KR101699125B1 - Conductive film and method for manufacturing it - Google Patents

Abstract

The present application relates to a method for producing a conductive film, a conductive film and a use thereof. In the present application, it is possible to provide a conductive film which is generated, for example, by heat treatment in a manufacturing process, and which does not contain bubbles or the like which hinders optical properties. In particular, even when the conductive film has a conductive layer on both sides, it is possible to provide a conductive film free from air bubbles.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a conductive film,

The present application relates to a conductive film and its use and a method of manufacturing the same.

The conductive film typified by ITO (Indium Tin Oxide) film can be used for various applications such as a display device such as a PDP (Plasma Display Panel) or an LCD (Liquid Crystal Display), an electrode such as OLED (Organic Light Emitting Diode) .

The conductive film can be produced by forming a conductive layer such as ITO on one surface or both surfaces of a glass substrate, a plastic film, or the like by vapor deposition or the like.

In the manufacturing process of the conductive film, a heat treatment process at a high temperature can be performed to crystallize the conductive layer such as ITO. Particularly, when a conductive layer is formed on a plastic film and a heat treatment is performed at a high temperature, air bubbles or the like may be generated inside the conductive film due to the influence of low molecular components such as oligomers present in the plastic film. Which is a factor that hinders the optical properties of the film. Particularly, when a conductive layer is formed on both sides of the film, the conductive layer acts as a barrier against bubbles, and it becomes more difficult to remove bubbles generated.

Patent Document 1: Korean Published Patent Application No. 2007-0055363 Patent Document 2: Korean Patent Publication No. 2004-0012552

The present application provides a method for producing a conductive film, a conductive film, and uses thereof.

The present application relates to an intermediate substrate layer; And an electrically conductive base layer adhered to one surface or both surfaces of the intermediate base layer. The conductive base layer is attached so that the room temperature peeling force of the intermediate base layer measured at a peeling speed of 0.3 m / min and a peeling angle of 180 is 1000 gf / inch or more.

In the present application, the conductive base layer is adhered to one side or both sides of the intermediate base layer so that the room temperature peeling force for the intermediate base layer measured at a peeling rate of 0.3 m / min and a peeling angle of 180 is 1000 gf / inch or more And a method for producing the conductive film.

Moreover, the present application provides the use of the conductive film.

In the present application, it is possible to provide a conductive film which is generated, for example, by heat treatment in a manufacturing process, and which does not contain bubbles or the like which hinders optical properties. In particular, even when the conductive film has a structure in which a conductive layer is present on both sides, it is possible to provide a conductive film free from air bubbles, its use, and its production method.

In addition, the present application can provide a conductive film comprising a conductive base layer having an excellent peeling force for an intermediate base layer, its use, and a method for producing the same.

Figs. 1 and 2 are schematic views showing a manufacturing process of a transparent conductive film produced by adhering a conductive base layer before a layer of the adhesive composition of the present application is crosslinked.
Fig. 3 is a schematic view showing a manufacturing process of a transparent conductive film produced by crosslinking a layer of the adhesive composition of the present application to form a pressure-sensitive adhesive layer, followed by adhering a conductive base layer.
Fig. 4 is a schematic view showing a manufacturing process of a transparent conductive film produced by crosslinking after the layer of the adhesive composition of the present application is bonded with the conductive base layer before crosslinking. Fig.
Figs. 5 and 6 are schematic views illustrating a heat treatment process for crosslinking the layer of the pressure-sensitive adhesive composition of the present application.

This application relates to a conductive film, a method for producing a conductive film, and a use of a conductive film.

Bubbles that can be generated during the heat treatment of the conductive film are a factor that hinders the optical properties such as transparency of the conductive film and bubbles may occur due to a decrease in the peeling force between the intermediate base layer and the conductive base layer. Therefore, in order to suppress bubbles that may occur in the conductive film, a step of increasing the peeling force between the intermediate base layer and the conductive base layer is required.

The present application relates to a method for producing a pressure-sensitive adhesive composition, which comprises forming a layer of a pressure-sensitive adhesive composition on one side or both sides of an intermediate substrate layer and then introducing a crosslinking reaction into the layer of the pressure- This excellent conductive film can be provided.

The step of forming the layer of the pressure-sensitive adhesive composition may be performed by directly coating the pressure-sensitive adhesive composition on the intermediate substrate layer or by laminating a layer of the pressure-sensitive adhesive composition in a film state. That is, the layer of the adhesive composition may mean a film-type layer formed from a pressure-sensitive adhesive composition that is laminated on the intermediate substrate layer or a layer formed by directly applying the pressure-sensitive adhesive composition to the intermediate substrate layer.

The term pressure-sensitive adhesive composition in the present application means a composition in which the crosslinking reaction has not proceeded, and the term pressure-sensitive adhesive may refer to a state after the pressure-sensitive adhesive composition has undergone the crosslinking reaction. Therefore, the layer of the pressure-sensitive adhesive composition of the present application may mean a layer in which the layer of the pressure-sensitive adhesive composition formed on the intermediate substrate layer is not subjected to the crosslinking reaction, and the term pressure- Quot; layer " refers to a layer in which a layer is crosslinked through a crosslinking reaction. The crosslinked state may be understood to include not only a state where the crosslinking reaction is completed but also a state in which the crosslinking reaction is proceeding.

The conductive film of the present application can be adhered so that the conductive base layer exhibits a high peeling force to the intermediate base layer by being produced by the above-described process, and thereby, in the conductive film, for example, Bubbles are not generated from the interface of the base layer or the like, and lifting or peeling at the interface can be prevented.

That is, in the present application, the conductive base layer is adhered to one surface or both surfaces of the intermediate base layer such that the peeling force at room temperature on the intermediate base layer measured at a peeling rate of 0.3 m / min and a peeling angle of 180 degrees is 1,000 gf / The present invention also relates to a method for producing a conductive film. In the present application, the term ambient temperature refers to a natural, non-warmed or non-warmed temperature, and may refer to a temperature of, for example, about 20 to 30 캜, about 20 to 28 캜, about 25 캜 or about 23 캜 .

