KR102041929B1 - Photosensitive resin comopsition and cured pattern formed from the same - Google Patents

Abstract

The present invention relates to a photosensitive resin composition, more specifically, a first alkali-soluble resin (A) comprising a repeating unit of a specific structure; Second alkali-soluble resin (B); Monofunctional polymerizable compound (C) having a specific structure; Polyfunctional polymerizable compound (D); Photopolymerization initiator (E); And it is related with the photosensitive resin composition which can form the pattern which is excellent in low-temperature hardening reactivity, and excellent in adhesive force with a lower base material, and chemical resistance by including a solvent (F).

Description

Photosensitive resin composition and the photocuring pattern formed therefrom {PHOTOSENSITIVE RESIN COMOPSITION AND CURED PATTERN FORMED FROM THE SAME}

The present invention relates to a photosensitive resin composition and a photocuring pattern formed therefrom, and more particularly, to a photosensitive resin composition having excellent reactivity even under low temperature curing conditions and excellent adhesion of a pattern to a lower substrate in a developing step.

In the field of display, the photosensitive resin composition is used to form various photocuring patterns such as photoresist, insulating film, protective film, black matrix, column spacer and the like. Specifically, the photosensitive resin composition is selectively exposed and developed by a photolithography process to form a desired photocuring pattern. In this process, the photosensitive resin having high sensitivity is used to improve the yield of the process and to improve the physical properties of the application target. A composition is required.

The pattern formation of the photosensitive resin composition is based on photolithography, that is, the polarity change and crosslinking reaction of the polymer caused by the photoreaction. In particular, the change characteristic of solubility with respect to solvents, such as aqueous alkali solution after exposure, is used.

Pattern formation by the photosensitive resin composition is classified into a positive type and a negative type according to the solubility to the development of the photosensitive part. The positive type photoresist is a method in which the exposed part is dissolved by the developer, and the negative type photoresist is a method in which the exposed part is not dissolved in the developer and the unexposed part is dissolved to form a pattern, and the positive type and the negative type are used. Binder resins, crosslinking agents, etc. are mutually different.

Recently, the use of a touch screen with a touch panel has exploded, and recently, a flexible touch screen has attracted much attention. Accordingly, the flexible characteristics of materials such as various substrates used in the touch screen should be provided. Accordingly, the materials that can be used are also limited to the flexible polymer materials, and the manufacturing process is also required to be performed under milder conditions. have.

Accordingly, the curing conditions of the photosensitive resin composition also require the need for low temperature curing in conventional high temperature curing, but low temperature curing has a problem of lowering reactivity and lowering durability of the formed pattern.

Korean Patent No. 10-1302508 discloses a negative photosensitive resin composition which is excellent in heat resistance and light resistance and can improve sensitivity by including a copolymer polymerized using a cyclohexenyl acrylate monomer. The conditions do not exhibit the required durability.

Korean Patent Registration No. 10-1302508

An object of the present invention is to provide a photosensitive resin composition which can be cured at a low temperature and is excellent in reactivity and can form a pattern excellent in adhesion and chemical resistance with a lower base material.

Moreover, an object of this invention is to provide the photocuring pattern formed from the said photosensitive resin composition.

1. First alkali-soluble resin (A) comprising a repeating unit represented by the following formula (1), a repeating unit represented by the following formula (2) and a carboxylic acid group;

A second alkali-soluble resin (B) comprising a repeating unit comprising a repeating unit represented by the following formula (3) and a carboxylic acid group;

Monofunctional polymerizable compound (C) represented by the following general formula (4);

Polyfunctional polymerizable compound (D);

Photopolymerization initiator (E); And

The photosensitive resin composition containing the solvent (F):

[Formula 1]

[Formula 2]

[Formula 3]

[Formula 4]

(Wherein R ₁ , R ₂ , R ₄ , R ₅ , R ₆ and R ₇ are each independently hydrogen or a methyl group,

R ₃ is a linear or branched alkyl or alkenyl group having 1 to 4 carbon atoms,

X is alkanediyl having 1 to 5 carbon atoms, aryldiyl having 6 to 10 carbon atoms, cycloalkanediyl having 6 to 10 carbon atoms, cycloalkenediyl having 6 to 10 carbon atoms,

n is an integer from 1 to 8).

2. The above 1, wherein the weight average molecular weight of the first alkali-soluble resin (A) is 6,000 to 20,000, photosensitive resin composition.

3. In the above 1, the weight average molecular weight of the second alkali-soluble resin (B) is 10,000 to 30,000, photosensitive resin composition.

4. In the above 1, the mixing weight ratio of the first alkali-soluble resin (A) and the second alkali-soluble resin (B) is 50:50 to 90:10, the photosensitive resin composition.

5. according to the above 1, wherein the monofunctional polymerizable compound (C) is contained in 0.1 to 20 parts by weight based on 100 parts by weight of the total photosensitive resin composition, based on solids, photosensitive resin composition.

6. In the above 1, wherein the polyfunctional polymerizable compound (D) is trimethylol propane tri (meth) acrylate, ethoxylated trimethylol propane tri (meth) acrylate, propoxylated trimethylol propane tree ( Meta) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate,

Ethoxylated dipentaerythritol hexa (meth) acrylate, propoxylated dipentaerythritol hexa (meth) acrylate dipentaerythritol hexa (meth) acrylate, tripentaerythritol hepta (meth) acrylate

 And at least one selected from the group consisting of tripentaerythritol octa (meth) acrylate.

7. according to the above 1, the photosensitive resin composition capable of curing at a low temperature of 70 to 150 ℃.

8. The photocurable pattern formed of the photosensitive resin composition of any one of the above 1 to 7.

9. The photocuring pattern of claim 8, wherein the photocuring pattern is selected from the group consisting of an array planarization film pattern, a protection film pattern, an insulation film pattern, a photoresist pattern, a black matrix pattern, and a column spacer pattern.

