KR101920283B1 - Semiconductor and display process data backup device - Google Patents

Abstract

A semiconductor process data backup device is disclosed. A semiconductor process data backup apparatus according to an embodiment of the present invention includes a main board having a PC connector at a rear end thereof and a vertical connector at an upper surface thereof; A vertical board mounted on the vertical connector and having a plurality of first slimline connectors horizontally arranged on an upper part of a front surface thereof; A plurality of interface boards mounted horizontally through a second slimline connector corresponding to one of the plurality of first slimline connectors; And a plurality of storage disks detachable with respect to each of the plurality of interface boards, wherein at least one of the plurality of storage disks is used as a main disk and the other is used as a backup disk, and the main disk and the backup An MCU may be mounted to manage the backup operation of the disk.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an industrial multi-

The present invention relates to industrial multifunctional data backup devices for semiconductor and display processes.

In general, various manufacturing facilities are used for the process of manufacturing semiconductors and displays. In order to improve the yield of the process, uniformity of the quality is required, and certain process data is required for this. Semiconductor and display process data contain various environmental condition data such as temperature, time, pressure, and heat, and these data play an important role in manufacturing semiconductors and displays of consistent quality.

Semiconductor and display manufacturing facilities may be shut down for maintenance, and abnormal stoppage may occur due to an accident such as a power failure. In this case, if the process data is not secured in advance, it becomes difficult to produce a semiconductor and a display of the same quality as before. Thus, a semiconductor and display manufacturing facility is equipped with a storage device for storing data generated during the process. However, since various data are frequently recorded or read in the storage device, the storage device may be damaged due to deterioration of the storage device. If the storage device fails, timely recorded data can not be used, making it difficult to set up and operate the semiconductor and display manufacturing processes.

To solve this problem, semiconductor and display manufacturing facilities store process data using a plurality of independent Redundant Array of Inexpensive Disks (RAID). The main storage device and the backup device are used to ensure the stability of data preservation.

However, a typical backup is simply about data. If the main disk of the main storage device fails, after installing the operating system (OS) after formatting, install the driver according to the usage environment and install the program that was used before I had to go. And by re-moving the backed up data, it was reusable. That is, in case of main disk error, it was possible to use it again after 6 steps of format -> OS installation -> driver installation -> program installation -> data copy.

In the semiconductor and display manufacturing lines of the industrial field, such a complicated reuse process leads to a large loss in time and cost.

Korean Patent Publication No. 10-2016-0101705 (published on August 25, 2016) - Semiconductor process management system including process management apparatus, data server interworking with the process management apparatus, and semiconductor process management method using the same

The present invention relates to an industrial multifunctional data backup apparatus for a semiconductor and a display process, which enables a normal semiconductor process to be performed by replacing semiconductor, display process data, OS, drivers, programs, .

An object of the present invention is to provide an industry-specific multifunctional data backup device for a semiconductor and a display process, which enables stable back-up of semiconductor process data, thereby allowing the system to operate continuously without interruption.

Other objects of the present invention will become more apparent through the following preferred embodiments.

According to an aspect of the present invention, there is provided a display device including a main board having a PC connector at a rear end thereof and a vertical connector at an upper surface thereof; A vertical board mounted on the vertical connector and having a plurality of first slimline connectors horizontally arranged on an upper part of a front surface thereof; A plurality of interface boards mounted horizontally through a second slimline connector corresponding to one of the plurality of first slimline connectors; And a plurality of storage disks detachable with respect to each of the plurality of interface boards, wherein at least one of the plurality of storage disks is used as a main disk and the other is used as a backup disk, and the main disk and the backup There is provided an apparatus for backing up semiconductor process data, characterized in that an MCU for managing the backup operation of the disc is mounted.

The storage disk may be an M.2 SSD or an NVME SSD.

When the storage disk is connected to the disk connector, the SSD interface of the NGFF method is converted into the second slimline connector corresponding to the first slimline connector, .

The interface board can be attached and detached in a slider manner through a slide guide provided on an intermediate plate spaced a predetermined distance from the upper surface of the main board.

The vertical connector may be a PCIEX connector that stabilizes bus flow of data.

The backup disk may back up the operating system (OS), driver, and program together with the semiconductor and display process data stored in the main disk in one of the periodic repeated backup, scheduled backup, and immediate backup.