The conductive base layer of the present application is adhered via a layer of a pressure-sensitive adhesive composition contained in one side or both sides of the intermediate base layer, and the intermediate base layer has a thickness of 100 m < 2 > The peel strength at room temperature may be 1,000 gf / inch to 5,000 gf / inch or 1,000 gf / inch to 10,000 gf / inch. When the peeling force of the conductive base layer is maintained within this range, bubbles or the like may be generated in the inside and the case where the optical property is lowered can be prevented.

The layer of the pressure-sensitive adhesive composition of the present application may be formed by directly applying the pressure-sensitive adhesive composition onto the intermediate substrate layer, or may be formed by laminating a layer of the pressure-sensitive adhesive composition in a film state on one side or both sides of the intermediate base layer.

That is, in the method for producing a conductive film of the present application, a non-crosslinked pressure-sensitive adhesive composition is applied to one surface or both surfaces of an intermediate substrate layer, and a conductive base layer is adhered to the intermediate base layer through the layer of the applied pressure- ≪ / RTI >

1, the conductive film of the present application is produced by forming a layer 12a of a sticky composition on one side of an intermediate substrate layer 11 and then attaching the conductive substrate layer 13 .

1, the conductive base layer 13 may include an intermediate base layer 13a and a conductive layer 13b formed on one surface of the base layer 13a. In this case, when the conductive layer 13b is not formed The surface of the base layer 13a can be attached to the intermediate base layer 11 via the layer 12a of the sticky composition.

2, a layer 12a of the adhesive composition is formed on both sides of the intermediate substrate layer 11, and the conductive substrate layer 13 is formed on the intermediate substrate 11 via the layer 12a of the adhesive composition, And adhering to both sides of the layer 11.

In the case of a step of producing a conductive film containing a conductive base layer on both sides of the intermediate base layer, the formation of the layers on both sides may be carried out sequentially or simultaneously. That is, in the step of forming the layer 12a of the adhesive composition on both sides as shown in Fig. 2, the pressure-sensitive adhesive composition is first applied to one side of the intermediate substrate layer 11 to form the layer 12a, The release film 14 may be laminated on the other side of the intermediate substrate layer 11 and then the pressure sensitive adhesive composition may be applied to the other side of the intermediate substrate layer 11 to form the layer 12a and then the release film 14 may be laminated again. Thereafter, the release film 14 may be sequentially or simultaneously peeled off, and then the conductive base layer 13 may be laminated on the intermediate base layer 11 via the layer 12a of the pressure-sensitive adhesive composition as shown in Fig. Further, a step of laminating a layer of a pressure-sensitive adhesive composition and a conductive base layer on one surface of an intermediate base layer in this order, and then laminating a layer of a pressure-sensitive adhesive composition and a conductive base layer on the other surface of the intermediate base layer, .

The conductive base layer may be adhered in the form of a layer of a non-crosslinked pressure-sensitive adhesive composition, or may be adhered in a state in which the crosslinking reaction is completed in the layer or the crosslinking reaction proceeds to form a pressure-sensitive adhesive layer. That is, crosslinking of the layer of the pressure-sensitive adhesive composition may be further performed before or after the adhesion of the conductive base layer.

Specifically, as shown in FIG. 3, the conductive film of the present application is prepared by adhering the conductive base layer 13 on the pressure-sensitive adhesive layer 12b formed by inducing a crosslinking reaction on the layer of the pressure-sensitive adhesive composition before the conductive base layer is adhered ≪ / RTI > Further, as shown in Fig. 4, the conductive film of the present application may be produced through a process in which a conductive base layer is adhered and then a crosslinking reaction is induced in the layer of the adhesive composition.

As the intermediate substrate layer on which the layer of the pressure-sensitive adhesive composition of the present application can be formed, a known material can be used without any particular limitation. For example, examples of the intermediate substrate layer include a polyester film such as a polyethylene terephthalate film, a polyethylene naphthalate film or a polybutylene terephthalate film, a polyether sulfone film, a polyamide film, a polyimide film, Various kinds of plastic films such as a polymer film, a polymer film, a (meth) acrylate film, a polyvinyl chloride film, a polystyrene film, a polyvinyl alcohol film, a polyarylate film or a polyphenylene sulfide film can be used. The plastic film may be a non-oriented film or a stretched film such as a uniaxial or biaxially oriented film. One surface or both surfaces of the intermediate substrate layer may be subjected to a surface treatment such as a corona discharge, an ultraviolet ray irradiation, a plasma or a sputter etching treatment, or a surface treatment layer such as a hard coating layer or an anti-blocking layer. Each of the surface treatment or surface treatment layer may be performed or formed using a known method or material, and the specific treatment method and material are not particularly limited. The thickness of the intermediate substrate layer is not particularly limited, and can be formed to an appropriate thickness in consideration of the intended use.

In this application, as an example of a step of forming a pressure-sensitive adhesive composition on one side or both sides of the intermediate base layer, the pressure-sensitive adhesive composition may be applied directly to form a pressure-sensitive adhesive composition layer. In this case, the direct application may mean a state in which an uncrosslinked pressure-sensitive adhesive composition is applied to the intermediate substrate layer in such a state, or diluted with an appropriate solvent to prepare a coating solution and then applied.

The method of applying the pressure-sensitive adhesive composition is not particularly limited and may be applied by a conventional coating method such as bar coating, blade coating or spin coating. The pressure-sensitive adhesive composition may be directly applied to the surface of the intermediate substrate layer, or may be applied to the surface of the surface treatment layer when the surface treatment layer or the like is present in the intermediate substrate layer.

As the pressure-sensitive adhesive composition, a known pressure-sensitive adhesive composition may be used. For example, an acrylic pressure sensitive adhesive composition, a silicone pressure sensitive adhesive composition, a rubber pressure sensitive adhesive composition or a polyester pressure sensitive adhesive composition may be used as the pressure sensitive adhesive composition. Generally, an acrylic pressure sensitive adhesive composition may be used.

