is used, and when both the air-cooled and the refrigerant-cooling cooling means are used.
6 is a perspective view showing the inside of the housing box of the power converter according to an embodiment of the present invention.
Figure 7 is a perspective view of the inside of the IGBT module cooling heat exchanger according to an embodiment of the present invention.
FIG. 8A shows a front side of an IGBT module cooling heat exchanger according to an embodiment of the present invention, and FIG. 8B shows a rear side of an IGBT module cooling heat exchanger according to an embodiment of the present invention, and FIG. 8C shows A-A 'of FIG. 8B. Represents the cross section of
9A to 9C are examples of the structure of an IGBT module cooling heat exchanger according to an embodiment of the present invention. FIG. 9A is a front view of a cooling plate of the IGBT module cooling heat exchanger, and FIG. 9B is a cover and a tube of the IGBT module cooling heat exchanger. 9C shows a cross section taken along the line BB ′ of FIG. 9B.
10A to 10B illustrate another structure of an IGBT module cooling heat exchanger structure according to an exemplary embodiment of the present invention. FIG. 10A is an exploded perspective view of the IGBT module cooling heat exchanger, and FIG. 10B is a cross-sectional view taken along line CC ′ of FIG. 10A. .
11A to 11B are yet another embodiment of an IGBT module cooling heat exchanger structure according to an embodiment of the present invention, FIG. 11A is an exploded perspective view of the IGBT module cooling heat exchanger, and FIG. 11B is a cross-sectional view taken along line D-D 'of FIG. 11A. to be.
12 is a graph showing a temperature change of the power conversion device according to the cooling plate thickness.
13 is a perspective view of a power conversion apparatus according to another embodiment of the present invention.
14 is an example of a side of a power conversion apparatus according to another embodiment of the present invention.
15 is another example of a side of a power conversion device according to another embodiment of the present invention.
16 is an example of a cross section of a power conversion apparatus according to another embodiment of the present invention.
17 is another example of a cross section of a power conversion apparatus according to another embodiment of the present invention.

Hereinafter, exemplary embodiments related to the present invention will be described in detail with reference to the accompanying drawings. The suffixes "module" and "unit" for components used in the following description are given or mixed in consideration of ease of specification, and do not have distinct meanings or roles.

In describing the embodiments of the present disclosure, when it is determined that a detailed description of a known function or configuration may unnecessarily obscure the subject matter of the present disclosure, the detailed description thereof will be omitted. Terms to be described below are terms defined in consideration of functions in the embodiments of the present invention, and may vary according to intentions or customs of users or operators. Therefore, the definition should be made based on the contents throughout the specification.

Those skilled in the art who understand the spirit of the present invention can easily implement other embodiments included in the scope of the same spirit by adding, changing, deleting, adding, and the like. However, this also can be said to fall within the scope of the present invention.

1 is a block diagram illustrating a schematic concept of a power providing system including an energy storage system according to an exemplary embodiment of the present invention.

Referring to FIG. 1, an energy storage system includes a generator 2, an energy storage system 2, and a load 3.

The generator 2 produces electrical energy. The generator 2 may be a solar power plant, a thermal power plant, a nuclear power plant, or a hydroelectric generator, or alternatively a wind power generator.

When the generator 2 is a photovoltaic device, the generator 2 may be a solar cell array.

The solar cell array combines a plurality of solar cell modules. The solar cell module is a device for generating a predetermined voltage and current by converting solar energy into electrical energy by connecting a plurality of solar cells in series or in parallel. Thus, the solar cell array absorbs solar energy and converts it into electrical energy.

In addition, when the generator 2 is a wind turbine, the generator 2 may be a fan that converts wind energy into electrical energy.

On the other hand, the generator 2 is not limited to this, in addition to the photovoltaic device and the wind power generator may be an tidal power generator and the like. However, this is merely an example, and the generator 2 is not limited to the above-mentioned kind, and may include all power generation systems that generate electric energy using renewable energy such as solar heat or geothermal heat.

The energy storage system 2 supplies the charging power for charging the battery using the electrical energy converted through the power generator 2 or the driving power for driving the load 3.

To this end, the energy storage system 2 includes a power converter and a battery conditioning system (BCS).

The power converter may be connected to the power generator 2 and perform a function of converting DC power generated from the power generator 2 into AC power, which is a commercial power source. In addition, the power converter may perform a function of converting direct current or alternating current power stored in a battery of the battery management device to supply the load 3.

Such a power converter may be provided in an energy storage system for supplying a relatively large amount of power. Energy storage systems require large amounts of power conversion in order to supply relatively large amounts of power to the consumer. To this end, a plurality of power converters may be provided. For example, a plurality of power converters may be provided in energy storage systems of 250 KW, 500 KW, 1 MW and 2 MW.

The number of power converters may be changed according to a limit amount of power that the power converter can convert. In addition, the limit amount of power that the power converter can convert may also be changed by a plurality of components provided to the power converter. It is not limited to this idea.

