KR102059117B1 - Release film for packaging epoxy molding compound - Google Patents

Abstract

The present invention is a nylon film layer; Antistatic coating layer; UV molding layer; And a release film for EMC packaging in which a fluorine release coating layer is laminated in this order. The release film for EMC packaging of the present invention exhibits low surface resistance of 10 ⁹ Ω / □ or less, low surface energy, proper film thickness of about 30 to 60 μm, excellent heat resistance, and excellent surface roughness, which is very useful for EMC packaging. Can be used.

Description

Release film for EMC packaging {RELEASE FILM FOR PACKAGING EPOXY MOLDING COMPOUND}

The present invention relates to a release film for EMC (EPOXY MOLDING COMPOUND) packaging, and more particularly, to protect the mold mold during the EMC molding process, to prevent the mold contact of the EMC uncured, and to prevent the chip (CHIP) susceptible to static electricity. It relates to a release film for EMC (EPOXY MOLDING COMPOUND) packaging that can protect performance.

The packaging process (PKG) refers to a process of separating individual semiconductor devices fabricated on a wafer to connect electrical connection lines and sealing them to withstand the external environment. The packaging process will be described in more detail as follows.

First, a defective product is sorted using a probe or the like to determine whether an integrated circuit chip formed on a wafer is electrically operated, and a chip is cut using a diamond wheel to separate chips on the wafer. The chip thus cut is bonded onto the chip support paddle on the surface of the lead frame (L / F). Solder alloys (Au-Si, Pb-Sn) and epoxy resins are used as adhesives for bonding the chip to the lead frame.

After the chip is fixed to the lead frame, the chip external connection terminal is connected to the lead frame with a gold wire. The lead frame connected with the metal wire is inserted into the mold, and the epoxy molding compound (EMC) is injected and sealed into the mold mold. This seal protects the chip and lead from external impact, corrosion and contact.

In the packaging process of a memory semiconductor, a molding method using an epoxy molding compound (EMC) is most widely used. This is because EMC has lower thermal stability and reliability than ceramics, but has the advantages of low cost and high productivity.

There are many different characteristics of EMC that are in conflict with each other. In particular, it is necessary to satisfy the opposite characteristics of adhesion and release property. The reason why the adhesion is necessary is that the stability of the package, that is, mechanical stability or electrical stability can be secured only when the adhesion with the silicon die or the metal lead frame is good. For this purpose, low molecular weight resins with good flowability or low amount of wax should be used.

However, when using a low molecular weight resin or using a low amount of wax as described above, the mold release property of the mold mold is lowered and defects in which the EMC sticks to the mold mold may occur, or the mold may be caused by residual EMC. Contamination of the mold occurs, which requires periodic surface cleaning of the mold.

In order to solve the above problem, a resin is formed to form a semiconductor package without directly contacting the mold resin with the cavity surface of the mold by injecting the mold resin into the mold while the resin molding portion (cavity surface) of the mold is covered with the release film. The technology using the release film for a mold was developed and has obtained the certain result.

The release film for resin molds require complex physical properties such as low surface resistance, low surface energy, low film thickness, excellent heat resistance, and excellent surface roughness. However, conventionally, the release film does not have sufficient physical properties as described above.

Republic of Korea Patent No. 10-1682934

The present invention has been made to solve the above problems of the prior art,

An object of the present invention is to provide a release film for EMC packaging that exhibits a low surface resistance of 10 ⁹ Ω / □ or less, low surface energy, an appropriate film thickness of about 30 to 60 μm, excellent heat resistance, and excellent surface roughness.

The present invention to solve the above problems,

Nylon film layer;

An antistatic coating layer laminated on the nylon film layer;

A UV molding layer laminated on the antistatic coating layer; And

It provides a release film for EMC packaging comprising a fluorine release coating layer laminated on the UV molding layer.

In one embodiment of the present invention, the nylon film layer may be formed using a nylon film having a corona treatment on one side or both sides.

In one embodiment of the present invention, the nylon film layer is nylon 6, nylon 66, nylon 46, nylon 11, nylon 12, nylon 610, nylon 612, nylon 6/66 copolymer, nylon 6/66/610 copolymer , Nylon MXD6, nylon 6T, nylon 6 / 6T copolymer, nylon 66 / PP copolymer, nylon 66 / PPS copolymer, methoxymethylated 6-nylon, methoxymethylated 6-610-nylon and 612- It may also be formed from a nylon film selected from methoxymethylates of nylon. Nylon film thickness can be used from 5um to 100um.

In one embodiment of the present invention, the antistatic coating layer is UV curable acrylate-based binder 1 to 4 parts by weight, ketone solvent 20 to 80 parts by weight, photopolymerization initiator 4 to 8 parts by weight, and alcohols, amides, or The mixed solvent organic dispersion may be formed of an antistatic coating composition containing 10 to 40 parts by weight of PEDOT: PSS. Preferably, the ketone solvent is 60-80 parts by weight, the organic dispersion PEDOT: PSS is an alcohol solvent, and contains 26 to 40 parts by weight.

