KR101659462B1 - Apparatus manufacturing conductive metal film electrode - Google Patents

Abstract

It is an object of the present invention to provide an apparatus for producing a conductive metal film electrode which forms a conductive metal film electrode on a flexible substrate. An apparatus for manufacturing a conductive metal film electrode according to an embodiment of the present invention includes an uncoiler for supplying a flexible substrate, a catalyst environment chamber for treating the surface of the flexible substrate supplied from the uncoiler by contacting the catalyst, A conductive metal film electrode forming chamber for forming a conductive metal film electrode with ink on the flexible substrate supplied from the conductive metal film electrode forming chamber and a recoiler for rewinding the flexible substrate on which the conductive metal film electrode is formed via the conductive metal film electrode forming chamber .

Description

TECHNICAL FIELD [0001] The present invention relates to an apparatus for manufacturing a conductive metal film electrode,

The present invention relates to an apparatus for producing a conductive metal film electrode which forms a conductive metal film electrode on a flexible substrate.

Generally, metal electrodes are utilized in various technical fields. For example, an aluminum (Al) electrode has been used as a core material in various fields such as electronics, electricity, energy, and environmental devices because it has excellent electrical properties such as electrical conductivity and work function and is economical in price.

More specifically, aluminum is more electrically conductive than silver (Ag), copper (Cu), and gold (Au), but is more economical than these metals in terms of cost. However, due to severe oxidation problems, aluminum has a very limited application area. Therefore, silver (Ag) is mainly used as an electrode material for charge transfer.

Silver (Ag) and gold (Au) are most widely used as electrode materials because they have excellent oxidation resistance and electrical characteristics, but they are expensive. Therefore, development of a metal electrode material which is cheaper than conventional materials and has excellent electrical characteristics is under development.

Aluminum is about 1/500 silver in price, has excellent electrical characteristics, and can be used as a good metal electrode material that can replace expensive silver if only oxidation control technology is secured. Therefore, in recent years, development of technology for forming an aluminum electrode through oxidation control is underway.

Representative devices using aluminum electrodes include solar cells and organic light emitting devices (OLEDs). In the case of a silicon (Si) solar cell, an aluminum electrode is used for the back electrode, and an aluminum powder paste having a diameter of 1 to 10 mu m is manufactured through a screen printing process and a high temperature heat treatment process at 800 DEG C or more.

At this time, an oxide film is formed on the surface of the aluminum powder used. Therefore, by heat-treating the aluminum powder at a high temperature, aluminum existing in the oxide film is melted and increased in volume, so that an oxide electrode is formed which penetrates through the oxide film on the surface and is sintered with another aluminum powder in the vicinity thereof. That is, when an electrode is to be formed using an aluminum powder paste, a high-temperature heat treatment process must be accompanied.

In the case of an organic optoelectronic device such as an organic light emitting device, since the charge transfer layer and the light emitting layer are all made of organic materials, inherent characteristics of the organic device are lost in an atmosphere of 150 DEG C or higher, and the characteristics of the device can not be exhibited at all. Therefore, the process of forming the aluminum electrode proceeds mostly at room temperature through vacuum deposition.

The vacuum deposition process effectively controls oxidation problems at low temperatures and produces high quality aluminum electrodes. However, due to the problem of maintaining vacuum, it takes a lot of system cost and process cost and leads to loss of raw material of over 70%. Also, when a large-area aluminum electrode is required, the vacuum chamber becomes large accordingly, and vacuum maintenance costs more. That is, the process cost required for manufacturing the aluminum electrode may explosively increase.

Accordingly, there is a need for a technique capable of efficiently manufacturing various metal electrodes having a large area, such as an aluminum electrode, which is one example of the above-described one.

It is an object of the present invention to provide an apparatus for producing a conductive metal film electrode which forms a conductive metal film electrode on a flexible substrate.

