KR102015128B1 - Polishing pad and manufacturing method thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing pad and a method for manufacturing the polishing pad, and relates to a polishing pad used for surface polishing of a wafer or glass for use in semiconductors, smart devices, LEDs, solar cells, and the like, and a manufacturing method thereof. To this end, it comprises a base plate, a first segment pad having a plurality of coupling surfaces, a first segment pad, and a second segment pad having a smaller number of coupling surfaces relative to the first segment pad. A polishing pad is disclosed.

Description

Polishing pad and method of manufacturing the polishing pad

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing pad and a method for manufacturing the polishing pad, and more particularly, to a polishing pad used for surface polishing of a wafer or glass used in semiconductors, smart devices, LEDs, solar cells, and the like, and a manufacturing method thereof. .

Recently, there is an increasing demand for surface polishing of difficult-to-machine materials that are not previously used for the emergence of new electronic components such as smart devices, LEDs, solar cells, and semiconductors as well as semiconductor wafers. The demand for surface polishing of difficult-to-use materials such as sapphire and solar cell SiC is steadily increasing. Among them, sapphire is trying to replace existing glass products for display protection of various smart devices besides LED. The movement is in full swing.

Surface polishing apparatuses such as chemical mechanical polishing apparatuses or lapping apparatuses are used for the processing of such semiconductor wafers and difficult-to-use materials for display protection or Sapphire, which is an LED material, and SiC, which is a solar cell material. In the surface polishing apparatus, a lapping plate or a polishing pad attached to a surface plate for processing a surface by pressing in contact with an object to be processed through a polishing liquid is used.

Representative examples of such a lapping plate or a polishing pad attached to a surface plate include a polishing pad 1 attached on a platen 3 described in a later patent document published in Japanese Patent Laid-Open Publication No. 2001-0051874 and a polishing method. .

The polishing pad 1 crosses the block portions 5 having the polygonal grooves 4 through which the slurry as the polishing liquid can flow on the surface 2a of the pad body 2 so that the slurry can be rotated even at high speed rotation. By remaining in the groove 4 for a long time, the thermal deformation of the polishing pad 1 is reduced to enable uniform polishing and high speed and high pressure polishing of the object to be processed.

However, since the polishing pad 1 has to form a plurality of grooves 4 through the surface processing on the pad body 2, not only is it difficult to process, but also the processing object is enlarged to increase product characteristics or processing efficiency. There is no large processing device capable of forming the block portions 5 having the polygonal grooves 4 in the pad body 2 of the integral polishing pad 1 in the trend that the polishing pad 1 ) Was not available.

In order to solve this problem, the grindstone units 100 and 200 described in Japanese Laid-Open Patent Publication No. 2006-198701, which are described later, have been proposed.

The grindstone units 100 and 200 are fixed to the mounting plate 22 by bolts on the lapping surface plate 1 and to the mounting plate by means of an adhesive like a piece of cake. It consists of a grindstone (2). The grindstone segment 21 is formed with a first bent part 31 and a second bent part 32 so that the polishing liquid can penetrate into a groove formed by the first bent part 31 and the second bent part 32. The grindstone units 100 and 200 are manufactured to increase the size of the grindstone segment 21 even when the workpiece is enlarged by the adoption of the grindstone segment 21 and then on the lapping surface 1 which is increased together. It can be used in combination with the mounting plate (22).

However, this grindstone segment 21 is further required to form a groove by mechanical processing for forming the second sphere 32 on the upper surface. In addition, since the grindstone segments 21 suitable for the size of the object to be processed are separately manufactured, there is a problem in that the manufacturing process is complicated and a separate production facility for the grindstone segments 21 for each size is provided. In addition, since the mounting plate 22 must be additionally interposed between the lapping surface 1 and the grindstone segment 21, the structure is complicated, manufacturing cost and manufacturing time are increased, and the grindstone segment 21 is worn by polishing. In this case, there is a problem that the replacement cost is not easy due to the mounting plate 22 interposed therebetween.

Republic of Korea Patent Application Publication KR 2011-0051874 Japanese Laid-Open Patent Publication JP 2006-198701 Japanese Laid-Open Patent Publication JP 2000-176828 Republic of Korea Patent Publication KR 10-0727484

Therefore, the problem to be solved by the present invention is to solve the above problems can be easily formed in the upper surface of the lapping plate to allow the inflow and continuous persistence of the slurry can be easily formed without the work by a general mechanical cutting process, such as difficult materials The present invention provides a lapping plate having a self-aligning segment capable of minimizing deformation due to heat generated during a surface polishing operation of a workpiece to minimize thermal deformation of the workpiece, and a method of manufacturing the same.

In addition, another technical problem to be solved by the present invention is to solve the above problems to easily form a groove in which the slurry can be introduced and sustained on the upper surface of the lapping plate without limiting the size even if the surface polishing processing object is enlarged It is to provide a lapping plate having a self-aligning segment that can be made and a method of manufacturing the same.

