KR102047223B1 - Backlight unit using LED and liquid crystal display device including the same - Google Patents

Backlight unit using LED and liquid crystal display device including the same Download PDF

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Publication number
KR102047223B1
KR102047223B1 KR1020120103514A KR20120103514A KR102047223B1 KR 102047223 B1 KR102047223 B1 KR 102047223B1 KR 1020120103514 A KR1020120103514 A KR 1020120103514A KR 20120103514 A KR20120103514 A KR 20120103514A KR 102047223 B1 KR102047223 B1 KR 102047223B1
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KR
South Korea
Prior art keywords
thickness
led
guide plate
light guide
liquid crystal
Prior art date
Application number
KR1020120103514A
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Korean (ko)
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KR20140036862A (en
Inventor
김상준
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엘지디스플레이 주식회사
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Priority to KR1020120103514A priority Critical patent/KR102047223B1/en
Publication of KR20140036862A publication Critical patent/KR20140036862A/en
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Publication of KR102047223B1 publication Critical patent/KR102047223B1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/003—Lens or lenticular sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements
    • G02F2201/503—Arrangements improving the resistance to shock
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The present invention is a light guide plate; An LED having a first thickness and mounted on one surface of the printed circuit board facing the light guide plate; Provided is a backlight unit mounted on one surface of the printed circuit board and including a buffer member having a second thickness greater than the first thickness.

Description

Backlight unit using LED and liquid crystal display device including same {Backlight unit using LED and liquid crystal display device including the same}

The present invention relates to a backlight unit using an LED, and more particularly, to an LED backlight unit and a liquid crystal display including the same.

Liquid crystal display devices (LCDs), which are used for TVs and monitors due to their high contrast ratio and are advantageous for displaying moving images, have optical anisotropy and polarization characteristics. The principle of image implementation by

Such a liquid crystal display device is an essential component of a liquid crystal panel bonded through a liquid crystal layer between two substrates facing each other, and realizes a difference in transmittance by changing an arrangement direction of liquid crystal molecules with an electric field in the liquid crystal panel. .

However, since the liquid crystal panel does not have its own light emitting element, a separate light source is required to display the difference in transmittance as an image. Recently, LEDs (light emitting diodes) having high efficiency and high brightness characteristics have been widely used as light sources for liquid crystal displays.

In an edge type liquid crystal display device having an advantage of thinness, an LED backlight disposed along the longitudinal direction of the light incident surface is used in which a plurality of LEDs are spaced apart from the light guide plate. Recently, the LED driving current is increased in terms of high efficiency, and thus the LED temperature is increased, and heat emitted from the LED is transferred to the light guide plate located nearby.

As a result, the light guide plate is thermally expanded to be in contact with the LEDs, thereby causing a poor LED image. In addition, the path of the light incident on the light guide plate is changed by the contact thereof, thereby causing an abnormal light emission phenomenon, and the hot spot phenomenon is intensified by the expansion of the light guide plate, resulting in poor image quality.

As such, the conventional LED backlight has a problem that the reliability is lowered.

The present invention has a problem to provide a method for improving the reliability of the LED backlight.

In order to achieve the above object, the present invention is a light guide plate; An LED having a first thickness and mounted on one surface of the printed circuit board facing the light guide plate; Provided is a backlight unit mounted on one surface of the printed circuit board and including a buffer member having a second thickness greater than the first thickness.

The buffer member may include a base member mounted directly on the printed circuit board; Located on the base member, it may include a support member having a light transmission characteristic.

The base member may have a third thickness, the support member may have a fourth thickness greater than the third thickness, and the base member and the support member may be coupled through an adhesive.

The optical auxiliary mechanism may be disposed between the buffer member and the light guide plate and have a concave lens-shaped recessed portion corresponding to the LED.

The optical aid may be made of a transparent material, or a fluorescent material may be added.

In another aspect, the present invention is a liquid crystal panel; A light guide plate positioned under the liquid crystal panel; An LED having a first thickness and mounted on one surface of the printed circuit board facing the light guide plate; Provided is a liquid crystal display device mounted on one surface of the printed circuit board and including a buffer member having a second thickness greater than the first thickness.

The buffer member may include a base member mounted directly on the printed circuit board; Located on the base member, it may include a support member having a light transmission characteristic.

The base member may have a third thickness, the support member may have a fourth thickness greater than the third thickness, and the base member and the support member may be coupled through an adhesive.

