KR101783284B1

KR101783284B1 - Organic light emitting display device and method for manufacturing the same

Info

Publication number: KR101783284B1
Application number: KR1020150169330A
Authority: KR
Inventors: 양희석; 백승민
Original assignee: 엘지디스플레이 주식회사
Priority date: 2015-11-30
Filing date: 2015-11-30
Publication date: 2017-09-29
Also published as: KR20170063216A

Abstract

An embodiment of the present invention relates to an organic light emitting display including fine pattern metal lines arranged corresponding to banks and a method of manufacturing the same. An organic light emitting display according to an embodiment of the present invention includes an anode electrode, a bank that covers the anode electrodes, a bank covering an edge of each of the anode electrodes, organic light emitting layers disposed on the anode electrodes, And first metal lines disposed on the bank, in the encapsulation film, or on the encapsulation film so as to overlap the bank.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting diode (OLED) display device,

An embodiment of the present invention relates to an organic light emitting display and a method of manufacturing the same.

As the information society develops, the demand for display devices for displaying images is increasing in various forms. In recent years, various display devices such as a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting display (OLED) have been used.

Of the display devices, the organic light emitting display device is a self-emitting type, and has a better viewing angle and contrast ratio than a liquid crystal display device (LCD), does not require a separate backlight and is lightweight and thin, . In addition, the organic light emitting display device is capable of being driven by a DC low voltage, has a high response speed, and is particularly advantageous in manufacturing cost.

The organic light emitting display device includes a display panel including a display area where pixels for displaying an image are formed and a non-display area that is a periphery of the display area. Each of the pixels is divided by a bank and includes an anode electrode, a hole transporting layer, an organic light emitting layer, an electron transporting layer, and a cathode electrode. In this case, when a high potential voltage is applied to the anode electrode and a low potential voltage is applied to the cathode electrode, holes and electrons move to the organic light emitting layer through the hole transporting layer and the electron transporting layer, respectively.

On the other hand, when the organic light emitting display device displays an image at a high resolution such as UHD (ultra high definition, 3840x2160), lines such as in-cell type touch lines and a low- . The in-line type touch lines indicate touch lines formed in the organic light emitting display. The low resistance cathode auxiliary line refers to an auxiliary line connected to the cathode electrode for lowering the voltage of the cathode electrode. Since the lines such as the insulator-type touch lines and the low-resistance cathode auxiliary line are formed of opaque metal, it is preferable to arrange them corresponding to the banks since the aperture ratio may be lowered when overlapping with the pixels. However, in the case of a high-resolution organic light emitting display, since the width of the bank is very narrow, it is difficult to finely pattern the lines such as the insensitive-type touch lines and the low-resistance cathode auxiliary line so as to correspond to the banks.

An embodiment of the present invention provides an organic light emitting display including fine pattern metal lines arranged corresponding to banks and a method of manufacturing the same.

An organic light emitting display according to an embodiment of the present invention includes an anode electrode, a bank that covers the anode electrodes, a bank covering an edge of each of the anode electrodes, organic light emitting layers disposed on the anode electrodes, And first metal lines disposed on the bank, in the encapsulation film, or on the encapsulation film so as to overlap the bank.

A method of fabricating an organic light emitting display according to an exemplary embodiment of the present invention includes forming thin film transistors on a lower substrate, applying an EHD voltage applying line disposed between the anode electrodes and the anode electrodes on the thin film transistors Forming an EHD voltage applying line and a bank covering an edge of each of the anode electrodes; forming an organic light emitting layer covering the bank and the anode electrodes; forming a cathode electrode on the organic light emitting layer; And forming a sealing film on the cathode electrode. Wherein the step of forming the bank or the step of forming the encapsulating film is performed by applying a ground voltage or a negative voltage to the EHD voltage applying line and forming, on the bank formed on the cathode electrode, The first touch lines are formed by dropping the metal material from the EHD nozzle so as to overlap with the bank.

According to another aspect of the present invention, there is provided a method of manufacturing an organic light emitting diode display, comprising: forming thin film transistors, anodes, a bank, an organic light emitting layer, a cathode electrode, and an encapsulating layer on a lower substrate; Forming a first etch stop layer by dropping an organic material from an EHD nozzle to overlap the bank on the first metal material, etching the first metal material to form first etch stop layers, Forming an insulating film on the encapsulation film and the first touch lines, forming a second metal material on the encapsulation film, forming an EHD nozzle over the second metal material to overlap the bank, Forming a second etch stop layer by etching the second metal material to form second touch lines.

The embodiment of the present invention can form the first and second touch lines by applying a predetermined voltage to the EHD voltage applying line and using the EHD printing method. As a result, even when the organic light emitting display device displays an image at a high resolution such as UHD (ultra high definition, 3840x2160), the first and second touch lines are overlapped with the fine pattern metal line Can be formed.

Embodiments of the present invention may also form first and second touch lines within the encapsulation film or on the encapsulation film. As a result, according to the embodiment of the present invention, a part of the sealing film can be used as an insulating film for insulating the first touch lines and the second touch lines. Therefore, mutual capacitance between the first touch lines and the second touch lines capacitance can be formed. Therefore, the embodiment of the present invention can sense the touch of the user by the in-cell touch method of the mutual capacity type.

Further, embodiments of the present invention can form a cathode auxiliary line (CAL) on the bank or on the cathode electrode by applying a predetermined voltage to the EHD voltage applying line and using the EHD printing method. As a result, in the embodiment of the present invention, even when the organic light emitting display device displays an image at a high resolution such as UHD (ultra high definition, 3840 × 2160), the cathode auxiliary wiring line (CAL) Metal lines.

The embodiment of the present invention also prevents the rise of the low potential voltage supplied to the cathode electrode 254 by lowering the resistance of the cathode electrode 254 by electrically connecting the cathode auxiliary wiring line CAL to the cathode electrode 254 can do.