In addition, another technical problem to be solved by the present invention is to solve the above problems, even if the size of the surface polishing processing object is diversified, even if there is no manufacturing equipment for each size of the lapping plate corresponding to the size of the various surface polishing processing object The present invention provides a lapping plate having a simple self-aligning segment and a method of manufacturing the same.

In addition, another technical problem to be solved by the present invention is to solve the above problems, the structure is very simple, the manufacturing cost and manufacturing time is low, the manufacturing efficiency is excellent, and the contact with the workpiece to be worn in the grinding process The present invention provides a lapping plate having a self-aligning segment having a low maintenance cost and a method of manufacturing the same, which can be easily replaced only by the contact.

In addition, the last technical problem to be solved by the present invention is a prior art document (JP2000-176828A) to go through the CNC machining in order to form a groove in the segment pitch, but in the present invention without forming a groove, furthermore, because it is produced by the mold time To provide a way to shorten much.

Wrapping plate having a self-aligning segment according to an embodiment of the present invention for solving the above problems is attached to the base plate, and the base plate, the longitudinal cross-section is the concave-convex constriction of the upper structure portion compared to the lower structure portion (Iii) the cross-section includes a segment unit plate in which a plurality of segment units each having a two-stage structure having an upper structure and a lower structure each having a hexagonal shape are assembled, and the segment unit plate has a side surface of the lower structure portion of each segment unit. It is mutually coupled with the side of the substructure of the adjacent segment unit by self alignment.

The segment unit has a height of 5 to 10 mm in the lower structure, a height of 7 to 15 mm in the upper structure, a width of a corresponding side of the cross section of the upper structure is 20 to 40 mm, and a step width of the upper structure and the lower structure. It is preferable that silver is 0.1-0.5 mm.

The segment unit is composed of a copper or tin metal powder and an epoxy resin mixture, and the segment unit plate can be separated and replaced separately from the base plate when worn by a polishing operation.

In addition, the manufacturing method of the lapping plate having a self-aligning segment according to an embodiment of the present invention for solving the above problems has a concave-convex shape in which the upper structure portion is constricted area compared to the lower structure shape. The cross-section is a segment unit shape having a two-stage structure of each of the upper structure and the lower structure of the hexagonal shape is a segment unit master manufacturing at least one formed on the master plate upper plate surface, wherein the prepared segment unit master Manufacturing a segment unit mold in which a mold space portion corresponding to a segment unit shape is formed by inverting the mold into a mold containing the liquid silicone rubber included therein and curing the copper or tin powder in the mold space portion of the manufactured segment unit mold. Liquid epoxy resin blend with Preparing a segment unit molding by adding water and curing, separating the manufactured segment unit molding from the segment unit mold, and then processing an upper surface and a lower surface to complete a segment unit. Segment unit for receiving and assembling a plurality of segment units upside down so that the side surface of the lower structure portion of the neighboring segment unit is in contact with each other in the segment unit receiving portion of the segment assembly jig formed with a segment unit receiving portion for accommodating two segment units A step of assembling, applying a liquid adhesive to the inverted lower surfaces of the assembled plurality of segment units, and a base of a metal material having a predetermined size on the inverted lower surfaces of the plurality of segment units to which the liquid adhesive is applied Image of plate Attaching and curing the side surface to produce a lapping plate molding, and post-processing the side portions of the prepared lapping plate molding so that the lower structure side of each segment unit is adjacent to the upper surface of the base plate by self alignment. Comprising the step of completing the wrapping plate is attached to the segment unit plate is mutually coupled with the lower structure side of the segment unit.

Between the step of applying a liquid adhesive to the lower surface and the manufacturing of the wrapping plate molding, the adhesive of the applied liquid is cured to produce a bonding force between the assembled plurality of segment units, and then back to the lower surface The method may further include applying a liquid adhesive.

In the step of completing the segment unit, the completed segment unit has a height of the lower structure is 5 to 10 mm, the height of the upper structure is 7 to 15 mm, the width between the corresponding sides of the cross section of the upper structure is 20 to 40 mm, Preferably, the stepped width of the upper structure and the lower structure is 0.1 to 0.5 mm.

The segment unit plate of the finished lapping plate can be separated and replaced separately from the base plate when worn by the polishing operation.

Meanwhile, an object of the present invention includes a base plate, a first segment pad having at least a plurality of joining surfaces, a second segment pad engaging with the first segment pad, and having a smaller number of joining surfaces than the first segment pad. It can be achieved by providing a polishing plate (or polishing pad) characterized in that.

In addition, the mating surfaces respectively formed on the first and second segment pads have an intaglio pocket portion formed on the joining surface by engraving, and an embossed mating surface on which the remaining area of the mating surface is coupled to an adjacent segment pad by the pocket portion. Is formed.

