KR102007566B1 - Apparatus and method for supplying resin material, resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

[PROBLEMS] To provide a resin material supply device capable of supplying a resin material to a supply object under correct conditions when the conditions of the resin material such as the feed rate and the kind of powdery resin material to be supplied are changed.
[Resolution] The resin material supply device 10 is held by the resin material holding unit 11 holding the resin material P and the resin material holding unit 11 connected to the resin material holding unit 11. The trough 12 for supplying the resin material P which has been made to the supply object (resin material transfer tray T), the excitation part 13 which vibrates the resin material holding | maintenance part 11 and the trough 12, and , A weight measuring unit (measuring unit) 14 for measuring the weight of the resin material holding unit 11 and the trough 12 including the resin material P, and an outlet of the trough 12 (supply port 121). Powder to set the vibration strength of the excitation unit 13 to position the object to be supplied at the same time and to supply the resin material to the object to be supplied at a predetermined flow rate based on the weight value measured by the weight measuring unit 14. When the conditions of the supply control unit 191 and the resin material to be supplied to the supply object are changed, By placing the material-receiving portion 17, and a discharge control unit 192 for discharging the resin material (P) of a resin material receiving portion (17) remaining in the trough (12).

Description

Resin material supply device, resin material supply method, resin molding device, and resin molded product manufacturing method {APPARATUS AND METHOD FOR SUPPLYING RESIN MATERIAL, RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD}

The present invention relates to a resin material supply device and method for supplying a resin material, a resin molding device having the resin material supply device, and a resin molded article manufacturing method using the resin material supply method.

In order to protect the electronic components from the environment such as light, heat, moisture, and the like, the electronic components are generally sealed with a resin. The resin sealing method includes a compression molding method and a transfer molding method. In the compression molding method, a resin material is supplied to a cavity of a lower mold by using a mold formed of a lower mold and an upper mold, and a substrate on which an electronic component is mounted is mounted on the upper mold. Molding is performed by mold coupling both while heating the lower mold and the upper mold. In the transfer molding method, a substrate is attached to one of the upper mold and the lower mold, and then the mold is clamped while the lower mold and the upper mold are heated, and molding is performed by pressing a resin into the cavity with a plunger. . In the transfer molding method, part of the resin remains in the path for feeding the resin from the plunger to the cavity, resulting in waste, and a problem that the semiconductor substrate or the wiring is damaged due to the flow of the resin. Therefore, in recent years, compression molding has become a mainstream.

In compression molding, generally, a granular resin material or a powdered resin material is used as the resin material to be supplied to the lower mold. Hereinafter, the granular resin material and the powdered resin material are collectively referred to as "powder resin material". Since the powdered resin material does not flow freely in the cavity after the supply, it is preferable to supply the powdered resin material into the cavity of the lower mold as evenly as possible so as to reduce the flow of the resin material in the cavity during molding. Do. Patent Document 1 describes a resin material supply device for uniformly supplying a powdery resin material from a resin material supply part to a resin material feed tray having a shape and size corresponding to a cavity. After supplying the powdered resin material to the resin material conveying tray, the resin material conveying tray is conveyed above the lower mold of the compression molding apparatus and the shutter provided at the bottom of the resin material conveying tray is opened to lower the powdery resin material. It is supplied in the cavity of (falls). In the resin material supply apparatus of patent document 2, instead of providing a shutter in a bottom part, powdery resin material is supplied to the resin material transfer tray which installed the release film. Thereafter, the resin material transfer tray is transferred above the lower mold in the same manner as described above, and then the powdery resin material is supplied to the cavity of the lower mold by sucking the mold release film from the lower mold side.

When supplying powdery resin material to a resin material feed tray from a resin material supply apparatus, the resin material supply apparatus of patent document 3 can be used, for example. As shown in FIG. 7, the resin material supply device 90 has an excitation section that applies vibration to the resin material holding unit 91, the trough 92, the resin material holding unit 91, and the trough 92. 93, the 1st metering part 94 which measures the weight of the resin material holding | maintenance part 91, and the conveyance mechanism 95 (In patent document 3, the resin material holding | maintenance part is provided. 91 and trough 92 are collectively called "second vibration feeder."

The trough 92 has one end connected to the resin material holding part 91 and the other end supplying the powdered resin material P to the resin material transfer tray (supply object) T. Sphere 921. The resin material transfer tray T is held by the transfer mechanism 95. The transfer mechanism 95 has the resin material transfer tray T so that an arbitrary position in the resin material transfer tray T to which the powdery resin material P is supplied can be disposed just below the supply port 921. It is a mechanism which moves substantially horizontally and conveys the resin material conveyance tray T to which the powdery resin material P was supplied to the upper side of a lower mold | type. Below the conveyance mechanism 95, the 2nd metering part 96 which measures the weight of the conveyance mechanism 95 of the state which hold | maintained the resin material conveyance tray T is provided.