An apparatus for manufacturing a conductive metal film electrode according to an embodiment of the present invention includes an uncoiler for supplying a flexible substrate, a catalyst environment chamber for treating the surface of the flexible substrate supplied from the uncoiler by contacting the catalyst, A conductive metal film electrode forming chamber for forming a conductive metal film electrode with ink on the flexible substrate supplied from the conductive metal film electrode forming chamber and a recoiler for rewinding the flexible substrate on which the conductive metal film electrode is formed via the conductive metal film electrode forming chamber .

The apparatus for manufacturing a conductive metal film electrode according to an embodiment of the present invention may further include a first drying chamber for receiving the uncoiler and removing moisture and oxygen contained in the flexible substrate.

The apparatus for manufacturing a conductive metal film electrode according to an embodiment of the present invention includes a conductive metal film electrode forming chamber provided between the conductive metal film electrode forming chamber and the recoil, And a cleaning chamber for cleaning the substrate with a cleaning solution.

The apparatus for manufacturing a conductive metal film electrode according to an embodiment of the present invention may further include a second drying chamber for receiving the recoiler and removing the conductive metal film electrode and the cleaning liquid remaining on the flexible substrate.

The apparatus for manufacturing a conductive metal film electrode according to an embodiment of the present invention includes a hot air drying chamber provided between the cleaning chamber and the second drying chamber for hot air drying the conductive metal film electrode and the cleaning liquid remaining on the flexible substrate .

The apparatus for manufacturing a conductive metal film electrode according to an embodiment of the present invention includes an atmosphere control chamber for accommodating the catalyst environment chamber, the conductive metal film electrode forming chamber, the cleaning chamber and the hot air drying chamber, .

The atmosphere control chamber may further include a first solenoid valve provided in a supply port for supplying the inert gas and controlling supply of the inert gas, and a second solenoid valve provided in an outlet for discharging the inert gas to control the discharge have.

The apparatus for manufacturing a conductive metal film electrode according to an embodiment of the present invention includes an oxygen removing catalyst connected to one side of the atmosphere control chamber to remove oxygen contained in an inert gas while circulating the inert gas, And a moisture removing catalyst connected to the other side to circulate the inert gas to remove moisture contained in the inert gas.

The catalyst comprises a metal precursor decomposition activating catalyst in a fume or solution state, and the catalyst environment chamber can treat the surface of the flexible substrate with the catalyst.

The composition of the ink includes a metal precursor, and the conductive metal film electrode forming chamber can impregnate the flexible substrate with the composition of the ink.

The catalyst environment chamber has a support roll for supporting the flexible substrate, and the support roll may have a heat generating function.

The catalytic environmental chamber, the conductive metal film electrode forming chamber, and the cleaning chamber each further include first, second, and third level sensors each having a chemical resistance to detect the level of the catalyst, the ink, and the cleaning liquid.

Wherein the catalyst environment chamber, the conductive metal film electrode forming chamber, and the cleaning chamber are respectively connected to the first, second and third solenoid valves, respectively, through the eleventh, twelfth, and thirteenth solenoid valves, , And a third chemical pump, respectively.

An apparatus for manufacturing a conductive metal film electrode according to an embodiment of the present invention includes an electrode for forming a conductive metal film and a conductive metal film electrode disposed between the catalytic environmental chamber and the conductive metal film electrode forming chamber to uncoil and preheat the flexible substrate, And may further include a preheater chamber.

The catalyst environment chamber may further include a catalyst injection nozzle for injecting a small amount of catalyst into an electrode forming portion of the uncoiled flexible substrate.

As described above, in one embodiment of the present invention, a flexible substrate supplied from an uncoiler is surface-treated with a catalyst in a catalytic environmental chamber, a conductive metal film electrode is formed on a flexible substrate in a conductive metal film electrode- The metal film electrode and the flexible substrate can be wound.

1 is a schematic diagram of an apparatus for manufacturing a conductive metal film electrode according to a first embodiment of the present invention.
2 is a configuration diagram of an apparatus for manufacturing a conductive metal film electrode according to a second embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

1 is a configuration diagram of an apparatus 1 for manufacturing a conductive metal film electrode according to a first embodiment of the present invention. An apparatus 1 for manufacturing a conductive metal film electrode according to one embodiment is configured to produce a conductive metal film electrode (e.g., "aluminum film electrode AE") on a flexible substrate S.