The acrylic pressure sensitive adhesive composition may, for example, comprise an acrylic polymer, and the acrylic polymer may be a polymer capable of exhibiting tackiness. The acrylic polymer may include, for example, a polymerization unit derived from a compound represented by the following formula (1) and a polymerization unit derived from a monomer having a crosslinkable functional group. The term polymerized unit derived from the term monomer in the present application may mean a state in which a polymer formed by polymerization of a certain monomer is contained in a skeleton such as a side chain or a main chain.

[Chemical Formula 1]

In Formula (1), R ¹ is hydrogen or an alkyl group having 1 to 4 carbon atoms, and R ² is a linear or branched alkyl group having 2 or more carbon atoms.

The alkyl group for R ² may be, for example, a straight chain or branched chain alkyl group having 2 to 20 carbon atoms, 2 to 14 carbon atoms, or 2 to 10 carbon atoms.

The types of the compounds of the formula (1) that can be used for producing acrylic polymers having adhesiveness are variously known. For example, the compound of Formula 1 may be at least one compound selected from the group consisting of ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n- (Meth) acrylate, n-butyl (meth) acrylate, sec-butyl (meth) acrylate, pentyl Octyl (meth) acrylate, isobonyl (meth) acrylate or lauryl (meth) acrylate. One or more of such compounds may be polymerized to form polymerized units of the polymer.

The acrylic polymer may also comprise polymerized units derived from a monomer containing a crosslinkable functional group. The term cross-linkable functional group-containing monomer in the present specification may mean a monomer which simultaneously contains a functional group capable of copolymerizing with another compound forming an acrylic polymer such as the compound of the above-mentioned formula (1) and a crosslinkable functional group. Such monomers can be polymerized to provide crosslinkable functional groups to acrylic polymers. As the crosslinkable functional group, for example, a hydroxyl group, a carboxyl group, an epoxy group, an amine group, a glycidyl group or an isocyanate group are known, and in the field of the production of a pressure sensitive adhesive, a monomer capable of providing such a crosslinkable functional group Lt; / RTI >

Examples of the monomer containing a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (Meth) acrylate such as hydroxyalkyl (meth) acrylate or 8-hydroxyoxyl (meth) acrylate, hydroxypolyethylene glycol (meth) acrylate or hydroxypolypropylene glycol Polyalkylene glycol (meth) acrylate, and the like, but are not limited thereto.

Examples of the monomer containing a carboxyl group include (meth) acrylic acid, 2- (meth) acryloyloxyacetic acid, 3- (meth) acryloyloxypropyl acid, 4- (meth) acryloyloxybutyric acid, Dimer, itaconic acid, maleic acid, or maleic anhydride.

Examples of the monomer containing an amine group of the present application include 2-aminoethyl (meth) acrylate, 3-aminopropyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate or N, Propyl (meth) acrylate, and the like.

The acrylic polymer may include, for example, 80 to 99.9 parts by weight of the compound of Formula 1 and 0.1 to 10 parts by weight of the crosslinkable functional group-containing monomer. As used herein, the term " weight portion " means the ratio of the weight between the components unless otherwise specified. Thus, the inclusion of polymerized units derived from 80 to 99.9 parts by weight of the compound of formula (I) and 0.1 to 10 parts by weight of the crosslinkable functional group-containing monomer, as described above, (B) of the compound (A) and the weight (B) of the crosslinkable functional group-containing monomer is 80 to 99.9: 0.1 to 10, It may mean that the polymer is formed from a mixture of monomers comprising monomers. The proportion of the monomer forming the acrylic polymer can be adjusted as described above to form a polymer which exhibits adequate tackiness and suitably ensuring cohesive force during crosslinking.

The acrylic polymer may also comprise polymerized units derived from other monomers than those mentioned above. Examples of such monomers include isobornyl acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, cyclododecyl acrylate, methylcyclohexyl acrylate, trimethylcyclohexyl acrylate, tert-butylcyclohexyl acrylate, (Meth) acrylic acid esters having an alicyclic structure such as hexyl or cyclohexylphenyl acrylate can be exemplified. The term "alicyclic structure" in the present application may mean a cycloparaffin structure having generally 5 or more carbon atoms or 5 to 7 carbon atoms.

When the polymerization unit derived from such a monomer is further contained, generation of bubbles at a high temperature can be inhibited more effectively, the conversion rate can be appropriately maintained at the time of production of the polymer, and the molecular weight can be effectively controlled. The acrylic polymer may, for example, be prepared by adding a polymerization unit derived from 5 to 40 parts by weight of the methyl (meth) acrylate and / or 5 to 30 parts by weight of (meth) acrylate having the alicyclic side chain As shown in FIG.

The acrylic polymer may further comprise other optional comonomers, if necessary. Examples of such monomers include (meth) acrylonitrile, (meth) acrylamide, N-methyl (meth) acrylamide, Nitrogen-containing monomers such as dimethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, N-vinylpyrrolidone or N-vinylcaprolactam; (Meth) acrylic acid esters, alkoxy alkylene glycol (meth) acrylic acid esters, alkoxy alkylene glycol (meth) acrylic acid esters, alkoxy alkylene glycol (Meth) acrylic acid esters, phenoxy alkylene glycol (meth) acrylic acid esters, phenoxy alkylene glycol (meth) acrylic acid esters, phenoxy trialkylene glycol Alkylene oxide group-containing monomers such as polyalkylene glycol (meth) acrylic acid esters and the like; Styrene-based monomers such as styrene or methylstyrene; Glycidyl group-containing monomers such as glycidyl (meth) acrylate; And carboxylic acid vinyl esters such as vinyl acetate, but are not limited thereto.

The acrylic polymer can be produced by a conventional polymerization method. For example, a monomer mixture prepared by blending necessary monomers according to the desired monomer composition may be subjected to solution polymerization, photo polymerization, bulk polymerization, suspension polymerization, or emulsion polymerization and emulsion polymerization. If necessary in this process, suitable polymerization initiators or molecular weight regulators, chain transfer agents and the like may be used together.

