KR101742613B1

KR101742613B1 - Composite for conductive pattern and method of conductive pattern using the same

Info

Publication number: KR101742613B1
Application number: KR1020150096526A
Authority: KR
Inventors: 유명재; 임호선
Original assignee: 전자부품연구원
Priority date: 2015-07-07
Filing date: 2015-07-07
Publication date: 2017-06-01
Also published as: KR20170006098A

Abstract

The composite material forming the conductive pattern by the laser irradiation according to the present invention includes an optional insulating material capable of being formed into a three-dimensional shape and a filler material activated by laser irradiation, wherein the filler material is an inorganic filler material, The material comprises aluminum nitride, which is activated by laser irradiation.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite material for a conductive pattern,

TECHNICAL FIELD The present invention relates to a composite material for a conductive pattern and a method for forming a conductive pattern using the same. More particularly, the present invention relates to a technique for forming a conductive pattern by laser irradiation.

With the development of information technology, the dependence of PCB (Printed Circuit Board) is increasing due to expansion of various application products using micro electric circuit. Particularly, a portable communication device such as a mobile phone is equipped with an antenna. In response to miniaturization of the device, such an antenna is formed in a conductor pattern similar to a general electric circuit pattern in recent years, It is a tendency to go to an embedded type antenna.

However, here, the built-in antenna is similar to the general electric circuit pattern, but differs from the general electric circuit pattern in the following points. That is, a general electric circuit pattern is usually provided in the form of a printed circuit board (PCB), whereas an antenna is provided by attaching a conductor pattern separately made on a substrate, also called a carrier or a base.

As is well known, a PCB is formed by forming a conductor pattern of copper or the like on a resin substrate of a limited material by a fine pattern formation method such as photolithography or the like. A conductor pattern for the antenna is prepared by press- Glued, or assembled onto a substrate prepared by injection molding. Therefore, a general electric circuit pattern provided in the form of a PCB and an antenna, which is a conductor pattern formed by press molding, differ in size and manufacturing method.

In addition, although a general electric circuit pattern provided in the form of a PCB has a structure in which a plurality of layers are laminated, a conductive pattern applied to an antenna has recently been required to have a three-dimensional shape, while the basic shape thereof is flat. This is because of the inherent characteristics required of the antenna that there should be no sensitivity variation according to the direction or direction when transmitting and receiving the radio wave. In addition, the base material forming the casing of the portable communication device, which is usually injection-molded, has a three-dimensional shape.

Meanwhile, recently, a built-in antenna has been manufactured by manufacturing a conductor pattern for an antenna in the form of a flexible PCB instead of press working, and bonding or attaching the conductor pattern to the base material, which is the above-mentioned injection-molded article. According to this method, it is advantageous in that a high degree of freedom in designing and a conventional flexible PCB manufacturing technology can be utilized as compared with a press working which is not suitable for manufacturing various antenna conductor patterns because expensive molds are required.

However, there is an inconvenience that an antenna manufactured in the form of a flexible PCB still needs to be adhered or adhered onto the above-mentioned three-dimensional shaped substrate, and over time, or due to carelessness of the manufacturer or the user, There is a problem such as separation.

Korean Patent No. 10-1434423 (the title of the invention: a material for a conductive pattern and a method for forming a conductive pattern using the same) discloses a technique using copper nitride in the development of a material for forming a conductive pattern have.

However, in the case of copper nitride and spinel structure, it is easy to form a conductive pattern, but the thermal conductivity of the material is insufficient, so there is a technical limit to realize a high thermal conductivity composite material.

An embodiment of the present invention is to provide a composite material which is optically responsive to laser irradiation to form a pattern on the surface of a base material and has high thermal conductivity in a technique of forming a conductive pattern by laser irradiation.

It should be understood, however, that the technical scope of the present invention is not limited to the above-described technical problems, and other technical problems may exist.

As a technical means for achieving the above technical object, the composite material forming the conductive pattern by the laser irradiation according to the first aspect of the present invention may be any insulating material which can be formed into a three-dimensional shape and a filler material which is activated by laser irradiation . At this time, the filler material is an inorganic filler material, the inorganic filler material includes aluminum nitride, and the aluminum nitride is activated by laser irradiation.

According to a second aspect of the present invention, there is also provided a method of forming a conductive pattern using laser irradiation, comprising: preparing a substrate; Forming a laser irradiation pattern by irradiating a laser beam onto the surface of the base material; and forming a conductive pattern using an electroless plating method on the laser irradiation pattern. At this time, the substrate includes an insulating material that can be formed into a three-dimensional shape and an inorganic filler material that is activated by laser irradiation, wherein the inorganic filler material includes aluminum nitride, It is activated by investigation.