1, a conductive metal film electrode manufacturing apparatus 1 includes an uncoiler 10, a catalytic environmental chamber 20, a conductive metal film electrode forming chamber 30, a cleaning chamber 40, and a recoiler 50 ).

For example, the flexible substrate S may be formed of paper, polymer sheet, fiber, and fabric. The conductive metal film electrode manufacturing apparatus 1 forms a conductive metal film electrode, that is, an aluminum film electrode AE, on the flexible substrate S as described above.

The uncoiler 10 is configured to continuously supply the wound flexible substrate S and is disposed on the inflow side of the production apparatus 1. [ Ricoh 50 is configured to continuously rewind the flexible substrate S forming the conductive metal film electrode and is disposed on the discharge side of the manufacturing apparatus 1. [

The uncoiler 10 is accommodated in the first drying chamber 11 and the first drying chamber 11 dries moisture and oxygen contained in the flexible substrate S continuously supplied from the accommodated uncoiler 10 Remove.

The cleaning chamber 40 is provided between the conductive metal film electrode forming chamber 30 and the recoiler 50 so that the flexible substrate S and the conductive metal film electrode supplied from the conductive metal film electrode forming chamber 30 are cleaned Lt; / RTI >

The recoiler 50 is accommodated in the second drying chamber 51 and the second drying chamber 51 is provided with a conductive metal film electrode which continuously rewinds to the recoiler 50 accommodated therein, Is dried and removed.

For convenience, the following description will be made on the conductive metal film electrode manufacturing apparatus 1 of the embodiment in which the aluminum film electrode (AE) is formed on the flexible substrate (S).

The first drying chamber 11 dries and removes oxygen and moisture to form the aluminum film electrode AE in the conductive metal film electrode forming chamber 30 by a chemical wet process. Therefore, moisture and oxygen contained in the flexible substrate S to be formed with the aluminum film electrode AE are removed.

Further, the first drying chamber 11 forms a drying atmosphere of less than 150 캜, which is filled with an inert gas (for example, nitrogen or argon). Therefore, the flexible substrate S supplied from the uncoiler 10 is transferred to the catalyst environment chamber 20 in a dry state in which moisture and oxygen are removed.

To this end, a first supply roll 12 is provided in the first drying chamber 11. The first supply roll 12 uncovers the flexible substrate S from the uncoiler 10 and transfers it to the catalyst environment chamber 20 by pressing both sides of the flexible substrate S and rotating the same.

The tension sensor TS is provided on the first supply roll 12 and receives the tension of the flexible substrate S so as to feed the tensile force of the flexible substrate S to the uncoiler 10 and the motor (Not shown) can control the tension of the flexible substrate S.

The catalytic environmental chamber 20 can be catalyzed to form an aluminum film electrode (AE) at a low temperature using a chemical wet process to treat the surface of the flexible substrate S in a part or patterned state. The catalytic environmental chamber 20 processes the surface of the flexible substrate S with a metal precursor decomposition activating catalyst in a fume or solution state.

The catalyst removes low temperature hydrogen from aluminum precursor inks composed of AlH ₃ and allows the formation of aluminum. For example, the metal precursor decomposition activation catalyst in the fumed state may be at least one selected from the group consisting of titanium isopropoxide (Ti (Oi - Pr) ₄ ), titanium chloride (TiCl ₄ ), platinum (Pt), cobalt (Ni) based catalyst, a manganese (Mn) based catalyst, a zinc (Zn) based catalyst, or a combination thereof.

There are three methods for bringing the flexible substrate S supplied to the catalyst environment chamber 20 into contact with the catalyst. One of the methods is to make the catalyst environment chamber 20 filled with titanium isopropoxide (Ti (O- i- Pr) ₄ ) in a fume state, And the surface of the flexible substrate S is processed while passing through the chamber 20.

