KR101704175B1 - Conductive laminate - Google Patents

Abstract

The present application relates to a conductive laminate. The conductive laminate of the present application can prevent steam generation that may occur during the slotting process, transportation or storage process, thereby preventing defects in products such as a touch panel to which the conductive laminate is applied, thereby maximizing productivity.

Description

Conductive laminate {CONDUCTIVE LAMINATE}

The present application relates to a conductive laminate and its use.

BACKGROUND ART [0002] A touch panel or a touch screen is variously applied to various information processing terminals such as a mobile communication terminal or an ATM, or a display device such as a TV and a monitor. In addition, as the application to small portable electronic devices increases, there is an increasing tendency for a smaller and lighter touch panel or screen.

In constructing the touch panel or the screen, for example, a conductive laminate as disclosed in Patent Document 1 or 2 is used. Such a conductive laminate may include a pressure-sensitive adhesive layer.

The thicker the pressure sensitive adhesive layer in the conductive laminate is, the more likely it is to generate steam during the slotting process, the transportation or storage process, and the defective product to which the conductive laminate is applied due to the generation of steam .

Patent Document 1: Korean Patent Publication No. 2002-0036837 Patent Document 2: Korean Patent Publication No. 2001-0042939

The present application provides a conductive laminate and its use.

The present application relates to a conductive laminate.

Fig. 1 is a schematic view showing the structure of the conductive laminate of the present application.

As shown in Figure 1, in one example, the conductive laminate comprises a substrate layer 30; A conductive layer 40 formed on one surface of the base layer 30; And a pressure-sensitive adhesive layer 20 adhered to the opposite surface of the conductive layer 40.

The type of the base layer included in the conductive laminate is not particularly limited, and for example, a glass base material or a plastic base material can be used. As the plastic substrate, a polyester film, a polyamide film, a polyvinyl chloride film, a polystyrene film, or a polyolefin film can be used, and a polyester film such as polyethylene terephthalate, an acrylic resin film or a polycarbonate film can be used But is not limited thereto.

In the present application, the thickness of the base layer is not particularly limited and may be suitably set as long as it can function as a conductive laminate. For example, the thickness of the substrate layer may be in the range of about 1 to 500 microns, about 3 to 300 microns, about 5 to 250 microns, or about 10 to 200 microns.

The base layer is not particularly limited, but may be subjected to appropriate bonding treatment such as corona discharge treatment, ultraviolet ray irradiation treatment, plasma treatment, or sputter etching treatment.

A conductive layer may be formed on one surface of the base layer of the conductive laminate of the present application.

The method of forming the conductive layer is not particularly limited, and may be formed by a conventional thin film forming method combining a vacuum deposition method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, And can usually be formed by a vacuum evaporation method or a sputtering method.

Examples of the material constituting the conductive layer include metal such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin or two or more alloys of the above metals, indium oxide, tin oxide, Titanium oxide, cadmium oxide, or a mixture of two or more of them may be used, and the conductive layer may be a crystalline layer or an amorphous layer.

In one example, indium tin oxide (ITO) may be used as a material for forming the conductive layer, but the present invention is not limited thereto.

The thickness of the conductive layer may be adjusted to a range of about 10 nm to 300 nm, about 10 nm to 200 nm, or about 10 nm to 100 nm in consideration of the possibility of forming a continuous coating, conductivity, transparency, and the like.

The conductive layer of the present application may be formed on one surface of the base layer via an anchor layer or a dielectric layer, if necessary. The anchor layer or the dielectric layer improves the adhesion between the conductive layer and the base layer, and improves scratch resistance or flex resistance.

The anchor layer or the dielectric layer may be formed of an inorganic material such as SiO ₂ , MgF ₂ or Al ₂ O ₃ ; A sputtering method, an ion plating method, or a coating method using an organic material such as an acrylic resin, a urethane resin, a melamine resin, an alkyd resin or a siloxane-based polymer, or a mixture of two or more of them. The anchor layer or the dielectric layer may typically be formed to a thickness of about 100 nm or less, specifically, 15 nm to 100 nm or 20 nm to 60 nm.

The conductive laminate of the present application may include a pressure-sensitive adhesive layer adhered to the opposite surface of the base layer on which the conductive layer is formed. The pressure-sensitive adhesive layer may comprise, for example, a crosslinked pressure-sensitive adhesive polymer. The composition of the adhesive polymer can be adjusted to prevent the problem that the adhesive tends to flow out of the film during the slotting or cutting process, or the adhesive tends to flow out depending on the ambient temperature during transport or storage.

