KR101937527B1 - Thermal Emitter and manufacturing method thereof - Google Patents
Thermal Emitter and manufacturing method thereof Download PDFInfo
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- KR101937527B1 KR101937527B1 KR1020160058928A KR20160058928A KR101937527B1 KR 101937527 B1 KR101937527 B1 KR 101937527B1 KR 1020160058928 A KR1020160058928 A KR 1020160058928A KR 20160058928 A KR20160058928 A KR 20160058928A KR 101937527 B1 KR101937527 B1 KR 101937527B1
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- 238000004519 manufacturing process Methods 0.000 title abstract description 10
- 239000004038 photonic crystal Substances 0.000 claims abstract description 180
- 230000005855 radiation Effects 0.000 claims abstract description 91
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000001228 spectrum Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 12
- 229910052715 tantalum Inorganic materials 0.000 claims description 10
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000002485 combustion reaction Methods 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 abstract description 5
- 238000000295 emission spectrum Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
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- 238000005530 etching Methods 0.000 description 3
- 230000005457 Black-body radiation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 241000487918 Acacia argyrodendron Species 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000011222 chang cao shi Nutrition 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000025 interference lithography Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
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- 238000000427 thin-film deposition Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/40—Thermal components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S10/00—PV power plants; Combinations of PV energy systems with other systems for the generation of electric power
- H02S10/30—Thermophotovoltaic systems
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/40—Thermal components
- H02S40/44—Means to utilise heat energy, e.g. hybrid systems producing warm water and electricity at the same time
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/60—Thermal-PV hybrids
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
A heat radiation body capable of controlling the radiation energy wavelength of a thermal body by a simple process and capable of increasing the radiation efficiency of a desired wavelength region and a manufacturing method thereof are proposed. The heat radiant body according to the present invention includes a heat radiating part for radiating energy inside the radiating body; A second photonic crystal layer having a first refractive index and a second photonic crystal layer having a shape corresponding to a two-dimensional shape having a second refractive index different from the first refractive index; And a heat radiation promoting layer including a layer.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation body and a method of manufacturing the same, and more particularly, to a heat radiation body capable of adjusting a radiation energy wavelength of a heat radiation body by a simple process, .
The photothermal conversion device is a device for converting thermal energy into electric energy and is becoming a candidate for a next generation secondary battery in that it can be made light in weight with high energy density. However, it is still necessary to improve efficiency in order to replace lithium batteries, which are currently widely used as secondary batteries.
The photovoltaic conversion device consists of a combustor that burns fossil fuel and generates heat energy, a thermal body that receives thermal energy to emit radiant energy, and a photoelectric cell that converts radiation energy into electric energy.
The phototransformer is driven by raising the temperature of a heat source by burning the fuel through a combustor and supplying electric energy generated by the photovoltaic cell to the device. In this case, the compatibility of each component such as a combustor, a thermal body, a photoelectric cell, and a device circuit determines the overall efficiency of the photodetector. Particularly, a radiant emission distribution by wavelength of a thermal body is a key element of energy conversion efficiency .
In order to realize a high-efficiency photodetector, the maximum radiant emission interval of the thermal body must coincide with the maximum blackbody radiation wavelength band of the driving temperature, and the quantum efficiency distribution of the photovoltaic cell must coincide with the corresponding wavelength band. Such a heat radiation body is disadvantageous in that the radiation efficiency is lowered toward a longer wavelength. Further, if the temperature of the heat radiation object is raised, the pattern shape may collapse, and an additional protective film process is required to prevent this.
SUMMARY OF THE INVENTION The present invention has been conceived to solve the above problems, and it is an object of the present invention to provide a thermal body capable of controlling a radiation energy wavelength of a thermal body by a simple process, And a manufacturing method thereof.
According to an aspect of the present invention, there is provided a heat radar comprising: a heat radiating part for radiating energy inside the radiating part; A second photonic crystal layer having a first refractive index and a second photonic crystal layer having a shape corresponding to a two-dimensional shape having a second refractive index different from the first refractive index; And a heat radiation promoting layer including a layer.
The heat radiating portion may include any one of tantalum, tungsten, nickel, molybdenum, silicon carbide, and silicon substrates. The first photonic crystal layer may be formed of the same material as the heat radiation portion.
The heat radiation promotion layer may be formed by interlocking the first photonic crystal structure of the first photonic crystal layer and the second photonic crystal structure of the second photonic crystal layer.
The first photonic crystal structure formed on the first photonic crystal layer may have a diameter of 0.5 to 4 mu m and a depth of 0.2 to 8 mu m.
The second photonic crystal layer may be one comprising aluminum oxide, silica, and hafnium oxide.
