KR101762791B1 - Light emitting device array - Google Patents

Light emitting device array Download PDF

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Publication number
KR101762791B1
KR101762791B1 KR1020100085657A KR20100085657A KR101762791B1 KR 101762791 B1 KR101762791 B1 KR 101762791B1 KR 1020100085657 A KR1020100085657 A KR 1020100085657A KR 20100085657 A KR20100085657 A KR 20100085657A KR 101762791 B1 KR101762791 B1 KR 101762791B1
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South Korea
Prior art keywords
light emitting
substrate
hole
pattern
insulating
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KR1020100085657A
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Korean (ko)
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KR20120022256A (en
Inventor
박형화
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엘지이노텍 주식회사
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Priority to KR1020100085657A priority Critical patent/KR101762791B1/en
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Led Device Packages (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The light emitting element array of the embodiment includes a substrate, a plurality of light emitting elements mounted on one surface of the substrate, a circuit pattern formed on the substrate and connected to the plurality of light emitting elements, at least one hole formed in the substrate and connected to the circuit pattern, An insulating layer formed on the other surface of the opposing substrate and an insulating pattern can be coated on the insulating layer so as to correspond to the positions of the holes. Thus, it is possible to prevent a short circuit of the light emitting element mounted on the substrate.

Description

[0001] The present invention relates to a light emitting device array

An embodiment relates to a light emitting element array.

A light emitting device (LED) is an element that converts an electric signal into an infrared ray, a visible light or a light by utilizing the characteristics of a compound semiconductor. It is used in household electric appliances, remote controllers, display boards, The use area of the light emitting element is widening.

In general, a miniaturized light emitting device is made of a surface mount device for mounting on a PCB (Printed Circuit Board) substrate, and this surface mount device can replace a conventional simple light lamp, It is used for a lit indicator, a character indicator, and an image indicator.

Meanwhile, a PCB (Printed Circuit Board) substrate is mounted with a plurality of light emitting devices to form an array, and is connected to a circuit pattern to supply power to a plurality of light emitting devices. At this time, the circuit pattern can be formed by forming a hole in a PCB (Printed Circuit Board) substrate. If a hole through which a circuit pattern extends is not properly insulated, a short circuit may occur in the mounted light emitting device.

And a light emitting element array capable of preventing a short circuit of the light emitting element mounted on the substrate.

A light emitting element array according to an embodiment includes a substrate, a plurality of light emitting elements mounted on one surface of the substrate, a circuit pattern formed on the substrate and connected to the plurality of light emitting elements, at least one hole formed in the substrate and connected to the circuit pattern, A first insulating layer formed on the other surface of the substrate opposite to the one surface, and at least one insulating pattern formed on the first insulating layer so as to correspond to the positions of the holes.

The diameter of the insulating pattern may be larger than the diameter of the via hole, and the difference between the diameter of the insulating pattern and the diameter of the via hole may be 0.1 mm to 0.2 mm.

Further, the thickness of the insulating pattern may be 4 탆 to 10 탆.

Further, the insulating pattern may be formed of an insulating material.

It is possible to prevent the short circuit of the light emitting device mounted on the substrate by applying the insulating pattern so as to correspond to the position of the hole.

1 is a perspective view illustrating a light emitting device array according to an embodiment,
Fig. 2 is a plan view showing the back surface of the light emitting element array of Fig. 1,
Fig. 3 is an enlarged view of a portion A in Fig. 2,
4 is a cross-sectional view taken along the line B-B 'in Fig. 2,
5 is a perspective view showing a lighting apparatus according to an embodiment,
6 is a cross-sectional view taken along line C-C 'of the illumination device of FIG. 5,
7 is an exploded perspective view showing a backlight unit according to an embodiment, and Fig.
8 is an exploded perspective view showing the backlight unit according to the embodiment.

In the description of the embodiments, the terms "on" and "under " are to be construed as " on" or "under" Quot; includes all that is "directly" or " indirectly formed " In addition, the criteria for top or bottom of a component are described with reference to drawings.