10. The image display device including the photocuring pattern of the above 8.

The photosensitive resin composition of the present invention may exhibit excellent reactivity even under low temperature curing conditions by using an alkali-soluble resin having a specific structure, thereby realizing a pattern having excellent resolution.

Moreover, the photosensitive resin composition of this invention is excellent in adhesiveness with a lower base material, and can form the pattern which has the outstanding chemical resistance by using combining the said alkali-soluble resin and the monofunctional polymeric compound of a specific structure.

Figure 1 schematically shows the definition of the Bottom CD size of the pattern according to an embodiment of the present invention.

The present invention relates to a photosensitive resin composition, more specifically, a first alkali-soluble resin (A) containing a repeating unit of a specific structure; Second alkali-soluble resin (B); Monofunctional polymerizable compound (C) having a specific structure; Polyfunctional polymerizable compound (D); Photopolymerization initiator (E); And it is related with the photosensitive resin composition which can form the pattern which is excellent in low-temperature hardening reactivity, and excellent in adhesive force with a lower base material, and chemical resistance by including a solvent (F).

Hereinafter, the present invention will be described in detail.

<Photosensitive resin composition>

The photosensitive resin composition of this invention is a 1st alkali-soluble resin (A), 2nd alkali-soluble resin (B), the monofunctional polymeric compound (C) of a specific structure, a polyfunctional polymeric compound (D), and a photoinitiator (E). ) And solvent (F).

In the present invention, each repeating unit represented by the formula includes the isomers of the repeating unit. When the repeating unit represented by each formula has an isomer, the repeating unit represented by the formula is representative including the isomer. Means the chemical formula.

In the present invention, each repeating unit may be freely positioned at any position of the chain within a predetermined mol% range. That is, each parenthesis in the chemical formula representing the polymer or resin is represented by one block in order to express mol%, but each repeating unit may be positioned in blocks or separately, without limitation, in the resin.

1st alkali-soluble resin (A)

Alkali-soluble resin is a component which gives solubility to the alkaline developing solution used at the development process at the time of forming a pattern, and this invention uses a combination of alkali-soluble resin which has a repeating unit of a specific structure, For example, it is possible to form an excellent pattern with excellent reactivity even at 70 to 150 ℃).

The photosensitive resin composition which concerns on this invention contains the 1st alkali-soluble resin (A) and 2nd alkali-soluble resin (B) from which a repeating unit differs from each other.

The first alkali-soluble resin (A) according to the present invention includes a repeating unit represented by the following formula (1), a repeating unit represented by the following formula (2) and a carboxyl group, and a reactivity at low temperature of the photosensitive resin composition and Function to improve chemical resistance.

[Formula 1]

[Formula 2]

In formula, R <_1> and R <_2> is hydrogen or a methyl group independently of each other, R <_3> is a linear or branched alkyl group or alkenyl group of 1-4 carbon atoms.

The repeating unit containing the carboxyl group in the first alkali-soluble resin (A) functions to impart solubility to the alkaline developer, and may be derived from methacrylic acid, 2-vinylacetic acid, or the like.

An example of the first alkali-soluble resin (A) according to the present invention may be a structure represented by the following formula (A).

[Formula A]

Wherein R ₁ , R ₂ and R ₃ are the same substituents as described above, R ₇ is hydrogen or a methyl group, a = 20 to 70 mol%, b = 20 to 60 mol%, c = 5 to 30 mol% .

The weight average molecular weight of the first alkali-soluble resin (A) according to the present invention is not particularly limited, but may be 6,000 to 20,000 in terms of improving the reactivity and chemical resistance of low-temperature conditions of the photosensitive resin composition, preferably 7,500 to 18,000, more preferably 13,000 to 17,000. When the above range is satisfied, the CD-Bias of the pattern may be implemented in an appropriate range to form a pattern having excellent resolution, and chemical resistance and pencil hardness may also be improved. On the other hand, when the weight average molecular weight of the first alkali-soluble resin (A) exceeds 20,000, the molecular weight becomes excessively large, the compatibility with other components of the photosensitive resin composition may be lowered and whitening of the coating film may occur in the developing step, The line width of the pattern also increases, which may degrade the CD-bias characteristics.

2nd alkali-soluble resin (B)

The second alkali-soluble resin (B) according to the present invention includes a repeating unit including a repeating unit represented by the following formula (3) and a carboxyl group, and functions to improve pattern formability of the photosensitive resin composition.

[Formula 3]

In the formula, R ₄ and R ₅ are each independently hydrogen or a methyl group.

In the present invention, the repeating unit represented by the general formula (3) of the second alkali-soluble resin (B) includes acryloyloxy 2-hydroxypropyl group, thereby reacting with the polymerizable compound and the polymerization reaction in the photocuring reaction of the exposure step. Participation to form a curing network, thereby improving the formability of the pattern.

In addition, the repeating unit containing the carboxyl group has a function of imparting solubility to an alkaline developer, and may be derived from (meth) acrylic acid, 2-vinyl acetic acid, or the like.

The second alkali-soluble resin (B) according to the present invention may include only the repeating structure having the formula (3) and the carboxyl group, and may be formed by further including other comonomers copolymerizable as necessary.