Another method is to adjust the concentration of titanium isopropoxide (Ti (O- i- Pr) ₄ ) as a catalyst to a solution state, fill the catalyst environment chamber 20, The surface of the flexible substrate S is processed while passing through the catalyst in a solution state filled in the catalyst environment chamber 20. [

Another method is applied to the second embodiment and is described in the second embodiment below.

The catalytic environment chamber 20 has a support roll 21 for supporting the flexible substrate S and the support roll 21 may have a heat generating function. For example, the heat generating function can be realized by providing a bar heater (not shown) inside the support roll 21.

The supporting roll 21 having a heating function raises the surface temperature of the flexible substrate S to shorten the reaction time with the ink so that the conductive metal film electrode can be formed quickly and uniformly on the flexible substrate S .

The conductive metal film electrode forming chamber 30 is supplied from the catalytic environmental chamber 20 to form an aluminum film electrode AE on the surface-treated flexible substrate S. For example, the conductive metal film electrode forming chamber 30 forms an aluminum layer or pattern by impregnating the flexible substrate S with the ink composition containing the metal precursor.

The conductive metal film electrode forming chamber 30 is dried in the first drying chamber 11 and forms an aluminum film electrode AE on the flexible substrate S according to the surface treated in the catalytic environmental chamber 20. [

The basic reaction in the conductive metal film electrode forming chamber 30 is

AlH _3? [R]? Al + 1.5H ₂ (g)? + [R] (L)

. Thus, the conductive metal film electrode forming chamber 30 is filled with AlH ₃ [R] ink, and the dried and catalyzed flexible substrate S passes through the ink, An aluminum film electrode (AE) is formed on the surface.

At this time, the thickness and structure of the aluminum film electrode (AE) formed according to the time of the flexible substrate (S) in the AlH ₃ · [R] ink are changed. Thus, the time during which the flexible substrate S is present in the AlH ₃ [R] ink can be controlled by controlling the movement speed of the flexible substrate S or adjusting the number of the support rolls 31.

For example, the metal precursor may be a metal hydride, a complex of a metal hydride and an ether or amine-based material, or a combination thereof.

