KR101819142B1 - Thin antena module and preparation method thereof - Google Patents

Abstract

A thin antenna module including a thin circuit board and a flexible magnetic sheet disposed on one surface of the thin circuit board includes a flexible base film and an antenna pattern. All are landfilled. Therefore, the thin antenna module can be mounted on various electronic products requiring light weight and miniaturization because the thin antenna module is very thin and flexible, has excellent adhesion between components, and can be manufactured in an efficient and simple manner.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a thin antenna module,

The present invention relates to a thin antenna module that can be used for NFC and wireless charging applications, and a method of manufacturing the same.

Recently, mobile devices such as mobile phones, tablet PCs, and notebook PCs are equipped with antennas for realizing near field communication (NFC) functions, wireless charging functions, or other functions.

However, there are other parts of the metal material inside the mobile device, and when an alternating magnetic field formed inside the device is applied to such a metal part, eddy current is generated, thereby deteriorating the performance of the antenna, .

In order to solve this problem, the magnetic sheet is attracted to the antenna by bonding the magnetic sheet having the high permeability to the antenna, so that the magnetic sheet can concentrate the magnetic flux of the antenna to prevent magnetic field penetration into the metal surface and generation of eddy currents, However, when the magnetic sheet is bonded to the antenna and mounted in the mobile device, various components are mounted on the antenna, which limits the efficiency of the inner space of the mobile device. If adhesion between the antenna and the magnetic sheet is poor, peeling may occur. If the adhesive layer is provided to prevent such peeling, another problem that the entire thickness of the antenna module becomes thick is caused.

Korean Patent Registration No. 1318453 discloses a method of reducing the thickness and adhesion of an antenna module by directly pressing a metal wire (coil) on a magnetic sheet including metal particles and a binder without using an insulating layer. However, since the conventional art uses only a metal wire that does not require an insulating layer as an antenna, only a simple coil-shaped antenna pattern can be formed, so that it does not meet the demand for a complex type antenna for various functions. In addition, in order to be used in an internal space such as a recent mobile device, flexibility of the module is often required.

Therefore, it is necessary to develop a new thin antenna module which is capable of complicated antenna pattern such as a printed circuit, but is excellent in adhesion and flexibility between components.

Korean Patent No. 1318453

It is an object of the present invention to provide a thin antenna module capable of antenna patterns of various shapes and excellent in adhesion and flexibility between components, and a method for efficiently manufacturing the antenna module.

The present invention A flexible substrate film; An antenna pattern formed on a surface of the flexible substrate film; And a flexible magnetic sheet disposed on a surface of the flexible substrate film on which the antenna pattern is formed, wherein a part or the whole of the antenna pattern is embedded in the flexible magnetic sheet.

(1) forming an antenna pattern on the surface of the flexible base film; (2) A method for manufacturing a thin antenna module, comprising the step of laminating a flexible magnetic sheet on a surface of the flexible substrate film on which an antenna pattern is formed, and embedding a part or the whole of the antenna pattern in the flexible magnetic sheet do.

The thin antenna module of the present invention is flexible and has various shapes of antenna patterns, which are thin, thin, and excellent in adhesion between constituent components, on a flexible base sheet having an antenna pattern formed on its surface.

In addition, when the energy absorbing member is included on the surface of the flexible substrate film and a part of the conductive pattern is buried after the groove is formed, the adhesion of the antenna pattern can be improved while making the antenna module thinner.

Accordingly, the thin antenna module can be applied to various electronic products requiring light weight and miniaturization.

1A to 1C are sectional views showing an example of a thin antenna module according to the present invention.
2 is a cross-sectional view showing an example of a configuration in which antenna patterns are embedded in the grooves of the flexible base film.
3 is a cross-sectional view showing an example of a configuration in which an antenna pattern is embedded in a flexible magnetic sheet.
4A and 4B are plan views showing an example of the antenna pattern.
5 shows an example of a method of manufacturing a thin circuit board which is a component of the thin antenna module.
6 shows an example of a method of manufacturing a thin antenna module by laminating a thin circuit board and a flexible magnetic sheet.

Hereinafter, the present invention will be described more specifically with reference to the drawings.

In the following detailed description, it is to be understood that when an individual layer, film or sheet is described as being formed "on" another layer, film or sheet, "on" Or " indirectly "through " another element ".

1A to 1C are sectional views showing an example of a thin antenna module according to the present invention.

1A to 1C, a thin antenna module of the present invention includes a flexible base film 100; An antenna pattern 210 formed on the surface of the flexible base film 100; And a flexible magnetic sheet 300 disposed on a surface of the flexible substrate film 100 on which the antenna pattern 210 is formed and a part or all of the antenna pattern 210 is formed on the flexible magnetic sheet 300 Landfill.

At this time, the flexible substrate film 100 and the antenna pattern 210 formed on the surface thereof constitute a flexible thin circuit board 250. Accordingly, the thin antenna module may include a flexible thin circuit board 250 and a flexible magnetic sheet 300 disposed on one side of the thin circuit board 250.

Hereinafter, each component will be described in more detail.

The flexible base film 100 may contain an insulating polymer resin, an energy absorber, an additive, or the like, and may have grooves on its surface.

For example, the flexible substrate film 100 includes an energy absorber on its surface or a surface thereof and has grooves on its surface. At least part of the portions of the antenna pattern that are not embedded in the flexible magnetic sheet of the antenna pattern Can be buried.