In the drawings, the thickness and the size of each component are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

Hereinafter, embodiments will be described in detail with reference to the drawings.

The longitudinal direction y of the illumination device 100, the horizontal direction z perpendicular to the longitudinal direction y, and the longitudinal direction y of the light emitting device array 100 according to the embodiment, And a height direction (x) perpendicular to the horizontal direction (z).

FIG. 1 is a perspective view showing a light emitting device array 100 according to an embodiment, and FIG. 2 is a plan view showing a back surface of the light emitting device array 100 of FIG. That is, FIG. 2 is a view of the light emitting device array 100 of FIG. 1 viewed in the longitudinal direction (y) and in the horizontal direction (z) in the height direction (x).

1 and 2, a light emitting device array 100 according to an embodiment includes a substrate 110, a circuit pattern 120 formed on the substrate 110, a circuit pattern 120 connected to the substrate 110, At least one hole 140 formed in the substrate 110 and connected to the circuit pattern 120, at least one hole 140 formed in the other surface of the substrate 110 facing the one surface of the substrate 110, And at least one insulating pattern 150 formed on the first insulating layer 112 and the first insulating layer 112 so as to correspond to the positions of the holes 140.

The substrate 110 may be formed of an insulating material with a support on which the circuit pattern 120 and the light emitting device 130 are located. The substrate 110 may be formed of FR-4 and may include at least one of polyimide, liquid crystal polymer, and polyester to have ductility.

For example, the circuit pattern 120 can be formed by forming a copper layer on the substrate 110 by sputtering a conductive material such as copper, electrolytic / electroless plating, and then etching the copper layer. The circuit pattern 120 may be formed on one or both surfaces of the substrate 110 and may be electrically connected to the light emitting device 130 to supply driving signals and electric power.

The plurality of light emitting devices 130 can generate light by the power supplied from the circuit pattern 120. The plurality of light emitting devices 130 may be mounted on the substrate 110 and the plurality of light emitting devices 130 may be red, green, blue, or ultraviolet light emitting diodes. For example, when a plurality of light emitting devices 130 emitting red, green, and blue light are repeatedly disposed, the light emitting device array 100 is formed by mixing red, green, and blue light, Can realize white light.

The hole 140 is formed on the substrate 110 and is connected to the circuit pattern 120 so that the circuit pattern 120 can be simplified in the case where the circuit pattern 120 is formed on both surfaces of the substrate 110 . The holes 140 may be positioned below the light emitting device 130 and may serve as a heat dissipation device capable of emitting heat generated from the light emitting device 130 to the outside.

When the circuit pattern 120 and the hole 140 are electrically connected to each other, a hole 140 is formed on the substrate 110 to prevent the hole 140 from being exposed to the outside, The first insulating layer 112 may be formed on the back surface of the first insulating layer 112. [

The first insulating layer 112 may be formed on the entire rear surface of the substrate 110 and the first insulating layer 112 may be formed of an insulating material such as Teflon, PSR ink, or polyimide.

The edge portion of the hole 140 may not be sufficiently coated when the first insulating layer 112 is formed on the back surface of the substrate 110. This may prevent the light emitting device array 100 A short circuit may occur in the corner portion of the hole 140 when the component is mounted. The light emitting element array 100 according to the embodiment can prevent the occurrence of a short circuit at the corner of the hole 140 by forming the insulating pattern 150 once more on the first insulating layer 112 .

The insulating pattern 150 may be formed on the first insulating layer 112 corresponding to the position of the hole 130. The insulating pattern 150 may be formed of an insulating ink such as a PSR ink, a Teflon, or a polyimide to further enhance the insulation of the corner portion of the hole 140.

4, the second insulation layer 113 is formed on the circuit pattern 120 to prevent the circuit pattern 120 from being exposed to the air. This will be described later with reference to FIG.

3 is an enlarged view of a portion A in Fig.