In one embodiment of the present invention, the antistatic coating layer may further comprise 0.01 to 3 parts by weight of the siloxane additive. Preferably, the antistatic coating layer may further comprise 1 to 3 parts by weight of the siloxane additive.

In one embodiment of the present invention, the alcohols, amides, or mixed solvents of the organic dispersion PEDOT: PSS, the organic solvent, and a dispersion aid are mixed in the first mixing step to prepare a mixed solvent and the mixed solvent It may also be prepared by a second mixing step of mixing poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS) in solid powder form.

In one embodiment of the present invention, the alcohols, amides, or mixed solvents of the organic dispersion PEDOT: PSS is 0.1 ~ based on the total weight of the alcohols, amides, or mixed solvents of the organic dispersion PEDOT: PSS 3% by weight of poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS), the alcohols, amides, or mixed solvents thereof organic dispersion PEDOT: 0.05 to 4% by weight of the total weight of the PSS First dispersion aid to assist the dispersion of the second, the organic dispersion of the alcohol PEDOT: a second dispersion aid for improving the conductivity of 0.1 to 10% by weight relative to the total weight of the PSS, and the alcohols, amides or mixed solvents thereof Organic Dispersion PEDOT: may contain 85% to 95% of a dispersion organic solvent based on the total weight of the PSS.

In one embodiment of the present invention, the UV molding layer is 42 to 60 parts by weight of silicone acrylate, polyfunctional acrylate monomer (PETA) for dilution of high viscosity oligomer 18 to 35 parts by weight, polyfunctional acrylate monomer for dilution (HDDA) A composition for forming a molding layer comprising 8 to 20 parts by weight, 3 to 10 parts by weight of a monofunctional acrylate monomer (HEMA), 10 to 25 parts by weight of a dispersant, 3 to 7 parts by weight of a photopolymerization initiator, and 1 to 7 parts by weight of a siloxane additive. It may be formed as.

In one embodiment of the present invention, the UV molding layer may be embossed.

In one embodiment of the present invention, the fluorine release coating layer may be formed of a composition for forming a fluorine release coating layer comprising 1-2 parts by weight of a perfluoro-based polymer and 98 to 99 parts by weight of a fluoro solvent.

The release film for EMC packaging of the present invention exhibits low surface resistance of 10 ⁹ Ω / □ or less, low surface energy, proper film thickness of about 30 to 60 μm, excellent heat resistance, and excellent surface roughness, which is very useful for EMC packaging. Can be used.

Various embodiments and / or aspects of the invention are disclosed below. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more aspects. However, it will also be appreciated by one of ordinary skill in the art that this aspect (s) may be practiced without these specific details. The following description and the annexed drawings set forth in detail certain illustrative aspects of the one or more aspects. However, these aspects are exemplary and some of the various methods in the principles of the various aspects may be used and the descriptions described are intended to include all such aspects and their equivalents.

As used herein, “an embodiment”, “an example”, “aspect”, “an example”, etc., may not be construed as having any aspect or design described being better or advantageous than other aspects or designs. .

In addition, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or”. In other words, unless specified otherwise or unambiguously in context, "X uses A or B" is intended to mean one of the natural implicit substitutions. That is, X uses A; X uses B; Or where X uses both A and B, "X uses A or B" may apply to either of these cases. Also, it is to be understood that the term "and / or" as used herein refers to and includes all possible combinations of one or more of the related items listed.

In addition, the terms "comprises" and / or "comprising" mean that such features and / or components are present, but exclude the presence or addition of one or more other features, components, and / or groups thereof. It should be understood that it does not.

In addition, it is to be understood that the singular forms “a” and “an”, including “an”, unless the context clearly indicates otherwise, include plural expressions. Thus, as an example, a “component surface” includes one or more component surfaces.

In addition, terms including ordinal numbers such as first and second may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The term and / or includes a combination of a plurality of related items or any item of a plurality of related items.

In addition, the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. As used herein, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

In addition, in the embodiments of the present invention, unless otherwise defined, all terms used herein including technical or scientific terms are generally understood by those skilled in the art to which the present invention belongs. Has the same meaning as Terms such as those defined in the commonly used dictionaries should be interpreted as having meanings consistent with the meanings in the context of the related art, and ideally or excessively formal meanings, unless explicitly defined in the embodiments of the present invention. Not interpreted as

The present invention is a nylon film layer; Antistatic coating layer; UV molding layer; And a release film for EMC packaging in which a fluorine release coating layer is laminated in this order. Specifically, the release film for EMC packaging according to an embodiment of the present invention is a nylon film layer; An antistatic coating layer laminated on the nylon film layer; A UV molding layer laminated on the antistatic coating layer; And a release film for EMC packaging including a fluorine release coating layer laminated on the UV molding layer.

The present invention is to use the anti-static coating layer, UV molding layer, fluorine releasing coating layer in order to solve the difficulty of the coating work and the static electricity generation problem while using the high heat resistance and high elongation of nylon as the base material of the release film at the same time. Lamination maximizes the advantages of nylon and complements its disadvantages, resulting in a high-performance release film for EMC packaging.

