KR101614721B1

KR101614721B1 - Attaching and Detaching Method of Semiconductor Packages on tray for EMI shielding Using Adhesive-Pad

Info

Publication number: KR101614721B1
Application number: KR1020150040942A
Authority: KR
Inventors: 김창수; 이민진; 김종운; 김봉석; 양원석
Original assignee: (주)씨앤아이테크놀로지
Priority date: 2015-03-24
Filing date: 2015-03-24
Publication date: 2016-04-22

Abstract

The present invention relates to a method of attaching and detaching a semiconductor package for forming an electromagnetic wave shielding film using a pressure sensitive adhesive pad, (B) a tray preparation step; (c) applying a liquid pressure-sensitive adhesive on an upper surface of the tray; (d) firstly curing the applied liquid pressure-sensitive adhesive to form a pressure-sensitive adhesive pad (E) loading the semiconductor package on the upper surface of the first hardened adhesive pad through the loading means; (f) secondarily curing the loaded semiconductor package while pressing it using a pressing plate, (G) forming an electromagnetic wave shielding film by sputtering on the attached semiconductor package; and (c) forming an electromagnetic wave shielding film by sputtering (H) separating the semiconductor package having the electromagnetic shielding film formed thereon from the upper surface of the tray by using a tool, and (i) separating the separated semiconductor package from the tray by unloading means (J) removing the adhesive pad from the tray, whereby the present invention can be applied to a ball grid array (BGA) type or a land grid array (LGA) type semiconductor package In order to form an electromagnetic wave shielding film on the bottom of the semiconductor package on the tray by using an adhesive pad before the sputtering deposition process, the sputtering particles are impregnated in the deposition process so as not to cause a gap, Deposition contamination can be suppressed or prevented, thereby preventing occurrence of a short between solder balls or lands. It is possible to suppress the occurrence of defects of the semiconductor package. After the deposition process is completed, detachment of the adhesive pad and the semiconductor package on the tray can be facilitated, thereby reducing damage to the semiconductor package due to excessive force during separation, thereby improving the quality of the product by reducing the defective rate of the semiconductor package. These processes can be automated to improve production yield and enable the deposition of electromagnetic shielding films on five sides of the top side and four sides (Sidewall), except for the bottom side of the semiconductor package, There is an effect that the electromagnetic wave generated by the semiconductor package can be shielded or the malfunction of the device can be prevented by the external electromagnetic wave. The silicone sheet is loaded into the tray in a vacuum environment, thereby suppressing lifting or bubbling between the tray and the silicon sheet in the chamber, thereby suppressing contamination during the process by exhausting gas or oil discharged during the curing process of the adhesive pad There is also an effect. In addition, it is convenient to detach the semiconductor package from the tray and to easily and cleanly remove the used adhesive pad, thereby facilitating the reuse of the tray.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of attaching and detaching a semiconductor package to an electromagnetic shielding film using an adhesive pad,

The present invention relates to a semiconductor package attaching and separating method for forming an electromagnetic wave shielding film using a pressure sensitive adhesive pad, and more particularly to a semiconductor package having a ball grid array (BGA) type or a Land Grid Array (LGA) In order to form a shielding film, the bottom side of the semiconductor package on the tray is adhered to the tray so that no gaps are formed by using an adhesive pad before the sputtering deposition process so that the sputtering particles do not permeate during the deposition process So that it is easy to detach the adhesive pad and the semiconductor package on the tray after the deposition process. Thus, it is possible to reduce the damage of the semiconductor package due to excessive force at the time of separation, To improve product quality and to automate these processes. Thus, it is possible to improve the production yield and to deposit the electromagnetic wave shielding film on the five sides of the top side and the four sides (Sidewall) except the bottom side of the semiconductor package uniformly and densely, To a method of attaching and detaching a semiconductor package for forming an electromagnetic wave shielding film using a pressure-sensitive adhesive pad capable of shielding or preventing malfunction of an element by external electromagnetic waves.

BACKGROUND ART [0002] Recent semiconductor manufacturing techniques have been continuously developed with a trend of highly integrated, thin, and miniaturized, and there are various types of highly integrated semiconductor devices.

Semiconductor package is adopted in various fields such as smartphone, display, home appliance, automobile, industrial device and medical device. Recently, it has become a trend of miniaturization, lighter weight and thinner. Accelerating multifunction, network, high capacity and high speed, The importance of electromagnetic wave shielding in the semiconductor package is increasing. Therefore, various countermeasures due to electromagnetic shielding have been proposed. In the beginning, a metal cover (Shield Iid) has been mounted on the semiconductor package. However, the problem of increased product cost, thinning, A method of forming a shielding film by plating or spraying method has been proposed. However, when the method is not applicable to a package having a problem in etching solution or chemical treatment, or when the coating efficiency is low and the thickness is thick and the film quality is uneven, The electromagnetic wave shielding function of the sputtering type which is equivalent to or superior to the electromagnetic wave shielding function of 1/5 ~ 1/10 or less as compared with the conventional method, excellent in adhesion with the package mold, have.

In the semiconductor package, instead of a pin, an LGA (Land Grid Array) package of a copper land in which an electrode capable of making contact with an electrode of a main board (main substrate) is gold-plated, a chip mounted directly on a silicon wafer, (BGA) with a solder ball on the bottom surface of the package, which maximizes the number of I / O terminals by placing an external terminal on the underside of the package so that the distance between the lead and the lead is fine pitch, Grid Array) package. In the production of such a semiconductor package, many techniques have been continuously researched and proposed for increasing the production yield and efficiency including the quality of the product.

Sputtering is one of the essential processes for manufacturing a semiconductor package. In order to manufacture a semiconductor package, conventionally, an adhesive tape is attached to the upper surface of a tray, and a semiconductor package is loaded thereon.

The adhesive tape is pressed or burnt on the side and bottom surface of the semiconductor package due to the adhesive component of the adhesive tape during the sputtering deposition process because of the characteristics of the shielding film formed to be thick for shielding electromagnetic waves for a long time (long time) Or a problem of causing contamination in the semiconductor package.

In addition, since the semiconductor package has to be manually removed from the adhesive tape after the sputtering deposition process, the efficiency and productivity of the work have been reduced. When the semiconductor package is separated from the adhesive tape on the upper surface of the tray, There is a problem that the component remains in the package to increase the defect rate of the semiconductor package.

In order to solve such a problem, the present applicant has applied for a patent and registered a patent for a method and apparatus for sputtering a semiconductor package using a liquid pressure sensitive adhesive. In the above-mentioned patent (No. 10-1479248) A pressure sensitive adhesive pad which is easy to remove is formed by using a liquid pressure sensitive adhesive so as to prevent the semiconductor package from being damaged when the semiconductor package is separated from the tray and to prevent the contamination during the manufacturing process, .