The optical auxiliary mechanism may be disposed between the buffer member and the light guide plate and have a concave lens-shaped recessed portion corresponding to the LED.

The optical aid may be made of a transparent material, or a fluorescent material may be added.

In the present invention, by configuring the buffer member thicker than the LED, the degree of thermal expansion of the light guide plate by the buffer member is limited, the contact between the light guide plate and the LED can be prevented.

Accordingly, defects such as LED imprints can be prevented as mechanical failures caused by contact of the light guide plate and the LEDs. In addition, since the expansion of the light guide plate is limited, the abnormal light emission phenomenon and the hot spot phenomenon are reduced, and thus optical defects can be reduced.

As a result, by using the buffer member, it is possible to reduce the mechanical and optical defects caused by the light guide plate expansion, it is possible to improve the reliability of the LED backlight.

Furthermore, an optical assisting mechanism can be used, in which case light incidence efficiency or color reproduction can be improved.

1 is an exploded perspective view schematically showing a liquid crystal display device including an LED module according to an embodiment of the present invention.
2 is a cross-sectional view schematically showing the LED of FIG.
3 is a cross-sectional view schematically showing an LED module using a buffer member according to an embodiment of the present invention.
4 and 5 are cross-sectional views schematically showing examples of an optical auxiliary mechanism configured between an LED and a light guide plate of a liquid crystal display according to an exemplary embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is an exploded perspective view schematically illustrating a liquid crystal display device including an LED module according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view schematically illustrating the LED of FIG. 1.

Referring to FIG. 1, a liquid crystal display device 100 according to an exemplary embodiment of the present invention includes a liquid crystal panel 120, a backlight unit 130, a main supporter 140, a top case 150, and a bottom. It may include a case 160.

The liquid crystal panel 120 displays an image. The liquid crystal panel 120 includes first and second substrates 121 and 122 bonded to each other with the liquid crystal layer interposed therebetween.

The first substrate 121 is an array substrate, and a pixel in which a plurality of gate lines and data lines cross each other and is arranged in a matrix form is defined.

A thin film transistor (TFT) is formed as a switching element connected to the gate wiring and the data wiring. The thin film transistor is connected to the pixel electrode formed in each pixel.

On the other hand, the second substrate 122, which is the opposite substrate facing the first substrate 121, has a color filter of red, green, and blue, for example, corresponding to each pixel. And a black matrix covering the color filter and covering the non-display elements such as the gate line, the data line, and the thin film transistor.

As such, the second substrate 122 having the color filter corresponds to the color filter substrate. The second substrate 121 may further include a common electrode covering the color filter and the black matrix.

As described above, the liquid crystal molecules are arranged in the liquid crystal layer according to the electric field generated by the pixel electrode and the common electrode, thereby displaying an image.

On the other hand, the liquid crystal panel 120 having the configuration as described above as an example, other various liquid crystal panel may be used. For example, an in-plane switching type liquid crystal panel may be used in which the pixel electrode and the common electrode are formed on the first substrate 121 and are substantially parallel to the substrate surface.

Although not shown, polarizers may be attached on the outer surfaces of the first and second substrates 121 and 122 to selectively transmit only light having a specific polarization.

The backlight unit 130 corresponds to a configuration for supplying light to the liquid crystal panel 120. As the backlight unit 130 according to the exemplary embodiment of the present invention, an edge type backlight unit in which a light source is disposed outside the liquid crystal panel 120 when viewed in plan view may be used.

The backlight unit 130 may include an LED module 200, a light guide plate 133, a reflector plate 131, and an optical sheet 135.

The LED module 200 includes a printed circuit board (PCB) extending in one direction, that is, along the longitudinal direction of the light incident surface of the light guide plate 133, and an extension direction of the printed circuit board (PCB) on one surface, that is, the upper surface of the printed circuit board (PCB). It may include a plurality of LEDs 210 disposed along.

Various types of printed circuit boards may be used as the printed circuit board (PCB). For example, a metal core printed circuit board (MCPCB) may be used as a metal PCB having a excellent heat dissipation function using a metal as a base, but is not limited thereto. When MCPCB is used, an insulating layer is formed on a base layer made of a metal material, and a wiring pattern is formed on the insulating layer.

As such, when the MCPCB is used as a printed circuit board (PCB), since the base layer is made of a metal material, it is possible to effectively dissipate heat generated from the LED 210.

