KR101560558B1 - Method for manufacturing intravascular ultrasound transducers and intravascular ultrasound transducer structure thereby - Google Patents

Abstract

The ultrasonic transducer comprises a flexible printed circuit board (FPCB), a first signal pad formed on the upper surface of the FPCB, and a second signal pad formed on the lower surface of the FPCB. A second signal pad, a ground pad formed on the upper surface of the FPCB and spaced apart from the first signal pad, and a piezoelectric element lapping according to a predetermined thickness and formed on the upper surface of the first signal pad, 1 signal pad and the second signal pad are electrically connected via a via through the FPCB, and a device in which a piezoelectric element, a first signal pad, a ground pad, an FPCB, and a second signal pad are stacked is formed of an intravascular ultrasound ) In the stacking direction so as to be equal to or smaller than the critical dimension for the thickness direction.

Description

TECHNICAL FIELD [0001] The present invention relates to an ultrasound transducer, and more particularly, to an ultrasound transducer having an intravascular ultrasound transducer,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic transducer for medical imaging, and more particularly, to a high-frequency transducer as a core element in an intravascular ultrasound image and an ultrasound transducer structure for insertion of the same.

An ultrasound (US) image is obtained by applying an ultrasound signal to an observation region in a human body using an ultrasonic probe and receiving an ultrasound signal reflected from the tissue to extract information contained in the signal, And imaging equipment. This has the advantage that real-time images without harm to human body can be obtained at low cost when compared with other medical imaging systems such as X-ray, CT, MRI, and PET.

Meanwhile, IVUS (Intravascular Ultrasound) imaging technology refers to image processing techniques and methods that image diseases occurring in real-time sections or vessels of blood vessels inside the blood vessels. The population growth with chronic diseases such as population aging and heart disease causes market growth And are in demand worldwide for inexpensive treatment. Under these circumstances, IVUS has great potential as it can meet the requirements that were not possible in the early detection and prevention of coronary artery disease. In addition, this technology is becoming more popular because of its advantages over traditional angiography methods, as revealed by some international clinical studies. The use of IVUS for left main disease and chronic complete obliteration, lower limb artery disease, and angiogenesis is a major opportunity for this technology.

In order to realize such an IVUS image, it needs to be manufactured in accordance with the efficiency and price of the high-frequency converter which is a core element. Because IVUS inserts the transducer into the blood vessel and performs imaging, the diameter of the transducer should be within 1mm, and the frequency used to obtain the high resolution image is the high frequency in the 20-100 MHz band. Since it is possible to transmit and receive ultrasonic waves in small size and high frequency, the cost of manufacturing the IVUS transducer must be low. Therefore, an efficient and economical way of manufacturing the IVUS transducer becomes a core technology barrier of the IVUS imaging device. The following prior art documents describe an array ultrasound transducer for IVUS imaging.

 Development of a Circular Array Ultrasonic Transducer, Hee Won Kim, Yong Rae, The Acoustical Society of Korea,

SUMMARY OF THE INVENTION It is an object of the present invention to provide an ultrasound transducer for IVUS which has a high operating frequency and has a very small thickness of each constituent material and a very small aperture size It is difficult to achieve the characteristics of the transducer desired by the user due to the use of the adhesive in the production of the ultrasonic transducer, and it is difficult to achieve the desired beam focusing Which can not be realized.

According to an aspect of the present invention, there is provided an ultrasonic transducer comprising: a flexible printed circuit board (FPCB); A first signal pad formed on the upper surface of the FPCB and a second signal pad formed on the lower surface of the FPCB; A ground pad formed on the upper surface of the FPCB and spaced apart from the first signal pad; And a piezoelectric element lapping according to a predetermined thickness and formed on the upper surface of the first signal pad, wherein the first signal pad and the second signal pad are connected to each other via a via through the FPCB And the element in which the piezoelectric element, the first signal pad, the ground pad, the FPCB, and the second signal pad are stacked is cut along the lamination direction so as to be less than a critical size for IVUS (intravascular ultrasound) dicing.