However, the adhesive pad formed by the liquid pressure-sensitive adhesive in the above-mentioned patent has overcome the above-described problems in the package of the land type and the BGA semiconductor package of which the electrode level difference is small such as the LGA in the semiconductor package and the solder ball largely protruded on the lower surface of the package BGA semiconductor package with solder ball protruding in a very large and dense form, LGA lower surface electrode land greatly protruded, or a package or package having a large electrode step size is PCB board level (Strip type) There is a problem that it is somewhat difficult to apply to a sputtering process of an electromagnetic wave shielding film in a package having a large special electrode shape. That is, when a conventional pressure-sensitive adhesive pad is used, a large gap between the pressure-sensitive adhesive pad and the package is caused by a large solder ball or a protrusion electrode having a large step difference in the LGA, The gap between the adhesive pad and the underside of the semiconductor package of the above-described shape of the electrode structure, or the gap between the adhesive pad and the underside of the semiconductor package of the shape described above, Deposition contamination occurs on the lower surface of the semiconductor package through the gap of the page, resulting in a defect of the semiconductor package.

In addition, although the sputtering contamination due to a slight exfoliation has been previously allowed, a range that does not significantly affect the performance of the product is allowed, but recently, the quality standard is strict and complicated, so that it has been difficult to solve it by the conventional methods.

Therefore, regardless of the size, arrangement and density of the solder balls, or regardless of the step or shape of the protruding electrodes, or regardless of the area of the bottom surface to be in contact, such as a large board- It was required to be able to sputter precisely and precisely only on the top and four sides of the package.

Korean Patent No. 10-1479248

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems of the prior art, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, The present invention provides a semiconductor package for forming an electromagnetic wave shielding film by using a pressure-sensitive adhesive pad capable of suppressing or preventing deposition contamination on a bottom surface of a semiconductor package when depositing the upper surface and the four side surfaces in various types of semiconductor packages, And a method of attaching and detaching a package.

According to another aspect of the present invention, there is provided a method of attaching and detaching a semiconductor package for forming an electromagnetic wave shielding film using a pressure-sensitive adhesive pad, (a) a step of confirming the external structure of the semiconductor package; (b) preparing a tray; (c) providing an adhesive material on a top side of the tray; (d) forming an adhesive pad from the adhesive material; (e) loading the semiconductor package onto an upper surface of the adhesive pad through a loading means; (f) curing the semiconductor package loaded on the upper surface of the pressure-sensitive adhesive pad while pressing it using a pressure plate, and attaching the semiconductor package to the pressure-sensitive adhesive pad; (g) forming an electromagnetic wave shielding film by sputtering on the semiconductor package side attached to the adhesive pad; (h) separating the semiconductor package on which the electromagnetic wave shielding film is formed from a top surface of the tray using a tool; (i) separating the semiconductor package away from an upper surface of the tray through unloading means from the tray; And (j) removing the adhesive pad from the tray. May be included as one feature.

Here, in the step (a), the semiconductor package is a BGA (Ball Grid Array) package consisting of a land grid array (LGA) package formed of metal electrodes in the form of a land on the bottom surface or a solder ball shaped metal electrode on the bottom surface It can also be a feature.

In the step (a), the area of the bottom side of the semiconductor package, the height of the side wall, the presence or absence of a metal line formed on the side surface, the shape of the side surface, The shape and shape of the tray, the shape of the bottom surface, the land protruding step of the bottom surface, the size of the solder ball attached to the bottom surface, the arrangement and density of the solder balls, May be another feature of the present invention.

Here, in the step (b), the tray for loading, attaching and transporting the semiconductor package may be formed as a flat surface and heat resistant.

Here, the semiconductor package in the step (a) may be any one of a semiconductor package having a large contact area with the adhesive pad, a semiconductor package having a large solder ball, or a semiconductor package having a large land protruding step The tray for loading and attaching the semiconductor package in the step (b) is a tray provided with an ejector hole through which an ejector pin can pass, .

Further, in the step (b), the ejector hole and the ejector pin may be characterized in that one or a plurality of ejector holes are provided corresponding to one semiconductor package have.

The adhesive material may be a liquid pressure sensitive adhesive. In the step (c), the surface of the tray formed on the flat surface may be coated with a liquid pressure-sensitive adhesive on a flat surface, and a surface leveling process may be performed .

In the step (c), a liquid pressure-sensitive adhesive is linearly coated on the upper surface of the tray provided with the ejector hole in a lattice pattern, and the pressure- Surface leveling may be another feature.

The adhesive may be a liquid pressure sensitive adhesive. In the step (d), the liquid pressure sensitive adhesive applied on the upper surface of the tray may be first cured to form a semi-cured pressure sensitive adhesive pad.

The adhesive material is a silicon sheet. In step (d), a silicon sheet having a flat and flat thickness and a sticky adhesive property is formed on the upper surface and the lower surface of the tray, And the adhesive pad is formed by attaching it to the upper surface.

Further, in the step (d), a protective film may be attached to the upper and lower surfaces of the silicon sheet.

Further, the semiconductor package in the step (a) may be a semiconductor package having a large contact area with the silicon sheet, a semiconductor package having a large solder ball, or a semiconductor package having a large land protruding step difference The tray for loading and attaching the semiconductor package in the step (b) is a tray provided with an ejector hole through which an ejector pin can pass, .

In the step (d), the pressure-sensitive adhesive may be applied on the upper surface of the tray, or may be linearly coated with a grid pattern or subjected to a surface leveling process, Wherein the semi-cured adhesive pad is formed to have a thickness greater than the outer diameter of the solder ball of the semiconductor package or the land of the semiconductor package.

The adhesive material may be a silicon sheet. In the step (d), the thickness of the silicon sheet may be greater than the outer diameter of the solder ball of the semiconductor package or the land of the semiconductor package have.

(D) performing a step between (d1) and (e), wherein (d1) a step of performing outgassing in a vacuum chamber provided with the tray before loading the semiconductor package onto the upper surface of the adhesive pad ; May be further included.

In addition, the adhesive material may be a silicon sheet. In the step (e), a semiconductor package having a large contact area with the silicon sheet, a semiconductor package having a large solder ball, or a semiconductor package having a large land- The tray for loading and attaching the semiconductor package in the step (b) is a tray provided with an ejector hole through which an ejector pin can pass , And a grid pattern is formed on the silicon sheet to load the package.

Here, in the step (f), the solder ball of the semiconductor package or the protruding land of the semiconductor package may be completely inserted into the adhesive pad so that the solder ball is closely attached to the lower face.