The pressure-sensitive adhesive composition may further comprise a thiol compound. The thiol compound is contained, for example, as a separate component in the pressure-sensitive adhesive composition, or added in the form of being combined with the acrylic polymer added in the course of polymerization of the acrylic polymer, or contained in a polymer other than the acrylic polymer May be included in the pressure-sensitive adhesive composition.

As the thiol compound, for example, at least one compound among the compounds represented by the following general formulas (2) to (5) can be exemplified.

(2)

(3)

[Chemical Formula 4]

[Chemical Formula 5]

In formulas (2) to (5), A ¹ to A ³ are each independently a linear or branched alkylene, R ¹ is a linear or branched alkyl group, R ² is hydrogen, an alkyl group or -A ⁴ -C A ⁵ -OC (= O) -A ⁶ -SH) _n R _(3-n) wherein A ⁴ to A ⁶ are each independently straight-chain or branched alkylene, and R is a linear or branched And n is a number of 1 to 3.

As the thiol compound, A ¹ in the general formulas (2) to (5) may be a linear or branched alkylene having 1 to 8 carbon atoms. As the thiol compound, R < ¹ > in the general formulas (2) to (5) may be a linear or branched alkyl group having 3 to 20 carbon atoms. As the thiol compound, those represented by the above formulas 2 to 5 in which A ² is a linear or branched alkyl group having 1 to 4 carbon atoms can be used. As the thiol compound, A ³ is a straight or branched alkyl group having 1 to 4 carbon atoms, R ² is hydrogen, a linear or branched alkyl group having 4 to 12 carbon atoms, or -A ⁴ -C (- A ⁵ -OC (= O) -A ⁶ -SH) _n R _(3-n) wherein A ⁴ to A ⁶ are each independently a straight or branched alkyl group having 1 to 4 carbon atoms, n is 2 or 3 is more preferable.

In the definitions of the formulas (2) to (5), the alkyl group or the alkylene group and the like may be substituted with, for example, a thiol group, a hydroxyl group or a carboxyl group.

Specific examples of the thiol compound include 2-mercaptoethanol, glycidylmercaptan, mercaptoacetic acid, 2-ethylhexyl thioglycolate, 2,3-dimercapto-1-propanol, n-dodecanethiol, t (1-octadecanethiol, trimethylolpropane tris (3-mercaptothiol), and / or pentaerythritol tetrakis (3-mercaptopropionate) .

The thiol compound may be contained in an amount of 0.001 part by weight to 3 parts by weight based on 100 parts by weight of the compound of the formula (1) of the acrylic polymer. As a result, properties such as initial adhesion, durability and peeling force of the pressure-sensitive adhesive layer can be effectively maintained.

The pressure-sensitive adhesive composition may further comprise a multifunctional crosslinking agent containing a functional group capable of reacting with the crosslinkable functional group in the acrylic polymer.

The term "multifunctional crosslinking agent" as used herein means a bifunctional or multifunctional compound containing two or more functional groups capable of reacting with the crosslinkable functional group of the acrylic polymer in one molecule, for example, a functional group having 2 to 6 May mean a multifunctional compound containing two or more functional groups. The two or more functional groups contained in the molecule may be the same or different kinds of functional groups.

As the polyfunctional crosslinking agent in the present application, the functional group capable of reacting with the crosslinkable functional group may be a carboxyl group, an acid anhydride group, a vinyl ether group, an amine group, a carbonyl group, an isocyanate group, an epoxy group, an aziridinyl group, a carbodiimide group, An oxazoline group, and the like can be used.

In one example, the multifunctional crosslinking agent containing a carboxyl group includes, for example, o-phthalic acid, isophthalic acid, terephthalic acid, 1,4-dimethylterephthalic acid, 1,3-dimethylisophthalic acid, 3-dimethylisophthalic acid, 4,4-biphenyldicarboxylic acid, 1,4-naphthalene dicarboxylic acid, 2,6-naphthalene dicarboxylic acid, norbornene dicarboxylic acid, diphenylmethane- Aromatic dicarboxylic acids such as 4'-dicarboxylic acid or phenyl dicarboxylic acid; Aromatic dicarboxylic acid anhydrides such as phthalic anhydride, 1,8-naphthalene dicarboxylic acid anhydride or 2,3-naphthalene dicarboxylic acid anhydride; Alicyclic dicarboxylic acids such as hexahydrophthalic acid; Alicyclic dicarboxylic acid anhydrides such as hexahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride or 1,2-cyclohexanedicarboxylic anhydride; Aliphatic compounds such as oxalic acid, malonic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, suberic acid, maleic acid, chloromaleic acid, fumaric acid, dodecanedic acid, pimelic acid, citraconic acid, glutaric acid or itaconic acid Dicarboxylic acids, and the like.

In one example, the polyfunctional crosslinking agent comprising the acid anhydride group is selected from the group consisting of anhydrous pyromellitic acid, benzophenonetetracarboxylic acid dianhydride, biphenyltetracarboxylic acid dianhydride, oxydiphthalic acid dianhydride, diphenylsulfonetetracarboxylic acid Acid anhydrides, diphenylsulfide tetracarboxylic acid dianhydrides, butane tetracarboxylic acid dianhydrides, perylenetetracarboxylic dianhydrides or naphthalenetetracarboxylic dianhydrides, and the like.

In one example, the polyfunctional crosslinking agent comprising the vinyl ether group is selected from the group consisting of ethylene glycol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, tetraethylene glycol divinyl ether, pentaerythritol divinyl ether, propylene Glycol divinyl ether, dipropylene glycol divinyl ether, tripropylene glycol divinyl ether, neopentyl glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-hexanediol divinyl ether, glycerin divinyldeether , Trimethylolpropane divinyl ether, 1,4-dihydroxycyclohexane divinyl ether, 1,4-dihydroxymethylcyclohexane divinyl ether, hydroquinone divinyl ether, ethylene oxide modified hydroquinone divinyl ether, Ethylene oxide modified resorcin divinyl ether, ethylene oxide modified bisphenol A divinyl ether, ethylene oxide modified ratio Phenol S divinyl ether, glycerin trivinyl ether, sorbitol tetravinyl ether, trimethylolpropane trivinyl ether, pentaerythritol trivinyl ether, pentaerythritol tetravinyl ether, dipentaerythritol hexa vinyl ether, dipentaerythritol poly Vinyl ether, ditrimethylolpropane tetravinyl ether or ditrimethylolpropane polyvinyl ether, and the like.