As described above, the insulating pattern 150 is applied on the first insulating layer 112 to enhance the protection of the corner portions of the hole 140. [

At this time, the diameter r 1 of the insulating pattern 150 may be larger than the diameter r 2 of the hole 140. The straight line r 1 of the insulating pattern 150 is formed to be larger than the diameter r 2 of the hole 140 so that it can be safely covered even when the corner portion of the hole 140 is exposed.

On the other hand, the radius (r a diameter (r 1) and the hole 140 diameter, if the difference (r 2) is less than 0.1㎜, i.e. insulating pattern 150 and the radial holes 140 of the insulating pattern 150 2 is less than 0.05 mm, it is not easy to locate the hole 140 in the center of the insulating pattern 150 and the width? R of the insulating pattern 150 to surround the hole 140 exceeds It may not be enough.

On the other hand in the number if the diameter (r 1) and the difference between the diameter (r 2) of the hole 140 is larger than 0.2㎜ quality is too thick, the thickness of the insulating pattern 150 of the insulating pattern 150, the light emitting element When the array 100 is mounted, scratches or the like may occur.

Thus, the difference between the diameter (r 2) with a diameter (r 1) and the hole 140 of the insulating pattern 150 is preferably 0.1㎜ to 0.2㎜.

4 is a cross-sectional view taken along the line B-B 'in Fig. 4 is a view of the light emitting device array 100 of FIG. 1 viewed in the horizontal direction z and in the direction of the height direction x in the longitudinal direction y.

Referring to FIG. 4, a hole 140 may be formed in the substrate 110, and a conductive layer 142 may be formed in the inner surface of the hole 140. The conductive layer 142 may electrically connect the circuit patterns 120, which may be formed on both sides of the substrate 110. The conductive layer 142 may be formed of the same material as the circuit pattern 120.

1 and 2, the first insulating layer 112 may be formed on the rear surface of the substrate 110, and the first insulating layer 112 may be formed on the rear surface of the substrate 110 on which the light emitting device 130 A second insulating layer 113 for protecting the circuit pattern 120 may be formed on one side. Since the second insulating layer 113 is the same as the first insulating layer 112, detailed description is omitted. However, it is needless to say that the second insulating layer 113 may be formed of a material different from the first insulating layer 112.

The insulating pattern 150 may be formed on the first insulating layer 112 to prevent a short circuit that may occur due to insufficient covering of the corner portion P of the hole 140. [ 3 , the difference between the diameter r 1 of the insulating pattern 150 and the diameter r 2 of the hole 140 is 0.1 mm to 0.2 mm.

In addition, it is preferable that the thickness T 1 of the insulating pattern 150 is formed to be 4 탆 to 10 탆. When the thickness T 1 of the insulation pattern 150 is less than 4 μm, the insulation pattern 150 may be too thin due to the spreading of the insulation pattern 150 and the thickness T 1 of the insulation pattern 150 may be If it is larger than 10 mu m, it is difficult to accurately fix the light emitting device 100 in a predetermined space when the light emitting device array 100 is mounted.

In this way, by forming the insulating pattern 150 once more on the first insulating layer 112, it is possible to prevent a short circuit from occurring at the corner of the hole 140.

FIG. 5 is a perspective view illustrating a lighting device including a light emitting device array according to an embodiment, and FIG. 6 is a cross-sectional view taken along the line A-A 'of the lighting device of FIG.

In order to describe the shape of the illumination device 600 according to the embodiment in more detail, the longitudinal direction Z of the illumination device 600, the horizontal direction Y perpendicular to the longitudinal direction Z, The direction Z and the horizontal direction Y and the vertical direction X perpendicular to the horizontal direction Y will be described.

6 is a cross-sectional view of the lighting device 600 of FIG. 5 cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. In FIG.

5 and 6, the lighting device 600 may include a body 610, a cover 630 coupled to the body 610, and a finishing cap 650 positioned at opposite ends of the body 610 have.