For example, the tacky polymer may include a first monomer polymerization unit having a glass transition temperature of less than 0 ° C and a second monomer polymerization unit having a glass transition temperature of 0 ° C or more.

When the glass transition temperature of a monomer is defined in this specification, its glass transition temperature can refer to the glass transition temperature of the homopolymer when the monomer is polymerized to form a homopolymer. Thus, for example, the term "a first monomer having a glass transition temperature of less than 0 ° C" may mean that the glass transition temperature of a homopolymer formed by polymerizing only the first monomers is less than 0 ° C, The second monomer having a transition temperature of 0 ° C or higher "may mean that the glass transition temperature of a homopolymer formed by polymerizing only the second monomers is 0 ° C or higher. In the present specification, the term " monomeric polymerization unit " may mean a form in which the monomer undergoes a polymerization reaction to form a skeleton of the polymer, for example, a main chain or a side chain.

The glass transition temperature of the first monomer contained as a polymerization unit in the tacky polymer may be less than 0 占 폚, less than -10 占 폚, less than -20 占 폚, less than -30 占 폚, or less than -40 占 폚 in other examples. The lower limit of the glass transition temperature of the first monomer is not particularly limited and may be, for example, about -100 ° C, -90 ° C, -80 ° C, or -70 ° C. Use of a monomer having a glass transition temperature within this range can form a pressure-sensitive adhesive layer that can more effectively prevent steam generation.

As the first monomer, for example, alkyl (meth) acrylates having an alkyl group having 1 to 6 carbon atoms or 1 to 5 carbon atoms having a glass transition temperature within the above range can be used. The alkyl group is not particularly limited when it has 1 to 6 carbon atoms, but may be, for example, a branched chain or straight chain alkyl group, more preferably a straight chain alkyl group. Examples of such monomers include ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, sec- (Meth) acrylate, and the like, and one or more of the above can be used.

In another example, the glass transition temperature of the second monomer may be at least 0 ° C, at least 10 ° C, at least 20 ° C, at least 30 ° C, at least 40 ° C, at least 50 ° C, at least 60 ° C, at least 70 ° C, The upper limit of the glass transition temperature of the second monomer is not particularly limited and may be, for example, about 300 ° C, 250 ° C, 200 ° C, 150 ° C, or 120 ° C.

As the second monomer, various types can be used without particular limitation, provided that the second monomer has the above-mentioned glass transition temperature.

The second monomer includes, for example, tertiary butyl acrylate, tertiarybutyl methacrylate, isobutyl methacrylate, 1-hexadecyl (meth) acrylate (Meth) acrylate having a straight-chain or branched-chain alkyl group such as 1-hexadecyl (meth) acrylate or methyl methacrylate; N-alkenylformamide having 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms, or an alkenyl group having 2 to 4 carbon atoms, such as N-vinylformamide; Acrylamide, N, N-diphenyl (meth) acrylamide, N- (n-dodecyl) (meth) acrylamide, N- (meth) acrylamide such as N, N-dimethyl acrylamide, N-hydroxyethyl acrylamide and the like; N-alkyl (meth) acrylamide, N, N-dialkyl (meth) acrylamide or N, N-diaryl (meth) acrylamide; Alkoxyalkyl (meth) acrylates such as 2-methoxyethyl (meth) acrylate and the like; Dihydrodicyclopentadienyl acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, cyclopropyl (meth) acrylate, acrylate, N-naphthyl acrylate, 2-phenoxyethyl (meth) acrylate, phenyl (meth) acrylate, Acrylate, 2-phenylethyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate or dicyclopentanyl (Meth) acrylate having a saturated or unsaturated cyclic hydrocarbon group such as cyclohexyl (meth) acrylate and the like; (Meth) acrylate having an aromatic group; Or styrene may be exemplified.

When the pressure-sensitive adhesive layer is formed using the pressure-sensitive adhesive polymer formed by polymerizing the first and second monomers as described above, the pressure-sensitive adhesive layer can exhibit an appropriate storage modulus at a high frequency range and at a high temperature, and maintains a viscosity at a high temperature in an appropriate range Steaming that can occur during slotting, cutting, or transporting or storing can be prevented.