The flexible base film 100 may include an insulating polymer resin.

The insulating polymer resin may be an insulating polymer resin used in a general flexible circuit board. Specifically, the insulating polymer resin may be at least one selected from the group consisting of polyimide (PI), polyamide (PA), polycarbonate (PC), polyethersulfone (PES), epoxy resin, acrylic resin, acrylonitrile-butadiene- ), Polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP) or the like, or polymer resins in which two or more of them are copolymerized or blended.

The insulating polymer resin may be contained in the flexible substrate film in an amount of 50 to 99% by weight.

As shown in FIG. 2, the flexible substrate film 100 may include an energy absorber 150 inside or on the surface thereof. The energy absorbing member 150 may be uniformly dispersed on the inside and / or the surface of the flexible base film 100.

The energy absorbing material is not particularly limited as long as it is a material that absorbs the energy when irradiating external energy. For example, the energy absorbing material may be a material that absorbs and releases external energy, thereby decomposing or changing the surrounding material. Further, the energy absorber absorbs external energy, and can be changed (denatured, transformed, telephoneized or activated) by itself. Accordingly, the energy absorbing material changes the surrounding material (and itself) by external energy irradiation, thereby activating the plating in the plating step and improving the adhesion with the antenna pattern. In addition, the energy absorber can easily implement an antenna pattern having various shapes by selective energy irradiation on the surface of the flexible base film.

The mechanism of the activation of the plating by the energy absorber and the improvement of the adhesion of the antenna pattern is not clear but is presumed to be the mechanism described below. When energy is irradiated, the energy absorber absorbs the energy and is excited into the conduction band in the valence band, and the energy absorber becomes instantly hot. As a result, the surrounding flexible substrate is melted or decomposed to form a groove, and the surface of the groove is formed to be very rough compared with other portions. By plating on the surface of such a very rough groove, the plating adhesion improves and the plating activity is promoted by electrons excited by the conduction band. Accordingly, when electroless plating is performed to form the antenna pattern, the plating can be performed very stably without the usual pretreatment of palladium (Pd).

That is, the energy absorber may include a material which generates excitation of electrons in the valence band in the valence band by energy irradiation. The energy absorbing material may be a material having a band gap corresponding to the energy to be irradiated.

For example, when irradiating a UV laser, the energy absorber may be a material having a band gap of at least about 2.5 eV, and most of the metal oxides may be included therein. As another example, when a visible light laser is irradiated, the energy absorber may be a material having a band gap of about 1 eV to 3 eV. Or a material capable of absorbing visible light energy by doping a material having a band gap corresponding to UV light energy with another element. As another example, when irradiating an IR laser, it may be a material having a band gap energy of about 1.5 eV or less. Thus, the energy absorber may be a laser absorber.

The energy absorber may include at least one selected from the group consisting of metals, metal oxides, metal hydroxides, carbon-based materials, and carbon oxides.

As an example, the energy absorber may be a material comprising a metal and / or a metal oxide. At this time, the material including the metal or metal oxide is not particularly limited as long as it is a metal or a metal oxide that absorbs energy such as a laser to be irradiated. For example, the metals include alkali metals, alkaline earth metals, lanthanide metals, actinide metals, transition metals, transition metals and metalloids. As an example, the transition metal includes Cu, Ti, Cr, and combinations thereof. In addition, the metal may include Al, Ga, In, Sn, Tl, Pb, Bi, and combinations thereof. The metalloid includes B, Si, Ge, As, Sb, Te, Po, and combinations thereof. Specific examples of the metal oxide include cerium oxide, magnesium oxide, titanium oxide, zinc oxide, copper oxide, cerium oxide, niobium oxide, tantalum oxide, yttrium oxide, zirconium oxide, aluminum oxide, chromium oxide, ₃ , MgZrSrTiO ₆ , MgTiO ₃ , MgAl ₂ O ₄ , BaZrO ₃ , BaSnO ₃ , BaNb ₂ O ₆ , BaTa ₂ O ₆ , WO ₃ , MnO ₂ , SrZrO ₃ , SnTiO ₄ , ZrTiO ₄ , CaZrO ₃ , CaSnO ₃ , There may be mentioned CaWO ₄ , MgTa ₂ O ₆ , MgZrO ₃ , La ₂ O ₃ , CaZrO ₃ , MgSnO ₃ , MgNb ₂ O ₆ , SrNb ₂ O ₆ , MgTa ₂ O ₆ , Ta ₂ O ₃ , .

As another example, the energy absorber may be a material containing a carbon-based material and / or a carbon oxide. At this time, the material including the carbon-based material or the carbon oxide is not particularly limited as long as it is a carbon-based material or a carbon oxide that absorbs energy such as a laser to be irradiated. The carbon-based material may be a carbon isotope consisting only of carbon. Or the carbon-based material may be a material containing about 90% or more, about 95% or more, or about 99% or more of carbon. For example, the carbon-based material includes graphene, graphite, carbon fiber, carbon nanotube, carbon black, activated carbon, graphene oxide, graphite oxide and the like.

As a preferable example, the energy absorber may include at least one selected from the group consisting of TiO ₂ , Al ₂ O ₃ , copper chromium oxide, graphite oxide and carbon black.