The operation of the resin material supply device 90 will be described. When the operation of the resin material supply device 90 starts, the powdery resin material P is transferred from the first vibration feeder (not shown) provided above the resin material holder 91 to the resin material holder 91. It is gradually supplied. During this time, the first metering unit 94 always measures the weight of the resin material holding unit 91. Here, since the weight of the resin material holding | maintenance part 91 itself does not change, the amount of increase (or decrease) of the weight which arises in the measurement of the powdery resin material P in the resin material holding | maintenance part 91 does not change. The amount of increase (or decrease) is shown. When the increase amount of the powdery resin material P measured by the first metering unit 94 reaches the small device, the supply of the powdery resin material P to the resin material holding unit 91 is stopped.

Next, the transfer mechanism 95 arranges the resin material transfer tray T directly under the supply port 921. And the excitation part 93 gives a vibration to the resin material holding | maintenance part 91 and the trough 92. As shown in FIG. Thereby, the powdery resin material P accommodated in the resin material holding | maintenance part 91 gradually moves inside the trough 92, falls from the supply port 921, and supplies it to the resin material transfer tray T. Going. In that case, the stronger the vibration by the excitation part 93 is, the larger the moving speed of the powdery resin material P, that is, the supply speed (flow rate) to the resin material transfer tray T becomes. The feed mechanism 95 supplies the powdered resin material P from the supply port 921 to the resin material feed tray T so that the powdered resin material P is evenly supplied into the resin material feed tray T. The resin material transfer tray T is moved within its opening. And when the weight of the powdery resin material P measured by the 2nd metering part 96 reaches the small apparatus, the vibration of the excitation part 93 is stopped and the powdery phase to the resin material feed tray T is carried out. Supply of the resin material P is stopped. Thereby, the operation | movement of supply of the powdery resin material P to one resin material transfer tray T is complete | finished. Thereafter, the transfer mechanism 95 transfers the resin material transfer tray T supplied with the powdered resin material P to the upper side of the lower mold, and immediately transfers the next resin material transfer tray T to the supply port 921. Place it below.

Patent Document 1: Japanese Patent Laid-Open No. 2007-125783 Patent Document 2: Japanese Patent Laid-Open No. 2010-036542 Patent Document 3: Japanese Patent Application Laid-Open No. 09-005148

When the supply of the powdery resin material P to the one resin material transfer tray T is completed, the trough 92 has a powdery resin material (as shown in FIGS. 8A and 8B). P) remains. The larger the feed rate (flow rate) of the powdery resin material P before the supply stops, the larger the remaining amount of the powdery resin material P in the trough 92. In the example shown to (a) and (b) of FIG. 8, since the supply speed of the powdery resin material P before supply stoppage is larger than (b), in the trough 92, it is powdery. The amount of resin material (P) is large.

The feed rate of the powdery resin material P to be supplied to the resin material feed tray T needs to be changed depending on the size of the resin material feed tray T as a supply destination, that is, the size of the resin molded product to be manufactured. For example, when the resin material feed tray T is shallow or its area is small, the feed rate is made small, and when the resin material feed tray T is deep or its area is large, the feed rate is made large. When the feed rate is changed in this manner, immediately after that, as shown in FIG. 8C, the trough 92 is removed from the resin material holding portion 91 before the change at a position on the supply port 921 side in the trough 92. ), There is a positive powdery resin material P in accordance with the feed rate before the change. On the other hand, at the position on the side of the resin material holding portion 91 in the trough 92, the positive powder supplied to the trough 92 from the resin material holding portion 91 after the change of the feeding speed, according to the feeding speed after the change. Phase resin material P exists. Therefore, even if the vibration according to the supply speed after a change is provided from the excitation part 93, what is made to be able to supply powdery resin material P to the resin material transfer tray T at the feed rate after a change actually is before the change. After all of the powdery resin material P supplied from the resin material holding | maintenance part 91 to the trough 92 was discharged | emitted from the supply port 921, it cannot supply at the feed rate after the original change to that point.

Moreover, depending on the resin molded article to manufacture, the powdery resin material P may be changed into a thing of a different kind (for example, a material and a particle size differ). However, since the powdery resin material P before the change remains in the resin material holding part 91 and the trough 92 at the time when the supply operation | movement of the powdery resin material P of the kind before a change was complete | finished, The kind of powdery resin material P cannot be immediately supplied to the resin material transfer tray T.

The problem which this invention is trying to solve is a resin material which can supply powdery resin material to a supply object on a correct condition, when the conditions of resin materials, such as a feed rate (flow volume) and the kind of powdery resin material to supply, are changed. A supply apparatus and method, a resin molding apparatus, and a resin molded article manufacturing method are provided.

The resin material supply apparatus which concerns on this invention made in order to solve the said subject,

a) a resin material holding part for holding a powdery resin material,

b) a trough for supplying the resin material held by the resin material holding part connected to the resin material holding part to a supply object;

c) an excitation portion for vibrating the resin material holding portion and the trough;

d) a weight measuring unit for measuring the weight of the resin material holding unit and the trough including the resin material;

e) powder for positioning the supply object at the outlet of the trough and setting the vibration intensity of the excitation section to supply the resin material to the supply object at a specified flow rate based on the weight value measured by the weight measuring unit. Supply control unit,

f) when the conditions of the resin material to be supplied to the object to be supplied are changed, the resin material receiving part is located at the outlet of the trough, and the discharge control unit for discharging the resin material remaining in the trough to the resin material receiving part is provided. It features.