Examples of such comonomers include styrene, vinyltoluene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-vinylbenzylmethyl ether, m-vinylbenzylmethyl ether aromatic vinyl compounds such as p-vinyl benzyl methyl ether, o-vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, and p-vinyl benzyl glycidyl ether; N-cyclohexylmaleimide, N-benzylmaleimide, N-phenylmaleimide, No-hydroxyphenylmaleimide, Nm-hydroxyphenylmaleimide, Np-hydroxyphenylmaleimide, No-methylphenylmaleimide, Nm N-substituted maleimide compounds such as -methylphenylmaleimide, Np-methylphenylmaleimide, No-methoxyphenylmaleimide, Nm-methoxyphenylmaleimide, and Np-methoxyphenylmaleimide; Methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, alkyl (meth) acrylates such as sec-butyl (meth) acrylate; Alkoxyalkylene glycols (meth), such as methoxy ethylene glycol (meth) acrylate, methoxy diethylene glycol (meth) acrylate, methoxy triethylene glycol (meth) acrylate, and methoxy tetraethylene glycol (meth) acrylate ) Acrylates; Alicyclic (meth) acrylates, such as cyclopentyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, 2-dicyclopentanyloxyethyl (meth) acrylate, and tricyclodecanyl (meth) acrylate Ryu; Benzyl (meth) acrylate, phenoxyethylene glycol (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, (2-phenyl) phenoxyethoxy (meth) acrylate, 2-hydroxy-3- ( Aryl (meth), such as 2'-phenyl) phenoxy propyl (meth) acrylate, 2-hydroxy-3-phenoxy propyl (meth) acrylate, tetrahydrofuryl (meth) acrylate, and phenyl (meth) acrylate ) Acrylates; Unsaturated oxirane compounds such as methylglycidyl (meth) acrylate; (Meth) acrylate substituted with a cycloalkane or dicycloalkane ring having 4 to 16 carbon atoms; And unsaturated cyclic monomers such as norbornene. These can be used individually or in mixture of 2 or more types.

In the present invention, "(meth) acryl-" refers to "methacryl-", "acryl-" or both.

For example, the second alkali-soluble resin according to the present invention may be polymerized including only the repeating unit represented by Chemical Formula 3, but may include other repeating units, for example, a structure represented by the following Chemical Formula B Can be.

[Formula B]

In the formula, R ₄ and R ₅ are the same substituents as described above, and are a = 30 to 60 mol%, b = 1 to 10 mol%, c = 5 to 35 mol% and d = 10 to 35 mol%.

The weight average molecular weight of the second alkali-soluble resin (B) according to the present invention is not particularly limited, but is preferably 10,000 to 30,000, more preferably 14,000 to 26,000 from the viewpoint of improving the formability of the pattern.

The first alkali-soluble resin (A) and the second alkali-soluble resin (B) according to the present invention may further include a repeating unit formed of other monomers known in the art, in addition to the above-described repeating units independently of each other, It may be formed only of repeating units.

It is preferable that the acid value of 1st alkali-soluble resin (A) and 2nd alkali-soluble resin (B) is a range of 20-200 (KOHmg / g) independently from each other. If the acid value is in the above range, it may have excellent developability and stability over time.

Although the mixing weight ratio of the 1st alkali-soluble resin (A) and the said 2nd alkali-soluble resin (B) which concerns on this invention is not specifically limited, For example, it is 50: 50-90: 10, Preferably it is 70:30. To 85:15. In order to ensure low temperature curing property, the content of the first alkali-soluble resin (A) is preferably higher than that of the second alkali-soluble resin (B), except that the content of the first alkali-soluble resin (A) is the second alkali. When it exceeds 9 times the weight of soluble resin (B), durability, such as chemical resistance, may fall.

In the present invention, the content (A + B) of the alkali-soluble resin obtained by combining the first alkali-soluble resin (A) and the second alkali-soluble resin (B) is not particularly limited. For example, the photosensitive resin is based on a solid content. 10 to 90 parts by weight, preferably 25 to 70 parts by weight, based on 100 parts by weight of the total composition. When included in the above range, the solubility in a developing solution is sufficient, so that the developability is excellent, and the photocuring pattern having excellent mechanical properties can be formed.

Acrylate Monofunctional Polymerizable  Compound (C)

With the development of displays that require flexibility in recent years, a pattern forming process is performed using a plastic having flexibility and excellent flexibility as a lower substrate instead of a glass substrate when forming a pattern. Accordingly, an electrode having high transparency is deposited by depositing ITO on the plastic substrate. Forming. However, the pattern formed on the ITO / polymer deposited film has a problem that the adhesion strength is significantly lower than the pattern formed on the conventional glass substrate.

Accordingly, the photosensitive resin composition according to the present invention may include an acrylate-based monofunctional polymerizable compound (C) having a specific structure, thereby improving adhesion to the lower substrate, thereby forming a pattern having excellent durability. . Moreover, the chemical resistance of the pattern with respect to an acidic aqueous solution can also be improved by including the said compound.

The acrylate monofunctional polymerizable compound (C) according to the present invention is a compound represented by the following formula (4).

[Formula 4]

In formula, R <_1> , R <_2> , R <_4> , R <_5> , R <_6> and R <_7> are hydrogen or a methyl group independently of each other, R <_3> is a C1-C4 linear or branched alkyl group or alkenyl group, and X is Alkanediyl having 1 to 5 carbon atoms, aryldiyl having 6 to 10 carbon atoms, cycloalkanediyl having 6 to 10 carbon atoms, cycloalkenediyl having 6 to 10 carbon atoms, and n is an integer of 1 to 8 to be.

The monofunctional polymerizable compound (C) according to the present invention has a carboxyl group at the terminal, and the carboxyl group performs interaction such as hydrogen bonding with the lower substrate to improve the adhesion of the pattern. The monofunctional polymerizable compound (C) forms a relatively long chain including an oxyethylene repeating structure in a molecule, and thus, even during a curing reaction, the monofunctional polymerizable compound (C) is separated from the main chain of the prepolymer in which the terminal carboxyl group forms a curing network. To effectively interact with At this time, it is thought that the part where the monofunctional polymerizable compound participates in the polymerization reaction due to the steric effect becomes the outer side which is easy to interact with the lower substrate, so that the lower substrate can be effectively interacted with.