The energy absorber may be in the form of particles. The energy absorbing material may be particles having a particle diameter of 0.01 to 100 탆, more specifically 0.01 to 10 탆.

The energy absorbing material may be contained in an amount of 1 to 70% by weight, specifically 1 to 50% by weight, more preferably 1 to 30% by weight, based on the weight of the flexible substrate film.

The energy absorber may be formed of a seed promoting electroless plating by external energy. Specifically, the energy absorber may be chemically / physically changed by external energy and formed of the seed. That is, energy is externally applied to the energy absorber, whereby the energy absorber can be denatured, deformed, dialed, or activated to the seed.

The seed may have a relatively higher activity than the energy absorber. That is, the energy absorber may be denatured, transformed, dialed or activated so as to have higher reactivity by the external energy. Accordingly, the seed can promote the plating in the plating process to have an activity high enough to perform an active site function.

5, the energy 500 is irradiated to a part of the surface of the flexible base material film 100 containing the energy absorber, and the energy absorber present in the energy irradiated area instantaneously reaches a high temperature do. Accordingly, grooves 110 are formed by melting or decomposing the insulating polymer resin, and seeds formed by modifying, deforming, converting, or activating the energy absorbing material may be present on the inner surface of the grooves 110. That is, the seed may be formed only in the region of the groove 110.

The seed may serve as an activation site for promoting plating by forming fine irregularities on the inner surface of the groove 110.

That is, the antenna pattern may be formed on the seed along the region where the seed exists, and as a result, the antenna pattern may be formed only in the groove among the surfaces of the flexible substrate film.

The flexible substrate film may further include a filler such as glass fiber or inorganic oxide. The inorganic oxide is preferably an inorganic oxide having a high dielectric constant. Accordingly, the inorganic oxide increases the dielectric constant of the flexible substrate film, and can be a substrate suitable for antenna manufacturing and the like. The inorganic oxide may be a metal oxide or a nonmetal inorganic oxide.

The inorganic oxide may be contained in an amount of about 1 to 30% by weight, more preferably about 5 to 15% by weight, based on the weight of the flexible substrate film.

The inorganic oxide may be dispersed and distributed in the flexible substrate film.

Further, the flexible substrate film may further include a flame retardant.

The flame retardant may be an inorganic flame retardant, an organic phosphorus flame retardant, a nitrogen flame retardant, or an organic halogen flame retardant.

Examples of the inorganic flame retardant include aluminum trihydroxide, magnesium dihydroxide, Huntite, hydro-magneite, hydrate, red phosphorus and borates. In addition, sulfonate salts such as potassium perfluorobutanesulfonate, Salts of alkali metals / alkaline earth metals (e.g., carbonates of alkali metals / alkaline earth metals), inorganic acid complex salts (e.g., fluoro anion complexes), and the like.

Examples of the organophosphorus flame retardant include organic phosphates such as triphenyl phosphate (TPP), resorcinol bis (diphenylphosphate) (RDP), bisphenol A diphenyl phosphate (BADP), tricresyl phosphate (TCP) and the like; Phosphonates such as dimethyl methylphosphonate (DMMP); And phosphinates such as aluminum diethylphosphinate. In addition, an organic phosphorus flame retardant having a halogen component is also possible.

Examples of the organic-based flame retardant include melamine phosphate (MP), nitrilotris (methylphosphonamidic acid), melamine cyanurate and the like.

Examples of the organic halogen-based flame retardant include organic chlorine-based flame retardants such as chlorinated acid derivatives and chlorinated paraffin; Decabromodiphenyl ethane, polymeric brominated compounds, brominated carbonate oligomers (BCO), brominated epoxy oligomers (BEO), tetrabromophthalic anhydride, tetrabromobisphenol A (TBBPA), hexa And organic bromine-based flame retardants such as bromocyclododecane (HBCD) and the like.

The flame retardant may be used alone or in combination of two or more of the exemplified materials, but is not limited to the above-exemplified materials.

The flame retardant may be contained in an amount of about 1 to 30% by weight, more preferably about 5 to 20% by weight, based on the weight of the flexible substrate film.

The flame retardant may be dispersed and distributed in the flexible substrate film.

In addition, the flexible substrate film may further include additives for color implementation, energy absorption and plating property improvement.

As shown in FIG. 2, the flexible substrate film 100 may have grooves 110 and 120 formed on its surface. That is, the flexible base film may have grooves formed on one surface or both surfaces thereof.

The antenna patterns 210 and 220 may be partially embedded in the grooves 110 and 120. Specifically, the depth d1 of the groove may be smaller than the height h1 of the antenna pattern.

For example, the depth d1 of the groove may be 70% to 90% of the height h1 of the antenna pattern. The depth d1 of the groove may be 10% to 90% of the thickness of the flexible base film 100.

Fine irregularities may be formed on the inner surface of the groove as described above. Also, on the inner surface of the groove, there may be a seed formed from the energy absorber as described above. For example, fine irregularities may be formed on the inner surface of the groove due to the seed.

The thickness of the flexible substrate film may be 10 탆 to about 500 탆, but may vary depending on the application, and is not particularly limited.

The antenna patterns 210 and 220 are formed on the surface of the flexible base film 100. 2, the antenna patterns 210 and 220 may be partially embedded in the grooves 110 and 120 formed on the surface of the flexible substrate film 100 in the thickness direction.