1 is a view illustrating an organic light emitting display according to an embodiment of the present invention.
FIG. 2 is an exemplary view illustrating light emitting regions, first touch lines, and second touch lines of a display region according to an exemplary embodiment of the present invention. Referring to FIG.
3 is a cross-sectional view showing one example of I-I 'and II-II' of FIG.
4 is a cross-sectional view showing another example of I-I 'and II-II' of FIG.
5 is a cross-sectional view showing another example of I-I 'and II-II' of FIG.
6 is a cross-sectional view showing another example of I-I 'and II-II' of FIG.
7 is a plan view showing light emitting regions and a cathode auxiliary wiring in a display region according to an embodiment of the present invention.
8 is a cross-sectional view showing one example of III-III 'and IV-IV' of FIG.
9 is a cross-sectional view showing another example of III-III 'and IV-IV' of FIG.
10 is a flowchart illustrating a method of manufacturing an OLED display according to an embodiment of the present invention.
11A to 11G are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.
12A and 12B are illustrations showing fine pattern metal lines printed by the EHD printing method according to whether or not a ground voltage is applied to the EHD voltage applying line.
13A to 13C are illustrative drawings showing the routing lines and pads for applying the ground voltage to the EHD voltage applying line.
14 is a flowchart illustrating a method of manufacturing an OLED display according to another embodiment of the present invention.
15A to 15I are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Where the terms "comprises," "having," "consisting of," and the like are used in this specification, other portions may be added as long as "only" is not used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

In the case of a description of a temporal relationship, for example, if the temporal relationship is described by 'after', 'after', 'after', 'before', etc., May not be continuous unless they are not used.

The first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

The terms "X-axis direction "," Y-axis direction ", and "Z-axis direction" should not be construed solely by the geometric relationship in which the relationship between them is vertical, It may mean having directionality.

It should be understood that the term "at least one" includes all possible combinations from one or more related items. For example, the meaning of "at least one of the first item, the second item and the third item" means not only the first item, the second item or the third item, but also the second item and the second item among the first item, May refer to any combination of items that may be presented from more than one.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, technically various interlocking and driving, and that the embodiments may be practiced independently of each other, It is possible.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view illustrating an organic light emitting display according to an embodiment of the present invention. 1, the OLED display 100 includes a display panel 110, a gate driver 120, a source driver IC 130 A flexible film 140, a circuit board 150, and a timing control unit 160. [

The display panel 110 includes a lower substrate 111 and an upper substrate 112. The upper substrate 112 may be an encapsulating substrate. The lower substrate 111 may be formed to be larger than the upper substrate 112 so that a part of the lower substrate 111 can be exposed without being covered by the upper substrate 112.

In the display area DA of the display panel 110, gate lines, data lines, and light emitting areas are formed. The light emitting regions are formed in the intersecting regions of the gate lines and the data lines. The light emitting areas of the display area DA display an image. A detailed description of the display area DA will be given later in conjunction with FIG. 2 and FIG.

The gate driver 120 supplies the gate signals to the gate lines according to the gate control signal input from the timing controller 160. The gate driver 120 may be formed in a gate driver in panel (GIP) manner outside the first side of the display area DA of the display panel 110 or may be mounted on a flexible film, Or may be attached to the outside of the first side of the display area DA of the display panel 110. [

The source driver IC 130 receives the digital video data and the source control signal from the timing controller 160. The source driver IC 130 converts the digital video data into analog data voltages according to the source control signal and supplies the analog data voltages to the data lines. When the source drive IC 130 is fabricated from a driving chip, the source drive IC 130 may be mounted on the flexible film 140 using a chip on film (COF) method or a chip on plastic (COP) method.

Since the size of the lower substrate 111 is larger than that of the upper substrate 112, a part of the lower substrate 111 can be exposed without being covered by the upper substrate 112. Pads such as data pads are formed on a part of the lower substrate 111 that is not covered by the upper substrate 112 but is exposed. Wires connecting the pads and the source drive IC 130 and wirings connecting the pads and the wirings of the circuit board 150 may be formed in the flexible film 140. The flexible film 140 is adhered to the pads using an anisotropic conducting film, whereby the pads and the wirings of the flexible film 140 can be connected.

The circuit board 150 may be attached to the flexible films 140. The circuit board 150 may be implemented with a plurality of circuits implemented with driving chips. For example, the timing control unit 160 may be mounted on the circuit board 150. [ The circuit board 150 may be a printed circuit board or a flexible printed circuit board.

The timing controller 160 receives digital video data and a timing signal from an external system board through a cable of the circuit board 150. The timing controller 60 generates a gate control signal for controlling the operation timing of the gate driver 120 and a source control signal for controlling the source driver ICs 130 based on the timing signal. The timing controller 60 supplies a gate control signal to the gate driver 120 and a source control signal to the source driver ICs 30. [

Meanwhile, the OLED display according to the exemplary embodiment of the present invention may be implemented by an in-cell touch method including first touch lines and second touch lines. Therefore, the first touch lines and the second touch lines may be additionally formed in the display area DA of the display panel 110. [ The first touch lines and the second touch lines may be formed to intersect with each other. The first touch lines may be Tx lines and the second touch lines may be Rx lines.

The touch driver 170 supplies touch driving signals to the first touch lines according to the touch control signal input from the touch controller. The touch driver 170 may be formed as a driving chip and mounted on a flexible film and may be attached to the outside of the second side of the display area DA of the display panel 110 in a TAB manner. The second side of the display area DA may be the opposite side facing the first side.

The source driver IC 130 may include a touch sensing unit sensing a capacitance change between the first touch lines and the second touch lines. The touch sensing unit converts the capacitance change value sensed through the second touch lines into touch row data, which is digital data, and supplies the touch row data to the touch control unit. The touch control unit calculates the touch coordinates using the touch row data. The touch control unit may be included in the timing controller 130, or may be mounted on the circuit board 150 separately from the timing controller 130.

FIG. 2 is an exemplary view illustrating light emitting regions, first touch lines, and second touch lines of a display region according to an exemplary embodiment of the present invention. Referring to FIG. In FIG. 2, the first touch lines TL are Tx lines and the second touch lines RL are Rx lines. However, the present invention is not limited thereto.

Referring to FIG. 2, the light emitting regions include a red light emitting region RE, a green light emitting region GE, and a blue light emitting region BE. The red light emitting region RE, the green light emitting region GE, and the blue light emitting region BE function as one pixel. The light emitting regions may further include a white light emitting region as well as a red light emitting region RE, a green light emitting region GE, and a blue light emitting region BE. In this case, (GE), the blue light emitting region BE, and the white light emitting region can function as one pixel.