In the step (f), a package curing and fixing device for fixing the semiconductor package by pressing the semiconductor package closely attached to the upper surface of the pressure-sensitive adhesive pad while pressing the package with the pressure plate is used. It can also be a feature.

Further, in the step (f), the package curing and fixing device may include: a tray forming the adhesive pad; A lower heater for heating the tray and located at a lower portion of the tray; A pressing plate for pressing the semiconductor package when the semiconductor package located on the upper surface of the adhesive pad is completely cured; And a presser plate height adjusting device located on a side surface of the presser plate and adjusting a height of the semiconductor package with respect to the presser plate; And may include another feature.

Further, in the step (f), the lower heater of the package curing and fixing device is provided with a plurality of vacuum suction holes, and the package curing and fixing device vacuum-sucks the tray, It is also possible to make it possible to correct the warpage and flatten it.

Further, in the step (f), the lower heater of the package curing and fixing device may be used to discharge gas or oil generated while heating the tray so that the adhesive pad is completely cured have.

Here, in the step (f), the package curing and fixing apparatus may further include an upper heater for heating the pressure plate and positioned above the pressure plate.

Further, in the step (f), the pressure plate may be heated by using the upper heater of the package curing and fixing device so that the pressure sensitive adhesive pad is completely cured, and the oil discharged from the pressure sensitive adhesive pad may be prevented from adhering to the pressure plate It may be another feature.

Further, in the step (f), in the package curing and fixing apparatus, a plurality of exhaust holes are provided on the side surface of the pressure plate, and the gas and oil components generated in the curing process are discharged through the exhaust hole It can also be a feature.

Further, in the step (f), the degree to which the semiconductor package solder ball or the protruding land of the semiconductor package is inserted when the semiconductor package is pressed using the pressure plate may be further characterized.

Further, in the step (f), a degassing and exhausting apparatus may be used so that outgassing can be completely performed when the semiconductor package is pressed using the presser plate.

In the step (f), at least one step curing process may be performed so that the semiconductor package solder ball and the protruding land are inserted into the upper surface of the adhesive pad and adhered to the upper surface of the adhesive pad. have.

Further, in the step (f), in the pressing plate of the package curing and fixing device, a spring capable of applying pressure to the semiconductor package to suppress the influence of the flat accumulation tolerance of the tray, each semiconductor package, and the pressure plate The pressure plate may be further provided with another feature.

Further, in the step (f), in the pressing plate of the package curing and fixing device, a load cell and a pressure adjusting device are additionally provided on the pressing plate to suppress the influence of the flat accumulation tolerance of the tray and each of the semiconductor packages and the pressing plate It is also possible to provide another feature.

In the step (h), the semiconductor package having the electromagnetic shielding film formed thereon is separated from the upper surface of the tray using the tool by sliding or twisting the semiconductor package with the tool, The semiconductor package may be separated from the upper surface of the tray by first hanging a hook at the bottom edge of the lower surface of the semiconductor package.

In the step (h), the semiconductor package is slid or twisted with a jig tool so as to separate the semiconductor package on which the electromagnetic wave shielding film is formed from the upper surface of the tray using the tool. or by separating the upper surface of the tray from the upper surface of the tray using an ejector pin by hooking the bottom edge of the bottom surface of the semiconductor package or through an ejector hole, .

The method of attaching and separating a semiconductor package for forming an electromagnetic wave shielding film using the adhesive pad according to the present invention is a method of attaching and detaching a semiconductor package, It is possible to prevent or prevent the contamination of the bottom surface in various kinds of semiconductor packages regardless of the area of the bottom surface and to prevent the occurrence of a short between the solder balls or the lands and to suppress the occurrence of defects in the semiconductor package in the sputtering deposition process .

In addition, since the upper and lower surfaces of the semiconductor package can be deposited uniformly and densely, the electromagnetic wave generated by the semiconductor package can be shielded or the malfunction of the device can be prevented by the external electromagnetic wave.

The silicon sheet is loaded into the tray in a vacuum environment, so that the silicon sheet is lifted or bubbled between the tray and the silicon sheet in the chamber. Is also suppressed.

In addition, since the contact area between the adhesive pad and the projecting electrode of the solder ball or the land attached to the lower side of the semiconductor package can be minimized, it is possible to easily unload the semiconductor package while preventing damage to the solder ball when separating and separating the semiconductor package It also has the effect of preventing damage to the semiconductor package and automating it, thereby improving the production yield.

In addition, since the pressure-sensitive adhesive pad does not bulge at the side surface of the semiconductor package during the sputtering process, the effect of suppressing or preventing the sputtering effect on the side surface of the semiconductor package is also reduced.

In addition, it is convenient to reuse the tray by easily and cleanly removing the adhesive pad used in the tray.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a process flow diagram showing a method for attaching and detaching a semiconductor package according to the present invention.
FIG. 2 is a cross-sectional view showing a practical example of a tray shape and a liquid-state adhesive forming method according to the semiconductor package exterior structure of the present invention.
3 is a cross-sectional view showing a practical example of forming a pressure-sensitive adhesive pad by first curing a liquid-applied pressure-sensitive adhesive applied on the upper surface of a tray of the present invention.
4 is a partial cross-sectional view showing a practical example in which a BGA semiconductor package is loaded on an adhesive pad formed after primary curing of the upper surface of the tray of the present invention
FIG. 5 is a partial cross-sectional view illustrating a loaded example of a grid pattern formed on a pressure sensitive adhesive pad for insertion and separation of a solder ball of a BGA semiconductor package when a pressure sensitive adhesive pad is formed using the silicon sheet of the present invention
6 is a cross-sectional view showing a practical example in which the BGA semiconductor package is secondarily cured using a package curing and fixing apparatus and adhered to a pressure-sensitive adhesive pad.
FIGS. 7 to 9 are cross-sectional views showing a practical example in which an additional device for attaching a precise BGA semiconductor package is provided with an additional device on the pressure plate of the package curing and fixing device.
10 is a partial cross-sectional view of an electromagnetic wave shielding film formed by applying the BGA semiconductor package attaching method of the present invention.
11 and 12 are partial sectional views schematically showing a method of separating a BGA semiconductor package having an electromagnetic wave shielding film of the present invention using a tool

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view showing a practical example of a method of forming a tray shape and a liquid adherend according to the outer appearance of a semiconductor package of the present invention, and Fig. 3 is a cross- FIG. 4 is a cross-sectional view showing a state in which a BGA semiconductor package is loaded on a pressure-sensitive adhesive pad formed after primary curing of a top surface of a tray of the present invention, And FIG. 5 is a partial cross-sectional view illustrating a case in which a solder ball of the BGA semiconductor package is inserted and separated when the adhesive pad is formed using the silicon sheet of the present invention. And FIG. 6 shows a practical example in which the BGA semiconductor package is secondarily cured using a package curing and fixing device to adhere to a pressure-sensitive adhesive pad And FIG. 7 to FIG. 9 are cross-sectional views showing a practical example in which an additional device for attaching a precise BGA semiconductor package is provided with an additional device on the pressure plate of the package curing and fixing device, and FIG. 10 is a cross- FIGS. 11 and 12 are partial sectional views schematically showing a method of separating a BGA semiconductor package having an electromagnetic wave shielding film of the present invention by using a tool. FIG.