The adhesive polymer may include, for example, 30 to 80 parts by weight of the first monomer polymerization unit and 10 to 50 parts by weight of the second monomer polymerization unit. In the present specification, the unit " weight part " may mean a ratio of the weight between the respective components. In another example, the tacky polymer may comprise from 40 to 70 parts by weight of the first monomeric polymerization unit and from 20 to 50 parts by weight of the second monomeric polymeric unit or from 40 to 60 parts by weight of the first monomeric polymeric unit, And 20 to 40 parts by weight of the unit. In this range, the pressure-sensitive adhesive polymer can form a pressure-sensitive adhesive layer having more appropriate target physical properties.

In one example, the tacky polymer may further comprise a third monomeric polymerization unit comprising a ring structure comprising nitrogen as a ring constituent atom, in addition to the first and second monomeric polymerization units.

The third monomer is not particularly limited as long as it has a cyclic structure containing nitrogen as a constituent atom. For example, a monomer represented by the following formula (1) can be used.

[Chemical Formula 1]

In formula (1), R is not a hydrogen atom or a polymerizable functional group, or when L and N are connected by a double bond, L may contain at least one oxygen atom or a nitrogen atom and may be substituted with at least one polymerizable functional group And at least one of the carbon atoms of the alkylene group or the alkenylene group may form a carbonyl group, and the alkylene group or the alkenylene group may each independently be alkyl or alkenyl group, And the compound of formula (1) comprises at least one polymerizable functional group.

The ring structure containing the nitrogen as the ring constituting atom may be morpholine, pyrrolidone, oxazoline, caprolactam or imidazole, but is not limited thereto. Examples of the polymerizable functional group include groups having 2 to 12 carbon atoms, 2 to 8 carbon atoms, or an alkyl group having 2 to 12 carbon atoms such as an acrylic group, a methacrylic group, an acryloyl group, a methacryloyl group or a vinyl group, Or an alkenyl group having 2 to 4 carbon atoms.

The term " alkylene group " as used herein is a divalent residue derived from a saturated hydrocarbon chain, and examples of the alkylene group include alkyl groups having 3 to 20 carbon atoms, 3 to 16 carbon atoms, 3 to 12 carbon atoms, It can be a stove. The alkylene group may be substituted with one or more polymerizable functional groups or other substituents and the saturated hydrocarbon chain may contain a heteroatom such as nitrogen (N) or oxygen (O) in the chain.

As used herein, the term " alkenylene group " is a divalent residue derived from a hydrocarbon chain containing at least one carbon-carbon double bond, and the alkenylene group includes, for example, an alkylene group having 3 to 20 carbon atoms, 3 to 16 carbon atoms, 3 to 12, or an alkylene group having 3 to 8 carbon atoms. The alkylene group may be substituted with one or more polymerizable functional groups or other substituents and the hydrocarbon chain may contain a heteroatom such as nitrogen (N) or oxygen (O) in the chain.

Specific examples of the monomer represented by the formula (1) include 4-acryloylmorpholine, 1-vinyl-2-pyrrolidone, 2-isopropenyl- But are not limited to, 2-isopropenyl-2-oxazoline, N-vinylcaprolactam or 1-vinylimidazole.

When a third monomer is included, the tacky polymer may comprise a third monomeric polymerization unit in a proportion of from 1 part by weight to 20 parts by weight, from 1 part by weight to 15 parts by weight, or from 1 part by weight to 10 parts by weight relative to the weight of the other monomer . In this range, the pressure-sensitive adhesive polymer can form a pressure-sensitive adhesive layer having more appropriate target physical properties.

The tacky polymer may further comprise a crosslinkable monomer polymerized unit. As used herein, the term " crosslinkable monomer " may mean a monomer capable of providing a crosslinkable functional group to a polymer when the polymer contains a crosslinkable functional group and another functional group capable of forming a tacky polymer.

In the production of pressure-sensitive adhesives, various monomers which can be used as crosslinking monomers are known, and all of these monomers can be used in the adhesive polymer. Examples of the crosslinkable monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl Hydroxyalkyl (meth) acrylates such as acrylate or 8-hydroxyoctyl (meth) acrylate; (Meth) acrylates such as poly (alkylene glycol) (meth) acrylates such as poly (ethylene glycol) (meth) acrylate or poly (propylene glycol) , Carboxyl group-containing copolymerizable monomers such as 3- (meth) acryloyloxypropyl acid, 4- (meth) acryloyloxybutyl acid, acrylic acid doublet, itaconic acid, maleic acid or maleic anhydride But is not limited thereto.