If there are two backup disks, the backup scheme may be individually configurable.

DC 12 V of the DC power input to the main board through the PC connector may be switched to 5 V to be used as a main power source of the RAID controller of the main board and DC 5 V may be used as a main power source of the plurality of storage disks.

In order to stably cope with an instantaneous peak voltage, the power supply unit of the storage disk may have a structure in which one or more tantalum capacitors are mounted at each input and output ends, respectively.

The MCU can receive all information of the storage disk through the second slimline connector, the first slimline connector, and the vertical connector, and display the information on the LCD.

The MCU can turn on and off the storage disk according to a set value by operating a switching IC.

And a front cover installed on a front surface of a case including the main board, the vertical board, the plurality of interface boards, and the plurality of storage disks, wherein the LCD display device mounted on the front cover and the main board It is possible to prevent problems even when the front cover is opened and closed by using an FPC (Flexible Printed Circuit) and an FFC (Flexible Flat Cable).

The PC connector may be a SATA system or an IDE system.

Other aspects, features, and advantages will become apparent from the following drawings, claims, and detailed description of the invention.

According to the embodiment of the present invention, not only the semiconductor and display process data, but also OS, driver, program, and the like are backed up so that normal semiconductor process can be performed by replacing with a backup disk in case of a main disk error.

In addition, there is an effect that the semiconductor process data can be reliably backed up so that the system can be continuously operated without interruption.

1 is a perspective view showing the outline of a semiconductor and display process multi-function data backup apparatus according to an embodiment of the present invention,
2 is a perspective view showing a main board and a vertical board of a semiconductor and display process multi-function data backup device,
3 is a perspective view showing an interface board and an adapter connected to the vertical board,
4 is a perspective view showing a guide panel for installing an adapter,
5 is a perspective view showing a state in which an adapter is installed on a guide panel,
FIG. 6A is a perspective view showing a rear surface of a semiconductor and display process multi-function backup apparatus according to an embodiment,
FIG. 6B is a perspective view showing the back surface of the semiconductor and display process multi-function backup apparatus according to another embodiment,
7 is a block diagram of the configuration of a disk power source,
8 is a configuration block diagram of the main board power supply.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

It is to be understood that the components of the embodiments described with reference to the drawings are not limited to the embodiments and may be embodied in other embodiments without departing from the spirit of the invention. It is to be understood that although the description is omitted, multiple embodiments may be implemented again in one integrated embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

2 is a perspective view showing a main board and a vertical board of a semiconductor device and a display process multifunctional data backup apparatus, and FIG. 3 is a perspective view of the multi- 4 is a perspective view showing a guide panel for installing an adapter, FIG. 5 is a perspective view showing a state in which an adapter is installed in a guide panel, FIG. 6A is a perspective view of the interface board and adapter, And FIG. 6B is a perspective view showing a back surface of a semiconductor and display process multi-function backup apparatus according to another embodiment.

1 to 8 show a semiconductor device and a display process multifunctional data backup device 1, a front cover 10, an LCD 11, a status display LED 12, an operation button 13, a lock portion 14, The main board 40, the vertical connector 42, the PC connector 44, the micro USB 45, the IDE connector 46, the vertical board 50, the first slim line 50, The connector 52, the interface board 60, the second slimline connector 62, the disk connector 64, the key knob 66, the storage disk 70, the intermediate plate 80, and the slide guide 82 Respectively.

A semiconductor device and a display process multifunctional data backup device 1 according to an embodiment of the present invention are installed in a semiconductor semiconductor and display manufacturing facility to store semiconductor and display process data and are provided with three or more storage disks Even if the main disk fails, continuous processing can be performed without interruption of the semiconductor process through a plurality of backup disks. Hereinafter, it will be assumed that there are three storage disks.

The multifunctional data backup apparatus 1 of the semiconductor and display process according to the present embodiment includes a case 20 including a front cover 10, a main board 40, a vertical board 50, an interface board 60, (70).

The case 20 is a part for protecting the built-in main board 40, the vertical board 50, the interface board 60 and the storage disk 70. The case 20 can be detachably attached to a rack provided in a semiconductor manufacturing facility I have. The fixing guide 30 is a bracket for fixing to the rack and can be installed on both sides of the case 20. [

In this embodiment, the case 20 has the same size as a general 3.5 inch hard disk, and can be directly inserted into a 1U server provided in a semiconductor and display manufacturing facility. Or it can be used as a general hard disk or SSD replacement.