  In one example, the multifunctional crosslinking agent containing the amine group may be an aliphatic diamine such as ethylenediamine or hexamethylenediamine; Alicyclic diamines such as 4,4'-diamino-3,3'-dimethyldicyclohexylmethane, 4,4'-diamino-3,3'-dimethyldicyclohexyl, diaminocyclohexane or isophoronediamine Ryu; And aromatic diamines such as xylylenediamine.

In one example, the multifunctional crosslinking agent comprising an isocyanate group is selected from the group consisting of 1,3-phenylene diisocyanate, 4,4'-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4'-diphenylmethane diisocyanate , 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate , Aromatic polyisocyanates such as 4,4'-diphenyl ether diisocyanate, 4,4 ', 4 "-triphenylmethane triisocyanate, toluene diisocyanate, xylene diisocyanate or xylylene diisocyanate; Propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene diisocyanate, 2-methylene diisocyanate, , 4,4-trimethylhexamethylene diisocyanate, and other aliphatic polyisocyanates; ω'-diisocyanate-1,3-dimethylbenzene, ω'-diisocyanate-1,4-dimethylbenzene, ω'-diisocyanate-1,4-diethylbenzene, 1,4- Aromatic polyisocyanates such as tetramethyl xylylene diisocyanate and 1,3-tetramethyl xylylene diisocyanate; 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl- Alicyclic polyisocyanates such as hexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylene bis (cyclohexyl isocyanate) or 1,4-bis (isocyanate methyl) cyclohexane, A reaction product of one or more polyisocyanates and a polyol, and the like. The specific kind of the polyfunctional crosslinking agent may be determined according to the kind of the crosslinkable functional group contained in the acrylic polymer.

The multifunctional crosslinking agent may be contained in the pressure-sensitive adhesive composition at a ratio of 0.01 to 10 parts by weight or 0.1 to 5 parts by weight based on 100 parts by weight of the acrylic polymer, and the appropriate cohesive strength of the pressure-sensitive adhesive layer can be ensured within this range.

The pressure-sensitive adhesive composition may further include known additives such as a silane coupling agent, a tackifier, an epoxy resin, a UV stabilizer, an antioxidant, a colorant, a reinforcing agent, a filler, a defoamer, a surfactant or a plasticizer in addition to the above components .

In addition, the pressure-sensitive adhesive composition of the present application is a pressure-sensitive adhesive which is capable of forming a point-adhesive layer capable of holding a permanent adhesive force to a base layer while having a temporary adhesive force but undergoing a crosslinking process . By way of example, the pressure sensitive adhesive composition may be a urethane or epoxy pressure sensitive adhesive composition.

The pressure sensitive adhesive layer of the conductive film of the present application may be formed by applying a pressure sensitive adhesive composition to one side or both sides of the intermediate base layer to form a pressure sensitive adhesive composition layer and crosslinking the pressure sensitive adhesive composition layer.

As described above, the crosslinking may be performed before or after the conductive base layer is attached, or may be performed in the process of being attached or attached. The manner of crosslinking the pressure-sensitive adhesive composition is not particularly limited, and can be carried out, for example, in such a manner that the layer of the pressure-sensitive adhesive composition is maintained at a predetermined temperature so that the above-mentioned acrylic polymer and the multifunctional crosslinking agent can react. In another example, if the pressure-sensitive adhesive composition includes a component that reacts as a crosslinking component by irradiation of an active energy ray, it may be conducted by irradiating with an appropriate active energy ray such as ultraviolet ray to induce the reaction of the component.

A conductive base layer may be attached to the layer before or after the layer of the pressure-sensitive adhesive composition is crosslinked or crosslinked. The conductive base layer 13 may include a base layer 13a and a conductive layer 13b formed on one surface of the base layer as shown in Figs. 1 and 3, wherein the conductive layer 13b is formed May be adhered to the layer 12a of the pressure-sensitive adhesive composition or the pressure-sensitive adhesive layer 12b.

The conductive base layer can be produced by forming a conductive layer on one side of the base layer. The type of the base layer on which the conductive layer is formed is not particularly limited, and for example, a suitable material may be selected and used from among the materials used for forming the above-described intermediate base layer. The thickness of the base layer is not particularly limited and may be suitably set. Typically, the substrate layer may have a thickness of about 3 to 300 microns, about 5 to 250 microns, or about 10 to 200 microns.

The conductive layer can be formed by, for example, a vacuum deposition method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a thin film formation method combining two or more of the above methods. Or a sputtering method.

Examples of the material constituting the conductive layer include metals such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin and alloys of two or more of the above metals, indium oxide, tin oxide, Titanium, cadmium oxide, or a mixture of two or more of the foregoing, or other metal oxides such as copper iodide. The conductive layer may be a crystalline layer or an amorphous layer. Typically, the conductive layer is formed using indium tin oxide (ITO), but the present invention is not limited thereto. The thickness of the conductive layer can be adjusted to about 10 nm to 300 nm, preferably about 10 nm to 200 nm, in consideration of the possibility of formation of the continuous layer, conductivity, transparency and the like.