The resin material supply method according to the present invention,

A resin material holding step of holding the powdery resin material in the resin material holding part;

The resin at a vibration intensity set to supply the resin material to a supply object positioned at the outlet of the trough based on the weight value of the weight of the trough connected to the resin material holding unit and the resin material holding unit. A powder supply step of supplying a resin material to the supply object at the specified flow rate by vibrating a material holding part and the trough;

When the conditions of the resin material to be supplied to the supply object is changed, the resin material receiving portion is located at the outlet of the trough, characterized in that it has a discharge step of discharging the resin material remaining in the trough to the resin material receiving portion. .

The resin molding apparatus according to the present invention,

The resin material supply device,

A compression molding portion having an upper mold, a lower mold having a cavity, a mold clamping mechanism for clamping the upper mold and the lower mold,

And a conveying part for transferring the supply object supplied with the powdery resin material by the resin material supply device over the cavity, and supplying the resin material from the supply object to the cavity.

Resin molded article manufacturing method according to the present invention,

Supplying a powdery resin material to the supply object by the resin material supply method;

Transferring the supply object supplied with the resin material to the cavity of the lower mold, and supplying the resin material from the supply object to the cavity;

And a step of clamping the upper mold and the lower mold supplied with the resin material to the cavity.

According to this invention, when changing conditions of resin materials, such as a feed rate (flow rate) and the kind of powdery resin material to supply, a powdery resin material can be supplied to a supply object on a correct condition after that.

BRIEF DESCRIPTION OF THE DRAWINGS It is a longitudinal cross-sectional view which shows one Embodiment of the resin material supply apparatus which concerns on this invention.
FIG. 2 is a flowchart showing the operation at the start of supply of the powdered resin material in the resin material supply device of the present embodiment.
Fig. 3 shows the resin material in the trough before (a), during the operation for changing the specified flow rate (b), and when the preparation for supply of the resin material is completed by changing the designated flow rate (c). It is a figure which shows the state of.
4 is a flowchart showing an operation when the condition of the resin material is changed during the operation of the resin material supply device of the present embodiment.
It is a longitudinal cross-sectional view which shows an example of the compression molding part which is a part of the compression molding apparatus which concerns on this invention.
6 is a schematic view showing an example of a resin molding apparatus including a material import module, a molding module, and a dispensing module.
It is a longitudinal cross-sectional view which shows the principal part of an example of the conventional resin material supply apparatus.
FIG. 8 is a trough in the case where the supply speed of the resin material is constant (a), when the supply speed of the resin material is constant (b) and slower than (a), and when the supply speed is changed (faster). It is a figure which shows the state of the internal resin material.

In the resin material supply apparatus which concerns on this invention, after holding a powdery resin material in a resin material holding | maintenance part, a resin material holding part and a trough are vibrated by an excitation part, and the resin material in a resin material holding | maintenance part is made to carry out a trough. It passes and supplies to the supply object arrange | positioned at the exit of the said trough. At this time, the weight measuring unit measures the weight of the resin material holding unit and the trough containing the resin material, and the powder supply control unit measures the vibration intensity of the excitation unit to supply the resin material to the supply object at a predetermined flow rate based on the measured weight value. Set it. Since the weight of the resin material holding part and the trough is unchanged, the change in the measured weight value represents the change of the weight of the resin material holding part and the resin material in the trough. Based on the change of the weight of this resin material, a powder supply control part can calculate | require the flow volume of an actual resin material, and can adjust vibration intensity based on this flow volume.

When the condition of the resin material for supplying the resin material to the supply object is changed, the discharge control unit discharges the resin material remaining in the trough to the resin material receiving unit. Here, the change of the conditions of a resin material includes the change of a designated flow volume, and the change of the kind of resin material.

When the designated flow rate is changed, the discharge control unit controls the excitation unit to discharge the resin material remaining in the trough to the resin material receiving unit at the designated flow rate (specified flow rate after the change) when the specified flow rate is changed. As a result, the resin material remaining in the trough at an amount corresponding to the designated flow rate before the change is extruded into the resin material receiving portion, for example, extruded into a new resin material supplied into the trough at the designated flow rate after the change. In the trough, a resin material in an amount corresponding to the designated flow rate after the change is present. Therefore, after this discharge process, the resin material can be supplied to the supply object at the correct designated flow rate after the change.

In the case of changing the type of the resin material, the discharge control unit discharges the resin material before the change remaining in the trough to the resin material receiving unit when the type is changed as described above. At the same time, the discharge control part also discharges the resin material before the change remaining in the resin material holding part. In that case, it is preferable that the flow volume at the time of discharging the resin material before a change is as fast as possible so that production efficiency may be made high, ie, the supply of the resin material after a change may be started as soon as possible. After discharging the resin material in the trough and the resin material holding part in this manner, the resin material after the change is held in the resin material holding part, and the resin material is supplied to the supply object.