Specifically, the release film for EMC packaging of the present invention according to the configuration described below exhibits a low surface resistance of 10 ⁸ Ω / □ or less, low surface energy, low film thickness of 45 ㎛ or less, excellent heat resistance, and excellent surface roughness It can be very useful for EMC packaging. The release film for EMC packaging according to the present invention having such characteristics can basically protect the mold mold from contamination during the EMC molding process, prevent the mold contact of the EMC uncured products, and have a low surface resistance to prevent static electricity. By protecting the performance of the chip vulnerable and having a low surface energy, the release operation can be performed smoothly, and with a low film thickness, the hot spot forming property that can realize the mold shape without damage in the EMC molding process Can be implemented.

Other layers known in the art may be further stacked between the layers constituting the release film for EMC packaging.

In another embodiment of the present invention, the release film for EMC packaging, may further include an additional UV molding layer laminated under the nylon film layer.

In another embodiment of the present invention, the release film for EMC packaging, may further comprise an additional antistatic coating layer disposed between the nylon film layer and the additional UV molding layer.

In another embodiment of the present invention, the release film for EMC packaging may further include an additional fluorine release coating layer laminated under the additional UV molding layer.

It is preferable that the additional UV molding layer, the additional antistatic coating layer, and the additional fluorine release coating layer have substantially the same components as the UV molding layer, the antistatic coating layer, and the fluorine release coating layer described later.

In another embodiment of the present invention, the release film for EMC packaging, the intermediate layer to enhance the adhesion between the nylon film layer and the UV molding layer instead of the additional antistatic coating layer disposed between the nylon film layer and the additional UV molding layer. It may also include. The intermediate layer is coated on the surface of the nylon layer to show a sufficient degree of adhesion, and the adhesion to the UV molding layer to be further coated, but also corresponds to a coating layer without additional components imparting antistatic performance, the components described above The organic dispersion PEDOT: PSS corresponding to the antistatic component in the antistatic coating layer is the same as the excluded component. In one embodiment, the intermediate layer is formed by UV curing acrylate binder, ketone solvent, photopolymerization initiation, more preferably, 1 to 10 parts by weight of UV curable acrylate binder, 20 to 90 parts by weight of ketone solvent It may include 4 to 8 parts by weight of the photopolymerization initiator.

Hereinafter, the layers constituting the release film for EMC packaging according to an embodiment of the present invention will be described in order.

1.nylon Film layer

The nylon film forming the nylon film layer is excellent in heat resistance and elongation, but has a disadvantage in that coating is difficult and static electricity is severe. Therefore, the present invention employs the above-described special layer structure in order to take advantage of the above advantages and overcome the disadvantages. That is, the coating and electrostatic problems are solved by combining different layer configurations.

The nylon film layer is preferably formed using a nylon film that has been corona treated on one or both sides.

The nylon film layer is nylon 6, nylon 66, nylon 46, nylon 11, nylon 12, nylon 610, nylon 612, nylon 6/66 copolymer, nylon 6/66/610 copolymer, nylon MXD6, nylon 6T, nylon Choose from 6 / 6T copolymer, nylon 66 / PP copolymer, nylon 66 / PPS copolymer, methoxymethylate of 6-nylon, methoxymethylate of 6-610-nylon and methoxymethylate of 612-nylon Can be formed into a nylon film. Nylon film thickness can be used from 5um to 100um.

In addition, the nylon film layer may have sufficient antistatic properties even if the antistatic coating layer is laminated on only one side, it may have an advantage in the manufacturing process.

2. Antistatic Coating Layer

An antistatic coating layer is laminated on the nylon film layer.

Preferably, the antistatic coating layer is 1 to 4 parts by weight of a UV curable acrylate binder, 20 to 80 parts by weight of a ketone solvent, 4 to 8 parts by weight of a photoinitiator, and alcohols, amides, or mixed solvents thereof. The organic dispersion PEDOT: PSS may be formed of an antistatic coating composition containing 10 to 40 parts by weight. Preferably, the ketone solvent is 60-80 parts by weight, the organic dispersion PEDOT: PSS is an alcohol solvent, and contains 26 to 40 parts by weight.

In addition, the antistatic coating composition may further comprise 0.01 to 3 parts by weight of the siloxane additive. Such siloxane additives can impart wettability (WETTING) during nylon coating. Preferably, the antistatic coating layer may further comprise 1 to 3 parts by weight of the siloxane additive.

The ketone solvent is a solvent for diluting the binder, and the alcohol organic dispersion PEDOT: PSS means a form in which PEDOT: PSS is dispersed in alcohol. The alcohol and PEDOT: PSS are preferably mixed in a weight ratio of 20 to 30: 1. Alternatively, PEDOT: PSS may be dispersed in a solvent other than alcohol.

As the alcohol, alcohols having 1 to 5 carbon atoms may be used, and preferably ethanol may be used.

The antistatic coating composition may be prepared using Dispersion in which a conductive polymer PEDOT: PSS is dispersed in an organic solvent to impart the required charging characteristics in the film.

The UV curable acrylate-based binder is preferably used because it has good adhesion with the nylon film and improves adhesion to the UV Molding layer. In addition, since the UV acrylate resin is used in the subsequent process, it may be used to improve adhesion to the UV molding layer.