When the crosslinkable monomer polymerization unit is contained in the tacky polymer, for example, the crosslinkable monomer polymerization unit may be used in an amount of 1 part by weight to 30 parts by weight, 5 parts by weight to 30 parts by weight, 10 parts by weight to 30 parts by weight Or 12 parts by weight to 30 parts by weight. It may be advantageous to provide a pressure-sensitive adhesive composition having a storage elastic modulus and / or viscosity of a specific range or more, which will be described later, by adjusting the pressure-sensitive adhesive polymer to include the above-mentioned crosslinkable monomer unit within the above-mentioned range.

In one example, the tacky polymer may have a weight average molecular weight of from 300,000 to 250,000, from 300,000 to 2,000,000, or from 300,000 to 150. The term "weight average molecular weight" as used in the present application means a value converted to standard polystyrene measured by GPC (Gel Permeation Chromatography). Use of a pressure-sensitive adhesive polymer having a weight average molecular weight within this range may be advantageous for the formation of a pressure-sensitive adhesive having desired properties.

The tacky polymer may have, for example, a glass transition temperature of -80 캜 to 30 캜, -70 캜 to 30 캜, or -60 캜 to 30 캜. If the glass transition temperature is within this range, the effect of adding the pressure-sensitive adhesive polymer can be increased, and thus the storage elastic modulus and / or viscosity of the pressure-sensitive adhesive layer containing the pressure-sensitive adhesive polymer described later can be adjusted to a specific range or more.

The method for producing the adhesive polymer is not particularly limited and may be a method in which the monomer is mixed at an appropriate ratio and solution polymerization, photo polymerization, bulk polymerization, suspension polymerization, Or by emulsion polymerization. [0033] The term " polymer " If necessary in this process, suitable polymerization initiators or molecular weight regulators, chain transfer agents and the like may be used together.

The pressure-sensitive adhesive layer may further comprise a crosslinking agent capable of crosslinking the pressure-sensitive adhesive polymer. The crosslinking agent may be a crosslinking agent having at least two or more functional groups capable of reacting with the crosslinkable functional group contained in the adhesive polymer, 2 to 10, 2 to 8, 2 to 6, or 2 to 4 Crosslinking agents may be used. As such a cross-linking agent, an appropriate type may be selected and used from among conventional cross-linking agents such as an isocyanate cross-linking agent, an epoxy cross-linking agent, an aziridine cross-linking agent or a metal chelate cross-linking agent considering the kind of the cross-linkable functional group of the adhesive polymer.

Examples of the isocyanate crosslinking agent include diisocyanate compounds such as tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoboron diisocyanate, tetramethylxylene diisocyanate, and naphthalene diisocyanate; And a reaction product of a polyol such as trimethylolpropane or an isocyanurate adduct of the above diisocyanate compound. Of these, xylene diisocyanate or hexamethylene diisocyanate can be preferably used. As the epoxy crosslinking agent Is composed of ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N, N, N'N 'tetraglycidyl ethylenediamine and glycerin diglycidyl ether And one or more selected from the group consisting of amino acids.

Examples of the aziridine crosslinking agent include N, N 'toluene-2,4-bis (1-aziridine carboxamide), N, N' diphenylmethane-4,4'bis (1-aziridine carboxamide) , Triethylene melamine, bisisoproparyl-1- (2-methyl aziridine), or tri-1-aziridinyl phosphine oxide, but the present invention is not limited thereto. Examples of the metal chelate crosslinking agent include And compounds in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium and / or vanadium is coordinated to acetyl acetone or ethyl acetonate, and the like.

The crosslinking agent may be contained in an amount of, for example, 0.01 to 10 parts by weight, 0.015 to 5 parts by weight, 0.02 to 2.5 parts by weight or 0.025 to 1 part by weight based on 100 parts by weight of the adhesive polymer . The cross-linking agent may be regulated to be included in the adhesive polymer within the above-mentioned range so that the pressure-sensitive adhesive layer has a storage elastic modulus and / or viscosity, which will be described later, within a desired range.

The pressure-sensitive adhesive layer may further include at least one selected from a coupling agent, a tackifier, a UV stabilizer, an antioxidant, a colorant, a reinforcing agent, a filler, a defoamer, a surfactant and a plasticizer, if necessary.