The conductive layer may be formed on the base layer via an anchor layer or a dielectric layer. That is, the conductive base layer may have a structure in which a base layer, an anchor layer, or a dielectric layer and a conductive layer are sequentially formed. The anchor layer or the dielectric layer improves the adhesion between the conductive layer and the base layer, and improves scratch resistance or flex resistance. The anchor layer or the dielectric layer may be formed of, for example, an inorganic material such as SiO ₂ , MgF ₂ or Al ₂ O ₃ ; An organic material such as an acrylic resin, a urethane resin, a melamine resin, an alkyd resin or a siloxane-based polymer, or a mixture of two or more of the above materials can be used. Examples of the forming method include a vacuum vapor deposition method, a sputtering method, A coating method or a coating method may be adopted. The anchor layer or dielectric layer may be formed typically to a thickness of about 100 nm or less, 15 nm to 100 nm, or 20 nm to 60 nm.

Adhesive treatment such as corona discharge treatment, ultraviolet ray irradiation treatment, plasma treatment, or sputter etching treatment may be performed on one side or both sides of the base layer of the conductive base layer. In addition, a conventional surface treatment layer such as a hard coating layer or an anti-blocking layer may be formed on one side or both sides of the base layer of the conductive base layer.

The manner of attaching the conductive base layer to the intermediate base layer is not particularly limited and may be carried out in a conventional manner.

Any known process may be further carried out after attaching the conductive base layer. Typical examples of the above process include a crystallization process performed when the conductive layer of the conductive base layer is in a microcrystalline or semi-crystalline state.

Such a crystallization process is usually carried out at a high temperature, for example, at a temperature of about 100 to 300 ° C. The time for the crystallization to proceed may be adjusted so that the required level of crystallization can be achieved, and may be generally conducted for about 10 minutes to 12 hours. The specific conditions under which the crystallization process is performed and the types of other processes that can be performed in addition to the crystallization process are not particularly limited and those normally performed during the production of the conductive film may be applied.

The layer of the pressure-sensitive adhesive composition formed on one side or both sides of the intermediate substrate layer of the present application may be formed by directly applying the pressure-sensitive adhesive composition described above to the intermediate substrate layer, Or may be formed by laminating them on a layer.

As a more specific example, the above-mentioned pressure-sensitive adhesive composition is coated on an arbitrary support, and then a layer is formed through a drying and curing process to form a layer, and then the layer is peeled to form a layer of a film type uncrosslinked adhesive composition, Layer is laminated on the intermediate substrate layer, a layer of the pressure-sensitive adhesive composition can be formed on the intermediate substrate layer.

After the layer of the pressure-sensitive adhesive composition is formed in the same manner as described above, the layer of the pressure-sensitive adhesive composition may be crosslinked, and thus the pressure-sensitive adhesive layer may be formed. That is, in the method of producing a conductive film of the present application, after the conductive base layer is attached to the intermediate base layer via the layer of the uncrosslinked adhesive composition formed on one side or both sides of the intermediate base layer, And crosslinking the pressure-sensitive adhesive composition in the state that the pressure-sensitive adhesive layer is in contact with the pressure-sensitive adhesive layer. Even in the case of the conductive film produced by the above-described method,

In addition, the present application relates to a process for producing a pressure-sensitive adhesive sheet, which comprises heat-treating an intermediate substrate layer on which a pressure-sensitive adhesive composition layer is formed on one surface or both surfaces thereof and then attaching the conductive substrate layer to the intermediate substrate layer via the pressure- It is possible to provide a conductive film excellent in peelability against the intermediate base layer of the base layer.

That is, by adhering the conductive base layer after the heat treatment step of keeping the intermediate base layer having the adhesive composition layer on one side or both sides at a predetermined temperature, it is possible to obtain excellent peeling properties and bubble generation Can be achieved.

Through the heat treatment process, the above-mentioned acrylic polymer and the polyfunctional crosslinking agent can be reacted to perform the crosslinking reaction. Accordingly, the heat treatment process can be performed in such a manner that the acrylic polymer and the multi-functional cross-linking agent maintain the intermediate substrate layer in which the layer of the sticky composition is formed at a temperature at which the cross-linking reaction can proceed. For example, as shown in FIGS. 5 and 6, the intermediate substrate layer 11 having the pressure-sensitive adhesive composition layer 12a formed on one side or both sides thereof is maintained at a temperature of 50 to 200 ° C, The pressure-sensitive adhesive layer 12b may be formed by inducing a crosslinking reaction on the layer of the conductive base material layer 13, and the heat treatment process may be performed before the conductive base material layer 13 is attached. That is, the method for producing a conductive film of the present application may include adhering the conductive base layer to the intermediate base layer after holding the intermediate base layer having the layer of the sticky composition at a temperature of 50 to 200 ° C.

In one example, the heat treatment process may be divided into two stages. For example, the heat treatment step may include a first step of holding the intermediate substrate layer at a temperature of about 100 to 200 DEG C or about 110 to 180 DEG C and a second step of holding the intermediate substrate layer at 40 to 100 DEG C or 50 to 90 DEG C And a secondary process. The terms first and second used in the above description are for distinguishing each process and do not limit the order of the processes. That is, the heat treatment process may be performed in the order of the primary and secondary processes, or may be performed in the order of the secondary process and the primary process. For example, the process may be performed in the order of the primary and secondary processes. The time at which each step is performed is not particularly limited as long as the conductive base layer to be attached later can be adhered to the intermediate base layer while exhibiting the peeling force described above.

The heat treatment process may be performed with the conductive base layer adhered to the intermediate base layer via a layer of the pressure-sensitive adhesive composition. The step of forming a pressure-sensitive adhesive layer by inducing a crosslinking reaction on a layer of a pressure-sensitive adhesive composition through a heat treatment process in a state where the conductive base layer is attached to the intermediate base layer may include the above-described primary and secondary processes.

The present application may relate to a conductive film produced by the above-mentioned production method. That is, the present application relates to an intermediate substrate layer; And a conductive base layer adhered to one surface or both surfaces of the intermediate base layer so as to have a room temperature peeling strength of not less than 1,000 gf / inch measured at a peeling rate of 0.3 m / min and a peeling angle of 180 degrees And may be for a conductive film including the conductive film.

The intermediate base layer of the conductive film of the present application may include all the contents of the intermediate base layer employed in the above-described method for producing a conductive film.