The UV curable acrylate-based binder may be used without limitation in this field, for example, PU620 (Aliphatic urethane hexaacrylate) manufactured by Miwon Specialty Chemical Co., may be used.

Formation of the coating layer by the antistatic coating composition is a film applied to the semiconductor packaging proceeds by using a nylon film having a corona treatment on one or both sides of 30 ~ 50㎛ thickness as a base film. The coating may be performed by Gravure coating, Slot DIE coating, etc., which is a WET coating process.

The antistatic coating composition maintains an antistatic performance of 10 ^{^ 4.5} ~ 10 ^{^ 5.5} . When the surface resistance is higher than the above range, it is difficult to obtain the desired chargeability when working the UV molding layer.

2-1. Alcohol, Amides Or Mixed Solvents  Organic dispersion PEDOT: PSS

As described above, the antistatic coating composition includes alcohols, amides, or mixed solvents organic dispersion PEDOT: PSS. Preferably, the antistatic coating composition includes an alcohol-based organic dispersion PEDOT: PSS, hereinafter will be described with respect to the manufacturing process and specific components of the alcohol-based organic dispersion PEDOT: PSS. Alcohol organic dispersion PEDOT: PSS may also be referred to as a poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS) dispersion. In other embodiments of the present invention, organic dispersed PEDOT: PSS other than alcohols may be used.

The conductive polymer, poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS), may first be made into a dispersion and then mixed with other components. That is, it is preferable that the PEDOT / PSS dispersion is prepared before mixing with other compositions of the antistatic coating layer, and then mixed with other compositions of the antistatic coating layer in a dispersion state.

At this time, poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS) can be dispersed in an organic solvent, and preferably, a dispersion aid can be further added to disperse.

In the method for preparing a poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS) dispersion liquid according to an embodiment of the present invention, the organic solvent and the dispersion aid are mixed to prepare a mixed solvent. And a second mixing step of mixing poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS) in the form of a solid powder in the mixed solvent.

As the organic solvent, a solvent selected from the above-described organic solvents may be used.

According to an embodiment of the present invention, the poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS) dispersion is poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT) 0.1-3% by weight of poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS), the poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid Total dispersion of the poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS), the first dispersion aid to assist the dispersion of 0.05 to 4% by weight relative to the total weight of the dispersion of (PEDOT / PSS) A second dispersion aid for improving the conductivity of 0.1 to 10% by weight, and 85 to 95% of the dispersion organic solvent.

Preferably, the method for preparing a poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS) dispersion according to an embodiment of the present invention, after the second mixing step, the mixed solvent and poly It may further comprise a high shear mixer step of preparing a second mixture by dispersing and mixing the mixture of (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS) by a shear force by a high shear mixer. have

As an example of the high shear mixer, a high shear force may be generated using a high rotational force or the like, thereby forming a device including two or more rotors and stators. Such a high shear mixer can be made into a second mixture by making the mixture more homogeneous by using a cavitation phenomenon. Preferably, the high shear mixer is dispersed and mixed for 1 hour or more at a rotational speed of about 6,000 rpm or more with respect to the mixed liquid. At this time, cooling is further performed to maintain the temperature of the mixed solution at 10 ° C.

More preferably, after the high shear mixer step, the bead mill step of performing additional dispersion of the second mixed solution to the bead mill; may further include. Preferably the bead mill is in the form of a bead mill capable of nano dispersion. By the bead mill step, the second mixed liquid may be more homogeneous and improved in dispersibility by the beads.

As an example of the bead mill, pulverization and dispersion are applied by applying an impact force to the target powder by using beads that are efficient in wet dispersion and wet grinding, for example, zirconia-containing beads, and thus, the second mixed liquid by the bead mill step. Silver can be more homogeneous and improved dispersibility by the beads.

In addition, the beads preferably have a particle diameter of 50 μm to 300 μm, more preferably, beads having a particle size in the range of 80 μm to 120 μm. The rotating speed of the rotating body of the bead mill is preferably used in the range of about 30 to 60Hz frequency. The dispersion thus prepared should be stored in a cold storage device at or below 10 ° C. If stored for a long time at room temperature 20 ℃ or more, the dispersion of PEDOT / PSS shows a cohesive phenomenon, the conductivity may be sharply reduced.

The dispersion aid comprises a first dispersion aid to assist in the dispersion of the poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS) in the form of a solid powder; And it is preferable to include a second dispersion aid for improving the conductivity when the dispersion is coated.

Here, the first dispersion aid comprises at least one of amines (Amine), acrylates (Acrylate), and polyols (Polyols), the second dispersion aid is diethylene glycol (Diethylene glycol), Propylene glycol, tetramethylene glycol, sorbitol, N, N-dimethylformamide, ethylene glycol, N, N-dimethylacetamide ( N, N-dimethylacetamide, acetonitrile, dimethylsulfoxide, glycerol, ethylene cyanide, formic acid, propylene carbonate, ethylene ethylene carbonate), 2,6-difluoropyridine, formamide, and N-methylformamide.

The first dispersion aid may be included in 0.05 to 4.0% by weight based on the total weight of the composition, the second dispersion aid may be included in 1 to 10% by weight.