On the other hand, when the acrylate-based monofunctional polymerizable compound (C) is included as a monomer for producing an alkali-soluble resin, the acrylate-based monofunctional polymerizable compound (C) is surrounded by a bulky adjacent functional group having a large steric effect and enters the entangled curing network. At this time, since the terminal carboxyl group has a function of imparting solubility to an alkaline developer rather than interaction with a lower substrate, developability may be improved during pattern formation, but the adhesion of the pattern desired in the present invention is improved. The effect of cannot be implemented. That is, the monofunctional polymerizable compound (C) must be included as a separate additive to realize the above-described effect.

The content of the acrylate-based monofunctional polymerizable compound (C) is not particularly limited, for example, 0.1 to 20 parts by weight, preferably 5 to 15, based on 100 parts by weight of the total photosensitive resin composition, based on solid content. Can be used in the range of parts by weight, when the acrylic monofunctional polymerizable compound (C) is included in the above content range, it can effectively interact with the lower substrate to improve the adhesion of the pattern, chemical resistance to acidic aqueous solution, etc. It can also be improved together. However, if it exceeds 20 parts by weight, the hydrophilicity may be excessively increased, rather the adhesion may be lowered, and a relatively short amount of monofunctionality may be included, resulting in a decrease in chemical resistance as the crosslinking density is lowered.

Multifunctional Polymerizable  Compound (D)

The polyfunctional polymerizable compound (D) used in the photosensitive resin composition of the present invention can increase the crosslinking density during the manufacturing process and can enhance the mechanical properties of the photocured pattern.

The polyfunctional polymerizable compound (D) may be used in the art without particular limitation, and in particular, the polyfunctional polymerizable compound (D) may be trimethylolpropane tri (meth) acrylate or ethoxylated trimethyl. All propane tri (meth) acrylate, propoxylated trimethylol propane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth ) Acrylate, ethoxylated dipentaerythritol hexa (meth) acrylate, propoxylated dipentaerythritol hexa (meth) acrylate dipentaerythritol hexa (meth) acrylate, tripentaerythritol hepta ( Meta) acrylate, tripentaerythritol octa (meth) acrylate, and the like.

Although the content of the said polyfunctional polymerizable compound (D) is not specifically limited, For example, 10-90 weight part with respect to 100 weight part of alkali-soluble resin based on solid content in the photosensitive resin composition, Preferably it is 30-80 Used in the range of parts by weight. When the polyfunctional polymerizable compound (D) is included in the above content range, it may have excellent durability, and developability of the composition may be improved.

Photopolymerization Initiator (E)

As long as the photoinitiator (E) which concerns on this invention can superpose | polymerize the said polymeric compound (D), it can use without a restriction | limiting in particular, For example, an acetophenone type compound, a benzophenone type compound, a tria At least one compound selected from the group consisting of a true compound, a biimidazole compound, a thioxanthone compound, and an oxime ester compound can be used, and it is preferable to use an oxime ester compound.

Specific examples of the acetophenone-based compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 2-hydroxy-1- [4- (2 -Hydroxyethoxy) phenyl] -2-methylpropane-1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1- On, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one, 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propane -1-one, 2- (4-methylbenzyl) -2- (dimethylamino) -1- (4-morpholinophenyl) butan-1-one, and the like.

Specific examples of the benzophenone compound include benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 3,3 ', 4,4'-tetra (tert-butylperoxycarbonyl) benzophenone, 2,4, 6-trimethyl benzophenone, etc. are mentioned.

Specific examples of the triazine-based compound include 2,4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine and 2,4-bis (trichloromethyl) -6- (4-methoxynaphthyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-piperonyl-1,3,5-triazine, 2,4 -Bis (trichloromethyl) -6- (4-methoxystyryl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (5-methylfuran- 2-yl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (furan-2-yl) ethenyl] -1,3,5- Triazine, 2,4-bis (trichloromethyl) -6- [2- (4-diethylamino-2-methylphenyl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloro Romethyl) -6- [2- (3,4-dimethoxyphenyl) ethenyl] -1,3,5-triazine and the like.

Specific examples of the biimidazole compound include 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (2, 3-dichlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetra (alkoxyphenyl) Biimidazole, 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetra (trialkoxyphenyl) biimidazole, 2,2-bis (2,6-dichlorophenyl) And imidazole compounds in which the phenyl group at the -4,4'5,5'-tetraphenyl-1,2'-biimidazole or 4,4 ', 5,5' position is substituted with a carboalkoxy group. And preferably 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (2,3-dichlorophenyl) -4 , 4 ', 5,5'-tetraphenylbiimidazole, 2,2-bis (2,6-dichlorophenyl) -4,4'5,5'-tetraphenyl-1,2'-biimidazole, etc. Can be mentioned.

Specific examples of the thioxanthone compound include 2-isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-dichloro thioxanthone, and 1-chloro-4-propoxy thioxanthone. Etc. can be mentioned.

Specific examples of the oxime ester compound include o-ethoxycarbonyl-α-oxyimino-1-phenylpropan-1-one, 1,2-octanedione, -1- (4-phenylthio) phenyl, -2- (o-benzoyloxime), ethanone, -1- (9-ethyl) -6- (2-methylbenzoyl-3-yl)-, 1- (o-acetyloxime), and the like. As a commercial item, CGI-124 (Shiba-gai company), CGI-224 (Shiba-gai company), Irgacure OXE-01 (BASF company), Irgacure OXE-02 (BASF company), N-1919 (Adeca company), NCI-831 ( Adeca).

In addition, the photopolymerization initiator (E) may further include a photopolymerization initiation aid in order to improve the sensitivity of the photosensitive resin composition of the present invention. Since the photosensitive resin composition which concerns on this invention contains a photoinitiation start adjuvant, a sensitivity can become high and productivity can be improved.

Examples of the photopolymerization initiation aid include at least one compound selected from the group consisting of an amine compound, a carboxylic acid compound and an organic sulfur compound having a thiol group.