The second refractive index may be 0.4 to 2.8.
The emissivity spectrum of the heat radiation promoting layer can be shifted to the long wavelength region compared with the emissivity spectrum of the first photonic crystal layer.
The thickness of the heat radiation promoting layer may be 2 to 6 占 퐉.
The difference between the first refractive index and the second refractive index may be 0.5 to 10.
According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a second photonic crystal structure of a two-dimensional shape on a second layer having a second refractive index; And forming a first layer of a shape corresponding to the two-dimensional shape, the first layer having a first refractive index different from the second refractive index on the second layer; And forming a heat radiation portion on the first layer, the heat radiation portion radiating the energy inside the first layer as radiant energy.
According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a second photonic crystal structure of a two-dimensional shape on a second layer having a second refractive index; And forming a heat radiation plate having a first refractive index different from the second refractive index on the second layer to form a heat radiation plate having a first photonic crystal structure corresponding to a two- Method is provided.
According to another aspect of the present invention, there is provided a combustion apparatus comprising: a combustion unit generating heat energy; A first photonic crystal layer having a first refractive index and a second refractive index different from the first refractive index, and a second photonic crystal layer having a second refractive index different from the first refractive index, A thermal radiation unit including a heat radiation facilitating layer including a second photonic crystal layer having a shape corresponding to the shape of the first photonic crystal layer; And a photoelectric conversion unit that receives radiation energy emitted from the heat radiation part and converts the radiation energy into electric energy.
As described above, according to the embodiments of the present invention, a photonic crystal structure can be introduced on the surface of a thermal image to increase the radiation efficiency of a specific wavelength.
In addition, the heat radiation body according to the present invention additionally forms a layer covering the photonic crystal structure, so that it is easy to control the radiation energy wavelength, thereby exhibiting excellent radiation efficiency.
In addition, when a thermal body is manufactured according to the present invention, it is possible to form a pattern on a dielectric substrate that is easier to form than a photonic crystal structure in a metal or the like, to easily form a photonic crystal structure pattern and precisely control the wavelength of a thermal body Whereby a highly reliable photodetector can be obtained.
1 is a cross-sectional view of a thermal body according to an embodiment of the present invention.
FIG. 2 is a view showing a first photonic crystal layer and a second photonic crystal layer in the thermal body of FIG. 1. FIG.
3 is an enlarged view of the first photonic crystal structure of FIG.
4 is a view showing an emissivity spectrum when a first photonic crystal structure is formed on a tantalum thermal radiation article and an emissivity spectrum when a second photonic crystal layer of aluminum oxide is additionally formed, FIG. 6 is a graph showing the emissivity spectrum in the case where the photonic crystal structure is formed and the emissivity spectrum in the case where the second photonic crystal layer is further formed. FIG. And FIG. 5 is a diagram showing the emissivity spectrum and the emissivity spectrum in the case where the second photonic crystal layer is further formed.
7 is a cross-sectional view of a thermal body according to another embodiment of the present invention.
8 is a cross-sectional view of a thermal body according to another embodiment of the present invention.
9 to 12 are views showing photonic crystal structures according to still another embodiment of the present invention.
FIGS. 13 to 15 are views provided in the description of a method for manufacturing a heat radome according to another embodiment of the present invention.
16 is a cross-sectional view of a thermal body according to another embodiment of the present invention.
FIG. 17 is a view showing a photodetector according to another embodiment of the present invention. FIG.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to enable those skilled in the art to more fully understand the present invention. It should be understood that while the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, The present invention is not limited thereto.
1 is a cross-sectional view of a thermal body according to an embodiment of the present invention. The
The
A
The photonic crystal is intended to control light by using a special interaction of nanostructure and light corresponding to the visible light region, and it is possible to control the reflection and selective light transmission characteristics by changing the arrangement among the particles, It is possible to increase the emission efficiency of a desired wavelength band by forming a photonic crystal structure on the surface. In other words, when the photonic crystal structure is formed in the
The wavelength-related radiation efficiency of the
FIG. 2 is a view showing a first photonic crystal layer and a second photonic crystal layer in the thermal body of FIG. 1. FIG. The second
The second
In the absence of the second
However, if the second
The second
3 is an enlarged view of the first photonic crystal structure of FIG. The first
As described above, the emissivity spectrum of the heat radiation facilitating layer including both the first
4 is a view showing an emissivity spectrum when a first photonic crystal structure is formed on a tantalum thermal radiation article and an emissivity spectrum when a second photonic crystal layer of aluminum oxide is additionally formed, FIG. 6 is a graph showing the emissivity spectrum in the case where the photonic crystal structure is formed and the emissivity spectrum in the case where the second photonic crystal layer is further formed. FIG. And FIG. 5 is a diagram showing the emissivity spectrum and the emissivity spectrum in the case where the second photonic crystal layer is further formed.
