KR101457857B1 - Wafer packing system and taping unit for the same - Google Patents

Abstract

Disclosed are a wafer packing system and a taping unit applied thereto which can prevent an error in labeling and enhance productivity. Such a wafer packing system includes a wafer information checking unit, a loading unit, a packing unit, a taping unit, a conveying unit, and a controlling unit. The wafer information checking unit opens a cover of a FOUP loaded on a load port to check an aligned state of wafers and wafer information. The loading unit includes a wafer box loading module for loading empty wafer boxes, a wafer box cover loading module for loading wafer box covers, and an interleaf loading module for loading interleaves. The packing unit packs the interleaves of the interleaf loading module and the empty wafer boxes in turns. The taping unit arranges the wafer box cover at the top of the wafer box in which the interleaves and the wafers are packed and stored in turns and tapes the boundary part between the wafer box and the wafer box cover. The conveying unit conveys the wafers, the interleaves, the wafer boxes and the wafer box covers. The controlling unit controls the wafer information checking unit, the loading unit, the packing unit, the taping unit, and the conveying unit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a wafer packing system and a taping unit applied thereto,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer packing system and a taping unit applied thereto, and more particularly to a wafer packing system for automatically packing processed wafers and a taping unit applied thereto.

BACKGROUND ART [0002] In most of today's electronic devices, a large number of semiconductor devices are used. These semiconductor elements are formed on a wafer, and after the wafers are separated and made into respective semiconductor chips, they are packaged and mounted on a substrate and used. The wafers on which the semiconductor devices are formed are alternately stacked and packaged in a wafer box (also referred to as a "jar ") and transferred to the next separation and packaging process.

Conventionally, these operations have been performed manually. That is, the worker takes out the wafers one by one from the wafer (F0UP), and manually loads the wafers according to the wafer information recorded in?. Accordingly, the alignment is not properly performed, and various problems have arisen.

To solve this problem, a device for automatically packing wafers has been developed. However, such an automatic packing apparatus developed up to now only carries out up to the packing process, and problems arise due to manual packaging and labeling.

That is, the wafers to be packed are not all the same, and all the different wafers are packed. For example, in each wafer, defects may be generated in a chip formed at a specific position, and the wafer is contained in the ID information including the positional information of defective chips. Accordingly, a label including information on each of the wafers is attached to the wafer box. The label is attached incorrectly due to a mistake of the operator, and a lot of problems are caused.

Therefore, a problem to be solved by the present invention is to provide a wafer packing system capable of solving the above-mentioned problems, which is not limited to wafer packing, is packed, packed, and automatically attached to a label, .

A wafer packing system according to an exemplary embodiment of the present invention for solving such problems includes a wafer information checking unit, a stacking unit, a packing unit, a taping unit, a transferring unit, and a control unit. The wafer information checking unit opens the cover of the wafer loaded in the load port to check wafer alignment and wafer information. The stacking unit includes a wafer box stacking module for stacking empty wafer boxes, a wafer box cover stacking module for stacking wafer box covers, and an interleaving stacking module for stacking sheets. The packing unit alternately packs the wafers of the intermittent stacking module and the wafers of the wafers into an empty wafer box. The taping unit places the wafer box cover on the upper end of the stored wafer box, and tapes the boundary portion between the wafer box and the wafer box cover. The transfer unit transfers wafers, gills, wafer boxes and wafer box covers. The control unit controls the wafer information checking unit, the stacking unit, the packing unit, the taping unit, and the transferring unit.

On the other hand, the taping unit includes a label attaching module, and the control unit receives wafer information from the wafer information checking unit, and attaches a label including the received wafer information to the taping-completed wafer box The labeling module can be controlled.

The stacking unit may further include a sponge loading module for stacking a lower sponge disposed on a lower surface of the empty wafer box and an upper sponge disposed on a wafer upper surface of the wafer box loaded with the wafer.