That is, a part of the antenna pattern may be located inside the groove. In addition, a part of the antenna pattern can directly contact the inner wall of the groove. As a result, the circuit board can be made thinner, the contact area between the antenna pattern and the flexible base film can be widened, and the bonding strength between the antenna pattern and the flexible base film can be increased.

3, the antenna pattern 210 may be at least partially or entirely embedded in the flexible magnetic sheet 300 in the thickness direction. The depth d2 of the antenna pattern 210 embedded in the surface of the flexible magnetic sheet 300 may be equal to or less than the height h2 of the antenna pattern 210. [

As the antenna pattern 210 is embedded in the flexible magnetic sheet 300, the antenna module can be thinned. In addition, the contact area between the antenna pattern 210 and the soft magnetic sheet 300 is widened through the embedding, so that the bonding strength between the antenna pattern 210 and the soft magnetic sheet 300 can be improved.

As an example, the flexible base film 100 may have a groove 110 formed on a surface facing the soft magnetic sheet 300. The antenna pattern 210 may be partially embedded in the groove 110.

At least a portion of the antenna pattern 210 that is not embedded in the flexible magnetic sheet 300 may be embedded in the groove 110. Particularly, in this case, since the antenna pattern 210 is partially buried in the flexible base film 100 and the flexible magnetic sheet 300 at a time, the antenna pattern 210 is embedded in the flexible base film 100, And the flexible magnetic sheet 300 can be further improved.

As another example, as shown in FIG. 2, the flexible base material film 100 may have a groove 120 formed in a surface that does not face the flexible magnetic sheet 300. The antenna pattern 220 may be partially embedded in the groove 120.

As another example, the flexible base film 100 may have a first groove 110 formed on a surface facing the soft magnetic sheet 300 and a second groove 120 formed on a surface that is not opposite to the first groove 110 have. The first antenna pattern 210 and the second antenna pattern 220 may be partially embedded in the first groove 110 and the second groove 120, respectively. At least a portion of the first antenna pattern 210 that is not embedded in the soft magnetic sheet 300 may be embedded in the first groove 110.

As another example, the antenna module of the present invention includes a first flexible magnetic sheet and a second flexible magnetic sheet on both sides of a thin circuit board, wherein the flexible base film constituting the thin circuit board includes a first flexible magnetic sheet And the first groove and the second groove on the surface facing the second flexible magnetic sheet, respectively. The first antenna pattern and the second antenna pattern may be partially embedded in the first groove and the second groove.

Preferably, the first antenna pattern is partially embedded in the first flexible magnetic sheet, and at least a portion of the first antenna pattern, which is not embedded in the first flexible magnetic sheet, Can be buried. The second antenna pattern may be partially embedded in the second flexible magnetic sheet, and at least a portion of the second antenna pattern not embedded in the second flexible magnetic sheet may be embedded in the second groove .

The antenna patterns 210 and 220 may include a conductive material. For example, these antenna patterns may comprise a conductive metal. Specifically, these antenna patterns may include one or more metals selected from the group consisting of copper, nickel, gold, silver, zinc and tin.

The antenna patterns 210 and 220 have a constant height (thickness) in a cross-sectional shape as shown in FIG. 4A and 4B are exemplary plan views of the antenna patterns 210 and 220, and the antenna pattern may have an antenna shape in a planar shape. Specifically, the antenna patterns 210 and 220 may have a predetermined height (thickness) in a cross-sectional shape, and may have an antenna shape in a planar shape.

The shape of the antenna pattern according to the present invention is not particularly limited, and may be, for example, a form of a coil capable of performing functions such as NFC, wireless charging, and RFID, and may be variously changed as needed. Accordingly, the antenna module can be used for various functions including an NFC antenna, a wireless charging antenna, and an RFID antenna. In addition, the antenna pattern may be a printed circuit pattern, and thus the flexible circuit board may be a printed circuit board.

In addition, the antenna patterns 210 and 220 may coincide with planar shapes of the grooves 110 and 120 when viewed in a plan view.

The thin circuit board 250 is excellent in adhesion force (adhesion) between the flexible base film 100 and the antenna patterns 110 and 120.

Specifically, the antenna patterns 110 and 120 may be more than 4B grade (Grade 4B) in the adhesion test according to ASTM D 3359 for the flexible base film 100, preferably 5B grade (Grade 5B) .

Here, the adhesion test according to ASTM D 3359 is performed by cutting a sample adhered to a substrate into a lattice-like piece as is well known in the related art, and then sticking the adhesive tape to the sample surface, (I.e., the number of sample pieces not separated due to the adhesive tape) is calculated, converted into a ratio with respect to the initial number of pieces, and classified into classes according to the categories. For example, if the ratio of the number of the remaining pieces to the initial number of pieces is 95% or more, it is classified as 4B (Grade 4B), and if it is 100%, it is classified as 5B (Grade 5B).

The flexible magnetic sheet 300 is disposed on the surface of the flexible base film 100 on which the antenna pattern is formed.

Specifically, the flexible magnetic sheet 300 is disposed so as to face the surface of the flexible base film 100 on which the antenna pattern 210 is formed. Accordingly, the antenna pattern 210 may be disposed between the flexible substrate film 100 and the flexible magnetic sheet 300.

The flexible magnetic sheet 300 may be disposed on only one side of the flexible base film 100 or on both sides thereof.