Further, the discharge control part places the resin material receiver at the outlet of the trough when the operation of the resin material supply device is resumed after a predetermined time elapses from when the resin material supply device stops. The resin material remaining in the resin material holding part and the trough may be discharged to the resin material receiving part. Since resin materials, such as a thermosetting resin, tend to deteriorate at normal temperature, by taking such a structure, it can prevent that the resin material deteriorated by the resin material holding part and the trough is supplied to a supply object. Also in this case, the flow rate at the time of discharging the resin material is preferably as fast as possible. The elapsed time from when the resin material supply device stopped, for example, the discharge control unit acquires the time when the previous operation stopped from the electronic file (log file) that recorded the operation of the device, And time from that point in time.

In addition, although the resin material discharged | emitted to the resin material receiving part may be discarded, you may return and use it to the resin material holding | maintenance part or the source supply part demonstrated below except the case where the deteriorated resin material was discharged as mentioned above. .

The resin material supply apparatus which concerns on this invention can further be equipped with the original supply part which supplies a resin material to the said resin material holding part. The supply of the resin material from the original supply portion to the resin material holding portion may be performed every time the resin material is supplied to the holding portion once, but usually the capacity of the resin material holding portion is made larger than that of the holding portion, It is efficient to perform it once every time a resin material is supplied to a to-be-held part multiple times.

Hereinafter, more specific embodiment is demonstrated about the resin material supply apparatus, the resin material supply method, the resin molding apparatus, and the resin molded article manufacturing method which concern on this invention using FIG.

(1) Structure of Resin Material Supply Device of Present Embodiment

The resin material supply apparatus 10 of this embodiment is an apparatus which supplies powdery resin material P to the resin material conveyance tray T which is a supply object. The resin material supply apparatus 10 has the resin material holding part 11 which hold | maintains powdery resin material P, and the trough 12. As shown in FIG. One end of the trough 12 is connected to the resin material holding part 11, and the other end is provided with a supply port 121, which is an opening for supplying the powdery resin material P to the resin material transfer tray T. In addition, the resin material supply device 10 includes an excitation portion 13 which vibrates the resin material holding portion 11 and the trough 12, a resin material holding portion 11 including the powdered resin material P, and It has the measuring part (weight measuring part) 14 which measures the weight of the trough 12. As shown in FIG. The structure of each part demonstrated so far is the same as the structure of each part of the conventional resin material supply apparatus 90. FIG.

The resin material receiving part 16 is arrange | positioned just under the supply port 121. The resin material receiving part 16 is a container which receives the said powdered resin material P when discharging it, without supplying powdered resin material P to the resin material feed tray T as mentioned later.

Moreover, the resin material supply apparatus 10 has the conveyance mechanism 15. The transfer mechanism 15 holds the resin material transfer tray T and is disposed at a position between the supply port 121 and the resin material receiver 16 to supply an arbitrary position in the resin material transfer tray T. The resin material transfer tray T is moved substantially horizontally so that the resin material transfer tray T can be disposed directly below the sphere 121, and the resin material transfer tray T supplied with the powdered resin material P is transferred above the lower mold. It is a mechanism to do it. When discharging the powdered resin material P without supplying it to the resin material conveying tray T, the conveying mechanism 15 moves the resin material conveying tray T from immediately below the supply port 121, thereby The upper resin material P is introduced into the resin material receiving portion 16. Instead of arranging the resin material receiving portion 16 immediately under the supply port 121, the resin material receiving portion 16 is directly provided on the supply opening 121 when discharging the powdered resin material P. You may make it move down.

In addition, although the metering part 14 is corresponded to the 1st metering part 94 in the conventional resin material supply apparatus 90, the weight of the resin material holding | maintenance part 91 (the powdery resin material P hold | maintained there) Together with the function of the first metering unit 94 to measure the weight of the resin), the resin material is conveyed from the amount of decrease in weight when the powdered resin material P is supplied to the resin material conveying tray T. It also has a function of measuring the supply amount of the resin material to the tray T. Therefore, the resin material supply apparatus 10 of this embodiment is not provided with the 2nd metering part 96 in the conventional resin material supply apparatus 90, and the structure of an apparatus is simplified by this. It is.

Above the resin material holding | maintenance part 11, it has the original supply part 17 which supplies powdery resin material P to the said resin material holding | maintenance part 11. As shown in FIG. The source supply part 17 has a source supply port 171 which is an opening for supplying the powdered resin material P to the resin material holding part 11 and a source supply part excitation part which vibrates the source supply part 17 at its lower part. 172 is provided.

The resin material supply apparatus 10 further has the control part 19. The control unit 19 is implemented by hardware and software of a computer, and includes a powder supply control unit 191 and a discharge control unit 192. The powder supply control part 191 controls the operation | movement of each part at the time of supplying powdery resin material P to the resin material feed tray T. As shown in FIG. The discharge control part 192 controls the operation | movement of each part at the time of discharging powdery resin material P in the trough 12 (and the resin material holding | maintenance part 11 as needed) to the resin material receiving part 16. FIG. It is.

(2) Operation of the resin material supply apparatus of this embodiment and the resin material supply method of this embodiment

Hereinafter, the operation | movement (resin material supply method of this embodiment) of the resin material supply apparatus 10 of this embodiment containing the detail of the control performed by the powder supply control part 191 and the discharge control part 192 is FIG. It demonstrates using FIG.