Specific examples of the amine compound include aliphatic amine compounds such as triethanolamine, methyldiethanolamine, and triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, and isoamyl 4-dimethylaminobenzoate. 2-dimethylaminobenzoic acid 2-ethylhexyl, benzoic acid 2-dimethylaminoethyl, N, N-dimethylparatoluidine, 4,4'-bis (dimethylamino) benzophenone (commonly known as Michler's ketone), 4,4'-bis (Diethylamino) benzophenone etc. are mentioned, It is preferable to use an aromatic amine compound.

Specific examples of the carboxylic acid compound are preferably aromatic heteroacetic acids, for example. Phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylthioacetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, N-phenylglycine , Phenoxy acetic acid, naphthylthioacetic acid, N-naphthylglycine, naphthoxy acetic acid, etc. are mentioned.

Specific examples of the organic sulfur compound having the thiol group include 2-mercaptobenzothiazole, 1,4-bis (3-mercaptobutyryloxy) butane, 1,3,5-tris (3-mercaptobutyloxy Ethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mer Captobutylate), pentaerythritol tetrakis (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate) and the like Can be.

The content of the photopolymerization initiator (E) is not particularly limited, but may be included, for example, in an amount of 0.1 to 10 parts by weight, and preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the total photosensitive resin composition. Can be. When the above range is satisfied, the photosensitive resin composition may be highly sensitive to shorten the exposure time, thereby improving productivity and maintaining high resolution, and the strength of the formed pixel portion and smoothness on the surface of the pixel portion may be improved. good.

Solvent (F)

The solvent (F) can be used without limitation as long as it is conventionally used in the art.

Specific examples of the solvent (F) include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether and ethylene glycol monobutyl ether; Diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol dipropyl ether and diethylene glycol dibutyl ether; Ethylene glycol alkyl ether acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate, and ethylene glycol monoethyl ether acetate; Alkylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxy butyl acetate, and methoxy pentyl acetate; Propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; Propylene glycol dialkyl ethers such as propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol ethyl methyl ether, propylene glycol dipropyl ether propylene glycol propyl methyl ether and propylene glycol ethyl propyl ether; Propylene glycol alkyl ether propionates such as propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate and propylene glycol butyl ether propionate; Butyl diol monoalkyl ethers such as methoxy butyl alcohol, ethoxy butyl alcohol, propoxy butyl alcohol and butoxy butyl alcohol; Butanediol monoalkyl ether acetates, such as a methoxy butyl acetate, an ethoxy butyl acetate, a propoxy butyl acetate, butoxy butyl acetate; Butanediol monoalkyl ether propionates such as methoxybutyl propionate, ethoxybutyl propionate, propoxybutyl propionate and butoxybutyl propionate; Dipropylene glycol dialkyl ethers such as dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, and dipropylene glycol methyl ethyl ether; Aromatic hydrocarbons such as benzene, toluene, xylene and mesitylene; Ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone and cyclohexanone; Alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, glycerin; Methyl acetate, ethyl acetate, propyl acetate, butyl acetate, 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, 2-hydroxy-2-methylpropionate, methyl hydroxyacetate, ethyl hydroxyacetate , Butyl hydroxy acetate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, 3-hydroxypropionate methyl, 3-hydroxypropionate ethyl, 3-hydroxypropionate propyl, 3-hydroxypropionate butyl, 2-hydroxy 3-Methyl methyl butyrate, methyl methoxy acetate, ethyl methoxy acetate, methoxy acetate propyl, butyl acetate, ethoxy acetate methyl, ethoxy acetate, ethoxy acetate propyl, butyl ethoxy acetate, propoxy Methyl acetate, ethyl propoxy acetate, propyl propoxy acetate, butyl propoxy acetate, methyl butoxy acetate, ethyl butoxy acetate, Propyl acetic acid, butyl butoxy acetate, methyl 2-methoxy propionate, ethyl 2-methoxy propionate, propyl 2-methoxy propionate, butyl 2-methoxy propionate, methyl 2-ethoxy propionate, ethyl 2-ethoxy propionate Propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, methyl 2-butoxypropionate, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate, methyl 3-methoxypropionate 3-methoxy ethylpropionate, 3-methoxy propylpropionate, 3-methoxy propylpropionate, 3-ethoxy propylpropionate, 3-ethoxy propylpropionate, 3-ethoxy propylpropionate, 3-ethoxy propionate Methyl propoxypropionate, 3-propoxy propionate, 3-propoxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, 3-butoxypropionic acid Esters such as ropil, 3-butoxy-propionic acid butyl; Cyclic ethers such as tetrahydrofuran and pyran; Cyclic ester, such as (gamma) -butyrolactone, etc. are mentioned. The solvent illustrated here can be used individually or in mixture of 2 or more types, respectively.

The solvents include esters such as alkylene glycol alkyl ether acetates, ketones, butanediol alkyl ether acetates, butanediol monoalkyl ethers, ethyl 3-ethoxypropionate and methyl 3-methoxypropionate in consideration of coating properties and drying properties. May be preferably used, more preferably propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, methoxybutyl acetate, methoxybutanol, ethyl 3-ethoxypropionate, 3-methoxypropionic acid Methyl and the like can be used.

The solvent (F) content may be included in the photosensitive resin composition in an amount of 40 to 95 parts by weight, preferably 45 to 85 parts by weight, based on 100 parts by weight of the total. When the said range is satisfied, since applicability | paintability becomes favorable when apply | coating with coating apparatuses, such as a spin coater, a slit & spin coater, a slit coater (it may also be called a die coater, a curtain flow coater), and inkjet, it is preferable.

Additive (G)

The photosensitive resin composition according to the present invention may further include additives known in the art as needed. Examples of such additives include fillers, other polymer compounds, curing agents, leveling agents, adhesion promoters, antioxidants, ultraviolet absorbers, anti-aggregation agents, chain transfer agents, and the like, which may be used alone or in combination of two or more.

< Photocuring  Pattern and Image Display Device>

An object of the present invention is to provide a photocuring pattern made of the photosensitive resin composition and an image display device including the photocuring pattern.