The light emitting regions RE, GE, and BE are partitioned by the banks. That is, the banks are arranged between the light emitting regions RE, GE, and BE.

The first touch lines (TL) and the second touch lines (RL) are formed to cross each other. For example, as shown in FIG. 2, the first touch lines TL may be formed in the x-axis direction, and the second touch lines RL may be formed in the y-axis direction. The x-axis direction may be a direction parallel to the gate line, and the y-axis direction may be a direction parallel to the data line.

The first touch lines (TL) and the second touch lines (RL) are formed on the banks, and may be arranged to overlap with the banks. Hereinafter, the formation positions of the first touch lines TL and the second touch lines RL according to the embodiments of the present invention will be described in detail with reference to FIGS. 3 to 6. FIG.

3 is a cross-sectional view showing one example of I-I 'and II-II' of FIG.

Referring to FIG. 3, thin film transistors are formed on the lower substrate 111. In FIG. 3, the thin film transistors 210 are formed in a top gate manner in which the gate electrode is located on the top of the semiconductor layer. However, the present invention is not limited thereto. That is, the thin film transistors 210 are formed by a bottom gate method in which a gate electrode is located below a semiconductor layer, or a double gate method in which a gate electrode is located at both the top and bottom of a semiconductor layer . Each of the thin film transistors 210 includes a semiconductor layer 211, a gate electrode 212, a source electrode 213 and a drain electrode 214 as shown in FIG.

On the lower substrate 111, semiconductor layers 211 are formed. A buffer layer (not shown) may be formed between the lower substrate 111 and the semiconductor layers 211. An interlayer insulating layer 220 may be formed on the semiconductor layers 211. Gate electrodes 212 may be formed on the interlayer insulating layer 220. A gate insulating layer 230 may be formed on the gate electrodes 212. Source electrodes 213 and drain electrodes 214 may be formed on the gate insulating layer 230. Each of the source electrodes 213 and the drain electrodes 214 may be connected to the semiconductor layer 211 through a contact hole penetrating the interlayer insulating layer 220 and the gate insulating layer 230.

A planarization layer 240 may be formed on the source electrodes 213 and the drain electrodes 214. The planarizing film 240 is a film for arranging the pixels partitioned by the banks 255 in a flat manner. The planarization layer 240 may be formed of a resin such as photo acryl and polyimide.

An anode electrode 251 and an EHD voltage applying line 252 are formed on the planarization film 240. [ Each of the anode electrodes 251 is connected to the drain electrode 214 through a contact hole passing through the planarization layer 240. The EHD voltage application line 252 is formed between the anode electrodes 251. The anode electrodes 251 and the EHD voltage applying line 252 may be formed of the same material.

When the first touch lines TL and the second touch lines RL are formed by an electrohydrodynamic (EHD) printing method, the first touch lines TL and the second touch lines RL The EHD voltage applying line 252 may be supplied with a ground voltage or a negative voltage so as to be formed at a precise position in the fine pattern. That is, the EHD voltage application line 252 applies a voltage only during the manufacturing process of forming the first touch lines TL and the second touch lines RL, and after the completion of the display panel 110, . A detailed description thereof will be given later with reference to FIG.

On the other hand, the EHD voltage applying line 252 may be formed on the same layer as the anode electrode 251 or on another layer disposed on the anode electrode 251. [ For example, an EHD voltage application line 252 may be formed on the bank 255 or formed on the cathode electrode 254. [ When the EHD voltage application line 252 is formed on the same layer as the anode electrode 251, there is an advantage that an EHD voltage application line can be formed without any additional process.

The bank 255 is formed so as to cover the edge of each of the EHD voltage application line 252 and the anode electrode 251.

An organic light emitting layer 253 is formed on the anode electrodes 251 and the banks 255. Each of the organic light emitting layers 253 may include a hole transporting layer, a light emitting layer, and an electron transporting layer. In this case, when a voltage is applied to the anode electrode 251 and the cathode electrode 254, holes and electrons move to the light emitting layer through the hole transporting layer and the electron transporting layer, respectively.

The organic light emitting layer 253 may include only a white light emitting layer that emits white light. In this case, the white light emitting layer may be formed on the entire surface of the display area DA. Alternatively, the organic light emitting layer 253 may include a red light emitting layer for emitting red light, a green light emitting layer for emitting green light, and a blue light emitting layer for emitting blue light. In this case, the red light emitting layer may include only red light emitting regions RE The green light emitting layer is formed only in the green light emitting regions GE, and the blue light emitting layer is formed only in the blue light emitting regions BE.

The cathode electrode 254 is formed on the organic light emitting layers 253 and the banks 255 so as to cover the organic light emitting layers 253 and the banks 255. [

The organic light emitting display may be implemented by a top emission method or a bottom emission method. In the upper emission type, since the light emitted from the organic emission layer 253 emits light toward the upper substrate 112, the thin film transistors 210 may be provided under the banks 255 and the anode electrodes 251. That is, the upper light emitting method has an advantage that the thin film transistors 210 have a wider design area than the lower light emitting method.

In order to obtain a micro cavity effect in the upper emission type, it is preferable that the anode electrodes 251 are formed of a metal material having a high reflectance such as aluminum and a laminated structure of aluminum and ITO. Further, in the upper emission type, the cathode electrode 150 may be formed of a transparent metal material such as ITO or IZO, or may be formed of a semitransparent metal material such as magnesium, silver, or an alloy of magnesium and silver.

A sealing film 260 is provided on the cathode electrode 254. The sealing film 260 serves to prevent penetration of oxygen or moisture into the organic light emitting layer 253. For this purpose, the sealing film 260 may include a first inorganic film 261, an organic film 262, and a second inorganic film 263.

The first inorganic film 261 is formed on the cathode electrode 254 so as to cover the cathode electrode 254. The organic film 262 is formed on the first inorganic film 261 to prevent the particles from penetrating the first inorganic film 261 and entering the organic light emitting layer 253 and the cathode electrode 254 . The second inorganic film 263 is formed on the organic film 262 so as to cover the organic film 262.