Further, in operation, the control unit transfers the sponge of the sponge loading module to the wafer box transferred from the wafer box loading module, arranges the sponge, and alternates wafers of the wiper loading module The sponge loading module having a sponge disposed thereon, the wafer box cover of the wafer box cover loading module being coupled to the wafer box, and the transfer unit and the wafer box cover being tapered to tap the interface between the wafer box and the wafer box cover. The taping unit can be controlled.

For example, at least one of the wafer box loading module and the wafer box cover loading module may be formed of a plurality of at least two.

Meanwhile, the taping unit may include a tape supporting module, a turntable module, an attachment module, a turntable rotation module, and a tape cutting module. The tape support module supports the wound tape. The turntable module supports the wafer box to which the wafer box cover is coupled. The attachment module attaches one end of the tape of the tape supporting module to the boundary between the wafer box cover and the wafer box. The turntable rotation module rotates the turntable module and winds the tape at the boundary when one end of the tape is attached to the boundary between the wafer box cover and the wafer box by the attachment module. The tape cutting module cuts the tape.

For example, the tape cutting module may include a push bar, a compression plate, and a cutter. The push bar pushes against the adhesive surface of the tape. The front attachment plate includes a fixing plate and a driving plate which is driven toward the fixing plate to press the tape pushed by the push bar to adhere the tapes to each other. The cutter cuts the tape pressed by the compression plate.

In the cutting operation, the control unit elevates the pushbars disposed at the lower portion on the basis of the imaginary horizontal plane and arranges them at the same height as the tape, and pushes the tape between the fixed plate and the compression plate And moving the clamping plate toward the fixed plate to adhere the tape to detach the push bar from the tape and to control the operation of the tape cutting module so that the cutter cuts the tape.

For example, the push bar may include a vertical bar extending in the vertical direction, and a pair of contact bars projecting in the horizontal direction at the upper and lower ends of the vertical bar and pushing in contact with the adhesive surface of the tape.

At this time, the pair of contact bars may protrude so as to decrease in the horizontal direction width as they are further away from the vertical bar.

The distance between the pair of contact bars may be larger than the height of the driving plate.

Further, the push bar may be surface-treated such that a portion bonded to the adhesive surface of the tape is not bonded to the tape.

For example, the push bar may have roughness formed on the surface of the portion bonded to the adhesive surface of the tape, thereby reducing the contact area with the tape.

Meanwhile, the interleaved stacking module includes an air blower for blowing air from both sides of the stacked sheet to separate the sheets, and an ion blower for discharging the accumulated sheets in the sheet stack. .

For example, the ion blowers may be provided such that the pair of the ion blowers face each other and have different heights from each other.

In addition, the kanji loading module may further include a suction pipe for sucking the foreign substances generated from the kanji.

A taping unit according to an exemplary embodiment of the present invention is a taping unit for tapping a boundary between a wafer box and a wafer box cover which are stored in alternately packed and stored wafers and wafers, A turntable module, a turntable rotation module, and a tape cutting module. The tape support module supports the wound tape. The turntable module supports the wafer box to which the wafer box cover is coupled. The turntable rotation module rotates the turntable module to wind the tape to the boundary when one end of the tape of the tape supporting module is attached to the boundary between the wafer box cover and the wafer box. The tape cutting module cuts the tape.

At this time, in the tape cutting module, the tape cutting module may include a push bar, a compression plate, and a cutter. The push bar pushes against the adhesive surface of the tape. The front attachment plate includes a fixing plate and a driving plate which is driven toward the fixing plate to press the tape pushed by the push bar to adhere the tapes to each other. The cutter cuts the tape pressed by the compression plate.

The push bar disposed at the lower portion is raised and positioned at the same height as the tape with respect to a virtual horizontal plane during the cutting operation, the push bar pushes the tape between the fixed plate and the compression plate, The pressing plate is moved toward the fixed plate to adhere the tape, and the push bar is detached from the tape, and the cutter cuts the tape.

For example, the push bar may include a vertical bar extending in the vertical direction, and a pair of contact bars projecting in the horizontal direction at the upper and lower ends of the vertical bar and pushing in contact with the adhesive surface of the tape.