Looking in more detail, the metal precursor is _{AlH 3, LiH, NaH, KH} , RbH, CsH, BeH 2, MgH 2, CaH 2, SrH 2, OAlH 3 (C 2 H 5) 2, OAlH 3 (C 3 H 7 _{) 2, OAlH 3 (C 4} H 9) 2, AlH 3 · NMe 3, AlH 3 · NEt 3, AlH 3 · NEt 2 Me, AlH 3 · NMe 2 Et, AlH 3 · dioxane (dioxane), AlH _{3 {S (C 2 H 5)} 2}, AlH 3 {S (C 4 H 9) 2}, AlH 3 {S (C 4 H 9) 2}, AlH 3 C 9 H 12, OLiH (C 2 H 5 _{) 2, OLiH (C 3 H} 7) 2, OLiH (C 4 H 9) 2, LiH · NMe 3, LiH · NEt 3, LiH · NEt 2 Me, LiH · NMe 2 Et, LiH · dioxan (dioxane) _{, LiH {S (C 2 H} 5) 2}, LiH {S (C 4 H 9) 2}, LiH {S (C 4 H 9) 2}, LiHC 9 H 12, _{ONaH (C 2 H 5) 2} , ONaH (C 3 H 7) 2, ONaH (C 4 H 9) 2, NaH · NMe 3, NaH · NEt 3, NaH · NEt 2 Me, NaH · NMe 2 Et, NaH , Dioxane, NaH {S (C ₂ H ₅ ) ₂ }, NaH {S (C ₄ H ₉ ) ₂ }, NaH {S (C ₄ H ₉ ) ₂ }, NaHC ₉ H ₁₂ , _{C 2 H 5) 2, OKH} (C 3 H 7) 2, OKH (C 4 H 9) 2, KH · NMe 3, KH · NEt 3, KH · NEt 2 Me, KH · NMe 2 Et, KH · dioxane hexanes (dioxane), KH {S ( C 2 H 5) 2}, KH {S (C 4 H 9) 2}, KH {S (C 4 H 9) 2}, KHC 9 H 12, ORbH (C 2 _{H 5) 2, ORbH (C} 3 H 7) 2, ORbH (C 4 H 9) 2, RbH · NMe 3, RbH · NEt 3, RbH · NEt 2 Me, RbH · NMe 2 Et, RbH · dioxane ( dioxane), RbH {S (C 2 H 5) 2}, RbH {S (C 4 H 9) 2}, RbH {S (C 4 H 9) 2}, RbHC 9 H 12, OCsH (C 2 H 5 ₂ , OCsH (C ₃ H ₇ ) ₂ , OCsH (C ₄ H ₉ ) ₂ , CsH NMe ₃ , CsH NEt ₃ , CsH NEt ₂ Me, CsH NMe ₂ Et, CsH dioxane, _{, CsH {S (C 2 H} 5) 2}, CsH {S (C 4 H 9) 2}, CsH {S (C 4 H 9) 2}, CsHC 9 H 12, OBeH 2 (C 2 H 5) ₂ , OBheH ₂ (C ₃ H ₇ ) ₂ , OBeH ₂ (C ₄ H ₉ ) ₂ , BeH ₂揃 NMe ₃ , BeH ₂揃 NEt ₃ , BeH ₂揃 NEt ₂ Me, BeH ₂揃 NMe ₂ Et, BeH ₂ · dioxane _{(dioxane), BeH 2 {S} (C 2 H 5) 2}, BeH 2 {S (C 4 H 9) 2}, BeH 2 {S (C 4 H 9) 2} _{, BeH 2 C 9 H 12,} OMgH 2 (C 2 H 5) 2, OMgH 2 (C 3 H 7) 2, OMgH 2 (C 4 H 9) 2, MgH 2 · NMe 3, MgH 2 · NEt 3, _{MgH 2 · NEt 2 Me, MgH} 2 · NMe 2 Et, MgH 2 · dioxane _{(dioxane), MgH 2 {S} (C 2 H 5) 2}, MgH 2 {S (C 4 H 9) 2}, MgH _{2 {S (C 4 H 9} ) 2}, MgH 2 C 9 H 12, OCaH 2 (C 2 H 5) 2, OCaH 2 (C 3 H 7) 2, OCaH 2 (C 4 H 9) 2, CaH _{2 · NMe 3, CaH 2 ·} NEt 3, CaH 2 · NEt 2 Me, CaH 2 · NMe 2 Et, CaH 2 · dioxane _{(dioxane), CaH 2 {S} (C 2 H 5) 2}, CaH 2 { _{S (C 4 H 9) 2} }, CaH 2 {S (C 4 H 9) 2}, CaH 2 C 9 H 12, OSrH 2 (C 2 H 5) 2, OSrH 2 (C 3 H 7) 2, _{OSrH 2 (C 4 H 9)} 2, SrH 2 · NMe 3, SrH 2 · NEt 3, SrH 2 · NEt 2 Me, SrH 2 · NMe 2 Et, SrH 2 · dioxane _{(dioxane), SrH 2 {S} ( C ₂ H ₅ ) ₂ }, SrH ₂ {S (C ₄ H ₉ ) ₂ }, SrH ₂ {S (C ₄ H ₉ ) ₂ }, SrH ₂ C ₉ H ₁₂ or a combination thereof.

The metal of the metal precursor is selected from the group consisting of Al, Li, Na, K, Rb, Cs, Ber, Mg, Or a combination thereof.

The ink composition may comprise a solvent and a metal precursor. For example, the solvent may be water, tetrahydrofuran (THF), alcohol solvent, ether solvent, sulfide solvent, toluene solvent, xylene solvent Based solvent, an alkane-based solvent, an oxane-based solvent, an amine-based solvent, a polyol-based solvent, or a combination thereof.

The ink composition may further comprise a solution stabilizer. For example, the solution stabilizer may be selected from diketones, amino alcohols, polyamines, ethanol amines, diethylnol amines, ethane thiols, propanethiol, propane thiol, butane thiol, pentane thiol, hexane thiol, heptanes thiol, octane thiol, nonane thiol, decane thiol, undecane thiol, or a combination thereof.