In addition, an embossed engagement surface of each of the first and second segment pads is mutually bonded to each other to form an accommodating space for restraining the movement of the abrasive slurry. It cannot move and is confined to the receiving space.

In addition, the receiving space is formed in the circumferential direction of the segment pad, and when the adjacent segment pads positioned in different directions with the central segment pad are bonded to each other, the polishing slurry is not moved in the different directions and is constrained in the receiving space.

In addition, the second segment pad is located at the outermost side, and a receiving groove is formed on the engaging surface of the second segment and the engaging surface of the first segment pad engaging with the second segment, and each receiving coupling is formed between the receiving pads. It further includes a support member for strengthening the bonding force.

In addition, the segment pad further includes grooves formed radially spaced apart, the polishing slurry contained in the region of one of the segment pad is constrained by the groove, the polishing slurry moved through the groove is accommodated in the receiving space Prevents abrasive slurry from moving to adjacent segment pads.

Meanwhile, an object of the present invention is a segment unit having a longitudinal cross-section having an uneven shape in which an upper structure is contracted compared to a lower structure, and a cross section having a two-stage structure having an upper structure and a lower structure each having a hexagonal shape. Manufacturing a segment unit master in which at least one shape is formed on the master plate upper plate surface,

Manufacturing a segment unit mold in which a mold space portion corresponding to a segment unit shape is formed by incorporating the manufactured segment unit master into a mold containing a liquid silicone rubber containing a curing agent, and then curing the segment unit master;

Injecting a liquid epoxy resin mixture containing copper or tin powder and a curing agent into a mold space of the manufactured segment unit mold, and manufacturing a segment unit molding through a curing process;

Separating the manufactured segment unit molding from the segment unit mold, and then processing the upper and lower surfaces to complete the segment unit,

Segment for receiving and assembling a plurality of segment units upside down so that the mating surfaces of neighboring segment units contact each other in a self-aligning manner in the segment unit accommodating portion of the segment assembly jig having a segment unit accommodating portion for accommodating a plurality of segment units in the center portion thereof. Unit assembly stage,

Applying a liquid adhesive to the inverted lower surface of the assembled plurality of segment units,

Attaching and curing a top surface of a base plate of a metal material having a predetermined size to an inverted bottom surface of a plurality of segment units coated with a liquid adhesive to prepare a lapping plate molding, and

Post-processing the side portions of the produced lapping plate moldings to complete a lapping plate having a segment unit plate attached to the upper surface of the base plate, each segment unit being mutually coupled to an adjacent segment unit by self alignment. It can be achieved by providing a method for producing a polishing pad, characterized in that.

In addition, the engaging surfaces respectively formed in the segment unit is formed with an intaglio pocket formed on the upper side of the engaging surface by intaglio, and an embossed engaging surface in which the remaining areas of the engaging surface are joined by adjacent segment units by the pockets, respectively. The corresponding embossed engagement surface formed in the segment unit of is adhesively bonded by the adhesive.

As described above, according to the present invention, a lapping plate having a self-aligning segment and a method of manufacturing the same, the upper structure portion of the segment unit capable of self-alignment when forming the segment unit assembly is formed so that the cross-sectional area is smaller than that of the lower structure portion. It is possible to make the space of the upper structural part naturally formed by the step generated between the structural members. Therefore, grooves capable of inflowing and sustaining the slurry on the upper surface of the lapping plate can be easily formed without general mechanical cutting operations, thereby minimizing heat deformation during surface polishing of difficult-to-cut materials. Therefore, there is an advantageous effect that uniform polishing and high speed and high pressure polishing of the surface polishing processing object are possible.

In addition, according to the present invention, the lapping plate having the self-aligning segment and the manufacturing method thereof, even if the surface polishing target object is enlarged, the slurry unit on the upper surface in accordance with the size of the target object in the form of assembling the segment unit without limitation of size There is an advantageous effect that it is easy to manufacture a lapping plate having a groove that can be introduced and sustained.

In addition, according to the present invention, a lapping plate having a self-aligning segment and a method of manufacturing the same, even when the surface polishing targets vary in size, it is possible to produce a lapping plate having grooves in the form of assembly of a plurality of segment units. It is possible to manufacture a lapping plate corresponding to the size of various surface polishing processing objects without having to separately provide a manufacturing facility for each size, which has an advantageous effect of simplifying the manufacturing process and the manufacturing equipment.

In addition, according to the present invention, a lapping plate having a self-aligning segment and a method for manufacturing the lapping plate have a very simple structure and a low manufacturing cost and a low manufacturing time. When the segment unit plate is worn out, the segment unit plate can be easily replaced without a separate pacing or grooving operation, and thus the maintenance cost is low.