The light emitting device array 640 is coupled to the lower surface of the body 610 and the body 610 is electrically connected to the light emitting element 644 through a conductive and / It can be formed of a metal material having excellent heat dissipation effect.

The light emitting devices 644 may be mounted on the PCB 642 in multiple colors and multiple rows to form the light emitting device arrays 640. The light emitting devices 644 may be mounted at equal intervals or may be mounted with various distances as required, Can be adjusted. As the PCB 642, MCPCB (Metal Core PCB) or FR4 material PCB can be used.

The PCB 642 may include a circuit pattern connected to the light emitting device 644 and a hole connected to the circuit pattern. The PCB 642 may include an insulating layer on the back surface of the PCB 642. In addition, by forming an insulating pattern corresponding to the position of the hole on the insulating layer once more, it is possible to prevent the occurrence of a short circuit at the corner of the hole.

The cover 630 may be formed in a circular shape so as to surround the lower surface of the body 610, but is not limited thereto.

The cover 630 protects the internal light emitting device array 640 from foreign substances or the like. The cover 630 may include diffusion particles to prevent glare of the light generated by the light emitting device 644 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 630 A prism pattern or the like may be formed on one side. Further, the phosphor may be applied to at least one of the inner surface and the outer surface of the cover 630.

Since the light emitted from the light emitting element 644 is emitted to the outside through the cover 630, the cover 630 must have a good light transmittance and sufficient heat resistance to withstand the heat generated by the light emitting element 644 The cover 630 may be formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like.

The finishing cap 650 is located at both ends of the body 610 and can be used to seal the power supply unit (not shown). In addition, the finishing cap 650 is provided with the power supply pin 652, so that the lighting apparatus 600 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

7 is an exploded perspective view of a liquid crystal display device including a light emitting element array according to an embodiment.

7, the liquid crystal display 700 may include a liquid crystal display panel 710 and a backlight unit 770 for providing light to the liquid crystal display panel 710 in an edge-light manner.

The liquid crystal display panel 710 can display an image using light provided from the backlight unit 770. The liquid crystal display panel 710 may include a color filter substrate 712 and a thin film transistor substrate 714 facing each other with a liquid crystal therebetween.

The color filter substrate 712 can realize the color of an image to be displayed through the liquid crystal display panel 710.

The thin film transistor substrate 714 is electrically connected to a printed circuit board 718 on which a plurality of circuit components are mounted via a driving film 717. The thin film transistor substrate 714 may apply a driving voltage provided from the printed circuit board 718 to the liquid crystal in response to a driving signal provided from the printed circuit board 718. [

The thin film transistor substrate 714 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 770 includes a light emitting element array 720 that outputs light, a light guide plate 730 that changes the light provided from the light emitting element array 720 into a surface light source and provides the light to the liquid crystal display panel 710, A plurality of films 750, 766, and 764 for uniformly distributing the luminance of light provided from the light guide plate 730 and improving vertical incidence and a reflective sheet (not shown) for reflecting the light emitted to the rear of the light guide plate 730 to the light guide plate 730 740).

The light emitting device array 720 may include a PCB substrate 722 such that a plurality of light emitting devices 724 and a plurality of light emitting devices 724 are mounted to form an array.

The PCB 722 may include a circuit pattern connected to the light emitting device 724 and a hole connected to the circuit pattern. The PCB 722 may include an insulating layer on the back surface of the PCB 722. In addition, by forming an insulating pattern corresponding to the position of the hole on the insulating layer once more, it is possible to prevent the occurrence of a short circuit at the corner of the hole. At this time, the thickness of the insulation pattern is 4 占 퐉 to 10 占 퐉 so that the light emitting device array 100 can be accurately mounted in the predetermined space.

The backlight unit 770 includes a diffusion film 766 for diffusing light incident from the light guide plate 730 toward the liquid crystal display panel 710 and a prism film 750 for enhancing vertical incidence by condensing the diffused light And may include a protective film 764 for protecting the prism film 750.

8 is an exploded perspective view of a liquid crystal display device including a light emitting device array according to an embodiment. However, the parts shown and described in Fig. 7 are not repeatedly described in detail.