Fig. 4 is a graph showing the emission spectrum (black line) of a tantalum thermal radiation material having a cylindrical photonic crystal pattern having a depth of 2.2 탆 and a radius of 380 nm formed at a period of 1 탆 and an emission spectrum (Red line). In the case of the red line, it can be seen that the emission spectrum of the tantalum thermal radiation shown by the black line is shifted to the long wavelength region.
Fig. 5 shows the emission spectrum (black line) of a tungsten heat radiation material having a cylindrical photonic crystal pattern with a depth of 2.2 탆 and a radius of 380 nm formed at a period of 1 탆 and an emission spectrum (black line) when aluminum oxide was added to the tungsten heat radiation material as a second photonic crystal layer (Red line). In the case of the red line, it can be seen that the emission spectrum of the tungsten heat radiation body shown by the black line is shifted to the long wavelength region.
Fig. 6 is a diagram showing the emission spectrum when the size of the pattern is increased. Fig. A radiation spectrum (black line) of a tantalum thermal radiation article having a cylindrical photonic crystal pattern with a depth of 2.2 m and a radius of 0.6 m and an emission spectrum when aluminum oxide was added to the tantalum thermal radiation body in Fig. 4 as a second photonic crystal layer FIG. That is, in the present embodiment, when the diameter of the photonic crystal pattern is increased in the tantalum thermal radiation body, the emission spectrum moves to the long wavelength region, and even when the second photonic crystal layer is added instead of increasing the diameter of the photonic crystal pattern, You can see that it moves. In the case of the red line, the emission spectrum is extended to the longer wavelength side as compared with the black line.
7 is a cross-sectional view of a thermal body according to another embodiment of the present invention. In the
The second
8 is a cross-sectional view of a thermal body according to another embodiment of the present invention. In the
The second photonic crystal layer 330 is formed in the form of a thin film layer along the first photonic crystal structure of the first
9 to 12 are views showing photonic crystal structures according to still another embodiment of the present invention. 9 to 12 show examples of a photonic crystal structure, that is, a photonic crystal pattern. The photonic crystal pattern of FIG. 9 is a cylindrical structure, the photonic crystal pattern of FIG. 10 is hemispherical, the photonic crystal pattern of FIG. 11 is conical, and the photonic crystal pattern of FIG. The shape and size of the pattern can be selected in consideration of the desired radiation spectrum or wavelength region.
FIGS. 13 to 15 are views provided in the description of a method for manufacturing a heat radome according to another embodiment of the present invention. According to the present embodiment, a step of forming a second
The
Since the first layer is in contact with the thermal body, the first layer may be formed of metal so that internal thermal energy can be transmitted. In the case of metal, a method of directly patterning and etching the metal such as photolithography or laser interference lithography is used to make a pattern on a metal surface. Since the structural parameters (period, diameter, and depth) of the photonic crystal pattern determine the radiation spectrum, it is necessary to precisely control the shape of the pattern. However, due to the unique properties of the metal, have.
On the other hand, since the dielectric can freely adjust the shape of the pattern, the dielectric substrate of the desired pattern is fabricated into the second layer, and then the first layer is laminated thereon (see FIG. 14) The first photonic crystal structure can be formed. Therefore, it is possible to realize photonic crystals of various structures and finer sizes that are difficult to realize in the conventional direct etching method.
Accordingly, by using a method of forming a pattern on a dielectric surface and laminating a heat radiating material, time and cost can be reduced as compared with a conventional patterning process through etching.
A
16 is a cross-sectional view of a thermal body according to another embodiment of the present invention. According to this embodiment, a step of forming a second
In this embodiment, instead of forming the first layer on the
FIG. 17 is a view showing a photodetector according to another embodiment of the present invention. FIG. According to this embodiment, a
The
In order to increase the efficiency of the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, many modifications and changes may be made by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.
100, 200, 300, 400, 500
110, 210, 310, 410, 510, 1210,
120, 220, 320, 420, 1220 The first photonic crystal layer
121, 521 First photonic crystal structure
130, 230, 330, 430, 530, 1230. The second photonic crystal layer
131, 431 Second photonic crystal structure
340 Third Floor
1000 thermal conversion device
1100 Combustion Unit
Claims (12)
And a heat dissipation member disposed on an energy-emitting surface from which the radiation energy of the heat-
A first photonic crystal layer in which a first photonic crystal structure of a two-dimensional shape having a first refractive index is formed and
And a second radiation confinement layer including a second photonic crystal layer having a second photonic crystal structure having a shape corresponding to the two-dimensional shape having a second refractive index different from the first refractive index,
The first photonic crystal structure and the second photonic crystal structure are interdigitated,
The second photonic crystal layer is a layer covering the first photonic crystal structure of the first photonic crystal layer,
The refractive index of the second photonic crystal layer is higher than the refractive index of air,
The refractive index of the second photonic crystal layer is higher than the refractive index of air and the emissivity spectrum of the heat radiation facilitating layer including the first photonic crystal layer and the second photonic crystal layer does not have the second photonic crystal layer, Is shifted to a longer wavelength region than the emissivity spectrum.