In addition, the battery management device is connected to a specific DC-DC converter of any one of a plurality of DC-DC converter to perform a charging operation according to the output power through the DC-DC converter connected to, or to another DC-DC converter. A battery for performing a discharge operation for power supply, and a battery management system for managing the state of the battery.

The load 3 receives electric energy from the energy storage system 2 and consumes power.

Hereinafter, the energy storage system configured as described above will be described in more detail.

2 is a block diagram showing a schematic configuration of an energy storage system according to an embodiment of the present invention.

Referring to FIG. 2, the energy storage system 1 includes a power converter 10 including a container 8, an IGBT module cooling heat exchanger 100, a transformer 20, an air conditioner 30, and a fire hydrant 40. ), The outdoor unit 50 and the first refrigerant pipe (71, 72) for connecting the outdoor unit 50 and the IGBT module cooling heat exchanger (100), the second refrigerant pipe for connecting the outdoor unit 50 and the air conditioner (30) It may include. However, the units of the energy storage system shown in FIG. 2 are not essential to implementing the energy storage system, so the energy storage system described herein may have more or fewer components than those listed above. Can be.

In detail, the energy storage system 1 includes a container 8, which is a box-shaped container, and a power converter 10 is disposed inside the container 8 so as to be protected from the external environment.

The energy storage system 1 may include an outdoor unit 50 disposed outside the container 8 and having a compressor and a condenser.

The outdoor unit 50 may supply and supply refrigerant to the IGBT module cooling heat exchanger 100 through the first refrigerant pipes 71 and 72, and supply the refrigerant to the air conditioner 30 through the second refrigerant pipe. And used refrigerant can be supplied. That is, the air conditioner cooling function and the refrigerant cooling type cooling function through the IGBT module cooling heat exchanger 100 may be selectively provided through a common air conditioner 30 according to circumstances, thereby improving cooling efficiency.

In addition, the energy storage system 1 may include a power conversion system 10 (PCS) disposed at least one inside the container (8).

The power converter 10 includes a plurality of Insulated Gate Bipolar Transistors (IGBTs, hereinafter referred to as IGBT modules 300), first refrigerant pipes 71 and 72 connected to the outdoor unit 50, and first The IGBT module cooling heat exchanger 100 may be connected to the refrigerant pipes 71 and 72 to support the IGBT module 300 and to cool the refrigerant. The IGBT module cooling heat exchanger 100 may be referred to as an evaporator.

3 is a block diagram showing a schematic configuration of a power converter 10 according to an embodiment of the present invention.

In detail, referring to FIG. 3, the power converter 10 includes an IGBT module cooling heat exchanger 100, a cooling fan 200, an IGBT module 300, a temperature sensor 400, and a temperature controller 500. can do.

In detail, the power converter 10 includes a housing box which is a body, and in the housing box, an IGBT module cooling heat exchanger 100 supporting the IGBT module 300 and the IGBT module 300 is provided. Can be arranged.

In addition, at least one side surface of the housing box may be provided with at least one cooling fan 200 (Cooling Fan), which cools the inside of the housing box by introducing the cooled air in the container (8).

In addition, the IGBT module 300 may include a power conversion device and a circuit board. In an embodiment, the power conversion device may be an insulated gate bipolar transistor. Such a power conversion element may operate as an AC / DC converter that converts AC of a battery into DC in order to operate an electronic device that requires DC, and, on the contrary, an electronic that requires AC In order to operate the device as a battery, it can operate as an inverter that converts direct current into alternating current.

In addition, the IGBT module 300 may further include a circuit board for electrically connecting the power conversion element, the battery, and the load.

When the power conversion device operates for DC-AC conversion or AC-DC conversion, high temperature heat is generated. If the high temperature heat is not properly released, the power conversion device and other circuit board devices may be damaged. Given this, the power conversion efficiency can be reduced and the life of the device can be reduced.

Accordingly, the energy storage system 1 may include an air cooling system including an outdoor unit 50 for cooling the power converter 10, a second refrigerant pipe, an air conditioner 30, a cooling fan 200, and the like. .

In detail, the air conditioner 30 is disposed inside the container 8 and connected to the outdoor unit 50 through a second refrigerant pipe to supply coolant to supply the cooled air into the container 8, thereby to supply the container 8. The whole interior can be cooled.

The cooling fan 200 of the power converter 10 introduces the air inside the cooled container 8 into the housing box through a duct and air-cools the housing box, thereby converting the power converter 10. Can be air cooled.

In addition, the energy storage system 1 may include an outdoor unit 50 for cooling the power converter 10, first refrigerant pipes 71 and 72, and an IGBT module cooling heat exchanger 100.

In detail, the outdoor unit 50 may branch a portion of the refrigerant into the first refrigerant pipes 71 and 72 provided separately from the second refrigerant pipe and supply the same to the IGBT module cooling heat exchanger 100. At this time, the refrigerant supplied by the outdoor unit 50 is R410A, and may be a high-pressure refrigerant of about 120 psi.