(2-1) Operation of the resin material supply device 10 at the start of supply of the powdered resin material P

FIG. 2 is a flowchart showing the operation of the resin material supply device 10 when starting the supply of the powdered resin material P. As shown in FIG.

In advance, the operator supplies the powdery resin material P to the original supply part 17. And the operation | movement of the resin material supply apparatus 10 is started by an operator performing predetermined operation using input devices, such as a touch panel (not shown) provided in the resin material supply apparatus 10. FIG. This predetermined operation includes an operation of inputting a condition of the resin material, such as a kind of the resin material to be supplied to the resin material transfer tray T, a designated flow rate, or the like.

First, the discharge control part 192 acquires data of the weight measured by the measurement part 14 (step S1). Wherein the weight w obtained from the weighing unit 14, a resin material holding section 11 and the weight of the tare weight of the sum of the trough (12) (tare weight) w _0, and their resin material holding portion 11 and the trough (12 ), the sum of the weight of the resin material, the weight w ₁ of the powder on the resin materials (P) present in the. Since tare weight w ₀ is constant, if the weight w obtained from the metering section 14 is greater than the tare weight w ₀ is, the powder on the resin material (P) used to sikyeoteul before operating a resin material supply unit 10 to the It remains in the resin material holding | maintenance part 11 and / or the trough 12. In step S2, the discharge control unit 192 determines whether the weight w acquired from the metering unit 14 is greater than the tare weight w ₀ . If YES in step S2, the flow advances to step S3, and if NO, the flow advances to step S8.

In step S3 (YES in step S2), the discharge control unit 192 determines whether or not the predetermined deterioration start time (for example, eight hours) has elapsed since the resin material supply device 10 was previously operated. . The recording (log file) of the time when the last resin material supply device 10 was operated is left in the recording unit (not shown) of the device, and the discharge control unit 192 makes the determination based on this recording. The deterioration start time is obtained by stopping the resin material supply device 10 after the last use, so that the powdered resin material P remains in the trough 12, whereby the powdered resin material P deteriorates. It is time to become unsuitable. In the case of YES in step S3, the flow goes to step S5, and in the case of NO, the flow goes to step S4.

In step S4 (NO in step S3), the discharge control unit 192 compares the type of resin material input by the operator at the start of operation with the type of resin material used during the previous operation recorded in the log file. It is determined whether or not both are the same. If YES in step S4, the process proceeds to step S7. If NO, the process proceeds to step S5.

In step S5 (YES in step S3 or NO in step S4), first, the discharge control unit 192 transfers the resin material transfer tray T so that the resin material transfer tray T is not disposed immediately below the supply port 121. After controlling the position of the mechanism 15, the excitation portion 13 is controlled so as to vibrate the excitation portion 13 to the maximum strength, whereby the powdery phase in the resin material holding portion 11 and the trough 12 is controlled. The resin material P is discharged to the resin material receiving portion 16. Discharge control section 192 acquires the data of the weight by the weighing unit 14, the weighing, the weight of the tare weight w at almost the same time with _zero, the powder in the resin material, the holding part 11 and the trough 12 It is judged that all the resin material P was discharged, and the vibration of the excitation part 13 is stopped. Thereby, it can prevent that powdery resin material P of the kind different from what is deteriorated or differs from what is supplied to this resin material conveyance tray T by mistake is supplied to the resin material conveyance tray T. Next, the discharge control part 192 vibrates the original supply part excitation part 172 so that sufficient amount of powdery resin material P may be supplied from the original supply part 17 to the resin material holding part 11 (step S6). After this operation, the process proceeds to step S8.

In step S7 (YES in step S4), the discharge control unit 192 compares the specified flow rate input by the operator at the start of operation with the specified flow rate used in the previous operation recorded in the log file. Determine if it is the same. When this determination result is YES, since it means that the powder-like resin material P of the kind which should be supplied to the resin material transfer tray T exists in the trough 12 by the quantity corresponding to a designated flow volume, The preparation for supplying the powdered resin material P is completed. On the other hand, when the determination result is No, it progresses to step S8.

At the time of starting step S8, the powdery resin material P of the quantity which does not correspond to the designated flow volume of the kind to be supplied remains in the trough 12 (when it determines with No in step S7). (A) of FIG. 3). In step S8, the discharge control unit 192 controls the excitation unit 13 to vibrate at an intensity corresponding to the designated flow rate input by the operator at the start of the operation. Thereby, the powdery resin material P of the quantity corresponding to a designated flow volume is supplied from the resin material holding | maintenance part 11 to the trough 12. FIG. In that case, in this embodiment, powder quantity of the quantity as much as what is supplied to one resin material conveyance tray T on the same conditions as when supplying powdery resin material P to resin material conveyance tray T is carried out. The resin material P is supplied from the resin material holding part 11 to the trough 12, and this operation is repeated several times. However, such an operation is not essential in the present invention. For example, a predetermined amount of powdery resin material P may be supplied from the resin material holding unit 11 to the trough 12 in one operation.