The LED 210 is configured in the form of a package. For example, the LED 210 may include a mold 211, an LED chip 212, and an encapsulant 213.

The mold part 211 corresponds to a structure defining a structural shape of the LED 210. An encapsulation space opened to an upper portion is provided in the mold part 211.

The mold portion 211 may be configured such that the outer side thereof has a quadrangular shape in plan view, but is not limited thereto.

The encapsulation space is preferably configured to have an inverted trapezoidal shape whose width increases along the upper direction, ie, the direction in which light is emitted, but is not limited thereto. Meanwhile, the encapsulation space may have a rectangular shape in plan, but is not limited thereto.

The encapsulation space is filled with the encapsulant 213 to which the fluorescent material is added. Silicone resin may be used as the encapsulant 213. It is not limited to this. The LED chip 212 emitting light may be mounted on the bottom surface of the encapsulation space, that is, the inner bottom surface of the mold portion 211.

The LED 210 configured as described above may be configured as a white LED emitting white light, or may be configured as a red, green, and blue LED, but is not limited thereto. Do not.

The LED 210 is connected to the wiring pattern formed on the printed circuit board (PCB), and receives the driving current to emit light. Here, the LED module 200 may receive a driving current generated from an external driving board through a flexible cable connected to the printed circuit board (PCB).

The light guide plate 133 receives light emitted from the LED 210 disposed along the light incident surface. Light incident on the light guide plate 133 is uniformly spread to the entire surface of the light guide plate 133 while providing light to the front surface of the light guide plate 133 by total reflection.

Here, in order to provide a more efficient surface light source, a pattern having a specific shape may be formed on at least one of the front and rear surfaces of the light guide plate 133.

The reflective plate 131 is positioned on the rear surface of the light guide plate 133. Accordingly, the light emitted through the rear surface of the light guide plate 133 may be reflected toward the liquid crystal panel 120, thereby improving luminance.

The optical sheet 135 is positioned on the front surface of the light guide plate 133. For example, the optical sheet 135 may include a diffusion sheet and at least one light collecting sheet, for example, a prism sheet, but is not limited thereto. The optical sheet 135 may diffuse and / or condense the light emitted through the light guide plate 133 to provide a higher quality uniform surface light source to the liquid crystal panel 120.

The liquid crystal panel 120 and the backlight unit 130 as described above may be modularized by being combined with members such as the top case 150, the bottom case 160, the main supporter 140, and the like.

The top case 150 may have a rectangular frame having a cross section bent in, for example, a shape to cover the top and side edges of the liquid crystal panel 120. The front of the top case 150 is opened, through which the image implemented in the liquid crystal panel 120 can be displayed to the outside.

The bottom case 160 corresponds to a configuration in which the liquid crystal panel and the backlight units 120 and 130 are seated on the bottom surface of the inside and serve as a basis for assembling the structure of the liquid crystal display device 100. The bottom case 160 may have a rectangular plate shape and four edges thereof may be vertically bent at a predetermined height.

The main supporter 140 surrounds the edges of the liquid crystal panel 120 and the backlight unit 130, and may be assembled to the top case and the bottom case 150 and 160. The main supporter 140 may accommodate the liquid crystal panel 120 and the backlight unit 130 to support and protect them.

Meanwhile, the buffer member 220 may be used in the backlight unit 130 according to the embodiment of the present invention as a mechanical configuration for preventing contact between the light guide plate 133 and the LED 210. In this regard, it will be described with reference to FIG. 3 further. 3 is a cross-sectional view schematically showing an LED module using a buffer member according to an embodiment of the present invention.

Referring to FIG. 3 further, the LED module 200 according to the embodiment of the present invention may be provided with a buffer member 220.

The buffer member 220 may be mounted on a printed circuit board (PCB), and may be mounted on an upper surface of the printed circuit board (PCB) on which the LED 210 is mounted.

The buffer member 220 may function to prevent the expanded light guide plate 133 from contacting the LED 210 when the light guide plate 133 is thermally expanded.

To this end, the buffer member 220 is preferably configured to have a larger thickness than the LED 210 located on the same surface of the printed circuit board (PCB). For example, the LED 210 has a first thickness d1 and the buffer member 220 has a second thickness d2 based on the top surface of the printed circuit board PCB. Is configured such that d1 <d2.

In this way, by configuring the buffer member 220 thicker than the LED 210, even if the light guide plate 133 is expanded in the direction of the LED 210, the degree of expansion is limited by the buffer member 220, the light guide plate 133 ) And the LED 210 can be prevented.