The following drawings, which are attached to this specification, illustrate one preferred embodiment of the present invention, and together with the detailed description thereof, serve to further understand the technical spirit of the present invention. It should not be construed as limited.
1 is a perspective view of a wrapping plate (or polishing pad) having a self-aligning segment according to a first embodiment of the present invention,
FIG. 2 is an enlarged perspective view of region 'A' of FIG. 1;
3 is a flow chart of each process of the manufacturing method of the lapping plate with the self-aligning segment according to the first embodiment of the present invention;
4 is a perspective view of a segment unit master manufactured in the manufacturing step of the segment unit master of FIG.
5 is a perspective view of a segment unit mold manufactured in the manufacturing step of the segment unit mold of FIG.
6 is a perspective view illustrating a manufacturing process of a segment unit molded product;
7 is a perspective view of a segment assembly jig used in the segment unit assembly step,
8 is a perspective view illustrating a segment unit assembly step;
9 is a perspective view of a segment unit assembly in which assembly is completed and separated from the segment assembly jig;
10 is a perspective view illustrating a process of manufacturing a wrapping plate molding;
11 and 13 illustrate a polishing pad according to a second embodiment of the present invention;
12 is a perspective view showing a segment pad;
FIG. 14 is a view illustrating coupling between the first segment pad and the second segment pad disposed at the outermost part.

Hereinafter, with reference to the drawings will be described a preferred embodiment of the present invention. In addition, one Example described below does not unduly limit the content of this invention described in the Claim, and the whole structure demonstrated by this Embodiment is not necessarily required as a solution of this invention. In addition, the matters obvious to those skilled in the art and the art may be omitted, and the description of the omitted elements (methods) and functions may be sufficiently referred to without departing from the spirit of the present invention.

<Polishing pad>

(First embodiment)

A lapping plate (polishing pad or polishing plate) having a self-aligning segment according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2. 1 is a perspective view of a lapping plate with self-aligning segments according to one embodiment of the invention, and FIG. 2 is an enlarged perspective view of region 'A' of FIG. The wrapping plate with self-aligned segments according to an embodiment of the present invention includes a base plate 10 and a segment unit plate 20 stacked on the base plate 10.

The base plate 10 is also called a surface plate and is used to attach to a turntable or the like of a surface polishing processing apparatus, and may be separately manufactured or purchased according to the size of the surface polishing processing object. The segment unit plate 20 is attached on the base plate 10 by an adhesive (for example, adhesion by liquid epoxy). As shown in FIG. 2, the segment unit plate 20 has a concave-convex shape in which the upper structure 21b has a reduced area compared to the lower structure 21a, and the cross section has the upper structure 21b and the lower structure as shown in FIG. 2. A plurality of segment units 21 each having a hexagonal shape two-stage structure 21a are joined by mutual bonding.

Since the plurality of segment units 21 are hexagonal in cross section, when the plurality of the unit units 21 are assembled, the lower structure side surfaces 21a of the six segment units 21 are arranged around the side surfaces of the lower structure portions 21a of the one segment unit 21. They are mutually coupled so that they are easily adjacent by a self-aligning method. Therefore, after combining the plurality of segment units 21 by the assembly method in accordance with the size of the base plate 10 selected according to the size of the object to be processed, the post-processing the circumference to a size that meets the processing specifications of the surface processing object of various sizes The wrapping plate comprising the manufactured segment unit plate 20 is easily made.

The segment unit 21 serves as a polishing member for polishing sapphire glass or the like, and the material is made of a copper or tin metal powder and an epoxy resin mixture. In addition, as shown in FIG. 2, the segment unit 21 has a height h1 of the lower structure portion 21a that is coupled and polished by convenience of attachment to the base plate 10 and self-alignment of adjacent segment units 21. It is preferable that it is 5 to 10 mm for preventing flow during the process. Meanwhile, the height h2 of the upper structural portion 21b is a numerical value that defines the depth of the groove or gap g between the upper structural portions 21b of the adjacent segment unit 21, and is a kind of polishing liquid for efficient and smooth polishing. In consideration of the required specifications according to the flow rate, the flow rate, the flow rate and the duration, it is preferable that it is 7 to 15 mm. In addition, the width between the corresponding side width d1 of the cross section of the upper structure portion 21b and the step width d2 of the upper structure portion 21b and the lower structure portion 21a are grooves between the upper structure portions 21b of the adjacent segment units 21. (g) is a numerical value for setting the intervals, each 20 to 40 in consideration of the required specifications according to the degree of friction with the object to be processed and the type of polishing liquid, inflow amount, inflow rate and duration for efficient and smooth polishing during the polishing process. Preference is given to mm and 0.1 to 0.5 mm.