A backing layer wrapped according to a predetermined thickness and formed on a bottom surface of the second signal pad in the ultrasonic transducer according to an exemplary embodiment; And a matching layer electrically connected to the upper surface of the piezoelectric element and the ground pad, the matching layer being wrapped according to a preset thickness and formed on the upper surface of the piezoelectric element, Layer and the matching layer.

In the ultrasonic transducer according to an embodiment, the back layer and the matching layer may be formed of a conductive material or a nonconductive material.

In the ultrasonic transducer according to an embodiment, a conductive material may be deposited on the upper surface of the FPCB to connect the piezoelectric element to the ground pad.

According to another aspect of the present invention, there is provided an ultrasound transducer structure comprising: a blood vessel insertion tube for IVUS; A first signal pad, a ground pad spaced apart from the first signal pad, a second signal pad electrically connected to the first signal pad via a FPCB and a via hole penetrating the FPCB, A single-element ultrasonic transducer installed at a distal end of the tube to acquire an ultrasonic image; And a supporter positioned between one side wall of the tube and the ultrasonic transducer to form an opposite angle of the ultrasonic transducer so that the angle of ultrasonic emission of the ultrasonic transducer is different from the insertion direction of the tube.

In the ultrasonic transducer structure according to another embodiment, the ultrasonic transducer may include a first signal pad and a ground pad spaced apart from each other on an upper surface of the FPCB, a second signal pad formed on a lower surface of the FPCB, The first signal pad and the second signal pad are electrically connected through a via penetrating through the first signal pad, and a piezoelectric element wrapped according to a predetermined thickness is formed on the upper surface of the first signal pad, 1 signal pad, the ground pad, the FPCB, and the second signal pad can be manufactured as a single element by cutting along the laminating direction so that the stacked elements are below the critical size for IVUS.

In the ultrasonic transducer structure according to another embodiment, the opposing angle of the ultrasonic transducer by the supporter is determined between 0 and 90 degrees from the insertion direction of the tube, so that the inserting direction of the tube and the insertion The ultrasound image can be obtained simultaneously with the wall surface of the blood vessel, or the Doppler frequency can be estimated to calculate the blood flow velocity.

In the ultrasonic transducer structure according to another embodiment, the ultrasonic transducer is formed in a rectangular shape, the length of the short side of the ultrasonic transducer is at least the diameter of the tube, and the length of the long side of the ultrasonic transducer is not less than the diameter of the tube And a long side of the ultrasonic transducer can be inserted along the inner wall surface of the tube.

In the ultrasound transducer structure according to another embodiment, the end of the tube provided with the ultrasound transducer may be formed with a diagonal cut surface in consideration of the ultrasound radiation direction of the ultrasound transducer.

In the ultrasound transducer structure according to another embodiment, the ultrasound transducer may focus the ultrasound transducer to the geometrical focus of the ultrasound transducer by forming a gradient such that the center plane is concave. In addition, in the ultrasonic transducer structure according to another embodiment, the ultrasonic transducer further includes a convex lens attached to the front surface thereof, so that the ultrasonic transducer can focus the beam to the geometrical focus of the ultrasonic transducer.

In the ultrasound transducer structure according to another embodiment of the present invention, the ultrasound transducer is inserted into a part of the ultrasound transducer to emit a light source for emitting a photoacoustic image and an optical signal for optical coherence tomography (OCT) Module. ≪ / RTI >

The ultrasonic transducer structure according to another embodiment may be grounded by supplying an electric signal to the second signal pad and connecting a housing to the ground pad.

Embodiments of the present invention propose a process technique that allows simultaneous production of multiple discrete single-element IVUS ultrasound transducers through cutting, thereby eliminating the need for adhesives and creating a matching layer and a backing layer It is possible to manufacture an ultrasonic transducer having a high operating frequency and a small aperture size and facilitating signal connection and grounding without using a conductive material, and it is possible to realize beam focusing through a geometrical focus.