Each of the first and second inorganic films 261 and 263 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide or titanium oxide. For example, each of the first and second inorganic films 261 and 263 may be formed of SiO ₂ , Al ₂ O ₃ , SiON, or SiNx. The organic layer 262 is preferably formed to be transparent so as to allow light emitted from the organic light emitting layer 253 to pass therethrough.

The first touch lines TL may be formed on the first inorganic film 261 and the second touch lines RL may be formed on the second inorganic film 263. [ In this case, the first and second touch lines TL and RL can be insulated by the organic film 263 and the second inorganic film 263, so that the first and second touch lines TL and RL, A mutual capacitance may be formed between them. Therefore, the embodiment of the present invention can sense the touch position of the user by using the first and second touch lines TL and RL.

Also, each of the first and second touch lines TL and RL may be formed of an opaque metal. In this case, each of the first and second touch lines TL and RL includes a bank 255 or a black matrix 274 to prevent light emitted from the light emitting regions RE, GE, And the width of each of the first and second touch lines TL and RL may be narrower than the width of the bank 255 or the width of the black matrix 274. [

On the other hand, when the organic light emitting display according to the embodiment of the present invention displays an image at a high resolution such as UHD (ultra high definition, 3840x2160), since the width of the bank 255 is narrow, Each of the transistors TL and RL needs to be formed in a precise position in a fine pattern in order to be arranged to overlap with the bank 255. [ To this end, each of the first and second touch lines TL and RL may be formed by an EHD printing method by applying a predetermined voltage to the EHD voltage applying line 252.

Specifically, the EHD printing method applies a positive voltage to the nozzle and applies a ground voltage or a negative voltage to the EHD voltage applying line 252 while dropping the metal material. The positive voltage may be a voltage higher than 0V and the negative voltage may be a voltage lower than 0V. As a result, the dropped metal material has a positive voltage, and therefore can be accurately disposed at a position corresponding to the EHD voltage applying line 252 having a ground voltage or a negative voltage. A detailed description thereof will be given later with reference to FIG.

Color filters 271 and 272 are formed on the upper substrate 112 facing the lower substrate 111. The color filters may include red color filters 271, green color filters 272, and blue color filters. The red color filters 271 are arranged corresponding to the red light emitting region RE and the green color filters 272 are arranged corresponding to the green light emitting region GE and the blue color filters are arranged in the blue light emitting region BE Can be disposed correspondingly.

A black matrix 274 is formed on the color filters so as to be overlapped with the bank 255. The black matrix 274 includes a material capable of absorbing light. It is possible to prevent the color mixture from being caused by the light emitted from adjacent light emitting regions due to the black matrix 274.

The lower substrate 111 and the upper substrate 112 are bonded together by a transparent adhesive layer 280. [ The transparent adhesive layer 280 may be an adhesive or an adhesive film. Specifically, the transparent adhesive layer 280 bonds the second inorganic film 173 of the lower substrate 111 and the color filters 271 and 272 of the upper substrate 112 to the lower substrate 111 and the upper substrate 112 may be joined together.

As described above, according to the embodiment of the present invention, the first and second touch lines TL and RL can be formed by applying a predetermined voltage to the EHD voltage applying line 252 and using the EHD printing method. have. As a result, even when the organic light emitting display device displays an image at a high resolution such as UHD (ultra high definition, 3840 × 2160), the first and second touch lines TL and RL are connected to the banks Patterned metal lines may be formed so as to overlap with the fine pattern metal lines.

In addition, the embodiment of the present invention may form the first touch lines TL in the sealing film 260 and the second touch lines RL on the sealing film 260. As a result, the embodiment of the present invention can use a part of the sealing film 260 as an insulating film for insulating the first touch lines TL and the second touch lines RL, A mutual capacitance may be formed between the second touch lines RL and the second touch lines RL. Therefore, the embodiment of the present invention can sense the touch of the user by the in-cell touch method of the mutual capacity type.

4 is a cross-sectional view showing another example of I-I 'and II-II' of FIG.

4, the second touch lines RL are formed in the sealing film 260, which is substantially the same as that described with reference to FIG. Hereinafter, for the sake of convenience of description, a detailed description of the components substantially the same as those in Fig. 3 will be omitted.

Referring to FIG. 4, the first touch lines TL may be formed on the first inorganic film 171, and the second touch lines RL may be formed on the organic film 172. In this case, since the first and second touch lines TL and RL can be insulated by the organic film 263, a mutual capacitance is formed between the first and second touch lines TL and RL. Can be formed. Therefore, the embodiment of the present invention can sense the touch position of the user by using the first and second touch lines TL and RL.

Specifically, the EHD printing method applies a positive voltage to the nozzle and applies a ground voltage or a negative voltage to the EHD voltage applying line 252 while dropping the metal material. As a result, the dropped metal material has a positive voltage, and therefore can be accurately disposed at a position corresponding to the EHD voltage applying line 252 having a ground voltage or a negative voltage. A detailed description thereof will be given later with reference to FIG.

The embodiment of the present invention also includes forming the first touch lines TL on the first inorganic film 261 in the sealing film 260 and forming the second touch lines RL on the organic film 262 . As a result, since the organic film 262 can be used as an insulating film for insulating the first touch lines TL and the second touch lines RL from the first touch lines TL and the second touch lines RL, And mutual capacitance can be formed between the second touch lines RL. Therefore, the embodiment of the present invention can sense the touch of the user by the in-cell touch method of the mutual capacity type.

5 is a cross-sectional view showing another example of I-I 'and II-II' of FIG.

In Fig. 5, the first touch lines TL are formed on the organic film 262, and are substantially the same as those described in conjunction with Fig. Hereinafter, for the sake of convenience of description, a detailed description of the components substantially the same as those in Fig. 3 will be omitted.

Referring to FIG. 5, the first touch lines TL may be formed on the organic film 172, and the second touch lines RL may be formed on the organic film 172. In this case, the first and second touch lines TL and RL can be insulated by the second inorganic film 173, so that the mutual capacitance mutual between the first and second touch lines TL and RL, capacitance may be formed. Therefore, the embodiment of the present invention can sense the touch position of the user by using the first and second touch lines TL and RL.

6 is a cross-sectional view showing another example of I-I 'and II-II' of FIG.