A front cover 10 provided with an LCD 11, a status display LED 12, an operation button 13 and a locking portion 14 is installed on the front surface of the case 20.

The front cover 10 has an opening-closing structure, which facilitates replacement of the disk. The LCD 11 is connected to the main board 40 by using an FPC (Flexible Printed Circuit) or an FFC (Flexible Flat Cable), thereby preventing the front cover 10 from being opened and closed. In addition, the front cover 10 has a structure in which the LCD 11 can be opened and closed, so that a small space utilization can be efficiently applied.

The LCD 11 displays the status of the storage disk 70 and displays various information necessary for backup.

The status display LED 12 indicates the operation status of the storage disk 70 and is set to correspond to three storage disks 70 arranged horizontally in the casing 20 with three LEDs arranged horizontally . For example, the LED may be set to emit blue light when the corresponding storage disk is in a normal or standby state, blink in blue while data is being read, and red in an error state.

The operation button 13 is a portion receiving a user input. Operations such as periodic backup, immediate backup, scheduled backup, etc. for the first backup disk R2 and the second backup disk B1 in addition to the main disk R1 can be set through the operation button 13. [

The locking portion 14 locks or unlocks the front cover 10 with a key lock for security and detachment prevention of the storage disk 70.

When the lock portion 14 is unlocked, the front cover 10 can rotate around the lower hinge axis, thereby facilitating the attachment / detachment of the storage disk 70 inside the case 20. [

A plurality of LEDs (not shown) may be installed on the rear surface of the case 20 to indicate all the states of the semiconductor process data backup apparatus 1. [ It is possible to easily grasp the current state of the semiconductor process data backup apparatus 1 from the outside by combining the display states of the plurality of LEDs.

2 to 6, the main board 40 is installed on the lower surface of the case 20 in a horizontal direction. The main board 40 is connected to the front cover 10 so as to receive user input by the operation button 13 and to control the LCD 11 and the status display LED 12.

An MCU for controlling the operation of the storage disk 70 is mounted on the main board 40 so that the storage disk 70 can be periodically backed up, immediately backed up, scheduled backup, and the like. The MCU can turn on / off the storage disk 70 according to the set value by operating the switching IC.

A PC connector 44 is provided at the rear end of the main board 40. The PC connector 44 is connected to a semiconductor and display manufacturing facility in which the semiconductor and display process multi-function data backup apparatus 1 is installed to receive power and perform various data input / . In this embodiment, the PC connector 44 may be a SATA connector as shown in Fig. 6A. Micro USB 45 is provided beside the PC connector 44 to receive various disk information such as the disk backup position in the multifunctional backup device through communication with the PC.

Alternatively, the PC connector 44 may be an IDE connector as shown in FIG. 6B. IDE connectors could be applied to lines using older production facilities.

Three storage disks 70 are horizontally disposed on the same plane on the main board 40 so as to have the maximum placement efficiency in a limited space.

The interface board 60 on which the storage disk 70 is installed is installed in a horizontal direction and the vertical board 50 for connecting the interface board 60 and the main board 40 is provided.

The vertical board (50) is fitted into a vertical connector (42) provided on the main board (40). In this embodiment, the vertical connector 42 can apply a PCIEX connector with a good bandwidth to stabilize the data bus flow between the interface board 60 and the main board 40.

A first slimline connector 52 for connection with the interface board 60 is provided on the front surface of the vertical board 50. The first slimline connectors 52 may be arranged horizontally in the same manner as the number of the interface boards 60.

The number of the interface boards 60 may be the same as the number of the storage disks 70. A second slimline connector 62 for connection with the vertical board 50 is provided at the rear end of the interface board 60. The second slimline connector 62 is fitted to the first slimline connector 52 so that the interface board 60 and the vertical board 50 are connected to each other. In this embodiment, the SATA scheme may be applied to the first slimline connector 52 and the second slimline connector 62.

Three interface boards 60 are horizontally arranged so that three storage disks 70 can be mounted in a horizontal 3 bay system.

A slide guide 82 for guiding installation of the interface board 60 may be installed on the intermediate plate 80 spaced apart from the main board 40 by a predetermined distance. Three slide guides 82 are horizontally arranged to guide the interface board 60 to be disposed corresponding to the first slimline connector 52 of the vertical board 50.