At least one IGBT module 300 may be attached and supported by the IGBT module cooling heat exchanger 100 which receives the high pressure refrigerant, and the refrigerant of the first refrigerant pipes 71 and 72 passes through the valve to expand the refrigerant. By evaporating from the tube, the attached IGBT module 300 may be a direct expansion structure to directly cool the refrigerant. In detail, the IGBT module cooling heat exchanger 100 may directly use the expanded refrigerant of the primary fluid constituting the refrigeration cycle for cooling.

Unlike the cooling fan 200 that indirectly cools the IGBT module 300, the IGBT module cooling heat exchanger 100 directly cools the refrigerant by directly contacting the IGBT module 300, thereby further cooling the temperature of the IGBT module 300. There is an advantage that can be effectively lowered.

In addition, the IGBT module 300 refrigerant cooling system through the IGBT module cooling heat exchanger 100 can be compactly configured in a plate-like structure, thereby cooling the IGBT module 300 using only the IGBT module cooling heat exchanger 100. In this case, the power converter 10 may be made small so that a plurality of power converters 10 may be concentrated in the container 8. For example, the power converter 10 for cooling the IGBT module 300 using only the IGBT module cooling heat exchanger 100 may have a volume of at least 30% or more smaller than that of the air-cooled power converter 10. .

On the other hand, operating both the air cooling system and the refrigerant cooling system regardless of the temperature of the IGBT module 300 may cause unnecessary power waste.

The power converter 10 includes a temperature sensor 400 for measuring the temperature of the IGBT module 300 and a temperature sensor 400 for selectively operating the cooling system according to the temperature of the IGBT module 300. According to the temperature may further include a temperature control unit 500 for controlling the expansion valve 60 for connecting the first refrigerant pipe (71, 72) and the outdoor unit (50).

4 is a flowchart illustrating a cooling process of the power converter 10 under the control of the temperature controller 500 according to the embodiment of the present invention.

Referring to FIG. 4, the IGBT module 300 may perform an operation of converting power. (S101)

During the power conversion process of the IGBT module 300 may generate a high temperature heat, this heat may gradually increase the temperature inside the closed housing box.

In order to air-cool the power converter 10, first, the air conditioner 30 may be operated to lower the overall temperature inside the container 8. (S103)

In detail, the air conditioner 30 supplied with the coolant from the outdoor unit 50 may lower the overall temperature inside the container 8 by vaporizing the coolant and releasing the cooled air into the container 8.

The temperature controller 500 measures the temperature of the IGBT module 300 through the internal temperature of the container 8 and the temperature sensor 400, and if the IGBT module 300 is below a predetermined temperature, the cooling fan 200 is turned on. In operation, the IGBT module 300 may be air cooled. (S105)

That is, when the temperature of the IGBT module 300 is low, the temperature controller 500 operates only an air cooling system for supplying cooled air inside the container 8 to lower the housing box temperature, and thus, a plurality of power converters at once. By cooling (10), power efficiency can be improved.

The temperature controller 500 measures the temperature of the IGBT module 300 through the temperature sensor 400, and if the IGBT module 300 is above a predetermined temperature, operates the IGBT module cooling heat exchanger 100 to operate the IGBT module. 300 may be air cooled. (S107, S109, S111)

In detail, when the temperature controller 500 determines that the temperature of the IGBT module 300 exceeds the predetermined temperature through the temperature sensor 400, there is a risk of damage to the power conversion element, the expansion valve of the first refrigerant pipe ( By opening 60 and supplying a coolant to the IGBT module cooling heat exchanger 100, the IGBT module 300 may be cooled. (S113)

In contrast to the above embodiment, the temperature controller 500 operates only the IGBT module cooling heat exchanger 100 that supports the IGBT module 300 of a predetermined temperature or more among the plurality of power converters 10, thereby reducing unnecessary power consumption. You can stop it.

That is, the temperature controller 500 may selectively operate the air cooling system and the refrigerant cooling system according to the temperature of the IGBT module 300, and the required IGBT module cooling heat exchanger 100 among the plurality of power converters 10 may be used. Only by operating the temperature of the efficient IGBT module 300 can be controlled.

Further, the temperature controller 500 controls the opening and closing degree of the expansion valve 60 in accordance with the temperature of the IGBT module 300, and controls the flow rate of the refrigerant supplied to the IGBT module cooling heat exchanger 100, thereby controlling the IGBT module ( The temperature of 300 may be precisely controlled.

In addition, the temperature controller 500 may calculate the required refrigerant of the air conditioner 30 and the IGBT module 300, and simultaneously control the rotation speed of the compressor in the outdoor unit 50 and the expansion device according to the required refrigerant.