6 is substantially the same as that described with reference to FIG. 3, except that the first and second touch lines TL and RL are all formed on the sealing film 260. FIG. Hereinafter, for the sake of convenience of description, a detailed description of the components substantially the same as those in Fig. 3 will be omitted.

6, the first touch lines TL are formed on the second inorganic film 173, the second touch lines RL are formed on the first touch lines TL and the second inorganic film 173, (Not shown). In this case, since the first and second touch lines TL and RL can be insulated by the insulating film 290, a mutual capacitance is formed between the first and second touch lines TL and RL . Therefore, the embodiment of the present invention can sense the touch position of the user by using the first and second touch lines TL and RL.

On the other hand, when the organic light emitting display according to the embodiment of the present invention displays an image at a high resolution such as UHD (ultra high definition, 3840x2160), since the width of the bank 255 is narrow, Each of the transistors TL and RL needs to be formed in a precise position in a fine pattern in order to be arranged to overlap with the bank 255. [ To this end, each of the first and second touch lines TL and RL may be formed by an EHD printing method. A detailed description thereof will be given later with reference to FIG.

The first touch lines TL are formed on the second inorganic film 263 and the second touch lines RL are formed on the insulating film 290 covering the second inorganic film 263, Lt; / RTI > As a result, in the embodiment of the present invention, the first touch lines TL and the second touch lines RL can be insulated by the insulating film 290, so that the first touch lines TL and the second touch lines RL. &Lt; / RTI > Therefore, the embodiment of the present invention can sense the touch of the user by the in-cell touch method of the mutual capacity type.

7 is a plan view showing light emitting regions and a cathode auxiliary wiring in a display region according to an embodiment of the present invention.

Referring to FIG. 7, the light emitting regions include a red light emitting region RE, a green light emitting region GE, and a blue light emitting region BE. The red light emitting region RE, the green light emitting region GE, and the blue light emitting region BE function as one pixel. The light emitting regions may further include a white light emitting region as well as a red light emitting region RE, a green light emitting region GE, and a blue light emitting region BE. In this case, (GE), the blue light emitting region BE, and the white light emitting region can function as one pixel.

The cathode auxiliary wiring (CAL) is formed of a mesh structure. For example, the cathode auxiliary wiring (CAL) may be formed in the x-axis direction and the y-axis direction as shown in Fig. The x-axis direction may be a direction parallel to the gate line, and the y-axis direction may be a direction parallel to the data line.

The cathode auxiliary line (CAL) is formed on the bank and can be arranged to overlap with the bank. Hereinafter, the formation positions of the first touch lines TL and the second touch lines RL according to the embodiments of the present invention will be described in detail with reference to FIGS. 8 and 9. FIG.

8 is a cross-sectional view showing one example of III-III 'and IV-IV' of FIG.

8 is substantially the same as that described with reference to FIG. 3, except that a cathode auxiliary wiring (CAL) is formed instead of the first and second touch lines TL and RL. Hereinafter, for the sake of convenience of description, a detailed description of the components substantially the same as those in Fig. 3 will be omitted.

Referring to FIG. 8, a cathode auxiliary line (CAL) may be formed on the bank 255. The cathode auxiliary line (CAL) may be electrically connected to the cathode electrode 254. For example, the cathode auxiliary wiring (CAL) may be electrically connected to the cathode electrode 254 through a contact hole penetrating the organic light emitting layer 253.

In the case of the top emission type, the cathode electrode 254 may be formed of a transparent metal material, but in this case, the resistance of the cathode electrode 254 is increased, so that the low potential voltage supplied to the cathode electrode may rise. The embodiment of the present invention can reduce the resistance of the cathode electrode 254 by electrically connecting the cathode auxiliary wiring (CAL) to the cathode electrode 254, and as a result, it is possible to prevent the rise of the low potential voltage.

Further, the cathode auxiliary wiring (CAL) may be formed of an opaque metal. In this case, the cathode auxiliary line CAL is arranged so as to overlap with the bank 255 or the black matrix 274 in order to prevent the light emitted from the light emitting regions RE, GE, The width of the wiring CAL may be narrower than the width of the bank 255 or the width of the black matrix 274. [

On the other hand, when the organic light emitting display according to the embodiment of the present invention displays an image with high resolution such as UHD (ultra high definition, 3840x2160), the width of the bank 255 is narrow, In order to overlap the bank 255, it must be formed in a precise position with a fine pattern. To this end, each of the cathode auxiliary wirings (CAL) may be formed by EHD printing by applying a predetermined voltage to the EHD voltage applying line 252.

As described above, the embodiment of the present invention can form a cathode auxiliary wiring (CAL) by applying a predetermined voltage to the EHD voltage applying line 252 and using the EHD printing method. As a result, in the embodiment of the present invention, even when the organic light emitting display device displays an image at a high resolution such as UHD (ultra high definition, 3840 × 2160), the cathode auxiliary wiring line (CAL) Metal lines.

9 is a cross-sectional view showing another example of III-III 'and IV-IV' of FIG.

9 is substantially the same as that described with reference to FIG. 3, except that a cathode auxiliary wiring (CAL) is formed instead of the first and second touch lines TL and RL. Hereinafter, for the sake of convenience of description, a detailed description of the components substantially the same as those in Fig. 3 will be omitted.

Referring to FIG. 9, a cathode auxiliary wiring (CAL) may be formed on the cathode electrode 254. The cathode auxiliary line (CAL) may be electrically connected to the cathode electrode 254.

On the other hand, the cathode auxiliary wiring (CAL) is not limited to that illustrated in Figs. 8 and 9, and may be formed in the sealing film 260 or on the sealing film 260. [ In this case, the cathode auxiliary wiring (CAL) may be connected to the cathode electrode 254 through a contact hole penetrating a part or all of the sealing film 260.

10 is a flowchart illustrating a method of manufacturing an OLED display according to an embodiment of the present invention. 11A to 11G are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention. Hereinafter, a method for fabricating an OLED display device according to an embodiment of the present invention will be described in detail with reference to FIG. 10 and FIGS. 11A to 11G.