When the powdered resin material P does not exist in the trough 12 at the start, when the powdered resin material P is gradually supplied into the trough 12 and reaches the supply port 121, the trough The powdery resin material P in an amount corresponding to the designated flow rate is evenly spread over the entire inside of the 12. On the other hand, when the powdered resin material P in an amount not corresponding to the designated flow rate remained in the trough 12 at the start, the powdered resin material P was supplied at a new designated flow rate. It moves to the supply port 121 side so that it may be extruded gradually by the material P (FIG. 3 (b)), and the whole inside of the trough 12 is substituted by the powdery resin material P of the quantity corresponding to a predetermined flow volume. ((C) of the same drawing). In either case, the preparation for supplying the powdered resin material P is completed by this operation.

After the preparation for supplying the powdered resin material P is completed as described above, the powder supply control unit 191 has a transport mechanism 15 holding the resin material transport tray T disposed immediately below the supply port 121. The transfer mechanism 15 is controlled so as to. And the powder supply control part 191 excites the excitation part 13 with the intensity | strength corresponding to the designated flow volume, and powder-like for one part of the resin material feed tray T than the result measured by the measurement part 14. The excitation of the excitation part 13 is stopped when the resin material P decreases, and the said quantity of powdery resin material P is supplied to the resin material transfer tray T. As shown in FIG. Thereafter, the resin material conveying tray T to which the powdered resin material P is supplied is moved from directly under the supply port 121, and the empty resin material conveyance to which the powdered resin material P should be supplied next. The transfer mechanism 15 is controlled so that the tray T is disposed directly below the supply port 121. The operation of supplying the powdered resin material P to these resin material transfer trays T is repeatedly performed until the operator inputs a command for stopping or a command for changing the condition of the resin material. .

(2-2) Operation when the condition of the resin material is changed during the operation of the resin material supply device 10

FIG. 4 is a flowchart showing an operation when the conditions (condition of the resin material) for supplying the powdered resin material P to the resin material transfer tray T are changed during the operation of the resin material supply device 10.

When the operator inputs a command to change the condition of the resin material during the operation of the resin material supply device 10, the discharge control unit 192 firstly, directly under the supply port 121, the resin material transfer tray T. Is controlled so that the position of the transfer mechanism 15 is controlled so that the resin material receiving portion 16 is disposed just below the supply port 121 (step S11).

Next, the discharge control part 192 determines whether the kind of resin material currently supplied and the kind of resin material which the operator inputted are the same (step S12). If YES in step S12, the flow advances to step S15. If NO, the flow goes to step S13.

In step S13, the discharge control unit 192 controls the excitation unit 13 to vibrate the excitation unit 13 to the maximum intensity. Thereby, the powdery resin material P of the kind before a change which remain | survives in the resin material holding | maintenance part 11 and the trough 12 is discharged | emitted to the resin material receiving part 16. As shown in FIG. Discharge control section 192 acquires the data of the weight by the weighing unit 14, the weighing, the weight of the tare weight w in substantially the same binary point and _zero, the powder in the resin material, the holding part 11 and the trough 12 It is judged that all the resin material P was discharged, and the vibration of the excitation part 13 is stopped. Next, the discharge control part 192 vibrates the original supply part excitation part 172 so that sufficient amount of powdery resin material P may be supplied from the original supply part 17 to the resin material holding part 11 (step S14). After this operation, the process proceeds to step S15.

In step S15, the discharge control unit 192 controls the excitation unit 13 to vibrate at an intensity corresponding to the designated flow rate. At that time, when the operator inputs a command to change the designated flow rate as a condition of the resin material, the amount of the quantity corresponding to the new specified flow rate is caused by vibrating the excitation section 13 at an intensity corresponding to the designated flow rate after the change. The powdered resin material P is supplied from the resin material holding part 11 to the trough 12. On the other hand, when a command for changing only the type of the resin material is input as the condition of the resin material, the excitation unit 13 is vibrated at the strength corresponding to the specified flow rate as before the change of the condition of the resin material, whereby The corresponding amount of powdered resin material P is supplied from the resin material holding part 11 to the empty trough 12. At this time, the supply operation of the powdery resin material P may also be repeatedly supplied a plurality of times as much as the supply to the one resin material transfer tray T, similarly to the start of the operation described above. You may supply resin material P by one operation.

By the operation of the above step S15, the preparation for supplying the powdered resin material P under the new conditions is completed. Thereafter, the resin material transfer tray T is disposed directly below the supply port 121. The powder supply control unit 191 can supply the powdery resin material P to the resin material transfer tray T by performing the same operation as that at the start of the operation described above.

(3) One embodiment of the resin molding apparatus (compression molding apparatus) and the resin molded article manufacturing method of the present embodiment

The resin molding apparatus of this embodiment has the above-mentioned resin material supply apparatus 10 and the compression molding part 20. Hereinafter, the structure of the compression molding part 20 is demonstrated using FIG.