Preferably, the organic solvent in the dispersion of poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS) is PGME, and the poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid ( The solvent of the dispersion of PEDOT / PSS) is N, N-dimethylformamide (DMF). In such a combination of solvents, the conductivity of the composition can be further increased, and at the same time, the particles can be uniformly dispersed and have an effect of not being precipitated.

3. UV Molding layer

The UV molding layer is 42 to 60 parts by weight of silicone acrylate, 18 to 35 parts by weight of polyfunctional acrylate monomer (PETA) for diluting high viscosity oligomer, 8 to 20 parts by weight of polyfunctional acrylate monomer (HDDA) for dilution, monofunctional It is preferably formed from a composition for forming a molding layer comprising 3 to 10 parts by weight of an acrylate monomer (HEMA), 10 to 25 parts by weight of a dispersant, 3 to 7 parts by weight of a photopolymerization initiator, and 1 to 7 parts by weight of a siloxane additive.

The UV molding layer is preferably embossed, and is therefore also referred to as an "emboss layer".

The silicone acrylate is an oligomer for improving heat resistance, and those known in the art may be used. For example, SIU-2400 (Multifunctional Silicone Acrylate) manufactured by Miwon Specialty Chemical may be used.

DMAA (N, N-dimethyl acrylamide) may be preferably used as the dispersant. The component may help to impart charging characteristics of the molding layer.

The monofunctional acrylate monomer (HEMA) aids in the expression of PEDOT: PSS chargeability.

 The siloxane additive performs a function of improving the wetting property with the release coating layer, and components known in the art may be used without limitation.

Since the temperature at which EMC is melted during the semiconductor packaging is 160-170 ° C and the process is performed at about 120 sec, the glass transition temperature (Tg) of the UV molding layer that EMC closes is very important.

Therefore, a silicone acrylate oligomer that can withstand high temperatures at high temperatures may be preferably used in the composition for forming a molding layer, as compared to an aliphatic urethane acrylate oligomer, an aromatic urethane acrylate oligomer, and the like. Specifically, since the silicone acrylate oligomer is difficult to work due to its high viscosity, the degree of crosslinking is increased by using diluent monomers PETA (peta pentaerythritol triacrylate), HDDA (Hexanediol diacrylate), HEMA (2-Hydroxyethyl methacrylate), and DMAA. The sex is advantageously configured to lower the viscosity.

In order to realize the antistatic property, since only the antistatic coating layer generates difficulty, PEDOT: PSS is dispersed in N, N-dimethylacrylamide and used for raw material synthesis.

The siloxane additive is used to improve the coating of the composition for forming a fluorine release coating layer in a later step.

4. Fluorine release coating layer

The fluorine release coating layer is preferably formed of a composition for forming a fluorine release coating layer containing 1-2 parts by weight of perfluoro-based polymer and 98-99 parts by weight of a fluoro solvent.

The composition for forming a fluorine release coating layer is applied to the UV molding layer subjected to the embo treatment by Gravure, SLOT DIE, Spray method, etc., which is a wet coating method.

The release coating layer is preferably formed to a thickness of about 0.1 ~ 0.5㎛ on the surface of the UV molding layer is embossed for the purpose of improving the releasability with the molten epoxy molding compound. In the case of coating by the spray method as described above, high temperature drying is not required, and it is preferable because it can be dried within minutes at room temperature (25 ° C).

The photopolymerization initiator used in the present invention can be used without particular limitation. In particular, the group consisting of acetophenone-based compounds, benzophenone-based compounds, triazine-based compounds, biimidazole-based compounds, oxime compounds, and thioxanthone-based compounds in terms of polymerization properties, starting efficiency, absorption wavelength, availability, and price. It may be preferably used to include one or more compounds selected from.

If the components constituting each layer of the release film for EMC packaging of the present invention is not specifically described in the present invention, components known in the art may be used without limitation.

Hereinafter, the Example of this invention is illustrated. The following examples are provided by way of example only to assist in understanding the present invention, whereby the technical scope of the present invention is not limited.

Preparation Example 1 Preparation of Antistatic Coating Composition

1 to 4 parts by weight of a UV curable acrylate binder, 60 to 80 parts by weight of a ketone solvent, 4 to 8 parts by weight of a photopolymerization initiator, and an alcohol-based organic dispersion PEDOT: 26 to 40 parts by weight of an alcohol, and a binder and a magnetic stirrer. After mixing PEDOT: PSS to mix well, the PEDOT was forcibly dispersed using a Homogenizer for the second time to prepare an antistatic coating composition of the preparation, and to evaluate the physical properties of the prepared composition.

The antistatic coating composition of Comparative Preparation Example was prepared in a composition outside the range of Preparation Example.

Specific mixed components and contents and the results of evaluation of physical properties of the prepared antistatic coating composition are shown in Table 1 below.