Accordingly, as a mechanical failure due to the contact between the light guide plate and the LEDs 133 and 210, defects such as LEDs can be prevented.

In addition, since the expansion of the light guide plate 133 is limited, the LED 210 and the light guide plate 131 may be kept spaced apart from each other. Accordingly, compared to the related art, it is possible to reduce the path change of the light incident on the light guide plate 133 from the LED 210, thereby reducing the abnormal light emission phenomenon. In addition, compared with the related art, it is possible to reduce the extent to which the expanded light guide plate 133 leaves the effective screen area, so that a hot spot phenomenon can be reduced. As such, by limiting the expansion of the light guide plate 133, optical defects can be reduced.

As a result, by using the buffer member 220, it is possible to reduce the mechanical and optical defects due to the expansion of the light guide plate 133, it is possible to improve the reliability of the LED backlight 130.

The buffer member 220 having the function as described above may be formed of structures of different materials. For example, the buffer member 220 may include a base member 221 and a support member 222.

The base member 221 is a structure positioned below the buffer member 220 and may function to mount the buffer member 220 on a printed circuit board (PCB). For example, the base member 221 is made of a metal material and may be directly fixed to the printed circuit board (PCB) through surface mounting technology (SMT), but is not limited thereto.

The support member 222 is a structure positioned on the upper portion of the buffer member 220, and supports the expanded light guide plate 133 to suppress expansion in the direction of the LED 210. For example, the support member 222 may be made of a silicone resin, a plastic, or the like as a transparent material having light transparency, but is not limited thereto.

The support member 222 and the base member 221 may be bonded through an adhesive, but are not limited thereto. Here, when an adhesive is used, a transparent adhesive silicone adhesive or Ag adhesive may be used in consideration of durability.

On the other hand, the base member 221 has a third thickness (d3) and the support member 222 has a fourth thickness (d4). The fourth thickness d4 may be configured to be larger than the third thickness d3, and the first thickness d1 may be configured to be larger than the third thickness d3.

In this regard, since the buffer member 220 is located on the same plane as the LED 210, it may be preferable that the interference or loss of light emitted from the LED 210 is minimized. Accordingly, the base member 221, which is attached to the printed circuit board (PCB), has a thickness that is thin enough to exclude or minimize interference or loss of light emitted from the LED 210. It is preferable. Accordingly, the support member 222 has a thickness d4 thicker than the third thickness d3. In such a case, the support member 222 may be made of a transparent material in order to minimize interference or loss of light emitted from the LED 210.

On the other hand, in the embodiment of the present invention, as an approach to improve the optical characteristics of the light emitted from the LED 210, an optical auxiliary mechanism can be configured between the LED 210 and the light guide plate 133. This will be described in detail with reference to FIGS. 4 and 5.

4 and 5 are cross-sectional views schematically showing examples of an optical auxiliary mechanism configured between an LED and a light guide plate of a liquid crystal display according to an exemplary embodiment of the present invention.

First, referring to FIG. 4, a first optical auxiliary mechanism 231 is configured between the LED 210 and the light incident surface of the light guide plate 133. The first optical auxiliary mechanism 231 is preferably configured to be in contact with the buffer member 220, but is not limited thereto.

As such, by disposing the first optical auxiliary mechanism 231 between the LED 210 and the light guide plate 133, the first optical auxiliary mechanism 231 together with the buffer member 220 suppresses the expansion of the light guide plate 133. You will be able to perform the function. Therefore, when the first optical auxiliary mechanism 231 is provided, the expansion of the light guide plate 133 is further limited, so that the reliability can be further improved.

Meanwhile, the first optical assistant 231 may be made of a transparent material such as silicone resin or plastic, and may include a concave indentation 235 recessed in correspondence to the LED 210.

Here, the first optical auxiliary mechanism 231 may be made of a silicone resin, but is not limited thereto. In addition, the recess 235 is preferably configured to have a concave lens shape, but is not limited thereto.

As the concave portion 235 is disposed above the LED 210, the light emitted from the LED 210 causes refraction in the outward direction by the concave portion 235. That is, the concave portion 235 performs a light diffusion function. As a result, the effect that the light directing angle of the LED 210 extends outward is exerted.

As such, by using the first optical auxiliary mechanism 231 having the concave portion 235, the light directing angle is extended, and the light incidence efficiency to the light guide plate 133 can be improved. In addition, since the arrangement interval of the LED 210 can be widened, a relatively small number of LEDs 210 can be used, thereby reducing the LED component cost.