The photocuring pattern made of the photosensitive resin composition is excellent in low temperature curability and excellent in chemical resistance, pencil hardness, and the like. Accordingly, the image display device may be used in various patterns, for example, an adhesive layer, an array planarization film, a protective film, an insulating film pattern, or the like, or may be used as a photoresist, a black matrix, a column spacer pattern, a black column spacer pattern, or the like. However, the present invention is not limited thereto, and is particularly suitable for an insulating film pattern.

An image display device having such a photocuring pattern or using the pattern during a manufacturing process may include a liquid crystal display device, an OLED, a flexible display, and the like, but is not limited thereto. All image display devices known in the art may be applied. Can be illustrated.

A photocuring pattern can be manufactured by apply | coating the photosensitive resin composition of this invention mentioned above on a base material, and forming a photocuring pattern (after roughening a development process as needed).

Hereinafter, preferred examples are provided to aid the understanding of the present invention, but these examples are merely illustrative of the present invention and are not intended to limit the scope of the appended claims, which are within the scope and spirit of the present invention. It is apparent to those skilled in the art that various changes and modifications can be made to the present invention, and such modifications and changes belong to the appended claims.

Production Example  1. Synthesis of First Alkali Soluble Resin (A)

(One) Production Example  A-1

In a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer, nitrogen was flowed at 0.02 L / min to make a nitrogen atmosphere, and 150 g of diethylene glycol methylethyl ether was added and heated to 70 ° C while stirring. Then, 132.2 g (0.60 mol) of a mixture of the following Chemical Formulas 5 and 6 (molar ratio is 50:50), 55.3 g (0.30 mol) of 3-ethyl-3-oxetanyl methacrylate and 8.6 g (0.10) of methacrylic acid mol) was dissolved in 150 g of diethylene glycol methylethyl ether to prepare a solution.

[Formula 5]

[Formula 6]

The prepared solution was added dropwise to the flask using a dropping funnel, and then 27.9 g (0.11 mol) of polymerization initiator 2,2'-azobis (2,4-dimethylvaleronitrile) was added to 200 g of diethylene glycol methylethyl ether. The solution dissolved in was dropped into the flask over 4 hours using a separate dropping funnel. After the dropwise addition of the solution of the polymerization initiator was completed, the mixture was kept at 70 ° C. for 4 hours, and then cooled to room temperature, followed by a copolymer of a solid content of 35.9 mass% and an acid value of 62 mg-KOH / g (solid content equivalent) (resin A- The solution of 1) was obtained. The weight average molecular weight Mw of obtained resin A-1 was 7,900, and molecular weight distribution was 1.8.

In this case, the weight average molecular weight (Mw) and the number average molecular weight (Mn) of the dispersion resin were measured using an HLC-8120GPC (manufactured by Tosoh Corporation) apparatus, and the column was used by serially connecting TSK-GELG4000HXL and TSK-GELG2000HXL. The column temperature was 40 ° C, the mobile phase solvent was tetrahydrofuran, the flow rate was 1.0 ml / min, the injection amount was 50 µl, and the detector RI was used. The measurement sample concentration was 0.6 mass% (solvent = tetrahydrofuran), a calibration standard. The material used was TSK STANDARD POLYSTYRENE F-40, F-4, F-1, A-2500, A-500 (manufactured by Tosoh Corporation).

The ratio of the weight average molecular weight and number average molecular weight obtained above was made into molecular weight distribution (Mw / Mn).

(A-1)

(2) Production Example  A-2

By applying the same conditions as in Synthesis Example (A-1), 198.2 g (0.90 mol) of a mixture of Formulas 5 and 6 (molar ratio is 50:50) and 8.6 g (0.10 mol) of methacrylic acid were added to synthesize the It progressed and obtained the solution of the copolymer (resin A-2) of 41.6 mass% of solid content, and acid value 59 mg-KOH / g (solid content conversion).

The weight average molecular weight Mw of obtained resin A-2 was 7,790, and molecular weight distribution was 1.9.

(A-2)

Production Example  2. Synthesis of Second Alkali-Soluble Resin (B-1)

(One) Production Example  B-1

Into a 1 L flask equipped with a reflux cooler, a dropping funnel and a stirrer, nitrogen was flowed at 0.02 L / min to a nitrogen atmosphere, 200 g of propylene glycol monomethyl ether acetate was introduced, and the temperature was raised to 100 ° C., followed by 24.5 g of acrylic acid (0.34 mol). ), 2,2'-azobis (2,4-dimethylvaleronitrile) 3.0 in a mixture comprising norbornene 4.7 g (0.05 mol), vinyltoluene 72.1 g (0.61 mol) and 150 g propylene glycol monomethylether acetate The solution to which g was added was dripped at the flask over 6 hours from the dropping lot, and stirring was continued at 100 degreeC for 12 hours.

Subsequently, the atmosphere in the flask was changed from nitrogen to air, 28.4 g of glycidyl methacrylate [0.20 mol (59 mol% based on acrylic acid used in this reaction)] was added to the flask, and the reaction was continued at 110 ° C. for 6 hours. And unsaturated group containing resin (B-1) whose solid content acid value is 71 mgKOH / g was obtained. The weight average molecular weight of polystyrene conversion measured by GPC was 25,600, and molecular weight distribution (Mw / Mn) was 2.2.