A second slim line connector 62 provided at the rear end of the interface board 60 is connected to the vertical board 62. The second slim line connector 62 is provided at the rear of the interface board 60, To be smoothly connected at the same height as the first slimline connector (52) of the first slimline connector (50).

One storage disk 70 may be installed in one interface board 60. To this end, a disk connector 64 is provided on the upper surface of the interface board 60, to which the input / output terminals of the storage disk 70 are fitted.

And a key knob 66 may be provided at a position spaced apart from the disc connector 64 by a length corresponding to the storage disc 70 forward. The key knob 66 may be a spring key knob type having a '?' Shape. The upper latching portion is rotatable so that the front end of the storage disk 70 can be fixed by making the upper latching portion rearward after the storage disk 70 is installed. When the storage disk 70 is detached, the upper latching portion is turned forward so that the storage disk 70 is smoothly separated from the interface board 60.

The storage disks 70 may be mounted one by one for each interface board 60.

The storage disk 70 may be a M.2 SSD or an NVME type solid state drive (SSD), which is a next generation storage disk.

The storage disk 70 is inserted into the disk connector 64 of the interface board 60. The disk connector 64 is applied with an NGFF type SSD interface.

The mounting method of the storage disk 70 is as follows.

A method of mounting the storage disk 70 on the interface board 60 is as follows. The storage disk 70 is inserted into the disk connector 64 at an inclination of 25 degrees so that the bottom surface of the rear end of the storage disk 70 contacts the ramp. Then, the storage disk 70 is rotated to be horizontal. Then, the key knob 66 described above is brought to a fixed position to fix the storage disk 70.

The interface board 60 on which the storage disk 70 is mounted is slid along the slide guide 82 on the intermediate plate 80 so that the second slimline connector 62 is connected to the first slimline connector 52 , The mounting of the storage disk 70 can be completed.

The attachment and detachment of the storage disk 70 can be easily performed through an opposite process to the mounting of the storage disk 70.

The interface board 60 on which the storage disk 70 is mounted serves as an adapter for converting the NGFF type SSD interface to the slimline SATA connector 62.

In this specification, a case where three storage disks 70 are horizontally arranged has a horizontal 3-bay structure will be described.

One of the three storage disks functions as a main disk, and the remaining two storage disks can function as a first backup disk and a second backup disk. Alternatively, you can use two disks as the main disk and one disk as the backup disk.

The main disk may be connected to a semiconductor manufacturing facility so that semiconductor process data required for performing a semiconductor process can be read out and used for a semiconductor process or new semiconductor process data can be recorded.

The first backup disk and the second backup disk are storage means for backing up not only semiconductor process data stored in the main disk but also all data such as an operating system (OS), a driver, and a program.

The backup operation between the main disk and the first and second backup disks can be managed by the MCU which is a backup controller provided in the main board 40. [

In this embodiment, the data line is first shut off when the data is shifted between the main disk and the backup disks, and the power is shut off to stabilize the data.

Between the main disk and the backup disks, the following backup operations are possible due to the MCU of the backup controller structure. It is possible to perform regular periodic repeated backup based on time and date. It also has a scheduled backup function that allows backups to be made at a preset time in advance. You can also have a backup feature that you can back up immediately at a convenient time.

If there are two backup disks, the periodic backup and the scheduled backup may be set separately for each backup disk. This is to ensure that one of the two backup disks has a current copy of the main disk.

In order to ensure the accuracy of the backup time, the semiconductor process data backup device 1 may have a structure that is time-synchronized with the semiconductor manufacturing facility (or a computing device that operates the same).

Fig. 7 is a block diagram of a configuration of a disk power source, and Fig. 8 is a configuration block diagram of a main board power supply.

In the present embodiment, a power distribution scheme in which DC 12V is used as a main power source of the main board 40 and DC 5V is branched and supplied to a main power source of the storage disk 70 to apply a stable power distribution is applied.

Referring to FIG. 7, a configuration for supplying power (3.3 V) to the storage disk 70 is shown.

The vertical board 50 includes a first tantalum capacitor 110 and a regulator 120.