Tie bars 22 (four in total) are placed in each of the four corners of the lower fixing plate 211, and the compression molded part 20 has a rectangular shape near the upper end of the tie bars 22. An upper fixing plate 212 is provided. A rectangular movable platen 23 is provided between the lower fixing plate 211 and the upper fixing plate 212. The movable platen 23 is provided with holes through which the tie bars 22 pass at four corners, and is movable up and down along the tie bars 22. On the lower fixing plate 211, a mold clamping device 24 which is a device for moving the movable platen 23 up and down is provided.

The lower heater 251 is arrange | positioned at the upper surface of the movable platen 23, and the lower mold | type LM is provided on the lower heater 251. The mold release film coating apparatus 26 is provided in lower mold | type LM. The release film coating apparatus 26 installs a release film on the cavity MC, and then draws a release film on the inner surface of the cavity MC by sucking from a suction port (not shown) provided on the inner surface of the cavity MC. To cover.

An upper heater 252 is disposed on a lower surface of the upper fixing plate 212, and an upper mold UM is mounted below the upper heater 252. On the lower surface of the upper mold UM, the substrate S on which the semiconductor chip is mounted can be mounted.

The operation of the compression molded part 20 is as follows. First, the board | substrate S in which the semiconductor chip was mounted is mounted on the lower surface of the upper mold UM by a board | substrate movement mechanism (not shown). At the same time, the release film is placed on the inner surface of the cavity MC of the lower mold LM by the release film coating device 26. Next, as described above, the resin material feed tray T to which the resin material P is supplied in the resin material supply device 10 is transferred directly to the lower mold LM by the transfer mechanism 15, and the resin material By opening the shutter provided at the bottom of the transfer tray T, the resin material P in the resin material transfer tray T is supplied into the cavity MC. In addition, you may attach the board | substrate S to the upper mold | type UM, and supply of the resin material P to the lower mold | type LM may be performed in the opposite order to the above.

In this state, the resin material P in the cavity MC is softened by the lower heater 251 to soften, and the substrate S is heated by the upper heater 252. In the state where the resin material P and the board | substrate S were heated, the movable platen 23 is raised by the mold clamping apparatus 24, and the mold clamping (upper mold UM and lower mold LM) is clamped. And the resin material P is hardened. After the resin material P is cured, the mold is opened by lowering the movable platen 23 by the mold clamping device 24.

By the operation (resin molded article manufacturing method) of the resin material supply apparatus 10 and the compression molding part 20 demonstrated above, the resin sealing article (resin molded article) by which the semiconductor chip was resin-sealed is manufactured. The obtained resin sealing article is smoothly mold-released from the lower mold | type LM by the inner surface of the lower mold | type LM being coat | covered with a release film.

Next, another embodiment of the resin molding apparatus according to the present invention will be described with reference to FIG. 6. The resin molding apparatus 30 of this embodiment has a material import module 31, a molding module 32, and a dispensing module 33. The material import module 31 is an apparatus for receiving the resin material P and the board | substrate S from the outside, and sending it to the shaping | molding module 32, Comprising: The above-mentioned resin material supply apparatus 10 is provided, and the board | substrate It has an import part 311. One shaping | molding module 32 is provided with one set of the compression shaping | molding part 20 mentioned above. Although three shaping | molding modules 32 are shown in FIG. 6, the number of shaping | molding modules 32 can be provided in the resin shaping | molding apparatus 30 arbitrary. Moreover, even after the resin molding apparatus 30 is assembled and the use is started, the molding module 32 can be increased or decreased. The dispensing module 33 carries in and holds the resin molded article manufactured by the molding module 32 from the molding module 32, and has a resin molded article holding unit 331.

Note for conveying the substrate S, the resin material transfer tray T, and the resin molded article so as to pass through the material import module 31, one or more molding modules 32, and the dispensing module 33. The conveying apparatus 36 is provided. The above-mentioned transfer mechanism 15 constitutes part of the main transport device 36. Moreover, in each module, the sub conveyance apparatus 37 which conveys the board | substrate S, the resin material conveyance tray T, and the resin molded article between the main conveyance apparatus 36 and the apparatus in the said module. Is provided.

In addition, the resin molding apparatus 30 has a power supply and a control part (all are not shown) for operating each said module.

The operation of the resin molding apparatus 30 will be described. The board | substrate S is hold | maintained in the board | substrate import part 311 of the material import module 31 by an operator. The main conveying apparatus 36 and the sub conveying apparatus 37 convey the board | substrate S from the board | substrate import part 311 to the compression molding part 20 in one of the shaping | molding modules 32, and a board | substrate ( S) is attached to the upper mold UM of the compression-molded part 20. Next, the main conveying apparatus 36 and the sub conveying apparatus 37 carry the resin material feed tray T into the resin material supply apparatus 10. In the resin material supply device 10, the resin material P is supplied to the resin material transfer tray T as described above. The main conveying apparatus 36 and the sub conveying apparatus 37 of the shaping | molding module 32 with which the resin material conveying tray T to which the resin material P was supplied are attached to the upper mold UM are attached to the board | substrate S. After conveying to the compression molding part 20 and arrange | positioning the resin material conveyance tray T on the lower mold | type LM of the said compression shaping | molding part 20, from the resin material conveyance tray T, the lower mold | type LM of The resin material P is supplied to the cavity MC. Thereafter, the resin material transport tray T is taken out from the compression molding section 20 by the main transport device 36 and the sub transport device 37, and then compression molding is performed in the compression molding section 20. Do it. While performing compression molding in the compression molding unit 20, the same operation as for the other compression molding unit 20 is performed so as to delay the time in the plurality of compression molding units 20 in parallel ( Compression molding can be performed. The resin molded article obtained by compression molding is carried out from the compression molded part 20 by the main conveying apparatus 36 and the sub conveying apparatus 37, and is carried in the resin molded product holding part 331 of the dispensing module 33, and maintain. The user can take out the resin molded article from the resin molded article holding part 331 suitably.