Example 1-1 Preparation Example 1-2 Comparative Production Example 1-1 Comparative Production Example 1-2 Comparative Production Example 1-3 PU620 One 3 5 7 8 2-Butanone 65 65 65 65 65 igacure500 5 5 5 5 5 EtOH 28 26 24 22 21 PEDOT: PSS One One One One One Total (% by weight) 100 100 100 100 100 Curable good good good good good Wetting good good good good good Adhesion good good BAD BAD BAD Charging characteristics 10 ^{^ 4.5 ~ 5.5} 10 ^{^ 5.8} 10 ^{^ 6.2} 10 ^{^ 10.3} 10 ^{^ 11.8}

Preparation Example 2 Preparation of UV Molding Layer Composition

Silicone acrylate 42 to 60 parts by weight, high viscosity oligomer dilution polyfunctional acrylate monomer (PETA) 18 to 35 parts by weight, dilution polyfunctional acrylate monomer (HDDA) 8 to 20 parts by weight, monofunctional acrylate monomer (HEMA ) 3 to 10 parts by weight, 10 to 25 parts by weight of dispersant, 3 to 7 parts by weight of the photopolymerization initiator and 1 to 7 parts by weight of the siloxane additive were added and stirred for at least 3 hours using an overhead stirrer to mix the raw materials well and mix the UV of the preparation example. A composition for forming a molding layer was prepared.

The UV molding layer-forming composition of Comparative Preparation Example was prepared in a composition outside the range of Example Preparation Example.

Specific mixed ingredients and contents are shown in Tables 2 and 3 below.

Using the agitated material, the surface roughness value was 1.6 ~ 2.0um and Rz value was 6.5 ~ 10.5um. The first curing was irradiated with light of 30 ~ 50mJ / ㎠ using a black light lamp, the second curing was carried out by irradiating with 300 ~ 400mJ / ㎠ light using high pressure Hg and high pressure metal lamp. The properties of the film thus produced were evaluated. The evaluation was performed to determine whether the UV molding composition is good adhesion to the nylon fabric subjected to the AS coating treatment, the surface resistance characteristics are good, and the results are shown in Tables 2 and 3.

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2-6 ETFE 100 Olly
Gomer Silicone acrylate
Oligomer SIU-
2400 50 30 35 Epoxy Acrylate
Oligomer SC6400 50 Urethane acrylate
Oligomer MU9500 50 Monomer Multifunctional
Monomer (PETA) M340 20 20 20 30 30 Multifunctional
Monomer (HDDA) M200 10 10 10 20 15 Monofunctional
Monomer (HEMA) HEMA 5 5 5 5 5 N, N-dimethyl
acrylamide DMAA 20 20 20 20 20 Disper
sion DMAA
dispersion DMAA PEDOT Photopolymerization
Initiator 1-droxy-cyclohexyl-phenyl-
1-tone Igacure 184 5 5 5 5 5 2,4,6-TriMethylbenzoyl-
diphenyl-phosphineoxide Igacure TPO additive Polysiloxane Rad2200N 5 5 With Nylon AS film
Adhesion N.G Good N.G N.G N.G N.G Surface resistance 10 ^{^ 10.5} 10 ^{^ 10.1} 10 ^{^ 9.8} 10 ^{^ 9.9} 10 ^{^ 9.5} 10 ^{^ 9.8} Good (◎) // ○ // △ // X (Bad) Heat resistance ◎ ◎ X X X △ Variant
Coating Bad Bad Bad Good Good

(Unit: parts by weight)

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2-4 practice
Produce
Yes
2-5 ETFE Olly
Gomer Silicone acrylate
Oligomer SIU-
2400 40 45 50 50 50 50 Epoxy Acrylate
Oligomer SC6400 Urethane acrylate
Oligomer MU9500 Monomer Multifunctional
Monomer (PETA) M340 30 25 20 20 20 20 Multifunctional
Monomer (HDDA) M200 10 10 10 10 10 10 Monofunctional
Monomer (HEMA) HEMA 5 5 5 5 5 5 N, N-dimethyl
acrylamide DMAA 20 20 Disper
sion DMAA
dispersion DMAA 19 19 19 19 PEDOT One One One One Photopolymerization
Initiator 1-droxy-cyclohexyl-phenyl-
1-tone Igacure 184 5 5 3 4 5 5 2,4,6-TriMethylbenzoyl-
diphenyl-phosphineoxide Igacure TPO 2 One 0.5 additive Polysiloxane Rad2200N 5 5 5 5 5 5 With Nylon AS film
Adhesion Good Good Good Good Good Good Surface resistance (Ω / □) 10 ^{^ 10.2} 10 ^{^ 10.1} 10 ^{^ 11.5} 10 ^{^ 10.8} 10 ^{^ 9.5} 10 ^{^ 8.5} Good (◎) // ○ // △ // X (Bad) Heat resistance △ ○ ○ ◎ ◎ ◎ Variant
Coating Good Good Good Good Good Good

(Unit: parts by weight)

Preparation Example 3 Preparation of Composition for Forming Fluorine Release Coating Layer

1 to 2 parts by weight of the perfluoro polymer and 98 to 99 parts by weight of the fluoro solvent were placed in a stirring chamber and stirred with an overhead stirrer for 29 to 31 hours (preferably 30 hours) to prepare a composition for forming a fluorine release coating layer according to the Preparation Example. Prepared.

The composition for forming a fluorine release coating layer of Comparative Preparation Example was prepared in a composition outside the range of Example Preparation Example.