1 is a cross-sectional view illustrating the structure of an intravascular ultrasound transducer according to one embodiment of the present invention.
FIG. 2A and FIG. 2B are plan views showing a state in which the vascular insertion type ultrasound transducer of FIG. 1 according to an embodiment of the present invention is viewed from above according to a manufacturing process.
FIG. 2C is a view for explaining a method of producing a single element by cutting a stacked ultrasonic transducer as a final step of the manufacturing process of FIGS. 2A and 2B.
3 is a flowchart illustrating a method of manufacturing an ultrasound transducer according to an embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating the structure of an endovascular ultrasound transducer structure according to another embodiment of the present invention.
5A and 5B are views for explaining a method of guiding beam focusing in the ultrasonic transducer structure of FIG. 4 according to another embodiment of the present invention.
FIG. 6 is a perspective view illustrating a part of the blood vessel insertion type ultrasound transducer structure of FIG. 4 according to another embodiment of the present invention.
FIG. 7 is a view illustrating an optical coherence tomography (OCT) image in an ultrasound transducer of FIG. 4 according to another embodiment of the present invention.
FIG. 8 is an exemplary view for explaining a signal supply and a grounding method in the blood vessel insertion type ultrasound transducer structure of FIG. 4 according to another embodiment of the present invention.

Hereinafter, basic ideas adopted by embodiments of the present invention will be outlined, and specific technical means will be described sequentially.

The fabrication of a single-element transducer, which is not an array converter that is difficult to implement for high frequencies for IVUS, requires wrapping each material of the required backing layer, piezoelectric material, and matching layer, lapping and cutting, and then sticking each of them using an adhesive. However, since the thickness of each material is small and the size is small, it is difficult to obtain the characteristics (ultraminiature and high frequency) of the transducer desired by the user when using a general single-element converter manufacturing method. Particularly, in the high-frequency implementation, the type and thickness of the back layer and the matching layer material as well as the piezoelectric element are the most important factors for determining the converter performance. In the above-described process, the back layer and the matching layer material Are all used as conductive materials, it is difficult to achieve the optimum IVUS converter performance according to the above-described process.

Therefore, in the embodiments of the present invention described below, the materials constituting the IVUS ultrasound transducer are first fabricated to a desired thickness using the FPCB, then the matching is performed, and then a plurality of individual IVUS transformers are diced, It is an efficient and economical process technology that can be fabricated at one time, and it is not necessary for the back layer and matching layer materials to be conductive, and we propose a process technology capable of achieving the best IVUS converter performance.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art, however, that these examples are provided to further illustrate the present invention, and the scope of the present invention is not limited thereto.

FIG. 1 is a cross-sectional view illustrating the structure of an ultrasound transducer according to an embodiment of the present invention. Referring to FIG. 1, two signal pads 11 and 12 are mounted on a flexible printed circuit board (FPCB) A ground pad 13, and a piezoelectric material 14, as shown in Fig.

The first signal pad 11 is formed on the upper surface of the FPCB 10 and the second signal pad 12 is formed on the lower surface of the FPCB 10. The first signal pad 11, The signal pad 12 is electrically connected through at least one via 15 penetrating the FPCB 10.

The ground pad 13 is located on the upper surface of the FPCB 10, which may be implemented as a polyimide, and is spaced apart from the first signal pad 11.

The piezoelectric element 14 is lapped according to a preset thickness and is formed on the upper surface of the first signal pad 11. A conductive material may be deposited on the upper surface of the FPCB 10 to connect the piezoelectric device 14 to the ground pad 13. The conductive material may be chromium or gold but is not limited thereto .

The element 100 in which the piezoelectric element 14, the first signal pad 11, the ground pad 13, the FPCB 10, and the second signal pad 12 are laminated is an intravascular ultrasound (IVUS) ) To be less than or equal to the critical size for the single-crystal silicon (Si). For example, such a critical dimension may be determined to be at least 1 mm x 1 mm, which is smaller than the cross-sectional area of the blood vessel.