1 to 10, a semiconductor package attaching and detaching method for forming an electromagnetic wave shielding film using a pressure pad according to an embodiment of the present invention includes a package attaching method S1100 and a package separating method S1200 . Here, the package attaching method S1100 includes steps (a) through (g), and the package detachment method S1200 includes steps (h) through (j).

Here, in explaining the present invention, it is noted that the semiconductor package is briefly described as a package for convenience of explanation.

In addition, liquid adhesives and silicone sheets can be used as typical examples of the adhesive material (adhesive material) in the present invention. The liquid pressure sensitive adhesive and the silicone sheet will be described separately in each step, if necessary, .

<< S1100 >>

<< S1110 >>

First, step (a) (S1110) is a step of checking the external structure of the semiconductor package.

(a) In step (S1110), for example, a LGA (Land Grid Array) semiconductor package composed of a metal electrode in the form of a land on the lower surface of the semiconductor package, or a BGA (Ball Grid Array) semiconductor package.

In addition, in step (a) (S1110), the area of the bottom side of the semiconductor package, the height of the sidewall, the presence or absence of a metal line formed on the side, By measuring the contact area between the semiconductor package and the adhesive pad through the land shape, land protruding step on the bottom surface, the size of the solder ball attached to the bottom surface, and the arrangement and densification of the solder balls, , It is desirable to determine the shape and structure of the tray.

Thus, in step (a) (S1110), the external structure of the semiconductor package is confirmed.

<< S1120 >>

(b) Step (S1120) is a tray preparing step.

(b) In step (S1120), the tray for loading and attaching and transporting the semiconductor package is preferably formed in a plane and has heat resistance.

For example, it is preferable that the tray for loading, attaching and transporting the semiconductor package is formed in a flat surface and is not thermally deformed to 250 deg. C, and has a flatness within 50 m.

(A) the semiconductor package in step (S1110) includes a semiconductor package having a large contact area with the adhesive pad, a semiconductor package having a large solder ball, or a land protrusion (B) In step (S1120), the tray for loading and attaching the semiconductor package is provided with an ejector hole through which the ejector pin can pass, It is preferable that the tray is provided.

For example, a package having an area exceeding 0.3 mm in the size of the solder ball of the BGA package or a size exceeding 25 mm x 25 mm in the size of the package bottom when the contact area with the adhesive pad is large at the time of confirming the external structure of the package, It is preferable that an ejector hole through which the ejector pin can pass is provided. Here, the above numerical values are actual examples, and the standard of the ejector holes may vary depending on the various external structures of the package or the package separation and separation method.

Here, more preferably, the ejector hole and the ejector pin may have one or a plurality of ejector pins based on one semiconductor package.

Thus, the tray is prepared in step (b) (S1120).

<< S1130 >>

Next, in step (c) (S1130), an adhesive material is provided on the upper surface of the tray. (C) Step (S1130) is a step of applying a liquid pressure-sensitive adhesive on the top side of the tray.

(c) In step S1130, it is preferable that a liquid level adhesive is applied to the upper surface of the tray formed on the flat surface and the surface leveling process is performed.

For example, it is also possible to apply a liquid pressure-sensitive adhesive on the upper surface of the tray formed in a flat surface and flatness within 30 m after surface leveling.

Here, a squeegee (not shown) or a flat bar (not shown) may be used to increase the flatness.

In the case of a tray provided with an ejector hole, it is preferable to apply a liquid level adhesive on the upper surface of the tray linearly in a lattice pattern and perform a surface leveling process.

More specifically, the method of applying the liquid adhesive may be different depending on the size of the solder balls attached to the BGA package, the area under the package, and the land protruding step of the LGA package.

For example, when the solder ball size of the BGA package is small, the area of the bottom surface of the package is small, or the LGA package land protruding step is small, the liquid- 210).

Or if the solder ball size of the BGA package is large, the area of the package bottom surface is large, and the LGA package land protruding step is large, the ejector holes are provided in the tray as shown in FIG. 2 (b) Or may be applied to the tray 230.

Here, in order to reduce the contact area between the pressure sensitive adhesive pad formed by curing the liquid pressure sensitive adhesive and the package to facilitate separation and separation of the package after the completion of the sputtering, a dispenser (not shown) It is preferable that the liquid pressure-sensitive adhesive is linearly applied in a lattice pattern using a surface coating nozzle of the above-mentioned type.

In this way, in step (c) (step S1130), an adhesive material is provided on the top side of the tray.

<< S1140 >>

(d) Step S1140 is a step of forming an adhesive pad from the adhesive material provided on the upper surface of the tray.

In the case where the adhesive material is a liquid pressure sensitive adhesive, (d) step (S1140) may be a step of first hardening the liquid pressure-sensitive adhesive applied on the upper surface of the tray to form an adhesive pad.

(C) Surface leveling of the liquid pressure sensitive adhesive applied on the upper surface of the tray in step (S1130), and (d) In step (S1140), primary curing is performed to form a semi-cured pressure sensitive adhesive pad.

For example, it is preferable that the primary curing temperature of the liquid-phase pressure-sensitive adhesive is semi-cured by heat of 50 ° C to 150 ° C. More preferably, the primary curing time of the liquid-phase pressure-sensitive adhesive forms a semi-cured pressure-sensitive adhesive pad within a period of 10 minutes or less at a temperature of 50 ° C to 150 ° C. Here, the above numerical values are actual examples, and the primary curing temperature and time may vary depending on various external structures of the package or package separation and separation method.

The primary curing makes the liquid pressure sensitive adhesive into a semi-hardened adhesive pad state, and has the adhesive force and the elasticity at the same time, so that the insertion of the solder ball or the land protruding electrode becomes easy. The concept of primary curing in FIG. 3 is schematically shown in cross-section. In FIG. 3, reference numeral 310 denotes a tray, reference numeral 330 denotes a tray, reference numeral 320 denotes a liquid coated pressure sensitive adhesive, and reference numeral 340 denotes a lattice pattern linearly applied liquid pressure sensitive adhesive.