Next, referring to FIG. 5, a second optical auxiliary mechanism 232 is configured between the LED 210 and the light incident surface of the light guide plate 133.

The second optical assistant 232 may be configured by adding a fluorescent material to the first optical assistant 231 described above. In this regard, for example, the second optical aid 232 may be formed by coating a fluorescent material on a transparent plastic tube, mixing silicon and fluorescent materials, or bonding the quantum dot fluorescent material and silicon. It is not limited to this.

As such, by using the second optical auxiliary mechanism 232 to which the fluorescent material is added, the color component embodied by the fluorescent material is emphasized in the light emitted from the LED 210. Therefore, in order to compensate for the insufficient color component, by using the second optical auxiliary mechanism 232 to which the fluorescent material for implementing the color component is added, color reproducibility can be improved.

As described above, according to the embodiment of the present invention, by configuring the buffer member thicker than the LED, the degree of thermal expansion of the light guide plate by the buffer member is limited, the contact between the light guide plate and the LED can be prevented.

Accordingly, defects such as LED imprints can be prevented as mechanical failures caused by contact of the light guide plate and the LEDs. In addition, since the expansion of the light guide plate is limited, the abnormal light emission phenomenon and the hot spot phenomenon are reduced, and thus optical defects can be reduced.

As a result, by using the buffer member, it is possible to reduce the mechanical and optical defects caused by the light guide plate expansion, it is possible to improve the reliability of the LED backlight.

Furthermore, an optical assisting mechanism can be used, in which case light incidence efficiency or color reproduction can be improved.

Embodiment of the present invention described above is an example of the present invention, it is possible to change freely within the scope included in the spirit of the present invention. Accordingly, the invention includes modifications of the invention within the scope of the appended claims and their equivalents.

210: LED 220: buffer member
221: base member 222: support member
PCB: printed circuit board d1 to d4: first to fourth thickness

Claims (11)

A light guide plate;
An LED having a first thickness and mounted on one surface of the printed circuit board facing the light guide plate;
A buffer member mounted on one surface of the printed circuit board and having a second thickness greater than the first thickness
Including,
The buffer member,
A base member made of a metallic material and directly attached to the printed circuit board through a surface mounting technique and having a third thickness;
Located on the base member, comprising a support member made of a transparent material and having a fourth thickness greater than the third thickness,
And the first thickness of the LED is greater than the third thickness of the base member and less than the fourth thickness of the support member.
delete The method of claim 1,
The base member and the support member are coupled through an adhesive
Backlight unit.
The method of claim 1,
An optical auxiliary mechanism positioned between the buffer member and the light guide plate and having a concave lens-shaped recessed portion corresponding to the LED;
Backlight unit.
The method of claim 4, wherein
The optical aid is made of a transparent material, or a fluorescent material is added
Backlight unit.
A liquid crystal panel;
A light guide plate positioned under the liquid crystal panel;
An LED having a first thickness and mounted on one surface of the printed circuit board facing the light guide plate;
A buffer member mounted on one surface of the printed circuit board and having a second thickness greater than the first thickness
Including,
The buffer member,
A base member made of a metallic material and directly attached to the printed circuit board through a surface mounting technique and having a third thickness;
Located on the base member, comprising a support member made of a transparent material and having a fourth thickness greater than the third thickness,
And the first thickness of the LED is greater than the third thickness of the base member and smaller than the fourth thickness of the support member.
delete The method of claim 6,
The base member and the support member are coupled through an adhesive
LCD display device.
The method of claim 6,
An optical auxiliary mechanism positioned between the buffer member and the light guide plate and having a concave lens-shaped recessed portion corresponding to the LED;
LCD display device.
The method of claim 9,
The optical aid is made of a transparent material, or a fluorescent material is added
LCD display device. delete
KR1020120103514A 2012-09-18 2012-09-18 Backlight unit using LED and liquid crystal display device including the same KR102047223B1 (en)

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Application Number Priority Date Filing Date Title
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KR102047223B1 true KR102047223B1 (en) 2019-11-21

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KR102135738B1 (en) * 2014-04-02 2020-07-20 엘지디스플레이 주식회사 Liquid crystal display device module and method for fabricating the same
CN106555949B (en) * 2015-09-23 2019-09-10 元太科技工业股份有限公司 Front optical module and display module
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