(B-1)

Example  And Comparative example

The photosensitive resin composition which has the composition and content (weight part) of following Table 1 and Table 2 was prepared.

division
(Parts by weight) Example One 2 3 4 5 6 7 8 9 10 11 A A-1 10.62 10.17 9.38 10.17 10.17 10.17 10.17 10.17 10.17 10.17 8.70 A-2 - - - - - - - - - - - B B-1 5.31 5.08 4.69 5.08 5.08 5.08 5.08 5.08 5.08 5.08 4.35 C C-1 1.33 2.54 4.69 - - - - - - - 6.52 C-2 - - - 2.54 - - - - - - - C-3 - - - - 2.54 - - - - - - C-4 - - - - - 2.54 - - - - - C-5 - - - - - - 2.54 - - - - C-6 - - - - - - - 2.54 - - - C-7 - - - - - - - - 2.54 - - C-8 - - - - - - - - - 2.54 - C-9 - - - - - - - - - - - C-10 - - - - - - - - - - - D B-1 10.62 10.17 9.38 10.17 10.17 10.17 10.17 10.17 10.17 10.17 8.70 E E-1 0.80 0.76 0.70 0.76 0.76 0.76 0.76 0.76 0.76 0.76 0.65 E-2 0.27 0.25 0.23 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.22 E-3 0.80 0.76 0.70 0.76 0.76 0.76 0.76 0.76 0.76 0.76 0.65 G G-1 0.27 0.25 0.23 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.22 F F-1 28.0 28.0 28.0 28.0 28.0 28.0 28.0 28.0 28.0 28.0 28.0 F-2 42.0 42.0 42.0 42.0 42.0 42.0 42.0 42.0 42.0 42.0 42.0

division
(Parts by weight) Comparative example One 2 3 4 5 6 7 A A-1 - - 11.11 11.11 10.17 10.17 15.25 A-2 - 10.17 - - - - - B B-1 15.25 5.08 5.56 5.56 5.08 5.08 - C C-1 2.54 2.54 - 11.11 - - 2.54 C-2 - - - - - - - C-3 - - - - - - - C-4 - - - - - - - C-5 - - - - - - - C-6 - - - - - - - C-7 - - - - - - - C-8 - - - - - - - C-9 - - - - 2.54 - - C-10 - - - - - 2.54 - D B-1 10.17 10.17 11.11 - 10.17 10.17 10.17 E E-1 0.76 0.76 0.83 0.83 0.76 0.76 0.76 E-2 0.25 0.25 0.28 0.28 0.25 0.25 0.25 E-3 0.76 0.76 0.83 0.83 0.76 0.76 0.76 G G-1 0.25 0.25 0.28 0.28 0.25 0.25 0.25 F F-1 28.0 28.0 28.0 28.0 28.0 28.0 28.0 F-2 42.0 42.0 42.0 42.0 42.0 42.0 42.0

1st alkali-soluble resin (A)

A-1 and A-2: Alkali-soluble resin prepared according to Preparation Example 1

2nd alkali-soluble resin (B)

B-1: Alkali-soluble resin prepared according to Preparation Example 2

Acrylate Monofunctional Polymerizable  Compound (C)

C-1:

C-2:

C-3:

C-4:

C-5:

C-6:

C-7:

C-8:

C-9:

C-10:

Multifunctional Polymerizable  Compound (D)

D-1: dipentaerythritol hexaacrylate (KAYARAD DPHA: manufactured by Nippon Kayaku Co., Ltd.)

Photopolymerization Initiator (E)

E-1: 2,2'-bis (o-chlorophenyl) -4,5,4 ', 5'-tetraphenyl-1,2'-biimidazole (B-CIM: manufactured by Hodogaya Chemical Co., Ltd.)

E-2: thioxanthone type compound

E-3: Multifunctional Thiol Compound

Additive (G)

G-1: 4,4'-butylidene bis [6-tert-butyl-3-methylphenol] (BBM-S: Sumitomo Fine Chemical Co., Ltd.)

Solvent (F)

F-1: diethylene glycol methylethyl ether

F-2: Propylene Glycol Monomethyl Ether Acetate

Test Methods

A glass substrate (Eagle 2000; manufactured by Corning Corporation) having a length and width of 2 inches was washed sequentially with a neutral detergent, water, and alcohol, and then dried. The photosensitive resin compositions prepared in Examples and Comparative Examples were spin coated on the glass substrate, and then prebaked at 80 ° C. for 120 seconds using a hot plate. After cooling the prebaked substrate to room temperature, the distance from the quartz glass photomask was 150 μm, and light was emitted at an exposure amount (365 nm standard) of 40 mJ / cm 2 using an exposure machine (UX-1100SM; manufactured by Ushio Corporation). Investigate. In this case, a photomask in which the next pattern was formed on the same plane was used.

It has a square opening having a diameter of 30 μm, the mutual interval is 100 μm, and after light irradiation, the coating film is immersed in a 2.38% tetraammonium hydroxide aqueous solution at 25 ° C. for 60 seconds to develop, washed with water and dried, and then cleaned. Post-baking was carried out for 60 minutes at 130 ℃ using. The obtained pattern height was 1.5 micrometers. The physical properties were evaluated for the pattern thus obtained as follows, and the results are shown in Table 3 below.

(1) Bottom CD size measurement of pattern

Observation of the obtained rectangular dot pattern with a three-dimensional shape measuring device (SIS-2000 system; manufactured by SNU Precision) defines a point where 5% of the total height from the bottom surface of the rectangular pattern is defined as Bottom CD, The average value of the measured values was defined as the CD line width of the pattern. The results are shown in Tables 3 and 4 below.

(2) CD-Bias of the pattern

The pattern size at the film thickness of 3.0 mu m obtained above was measured using a three-dimensional shape measuring apparatus (SIS-2000 system; manufactured by SNU Precision), and the difference from the mask size was calculated by CD-bias as follows. The results are shown in Tables 3 and 4 below.

The closer CD-bias is to 0, the better. (+) Means that the pattern is larger than the mask and (-) is smaller than the mask.

(3) Development adhesiveness evaluation

Development Adhesion is a pattern in which a pattern formed on an ITO / PET film (ELECRYSTA) manufactured on a glass substrate is adhered to the substrate using a mask using a half-tone mask having a 25% transmittance. By grasping the degree, a pattern formed with a film thickness of 1.5 μm by a photomask having 1000 dot patterns each having a length of 1 μm from 5 μm to 20 μm in a square opening is 100 without missing. The actual size of the pattern in the case of% remaining was measured by using a three-dimensional shape measuring instrument SIS-2000 of SNU Precision, and the results are shown in Tables 3 and 4 below.