When using FPCB as above, it is possible to supply and ground signal through signal and ground pad located on FPCB without using both back layer and matching layer materials as conductive to facilitate signal supply and grounding like existing process. A backing layer (not shown) may be formed on the bottom of the second signal pad 12 and a matching layer (not shown) may be mated to the top surface of the piezoelectric element 14, Has the advantage of being able to produce an ultrasonic transducer without being limited to a conductive material. That is, there is no limitation on the conductive material or the nonconductive material. Therefore, in the case of this embodiment, it is more advantageous to implement the high-frequency characteristic of the IVUS converter as a process technology capable of obtaining the best converter performance as described above.

FIG. 2A and FIG. 2B are plan views showing a state in which the vascular insertion type ultrasound transducer of FIG. 1 according to an embodiment of the present invention is viewed from above according to a manufacturing process.

2A shows a state in which the first signal pad 11 and the ground pad 13 are spaced apart from each other on the upper surface of the FPCB 10. A second signal pad (not shown) is formed on the lower surface of the FPCB 20 . Under these circumstances, a via hole 15 is formed to connect the first signal pad 11 and the second signal pad (not shown) to electrically connect the first signal pad 11 and the second signal pad . FIG. 2B shows that the piezoelectric element 14 is formed on the first signal pad in succession to the process of FIG. 2A.

FIG. 2C is a view for explaining a method of producing a single element by cutting a stacked ultrasonic transducer as a final stage of the manufacturing process of FIGS. 2A and 2B. FIG. 2C is a plan view of a stacked ultrasonic transducer 100, A plurality of single elements 101 can be continuously manufactured.

3 is a flowchart illustrating a method of manufacturing an ultrasound transducer according to an embodiment of the present invention.

In step S310, the first signal pad and the ground pad are formed on the upper surface of the FPCB.

In step S320, a second signal pad is formed on the lower surface of the FPCB.

In step S330, the first signal pad and the second signal pad are electrically connected through a via penetrating the FPCB.

In step S340, a piezoelectric element wrapped according to a predetermined thickness is formed on the upper surface of the first signal pad.

In step S350, a backing layer wrapped according to a predetermined thickness is formed on the lower surface of the second signal pad.

In step S360, after the upper surface of the piezoelectric element is electrically connected to the ground pad, a matching layer wrapped according to a predetermined thickness is formed on the upper surface of the piezoelectric element. Such an electrical connection can be realized by using a material such as gold or chromium. On the other hand, the back layer and the matching layer may be composed of a conductive material or a non-conductive material.

In step S370, the elements in which the piezoelectric element, the first signal pad, the ground pad, the FPCB, the second signal pad, the back layer, and the matching layer are stacked are stacked in a stacking direction Followed by cutting to produce a single device. For example, such a critical dimension may be determined to be at least 1 mm x 1 mm, which is smaller than the cross-sectional area of the blood vessel. However, as will be described later through the proposed ultrasound transducer structure, It is also possible to make the length of one side longer than the diameter of the tube. In this case, however, it is natural that the length of the other side of the device should be shorter than the diameter of the tube.

FIG. 4 is a cross-sectional view illustrating the structure of an endovascular ultrasound transducer structure according to another embodiment of the present invention. The ultrasound transducer 101 includes a single-element ultrasound transducer 101, a support base 30, and a tube 20.

The tube 20 is an outer body for IVUS for insertion of blood vessels.

The single-element ultrasonic transducer 101 is electrically connected to the first signal pad through a piezoelectric element, a first signal pad, a ground pad spaced apart from the first signal pad, a FPCB, and a via penetrating the FPCB And the second signal pad is disposed on the distal end of the tube to acquire an ultrasound image. If necessary, a backing layer may be formed on the lower surface of the second signal pad, and a matching layer may be further formed on the upper surface of the piezoelectric element.