The conductive base layer of the present application may be attached to the intermediate base layer via a pressure-sensitive adhesive layer or an adhesive layer, and may be attached to one surface of the intermediate base layer as shown in Fig. 1, Or may be attached to both sides of the intermediate substrate layer as described above.

As an example, the conductive film has a conductive base layer having a room temperature peeling force of 1,000 gf / inch or more adhered to both surfaces of the intermediate base layer measured at a peeling speed of 0.3 m / min and a peel angle of 180 degrees Lt; / RTI >

The conductive base layer is attached to the intermediate base layer directly or after the layer of the pressure-sensitive adhesive composition formed in a laminated manner is subjected to the crosslinking reaction or after the crosslinking reaction is performed, thereby achieving a high peeling force for the intermediate base layer Temperature peeling force of the intermediate substrate layer measured at a peeling speed of 0.3 m / min and a peeling angle of 180 degrees is 1,000 gf / inch to 10,000 gf / inch or 1,000 gf / inch to 5,000 gf / inch .

The pressure-sensitive adhesive layer of the conductive film of the present application means a layer in a state after the layer of the pressure-sensitive adhesive composition is crosslinked, and all contents of the pressure-sensitive adhesive composition mentioned in the above-mentioned method for producing a conductive film can be included without limitation.

That is, the pressure sensitive adhesive layer may include at least one selected from the group consisting of acrylic pressure sensitive adhesives, silicone pressure sensitive adhesives, rubber pressure sensitive adhesives, and polyester pressure sensitive adhesives. The acrylic pressure sensitive adhesives include ethyl (meth) acrylate, n- (Meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl (Meth) acrylate, 2-ethylbutyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl Or the like.

The pressure-sensitive adhesive layer of the present application may be a pressure-sensitive adhesive layer having a temporary adhesive force in the attached state, but may be a layer of a point adhesive capable of retaining a permanent adhesive force to the base layer while undergoing a crosslinking process or the like. By way of example, the point-adhesive layer may be a urethane or epoxy point-adhesive layer, but is not limited thereto. The step of forming the pressure-sensitive adhesive layer is known and can be produced in the same manner as the step of forming the pressure-sensitive adhesive layer described above.

The present application may relate to the use of the conductive film. The conductive film can be used for a display device such as OLED (Organic Light Emitting Diode), PDP (Plasma Display Panel) or LCD (Liquid Crystal Display), a touch panel, And can be applied to all uses of the same known conductive films.

Hereinafter, one embodiment of the conductive film, the conductive film, and the conductive film of the present application will be described, but the following examples are merely examples according to the present application and do not limit the technical idea of the present application. The physical properties shown in this Example and Comparative Example were evaluated in the following manner.

One. Peel force  Evaluation method

(1) Measuring device: TA-XT2plus

(2) Mode: tension mode

(3) Trigger force: 5 gf

(4) Peeling speed: 0.3 m / min

(5) Peeling angle: 180 degrees

(6) Specimen size: Width 12cm x Width 2.54cm

[Example 1]

94 parts by weight of butyl acrylate (BA) and 6 parts by weight of acrylic acid (AA), and 1 part by weight of a toluene diisocyanate crosslinking agent based on 100 parts by weight of the mixed liquid were added to prepare a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was directly applied on both sides of the polyethylene terephthalate base layer, and the pressure-sensitive adhesive layer was formed by dividing the polyethylene terephthalate coated with the pressure-sensitive adhesive composition in an oven into four zones and drying at 80 to 140 ° C . A conductive base layer was attached via a pressure-sensitive adhesive layer formed on both sides of the polyethylene terephthalate to prepare a double-sided conductive film. The peel strength results of the produced double-sided electroconductive films are shown in Table 1 below. Further, the produced double-sided conductive film was aged at a temperature of 40 캜 and 60 캜, and then the occurrence of bubbles was measured every day. The results are shown in Table 2 below. At this time, the heat treatment process of the conductive layer was performed at 190 占 폚 for 15 minutes.

[Example 2]

, 94 parts by weight of butyl acrylate (BA) and 6 parts by weight of acrylic acid (AA), and 3 parts by weight of a toluene diisocyanate crosslinking agent based on 100 parts by weight of the mixed liquid were added to prepare a pressure-sensitive adhesive composition, Sided conductive film. The results of peeling force and bubble occurrence of the produced double-sided conductive films were measured and are shown in Tables 1 and 2 below.

 [Example 3]

50 parts by weight of 2-ethylhexyl acrylate, 40 parts by weight of methyl acrylate and 10 parts by weight of 2-hydroxyethyl acrylate, and an isocyanate crosslinking agent added at a ratio of 0.25 parts by weight based on 100 parts by weight of the mixed solution The pressure-sensitive adhesive composition was directly applied to both surfaces of the polyethylene terephthalate base layer, and then a conductive film was produced in the same manner as in Example 1 above. The results of peeling force and bubble occurrence of the produced double-sided conductive films were measured and are shown in Tables 1 and 2 below.

[Example 4]

94 parts by weight of butyl acrylate (BA) and 6 parts by weight of acrylic acid (AA), and 1 part by weight of a toluene diisocyanate crosslinking agent based on 100 parts by weight of the mixed liquid were applied onto a support and dried to obtain a film Type pressure-sensitive adhesive composition. A release film is attached to both sides of the layer of the peeled pressure-sensitive adhesive composition to prepare NCF (Non-carrier film). After removing the release film attached to one side of the NCF (non-carrier film), the polyethylene terephthalate base layer was laminated on both sides and heat pretreated in an oven at 150 ° C for 30 minutes. Thereafter, the release film attached to the other surface of the NCF (non-carrier film) is removed, and then the conductive base layer is attached. The results of peeling force and bubble occurrence of the produced double-sided conductive films were measured and are shown in Tables 1 and 2 below.