As another method for forming a semi-cured adhesive pad, a silicon sheet may be used as an adhesive material. In this case, it is also preferable that a pressure sensitive adhesive pad is formed by attaching a silicon sheet having a flat and flat thickness on the upper surface and the lower surface of the tray to the upper surface of the tray.

Here, it is preferable that the silicon sheet has a protective film attached to both sides (upper surface and lower surface).

Since the silicone sheet is excellent in moldability and can be processed into a pad shape, there is no need to perform primary heat curing. And silicone oil with low vapor pressure on the silicon sheet can be used to suppress the outgassing during the sputtering process.

(A) the semiconductor package in the step (S1110) corresponds to any one of a semiconductor package having a large contact area with the silicon sheet, a semiconductor package having a large solder ball size, or a semiconductor package having a large land protruding step difference (B) In step (S1120), the tray for loading and attaching the semiconductor package is preferably a tray provided with an ejector hole through which an ejector pin can pass.

For example, in the case where the solder ball of the BGA package having a large contact area with the silicon sheet at the time of confirming the external structure of the package is larger than 0.3 mm or the package has an area exceeding 25 mm x 25 mm in size, A tray provided with a hole is preferably used.

Here, the above numerical values are actual examples, and the standard of the ejector holes may vary depending on the external structure of the various bottom surfaces of the package or the package separation and separation method.

When a pressure-sensitive adhesive is a liquid pressure-sensitive adhesive, it is preferable to coat the upper surface of the tray with a liquid-phase pressure-sensitive adhesive on its entire surface or with a linear pattern of a grid pattern or a surface leveling treatment The semi-cured adhesive pad is preferably formed so that the thickness of the semi-cured adhesive pad is larger than the outer diameter of the solder ball of the semiconductor package or the thickness of the land of the semiconductor package.

When a silicon sheet is used as the adhesive, the thickness of the silicon sheet is preferably about 100 to 500 mu m thicker than the solder ball of the semiconductor package or the land of the semiconductor package.

Here, the above numerical values are actual examples, and the thickness of the adhesive material may vary depending on the appearance and the shape of the various bottom surfaces of the package.

Further, a step of performing outgassing in the vacuum chamber may be further added before the package is loaded in the primary cured semi-cured adhesive pad or the silicon sheet.

In other words, step (d) between step (S1140) and step (S1150) (step S1150) is performed in which the semiconductor package is mounted in a vacuum chamber equipped with a tray (D1) in which outgassing is performed; May also be included.

Thus, step (d) S1140 forms a pressure-sensitive adhesive pad from the adhesive material.

<< S1150 >>

(e) Step S1150 is a step in which the semiconductor package is loaded onto the upper surface of the adhesive pad through a loading means.

In the case where the adhesive material is a silicon sheet, in step (e) (S1150), a semiconductor package having a large contact area with the silicon sheet, a semiconductor package having a large solder ball, or a semiconductor package having a large land- In step (b), the tray for loading and attaching the semiconductor package in step (S1120) is a tray provided with an ejector hole through which an ejector pin can pass, It is desirable to create a grid pattern on the sheet to load the semiconductor package.

For example, in the case where the solder ball of the BGA package having a large contact area with the silicon sheet at the time of confirming the external structure of the package is larger than 0.3 mm or the package has an area exceeding 25 mm x 25 mm in size, When a tray having a hole is used, it is preferable that a grid pattern is formed on a silicon sheet and the package is loaded. Here, the above numerical value is a practical example, and the fabrication criteria and the grid size of the grid pattern may vary in the silicon sheet depending on the external structure of the package bottom surface or the package separation and separation method.

<< S1160 >>

(f) In step S1160, the semiconductor package loaded on the upper surface of the adhesive pad is cured while being pressed by using a pressure plate, and attached to the adhesive pad.

If the adhesive material is a liquid-phase adhesive, (f) step (S1150) may be a step of secondarily curing the loaded semiconductor package while pressing the loaded semiconductor package using a pressure plate, and attaching the package to the adhesive pad.

(f) In step S1150, it is preferable that the solder balls of the semiconductor package or the protruding lands of the semiconductor package are completely inserted into the adhesive pad and adhere to the lower surface of the solder ball.

4, when the BGA semiconductor package is loaded on the upper surfaces of the adhesive pads 420 and 470 formed on the trays 410 and 460, the solder balls 435 and 485 of the BGA semiconductor packages 430 and 480 are completely inserted into the adhesive pads 420 and 470 (440,490).

As shown in FIG. 4, when the solder balls 435 and 485 of the BGA semiconductor packages 430 and 480 are not fully inserted into the adhesive pads 420 and 470 but are floated (440 and 490), the package bottom is damaged due to deposition contamination during the sputtering for forming the shielding film, do.

5 is a schematic cross-sectional view illustrating a state in which a grid pattern is formed on an adhesive pad for insertion and detachment of a solder ball of a BGA semiconductor package when the adhesive pad is formed on the upper surface of the tray using a silicon sheet.

When the silicon sheet 520 is attached to the tray 510, a large amount of force is required to remove the BGA semiconductor package 530, and the solder ball on the bottom surface of the BGA semiconductor package 530 may be damaged . When the entire lower surface of the BGA semiconductor package 530 is attached to the silicon sheet 520, there may also be a problem that the portion of the silicon sheet 520 on the bottom of the package is pushed up to the side of the BGA semiconductor package 530. In order to solve such a problem, a tray 560 and a silicon sheet 570 are formed in a lattice form to form a contact area (contact area) between the solder ball on the lower surface of the BGA semiconductor package 580 and the silicon sheet 570 It is desirable to minimize. The lattice-shaped ejector hole 565 of the tray 560 may serve as a passage through which the ejector pin operates when the package is separated.

Therefore, it is desirable to provide a package curing and fixing device that fixes the semiconductor package by pressing the semiconductor package closely attached to the upper surface of the pressure-sensitive adhesive pad while pressing the package with a pressing plate.

The package curing and fixing apparatus includes a tray for forming a pressure sensitive adhesive pad, a lower heater for heating the tray and disposed at a lower portion of the tray, a pressing member for pressing the semiconductor package when fully curing the semiconductor package, A pressure plate height adjusting device which is disposed on a side surface of the pressure plate and adjusts a height of the semiconductor package relative to the pressure plate; As shown in FIG.

In the package curing and fixing apparatus, a plurality of vacuum exhaust holes are provided in the lower heater, and the package curing and fixing apparatus is preferably capable of vacuum-absorbing trays to correct warpage and planarize the trays.

It is preferable to use the lower heater of the package curing and fixing device to discharge gas or oil generated while heating the tray so that the adhesive pad is completely cured, thereby suppressing contamination during the sputtering process.