The cleaning chamber 40 receives the cleaning liquid and is not finished on the flexible substrate S and the aluminum film electrode AE by passing the flexible substrate S supplied from the conductive metal film electrode forming chamber 30 through the cleaning liquid The remaining AlH ₃ · [R] ink is washed.

Therefore, when the flexible substrate S passes through the cleaning chamber 40, the AlH ₃ · [R] ink remaining on the flexible substrate S and the aluminum film electrode AE is washed, and further reaction is prevented. Therefore, the surface of the aluminum film electrode (AE) formed on the surface of the flexible substrate (S) becomes even.

For example, the cleaning solution used for cleaning is AlH _{3 ·} [R] may be a kind of solution, such as a solvent of the ink, it can also remove the AlH ₃ · [R] solvent of the ink can be found on the flexible substrate (S) Can be a solution which does not damage the formed and aluminum film electrode (AE), and does not deteriorate the atmosphere of the other chambers constituting the manufacturing apparatus (1).

The conductive metal film electrode manufacturing apparatus 1 of the first embodiment further includes a hot air drying chamber 53 installed between the cleaning chamber 40 and the second drying chamber 51. The hot air drying chamber 53 performs hot air drying on the conductive metal film electrode (for example, the aluminum film electrode AE) and the cleaning liquid remaining on the flexible substrate S.

On the other hand, the conductive metal film electrode manufacturing apparatus 1 of the first embodiment accommodates the catalytic environmental chamber 20, the conductive metal film electrode forming chamber 30, the cleaning chamber 40 and the hot air drying chamber 53, And an atmosphere control chamber 60 for forming a gas atmosphere.

The atmosphere control chamber 60 is provided with an oxygen removal catalyst 63 on one side thereof and a moisture removal catalyst 64 on the other side thereof for further operation of the first drying chamber 11 for removing oxygen and moisture do. The oxygen removal catalyst 63 is connected to the atmosphere control chamber 60 to remove oxygen contained in the inert gas to be circulated. The moisture removal catalyst 64 is connected to the atmosphere control chamber 60 to remove moisture contained in the circulating inert gas.

That is, the moisture removal catalyst 64 and the oxygen removal catalyst 63 maintain the moisture and oxygen in the atmosphere control chamber 60 at less than several ppm. For this purpose, the atmosphere gas is circulated around the moisture removing catalyst 64 (for example, a molecular sieve) and the oxygen removing catalyst 63 (for example, a Cu ball) Moisture and oxygen are removed and a stable atmosphere is maintained.

The atmosphere control chamber 60 is provided with a first solenoid valve V1 in the supply port 61 and a second solenoid valve V2 in the discharge port 62. [ The first solenoid valve (V1) is provided in a supply port (61) for supplying a fresh inert gas to control intermittent supply of the inert gas and supply amount by regulating intermittent opening and opening of the supply port (61). At the same time, the second solenoid valve V2 is provided in the discharge port 62 for discharging the contaminated inert gas to regulate the intermittent opening and opening of the discharge port 62 to control the intermittent discharge and the discharge amount of the inert gas.

The atmosphere control chamber 60 is maintained in a high-purity argon or nitrogen atmosphere in order to remove moisture and oxygen when the aluminum film electrode (AE) is formed on the surface of the flexible substrate S using a chemical wet process.

Hydrogen is continuously generated during the process of forming the aluminum film electrode (AE) on the flexible substrate (S) by looking at the formula AlH ₃揃 R! Al + 1.5H ₂ (g) The pressure in the conductive metal film electrode forming chamber 30 continuously increases, and a dangerous situation may occur due to hydrogen.

The first solenoid valve V1 and the second solenoid valve V2 forcibly discharge the internal gas when the internal pressure of the conductive metal film electrode forming chamber 30 becomes equal to or higher than a predetermined level, Or argon.