On the other hand, unlike the above embodiment, the temperature control unit 500 to cool the IGBT module 300 to give priority to the refrigerant cooling type, and when the temperature is above a predetermined temperature, an embodiment in which the cooling fan 200 is additionally possible. will be.

Referring to FIG. 5, (a) the graph shows the temperature of the IGBT module 300 when only the air cooling system is operated in the state where the temperature of the IGBT module 300 is improved, and (b) the graph shows the IGBT module 300. When only the refrigerant cooling system is operated in the state where the temperature is improved, the temperature of the IGBT module 300 is shown. (C) The graph shows the operation of both the air cooling and the refrigerant cooling system in the state where the temperature is improved by operating the IGBT module 300. In this case, the temperature of the IGBT module 300 is shown.

Through this graph, it can be seen that when the IGBT module 300 is cooled through the refrigerant cooling system, the temperature of the IGBT module 300 can be controlled faster and lower than the air cooling, and when both cooling systems are operated. It can be seen that the temperature of the IGBT module 300 can be controlled to the lowest.

Hereinafter, the specific structure of the power converter 10 will be described in more detail.

6 is a perspective view showing the inside of the housing box of the power converter 10 according to an embodiment of the present invention.

Referring to FIG. 6, the power converter 10 includes a housing box 250, a cooling fan 200, a duct 210, a fin heat sink 220, and an IGBT module cooling heat exchanger 100. ) And the IGBT module 300.

In detail, the housing box 250 is a box-shaped container and may include an accommodation space therein.

A cooling fan 200 for supplying outside air into the housing box 250 may be disposed on at least one side of the housing box 250.

In addition, a duct 210 for guiding the air supplied from the cooling fan 200 may be disposed in the housing box 250. In detail, the duct 210 includes a duct head portion 211 that directly receives air supplied to the cooling fan 200 in a size corresponding to the cooling fan 200, and a housing box having a narrower width than the head portion 211. It may include a duct body portion 212 extending along one surface of the (250).

A fin heat sink 220 may be disposed on one surface of the body of the duct 210. The fin heat sink 220 may have at least one plate shape, and includes a plurality of fins therein facing the duct 210 to discharge heat generated from the IGBT module 300 toward the duct 210. can do.

An IGBT module cooling heat exchanger 100 may be disposed on one surface of the fin heat sink 220. At least one IGBT module 300 may be disposed on one surface of the IGBT module cooling heat exchanger 100.

In detail, one surface of the IGBT module cooling heat exchanger 100 may be in contact with the fin heat sink 220, and the other surface may be disposed in contact with the IGBT module 300.

To describe the structure of the IGBT module cooling heat exchanger 100 in more detail, referring to FIG. 7, a pair of pipe headers 111 and 112, a flat tube 120, and a cooling plate 130 may be included.

In detail, the first pipe header 111 connected to the first refrigerant pipe 71 for supplying the refrigerant may be disposed above the cooling plate 130, and the second connection pipe connected to the first refrigerant pipe 72 for returning the refrigerant may be used. The piping header 112 may be disposed below the cooling plate 130.

In addition, a plurality of flat tubes 120 may be disposed between the first pipe header 111 and the second pipe header 112. In detail, the flat tubes 120 connected to the first pipe header 111 and extending toward the second pipe header 112 may be arranged at equal intervals along the extension direction of the pipe header. That is, one end of the flat tube 120 may be connected to the first pipe header 111 and the other end may be connected to the second pipe header 112.

The flat tube 120 may be supported by being attached to the rear surface of the cooling plate 130, and in an embodiment, the flat tube 120 may be supported by the rear surface of the cooling plate 130 and the front surface of the cover. .

The flat tube 120 receives the coolant from the first pipe header 111 to straighten the coolant or receives the coolant expanded from the expansion valve 60 to cool the cooling plate 130, thereby cooling the cooling plate 130. The IGBT module 300 attached to the refrigerant may be cooled.

The IGBT module 300 may be disposed in contact with the front surface of the cooling plate 130. In detail, the IGBT module 300 includes a power conversion element and a circuit board, and the power conversion element and the circuit board are surrounded by the body, so that one side of the body is open and the open side and the cooling plate 130 are front. It may have a structure in direct contact with the cooled cooling plate 130. That is, the power conversion element is disposed in the closed space by the body and the cooling plate 130, it can effectively cool the refrigerant.

8A shows the front of an IGBT module cooling heat exchanger 100 according to an embodiment of the invention.

Referring to FIG. 8A, a plurality of IGBT modules 300 may be alternately disposed at the front of the cooling plate 130. In detail, the IGBT module 300 may be disposed in a first row on the first pipe header 111 side of the cooling plate 130, and in the second row of the second pipe header 112 side of the cooling plate 130. The IGBT module 300 may be arranged, and the IGBT module 300 arranged in the first row and the IGBT module 300 arranged in the second row may be arranged to cross each other.