The package curing and fixing apparatus may further include an upper heater which heats the press plate and is located above the press plate.

Here, the pressure plate may be heated so that the pressure sensitive adhesive pad is completely cured by using the upper heater of the package curing and fixing device, and the oil discharged from the pressure sensitive adhesive pad may be prevented from sticking to the pressure plate.

Further, in the package curing and fixing device, a plurality of exhaust holes are provided on the side of the press plate, and gas and oil components generated in the curing process are preferably discharged through the exhaust holes.

Here, it is preferable that the degree to which the semiconductor package solder ball or the protruding land of the semiconductor package is inserted when pushing the semiconductor package using the push plate is preferably adjustable.

Further, a degassing and exhausting device may be added so that outgassing can be completely performed when a semiconductor package is pressed using a pressure plate.

In addition, it is preferable that at least one step curing process is performed so that the semiconductor package solder ball and the protruding land are inserted and adhered to the upper surface of the adhesive pad.

6 is a cross-sectional view showing a practical example in which the BGA semiconductor package is secondarily cured using a package curing and fixing apparatus and adhered to a pressure-sensitive adhesive pad.

The upper surface of the BGA semiconductor package 630 is pressed by the pressing plate 650 and the secondary curing is performed. A plurality of exhaust holes 651 are provided at the edges of the lid pressing plate 650 and a pressure plate height adjusting device 652 is provided so that the solder balls of the BGA semiconductor package 630 are bonded to the adhesive pad 620 or the silicon sheet 620). If the pressure to be applied through the push plate adjusting device 652 varies depending on the thickness of the adhesive pad 620 or the silicon sheet 620, the solder ball size of the BGA semiconductor package, and the LGA protruding land step, for example, in the case of a BGA semiconductor package, ~ 5 Newtons of pressure.

Here, the secondary curing means complete curing, and outgassing is completely performed through the plurality of exhaust holes 651 from the adhesive pad 620 or the silicon sheet 620. The complete curing is performed at a lower heater 611 provided at a lower portion of the tray 610 at, for example, 100 ° C to 200 ° C for 10 minutes or less. In this process, And is discharged to the hole 612.

The upper heater 655 provided on the pressure plate 650 promotes the secondary curing of the adhesive pad 620 or the silicon sheet 620 to thereby completely cure the oil, And is also exhausted through the exhaust hole 612 to prevent contamination during processing.

A plurality of vacuum exhaust holes 612 are provided in the lower heater 611 to compensate for the warping by vacuum suction of the tray 610 and to flatten the semiconductor package 630 so that the semiconductor package 630 is bonded to the adhesive pad 620 or the silicon sheet 620 ).

The solder ball of the BGA semiconductor package 630 is completely inserted into the secondary hardened adhesive pad 620 or the silicon sheet 620. [

Here, the embodiment as shown in Figs. 7 to 9 is also preferable.

FIGS. 7-9 are cross-sectional views illustrating several examples of embodiments implementing additional apparatus for attaching a precision BGA semiconductor package with additional equipment to the pressure plate of the package curing and securing apparatus.

7 is a view for explaining the effect of suppressing the influence of the flat accumulation tolerance of the tray 710, each package 730, and the pressure plate 750 at the pressure plate 750 of the package curing and fixing device 700 Sectional view showing an example in which a spring 753 capable of applying pressure to individual packages 730 or a plurality of packages 730 is additionally provided in the pressure plate 750. [

7, in order to suppress the influence of the planar cumulative tolerance of the tray 710, each semiconductor package 730, and the pressure plate 750 in the pressing plate 750 of the semiconductor package curing and fixing device 700, A spring 753 capable of applying pressure to the plurality of packages 730 or the plurality of packages 730 may be additionally provided to the pressure plate 750. Reference numeral 755 denotes an upper heater, reference numeral 752 denotes a pressure plate height adjusting device, reference numeral 711 denotes a lower heater, reference numeral 712 denotes a vacuum exhaust hole, and reference numeral 720 denotes an adhesive pad.

8 shows an individual package 830 or 830 for suppressing the influence of the planar cumulative tolerance of the tray 810, each package 830, and the pressure plate 850 in the pressure plate 850 of the package curing and fixing device 800, (A leaf spring 853 capable of applying pressure to a plurality of packages 830) is additionally provided on the pressure plate 850. As shown in Fig.

The influence of the planar cumulative tolerance of the tray 810, each semiconductor package 830, and the pressure plate 850 in the pressing plate 850 of the semiconductor package curing and fixing device 800 is suppressed It is also desirable to additionally provide a plate spring 853 to the pressure plate 850 that can apply pressure to the individual package 830 or the plurality of packages 830 in order to achieve the desired effect. Here, reference numeral 855 denotes an upper heater, reference numeral 852 denotes a presser plate height adjusting device, reference numeral 811 denotes a lower heater, reference numeral 812 denotes a vacuum exhaust hole, and reference numeral 820 denotes a pressure pad.

9 shows the load cell 961 and the pressure sensor 950 for suppressing the influence of the planar cumulative tolerance of the tray 910, each package 930 and the pressure plate 950 in the pressure plate 950 of the package curing and fixing device 900, Sectional view showing an example in which the adjusting device 963 is additionally provided on the pressure plate 950. Fig.

9, in order to suppress the influence of the planar cumulative tolerance of the tray 910, each semiconductor package 930, and the pressure plate 950 in the pressure plate 950 of the semiconductor package curing and fixing device 900, 961, see Fig. 9) and the pressure regulating device 963 (see Fig. 9) are additionally provided on the pressure plate 950.

Here, the pressure regulating device 963 and the load cell 961 can perform the same function as the presser plate height adjusting device. The edge of the lid-shaped pressure plate 950 maintains a certain space and is spaced away from the tray 910 to adjust the pressure applied to the package 930 through the pressure regulator 963. Reference numeral 955 denotes an upper heater, reference numeral 911 denotes a lower heater, reference numeral 912 denotes a vacuum exhaust hole, and reference numeral 920 denotes an adhesive pad.

<< S1170 >>

(g) Step S1170 is a step of forming an electromagnetic wave shielding film by sputtering toward the semiconductor package attached to the adhesive pad.

Conventional deposition methods can be used for deposition in a BGA semiconductor package by sputtering. Therefore, detailed description of the sputtering will be omitted. However, when the deposition is completed by sputtering, the electromagnetic wave shielding films 1040 and 1090 are formed as shown in a schematic sectional view shown in FIG. In FIG. 10, reference numerals 1010 and 1060 denote trays, reference numerals 1020 and 1070 denote adhesive pads, reference numerals 1030 and 1080 denote BGA semiconductor packages, reference numeral 1065 denotes an ejector hole, reference numeral 1067 denotes an ejector Pin.