Segment unit plate 20 is separated from the base plate 10 when abrasion occurs due to the polishing process separately after the method of manufacturing a wrapping plate having a self-aligning segment according to an embodiment of the present invention to be described later Accordingly, since the new segment unit plate 20 can be easily replaced, there is no need for a separate facing or grooving operation, and thus maintenance is easy and cost is low. In addition, a plurality of sapphire glass may be simultaneously polished on the segment unit plate 20, and thus the flatness of the segment unit plate 20 may be different for each region. At this time, there is an advantage that can be used again after adjusting the flatness of the segment unit plate 20. In the case where various grooves 28 and 29 are formed in the pitch segment 24 as in the prior document JP 2000-176828, the process of processing the grooves after the planarization is performed in the same manner as the grooves. The segment unit plate 20 can be used directly without this groove or groove processing process.

Since the upper structure portion 21b and the lower structure portion 21a of the segment unit 21 shown in FIG. 2 are formed with a step d2 from each other, when the epoxy is bonded to another adjacent segment unit 21 with each other, A gap or groove g is formed along the six sides of the segment unit 21. That is, the gap or the groove g is formed in the six plane direction by being spaced apart from the adjacent segment unit along a six circumferential direction of the segment unit 21 by a predetermined distance. When the polishing slurry (including diamond powder) used in sapphire glass polishing is sprayed on the segment unit plate and polished, the polishing slurry moves outward by centrifugal force by the rotation of the base plate 10. It is necessary to limit the movement of such polishing slurry, and accordingly, in the present invention, the gap or groove g is formed on the outer six sides of the segment unit 21 so that the polishing slurry is at least the gap or groove of its own segment unit 21. By restraining to (g), it can prevent it from moving to the adjacent segment unit 21 side. In this gap or groove g, a part of the polishing slurry may be accumulated in a predetermined height in advance.

Although not shown in the drawings, a cushion layer may be inserted between the base plate 10 and the segment unit plate 20. That is, the cushion layer may be adhesively fixed to the upper surface of the base plate 10, and the segment unit plate 20 may be adhesively fixed to the upper surface of the cushion layer. When the cushion layer is provided, the segment unit plate 20 may be uniformly polished at the time of polishing the sapphire glass, and further, the top surface of the segment unit plate 20 may be uniformly worn to maintain the flatness.

(2nd Example)

In the polishing pad 500 or the polishing plate according to the second embodiment of the present invention, as shown in FIG. 11, each of the segment pads 510 and 520 is separately manufactured, and each of the segment pads is epoxy bonded to each other. The first segment pad 510 is a six-sided segment pad, and the second segment pad 520 is a segment pad having fewer than six surfaces (eg, two, three, four, and five surfaces). That is, the second segment pad 520 is mainly located at the outermost or near the rotating shaft (inside of the polishing plate through which the rotating shaft passes).

As shown in FIG. 12, the first segment pad 510 having six surfaces includes pockets 511, 512, and 513 on each surface thereof. At this time, although three pocket parts are shown in FIG. 12, it is preferable to have the same pocket parts on all six surfaces. The pocket portion 511 formed on one surface 515 has a substantially rectangular or square shape (described as a rectangular shape hereinafter) with a cross section recessed by a rectangular area with respect to the surface 515. The rectangular pocket portion is formed smaller than the size of the surface 515 and is formed on the upper side of the surface 515. The pocket portion is formed on the upper side of each surface, so that the polishing slurry sprayed on the upper surface of the segment pad 510 moves in one direction by centrifugal force or rotation by rotation, and is constrained by the pocket portion provided on the six sides to prevent the polishing slurry from moving to the adjacent segment pad. can do. The pockets provided on each surface may be referred to as intaglio, and the remaining portion of the surface 515 except for the pocket may be referred to as embossed.

When any one of the segment pads and the adjacent segment pads are bonded to each other by epoxy, corresponding pocket portions formed in the respective segment pads face each other to form an accommodating space 530 or a room for receiving the polishing slurry. . At the time of epoxy bonding, an accommodating space is formed by adhering an embossed surface formed on one surface of one of the segment pads and an embossed surface formed on a corresponding surface of an adjacent segment pad to each other. This accommodation space is formed by the pocket area of each corresponding pocket portion. In addition, the accommodating spaces formed on the respective surfaces prevent the polishing slurry from moving to the accommodating spaces formed on the different surfaces. That is, the polishing slurry contained in the first receiving space formed on the first surface of the segment pad does not move to the second receiving space formed on the second surface (adjacent surface) of the same segment pad. This is because the accommodation space is formed as a single room. Therefore, the polishing slurry introduced into one of the receiving spaces is restricted from moving to another adjacent receiving space. The lateral guide groove 32 of the prior document JP 2000-176828 is formed in the circumferential direction of the six faces of the pitch segment 24 and at the same time, the polishing slurry is forced to move along the six faces. In contrast, the receiving space of the present invention has an advantage in that the polishing slurry does not move to the adjacent receiving space by constraining the polishing slurry. The pocket part and the accommodation space described above are described based on the first segment pad 510, but the same may be applied to the second segment pad 520. However, in the case of the second segment pad 520, since the number of surfaces is smaller than that of the first segment pad 510, the pocket part and the accommodation space may be formed based on the number of the formed surfaces. 13 shows receiving spaces 531, 532, 533, 534, 535, and 536 formed on six surfaces of the segment pad 510, respectively. The abrasive slurry introduced into each receiving space is confined to each receiving space without being moved to another adjacent receiving space.