8, the liquid crystal display device 800 may include a liquid crystal display panel 810 and a backlight unit 870 for providing light to the liquid crystal display panel 810 in a direct manner.

Since the liquid crystal display panel 810 is the same as that described with reference to FIG. 7, detailed description is omitted.

The backlight unit 870 includes a plurality of light emitting element arrays 823, a reflecting sheet 824, a lower chassis 830 in which the light emitting element arrays 823 and the reflecting sheet 824 are accommodated, And a plurality of optical films 860. The diffuser plate 840 and the plurality of optical films 860 are disposed on the light guide plate 840. [

The light emitting device array 823 may include a plurality of light emitting devices 822 and a PCB 821 on which the plurality of light emitting devices 822 are mounted.

The PCB 821 may include a circuit pattern connected to the light emitting device 822 and a hole connected to the circuit pattern. The PCB 821 may include an insulating layer on the back surface of the PCB 821. In addition, by forming an insulating pattern corresponding to the position of the hole on the insulating layer once more, it is possible to prevent the occurrence of a short circuit at the corner of the hole.

The reflection sheet 824 reflects light generated from the light emitting element 822 in a direction in which the liquid crystal display panel 810 is positioned, thereby improving the efficiency of light utilization.

The light emitted from the light emitting element array 823 is incident on the diffusion plate 840 and the optical film 860 is disposed on the diffusion plate 840. The optical film 860 is composed of a diffusion film 866, a prism film 850, and a protective film 864.

Meanwhile, the light emitting device array according to the embodiment is not limited to the configuration and method of the embodiments described above, but the embodiments may be modified so that all or some of the embodiments are selectively As shown in FIG.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention.

100: light emitting element array 110: substrate
112: first insulating layer 113: second insulating layer
120: circuit pattern 130: light emitting element
140: Hole 150: Insulation pattern

Claims (11)

Board;
A circuit pattern formed on the substrate;
A plurality of light emitting devices connected to the circuit pattern and mounted on one surface of the substrate;
At least one hole formed in the substrate and electrically connected to the circuit pattern through a conductive layer disposed on the inner surface;
A first insulation layer formed on the other surface of the substrate opposite to the one surface of the substrate, the first insulation layer being in contact with the hole of the substrate;
A second insulating layer formed on the circuit pattern; And
And at least one insulating pattern formed on the first insulating layer so as to correspond to a position of the hole,
The conductive layer is formed of the same material as the circuit pattern,
Wherein the first insulating layer and the second insulating layer are formed of different materials. The method according to claim 1,
Wherein a diameter of the insulating pattern is larger than a diameter of the hole. 3. The method of claim 2,
Wherein a difference between a diameter of the insulating pattern and a diameter of the hole is 0.1 mm to 0.2 mm. The method according to claim 1,
Wherein a thickness of the insulating pattern is 4 占 퐉 to 10 占 퐉. The method according to claim 3 or 4,
Wherein the insulating pattern is formed of an insulating material. The method according to claim 1,
Wherein the first insulating layer is formed of at least one of PSR ink, Teflon, and polyimide. The method according to claim 1,
Wherein the substrate is a flexible substrate. delete delete A lighting device comprising the light-emitting element array according to any one of claims 1 to 7. A display device comprising the light-emitting element array according to any one of claims 1 to 7.
KR1020100085657A 2010-09-01 2010-09-01 Light emitting device array KR101762791B1 (en)

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KR101762791B1 true KR101762791B1 (en) 2017-07-28

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KR102091912B1 (en) * 2017-11-20 2020-04-28 한국산업기술대학교산학협력단 Flexible printed circuit board and display system including the same
DE102019106546A1 (en) * 2019-03-14 2020-09-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung METHOD FOR MANUFACTURING OPTOELECTRONIC SEMICONDUCTOR COMPONENTS AND OPTOELECTRONIC SEMICONDUCTOR COMPONENTS

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