<< S1200 >>

<< S1210 >>

(h) In operation S1210, the semiconductor package having the electromagnetic shielding film is separated from the upper surface of the tray using a tool.

(h) In step S1210, the semiconductor package is slid or twisted with a tool to allow the semiconductor package with the magnetic shielding film formed thereon to be separated from the upper surface of the tray using the tool, It is preferable that a ring is hooked on the bottom edge of the lower tray and is separated from the upper surface of the tray to be primaryly separated.

Alternatively, the semiconductor package may be slid or twisted with a jig tool to separate the semiconductor package on which the electromagnetic wave shielding film is formed from the upper surface of the tray using a tool, It is preferable that the tray is separated from the upper surface of the tray by a hook or a ejector pin through an ejector hole so as to be primarily separated.

FIG. 11 schematically shows a first BGA semiconductor package having an electromagnetic wave shielding film formed thereon by using a tool. When the tool 1150 is pressed and pushed in parallel to the tray 1110, the BGA semiconductor package 1130 is moved to one side. At this time, primary separation occurs. That is, one side of the BGA semiconductor package is slightly opened or separated. Or it may be slid, twisted, or spaced apart by hanging the edge of the lower surface with a hook. 11, reference numeral 1120 denotes an adhesive material which has been completely cured.

12 schematically shows a case where a tray 1260 provided with an ejector hole 1265 is used. 11, the ejector hole 1265 and the ejector pin 1267 are provided slightly different from each other. The ejector pin 1267 located inside the ejector hole 1265 is moved upward and the BGA semiconductor package 1280 is firstly separated.

<< S1220 >>

(i) Step S1220 is a step of separating the BGA semiconductor package separated from the upper surface of the tray from the transfer tray by unloading means.

Here, a vacuum picker 1190 (see FIG. 11) (1290, see FIG. 12) may be used as unloading means.

(h) Lifting the BGA semiconductor package 1130 (see FIG. 11) using the vacuum picker 1190 (see FIG. 11) while the BGA semiconductor package 1130 (see FIG. 11) The BGA semiconductor package 1130 (see FIG. 11) can be unloaded.

<< S1230 >>

(j) Step S1230 is a step of removing the adhesive material from the tray.

Here, the conventional method of removing the adhesive pad may be used, and a detailed description thereof will be omitted.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the scope of the present invention is to be construed as being limited only by the embodiments, and the scope of the present invention should be understood as the following claims and their equivalents.

Tray 210, 230, 310, 330, 410, 460, 510, 560, 610, 710, 810, 910, 1010, 1060, 1110, 1260
Liquid pressure sensitive adhesive: 220, 240, 320, 340
Silicon sheet: 520, 570
Adhesive pads: 420, 470, 620, 720, 820, 920, 1020, 1070
(BGA) semiconductor packages: 430, 480, 530, 580, 630, 730, 830, 930, 1030, 1130, 1280
Package curing and fastening devices: 600, 700, 800, 900

Claims

A method of attaching a semiconductor package for forming an electromagnetic wave shielding film using a pressure-sensitive adhesive pad,
(a) a step of confirming the external structure of the semiconductor package;
(b) preparing a tray;
(c) providing an adhesive material on a top side of the tray;
(d) forming an adhesive pad from the adhesive material;
(e) loading the semiconductor package onto an upper surface of the adhesive pad through a loading means;
(f) curing the semiconductor package loaded on the upper surface of the pressure-sensitive adhesive pad while pressing it using a pressure plate, and attaching the semiconductor package to the pressure-sensitive adhesive pad;
(g) forming an electromagnetic wave shielding film by sputtering on the semiconductor package side attached to the adhesive pad;
(h) separating the semiconductor package on which the electromagnetic wave shielding film is formed from a top surface of the tray using a tool;
(i) separating the semiconductor package away from an upper surface of the tray through unloading means from the tray; And
(j) removing the adhesive pad from the tray;
, &Lt; / RTI &
The step between (d) and (e)
(d1) performing outgassing in a vacuum chamber provided with the tray before loading the semiconductor package onto the top surface of the adhesive pad; The method of claim 1, further comprising the steps of: forming an adhesive layer on the semiconductor wafer;

The method according to claim 1,
In the step (a)
The semiconductor package includes:
An LGA (Land Grid Array) package formed of a land-shaped metal electrode on the lower surface or
And a BGA (Ball Grid Array) package including a metal electrode in the form of a solder ball on the bottom surface of the package.

The method according to claim 1,
In the step (a)
The height of the side wall of the semiconductor package, the height of the side wall, the presence or absence of a metal line formed on the side surface, the shape of the side surface, the shape of the bottom surface, The size of the solder ball attached to the solder balls, and the arrangement and density of the solder balls,
And the shape and structure of the tray are determined based on the height and the attachment condition of the adhesive pad, and the method of attaching and detaching the semiconductor package for forming the electromagnetic wave shielding film using the adhesive pad.

The method according to claim 1,
In the step (b)
Wherein the tray for loading, attaching and transporting the semiconductor package is formed in a flat surface and has heat resistance.

The method according to claim 1,
Wherein the semiconductor package in the step (a)
When a semiconductor package having a large contact area with the adhesive pad, a semiconductor package having a large solder ball, or a semiconductor package having a large land protruding step difference on the bottom surface of the semiconductor package,
In the step (b), the tray for loading, attaching and transporting the semiconductor package may include:
Wherein the tray is provided with an ejector hole through which an ejector pin can pass. 2. The semiconductor package according to claim 1, wherein the ejector hole has an ejector hole.

The method of claim 5,
In the step (b)
The ejector hole and the ejector pin are connected to each other,
Corresponding to one semiconductor package,
Wherein each of the plurality of semiconductor packages is provided with one or a plurality of adhesive pads.

The method according to claim 1,
The pressure-sensitive adhesive material is a liquid pressure-
In the step (c)
A method for attaching and detaching a semiconductor package for forming an electromagnetic wave shielding film, the method comprising: applying a liquid pressure-sensitive adhesive on a flat surface of a tray formed on a flat surface and performing a surface leveling process.

The method according to claim 1 or 5,
The pressure-sensitive adhesive material is a liquid pressure-
The tray is provided with an ejector hole,
In the step (c)
Wherein a liquid level adhesive is linearly applied to the upper surface of the tray provided with the ejector hole in a lattice pattern and subjected to a surface leveling process. The semiconductor package according to claim 1, And separation method.

The method according to claim 1,
The pressure-sensitive adhesive material is a liquid pressure-
In the step (d)
Wherein the liquid curable adhesive applied on the top surface of the tray is first cured to form a semi-cured adhesive pad.