If the stirring time is too long, evaporation of the solvent occurs, the solid content is changed, the time is strictly adhered to. Specific mixed ingredients and contents are shown in Table 4 below.

The composition for forming a fluorine release coating layer prepared as described above was sprayed onto the UV molding layer formed in 2. using a spray gun. In order to observe the surface characteristics after coating, the droplets were observed by dropping DI water into niddle. To observe more accurately, the surface energy change is observed by using the Contant angle measuring device. When the contact angle is measured at 85 degrees or more, it is judged that the coating is good. The evaluation results are shown in Table 4 below.

Example of manufacture
3-1 Example of manufacture
3-2 Comparative Production Example 3-1 Comparative Production Example
3-2 Comparative Production Example
3-3 Comparative Production Example
3-4 ETFE 100 perfluoro polymer One 2 3 4 5 fluoro solvent 99 98 97 96 95 Surface energy 80 ° 85 ° 95 ° or more 78 ° 80 ° 82 ° EMC release Good Good Good Bad Bad Bad

Examples 1-2 and Comparative Examples 1-3: Preparation of Release Film for EMC Packaging

After coating the antistatic coating composition prepared in Preparation Example 1-1 on mayer bar # 12 ~ 16 on the nylon film treated with a cross-sectional corona treatment having a thickness of 30 to 50 μm, so that the wetting is easy, It was dried for 2 minutes in a 90 ℃ oven. After the drying, by using a Fusion Lamp on the conveyor belt irradiated with light of 400 ~ 500mJ / ㎠ to form an antistatic coating layer.

Roll using a hard roll of a pattern having a surface roughness value of 1.6 ~ 2.0um, Rz value of 6.5 ~ 10.5um using the UV molding layer forming composition prepared in Preparation Example 2-5 on the antistatic coating layer. The UV molding layer was formed in a to roll line. Specifically, the first curing was carried out by irradiating 30 ~ 50mJ / ㎠ using a black light lamp, the second was cured by irradiating light of 300 ~ 400mJ / ㎠ using a high pressure Hg and a high pressure metal lamp.

A release coating layer was formed on the UV molding layer using the composition for forming a fluorine release coating layer prepared in Preparation Example 3-2. Specifically, the release film for EMC packaging of Example 1 was prepared by spraying the composition for forming a fluorine release coating layer on a UV molding layer with a spray gun to form a release coating layer.

To prepare a release film for EMC packaging in the same manner as described above, the components using the components described in Table 5 below, to prepare a release film for EMC packaging of Example 2 and Comparative Examples 1 to 3.

Base film Antistatic coating layer UV molding layer Fluorine Release Coating Layer Example 1 Nylon film Example 1-1 Example of Production Example 2-5 Example 3-2 Example 2 Nylon film Preparation Example 1-2 Example of Production Example 2-1 Example 3-1 Comparative Example 1 Nylon film Comparative Production Example 1-1 Example of Production Example 2-1 Comparative Production Example 3-1 Comparative Example 2 Nylon film Preparation Example 1-2 Comparative Production Example 2-6 Comparative Production Example 3-2 Comparative Example 3    PET film Example 1-1 Example of Production Example 2-5 Example 3-2

Test Example 1 Evaluation of Physical Properties of Release Film for EMC Packaging

The physical properties of the release film for EMC packaging as described below and the results are shown in Table 5 below.

(1) Surface resistance measurement

The surface resistance of the release film for EMC packaging prepared above was measured using a surface resistance measuring instrument (ST-4, manufactured by SIMCO).

(2) Surface energy measurement

In order to observe the surface characteristics of the prepared release film for EMC packaging, DI water was dropped one drop into niddle, and the surface energy change was observed using a contant angle measuring device. When the angle was measured more than 85 degrees in the contact angle measurement, it was determined that the surface energy is low.

(3) film thickness measurement

The thickness of the release film for EMC packaging prepared above was measured by a conventional method.

(4) heat resistance measurement

In order to evaluate the heat resistance of the release film for EMC packaging manufactured above for 10 to 20 seconds at the same temperature as the EMC molding process, that is, 170 ~ 180 ℃, the deformation and bubble generation on the film surface based on the following criteria Evaluated.

◎: No bubble generation or surface deformation (good)

△: no bubble generation but surface deformation is observed

Ⅹ: Both bubble formation and surface deformation are observed (defect)

(5) Surface roughness measurement

Ra (Roughness) was measured by measuring the surface roughness of the 1mm x 1mm area of the release film for EMC packaging using a lens of 10x magnification with a 3D Profiler.

Measures Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Surface resistance (Ω / □) 10 ^ 8.5 10 ^ 8.8 10 ^ 13.5 10 ^ 10.3 10 ^ 10.0 Surface energy 85 ° 90 ° 79 ° 75 ° 81 ° Film thickness (㎛) 48um 51um 66um 58um 55um Heat resistance Good Good Bad Bad Bad Surface roughness Good Good Bad Bad Bad

As confirmed in Table 6, the release film for EMC packaging of Examples 1 and 2 of the present invention showed excellent physical properties in all aspects of surface resistance, surface energy, film thickness, heat resistance and surface roughness. However, the release films for EMC packaging of Comparative Examples 1 to 3 were found to have insufficient properties.