At this time, the pair of contact bars may protrude so as to decrease in the horizontal direction width as they are further away from the vertical bar.

The distance between the pair of contact bars may be larger than the height of the driving plate.

Further, the push bar can be surface-treated so that the portion of the push bar that touches the adhesive surface of the tape is not bonded to the tape.

For example, the push bar may have roughness formed on the surface of the portion of the push bar that comes in contact with the adhesive surface of the tape, thereby reducing the contact area with the tape.

According to the wafer packing system according to the exemplary embodiment of the present invention, the post-work of the wafer packing, that is, the taping and labeling of the wafer box is automatically performed, thereby preventing errors in labeling as well as improving productivity .

1 is a plan view showing a wafer packing system according to an exemplary embodiment of the present invention.
FIG. 2 is a perspective view showing the intermittently stacked module shown in FIG. 1. FIG.
3 is a perspective view showing the intermittent stacking module and the interposing transfer robot shown in FIG.
Fig. 4 is a perspective view showing a part of the taping unit shown in Fig. 1. Fig.
Figure 5 is a top view of the attachment module of Figure 4;
6 to 7 are schematic views for explaining the operation of the tape cutting module included in the taping unit shown in Fig.
8 is a perspective view showing a tape on which a grip portion is formed to facilitate separation of the tape from the wafer box.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings, It will be possible. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprising" or "having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is a plan view showing a wafer packing system according to an exemplary embodiment of the present invention.

1, a wafer packing system 1000 according to an exemplary embodiment of the present invention includes a wafer information checking unit 1100, a loading unit 1200, a packing unit 1300, a taping unit 1400, A transfer unit 1500 and a control unit 1600.

The wafer information checking unit opens the cover of the wafer (F) loaded in the load port (FOUP, F) to check the wafer alignment and wafer information. The wafer information may include various kinds of information of the wafer, for example, position information of a defective chip, a place where the wafer is to be transferred, and the like.

The stacking unit 1200 includes a wafer box stacking module 1210 for stacking empty wafer boxes, a wafer box cover stacking module 1220 for stacking wafer box covers, and an interleaving stacking module 1230 for stacking sheets do. The stacking unit 1200 may further include a sponge loading module 1240 for loading a lower sponge disposed on the lower surface of the empty wafer box and an upper sponge disposed on the upper surface of the wafer in the wafer box loaded with the wafer have. For example, a plurality of stacking modules of the stacking unit 1200 may be formed. When a plurality of stacking modules are formed as described above, the stacking operation can be performed redundantly in conjunction with the transferring units 1500, and productivity can be improved.

The arrangement of the wafer box stacking module 1210, the wafer box cover stacking module 1220, the interleaving stacking module 1230 and the sponge stacking module 1240 is not limited to the drawings, And the like.

The packing unit 1300 alternately packs the wafers of the intermittent stacking module 1230 and the wafers of the wafer F into an empty wafer box. The packing unit 1300 may include a robot arm 1510, for example.

The taping unit 1400 arranges the wafer box cover on the upper side of the stored wafer box, and tapes the boundary portion between the wafer box and the wafer box cover.

The transfer unit 1500 transfers wafers, gills, wafer boxes, and wafer box covers. That is, although the transfer unit 1500 may be packaged and occupied in the same space, when each unit is dispersedly disposed as in the present embodiment, the parts for transferring the wafer, the separator, the wafer box, Or may be spaced apart.

The control unit 1600 controls the wafer information checking unit 1100, the loading unit 1200, the packing unit 1300, the taping unit 1400, and the transfer unit 1500. For example, the control unit 1600 may be configured as a workstation, a PC, or the like.

The taping unit 1400 includes a label attach module 1450 and the control unit 1600 receives wafer information from the wafer information checking unit 1100 and includes received wafer information The labeling module 1450 can be controlled to attach the label to the taping completed wafer box.