In detail, two IGBT modules 300 are arranged at the center in the first row, and two IGBT modules 300 are arranged at the outer edge side in the second row, so that the first row IGBT module 300 and the second row The IGBT modules 300 may be staggered from each other.

Accordingly, the flat tube 120 may include a first flat tube overlapping only the first row IGBT module and a second flat tube overlapping only the second row IGBT module. In addition, the flat tube 120 may include a third flat tube overlapping the first row IGBT module and the second row IGBT module simultaneously.

That is, by arranging the IGBT module 300 in each row, the IGBT module 300 in the first row and the IGBT module 300 in the second row are cooled by separate flat tubes 120, thereby improving cooling efficiency. You can.

FIG. 8B shows a back side of the IGBT module cooling heat exchanger 100 according to an embodiment of the invention, and FIG. 8C shows a cross section of AA ′ of FIG. 8B.

Referring to FIG. 8B, the rear surface of the cooling plate 130 has a flat tube 120 between the first pipe header 111 and the second pipe header 112 spaced apart from the first pipe header 111 in a vertical direction. The plurality of flat tubes 120 may be arranged in a horizontal direction spaced apart from each other by a predetermined interval.

Referring to FIG. 8C, the flat tube 120 includes a plurality of microchannels 122 arranged at least in a line, and the microchannels 122 use the high pressure refrigerant supplied from the pipe header to cool the plate 130. ) Can be cooled.

The micro-channel flat tube 120 is capable of high-efficiency cooling by using a high-pressure refrigerant, the size is small has the advantage that can be formed compactly the IGBT module 300 refrigerant exchanger.

Hereinafter, examples of the structure of the IGBT module cooling heat exchanger 100 including the micro channel flat tube 120 and a manufacturing method of each example will be described in detail.

9A to 9C are examples of the structure of the IGBT module cooling heat exchanger 100 according to the embodiment of the present invention, and FIG. 9A is a front view of the cooling plate 130 of the IGBT module cooling heat exchanger 100. A cover and tube of the IGBT module cooling heat exchanger 100 are shown, and FIG. 9C shows a cross section of BB ′ in FIG. 9B.

9A to 9C, the IGBT module cooling heat exchanger 100 according to an embodiment may include a cooling plate 130, a pipe header, and a flat tube 120.

In detail, the IGBT module 300 is disposed on the front surface of the cooling plate 130, and bolting holes for bolting the IGBT module 300 may be formed.

The first pipe header 111 may be disposed at one edge of the cooling plate 130, and the second pipe header 112 may be disposed at the opposite edge of the cooling plate 130. On the rear surface of the cooling plate 130, a plurality of grooves extending from the first pipe header 111 to the second pipe header 112 and arranged in the pipe header extension direction may be formed.

The flat tube 120 may be disposed in each of the plurality of grooves. In detail, by brazing the flat tube 120 in the groove, the cooling plate 130 and the flat tube 120 may be integrally formed.

At this time, by matching the height of the groove and the height of the flat tube 120, the upper surface 125 of the flat tube 120 and the cooling plate 130 may be formed to extend. In this case, the IGBT module 300 may be disposed in contact with the rear surface of the cooling plate 130 on which the flat tube 120 is formed, so that the flat tube 120 and the IGBT module 300 may be in contact with each other.

Cooling plate 130 and flat tube 120 integrated structure improves the space efficiency by forming a thin thickness of the IGBT module cooling heat exchanger 100, but there is a thickness limitation of the cooling plate 130, in the IGBT module 300 Since the diffusion of generated heat is difficult, a part of the IGBT module 300 is partially heated, and thus a hot spot may occur.

10A to 10B are another embodiment of the structure of the IGBT module cooling heat exchanger 100 according to the embodiment of the present invention, and FIG. 10A is an exploded perspective view of the IGBT module cooling heat exchanger 100, and FIG. 10B is C of FIG. 10A. -C 'is the cross section.

10A, the IGBT module cooling heat exchanger 100 according to another embodiment may include a cooling plate 130, a cover plate 140, pipe headers 111 and 1112, and a flat tube 120. have.

In detail, the first pipe header 111 may be disposed at one edge of the cover plate 140, and the second pipe header 112 may be disposed at the other edge of the cover plate 140.

The flat tubes 120 may be arranged at equal intervals on the upper surface of the cover plate 140. In detail, the cover plate 140 and the flat tube 120 may be integrally formed by brazing the flat tube 120 on the upper surface of the cover plate 140.

An IGBT module 300 is disposed on the front surface of the cooling plate 130, and bolting holes for bolting the IGBT module 300 may be formed. In this case, the cover plate 140 may also have a bolting hole formed at a position corresponding to the bolting hole of the cooling plate 130.

On the rear surface of the cooling plate 130, a plurality of grooves may be formed at a position corresponding to the flat tube 120 formed on the cover plate 140.