The flexible magnetic sheet contains a magnetic component. The magnetic component may be an oxide magnetic substance such as ferrite (NiZn-based, Mg-Zn-based or Mn-Zn-based ferrite), a metal magnetic substance such as permalloy and sendust, or a composite component thereof .

The flexible magnetic sheet may be a polymeric magnetic sheet (PMS). Specifically, the flexible magnetic sheet may contain a magnetic powder and a polymer resin (binder resin), and may also be a non-fired dry sheet.

The flexible magnetic sheet may use a magnetic sheet suitable for the use of the antenna module. For example, when the antenna module is used for shielding electromagnetic waves, a magnetic sheet having an electromagnetic wave shielding performance of 30 dB or more can be used. When the antenna module is used for wireless charging, a magnetic sheet having a permeability of 200 to 9,000 may be used. Further, when the antenna module is used for NFC, a magnetic sheet having a magnetic permeability of 100 to 300 can be used.

The thickness of the flexible magnetic sheet 300 may be 10 탆 to about 500 탆, but it may vary depending on the application, and is not particularly limited.

As shown in FIG. 1C, the thin antenna module may further include an adhesive layer 400 between the flexible circuit board 250 and the flexible magnetic sheet 300.

For example, the flexible base film 100 has a groove formed on a surface facing the flexible magnetic sheet 300, the antenna pattern 210 is partially embedded in the groove, An adhesive layer 400 may be provided between the flexible magnetic sheet 250 and the flexible magnetic sheet 300.

At this time, the thickness of the adhesive layer 400 is preferably smaller than the height of the antenna pattern 210. 1C, at least a portion of the antenna pattern 210 may be embedded in the flexible magnetic sheet 300 through the adhesive layer 400. In this case,

The adhesive layer 400 further improves the adhesion between the flexible substrate film 100, the flexible magnetic sheet 300, and the antenna pattern 210 disposed therebetween.

The adhesive layer may contain conventional adhesive components. For example, the adhesive layer may use a curable adhesive resin.

Examples of the resin that can be cured and exhibit adhesiveness include at least one functional group or moiety capable of being cured by heat such as a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group or an amide group, or an epoxide group, A resin containing at least one functional group or moiety capable of being cured by irradiation with an active energy ray such as a cyclic ether group, a sulfide group, an acetal group or a lactone group can be used .

Specifically, the curable adhesive resin may be an acrylic resin, a polyester resin, an isocyanate resin or an epoxy resin having at least one or more functional groups or sites as described above, but the present invention is not limited thereto

The thin antenna module has excellent flexibility (bending resistance). Specifically, the thin antenna module exhibits excellent folding endurance in an MIT folding test.

More specifically, the thin antenna module has a number of bending times until cutting at an MIT bending test under a condition of a test specimen of 1.5 x 10 cm, a load of 0.98 N, a bending radius of curvature radius (R) of 2 mm and a speed of 90 rpm Is more than 100 times. The number of times of bending until cutting may be 1,000 times or up to 10,000 times. Here, the MIT bend test may be a test according to ASTM D 2176, and may be performed under the condition of 60 to 120 °.

The thin antenna module comprises: (1) forming an antenna pattern on a surface of a flexible base film; And (2) laminating a flexible magnetic sheet on the surface of the flexible substrate film on which the antenna pattern is formed, and embedding a part or the whole of the antenna pattern in the flexible magnetic sheet.

Hereinafter, each step of the manufacturing method will be described in detail.

In the step (1), the antenna pattern is formed on the surface of the flexible base film.

For example, a first antenna pattern may be formed on one side of the flexible substrate sheet. In addition, a second antenna pattern may be further formed on the other surface of the flexible substrate sheet.

According to one embodiment, this step may be performed by a process that forms a typical printed circuit pattern.

According to another embodiment, referring to FIG. 5, this step includes the steps of: (1-1) preparing a flexible base film 100 including an energy absorber 150 inside or on a surface; (1-2) forming a groove 110 on the surface by selectively irradiating the flexible substrate film 100 with energy (500); And (1-3) forming an antenna pattern 210 partially buried in the groove 110 through plating.

Hereinafter, detailed steps (1-1) to (1-3) according to the preferred embodiment will be described in detail with reference to FIG.

In the step (1-1), the flexible base material film 100 including the energy absorber 150 inside or on the surface thereof is manufactured.

As an example, the energy absorber may be dispersed in an insulating polymer resin and then molded into a sheet to produce a flexible base film. At this time, besides the energy absorber, an additive may be further added to the insulating polymeric resin for the purpose of hue development, laser energy absorption, and plating property improvement.

Specific examples of the energy absorber, the insulating polymer resin, and the additive are as described above. As the molding method, a method such as extrusion molding can be used.

As a concrete example, a flexible substrate film can be produced by adding an energy absorber and other additive materials into an insulating polymer resin and compounding the resultant, then extruding the resultant into a sheet form. As a result, the energy absorbing material and the additive material can be dispersed and distributed on the inside and the surface of the flexible substrate.

In step (1-2), the flexible substrate film 100 is selectively irradiated with energy 500 to form grooves 110 on the surface.

That is, the energy is not irradiated to all areas of the surface of the flexible substrate film, but is selectively irradiated to only a part of the surface of the flexible substrate film. For example, the energy may be irradiated in a pattern on the surface of the flexible substrate film, and specifically on the surface of the flexible substrate film in the form of an antenna circuit pattern or an integrated circuit pattern.