For example, the label attaching module 1450 may include, for example, a bar code label attaching portion 1451 and a security label attaching portion 1452. [ The barcode label attaching unit 1451 attaches a barcode including wafer information, and attaches a security label to the security label attaching unit 1452 to confirm whether or not the tapped wafer box is opened.

The barcode label attaching portion 1451 includes a barcode label printer (not shown) and a barcode label applicator (not shown). A barcode label printer (not shown) prints a barcode containing received wafer information, and a barcode label applicator (not shown) adsorbs the barcode and attaches it to the tapered wafer box.

The security label attaching unit 1452 attaches a plurality of stored security labels to the tapped wafer box.

The specific operation of the wafer packing system 1000 will be described below. First, in the previous process? When the wafer is loaded on the load port LP of the wafer packing system 1000 by a transfer robot (not shown), the wafer alignment is checked by a notch alignment aligner (not shown) (1100) checks the wafer information.

The linear transfer robot 1530 also transfers the empty wafer box from the wafer box loading module 1210 to the first position P1 and places the sponge from the sponge loading module 1240 below the empty wafer box.

After the wafer box with the sponge disposed thereon is transferred from the first position P1 to the second position P2, the robot arm 1510 and the vacuum ejector 1521 transfer wafers and wafers to the wafer box Pack alternately.

At this time, the linear transfer robot 1530 transfers the wafer box loading module 1210 to the third position P3, places the sponge from the sponge loading module 1240 to the bottom of the empty wafer box, and waits.

When the packing operation of the wafer and the separator is completed at the second position P2, the wafer box packed with the wafer is again transported to the first position P1, and the sponge of the third position P3 is transported to the wafer box Is transferred to the fourth position P4, and the robot arm 1510 and the vacuum ejector 1521 alternately pack the wafers and the wafers into the wafer box.

On the other hand, the wafer loaded on the wafer box at the second position P2 is loaded with the wafer of the first load port LP1 and the wafer loaded at the wafer box of the fourth position P3 is loaded into the second load port LP2. Of the wafer W is loaded. Alternatively, the wafer loaded in the wafer box in the second position P2 is loaded with the wafer in the second load port LP2, and the wafer loaded in the wafer box in the fourth position P3 is loaded into the first load port LP1 May be loaded. However, the wafers of the first load port LP1 and the second load port LP2 are not mixed.

When the packing process is performed alternately, the packing time can be shortened and the productivity can be improved.

The sponge of the sponge loading module 1240 is placed on the wafer or the wafers of the wafer box in the wafer box that has been packed and transferred to the first position P1 or the third position P3 and is moved by the linear transfer robot 1530 After being transported to the fifth position P5, the wafer box cover of the wafer box cover loading module 1220 is placed on top of the wafer box. In this embodiment, the sponge is disposed at the first position P1 or the third position P3 and then transferred to the fifth position P5, but otherwise is transferred to the fifth position P5, A box cover may be disposed.

At the fifth position P5, the wafer box to which the wafer box cover is coupled is transferred to the taping unit 1400 to complete taping and labeling. More specifically, the wafer box at the fifth position P5 is transported to the sixth position P6 and a tape wound around the tape supporting module 1410 is attached by a tape attaching module (Figs. 5 and 1440), and the turntable module 1420 is rotated so that the tape is wound around the boundaries of the wafer box and the wafer box cover, the tape is cut by the tape cutting module 1430, the security label is attached by the security label attaching portion 1452, 7 position (P7), the bar code is attached by the bar code label attaching unit 1451 and unloaded.

These operations are performed under the control of the control unit 1600. [

FIG. 2 is a perspective view showing the intermittent loading module shown in FIG. 1, and FIG. 3 is a perspective view showing the intermittent loading module and the intermittent moving robot shown in FIG.

2 and 3, the kanji loading module 1230 includes an air blower 1231 for blowing air from both sides of the loaded kanji to separate the kanji, and charges accumulated in the kanji and an ion blower 1232 for discharging the ions.