Referring to FIG. 10B, the flat tube 120 disposed on the top surface of the cover plate 140 is fitted into the groove of the cooling plate 130, and the flat tube 120 is coupled to the top surface of the cover plate 140 and the cooling plate 130. I can be surrounded by the home of).

The IGBT module cooling heat exchanger 100 of this embodiment, by brazing the flat tube 120 to the cover plate 140 and defects with the cooling plate 130, it is possible to ensure a sufficient thickness of the cooling plate 130 By increasing the heat diffusion through the cover plate 140 and the cooling plate 130, there is an advantage that can effectively reduce the temperature of the IGBT module 300.

Furthermore, the cover plate 140 and the cooling plate 130 are coupled to the fastening member 150 to further improve the contact resistance between the flat tube 120 and the cooling plate 130, thereby providing the flat tube 120 and the IGBT module. Heat exchange between 300 can be effectively made.

In detail, the fastening member 150 includes a plurality of bolts 152 penetrating through the cover plate 140 and the cooling plate 130 and disposed at both ends of the bolt 152 to cover the cover plate 140 and the cooling plate 130. Including a nut (151, 153) to provide a tightening force to), it is possible to increase the coupling force of the cooling plate 130 and the cover plate 140.

11A to 11B are yet another embodiment of the structure of the IGBT module cooling heat exchanger 100 according to the embodiment of the present invention, FIG. 11A is an exploded perspective view of the IGBT module cooling heat exchanger 100, and FIG. 11B is a view of FIG. It is sectional drawing of D-D '.

Referring to FIG. 11A, the IGBT module cooling heat exchanger 100 according to another embodiment may include a cooling plate 130, a cover plate 140, piping headers 111 and 112, and a flat tube 120. Can be.

In detail, in detail, the first pipe header 111 may be disposed at one edge of the cover plate 140, and the second pipe header 112 may be disposed at the other edge thereof.

On one surface of the cover plate 140, a plurality of protrusions 131 extending from the first pipe header 111 to the second pipe header 112 and arranged in the pipe header extension direction may be formed.

In addition, the flat tube 120 may be disposed on the protrusion 131 of the cover plate 140. In detail, the flat tube 120 may be thermally bonded to the upper surface of the protrusion 131 of the cover plate 140 to be coupled.

The IGBT module 300 may be disposed on the front surface of the cooling plate 130, and bolting holes for bolting the IGBT module 300 may be formed. On the rear surface of the cooling plate 130, a plurality of grooves 142 extending from the first pipe header 111 to the second pipe header 112 and arranged in the pipe header extension direction may be formed.

The groove 142 of the cooling plate 130 and the protrusion 131 of the cover plate 140 are formed at positions corresponding to each other, and the plurality of protrusions 131 of the cover plate 140 are the cooling plate 130. Can be coupled to fit in the groove 142 of.

That is, one surface of the flat tube 120 is disposed on the upper surface of the protrusion 131 of the cover plate 140, and the flat tube 120 is provided on the upper surface of the protrusion 131 of the cover plate 140 and the cooling plate 130. The contact resistance may be improved by being disposed between the bottom surfaces of the c) and being pressed by the protrusion 131 and the groove 142.

The IGBT module cooling heat exchanger 100 of this embodiment, by thermally bonding the flat tube 120 to the cover plate 140 and then thermally bonding the flat tube 120 to the cooling plate 130, the cooling plate 130 of the Since the thickness can be sufficiently secured, the thermal diffusion through the cover plate 140 and the cooling plate 130 is increased, thereby effectively reducing the temperature of the IGBT module 300.

In detail, referring to FIG. 12, when the thickness of the cooling plate 130 is 5 mm or more, it can be seen that the temperature of the cooling plate 130 is drastically lowered, and when it is 10 mm or more, the temperature drop rate is rapidly lowered. have.

Therefore, it can be seen that when the thickness of the cooling plate 130 is between 5 mm and 10 mm, the IGBT module 300 can be cooled with optimum efficiency.

In addition, the flat tube 120 is inserted between the protrusion 131 of the cover plate 140 and the groove 142 of the cooling plate 130 to improve contact resistance, thereby cooling the cooling plate 130 more effectively. There is an advantage.

Furthermore, the cover plate 140 and the cooling plate 130 may be coupled to the fastening member 150 to further improve the contact resistance between the flat tube 120 and the cooling plate 130.

In detail, the fastening member 150 includes a plurality of bolts 152 penetrating through the cover plate 140 and the cooling plate 130 and disposed at both ends of the bolt 152 to cover the cover plate 140 and the cooling plate 130. Including a nut (151, 153) to provide a tightening force to), it is possible to increase the coupling force of the cooling plate 130 and the cover plate 140.

Hereinafter, the structure of the power converter 10 for further miniaturizing the power converter 10 for cooling the IGBT module 300 by using the IGBT module cooling heat exchanger 100 will be described in detail.

13 is a perspective view of a power conversion apparatus 10 according to another embodiment of the present invention.