The pressure-sensitive adhesive layer of the conductive laminate of the present application may have a storage modulus of 0.5 MPa or more, 0.55 MPa or more, or 0.6 MPa or more as measured at a temperature of 30 DEG C and a frequency of 500 rad / sec in a state where the adhesive polymer is crosslinked. The upper limit of the storage elastic modulus measured at the temperature of 30 DEG C and the frequency of 500 rad / sec is not particularly limited and may be, for example, 1.2 MPa or less, 1.1 MPa or less or 1.0 MPa or less.

The pressure-sensitive adhesive layer may have a storage elastic modulus of 0.05 MPa or more, 0.055 MPa or more, 0.06 MPa or more, 0.065 MPa or more, or 0.07 MPa or more at a temperature of 80 캜 and a frequency of 1 rad / sec in a state of implementing a crosslinked structure. The upper limit of the storage elastic modulus of the pressure-sensitive adhesive layer measured at a temperature of 80 DEG C and a frequency of 1 rad / sec is not particularly limited and may be, for example, 0.12 MPa or less, 0.11 MPa or less, 0.1 MPa or less or 0.095 MPa or less.

By controlling the storage modulus of the pressure-sensitive adhesive layer within the above-mentioned range, it is possible to prevent the occurrence of steam that may occur during the slotting process, the transportation or the storage process of the product in which the conductive laminate including the pressure-sensitive adhesive layer is applied, Thereby maximizing the productivity of the product.

In one example, the pressure-sensitive adhesive layer is temperature 80 ℃ In one embodiment, a cross-linking structure state and 1rad / sec the complex viscosity at a frequency of 5 × 10 ⁴ Pa · s or more, 5.5 × 10 ⁴ Pa · s or more, 6.0 × 10 ⁴ Pa s or more, 6.5 x 10 ⁴ Pa s or more, or 7.0 x 10 ⁴ Pa s. The pressure-sensitive adhesive layer has an upper limit of the complex viscosity measured at a temperature of 80 ℃ and 1rad / sec frequency is not particularly limited, 3 × 10 ⁶ Pa · s or less, 2.5 × 10 ⁶ Pa · s or less, 2.0 × 10 ⁶ Pa · s Or 1.5 x 10 < ⁶ > Pa s or less.

By controlling the complex viscosity of the pressure-sensitive adhesive layer within the above-mentioned range, it is possible to prevent the occurrence of steam that may occur during the slotting process, the transportation or the storage in the product using the conductive laminate including the pressure-sensitive adhesive layer, Thereby maximizing the productivity of the product.

The conductive laminate includes the above-described base layer, conductive layer and pressure-sensitive adhesive layer as basic units, and if necessary, other elements usually used for forming the conductive laminate, such as a transparent sheet layer, a release film layer or a hard coating layer The present application is also directed to a touch panel. The exemplary touch panel may include the conductive laminate as an electrode plate for a touch panel, for example.

The touch panel may have a known structure including an electrostatic capacity type or a resistance film type as long as the touch panel includes the conductive laminated body. The conductive laminate can be used for forming various devices such as a touch panel or a liquid crystal display.

The conductive laminate of the present application can prevent the steam phenomenon that may occur during the slotting process, transportation or storage process, thereby preventing the defective product from being applied to the conductive laminate, thereby maximizing the productivity.

1 is a diagram schematically showing the structure of a conductive laminate according to one example of the present application.

Hereinafter, the present application will be described in more detail by way of examples according to the present application and comparative examples not complying with the present application, but the scope of the present application is not limited by the following embodiments.

The physical properties in the following examples and comparative examples were evaluated in the following manner.

1. Measurement of glass transition temperature

The glass transition temperature after forming the homopolymer for each of the monomers as raw materials used in each production example was referred to based on the known data (thermal transitions of homopolymers), and the glass transition temperature of the sticking polymers prepared in each production example was 5 mg of each sample was measured at a temperature raising rate of 10 캜 / min using differential scanning calorimetry (DSC, TA corporation) at a temperature ranging from -100 캜 to 50 캜.

2. Molecular weight measurement

The weight average molecular weight (Mw) was measured using GPC under the following conditions, and the measurement results were converted using standard polystyrene of Agilent system for the calibration curve.

<Measurement Conditions>

Measuring instrument: Agilent GPC (Agilent 1200 series, U.S.)