Accordingly, energy is also irradiated to the energy absorber located inside or on the surface of the flexible substrate film.

The energy absorbing material absorbs and releases external energy, thereby decomposing or changing the surrounding material (i.e., insulating polymeric resin or the like). Accordingly, a groove 110 is formed in a region of the surface of the flexible base film 100 where the energy 500 is selectively irradiated.

The inner surface of the groove 110 may have fine irregularities, and such fine irregularities may serve as an activation site of the subsequent plating process and improve the adhesion of the plating. In addition, the energy absorbing body may be formed as a seed by denaturing, deforming, dialing, or activating itself by the energy, and as a result, a seed formed from the energy absorbing body may exist on the inner surface of the groove 110 .

The energy can be an electromagnetic wave, an electron beam, an ion beam, or the like. Preferably, the energy can be an electromagnetic file, more preferably a laser. That is, the energy irradiation includes laser irradiation, and excitation of electrons in the conduction path from the valence band of the energy absorber included in the flexible base film can be generated by the laser irradiation. Examples of the laser include a UV laser, an excimer laser, and a YAG laser. Further, the wavelength of the laser may be about 150 nm to about 1500 nm.

The amount of energy selectively irradiated on the surface of the flexible base film may vary depending on the type of the energy absorber, the height of the antenna pattern, and the like. For example, the amount of energy to be irradiated may be an amount such that the depth of the groove produced by energy irradiation can be formed to be equal to or lower than the height of the antenna pattern.

In the step (1-3), the antenna pattern 210 partially embedded in the groove 110 is formed. The antenna pattern 210 may be formed by electroless plating, electrolytic plating, or the like.

For example, it may be performed only by electroless plating, or may be performed after electroless plating.

Examples of the metal used in the plating process include, but are not limited to, copper, nickel, gold, silver, zinc, and tin.

Fine irregularities may be formed on the surface of the groove 110 and the fine irregularities may serve as an activation site for promoting plating and the antenna pattern may be formed on the irregularities.

Also, a seed formed from the energy absorber may exist on the inner surface of the groove 110, and the seed may serve as an activation site for promoting plating, and the antenna pattern 210 may be formed on the seed .

According to the present invention, the antenna pattern 210 can be formed very stably without palladium pretreatment, so that electroless plating can be performed without performing palladium pretreatment in the step (1-3).

According to a preferred example, in the step (1-1), the flexible base film is produced by dispersing an energy absorber in an insulating polymer resin and then molding it into a sheet, and in the step (1-2) And excitation of electrons in the conduction path occurs from the valence band of the energy absorbing body contained in the flexible base film by the laser irradiation. Further, in step (1-3), the antenna pattern may be formed by performing electroless plating without palladium pretreatment.

Also, on the other surface of the flexible substrate film 100, the grooves and the antenna patterns buried in the grooves can be formed in the same manner as described above.

In the step (2), a flexible magnetic sheet is laminated on the surface of the flexible substrate film on which the antenna pattern is formed, and part or all of the antenna pattern is embedded in the flexible magnetic sheet.

The flexible magnetic sheet may be a polymer magnetic sheet (PMS). The flexible magnetic sheet can be produced by a conventional method of producing a non-fired dry polymeric magnetic sheet. For example, the flexible magnetic sheet can be produced by dispersing a magnetic powder in a polymer resin and then molding the sheet in a form of a sheet.

As a specific example, the polymer magnetic sheet includes (i) dispersing a powder of a magnetic material in a polymer resin (binder resin) and a solvent to prepare a slurry; And (ii) shaping the sheet using the slurry and then drying the sheet.

As a more specific example, a magnetic substance powder is first added to a solvent together with a thermosetting binder resin such as an acrylic resin, a urethane resin, a butadiene resin, and a silicone resin and dispersed by a dispersing machine (planetary mixer, homo mixer, no- A slurry having a viscosity of 100 to 10,000 cPs is prepared. Thereafter, the slurry is passed through a thin gap by tape casting to form a film. The speed and temperature are adjusted according to a desired thickness, and the solvent is removed through a drier, and the molded sheet is wound to produce PMS.

6, a flexible magnetic sheet 300 is laminated on a flexible base film 100, that is, a thin circuit board 250 on which antenna patterns 210 and 220 are formed. That is, the flexible magnetic sheet 300 can be disposed and laminated so as to face the surface of the flexible base film 100 on which the antenna pattern 210 is formed.

Preferably, the laminate may comprise a hot press process.

For example, the flexible magnetic sheet 300 may be a polymeric magnetic sheet produced by dispersing a magnetic powder in a polymer resin (binder resin) and then forming the sheet in a sheet form, Accordingly, part or all of the antenna pattern 210 can easily be infiltrated into the surface of the flexible magnetic sheet 300 by thermocompression bonding 600.

The flexible substrate film 100 in which the antenna pattern 210 is partially embedded in the groove 110 may be formed on the surface of the flexible substrate film 100. [ At least a part of the portion of the antenna pattern 210 not buried in the groove 110 is pressed against the flexible magnetic sheet 300, As shown in FIG.