On the other hand, as shown in FIG. 11, when adjacent segment pads are bonded by mutual epoxy, most six surfaces are adhesively bonded to each other. That is, the embossed surfaces formed on the six surfaces of each segment pad and the embossed surfaces of the adjacent segment pads corresponding thereto are epoxy bonded to each other. On the other hand, in the case of the second segment pad 520 positioned at the outermost side, the two sides 521 or 3 sides 522 may be epoxy-bonded with the adjacent segment pads, so that the bonding strength may be weaker than that of other bonds. In order to strengthen the coupling force, as shown in FIG. 14, it is preferable to further include a coupling part 540 capable of coupling the first segment pad 510 and the second segment pad 520 to each other. That is, a support member receiving groove 541 into which the support member 542 may be inserted is formed on one surface of the first segment pad 510. In addition, a support member accommodating groove into which the support member 542 may be inserted is formed in one surface of the second segment pad 520 corresponding to the first segment pad. The support member 542 may be respectively accommodated in the accommodating grooves of the first and second segment pads so as to be coupled and fixed to enhance the bonding force of the second segment pads. Support member 542 of the coupling portion is provided with one or two or more on each side to enhance the bonding force. The receiving groove is preferably formed corresponding to the number of support members provided. The supporting member 542 is inserted into and fixed to one surface of the second segment pad 520 and the first segment pad 510 facing each other to reinforce the bonding force. That is, as shown in FIG. 14, the second segment pad 520 has two surfaces facing each other with the first segment pad 510, so that the supporting member 542 is inserted into each corresponding two surfaces. Can be fixed to strengthen the bonding force. The length of the support member 542 may be equal to the width of the accommodation space 530 (or the spaced apart from the adjacent segment pad). That is, it is preferable that the remaining length except the length of the supporting member 542 inserted into the receiving groove 541 corresponds to the width of the receiving space. If the length of the supporting member 542 is longer than the width of the receiving space, the receiving space can be moved to the adjacent receiving space without restraining the polishing slurry, and the corresponding embossed surfaces of the segment pads are not bonded to each other. Cohesion may weaken.

Meanwhile, although not shown in the drawing, grooves having grooves in a circular shape may be formed in the polishing pad 500 by being spaced apart from the inside of the polishing pad by a predetermined interval. That is, each segment pad may be provided with grooves spaced at regular intervals in the radial direction (ie, from the inside of the circle to the outside of the circle). The groove may constrain the polishing slurry from moving in the radial direction. In the present invention, the movement of the polishing slurry may be restrained by the groove, and further, the polishing slurry may be prevented from moving to the adjacent segment pad by accommodating the moved polishing slurry by the receiving space. The groove width and separation distance of the groove can be adjusted in various ways depending on the installation environment.

On the other hand, the manufacturing method according to the first and second embodiments will be described in the manufacturing method of the polishing pad to be described later.

<Method for Manufacturing Polishing Pad>

Hereinafter, a method of manufacturing a lapping plate (polishing pad or polishing plate) having a self-aligning segment according to one embodiment of the present invention will be described in detail with reference to FIGS. 3 to 10.

3 is a flow chart of each process of the manufacturing method of the lapping plate with a self-aligned segment according to an embodiment of the present invention, Figure 4 is a perspective view of a segment unit master manufactured in the manufacturing step of the segment unit master of Figure 3, Figure 5 3 is a perspective view of a segment unit mold manufactured at the manufacturing stage of the segment unit mold of FIG. 3, FIG. 6 is a perspective view illustrating a manufacturing process of the segment unit molding, and FIG. 7 is a perspective view of a segment assembly jig used at the segment unit assembly stage. 8 is a perspective view illustrating a segment unit assembly process, FIG. 9 is a perspective view illustrating a segment unit assembly in which assembly is completed and separated from a segment assembly jig, and FIG. 10 is a perspective view illustrating a process of manufacturing a wrapping plate molding.

The method of manufacturing a lapping plate with a self-aligning segment according to an embodiment of the present invention first starts from the segment unit master manufacturing step S100 as shown in FIGS. 3 to 4. That is, the longitudinal cross-section corresponding to the segment unit 21 shown in FIGS. 1 and 2 has a concave-convex shape in which the upper structure portion 124 has a contracted area compared to the lower structure portion 122. In addition, as shown in FIG. 4, the cross section is a segment unit shape 120 in which the upper structure shape 124 and the lower structure shape 122 each have a two-stage structure of hexagonal shape. The segment unit master 100 is manufactured by cutting (a cutting process) a segment resin 120 protruding from the master plate 110 and the upper plate surface of the master plate 110 by cutting a workable ABS resin plate or the like. do.