Referring to FIG. 13, the power converter 10 according to another embodiment may include an IGBT module cooling heat exchanger 100, a first IGBT module 301, and a second IGBT module 302. The IGBT module cooling heat exchanger 100 may include a plurality of tubes and a cooling plate.

In detail, at least one first IGBT module 301 may be disposed on a front surface of the cooling plate. At least one second IGBT module 302 may be disposed on the rear surface of the cooling plate.

In the cooling plate, a plurality of tubes are disposed, and the plurality of tubes are supplied with a refrigerant to straighten the refrigerant or receive the refrigerant expanded by the expansion valve 60 to cool the cooling plate, and attach them to both sides of the cooling plate. The IGBT modules 300 may be cooled at the same time.

The tube disposed inside the cooling plate may have various shapes such as a circular tube and a flat tube. In addition, one tube may extend along the extending direction of the cooling plate at one end of the cooling plate and bend at the other end of the cooling plate to extend in the opposite extension direction, and may include a refrigerant inlet and a refrigerant return port at the same time.

In an embodiment, the tube may be a flat tube 120 comprising micro channels, which micro channels can effectively cool the cooling plate using the supplied high pressure refrigerant. The micro-channel flat tube 120 is capable of high-efficiency cooling by using a high-pressure refrigerant, the size is small has the advantage that can be formed compactly the IGBT module 300 refrigerant exchanger.

14 is an example of the side of the power converter 10 according to another embodiment of the present invention.

Referring to FIG. 14, the first IGBT module 301 and the second IGBT module 302 may be disposed to overlap each other with a cooling plate interposed therebetween. In detail, when the cooling plate extends in the horizontal direction, moving the first IGBT module 301 in the vertical direction may exactly overlap the second IGBT module 302.

The power converter 10 having a structure in which the first IGBT module 301 and the second IGBT module 302 overlap with the cooling plate interposed therebetween simultaneously controls the IGBT module 300 disposed on both sides by one cooling plate. By heat dissipation, the volume of the IGBT module cooling heat exchanger 100 may be reduced by 50% or more compared with the structure in which the IGBT module 300 is disposed only on one surface.

In summary, the IGBT module cooling heat exchanger 100 according to another embodiment may switch from the bulky IGBT module 300 air cooling system to the refrigerant cooling system and reduce the volume by at least 30% or more. Through the structure of arranging the IGBT module 300 on both sides, there is an advantage that can reduce the volume of the power converter 10 by 50% or more.

However, when the first IGBT module 301 and the second IGBT module 302 completely overlap each other with the cooling plate interposed therebetween, the cooling plate region between the two parts may be excessively overheated to generate hot spots.

15 is another example of the side of the power converter 10 according to another embodiment of the present invention.

Referring to FIG. 15, the first IGBT module 301 and the second IGBT module 302 may be arranged to be staggered with each other with a cooling plate therebetween. In detail, when the cooling plate extends in the horizontal direction, moving the first IGBT module 301 in the vertical direction may partially overlap the second IGBT module 302.

In detail, the cooling plate overlaps only the first region L1 disposed between the first IGBT module 301 and the second IGBT module 302, and only each of the first IGBT module 301 and the second IGBT module 302. It may include a second region (L2) to be.

Unlike FIG. 15, the first IGBT module 301 and the second IGBT module 302 are arranged to be completely crossed so that the cooling plate overlaps only the first IGBT module 301 and the second IGBT module 302, respectively. It may include two regions (L2).

That is, another example IGBT module cooling heat exchanger 100 reduces the first area (L1) of the cooling plate disposed between the first IGBT module 301 and the second IGBT module 302 to generate hot spots. You can stop it.

On the other hand, as the IGBT module 300 is disposed on both sides of the cooling plate, the IGBT module cooling heat exchanger 100 must simultaneously cool a pair of IGBT modules 300 with one tube, thereby reducing cooling efficiency. .

In order to prevent a reduction in cooling efficiency in the double-sided IGBT module 300 arrangement structure, at least two rows of tubes may be disposed inside the cooling plate to improve performance degradation due to refrigerant pressure loss.

16 is an example of a side cross section of a power conversion apparatus 10 according to another embodiment of the present invention.

Referring to FIG. 16, the plurality of tubes 120a and 120b may be arranged in at least two rows in the cooling plate 130. In this case, the tubes 120a and 120b of the front row and the rear row may be arranged in parallel with each other.

That is, one surface of the tube 120a disposed in the front row and one surface of the tube 120b disposed in the rear row may be disposed to face each other.

The IGBT module cooling heat exchanger 100 may improve performance degradation due to refrigerant pressure loss by arranging the tubes 120a and 120b in at least two rows in the cooling plate 130.

17 is another example of a cross section of the power converter 10 according to another embodiment of the present invention.

The plurality of tubes 120a and 120b may be arranged in at least two rows in the cooling plate 130. In this case, the front and rear rows of tubes 120a and 120b may be arranged in a zigzag pattern.