More specifically, the ultrasonic transducer 101 is formed by disposing a first signal pad and a ground pad on the upper surface of the FPCB, forming a second signal pad on the lower surface of the FPCB, The first signal pad and the second signal pad are electrically connected to each other through the first signal pad and the piezoelectric element wrapped according to a predetermined thickness is formed on the upper surface of the first signal pad, The first pad, the second pad, the ground pad, the FPCB, the second signal pad, the back layer, and the matching layer may be cut along the laminating direction so as to be less than a critical size for the IVUS. However, the back layer and the matching layer may not be laminated depending on the performance condition.

The supporter 30 is positioned between one side wall of the tube 20 and the ultrasonic transducer 101 to form an opposing angle of the ultrasonic transducer 101, And adjusts the angle so that the angle is different from the insertion direction of the tube 20. That is, the supporter 30 may be fixed to the tube 20 and may be implemented as a kind of pad for adjusting the angle of the ultrasonic transducer 101.

The opposing angle of the ultrasonic transducer 101 by the support 30 is determined between 0 and 90 degrees from the insertion direction of the tube 20, It is possible to simultaneously acquire ultrasound images of the wall surface of the blood vessel into which the tube 20 is inserted. The ultrasound transducer structure according to the present embodiment has the advantage that the ultrasound transducer structure can observe both the ultrasound transducer structure and the blood vessel wall surface or the insertion direction of the ultrasound transducer. In addition, the ultrasound transducer structure according to the present embodiment may calculate the blood flow velocity by estimating the Doppler frequency through the support 30.

In addition, the distal end of the tube 20 provided with the ultrasonic transducer 101 is preferably formed with a diagonal cut surface in consideration of the ultrasonic radiation direction of the ultrasonic transducer.

Meanwhile, the embodiment of the present invention shown in FIG. 4 attempts to utilize the characteristics of a tube in manufacturing an ultrasonic transducer for beam focusing. The device used for the IVUS transducer has a limited size due to the width of the blood vessel. However, the depth direction of the blood vessel is not limited in size. Therefore, the size of the device can be made longer in the depth direction of the blood vessel. The ultrasonic transducer 101 is formed in a rectangular shape and the length of the short side of the ultrasonic transducer 101 is at least the diameter of the tube and the length of the long side of the ultrasonic transducer 101 is the length And a long side of the ultrasonic transducer 101 is inserted along the inner wall surface of the tube. Through this structure, the ultrasound transducer can enhance the resolution of the image through beam focusing.

FIGS. 5A and 5B are diagrams illustrating two methods for explaining a beam focusing method in the ultrasonic transducer structure of FIG. 4 according to another embodiment of the present invention.

The shape of a device used in a typical intravascular transducer is elliptical or square. That is, since the device is a very small-sized device, natural focusing occurs. The beam focusing using the natural focusing point has a weak point that the user can not focus on the desired spot. Therefore, the method proposed in FIGS. 5A and 5B is to make the shape of the device rectangular. As described above, since the diameter of the blood vessel is limited, the size of the device can be made large in the depth direction of the blood vessel, so that the beam can be focused even in one direction.

In FIG. 5A, the ultrasound transducer 101 can beam-converge to the geometrical focus of the ultrasound transducer by forming a gradient such that the center plane is concave. For this purpose, it is possible to implement a method of forming a gradient by using iron balls with heat applied to a rectangular element (ultrasonic transducer).

5B, the ultrasound transducer 101 further includes a convex lens 17 attached to the front surface thereof, so that the ultrasound transducer 101 can converge the beam to the geometrical focus of the ultrasound transducer.

FIG. 6 is a perspective view illustrating a part of the blood vessel insertion type ultrasound transducer structure of FIG. 4 according to another embodiment of the present invention.

As described above, it is shown that the single-element ultrasonic transducer 101 is positioned at the distal end of the tube 20, and can be fixed and arranged so as to be inclined by the support 30. Through this structure, both the wall surface of the blood vessel into which the tube 20 is inserted and the advancing direction of the tube can be observed at the same time, and a freely adjustable support can be utilized as needed. Particularly, when such a gradient is utilized, not only the image can be acquired not only when the tube 20 is retracted but also when it is advanced (inserted), but also has an advantage that Doppler (blood flow velocity) measurement is possible.