Column: Two PL Mixed B connections

Column temperature: 40 ° C

Eluent: THF (Tetrahydrofuran)

Flow rate: 1.0 mL / min

Concentration: ~ 1 mg / mL (100 μL injection)

3. Evaluation of storage modulus (A)

The storage elastic modulus of the pressure-sensitive adhesive layer contained in the conductive laminate prepared in Examples and Comparative Examples was measured using a Rheometric Expansion System (TA). The pressure-sensitive adhesive layer was cut into a specimen having a thickness of 1 mm and a width of 50 mm and a length of 50 mm. Then, a frequency sweep was performed using a Parallel Plate Fixture having a diameter of 8 mm under a strain of 10% Lt; RTI ID = 0.0 &gt; 30 C &lt; / RTI &gt; and a frequency of 500 rad / sec.

4. Evaluation of storage modulus (B)

The storage elastic modulus of the pressure-sensitive adhesive layer contained in the conductive laminate prepared in Examples and Comparative Examples was measured using a Rheometric Expansion System (TA). The pressure-sensitive adhesive layer was cut into a specimen having a thickness of 1 mm and a width of 50 mm and a length of 50 mm. Then, a frequency sweep was performed using a Parallel Plate Fixture having a diameter of 8 mm under a strain of 10% Lt; RTI ID = 0.0 &gt; 80 C &lt; / RTI &gt; and a frequency of 1 rad / sec.

5. Evaluation of Viscosity

The storage elastic modulus of the pressure-sensitive adhesive layer contained in the conductive laminate prepared in Examples and Comparative Examples was measured using a Rheometric Expansion System (TA). The pressure-sensitive adhesive layer was cut into a specimen having a thickness of 1 mm and a width of 50 mm and a length of 50 mm. Then, a frequency sweep was performed using a Parallel Plate Fixture having a diameter of 8 mm under a strain of 10% Lt; RTI ID = 0.0 &gt; 30 C &lt; / RTI &gt;

6. Evaluation of Steaming Phenomena (1)

The conductive laminate including the PET film prepared in Examples and Comparative Examples was cut into two specimens having a size of 100 mm x 100 mm (width x length), and then the two specimens were overlapped with each other by the upper and lower edges, After rubbing about 10 times, the extent to which the pressure-sensitive adhesive was applied to the surface of the PET film from the pressure-sensitive adhesive layer while peeling off was visually observed and evaluated according to the following criteria.

<Evaluation Criteria>

○: The adhesive on the surface of the film was not visually confirmed.

X: The adhesive on the surface of the film was observed visually.

7. Evaluation of steam phenomena (2)

After applying a force of 10 kgf for 24 hours at 60 DEG C to the conductive laminate including the PET film prepared in Examples and Comparative Examples, the amount of the adhesive contained in the pressure-sensitive adhesive layer exiting from the PET film was visually observed Observations were made based on the following criteria.

<Evaluation Criteria>

○: It is not visually confirmed that the adhesive is released between the films.

X: The viscous agent was observed to be evacuated from the film to the naked eye.

Manufacturing example  1. Preparation of adhesive polymer (A1)

50 parts by weight of n-butyl acrylate (BA), 30 parts by weight of isobornyl acrylate (IBOA), 2 parts by weight of 2-hydroxyethyl acrylate (HEA) and 5 parts by weight of 1-vinyl-2-pyrrolidone (VP). Subsequently, 100 parts by weight of ethyl acetate (EAc) was poured into a solvent, and nitrogen gas was purged for 60 minutes to remove oxygen. Then, while maintaining the temperature at 60 占 폚, azobisisobutyronitrile (AIBN) were added to initiate the reaction. Thereafter, the reaction product which had been reacted for about 5 hours was diluted with ethyl acetate (EAc) to prepare a sticky polymer (A1).

Manufacturing example  2 to Manufacturing example  7. Preparation of sticky polymers (A2 to A5 and B1 to B2)

(A2 to A5 and B1 to B2) were prepared in the same manner as in Production Example 1, except that the types and / or ratios of raw materials and additives used in the polymerizing the adhesive polymer were controlled as shown in Table 1 below. Respectively.