First, gate lines, data lines, and thin film transistors are formed on the lower substrate 111 as shown in FIG. 11A. The lower substrate 111 may be glass or plastic. In FIG. 11A, the thin film transistors 210 are formed in a top gate manner in which the gate electrode is located on the top of the semiconductor layer. However, the present invention is not limited thereto. That is, the thin film transistors 210 may be formed by a bottom gate method in which a gate electrode is positioned below a semiconductor layer. The thin film transistors 210 are formed in the display area DA.

Semiconductor layers 211 are formed on the lower substrate 111. Alternatively, a buffer layer (not shown) may be formed on the lower substrate 111, and then a semiconductor layer 211 may be formed on a buffer layer (not shown). An interlayer insulating film 220 is formed on the semiconductor layers 211. The interlayer insulating film 220 is a film for insulating the semiconductor layers 211 from other metals. Gate electrodes 212 are formed on the interlayer insulating film 220. A gate insulating layer 230 is formed on the gate electrodes 212. Source electrodes 213 and drain electrodes 214 are formed on the gate insulating layer 230. The contact holes may be formed through the interlayer insulating layer 220 and the gate insulating layer 230 to expose the semiconductor layers 211 before the source electrodes 213 and the drain electrodes 214 are formed. Each of the source electrodes 213 and the drain electrodes 214 may be connected to the semiconductor layer 211 through a contact hole passing through the interlayer insulating layer 220 and the gate insulating layer 230.

A planarization layer 240 is formed on the source electrodes 213 and the drain electrodes 214. The planarizing film 240 is a film for arranging the pixels P partitioned by the banks 255 in a flat manner. The planarization layer 240 may be formed of a resin such as photo acryl and polyimide. (S101 in Fig. 10)

Secondly, the anode electrodes 251 and the EHD voltage applying line 252 are formed on the planarization layer 240 as shown in FIG. 11B. The contact holes may be formed through the planarization layer 240 to expose the drain electrodes 214 before the anode electrodes 251 are formed. Thus, each of the anode electrodes 251 may be connected to the drain electrode 214 through a contact hole passing through the planarization layer 240. The EHD voltage application line 252 is formed between the anode electrodes 251.

In order to obtain a micro cavity effect in the upper emission type, the anode electrodes 251 are preferably formed of a metal material having a high reflectance such as aluminum and a laminated structure of aluminum and ITO. The anode electrodes 251 and the EHD voltage applying line 252 may be formed of the same material. (S102 in Fig. 10)

Third, a bank 255, an organic light emitting layer 253, and a cathode electrode 254 are formed in turn as shown in FIG. 11C.

An organic light emitting layer 253 is formed on the anode electrodes 251 and the banks 255. Each of the organic light emitting layers 253 may include a hole transporting layer, a light emitting layer, and an electron transporting layer. The organic light emitting layer 253 may include only a white light emitting layer that emits white light. In this case, the white light emitting layer may be formed on the entire surface of the display area DA. Alternatively, the organic light emitting layer 253 may include a red light emitting layer for emitting red light, a green light emitting layer for emitting green light, and a blue light emitting layer for emitting blue light. In this case, the red light emitting layer may include only red light emitting regions RE The green light emitting layer is formed only in the green light emitting regions GE, and the blue light emitting layer is formed only in the blue light emitting regions BE.

The cathode electrode 254 is formed on the organic light emitting layers 253 and the banks 255 so as to cover the organic light emitting layers 253 and the banks 255. [ In the top emission type, the cathode electrode 250 may be formed of a transparent metal material such as ITO or IZO, or may be formed of a semitransparent metal material such as magnesium, silver, or an alloy of magnesium and silver.

A first inorganic film 261, which is a part of the sealing film 260, may be formed on the cathode electrode 254. The first inorganic film 261 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. For example, the first inorganic film 261 may be formed of SiO ₂ , Al ₂ O ₃ , SiON, or SiNx. (S103 in Fig. 10)

Fourth, first touch lines TL are formed on the first inorganic film 261 by an electrohydrodynamic (EHD) printing method as shown in FIG. 11D.

Specifically, first, the EHD nozzle NZ is disposed on the first inorganic film 261 so as to be overlapped with the bank 255. Then, a ground voltage or a negative voltage is applied to the EHD voltage applying line 252. Then, a positive voltage is applied to the EHD nozzle NZ to drop the metal material. In this case, the metal material having the charge from the EHD nozzle can be accurately formed on the EHD voltage applying line 252 since it is collected by the EHD voltage applying line 252 to which the ground voltage or the negative voltage is applied. As a result, the first touch lines TL can be finely patterned to overlap the banks 255 on the first inorganic film 261.

12A, when the ground voltage or the negative voltage is not applied to the EHD voltage application line 252, the width W1 of the first touch line TL is set to a ground voltage or a ground voltage to the EHD voltage application line 252 as shown in FIG. And is larger than the width W2 of the first touch line TL when a negative voltage is applied. If the ground voltage or the negative voltage is not applied to the EHD voltage application line 252, the first touch line TL may drop or be broken in the openings of the light emitting regions RE, GE, and BE have.

However, the embodiment of the present invention forms an EHD voltage applying line 252 capable of applying a ground voltage or a negative voltage to a position where the fine pattern metal line is to be patterned by the EHD printing method. As a result, the embodiment of the present invention can form the first touch line TL by fine patterning by the EHD printing method. In addition, since the EHD nozzle EZ does not contact the first inorganic film 261 in the embodiment of the present invention, the first touch lines TL can be formed without damaging the first inorganic film 261.

13A, the EHD voltage application line 252 is electrically connected to the routing lines RTL formed in the non-display area NDA around the display area DA, and the routing lines RTL are electrically connected to the pad PAD ). &Lt; / RTI > Thus, the ground voltage or the negative voltage may be applied to the EHD voltage applying line 252 through the pads PAD and the routing lines RTL.