Then, a segment unit mold is manufactured as shown in FIGS. 3 and 5 (S200). Looking at this in detail to accommodate the segment unit master (100) prepared as shown in Figure 4 in a mold (not shown) containing a liquid silicone rubber containing a curing agent after receiving in the oven or electric furnace 15 ℃ to 60 ℃ 6 hours to 72 hours to prepare a segment unit mold 200 in which a mold space portion 220 corresponding to the segment unit shape 120 is formed. In this embodiment, the segment unit mold 200 was manufactured through a curing process through hot air drying at 40 ° C. for 12 hours.

Then, as shown in FIG. 3 and FIG. 6 to produce a segment unit molding (S300). That is, 50 to 70% by weight of copper or tin powder and 30 to 50% by weight of a liquid epoxy resin containing a curing agent in the mold space portion 220 of the segment unit mold 200 manufactured as shown in FIG. The ratio of can be adjusted) is prepared and the segment unit molding 23 is produced through a curing process for 6 hours to 24 hours at 60 ℃ to 90 ℃ in an oven or an electric furnace. In this embodiment, a mixture composed of 60 wt% copper or tin powder and 40 wt% of a liquid epoxy resin containing a curing agent is added to the segment shown in FIG. 6 through a curing process by hot air drying at 60 ° C. for 10 hours in an electric furnace. The unit molding 23 was produced.

Then, as shown in FIG. 3, a step of completing the segment unit is performed (S400). That is, after separating the manufactured segment unit molding 23 from the segment unit mold 200, the upper and lower surfaces are planarized to complete the segment unit 21 as shown in FIG. Then, the segment unit assembly step (S500) as shown in FIG. 3 and FIG. That is, as shown in FIG. 7, the segment unit accommodating part of the segment assembly jig 300 having the segment unit accommodating part 310 accommodating the plurality of segment units 21 in the center part manufactured according to the size of the object to be processed ( As shown in FIG. 8, the plurality of segment units 21 are assembled by inverting and accommodating the plurality of segment units 21 so that the side surfaces of the lower structure portions 21a of the neighboring segment units 21 are aligned with each other. .

Then, as shown in FIG. 3, the inverted bottom surface or side surface of the plurality of segment units 21 assembled (a stepped side, that is, the side surface of the segment unit adjacent to the side surface of the segment unit of its own segment unit Applying a liquid adhesive to its own six-sided circumferential direction) (S600), curing the applied liquid adhesive (S700), as shown in Figure 9 having a bonding force between the adjacent plurality of segment units 21 Complete the segment unit assembly 25.

Then, as shown in FIG. 3, the liquid adhesive is further applied to the lower surface of the segment unit assembly 25 (S800), and the inverted lower surface of the segment unit assembly 25 to which the liquid adhesive is further applied. The upper surface of the base plate 10 of a metal material having a predetermined size corresponding to the segment unit assembly 25 is attached and cured to prepare a wrapping plate molding illustrated in FIG. 10 (S900).

Then, post-processing the side portions of the lapping plate moldings prepared as shown in FIG. 3, the lower structural side of each segment unit 21 is adjacent to the upper surface of the base plate 10 by self alignment. The wrapping plate to which the segment unit plate 20 is coupled to the lower structure side surface of the unit 21 is attached (S1000).

On the other hand, unlike one embodiment of the present invention after applying the liquid adhesive to the lower surface of the assembled segment unit 21 (S600) after the separate adhesive curing process (S700) and adhesive re-application (S900) process, The upper surface of the base plate 10 may be directly attached to the inverted lower surface of the segment unit assembly 25 to which the adhesive is applied, and then hardened to prepare the wrapping plate molding illustrated in FIG. 10 (S900).

In the following description of the present invention, those skilled in the art and those skilled in the art may omit descriptions, and descriptions of such omitted components (methods) and functions may be sufficiently referred to without departing from the technical spirit of the present invention. Could be.

Description of the configuration and functions of the above-described parts have been described separately from each other for convenience of description, and any configuration and function may be implemented by being integrated into other components, or may be further subdivided as necessary.

As mentioned above, although demonstrated with reference to one Embodiment of this invention, this invention is not limited to this, A various deformation | transformation and an application are possible. That is, those skilled in the art will readily appreciate that many modifications are possible without departing from the spirit of the invention. In addition, when it is determined that the detailed description of the known function and its configuration or the coupling relationship for each configuration of the present invention may unnecessarily obscure the subject matter of the present invention, it should be noted that the detailed description is omitted. something to do.