The method according to claim 1,
The adhesive material is a silicon sheet,
In the step (d)
Wherein the adhesive pad is formed by attaching a silicon sheet having an upper surface and a lower surface in a plane and having a constant thickness and adhesiveness to an upper surface of the tray, A method of attaching and detaching a semiconductor package for forming a semiconductor package.

The method of claim 10,
In the step (d)
Wherein a protective film is attached to the top and bottom surfaces of the silicon sheet. &Lt; RTI ID = 0.0 > 8. < / RTI >

The method of claim 10,
Wherein the semiconductor package in the step (a)
When a semiconductor package having a large contact area with the silicon sheet, a semiconductor package having a large solder ball size, or a semiconductor package having a large land protruding step difference on the bottom surface of the semiconductor package,
In the step (b), the tray for loading, attaching and transporting the semiconductor package may include:
Wherein the tray is provided with an ejector hole through which an ejector pin can pass. 2. The semiconductor package according to claim 1, wherein the ejector hole has an ejector hole.

The method according to claim 1,
The pressure-sensitive adhesive material is a liquid pressure-
In the step (d)
The liquid adhesive may be coated on the upper surface of the tray, linearly coated with a grid pattern, or subjected to surface leveling treatment irrespective of the coating shape, and then primary cured to form a semi-cured adhesive pad,
Wherein the semi-cured adhesive pad thickness is formed to be larger than the outer diameter of the solder ball of the semiconductor package or the land of the semiconductor package.

The method according to claim 1,
The adhesive material is a silicon sheet,
In the step (d)
Wherein the thickness of the silicon sheet is larger than the outer diameter of the solder ball of the semiconductor package or the thickness of the land of the semiconductor package.

delete

The method according to claim 1 or 12,
The adhesive material is a silicon sheet,
In the step (e)
When a semiconductor package having a large contact area with the silicon sheet, a semiconductor package having a large solder ball, or a semiconductor package having a large land protruding step difference on the bottom surface of the semiconductor package,
In the step (b), the tray for loading, attaching and transporting the semiconductor package may include:
Wherein the electronic device is a tray provided with an ejector hole through which an ejector pin can pass and a grid pattern is formed on the silicon sheet to load the package. A method of attaching and detaching a semiconductor package.

The method according to claim 1,
In the step (f)
Wherein the solder balls of the semiconductor package or the protruding lands of the semiconductor package are completely inserted into the adhesive pads and adhere to the lower surfaces of the adhesive pads in close contact with the lower surface of the adhesive pads.

The method according to claim 1,
In the step (f)
And a package curing and fixing device for fixing the semiconductor package by completely pressing the semiconductor package attached to the upper surface of the adhesive pad while pressing the package using the pressing plate. A method of attaching and detaching a semiconductor package.

19. The method of claim 18,
In the step (f)
The package curing and securing apparatus comprises:
A tray forming the adhesive pad;
A lower heater for heating the tray and located at a lower portion of the tray;
A pressing plate for pressing the semiconductor package when the semiconductor package located on the upper surface of the adhesive pad is completely cured; And
A presser plate height adjusting device located at a side surface of the presser plate and adjusting a height of the semiconductor package with respect to the presser plate; And attaching and detaching the semiconductor package to the electromagnetic shielding film.

The method of claim 19,
In the step (f)
The lower heater of the package curing and fixing device is provided with a plurality of vacuum exhaust holes,
The package curing and securing apparatus comprises:
Wherein the tray is vacuum-adsorbed to correct the warpage of the tray and to planarize the tray.

The method of claim 19,
In the step (f)
Wherein the lower heater of the package curing and fixing device is used to discharge gas or oil generated while heating the tray so that the adhesive pad is completely cured, and a semiconductor package for forming an electromagnetic wave shielding film is formed using the adhesive pad And separation method.

The method of claim 19,
In the step (f)
The package curing and securing apparatus comprises:
Further comprising an upper heater located above the pressing plate to heat the pressing plate, and attaching and detaching the semiconductor package for forming an electromagnetic wave shielding film using the adhesive pad.

23. The method of claim 22,
In the step (f)
Wherein the upper heater of the package curing and fixing device is used to heat the pressure plate so that the pressure pad is completely cured and to prevent the oil discharged from the pressure pad from adhering to the pressure plate, A method of attaching and detaching a semiconductor package to form a shielding film.

The method of claim 19,
In the step (f)
In the package curing and fixing apparatus,
Wherein a plurality of exhaust holes are provided on a side surface of the pressure plate and gas and oil components generated in the curing process are discharged through the exhaust hole. Way.

The method of claim 19,
In the step (f)
And the degree of inserting the protruding lands of the semiconductor package solder ball or the semiconductor package when the semiconductor package is pressed using the push plate can be adjusted. .

The method of claim 19 or claim 24,
In the step (f)
Wherein a degassing and evacuating device is used so that outgassing can be completely performed when the semiconductor package is pressed using the presser plate.

The method according to claim 1,
In the step (f)
Wherein at least one step curing process is performed on the upper surface of the adhesive pad so that the semiconductor package solder ball and the protruding land are inserted and closely attached to the upper surface of the adhesive pad. And separation method.

The method of claim 19,
In the step (f)
In the pressing plate of the package curing and fixing device,
Wherein a spring capable of applying pressure to the semiconductor package is additionally provided on the pressing plate to suppress an influence of a flat accumulation tolerance of the tray, each semiconductor package, and the pressing plate. A method of attaching and detaching a semiconductor package.

The method of claim 19,
In the step (f)
In the pressing plate of the package curing and fixing device,
And a load cell and a pressure regulating device are additionally provided on the pressing plate to suppress the influence of the flat accumulation tolerance of the tray, the semiconductor package, and the pressing plate, and a semiconductor package for forming an electromagnetic wave shielding film And separation method.

The method according to claim 1,
In the step (h)
In order to separate the semiconductor package on which the electromagnetic wave shielding film is formed from the upper surface of the tray using the tool,
Characterized in that the semiconductor package is firstly separated by sliding the semiconductor package with the tool or by twisting the semiconductor package or by hanging a ring on the bottom edge of the semiconductor package so as to be separated from the upper surface of the tray. A method of attaching and detaching a semiconductor package for forming an electromagnetic wave shielding film using the method.

The method according to claim 1,
In the step (h)
In order to separate the semiconductor package on which the electromagnetic wave shielding film is formed from the upper surface of the tray using the tool,
The semiconductor package may be slid or twisted with a jig tool or a hook may be hooked to the bottom edge of the semiconductor package or an ejector pin may be inserted through the ejector hole. And separating the upper surface of the tray from the upper surface of the tray using the adhesive pad.