The second drying chamber 51 forms an aluminum film electrode AE in the conductive metal film electrode forming chamber 30 by a chemical wet process so that the aluminum film electrode AE, (S) is dried.

Further, the second drying chamber 51 forms a drying atmosphere of less than 150 캜 filled with an inert gas (for example, nitrogen or argon). Accordingly, the aluminum film electrode (AE) and the flexible substrate (S) are rewound to the recoiler (50) in a dry state in which the cleaning liquid is removed.

To this end, a second supply roll 52 is provided in the second drying chamber 51. The second supply roll 52 pushes both sides of the flexible substrate S on which the aluminum film electrode AE is formed and rotates to transport it to the recoiler 50. [ Thus, the aluminum film electrode (AE) completed in the recoiler (50) can be obtained.

The catalytic environmental chamber 20, the conductive metal film electrode forming chamber 30 and the cleaning chamber 40 respectively sense the level of the catalyst, the ink, and the cleaning liquid. The first, second, and third water level sensors (S1, S2, S3).

Second, and third chemical pumps P1, P2, and P3 and a catalytic environmental chamber 20, a conductive metal film electrode forming chamber 30, and a cleaning chamber 40, And the eleventh, twelfth, and thirteenth solenoid valves V11, V12, and V13, respectively, are disposed between each of them.

The control unit (not shown) receiving the sensing signals of the first, second and third water level sensors S1, S2 and S3 receives the first, second and third chemical pumps P1, P2, P3, The twelfth and thirteenth solenoid valves V11, V12, and V13, respectively, so that the catalyst, the ink, and the cleaning liquid can be automatically supplied according to the respective levels.

The second embodiment will be described below. The description of the same configuration as that of the first embodiment will be omitted and different configurations will be described.

2 is a configuration diagram of an apparatus for manufacturing a conductive metal film electrode according to a second embodiment of the present invention. 2, the apparatus 2 for manufacturing a conductive metal film electrode according to the second embodiment further includes a preheater chamber 70 between the catalyst environment chamber 220 and the conductive metal film electrode forming chamber 30 do.

The preheater chamber 70 may include a pair of plate heaters 71 and 72 disposed to face the upper and lower surfaces of the flexible substrate S running.

The preheater chamber 70 is uncoiled to preheat the flexible substrate S via the catalytic environmental chamber 220 to the plate heaters 71 and 72 so that the conductive metal film electrode Thereby facilitating the formation of a smooth surface.

The preheater chamber 70 is provided in front of the conductive metal film electrode forming chamber 30 to preheat the flexible substrate S to raise the surface temperature of the flexible substrate S, Thereby shortening the reaction time and accelerating the formation of the conductive metal film electrode.

And a third method of contacting the flexible substrate S supplied to the catalyst environmental chamber 220 with the catalyst. As an example, the catalyst environment chamber 220 has a catalyst injection nozzle 22 for injecting a catalyst supplied by a circulation pump Pc. The catalyst injection nozzle 22 treats the surface of the flexible substrate S by intensively injecting a small amount of catalyst to the electrode formation portion in the uncoiled flexible substrate S, so that the catalyst can be saved in comparison with the first embodiment have.

The apparatus for manufacturing a conductive metal film electrode 2 according to the second embodiment also includes a support roll 81 and a blade 82 between the catalyst environment chamber 220 and the preheater chamber 70. The flexible substrate S onto which the catalyst is sprayed is advanced between the support roll 81 and the blade 82. At this time, the blade 82 uniformly spreads the catalyst sprayed on the flexible substrate S, thereby allowing the pre-heater chamber 70 to be dried to a uniform thickness.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, And it goes without saying that the invention belongs to the scope of the invention.