10: base plate
20: segment unit plate (or polishing pad)
21: Segment unit (or segment pad)
21a: undercarriage
21b: superstructure
23: segment unit molding
25: segment unit assembly
100: segment unit master
110: master plate
120: segment unit shape
122: substructure shape
124: superstructure shape
200: segment unit mold
220: mold space part
300: segment assembly jig
310: segment unit accommodating part
500: polishing pad (or polishing plate)
510: first segment pad
511: first pocket portion
512: second pocket portion
513: third pocket portion
515: first side
520: second segment pad
521: two-sided joining segment pad
522: 3-sided bonding segment pad
530: accommodation space
531: first accommodation space
532: second accommodation space
533: third accommodation space
534: fourth accommodation space
535: fifth accommodation space
536: 6th accommodation space
540: coupling part
541: receiving groove (combination groove)
542 support member
600: axis of rotation

Claims (8)

Base plate, and
A second segment pad having a polygonal shape to have at least a plurality of joining surfaces and a second segment pad engaging with a circumferential surface of the first segment pad and having a polygonal shape such that the number of joining surfaces is relatively smaller than that of the first segment pad. A segment unit having a segment pad,
The segment unit,
The step of forming a step with each other, the upper structure of the segment unit forms a two-stage structure with a smaller area than the lower structure, and the first and second segment pads are disposed correspondingly to the upper structure and the lower structure.
The method of claim 1,
In the mating surface formed on the first and second segment pads,
Engraved pocket portion formed on the upper side of the engaging surface by engraving
And an embossed mating surface on which the remaining area of the mating surface engages with an adjacent segment pad by the engraved pocket part.
The method of claim 2,
Corresponding embossed mating surfaces of the first and second segment pads are joined to each other to form a receiving space for restraining the movement of the polishing slurry.
The polishing pad is characterized in that the polishing slurry does not move from one segment pad to an adjacent segment pad but is confined to the receiving space by the receiving space.
The method of claim 3, wherein
The receiving space is formed in the circumferential direction of the segment pad,
And a polishing slurry cannot be moved in different directions when the center segment pad and adjacent segment pads positioned in different directions are constrained in the receiving space.
The method of claim 1,
The second segment pad is located at the outermost side,
Receiving grooves are formed in the engaging surface of the second segment and the engaging surface of the first segment pad engaging with the second segment,
And a support member accommodating and coupled to each of the receiving grooves to reinforce the bonding force between the segment pads.
The method of claim 4, wherein
Groove grooved in a circular shape spaced apart at regular intervals from the inner side to the outer side of the polishing pad to restrain the polishing slurry from moving in the radial direction,
The polishing slurry included in the region of one of the segment pads is constrained by the grooves, and the polishing slurry moved through the grooves is accommodated in the receiving space to prevent the polishing slurry from moving to the adjacent segment pads. Polishing pads.
The longitudinal section has a concave-convex shape in which the upper structure is constricted in area compared to the lower structure, and the cross section is a segment unit shape in which the upper structure and the lower structure have hexagonal two-stage structures, respectively, on the master plate upper plate. Manufacturing a segment unit master having at least one formed thereon;
Manufacturing a segment unit mold in which a mold space portion corresponding to a segment unit shape is formed by incorporating the prepared segment unit master in a mold containing a liquid silicone rubber containing a curing agent, and then curing the segment unit master;
Injecting a liquid epoxy resin mixture containing copper or tin powder and a curing agent into the mold space of the manufactured segment unit mold, and manufacturing a segment unit molding through a curing process;
Separating the manufactured segment unit molding from the segment unit mold and then processing an upper surface and a lower surface to complete a segment unit,
A plurality of segments such that the joining surfaces of the segment units formed in a polygonal shape in the segment unit accommodating portion of the segment assembly jig in which a segment unit accommodating portion is formed in the center portion are in contact with the joining surfaces of neighboring segment units; Segment unit assembly step of inverting and accepting the unit,
Applying a liquid adhesive to the inverted lower surfaces of the assembled plurality of segment units,
Preparing a lapping plate molding by attaching and curing an upper surface of a metal base plate having a predetermined size to an inverted lower surface of the plurality of segment units to which the liquid adhesive is applied, and
Post-processing the side portions of the prepared lapping plate moldings to complete a lapping plate having a segment unit plate attached to an upper surface of the base plate, wherein each segment unit is mutually coupled with an adjacent segment unit,
The segment unit,
By forming a step with each other, the upper structure of the segment unit forms a two-stage structure having a smaller area than the lower structure, and the first and second segment pads are disposed correspondingly to the upper structure and the lower structure. Manufacturing method.
The method of claim 7, wherein
In the engaging surface formed in each of the segment unit,
Engraved pocket portion formed on the upper side of the engaging surface by engraving
An embossed engaging surface is formed by the pocket part in which the remaining area of the engaging surface engages with an adjacent segment unit.
A corresponding embossed mating surface formed in each segment unit is adhesively bonded by an adhesive.

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