Needless to say, the present invention is not limited to the above embodiments, and various modifications are possible.

10, 90... Resin material feeder
11, 91... Resin material holding part
12, 92... Trough
121, 921... Supply port
13, 93... Aftershock
14... Weighing
15, 95... Transport mechanism
16... Resin material receiving part
17... Supply Division
171... Supply port
172... Source Supply Section
19 ... Control
191... Powder supply control unit
192... Discharge control
20... Compression molding
211... Lower fixing plate
212... Upper fixing plate
22... Thai Bar
23 ... Operation platen
24 ... Clamping device
251... Bottom heater
252... Upper heater
26... Release film coating device
30... Resin molding equipment
31... Material import module
311... Board Import Department
32... Molding module
33 ... Dispensing module
331... Resin molded article holding part
36... Main Carrier
37... Subconveyor
94... 1st weighing unit
96.. 2nd weighing unit
LM… Hype
MC… Cavity
P… Powdered resin material
S… Board
T… Resin material transfer tray (feed object)
UM… avoirdupois

Claims (10)

a) a resin material holding portion for holding a powdery resin material;
b) a trough for supplying the resin material held by the resin material holding part connected to the resin material holding part to a supply object;
c) an excitation portion for vibrating the resin material holding portion and the trough;
d) a weight measuring unit for measuring the weight of the resin material holding unit and the trough including the resin material;
e) powder for positioning the supply object at the outlet of the trough and setting the vibration intensity of the excitation section to supply the resin material to the supply object at a specified flow rate based on the weight value measured by the weight measuring unit. (粉體) supply control unit,
f) when the conditions of the resin material to be supplied to the object to be supplied are changed, the resin material receiving part is located at the outlet of the trough, and the discharge control unit for discharging the resin material remaining in the trough to the resin material receiving part is provided. Resin material supply apparatus characterized by the above-mentioned. The method according to claim 1,
The condition is a specified flow rate,
And the discharge control unit controls the excitation unit to discharge the resin material remaining in the trough to the resin material receiving unit at the specified flow rate when the condition is changed. The method according to claim 1,
The condition is a kind of resin material,
And the discharge control unit controls the excitation unit to discharge the resin material remaining in the resin material holding unit to the resin material receiving unit when the condition is changed. As the resin material supply apparatus in any one of Claims 1-3,
When the discharge control part resumes the operation of the resin material supply device after a predetermined time elapses from when the resin material supply device stops, the resin material holding part is placed at the outlet of the trough. And controlling the excitation portion to discharge the resin material remaining in the trough to the resin material receiving portion. A resin material holding step of holding the powdery resin material in the resin material holding part;
Excitation part with vibration intensity set so that resin material may be supplied to the supply object located in the outlet of the said trough based on the weight value which measured the weight of the trough connected to the said resin material holding part and the said resin material holding part. A powder supply step of supplying the resin material to the supply object at the specified flow rate by vibrating the resin material holding part and the trough by
When the condition of the resin material to be supplied to the supply object is changed by the discharge control unit, a discharge step of placing the resin material receiver at the outlet of the trough and discharging the resin material remaining in the trough to the resin material receiver is performed. Resin material supply method characterized by having. The method according to claim 5,
The condition is a specified flow rate,
In the discharge step, the excitation portion is controlled to discharge the resin material remaining in the trough to the resin material receiving portion at the specified flow rate when the condition is changed. The method according to claim 5,
The condition is a kind of resin material,
In the discharging step, when the conditions are changed, the resin material remaining in the resin material holding part is discharged to the resin material receiving part. As a resin material supply method as described in any one of Claims 5-7,
When the discharge control section resumes the operation of the resin material supply device after a predetermined time elapses from when the operation by the resin material supply method stops, the resin material receiver is placed at the outlet of the trough. And controlling the excitation unit to discharge the resin material remaining in the resin material holding unit and the trough to the resin material receiving unit. The resin material supply apparatus as described in any one of Claims 1-3,
A compression molded part having an upper mold, a lower mold having a cavity, a mold clamping mechanism for clamping the upper mold and the lower mold,
And a conveying part for transferring the supply object supplied with the powdery resin material by the resin material supply device onto the cavity, and supplying the resin material from the supply object to the cavity. The process of supplying powdery resin material to the said supply object by the resin material supply method as described in any one of Claims 5-7,
Transferring the supply object supplied with the resin material to the cavity of the lower mold, and supplying the resin material from the supply object to the cavity;
And a step of clamping the upper mold and the lower mold supplied with the resin material to the cavity.

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