13B, when a ground voltage or a negative voltage is applied to the EHD voltage applying line 252 before cutting the lower substrate 111 in the mother substrate MS, the EHD voltage applying line 252 One lower substrate 111 and the routing wiring RTL of the lower substrate 111 adjacent thereto may be connected to each other to stably supply the ground voltage or the negative voltage. 13C, pads PAD to which a ground voltage or a negative voltage is applied are formed only on one of the lower substrates 111 and the routing wirings RTL of the lower substrate 111 adjacent to the lower substrate 111 May be connected to the routing wiring lines (RTL) of any one of the lower substrates 111. In this case, the EHD voltage application line 252 of the lower substrate 111 adjacent to the lower substrate 111 may be a ground voltage or a negative voltage supplied to the pads of the lower substrate 111 Can be supplied. (S104 in Fig. 10)

Fifthly, an organic film 262 is formed on the first touch lines TL and the first inorganic film 261 and a second inorganic film 263 is formed on the organic film 262, .

The organic layer 262 is preferably formed to be transparent so as to allow light emitted from the organic light emitting layer 253 to pass therethrough. The second inorganic film 263 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. For example, the second inorganic film 263 may be formed of a _{SiO 2, Al 2 O 3,} SiON, SiNx. (S105 in Fig. 10)

Sixth, second touch lines RL are formed on the second inorganic film 263 by electrohydrodynamic (EHD) printing as shown in FIG. 11F.

Specifically, first, the EHD nozzle NZ is disposed on the second inorganic film 263 so as to be overlapped with the bank 255. Then, a ground voltage or a negative voltage is applied to the EHD voltage applying line 252. Then, a positive voltage is applied to the EHD nozzle NZ to drop the metal material. In this case, the metal material having the charge from the EHD nozzle NZ can be accurately formed on the EHD voltage applying line 252 since it is collected in the EHD voltage applying line 252 to which the ground voltage or the negative voltage is applied. As a result, the second touch lines RL can be finely patterned to overlap the banks 255 on the second inorganic film 263.

The embodiment of the present invention forms an EHD voltage applying line 252 capable of applying a ground voltage or a negative voltage to a position where the fine pattern metal line is to be patterned by the EHD printing method. As a result, the embodiment of the present invention can form the second touch line RL by fine patterning by the EHD printing method. In addition, the embodiment of the present invention can form the second touch lines RL without damaging the second inorganic film 263 because the EHD nozzle EZ does not contact the second inorganic film 263. (S106 in Fig. 10)

Seventh, the lower substrate 111 and the upper substrate 112 are bonded to each other using a transparent adhesive layer 280 as shown in FIG. The transparent adhesive layer 280 may be an adhesive or an adhesive film.

On the upper substrate 112, color filters 271 and 272 are formed. The color filters may include red color filters 271, green color filters 272, and blue color filters. The red color filters 271 are arranged corresponding to the red light emitting region RE and the green color filters 272 are arranged corresponding to the green light emitting region GE and the blue color filters are arranged in the blue light emitting region BE Can be disposed correspondingly.

Specifically, the transparent adhesive layer 280 bonds the second inorganic film 173 of the lower substrate 111 and the color filters 271 and 272 of the upper substrate 112 to the lower substrate 111 and the upper substrate 112 may be joined together. (S107 in Fig. 10)

As described above, according to the embodiment of the present invention, the ground voltage or the negative voltage is applied to the EHD voltage applying line 252 and the EHD printing method is used. 1 and the second touch lines TL, RL. As a result, even when the organic light emitting display device displays an image at a high resolution such as UHD (ultra high definition, 3840 × 2160), the first and second touch lines TL and RL are connected to the banks Patterned metal lines may be formed so as to overlap with the fine pattern metal lines.

3, the first touch lines TL are formed on the first inorganic film 261, the second touch lines RL are formed on the first inorganic film 261, Are formed on the second inorganic film 263, but the present invention is not limited thereto. That is, those skilled in the art will recognize that when the first touch lines TL are formed on the first inorganic film 261 and the second touch lines RL are formed on the organic film 262 as shown in FIG. 4, The organic light emitting display device may be manufactured by changing the first touch lines TL to be formed on the organic film 262 and the second touch lines RL to be formed on the second inorganic film 262. [ In addition, a person skilled in the art may change the case where the cathode auxiliary lines (CALs) are formed on the banks 255 as shown in FIG. 8 or formed on the cathode electrodes 254 as shown in FIG. 9 to manufacture an organic light emitting display.

14 is a flowchart illustrating a method of manufacturing an OLED display according to another embodiment of the present invention. 15A to 15I are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to another embodiment of the present invention. Hereinafter, a method of manufacturing an OLED display according to another embodiment of the present invention will be described in detail with reference to FIG. 14 and FIGS. 15A to 15I.

First, gate lines, data lines, thin film transistors, anode electrodes, banks, an organic light emitting layer, a cathode electrode, and a sealing film are formed on a lower substrate 111 as shown in FIG.

The steps of forming the gate lines, the data lines, and the thin film transistors 210 on the lower substrate 111 are substantially the same as those described in step S101 of FIG. 10, so that detailed description thereof will be omitted. In addition, the step of forming the anode electrodes 251, the bank 255, the organic light emitting layer 253, and the cathode electrode 254 is the same as the step of forming the EHD voltage applying line 252, And S103, detailed description thereof will be omitted.

On the cathode electrode 255, a sealing film 260 including a plurality of inorganic films and at least one organic film is formed. The first inorganic film 261 may be formed on the cathode electrode 255. An organic film 262 is formed on the first inorganic film 261 and a second inorganic film 263 is formed on the organic film 262. The first and second inorganic films 261 and 263 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. For example, the first and second inorganic films 261 and 263 may be formed of SiO ₂ , Al ₂ O ₃ , SiON, and SiNx. The organic layer 262 is preferably formed to be transparent so as to allow light emitted from the organic light emitting layer 253 to pass therethrough. (S201 in Fig. 14)

Second, a first metal material ML1 is formed on the second inorganic film 263 as shown in FIG. 15B. It is preferable that the first metal material ML1 is formed of a metal material opaque than a transparent metal material to lower the resistance. The first metal material ML1 may be formed so as to cover the display area DA. (S202 in Fig. 14)

Third, the first etch stop layer ESL1 is formed on the first metal material ML1 by an electrohydrodynamic (EHD) printing method as shown in FIG. 15C. The first etch stop layer ESL1 is a layer formed in a region where the first touch lines TL are to be formed to prevent the first metal material ML1 from being etched.