The first tantalum capacitor 110 is connected in parallel to at least one 5V power line input from the switching power of the semiconductor manufacturing facility connected to the vertical board 50 via the main board 40, Prevent current in advance.

The regulator 120 may be a low dropout positive voltage regulator that lowers the 5V power supply to 3.3V. It is possible to provide a stable 3.3 V through the regulator 120.

The interface board 60 includes a second tantalum capacitor 140.

The output terminal of the regulator 120 and the input terminal of the storage disk 70 through the slimline connectors 52 and 62 between the vertical board 50 and the interface board 60 are connected to one or more second tantalum capacitors 140 can be connected in parallel to stably cope with an instantaneous peak voltage that may occur during the connection of the storage disk 70.

That is, one or more tantalum capacitors may be provided in the input unit, one or more in the output unit, and an inductor may be mounted on the power supply unit of the storage disk 70 to stably respond to the instantaneous peak voltage.

Referring to FIG. 8, a configuration for supplying a power source 12V to the main board 40 is shown. The main power source 210 receives 12 V at the switching power of the semiconductor manufacturing facility. The 12V supply is switched to a 5V supply at the step-down switching regulator 220. Therefore, the main board 40 has a structure in which DC 12V is supplied by being switched to DC 5V.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It will be understood that the invention may be varied and varied without departing from the scope of the invention.

1: Semiconductor process data backup device 10: Front cover
11: LCD 12: Status LED
13: operation button 14:
20: Case 30: Fixed guide
40: main board 42: vertical connector
44: PC connector 45: USB connector
50: vertical board 52: first slim line connector
60: Interface board 62: Second slimline connector
64: disk connector 66: key knob
70: Storage disk 80: Intermediate plate
82: Slide guide

Claims (13)

A main board having a PC connector at a rear end thereof and a vertical connector at an upper surface thereof;
A vertical board mounted on the vertical connector and having a plurality of first slimline connectors horizontally arranged on an upper part of a front surface thereof;
A plurality of interface boards mounted horizontally through a second slimline connector corresponding to one of the plurality of first slimline connectors; And
And a plurality of storage disks detachable with respect to each of the plurality of interface boards,
Wherein at least one of the plurality of storage disks is used as a main disk and the other is used as a backup disk, and an MCU for managing a backup operation of the main disk and the backup disk is mounted on the main board. Industrial multifunctional data backup device.
The method according to claim 1,
Wherein the storage disk is an M.2 SSD or NVME SSD. ≪ RTI ID = 0.0 > 11. < / RTI >
3. The method of claim 2,
The interface board is provided with a disk connector, which is an NGFF type SSD interface,
And an SSD interface of the NGFF system is converted into the second slimline connector corresponding to the first slimline connector when the storage disk is connected to the disk connector. .
The method according to claim 1,
Wherein the interface board is detachably attached to the main board in a slider manner through a slide guide provided on an intermediate plate spaced apart from the upper surface of the main board.
The method according to claim 1,
Wherein the vertical connector is a PCIEX connector for stabilizing bus flow of data.
The method according to claim 1,
Wherein the backup disk is backed up by a backup method of operating system (OS), driver and program together with semiconductor and display process data stored in the main disk in one of a cyclic repeated backup, a scheduled backup and an immediate backup. Industrial multifunctional data backup device.
The method according to claim 6,
Wherein the backup method is individually configurable when there are two backup disks. ≪ Desc / Clms Page number 19 >
The method according to claim 1,
DC 12 V of the DC power input to the main board through the PC connector is switched to 3.3 V to be used as a main power source of the RAID controller of the main board and DC 5 V is used as a main power source of the plurality of storage disks Industrial multifunctional data backup device for semiconductor and display processes.
9. The method of claim 8,
Wherein at least one tantalum capacitor is mounted on each of the disc bays and one or more tantalum capacitors are mounted on the output stage in order to stably cope with an instantaneous peak voltage in the power supply unit of the storage disc. Data backup device.
The method according to claim 1,
And the MCU receives all the information of the storage disk through the second slimline connector, the first slimline connector, and the vertical connector, and displays the received information on the LCD. Industrial Multifunctional Data Backup Device for Semiconductor and Display Process .
The method according to claim 1,
Wherein the MCU activates a switching IC to turn on and off the storage disk according to a set value.


delete The method according to claim 1,
Wherein the PC connector is applied with a SATA system or an IDE system.

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