The temperature condition at the time of thermocompression may be preferably 100 ° C to 250 ° C, and more preferably 130 ° C to 200 ° C. Further, the pressure condition at the time of thermocompression may be preferably 1 MPa to 30 MPa, and more preferably 5 MPa to 10 MPa. The holding time of the thermocompression bonding may be preferably from 2 minutes to 60 minutes, more preferably from 10 minutes to 30 minutes. According to a specific example, the thermocompression bonding may be performed at a temperature of 140 to 180 ° C and a pressure of 5 to 10 MPa for 10 to 30 minutes.

When the thermocompression bonding is performed within the above preferable range of conditions, it may be more advantageous to realize the deformation and hardening of the resin at the same time and improve the productivity between the antenna pattern and the magnetic sheet to improve the productivity.

The thin antenna module manufactured through the above steps was subjected to an MIT bending test under the condition of a test piece of 1.5 x 10 cm, a load of 0.98 N, a bending radius of curvature (R) of 2 mm and a speed of 90 rpm, More than 100 times can be flexible.

Between steps (1) and (2), a step of applying an adhesive composition to one surface of the flexible substrate film to form an adhesive layer, wherein the adhesive layer is formed to a thickness lower than the height of the first antenna pattern, .

As the adhesive composition, a conventional adhesive component can be used, and for example, a curable adhesive resin can be used. Specific examples of the curable adhesive resin are as described above.

As a result, the adhesive layer formed on one side of the flexible substrate film is cured simultaneously with thermocompression bonding to exhibit an adhesive force, so that the adhesion between the flexible base film and the magnetic sheet can be further improved.

Hereinafter, the present invention will be described by way of more specific examples. The following examples are illustrative of the present invention and are not intended to limit the scope of the present invention.

Example 1: Fabrication of thin antenna module

Step (1) Formation of antenna pattern

A polyester film containing 10 wt% of TiO ₂ as an energy absorbing material was irradiated with a UV laser to form a groove, and then an antenna pattern made of copper was formed by electroless plating to obtain a thin circuit board. The antenna pattern was formed very stably without performing palladium pretreatment at the electroless plating.

Step (2) Polymer-type magnetic sheet and laminate

The magnetic substance powder was added to the solvent together with the thermosetting binder resin and dispersed by a dispersing machine to prepare a slurry. Thereafter, the slurry was passed through a thin gap by tape casting to form a film, and the solvent was removed through a drier to prepare a polymer-type magnetic sheet.

The thin circuit board manufactured in the above step (1) was arranged such that the surface of the flexible base film on which the antenna pattern was formed faced the polymer magnetic sheet. Then, the polymer magnetic sheet was thermally pressed on the flexible base film at 160 DEG C and 6.8 MPa for 30 minutes to form a thin antenna module.

Example 2: Fabrication of thin antenna module

A polyester film containing 5 wt% of black Al ₂ O ₃ (doped Al ₂ O ₃ ) as an energy absorbing material was irradiated with an IR laser to form a groove, and then a conductive pattern made of copper was formed by electroless plating, A thin circuit board was obtained. The antenna pattern was formed very stably without performing palladium pretreatment at the electroless plating. The antenna module was completed by using the thin circuit board and laminating it with the polymeric magnetic sheet according to the same procedure as in step (2) of the first embodiment.

Example 3: Fabrication of thin antenna module

A polyester film containing 10 wt% of carbon black as an energy absorbing material was irradiated with an IR laser to form a groove, and then a conductive pattern made of copper was formed by electroless plating to obtain a thin circuit board. The antenna pattern was formed very stably without performing palladium pretreatment at the electroless plating. The antenna module was completed by using the thin circuit board and laminating it with the polymeric magnetic sheet according to the same procedure as in step (2) of the first embodiment.

Example 4: Fabrication of thin antenna module

A polyester film containing 10 wt% of TiO ₂ and carbon black as an energy absorbing material was irradiated with an IR laser to form a groove, and then a conductive pattern made of copper was formed by electroless plating to obtain a thin circuit board. The antenna pattern was formed very stably without performing palladium pretreatment at the electroless plating. The antenna module was completed by using the thin circuit board and laminating it with the polymeric magnetic sheet according to the same procedure as in step (2) of the first embodiment.

On the other hand, in order to compare the processability of the groove and the electroless plating property, a groove is formed by irradiating a UV ray or an IR laser to a polyester film not containing an energy absorber, and then a conductive pattern made of copper is formed by electroless plating However, unlike Examples 1 to 4, grooves were not properly formed and electroless plating was not properly performed.

Test Example 1: Flexibility evaluation (MIT folding test)

For each of the thin antenna modules manufactured in Examples 1 to 4, an MIT bending test (TAPPI Test Method T 511: Folding endurance of paper) according to ASTM D 2176 was performed under the condition of 90 °. Specifically, the MIT bending test was performed with a test specimen of 1.5 x 10 cm, a load of 0.98 N, a bending radius of curvature (R) of 2 mm, and a speed of 90 rpm.

As a result, the thin antenna modules manufactured in step (1) of Examples 1 to 4 did not break even after 10,000 bending cycles.