Specifically, first, the EHD nozzle NZ is disposed over the bank 255 on the first metal material ML1. Then, a positive voltage is applied to the EHD nozzle NZ and the organic material is dropped to form an etch stop layer (ESL). The first etch stop layer ESL1 is a layer for preventing the first metal material ML1 from being etched. Therefore, when the first etch stop layer ESL1 is formed using the EHD printing method, Less accuracy is required than when it is formed. Accordingly, the method of fabricating an OLED display according to another embodiment of the present invention can form the first etch stop layer ESL1 using the EHD printing method without forming the EHD voltage applying line 252. [ (S203 in Fig. 14)

Fourth, the first metal lines ML1 are etched to form the first touch lines TL as shown in FIG. 15D. The etching of the first metallic material ML1 may be a wetting wetting. (S204 in Fig. 14)

Fifthly, an insulating film 290 is formed on the first touch lines TL and the second inorganic film 263 as shown in FIG. 15E. The insulating layer 290 may be formed of the same material as the first and second inorganic layers 261 and 263. (S205 in Fig. 14)

Sixth, a second metal material ML2 is formed on the insulating film 290 as shown in FIG. The second metallic material ML2 is preferably formed of a metallic material that is opaque than the transparent metallic material to lower the resistance. The second metallic material ML2 may be formed to cover the display area DA. (S206 in Fig. 14)

Seventh, as shown in FIG. 15G, a second etch stop layer ESL2 is formed on the second metal material ML2 by an electrohydrodynamic (EHD) printing method. The second etch stop layer ESL2 is a layer formed in a region where the second touch lines RL are to be formed to prevent the second metal material ML2 from being etched.

Specifically, first, the EHD nozzle NZ is disposed over the bank 255 on the second metal material ML2. Then, a positive voltage is applied to the EHD nozzle NZ and the organic material is dropped to form the second etch stop layer ESL2. The second etch stop layer ESL2 is a layer for preventing the second metal material ML2 from being etched. Therefore, when the second etch stop layer ESL2 is formed using the EHD printing method, Less accuracy is required than when it is formed. Accordingly, the method of fabricating an organic light emitting display according to still another embodiment of the present invention can form the second etch stop layer ESL2 using the EHD printing method without forming the EHD voltage applying line 252. [ (S207 in Fig. 14)

Eighth, the second metal material ML2 is etched to form the second touch lines RL as shown in FIG. 15H. The etching of the second metallic material ML2 may be a wetting wetting. (S208 in Fig. 14)

15, the lower substrate 111 and the upper substrate 112 are bonded to each other by using a transparent adhesive layer 280. FIG. The transparent adhesive layer 280 bonds the color filters 271 and 272 of the insulating layer 290 of the lower substrate 111 and the color filters 271 and 272 of the upper substrate 112 so that the lower substrate 111 and the upper substrate 112 They can be joined together. (S209 in Fig. 14)

As described above, in the embodiment of the present invention, the first and second touch lines TL and RL are formed on the sealing film 260 by forming the etching preventing layers ESL1 and ESL2 using the EHD printing method. Can be formed. As a result, even when the organic light emitting display device displays an image at a high resolution such as UHD (ultra high definition, 3840 × 2160), the first and second touch lines TL and RL are connected to the banks Patterned metal lines may be formed so as to overlap with the fine pattern metal lines.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

110: display panel 111: lower substrate
112: upper substrate 120: gate driver
130: Source drive IC 140: Flexible film
150: circuit board 160: timing controller
170: touch driver 210: thin film transistor
211: semiconductor layer 212: gate electrode
213: source electrode 214: drain electrode
220: interlayer insulating film 230: gate insulating film
240: planarization film 251: anode electrode
252: EHD voltage applying line 253: organic light emitting layer
254: cathode electrode 255:
260: sealing film 261: first inorganic film
262: moisture absorption organic film 263: second inorganic film
271: Red color filter 272: Green color filter
274: black matrix 280: transparent adhesive layer
TL: first touch line RL: second touch line

Claims

Anode electrodes;
A bank which divides the anode electrodes and covers the edges of the anode electrodes;
Organic light emitting layers disposed on the anode electrodes;
A sealing film disposed on the organic light emitting layers;
A first metal line disposed on the bank, in the encapsulation film, or on the encapsulation film so as to overlap the bank; And
And an EHD voltage application line arranged to overlap with the first metal line below the first metal lines.

The method according to claim 1,
And a second metal line overlapping the bank in the encapsulation film or on the encapsulation film and disposed on the first metal line.

3. The method of claim 2,
Wherein the first metal line and the second metal line intersect each other.

3. The method of claim 2,
Wherein an insulating film is disposed between the first metal line and the second metal line.

delete

The method according to claim 1,
Wherein the EHD voltage application line is disposed on the same layer as the anode electrodes or on another layer disposed on the anode electrodes.

The method according to claim 1,
Wherein no voltage is applied to the EHD voltage applying line.

The method according to claim 1,
Wherein the first metal line is electrically connected to a cathode electrode disposed on the organic light emitting layer.

Forming thin film transistors on the lower substrate;
Forming an EHD voltage applying line disposed between the anode electrodes and the anode electrodes on the thin film transistors;
Forming an EHD voltage applying line and a bank covering an edge of each of the anode electrodes;
Forming an organic light emitting layer covering the bank and the anode electrodes; forming a cathode electrode on the organic light emitting layer; And
And forming a sealing film on the cathode electrode,
Wherein the forming of the bank or the forming of the encapsulating film comprises:
Applying a ground voltage or a negative voltage to the EHD voltage application line and dropping a metal material from the EHD nozzle to overlap the bank in the encapsulation film or on the encapsulation film on the bank formed on the cathode electrode, Thereby forming a first touch line.

Forming a thin film transistor, an anode electrode, a bank, an organic light emitting layer, a cathode electrode, and an encapsulating film on a lower substrate;
Forming a first metal material on the sealing film;
Forming a first etch stop layer by dropping an organic material from the EHD nozzle to overlap the bank on the first metal material;
Etching the first metal material to form first touch lines;
Forming an insulating film on the sealing film and the first touch lines;
Forming a second metallic material on the encapsulant;
Forming a second etch stop layer by dropping an organic material from the EHD nozzle to overlap the bank on the second metallic material; And
And etching the second metal material to form second touch lines.