The value of the pattern line width was defined as the value of Bottom CD at the point of 5% of the total height from the bottom surface of the pattern. The smaller the minimum pattern size remaining without missing, the better the development adhesion.

(4) Evaluation of chemical resistance adhesion

Immerse the coating film on ITO / PET film (ELECRYSTA) attached to the glass substrate in HNO ₃ and HCl aqueous solution (70% nitric acid (80%) + concentrated hydrochloric acid (20%)) for 45 minutes / 2 minutes. After the treatment, the coating film was cut with a cutter according to ASTM D-3359-08 standard test conditions, and the adhesiveness was evaluated by attaching and detaching a tape on the surface, and the results are shown in Tables 3 and 4 below.

In the Cutting / Tape test after chemical treatment, the degree of peeling of the coating film was defined as 0B to 5B based on the standard test method, and 5B was determined to have the best performance.

<Chemical Resistance Evaluation Criteria>

5B peeling 0%> 4B peeling less than 5%> 3B peeling 5-15%> 2B peeling 15-35%> 1B peeling 35-65%> 0B 65% or more

division Example One 2 3 4 5 6 7 8 9 10 11 Bottom size (㎛) 25.3 28.1 30.7 29.2 30.6 25.2 26.6 27.7 27.4 26.0 28.5 CD-Bias (μm) -4.7 -1.9 0.7 -0.8 0.6 -4.8 -3.4 -2.3 -2.6 -4.0 -1.5 Phenomenon
(ITO / PET Film) (㎛) 10 11 14 13 15 11 13 15 12 10 13 Chemical adhesion
(ITO / PET Film) 4B 5B 5B 5B 4B 5B 5B 5B 5B 5B 5B

division Comparative example One 2 3 4 5 6 7 Bottom size (㎛) 34.2 22.1 23.4 Pattern not formed
(Exfoliation) 21.2 23.9 26.5 CD-Bias (μm) 4.2 -7.9 -6.6 -8.8 -6.1 -3.5 Phenomenon
(ITO / PET Film) 18 16 14 16 19 17 Chemical adhesion
(ITO / PET Film) 0B 0B 0B 0B 0B 0B 0B

Referring to Tables 3 and 4, the CD-bias value of the pattern prepared using the example of the photosensitive resin composition of the present invention is close to 0, and the residual film does not occur after development, so the reactivity is excellent even at low temperature curing conditions. It was confirmed that the pattern formation was excellent. In addition, it was confirmed that the pattern produced using the photosensitive resin composition according to the present invention has excellent adhesion and chemical resistance.

However, in the case of a pattern manufactured using a comparative example other than the photosensitive resin composition of the present invention, the CD-bias value is greatly deviated from 0 or a residual film occurs after development, and thus it is confirmed that the pattern formation is not excellent. It was confirmed that the chemical properties were reduced compared to the examples.

Claims (10)

A first alkali-soluble resin (A) comprising a repeating unit represented by the following formula (1), a repeating unit represented by the following formula (2) and a carboxylic acid group;
A second alkali-soluble resin (B) comprising a repeating unit including a repeating unit represented by the following Formula 3 and a carboxylic acid group;
Monofunctional polymerizable compound (C) represented by the following general formula (4);
Polyfunctional polymerizable compound (D);
Photopolymerization initiator (E); And
The photosensitive resin composition containing the solvent (F):
[Formula 1]

[Formula 2]

[Formula 3]

[Formula 4]

(Wherein R ₁ , R ₂ , R ₄ , R ₅ , R ₆ and R ₇ are each independently hydrogen or a methyl group,
R ₃ is a methyl group or a straight or branched chain alkyl or alkenyl group having 2 to 4 carbon atoms,
X is alkanediyl having 1 to 5 carbon atoms, aryldiyl having 6 to 10 carbon atoms, cycloalkanediyl having 6 to 10 carbon atoms, cycloalkenediyl having 6 to 10 carbon atoms,
n is an integer from 1 to 8).
The photosensitive resin composition of Claim 1 whose weight average molecular weights of the said 1st alkali-soluble resin (A) are 6,000-20,000.
The photosensitive resin composition of Claim 1 whose weight average molecular weights of a said 2nd alkali-soluble resin (B) are 10,000-30,000.
The photosensitive resin composition of Claim 1 whose mixing weight ratio of said 1st alkali-soluble resin (A) and said 2nd alkali-soluble resin (B) is 50:50-90:10.
The photosensitive resin composition according to claim 1, wherein the monofunctional polymerizable compound (C) is included at 0.1 to 20 parts by weight based on 100 parts by weight of the total photosensitive resin composition based on solid content.
The said polyfunctional polymerizable compound (D) is a trimethylol propane tri (meth) acrylate, an ethoxylated trimethylol propane tri (meth) acrylate, and propoxylated trimethylol propane tree (meth) of Claim 1 Acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate,
Ethoxylated dipentaerythritol hexa (meth) acrylate, propoxylated dipentaerythritol hexa (meth) acrylate dipentaerythritol hexa (meth) acrylate, tripentaerythritol hepta (meth) acrylate
And at least one selected from the group consisting of tripentaerythritol octa (meth) acrylate.
The photosensitive resin composition of Claim 1 which can be hardened at 70-150 degreeC low temperature.
The photocuring pattern formed from the photosensitive resin composition of any one of Claims 1-7.
The photocuring pattern of claim 8, wherein the photocuring pattern is selected from the group consisting of an array planarization film pattern, a protection film pattern, an insulation film pattern, a photoresist pattern, a black matrix pattern, and a column spacer pattern.
An image display device comprising the photocuring pattern of claim 8.

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