When the air blower 1231 supplies air to separate the sheets of paper between the sheets stacked in the interleaf stacking module 1230, the ion blower 1232 continuously blows the air containing the ions, In the air. In addition, the ion blower 1232 can reduce the damage that can be caused by contacting the wafers with the wafers by supplying ions to the wafers, thereby removing the charges accumulated in the wafers by friction.

For example, the pair of air blowers 1231 are arranged so as to face each other, and the pair of ion blowers 1232 are arranged so as to face each other. At this time, it is preferable that a pair of the air blowers 1231 and a pair of the ion blowers 1232 are arranged in directions crossing each other.

Therefore, the air generated by the pair of air blowers 1231 and separated from each other collides with each other and escapes in the direction of the ion blower 1232. However, air containing ions is blown again by the ion blower 1232 , The ion blower (1232), so that they can float in the air.

Meanwhile, the ion blowers 1232 may have different heights. Therefore, it is possible to supply ions to all laminated sheets.

Meanwhile, the kanji loading module 1230 may further include a suction pipe 1233 for sucking the foreign substance generated from the kanji.

In general, the separators are made of a material that inhibits the formation of foreign matter (dust), but the foreign materials are not completely blocked. Particularly, air is blown by the air blower 1231 and the ion blower 1232, and the generation of such foreign matter becomes worse, so that the damage to the wafer can be caused by the foreign matter. In order to remove such foreign matter, the kanji loading module 1230 includes a suction pipe 1233 to suck and remove foreign matter.

At this time, it is preferable that the suction pipe 1233 is disposed on the upper side of the interleaf stacking module 1230 because the foreign substance is pushed upward by air blown.

Separated by the air blower 1231 and the ion blower 1232 and separated by the air blown into the air, the waste paper is sucked by the vacuum ejector 1521 and transferred by the separable transfer robot 1520, .

At this time, it is preferable that the vacuum ejector 1521 is provided with a plurality of vacuum suckers to suck at various points of the paper. If the size of the kanji is small, there is no problem in adsorption at one point in the center. However, if the kanji size is large, the kanji can be folded if it is adsorbed at only one point in the center. Therefore, it is preferable that the vacuum ejector 1521 is composed of three or more. In this embodiment, the vacuum ejector 1521 is composed of, for example, four vacuum ejectors.

Each of the vacuum ejectors 1521 is configured to move up and down. By this movement, it is possible to prevent two or more sheets from being adsorbed. More specifically, after the vacuum ejector 1521 has adsorbed the kanji of the kanji loading module 1230, the one side two vacuum ejectors 1521 and the other two vacuum ejectors 1521 reverse the upward and downward movement , It will shake the kanji, and if two kanji are overlapped, it is possible to drop the kanji below.

FIG. 4 is a perspective view showing a part of the taping unit shown in FIG. 1, and FIG. 5 is a plan view showing the attachment module of FIG.

Referring to Figures 1, 4 and 5, the taping unit 1400 includes a tape support module 1410, a turntable module 1420, an attachment module 1440, a turntable rotation module (not shown) Module 1430. < / RTI >

The tape support module 1420 supports the wound tape.

The turntable module 1420 supports the wafer box WB to which the wafer box cover is coupled.

The attachment module 1440 attaches one end of the tape of the tape supporting module 1420 to the boundary between the wafer box cover and the wafer box WB. At the end of the attachment module 1440, a roller 1442 is formed. The roller 1442 can rotate more easily when the wafer box WB arranged on the turn table is rotated by the table rotation module. 5, the attachment module 1440 includes a cylinder 1441 and applies a suitable pressure through the cylinder 1441 so that the roller 1442 is pressed against the wafer box WB, It is possible to maintain contact with the side surface of the wafer box WB even in the case of the octagonal wafer box WB which is not circular.

The turntable rotation module (not shown) is disposed under the turntable module 1420 to rotate the turntable module 1450. More specifically, the turntable rotation module rotates the turntable module when the one end of the tape is attached to the boundary between the wafer box cover and the wafer box WB by the attachment module 1440, .

Then, the tape cutting module 1430 cuts the tape.

For example, the tape cutting module 1430 may include a push bar 1431, a compression plate 1432, and a cutter (not shown).