Wherein the heat radiating portion includes any one of tantalum, tungsten, nickel, molybdenum, silicon carbide, and a silicon substrate.
Wherein the first photonic crystal layer is formed of the same material as the heat radiation portion.
Wherein the first photonic crystal structure formed on the first photonic crystal layer has a diameter of 0.5 to 4 占 퐉 and a depth of 0.2 to 8 占 퐉.
Wherein the second photonic crystal layer comprises any one of aluminum oxide, silica, and hafnium oxide.
Wherein the second refractive index is higher than the refractive index of air and is 2.8 or lower.
Wherein the heat radiation facilitating layer has a thickness of 2 to 6 占 퐉.
Wherein the difference between the first refractive index and the second refractive index is 0.5 to 10.
A first photonic crystal layer having a two-dimensional first photonic crystal structure having a first refractive index formed on an energy-emitting surface from which the radiant energy is emitted, and a second photonic crystal layer having a first refractive index, And a second photonic crystal layer having a second photonic crystal structure of a shape corresponding to the two-dimensional shape having a second refractive index different from the refractive index of the second photonic crystal layer; And
And a photoelectric conversion unit that receives the radiation energy emitted from the thermal radiation unit and converts the radiation energy into electric energy,
The heat-
The first photonic crystal structure and the second photonic crystal structure are interdigitated,
The second photonic crystal layer is a layer covering the first photonic crystal structure of the first photonic crystal layer,
The refractive index of the second photonic crystal layer is higher than the refractive index of air,
The refractive index of the second photonic crystal layer is higher than the refractive index of air and the emissivity spectrum of the heat radiation facilitating layer including the first photonic crystal layer and the second photonic crystal layer does not have the second photonic crystal layer, Is shifted to a longer wavelength region than an emissivity spectrum.
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KR1020160058928A KR101937527B1 (en) | 2016-05-13 | 2016-05-13 | Thermal Emitter and manufacturing method thereof |
PCT/KR2017/004929 WO2017196115A1 (en) | 2016-05-13 | 2017-05-12 | Thermal radiator and manufacturing method therefor |
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KR1020160058928A KR101937527B1 (en) | 2016-05-13 | 2016-05-13 | Thermal Emitter and manufacturing method thereof |
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KR102106686B1 (en) * | 2018-02-22 | 2020-05-04 | 연세대학교 산학협력단 | Image device using photonic crystal, recording method of the same and method of fabricating the same |
KR102190420B1 (en) * | 2018-12-18 | 2020-12-11 | 경희대학교 산학협력단 | Cerium Oxide-based Photonic Crystal Thermal Emitter Having High-temperature Stability and Method for Preparing the Same |
Citations (2)
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US20030132705A1 (en) * | 2001-08-27 | 2003-07-17 | Gee James M. | Photonically engineered incandescent emitter |
US20110284059A1 (en) * | 2010-05-21 | 2011-11-24 | Massachusetts Institute Of Technology | Thermophotovoltaic energy generation |
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CA2444831A1 (en) * | 2003-10-10 | 2005-04-10 | Alberta Research Council Inc. | Thermophotovoltaic device with selective emitter |
US20050109386A1 (en) * | 2003-11-10 | 2005-05-26 | Practical Technology, Inc. | System and method for enhanced thermophotovoltaic generation |
US9400219B2 (en) * | 2009-05-19 | 2016-07-26 | Iowa State University Research Foundation, Inc. | Metallic layer-by-layer photonic crystals for linearly-polarized thermal emission and thermophotovoltaic device including same |
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2016
- 2016-05-13 KR KR1020160058928A patent/KR101937527B1/en active IP Right Grant
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2017
- 2017-05-12 WO PCT/KR2017/004929 patent/WO2017196115A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20030132705A1 (en) * | 2001-08-27 | 2003-07-17 | Gee James M. | Photonically engineered incandescent emitter |
US20110284059A1 (en) * | 2010-05-21 | 2011-11-24 | Massachusetts Institute Of Technology | Thermophotovoltaic energy generation |
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KR20170127965A (en) | 2017-11-22 |
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