That is, one surface of the tube 120a disposed in the front row and one surface of the tube 120a disposed in the rear row may be alternately disposed.

The IGBT module cooling heat exchanger (100) structure, by placing the tubes (120a, 120b) in at least two rows in the cooling plate 130, it is possible to improve performance degradation due to refrigerant pressure loss, cooling plate 130 By uniformly cooling the front surface, it is possible to reduce the occurrence of hot spots.

FIG. 18 is a view specifically illustrating a cross section of the IGBT module cooling heat exchanger 100 of the power converter 10 of FIG. 17.

Referring to FIG. 18, the cooling plate 130 may include a first cooling plate 130a in which a first IGBT module 301 is disposed on a front surface thereof, and a second cooling plate in which a second IGBT module 302 is disposed on a front surface thereof. 130b, a plurality of protrusions 131a and grooves are formed on a rear surface of the first cooling plate 130a, tubes 120a and 120b are disposed on the plurality of protrusions, and a second cooling plate 130b is provided. A plurality of protrusions 131b and grooves are formed on the rear surface of the tube, and the tubes 120a and 120b are disposed on the plurality of protrusions, and the protrusions 131a and the second cooling plate on the rear surface of the first cooling plate 130a. The first cooling plate 130a and the second cooling plate 130b may be coupled to each other so that the groove of the rear surface of the 130b may be fitted.

That is, one surface of the tubes 120a and 120b may be in contact with an upper surface of the protrusion 131a of the first cooling plate 130a, and the protrusion 131a may be inserted into a groove of the second cooling plate 130b to form a tube 120a. , 120b is inserted between the upper surface of the protrusion 131a of the first cooling plate 130a and the groove bottom surface of the second cooling plate 130b to be pressed by the protrusion and the groove, thereby improving contact resistance. And due to the improved contact resistance of the tube (120a, 120b), heat exchange between the tube (120a, 120b) and the IGBT module 300 can be more effectively.

Furthermore, the second cooling plate 130b and the first cooling plate 130a are coupled to the fastening member 150 to further improve the contact resistance between the tube 120 and the first cooling plate 130a, thereby resulting in a tube 120. ) And the IGBT module 301, 302 can be effectively exchanged heat.

In detail, the fastening member 150 may include a plurality of bolts 152 penetrating through the second cooling plate 130b and the first cooling plate 130a, and disposed at both ends of the bolt 152 to form the second cooling plate 130b. ) And the nuts 151 and 153 which provide the tightening force to the first cooling plate 130a, the coupling force of the first cooling plate 130a and the second cooling plate 130b may be increased.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be interpreted that the contents related to such a combination and modification are included in the scope of the present invention.

In addition, the above description has been made with reference to the embodiments, which are merely examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains may be exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (9)

A plurality of flat tubes having a channel through which the refrigerant passes, extending in the vertical direction;
A first pipe header provided at an upper end of the flat tube and connected to a first refrigerant inlet pipe for supplying the refrigerant;
A second pipe header provided at a lower end of the flat tube and connected to a second refrigerant outlet pipe for discharging the refrigerant;
A cooling plate having a plurality of grooves accommodating the flat tube on one surface thereof and a supporting part supporting at least one IGBT module on the other surface thereof; And
A cover plate coupled to the cooling plate through a fastening member and having a plurality of protrusions formed at positions corresponding to the plurality of grooves of the cooling plate;
The plurality of protrusions are coupled to fit in the plurality of grooves,
The inside of the flat tube includes a plurality of micro-channel (Micro-channel) listed in at least one row,
The flat tube is positioned between the cooling plate and the cover plate,
And the flat tube is pressurized between the bottom surface of the groove of the cooling plate and the top surface of the protrusion of the cover plate. The method of claim 1,
A plurality of IGBT modules disposed on the other surface of the cooling plate and including a power conversion element and a circuit board connected to the power conversion element;
The first IGBT module is disposed on the other side of the cooling plate,
The second IGBT module is disposed below the other side of the cooling plate
IGBT Modular Cooling Heat Exchanger. The method of claim 2,
The flat tube,
A first flat tube overlapping the first IGBT module and a second flat tube overlapping the second IGBT module
IGBT Modular Cooling Heat Exchanger. delete delete The method of claim 1,
One surface of the flat tube is in contact with the bottom surface of the groove of the cooling plate,
The other surface of the flat tube is in contact with the upper surface of the protrusion of the cover plate IGBT module cooling heat exchanger. The method of claim 6,
The flat tube is thermally bonded to the upper surface of the protrusion of the cover plate to be bonded
IGBT Modular Cooling Heat Exchanger. delete The method of claim 1,
The fastening member,
A plurality of bolts passing through the cover plate and the cooling plate, and nuts disposed at both ends of the bolt to provide a tightening force to the cover plate and the cooling plate.
IGBT Modular Cooling Heat Exchanger.

Images