According to any one of the above-described objects of the present invention, a three-dimensional conductive pattern can be formed on a part having a complicated shape through laser irradiation by using a material composed of nitride.

According to an embodiment of the present invention, a composite material having high strength and high thermal conductivity can be formed.

1 is a flowchart of a conductive pattern forming method according to an embodiment of the present invention.
2 is a flow chart of the steps of preparing a substrate according to an embodiment of the present invention.
3 is a diagram showing an example of pattern formation using laser irradiation in an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. It should be understood, however, that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the same reference numbers are used throughout the specification to refer to the same or like parts.

Throughout this specification, when a part is referred to as being "connected" to another part, it is not limited to a case where it is "directly connected" but also includes the case where it is "electrically connected" do.

Throughout this specification, when a member is " on " another member, it includes not only when the member is in contact with the other member, but also when there is another member between the two members.

Throughout this specification, when an element is referred to as "including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise. The terms "about "," substantially ", etc. used to the extent that they are used throughout the specification are intended to be taken to mean the approximation of the manufacturing and material tolerances inherent in the stated sense, Accurate or absolute numbers are used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure. The word " step (or step) "or" step "used to the extent that it is used throughout the specification does not mean" step for.

The present invention relates to a composite material for a conductive pattern and a method for forming a conductive pattern using the same.

A composite material for a conductive pattern according to an embodiment of the present invention and a conductive pattern forming method using the same can be applied to a mobile phone antenna and a motor driving circuit, a sensor circuit, and a medical portable device, which are three- Do. Hereinafter, a conductive pattern forming method according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3. FIG.

As shown in FIG. 1, a conductive pattern forming method according to an embodiment of the present invention includes a step of preparing a substrate (S110), a step of forming a laser pattern by irradiating laser light onto a substrate surface (S120) And forming a conductive pattern on the pattern using an electroless plating method (S130).

In step S110, a substrate 10 (see Fig. 3) in which a conductive pattern is formed is manufactured. The substrate 10 according to an embodiment of the present invention may be manufactured in various shapes by various methods, unlike a conventional PCB manufactured in a limited shape by a limited material and a limited method.

Specifically, the substrate 10 in the embodiment of the present invention may be formed of any insulating material which can be formed into a three-dimensional shape. The substrate 10 may be made of, for example, an acrylonitrile-butadiene-styrene (ABS) resin, a polyester resin, a polycarbonate resin, a PC / ABS resin mixture, a polyamide resin, a modified polyphenyl ether resin, Plastic, or the like. Here, it is preferable to use a thermoplastic resin such as an ABS resin, a polyester resin, or a PC resin in consideration of moldability and cost.

In addition, the substrate 10 in the embodiment of the present invention may further include an inorganic filler material which is activated in the laser irradiation treatment to facilitate the implementation of the conductive pattern, in addition to any polymer resin described above. That is, the substrate 10 in the embodiment of the present invention may be a composite material in which the above-mentioned polymer resin and the inorganic filler material are mixed.

Here, the inorganic filler material may be composed of nitride. At this time, in one embodiment of the present invention, an aluminum nitride material can be utilized to exhibit a characteristic activated by laser irradiation. For example, aluminum nitride is preferably made of AlN material.

On the other hand, a complex of aluminum nitride may be used as an inorganic filler material.

Meanwhile, the substrate 10 in the embodiment of the present invention may be manufactured by any method such as extrusion, injection molding and cutting to form a desired shape. However, in order to solve the problem of applying a considerably high shear force to the manufactured composite material, the substrate 10 in one embodiment of the present invention may be manufactured by a method according to FIG. 2 which may have high thermal conductivity .

Referring to FIG. 2, nitrogen gas and ammonia gas are reacted to an aluminum foil (S111). Next, the aluminum foil is heat-treated to form an aluminum nitride powder (S113).

In the prior art, a direct nitriding method and a carbothermal synthesis method are mainly used. However, in this case, there is a problem that a lot of impurities are contained in the synthesis of aluminum nitride, synthesis of nano-size powder is difficult, and expensive manufacturing costs are required because expensive equipment is utilized. Accordingly, in one embodiment of the present invention, aluminum nitride may be produced by reacting aluminum foil with nitrogen and ammonia gas and performing a heat treatment process.

Next, the aluminum nitride powder is formed into a spherical powder based on a spray-dry technique (S115). In order to realize high thermal conductivity in a composite material, a large number of thermally conductive fillers must be filled, and the larger the filler filler, the higher the thermal conductivity can be realized. In addition, in order to increase the filling rate of the filler in the composite material, it is preferable that the shape of the filler is spherical.