 [Example 5]

50 parts by weight of 2-ethylhexyl acrylate, 40 parts by weight of methyl acrylate and 10 parts by weight of 2-hydroxyethyl acrylate, and an isocyanate crosslinking agent added at a ratio of 0.25 parts by weight based on 100 parts by weight of the mixed solution A double-side conductive film was produced in the same manner as in Example 4 except that NCF (non-carrier film) prepared using a pressure-sensitive adhesive composition was used. The results of peeling force and bubble occurrence of the produced double-sided conductive films were measured and are shown in Tables 1 and 2 below.

[Comparative Example]

50 parts by weight of 2-ethylhexyl acrylate, 40 parts by weight of methyl acrylate and 10 parts by weight of 2-hydroxyethyl acrylate, and 0.2 parts by weight of a xylene diisocyanate crosslinking agent based on 100 parts by weight of the mixed solution Is coated on a support and dried to form a layer of a pressure-sensitive adhesive composition of a film type and then peeled. A release film is attached to both sides of the layer of the peeled pressure-sensitive adhesive composition to prepare NCF (Non-carrier film). After removing the release film adhered to one surface of the NCF (non-carrier film), the release film adhered to the other surface of the NCF (non-carrier film) was removed by lamination on both sides of the polyethylene terephthalate base layer, Thereby adhering the substrate layer. The results of peeling force and bubble occurrence of the produced double-sided conductive films were measured and are shown in Tables 1 and 2 below.

Peel test results (gf / inch) Example 1 1147 Example 2 1032 Example 3 1449 Example 4 1011 Example 5 1243 Comparative Example 822

The conductive heat treatment condition at 190 캜 for 15 minutes Day 1 Day2 Day3 bubble Fine bubble bubble Fine bubble bubble Fine bubble Example 1
40 ℃ aging △ △ X X X X 60 ℃ aging △ X X X X X Example 2 40 ℃ aging △ △ X X X X 60 ℃ aging △ X X X X X Example 3 40 ℃ aging △ △ X X X X 60 ℃ aging △ X X X X X Example 4 40 ℃ aging △ △ △ X X X 60 ℃ aging △ X X X X X Example 5 40 ℃ aging △ △ △ X X X 60 ℃ aging △ X X X X X Comparative Example
40 ℃ aging ○ ○ ○ ○ ○ ○ 60 ℃ aging ○ ○ ○ ○ ○ ○

○: Large amount of bubbles are generated.

Δ: Bubbles are generated weakly.

X: No bubbles.

11: intermediate substrate layer
12a: layer of pressure-sensitive adhesive composition
12b: pressure-sensitive adhesive layer
13: conductive base layer
13a: substrate layer
13b: conductive layer
14: release film

Claims (16)

An intermediate substrate layer; And a conductive base layer adhered to one side or both sides of the intermediate base layer so that a room temperature peeling force against the intermediate base layer measured at a peeling rate of 0.3 m / min and a peeling angle of 180 degrees is 1,000 gf / inch or more Including,
Wherein the conductive base layer is attached to the intermediate base layer via a pressure-sensitive adhesive layer,
The pressure-sensitive adhesive layer is formed by inducing a crosslinking reaction in a layer of the pressure-sensitive adhesive composition before the conductive base layer is adhered,
Wherein the pressure-sensitive adhesive layer comprises a mixture comprising 80 to 99.9 parts by weight of a compound represented by the following formula (1), 5 to 30 parts by weight of a (meth) acrylic acid ester having an alicyclic side chain and 0.1 to 10 parts by weight of a monomer having a crosslinkable functional group, A pressure-sensitive adhesive composition comprising a pressure-sensitive crosslinking agent,
After the intermediate substrate layer having the layer of the adhesive composition is crosslinked by a sequential process of a primary process of holding the intermediate substrate layer at a temperature of 100 to 200 DEG C and a secondary process of maintaining the temperature at 50 to 90 DEG C, Respectively,
A conductive film which is crystallized by heat-treating the conductive layer of the conductive base layer at a temperature of 190 to 300 DEG C after attaching the conductive base layer;
[Chemical Formula 1]

In Formula (1), R ¹ is hydrogen or an alkyl group having 1 to 4 carbon atoms, and R ² is a linear or branched alkyl group having 2 or more carbon atoms. The conductive base material according to claim 1, wherein the conductive base layer having a room temperature peel strength of 1,000 gf / inch or more on the intermediate base layer measured at a peeling rate of 0.3 m / min and a peel angle of 180 degrees has a conductivity film. delete delete delete A touch panel comprising the conductive film of claim 1. A display device comprising the conductive film of claim 1. And attaching the conductive base layer to one side or both sides of the intermediate base layer so that the room temperature peeling force for the intermediate base layer measured at a peeling rate of 0.3 m / min and a peeling angle of 180 is 1,000 gf / inch or more,
Wherein the conductive base layer is attached to the intermediate base layer via a pressure-sensitive adhesive layer,
The pressure-sensitive adhesive layer is formed by inducing a crosslinking reaction in a layer of the pressure-sensitive adhesive composition before the conductive base layer is adhered,
Wherein the pressure-sensitive adhesive layer comprises a mixture comprising 80 to 99.9 parts by weight of a compound represented by the following formula (1), 5 to 30 parts by weight of a (meth) acrylic acid ester having an alicyclic side chain and 0.1 to 10 parts by weight of a monomer having a crosslinkable functional group, A pressure-sensitive adhesive composition comprising a pressure-sensitive crosslinking agent,
After the intermediate substrate layer having the layer of the adhesive composition is crosslinked by a sequential process of a primary process of holding the intermediate substrate layer at a temperature of 100 to 200 DEG C and a secondary process of maintaining the temperature at 50 to 90 DEG C, Respectively,
Wherein the conductive layer of the conductive base layer is crystallized by heat treatment at a temperature of 190 to 300 DEG C after attaching the conductive base layer to the conductive base layer,
[Chemical Formula 1]

In Formula (1), R ¹ is hydrogen or an alkyl group having 1 to 4 carbon atoms, and R ² is a linear or branched alkyl group having 2 or more carbon atoms. delete delete delete delete delete delete delete delete

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