1, 2: Conductive metal film electrode manufacturing apparatus
10: Uncoiler 11: 1st drying chamber
12: first feed roll 20, 220: catalytic environment chamber
21, 31, 81: Support roll 30: Conductive metal film electrode forming chamber
40: Cleaning chamber 50: Recoiler
51: second drying chamber 52: second supply roll
53: hot air drying chamber 60: atmosphere control chamber
61: supply port 62:
63: oxygen removal catalyst 64: water removal catalyst
70: preheater chamber 71, 72: plate heater
82: Blade AE: Aluminum film electrode
P1, P2, P3: first, second and third chemical pumps Pc: circulating pump
S1, S2, S3: first, second and third level sensors S: flexible substrate
TS: tension sensor V1, V2: first and second solenoid valves
V11, V12, V13: Eleventh, twelfth, thirteenth solenoid valve

Claims (15)

An uncoiler for supplying a flexible substrate;
A catalyst environment chamber for contacting the flexible substrate supplied from the uncoiler with a metal precursor decomposition activating catalyst in a fume state or a solution state to treat the surface of the flexible substrate in a partial or patterned state by a chemical wet process;
A conductive metal film electrode forming chamber for forming a conductive metal film electrode with ink on the flexible substrate supplied from the catalytic environmental chamber; And
And a re-coiler for rewinding the flexible substrate formed with the conductive metal film electrode via the conductive metal film electrode forming chamber
/ RTI >
Wherein the composition of the ink comprises a metal precursor,
The conductive metal film electrode forming chamber includes:
Impregnating the flexible substrate with the composition of the ink and forming the conductive metal film electrode on the flexible substrate according to a surface treated condition in the catalytic environmental chamber.
The method according to claim 1,
A first drying chamber for accommodating the uncoiler and removing moisture and oxygen contained in the flexible substrate,
Further comprising: a conductive metal film;
The method according to claim 1,
And a cleaning chamber provided between the conductive metal film electrode forming chamber and the recoiler for cleaning the conductive metal film electrode and the flexible substrate supplied from the conductive metal film electrode forming chamber,
Further comprising: a conductive metal film;
The method of claim 3,
And a second drying chamber for receiving the recoiler and removing the cleaning metal liquid remaining on the conductive metal film electrode and the flexible substrate,
Further comprising: a conductive metal film;
5. The method of claim 4,
A hot air drying chamber provided between the cleaning chamber and the second drying chamber for hot air drying the conductive metal film electrode and the cleaning liquid remaining on the flexible substrate,
Further comprising: a conductive metal film;
The method of claim 3,
An atmosphere control chamber for accommodating the catalytic environmental chamber, the conductive metal film electrode forming chamber, the cleaning chamber, and the hot air drying chamber,
Further comprising: a conductive metal film;
The method according to claim 6,
The atmosphere control chamber includes:
A first solenoid valve provided in a supply port for supplying the inert gas and controlling supply of the inert gas,
A second solenoid valve provided at an outlet for discharging the inert gas to control the discharge,
Further comprising: a conductive metal film;
The method according to claim 6,
An oxygen removal catalyst connected to one side of the atmosphere control chamber for removing oxygen contained in the inert gas while circulating the inert gas,
And a moisture removal catalyst connected to the other side of the atmosphere control chamber to remove water contained in the inert gas while circulating the inert gas,
Further comprising: a conductive metal film;
delete delete The method according to claim 1,
The catalytic environmental chamber may comprise:
And a support roll for supporting the flexible substrate,
Wherein the supporting roll has a heat generating function.
The method of claim 3,
The catalytic environmental chamber, the conductive metal film electrode forming chamber,
Further comprising a water level sensor which detects the level of the catalyst, the ink, and the cleaning liquid, respectively, and has chemical resistance.
13. The method of claim 12,
The catalytic environmental chamber, the conductive metal film electrode forming chamber,
Through the eleventh, twelfth, and thirteenth solenoid valves, respectively,
And the first, second, and third chemical pumps supplying the catalyst, the ink, and the cleaning liquid, respectively.
The method according to claim 1,
And a preheater chamber disposed between the catalytic environmental chamber and the conductive metal film electrode forming chamber and uncoiled to preheat the flexible substrate via the catalytic environmental chamber.
15. The method of claim 14,
The catalytic environmental chamber may comprise:
Further comprising a catalyst injection nozzle for injecting a small amount of catalyst to an electrode formation portion of the uncoiled flexible substrate.

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