The push bar 1431 pushes against the adhesive surface of the tape. For example, the push bar 1431 includes a vertical bar 1431a extending in the vertical direction and a pair of vertical bars 1431a protruding in the horizontal direction from the upper and lower ends of the vertical bar 1431a in contact with the adhesive surface of the tape Contact bar 1431b.

At this time, the pair of contact bars 1431b may protrude so as to decrease in the horizontal direction width as they are further away from the vertical bar. In other words, the end of the contact bar 1431b is sharpened so that it can be folded more easily when the tape is folded, and this folded tape makes it easier to remove the tape when removing the bonded tape .

Further, the push bar 1431 can be surface-treated so that the portion of the push bar 1431 that comes into contact with the adhesive surface of the tape is not bonded to the tape. For example, in the push bar 1431, roughness is formed on the surface of the portion of the push bar 1431 which abuts on the adhered surface of the tape, so that the contact area with the tape can be reduced. More specifically, the surface treatment or roughness formation may be formed over the entire push bar 1431, but may be formed only on the pair of contact bars 1431b.

The front attachment plate 1432 includes a fixed plate 1432a and a driving plate 1432b driven toward the fixed plate 1432a to press the tape pushed by the push bar 1431 to adhere the tapes to each other do.

Meanwhile, the distance between the pair of contact bars 1431b may be larger than the height of the driving plate 1432b. In this way, when the distance between the pair of contact bars 1431b is formed to be larger than the height of the drive plate 1432b, the pair of contact bars 1431b can be more easily separated from the tape. The detailed description will be described in more detail with reference to FIG. 6 and FIG.

The cutter (not shown) cuts the tape squeezed by the squeeze plate 1432.

In the cutting operation, the control unit (1600 in Fig. 1) raises the push bar 1431 disposed at the lower side with respect to the imaginary horizontal plane, arranges the push bar 1431 at the same height as the tape, Pushes the tape between the fixing plate 1432a and the pressing plate 1432b and moves the pressing plate 1432b toward the fixing plate 1432a to adhere the tape to the push plate 1431 ) From the tape, and control the operation of the tape cutting module such that the cutter (not shown) cuts the tape.

6 and 7, the operation of the tape cutting module will be described in more detail.

6 to 7 are schematic views for explaining the operation of the tape cutting module included in the taping unit shown in Fig.

6, in the cutting operation, first, the push bar 1431 at the lower side is transported to the upper portion along the direction A, and is disposed at the same height as the tape T. Thereafter, the push bar 1431 is transferred along the direction B between the fixed plate 1432a and the drive plate 1432b to push the tape T in.

Thereafter, the driving plate 1432b is transferred in the C direction so as to be in close contact with the fixing plate 1432a, thereby adhering the tape T. At this time, the protruding bar 14320 may be attached to the driving plate 1432b to further increase the pressure applied to the fixing plate 1432a. Alternatively, the protruding bar 14320 may be formed on the fixing plate 1432a.

7, the push bar 1431 is moved in the direction D in the state in which the drive plate 1432b is in contact with the stationary plate 1432a and separated from the tape, 6, the drive plate 1432b is moved in a direction opposite to C, that is, away from the fixing plate 1432a. Then, when the tape is cut using the cutter, The tape is formed with the grip portion GR as shown in Fig. 8, so that the tape of the wafer box can be more easily removed.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1000: Wafer packing system 1100: Wafer information checking unit
1200: Loading unit 1210: Wafer box loading module
1220: Wafer box cover loading module 1230: Kanji loading module
1231: Air blower 1232: Ion blower
1233: Suction pipe 1240: Sponge loading module
1300: Packing unit 1441: Roller
1400: taping unit 1410: tape supporting module
1420: Turntable module 1430: Tape shear module
1431: Push bar 1431a: Vertical bar
1431b: contact bar 1432:
1432a: Fixing plate 1432b: Driving plate
1440: attachment module 1441: cylinder
1450: label attaching module 1451: bar code label attaching part
1452: security label attaching part 1500: transfer unit
1510: Robot arm 1520: Manual transfer robot
1521: Vacuum ejector 1530: Linear transfer robot
1600: control unit WB: wafer box
T: Tape