FIG. 7 is an exemplary view illustrating a method of implementing a photoacoustic image and an optical coherence tomography (OCT) image in the vascular insertion type ultrasound transducer structure of FIG. 4 according to another embodiment of the present invention.

A photoacoustic (PA) image is obtained by applying a photon to an observation region in the human body, receiving ultrasound signals directly generated by the photons absorbed by the tissue, and extracting image information from the signals. This unique situation, where photons are absorbed into tissues and generates ultrasonic waves, is a phenomenon that occurs when tissue is heated when it absorbs photons. When a pulsed laser is used to illuminate an absorbent tissue structure, the temperature of the tissue changes, The structure expands. The pressure wave propagates out of the expanding structure, and this pressure wave can be detected by an ultrasonic transducer. Therefore, photoacoustic and ultrasonic waves can share their configuration in a certain part (detection / reception).

For this purpose, in the ultrasound transducer structure proposed in FIG. 7, the ultrasound transducer 101 is inserted into a part of the area 19 of the ultrasound transducer 101, and a light source module (Not shown). That is, a hole is formed inside the ultrasonic transducer 101, and a light source module is inserted inward, thereby acquiring a photoacoustic image together with the ultrasound image. In addition, such a light source module can be used as it is for acquiring optical coherence tomography images, and ultrasound and optical coherence tomography fusion images regarding vascular diseases can be obtained.

FIG. 8 is a view for explaining a signal supply and a grounding method in the vessel-inserted ultrasound transducer structure of FIG. 4 according to another embodiment of the present invention. In the ultrasound transducer structure proposed by the embodiments of the present invention, An electric signal is supplied to the second signal pad (not shown) of the ultrasonic transducer 101 of the element and the housing 50 is connected to the ground pad (not shown) of the ultrasonic transducer 101 of the single element, .

Referring to FIG. 8, a wire 40 is connected to a second signal pad using a conductive adhesive to supply a signal, and the ground is connected to the housing 50 and the ground pad by depositing chromium, gold, or the like . Of course, the configuration of FIG. 8 is only an embodiment, and the second signal pad may be connected to the wire by depositing chromium / gold by connecting it to the housing material. Also, wires may be used to connect with the housing material, or other materials other than chromium / gold may be deposited and connected.

According to the embodiments of the present invention described above, by proposing a process technology capable of simultaneously producing a plurality of individual single-element IVUS ultrasound transducers through cutting and deposition of various elements and stacking, it is possible to use no adhesive, it is possible to manufacture an ultrasonic transducer having a high operating frequency and a small aperture size and easy signal connection and grounding without using a conductive material for the matching layer and the backing layer, Beam focusing can be implemented.

The present invention has been described above with reference to various embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the disclosed embodiments should be considered in an illustrative rather than a restrictive sense. The scope of the present invention is defined by the appended claims rather than by the foregoing description, and all differences within the scope of equivalents thereof should be construed as being included in the present invention.

100: Ultrasonic transducer of laminated structure
101: Single-element ultrasonic transducer
10: FPCB
11: first signal pad 12: second signal pad
13: ground pad 14: piezoelectric element
15: via
17: lens 19: optical source module
20: blood vessel shunt tube
30: Support
40: wire
50: Housing

Claims (15)