Raw material EA V-65 BA IBOA MA MMA HEA VP ACMO EHA Stickiness
polymer A1 50 30 - 15 5 - - 100 0.06 A2 50 30 - 15 - 5 - 100 0.06 A3 55 30 - - 15 - - - 100 0.06 A4 55 - 30 - 15 - - - 100 0.06 A5 55 - - 30 15 - - - 100 0.06 B1 - 30 - - 15 - - 55 100 0.06 B2 - - 40 - 10 - - 50 100 0.06 Content Unit: g
BA: n-butyl acrylate (homopolymer Tg: about -54 ° C)
IBOA: isobornyl acrylate (homopolymer Tg: about 94 ° C)
MA: Methyl acrylate (homopolymer Tg: about 10 ° C)
MMA: methyl (meth) acrylate (homopolymer Tg: about 110 ° C)
HEA: 2-hydroxyethyl acrylate (homopolymer Tg: about -15 ° C)
VP: 1-vinyl-2-pyrrolidone (homopolymer Tg: about 54 ° C)
ACMO: 4-acryloylmorpholine (homopolymer Tg: about 145 ° C)
EHA: 2-ethylhexyl acrylate (homopolymer Tg: about -50 ° C)
EA: ethyl acetate (homopolymer Tg: about -24 ° C)
V-65: 2,2'-azobis (2,4-dimethyl valeronitrile)
Tg: glass transition temperature

Example  One

Preparation of pressure-sensitive adhesive composition

0.5 part by weight of xylene diisocyanate (Takenate D110N, Mitsui Chemicals, Inc.) as a crosslinking agent was uniformly mixed with 100 parts by weight of the pressure-sensitive adhesive polymer (A1) prepared in Preparation Example 1 to prepare a pressure-sensitive adhesive composition.

Conductivity Of the laminate  Produce

On one surface of the PET film, the pressure-sensitive adhesive composition was releasably treated with silicone, and the pressure-sensitive adhesive composition thus prepared was coated thereon to a thickness of about 50 mu m and dried to form a pressure-sensitive adhesive layer. Thereafter, the pressure-sensitive adhesive layer was transferred to the opposite surface of a PET film (thickness: about 25 mu m) having an ITO layer formed on one surface thereof in a usual manner, and the PET film thus treated was peeled off to produce a conductive laminate.

Example  2

A pressure-sensitive adhesive composition and a conductive laminate were prepared in the same manner as in Example 1, except that A2 was used instead of A1 as the adhesive polymer.

Example  3

A pressure-sensitive adhesive composition and a conductive laminate were prepared in the same manner as in Example 1, except that A3 was used instead of A1 as the tacky polymer.

Example  4

A pressure-sensitive adhesive composition and a conductive laminate were prepared in the same manner as in Example 1, except that A4 was used instead of A1 as the tacky polymer.

Example  5

A pressure-sensitive adhesive composition and a conductive laminate were prepared in the same manner as in Example 1, except that A5 was used instead of A1 as the tacky polymer.

Comparative Example  One

A pressure-sensitive adhesive composition and a conductive laminate were prepared in the same manner as in Example 1 except that B1 was used instead of A1 as the adhesive polymer.

Comparative Example  2

A pressure-sensitive adhesive composition and a conductive laminate were prepared in the same manner as in Example 1, except that B2 was used instead of A1 as the adhesive polymer.

The physical properties and evaluation results of the above-mentioned Examples and Comparative Examples are shown in Table 2 below.

division Example Comparative Example One 2 3 4 5 One 2 Sticky polymer
(Tg, ° C) A1
(-One) A2
(-One) A3
(-17) A4
(-33) A5
(-16) B1
(-41) B2
(-49) Molecular weight (unit: million) 74 90 148 149 40 130 140 Storage elasticity (1)
(× 10 ⁵ )
(Unit: pa) 7.9 6.2 6.4 6.9 9.1 4.1 2.8 Storage elasticity (2)
(× 10 ⁴ )
(Unit: pa) 8.2 6.9 7.4 7.2 9.4 3.6 4.4 Viscosity (× 10 ⁴ )
(Unit: pa · s) 8.6 7.3 7.8 6.7 9.5 3.8 4.6 Steam Evaluation (1) ○ ○ ○ ○ ○ × × Steam Assessment (2) ○ ○ ○ ○ ○ × ×

As can be seen from the above Table 2, in the case of the conductive laminate of the present application, the storage elastic modulus and / or viscosity exceeding a specific range are prevented, thereby preventing generation of steam which may occur in the slotting process, Thereby maximizing productivity.