Accordingly, in one embodiment of the present invention, the aluminum nitride powder may be formed into a spherical powder by using a spray dry method in order to make the filler of aluminum nitride into a spherical shape, wherein the spherical powder has a size of 1 to 50 μm .

Meanwhile, in one embodiment of the present invention, in order to maintain the shape of the spherical powder during the mass production process, glass powder may be mixed with the aluminum nitride powder as a binder. That is, spherical powders can be prepared by mixing glass powder and aluminum nitride powder in a spray-drying process.

The thus-prepared spherical powder is subjected to heat treatment up to the softening point of the glass powder (S117). Accordingly, the spherical powder produced in one embodiment of the present invention can be made into a spherical powder in a form more rigid than the spherical powder prepared by using a general organic binder.

Meanwhile, in order to form a composite material having a higher thermal conductivity, an embodiment of the present invention may include a carbon-based material (for example, a carbon nanotube, a carbon fiber, a graphene, ) May be added.

example Filler material Thermal conductivity (Wm ^-1 K ^-1 ) One Cu ₃ N 1 or less 2 AlN (30 vol%) 2.5 3 AlN + CNT 4 4 Boron nitride (30 vol%) 2.0 5 No filler 0.25

Referring again to FIG. 1, in step S120, a certain pattern is formed on the surface of the substrate 10 by using a laser irradiation apparatus. At this time, the nitride component and the laser light constituting the substrate 10 undergo a photochemical reaction, and a laser irradiation pattern 15 having a uniform shape is formed on the surface of the substrate 10 using the photochemical reaction.

More specifically, after a high thermal conductive composite material is produced by using a spherical aluminum nitride powder, the surface of the composite material is irradiated with a laser to remove the polymer and activate the aluminum nitride.

On the other hand, the laser irradiation apparatus is an apparatus for forming a contour of a conductor pattern by irradiating the surface of the substrate 10 with laser beams La and Lb, and can be composed of a laser source, necessary optical system and control unit.

The laser source can be used without limitation as long as it can form a conductor pattern through a photochemical reaction. For example, a YV04 laser or the like can be used. In addition, the laser source can vary its power and processing speed depending on the wavelength used. For example, if a laser having a wavelength of 1064 nm is utilized, a light source having a power of 2 to 6 Watt and a frequency of 40 Hz can be used.

In step S130, a conductive pattern is formed on the laser irradiation pattern 15 using an electroless plating method. That is, the activated aluminum nitride acts as a seed, and a conductive pattern can be formed by subjecting the seed to electroless plating.

At this time, the plating metal forming the conductive metal pattern may be gold, silver, copper, nickel or an alloy thereof which is low in ionization tendency and low in reactivity and excellent in conductivity.

Here, as a method of forming the conductive metal pattern on the laser irradiation pattern 15, an electroless plating method can be used.

In the above description, steps S110 to S130 may be further divided into additional steps or combined into fewer steps, according to an embodiment of the present invention. Also, some of the steps may be omitted as necessary, and the order between the steps may be changed.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

10: substrate
15: laser irradiation pattern

Claims

In a composite material forming a conductive pattern by laser irradiation,
An arbitrary insulating material which can be formed into a three-dimensional shape, and
A filler material activated by laser irradiation,
Wherein the filler material is an inorganic filler material,
The inorganic filler material reacts with nitrogen gas and ammonia gas in an aluminum foil to prevent a shear force from being applied to the conductive pattern, and aluminum nitride formed by heat treatment of the aluminum foil In addition,
The aluminum nitride is formed into a spherical powder by a spray-dry technique, is activated by laser irradiation,
Wherein the spherical powder is formed by mixing a glass powder with the aluminum nitride and heat-treating the glass powder to a softening point of the glass powder.

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The method according to claim 1,
Wherein the filler material further comprises a carbonaceous material.

6. The method according to claim 1 or 5,
Wherein the aluminum nitride is AlN.

In the conductive pattern forming method using laser irradiation,
Preparing a substrate;
Forming a laser irradiation pattern by irradiating the surface of the substrate with a laser beam; and
And forming a conductive pattern on the laser irradiation pattern using an electroless plating method,
The above-
And an inorganic filler material activated by laser irradiation, wherein the inorganic filler material is a mixture of nitrogen and ammonia in an aluminum foil in order to prevent a shear force from being applied to the substrate, Wherein the aluminum nitride is formed into a spherical powder by a spray drying technique and is activated by the laser irradiation,
Wherein the spherical powder is formed by mixing a glass powder with the aluminum nitride and thermally treating the glass powder to a softening point of the glass powder.

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