A flexible printed circuit board (FPCB);
A first signal pad formed on the upper surface of the FPCB and a second signal pad formed on the lower surface of the FPCB;
A ground pad formed on the upper surface of the FPCB and spaced apart from the first signal pad; And
And a piezoelectric element lapping according to a predetermined thickness and formed on an upper surface of the first signal pad,
The first signal pad and the second signal pad are electrically connected through a via through the FPCB,
The element in which the piezoelectric element, the first signal pad, the ground pad, the FPCB, and the second signal pad are stacked is diced according to the stacking direction so as to be less than a critical size for IVUS (intravascular ultrasound) Ultrasonic transducer. The method according to claim 1,
A backing layer wrapped according to a predetermined thickness and formed on a lower surface of the second signal pad; And
And a matching layer formed on the upper surface of the piezoelectric element, the upper surface of the piezoelectric element being electrically connected to the ground pad,
Wherein the stacked elements are cut including the backside layer and the matching layer. 3. The method of claim 2,
Wherein the back layer and the matching layer are formed of a conductive material or a nonconductive material. The method according to claim 1,
And a conductive material is deposited on the upper surface of the FPCB to connect the piezoelectric element to the ground pad. 5. The method of claim 4,
Wherein the conductive material is chrome or gold. The method according to claim 1,
Wherein the FPCB is a polyimide. A tube for insertion of blood for IVUS;
A first signal pad, a ground pad spaced apart from the first signal pad, a second signal pad electrically connected to the first signal pad via a FPCB and a via hole penetrating the FPCB, A single-element ultrasonic transducer installed at a distal end of the tube to acquire an ultrasonic image; And
And a supporter which is positioned between one side wall of the tube and the ultrasonic transducer to form an opposite angle of the ultrasonic transducer so that the angle of ultrasonic emission of the ultrasonic transducer is different from the insertion direction of the tube, Structure. 8. The method of claim 7,
Wherein an opposing angle of the ultrasonic transducer by the supporter,
An ultrasonic image of the insertion direction of the tube and a wall surface of the blood vessel into which the tube is inserted is obtained at the same time or a Doppler frequency is estimated by determining the blood flow velocity Wherein the ultrasound transducer structure comprises a plurality of ultrasound transducer structures. 8. The method of claim 7,
The ultrasonic transducer is formed in a rectangular shape,
Wherein the length of the short side of the ultrasonic transducer is at least the diameter of the tube and the length of the long side of the ultrasonic transducer is not less than the diameter of the tube,
Wherein a long side of the ultrasonic transducer is inserted along the inner wall surface of the tube. 8. The method of claim 7,
Wherein the distal end of the tube provided with the ultrasonic transducer is formed with an oblique cut surface in consideration of the ultrasonic radiation direction of the ultrasonic transducer. 8. The method of claim 7,
Wherein the ultrasound transducer forms a gradient so that a center plane thereof is concave, thereby focusing the ultrasound transducer to the geometrical focus of the ultrasound transducer. 8. The method of claim 7,
Wherein the ultrasound transducer further includes a convex lens attached to the front surface thereof to beam-concentrate the ultrasound transducer to a geometrical focus of the ultrasound transducer. 8. The method of claim 7,
Wherein the ultrasound transducer further comprises a light source module inserted into a part of the ultrasound transducer to emit an optical signal for a photoacoustic image or an optical coherence tomography (OCT) image, Structure. 8. The method of claim 7,
Supplying an electrical signal to the second signal pad,
And a ground is connected to the ground pad by connecting a housing to the ground pad. 8. The method of claim 7,
The ultrasound transducer includes:
A first signal pad formed on the upper surface of the FPCB and a second signal pad formed on the lower surface of the FPCB;
A ground pad formed on the upper surface of the FPCB so as to be spaced apart from the first signal pad;
A piezoelectric element which is wrapped according to a preset thickness and is formed on an upper surface of the first signal pad;
A backside layer wrapped according to a predetermined thickness and formed on a lower surface of the second signal pad; And
And a matching layer formed on the upper surface of the piezoelectric element, the upper surface of the piezoelectric element being electrically connected to the ground pad,
The first signal pad and the second signal pad are electrically connected through a via through the FPCB,
The element in which the piezoelectric element, the first signal pad, the ground pad, the FPCB, the second signal pad, the back layer, and the matching layer are laminated is cut along the lamination direction so as to be equal to or smaller than the critical size for IVUS Characterized by an ultrasonic transducer structure.

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