20: pressure-sensitive adhesive layer
30: substrate layer
40: conductive layer

Claims (20)

A base layer;
A conductive layer formed on one surface of the base layer; And
And a pressure-sensitive adhesive layer adhered to an opposite surface on which the conductive layer is formed,
Wherein the pressure-sensitive adhesive layer comprises a pressure-sensitive adhesive polymer and has a storage elastic modulus at 30 DEG C and 500 rad / sec in a state of realizing a crosslinked structure of 0.5 MPa to 1.2 MPa,
The pressure-sensitive adhesive polymer is prepared by mixing 40 to 60 parts by weight of a first monomer polymerization unit capable of forming a homopolymer having a glass transition temperature of less than 0 DEG C and a second monomer polymerization unit capable of forming a homopolymer having a glass transition temperature of 0 DEG C or higher And 20 parts by weight to 40 parts by weight of the conductive polymer. The conductive laminate according to claim 1, wherein the base layer is at least one selected from the group consisting of a glass substrate, a polyester film, a polyamide film, a polyvinyl chloride film, a polystyrene film and a polyolefin film. The method of claim 1, wherein the conductive layer comprises at least one of gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, indium oxide, tin oxide, titanium oxide, cadmium oxide or copper iodide Conductive laminate. The conductive laminate according to claim 1, wherein the conductive layer is formed on one surface of the substrate layer via an anchor layer or a dielectric layer. The conductive laminate according to claim 1, wherein the pressure-sensitive adhesive layer has a storage elastic modulus at 30 占 폚 and 500 rad / sec of 0.5 MPa to 1.1 MPa in a state of realizing a crosslinked structure. The conductive laminate according to claim 1, wherein the pressure-sensitive adhesive layer has a storage elastic modulus at 80 占 폚 and 1 rad / sec of 0.05 MPa or more in a state of realizing a crosslinked structure. The conductive laminate according to claim 1, wherein the pressure-sensitive adhesive layer has a composite viscosity of 5 x 10 &lt; ⁴ &gt; Pa s or more at 80 DEG C and 1 rad / sec in a state where a crosslinked structure is implemented. The conductive laminate according to claim 1, wherein the tacky polymer has a weight average molecular weight of 300,000 to 2,500,000. The conductive laminate according to claim 1, wherein the tacky polymer has a glass transition temperature in the range of -80 占 폚 to 30 占 폚. The positive resist composition according to claim 1, wherein the first monomer is at least one selected from the group consisting of ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, sec- And n-hexyl (meth) acrylate. delete (Meth) acrylamide, N-alkyl (meth) acrylamide, N, N &lt; RTI ID = 0.0 &gt; (Meth) acrylate having a dialkyl (meth) acrylamide, N, N-diaryl (meth) acrylamide, alkoxyalkyl (meth) acrylate, a saturated or unsaturated cyclic hydrocarbon group or an aromatic group; Or styrene. The conductive laminate according to claim 1, wherein the second monomer is capable of forming a homopolymer having a glass transition temperature in the range of 80 占 폚 to 300 占 폚. The conductive laminate of claim 1, wherein the tacky polymer further comprises 1 to 20 parts by weight of a third monomeric polymerized unit comprising a cyclic structure containing nitrogen as a ring constituent atom. 15. The conductive laminate according to claim 14, wherein the third monomer is represented by the following formula (1)
[Chemical Formula 1]

In formula (1), R is not a hydrogen atom or a polymerizable functional group, or when L and N are connected by a double bond, L may contain at least one oxygen atom or a nitrogen atom and may be substituted with at least one polymerizable functional group And at least one of the carbon atoms of the alkylene group or the alkenylene group may form a carbonyl group, and the alkylene group or the alkenylene group is independently an alkyl group or an alkenyl group, And the compound of formula (1) comprises at least one polymerizable functional group. 15. The method of claim 14, wherein the third monomer is selected from the group consisting of 4-acryloylmorpholine, 1-vinyl-2-pyrrolidone, 2-isopropenyl- 2- oxazoline, N- vinylcaprolactam, And at least one selected from the group consisting of a metal oxide and a sol. The conductive laminate according to claim 1, wherein the tacky polymer further comprises 1 to 30 parts by weight of a crosslinkable monomer. The conductive laminate according to claim 1, wherein the pressure-sensitive adhesive layer further comprises a crosslinking agent which crosslinks the tacky polymer. The conductive laminate according to claim 1, wherein the pressure-sensitive adhesive layer comprises at least one selected from the group consisting of a coupling agent, a tackifier, a UV stabilizer, an antioxidant, a colorant, a reinforcing agent, a filler, a defoamer, a surfactant and a plasticizer. A touch panel comprising the conductive laminate according to any one of claims 1 to 10 and 12 to 19.

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