Test Example 2: Adhesion Test

Adhesion tests according to ASTM D 3359 were performed on the thin circuit boards prepared in step (1) of Examples 1 and 3 above. Specifically, thin circuit boards were respectively fabricated in the same manner as in step (1) of Examples 1 and 3, except that the conductive patterns were formed to have four lines each having a width of about 1 mm. Each of these four lines was cut at intervals of 1 mm in length with respect to a length of 10 mm to form a total of 40 pattern pieces each having an area of about 1 mm 2 (1 mm x 1 mm). The adhesive tape of Nitto denko was attached to the surface of the 40 pattern pieces, and then the number of pieces remaining in the flexible base film was counted and shown in the following table in the form of "remaining number / initial number" .

division The substrate of Example 1 The substrate of Example 3 Adhesion test 40/40 40/40

As shown in Table 1, the thin circuit boards fabricated in the step (1) of the embodiments of the present invention have excellent adhesion between the conductive pattern and the flexible substrate film.

From the results of Test Examples 1 and 2, it can be seen that the antenna module of the present invention has a thin thickness, excellent adhesion between constituent components, and is flexible and capable of variously shaped antenna patterns.

The above-described thin antenna module can be applied to all industrial fields requiring an antenna pattern such as an NFC antenna, a wireless charging antenna, and an FPCB including an RFID antenna. For example, it can be used in mobile phones, tablets, personal computers, laptops, other communication equipment, automobiles, medical equipment, and the like. In addition, it can be used for all items such as goods, furniture, electronic devices, mobile devices, etc., which require antennas in relation to things Internet.

100: flexible base material film, 110: (first) groove,
120: (second) groove, 150: energy absorbing body,
210: (first) antenna pattern, 220: (second) antenna pattern,
250: thin circuit board, 300: flexible magnetic sheet,
400: adhesive layer, 500: energy irradiation,
600: thermocompression, h1, h2: antenna pattern height,
d1 is the groove depth, and d2 is the depth at which the antenna pattern is embedded in the flexible magnetic sheet.

Claims (15)

A flexible substrate film;
An antenna pattern formed on a surface of the flexible substrate film; And
And a flexible magnetic sheet disposed on a surface of the flexible base film on which the antenna pattern is formed,
A thin antenna module in which a part of the antenna pattern is embedded in the flexible magnetic sheet,
Wherein at least a portion of the antenna pattern that is not embedded in the soft magnetic sheet of the antenna pattern is embedded in the groove,
Wherein an inner surface of the groove has a seed formed by deforming, deforming, dialing, or activating the energy absorber by a laser, and an antenna pattern is formed on the seed along an area where the seed exists, .
The method according to claim 1,
Wherein the antenna pattern is a printed circuit pattern.
The method according to claim 1,
The thin antenna module was fabricated using a test specimen of 1.5 x 10 cm, a load of 0.98 N, a bending radius of curvature (R) of 2 mm and an MIT folding test at a speed of 90 revolutions per minute A thin antenna module having a frequency of 100 or more times.
The method of claim 3,
Wherein the antenna pattern has a 4B rating or higher in an adhesion test according to ASTM D 3359 for the flexible substrate film.
The method according to claim 1,
Wherein the energy absorber comprises a substance which generates excitation of electrons in a conduction band in a valence band by energy irradiation.
The method according to claim 1,
Wherein the energy absorber comprises a metal oxide.
The method according to claim 1,
Wherein the energy absorber comprises at least one selected from the group consisting of TiO ₂ , Al ₂ O ₃ , copper chromium oxide, graphite oxide, and carbon black.
The method according to claim 1,
Wherein the flexible magnetic sheet comprises a magnetic powder and a polymer resin.
The method according to claim 1,
Wherein the thin antenna module further comprises an adhesive layer between the flexible substrate film and the soft magnetic sheet,
And at least a part of the antenna pattern penetrates through the adhesive layer to be embedded in the flexible magnetic sheet.
The method according to claim 1,
The energy absorber is contained in the flexible base film in an amount of 1 to 30% by weight,
Wherein the flexible base film comprises an insulating polymer resin,
Wherein the groove has a depth corresponding to 70% to 90% of the height of the antenna pattern.
(1) forming an antenna pattern on the surface of the flexible base film; And
(2) a step of laminating a flexible magnetic sheet on a surface of the flexible substrate film on which an antenna pattern is formed, and embedding a part of the antenna pattern in the flexible magnetic sheet,
Wherein at least a portion of the antenna pattern that is not embedded in the flexible magnetic sheet is embedded in the groove,
Wherein an inner surface of the groove has a seed formed by deforming, deforming, dialing, or activating the energy absorber by a laser, and an antenna pattern is formed on the seed along an area where the seed exists, ≪ / RTI >
12. The method of claim 11,
If step (1)
(1-1) preparing a flexible base film comprising an energy absorber inside or on a surface thereof;
(1-2) selectively irradiating the flexible substrate film with energy to form grooves on the surface; And
(1-3) A method of fabricating a thin antenna module, the method comprising: forming an antenna pattern partially embedded in the groove through plating.
13. The method of claim 12,
Wherein the antenna pattern is formed by performing electroless plating without palladium pretreatment.
12. The method of claim 11,
The flexible magnetic sheet is produced by dispersing a magnetic powder in a polymer resin and then molding the sheet in a shape of a sheet,
Wherein the laminate comprises a hot press process.
12. The method of claim 11,
In the MIT bending test under the condition of a test piece of 1.5 x 10 cm, a load of 0.98 N, a bending radius of curvature R of 2 mm and a speed of 90 rpm, the number of bending times until cutting was 100 or more , A method of manufacturing a thin antenna module.

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