Claims (14)

Nylon film layer;
An antistatic coating layer laminated on the nylon film layer;
A UV molding layer laminated on the antistatic coating layer; And
It comprises a fluorine release coating layer laminated on the UV molding layer,
The antistatic coating layer is UV curable acrylate-based binder 1 to 4 parts by weight, ketone solvent 20 to 80 parts by weight, photopolymerization initiator 4 to 8 parts by weight, and alcohols, amides, or mixed solvents organic dispersion PEDOT: Formed with an antistatic coating composition containing 10 to 40 parts by weight of PSS, release film for EMC packaging.
The method according to claim 1,
The release film for EMC packaging, characterized in that the nylon film layer is formed using a nylon film that has been corona treated on one or both sides.
The method according to claim 2,
The nylon film layer is nylon 6, nylon 66, nylon 46, nylon 11, nylon 12, nylon 610, nylon 612, copolymer of nylon 6/66, nylon 6/66/610 copolymer, nylon MXD6, nylon 6T, nylon 6 / 6T copolymer, nylon 66 / PP copolymer, nylon 66 / PPS copolymer, methoxymethylate of 6-nylon, methoxymethylate of 6-610-nylon and methoxymethylate of 612-nylon Release film for EMC packaging, characterized in that formed of a selected nylon film.
delete The method according to claim 1,
The antistatic coating layer is an EMC packaging release film, characterized in that it further comprises 0.01 to 3 parts by weight of siloxane-based additives.
The method according to claim 1,
The alcohols, amides, or mixed solvents of organic dispersion PEDOT: PSS,
A first mixing step of preparing a mixed solvent by mixing an organic solvent and a dispersion aid, and a poly (3,4-ethylenedioxythiophene) -polystyrene sulfonic acid (PEDOT / PSS) of a solid powder in the mixed solvent Release film for EMC packaging, characterized in that prepared by 2 mixing steps.
The method according to claim 1,
The alcohols, amides, or mixed solvents organic dispersed PEDOT: PSS,
The alcohols, amides, or mixed solvents thereof Organic dispersion PEDOT: Poly (3,4-ethylenedioxythiophene) -polystyrenesulfonic acid (PEDOT / PSS), 0.1 to 3% by weight, based on the total weight of the PSS , Amides, or mixed solvents of the organic dispersion PEDOT: a first dispersion aid to assist the dispersion of 0.05 to 4% by weight based on the total weight of the PSS, the alcohols, amides, or a mixed solvent of the organic dispersions PEDOT: A second dispersion aid for improving the conductivity of 0.1 to 10% by weight relative to the total weight of the PSS, and the organic dispersions of the alcohols, amides, or mixed solvents thereof. PEDOT: 85 to 95% of the dispersion organic to the total weight of the PSS. Release film for EMC packaging, characterized in that it comprises a solvent.
Nylon film layer;
An antistatic coating layer laminated on the nylon film layer;
A UV molding layer laminated on the antistatic coating layer; And
It comprises a fluorine release coating layer laminated on the UV molding layer,
The UV molding layer is 42 to 60 parts by weight of silicone acrylate, 18 to 35 parts by weight of polyfunctional acrylate monomer (PETA) for diluting high viscosity oligomer, 8 to 20 parts by weight of polyfunctional acrylate monomer (HDDA) for dilution, monofunctional EMC formed of a composition for forming a molding layer comprising 3 to 10 parts by weight of an acrylate monomer (HEMA), 10 to 25 parts by weight of a dispersant, 3 to 7 parts by weight of a photopolymerization initiator, and 1 to 7 parts by weight of a siloxane additive. Release film for packaging.
The method according to claim 8,
The release film for EMC packaging, characterized in that the UV molding layer is embossed.
Nylon film layer;
An antistatic coating layer laminated on the nylon film layer;
A UV molding layer laminated on the antistatic coating layer; And
It comprises a fluorine release coating layer laminated on the UV molding layer,
The release film for EMC packaging, characterized in that the fluorine release coating layer is formed of a composition for forming a fluorine release coating layer containing 1 to 2 parts by weight of perfluoro-based polymer and 98 to 99 parts by weight of a fluoro solvent.
Nylon film layer;
An antistatic coating layer laminated on the nylon film layer;
A UV molding layer laminated on the antistatic coating layer; And
As a release film for EMC packaging comprising a fluorine release coating layer laminated on the UV molding layer,
The release film for EMC packaging,
The release film for EMC packaging further comprising; further UV molding layer laminated under the nylon film layer.
The method according to claim 11,
The release film for EMC packaging,
The release film for EMC packaging further comprising an additional antistatic coating layer disposed between the nylon film layer and the additional UV molding layer.
The method according to claim 12,
The release film for EMC packaging,
The release film for EMC packaging further comprises an additional fluorine release coating layer laminated under the additional UV molding layer.
The method according to claim 11,
The release film for EMC packaging,
Further comprising an intermediate layer disposed between the nylon film layer and the additional UV molding layer,
The intermediate layer, a UV curable acrylate binder, a ketone solvent, a release film for EMC packaging containing a photopolymerization initiator.