Claims (24)

A wafer information checking unit that opens the cover of the wafer loaded in the load port to check the wafer alignment and wafer information;
A stacking unit including a wafer box stacking module for stacking empty wafer boxes, a wafer box cover stacking module for stacking the wafer box covers, and an interleaving stacking module for stacking sheets;
A packing unit for alternately packing the wafers of the intermittent stacking module and the wafers of the wafers into an empty wafer box;
A taping unit for placing the wafer box cover on an upper end of a wafer box where the lancet and the wafer are packed alternately and taping the boundary between the wafer box and the wafer box cover;
A transfer unit for transferring the wafer, the kanji, the wafer box, and the wafer box cover; And
And a control unit for controlling the wafer information checking unit, the stacking unit, the packing unit, the taping unit, and the transferring unit,
The taping unit comprises:
A tape support module for supporting the wound tape;
A turntable module for supporting the wafer box to which the wafer box cover is coupled;
An attaching module for attaching one end of the tape of the tape supporting module to a boundary of the wafer box cover and the wafer box;
A turntable rotation module that rotates the turntable module and winds the tape at the boundary when the tape is attached to one end of the wafer box cover and the wafer box by the attaching module; And
A tape cutting module for cutting the tape;
Wherein the wafer packing system comprises:
The method according to claim 1,
Wherein the taping unit further comprises a label attaching module,
Wherein the control unit controls the labeling module to receive the wafer information from the wafer information checking unit and to attach a label containing the received wafer information to the wafer box with the taping completed.
The method according to claim 1,
The stacking unit includes:
A sponge loading module for loading a lower sponge disposed on a lower surface of an empty wafer box and an upper sponge disposed on an upper surface of a wafer of a wafer box loaded with wafers;
≪ / RTI >
The method of claim 3,
In operation,
Transferring the lower sponge of the sponge loading module to the wafer box transferred from the wafer box loading module, placing the sponge,
The wafers of the wafers are stacked alternately,
Placing a sponge of the sponge loading module thereon,
The wafer box cover of the wafer box cover loading module is coupled to the wafer box,
And to tap the boundary portion between the wafer box and the wafer box cover,
And controls the transfer unit and the taping unit.
The method according to claim 1,
Wherein at least one of the wafer box loading module and the wafer box cover loading module is formed of a plurality of at least two.
delete The method according to claim 1,
Wherein the tape cutting module comprises:
A push bar (PUSH BAR) pushing in contact with the adhesive surface of the tape;
A compression plate including a fixed plate and a drive plate which is driven toward the fixed plate to press the tape pushed by the push bar to adhere the tapes to each other; And
A cutter for cutting the tape pressed by the compression plate;
Wherein the wafer packing system comprises:
8. The method of claim 7,
In the cutting operation,
The push bars disposed at the lower portion are raised to be at the same height as the tape with reference to a virtual horizontal plane,
Pushing the tape between the fixed plate and the compression plate using the push bar,
The pressing plate is moved toward the fixed plate to adhere the tape,
Releasing the push bar from the tape,
And the operation of the tape cutting module is controlled so that the cutter cuts the tape.
8. The method of claim 7,
The push-
A vertical bar extending in a vertical direction; And
A pair of contact bars protruding in the horizontal direction at the upper and lower ends of the vertical bars to push and come in contact with the adhesive surface of the tape;
Wherein the wafer packing system comprises:
10. The method of claim 9,
The pair of contact bars may include:
And a width in the horizontal direction decreases as the distance from the vertical bar increases.
10. The method of claim 9,
Wherein a distance between said pair of contact bars is greater than a height of said drive plate.
8. The method of claim 7,
The push-
Characterized in that the portion bonded to the adhesive surface of the tape is surface treated so as not to adhere to the tape.
13. The method of claim 12,
The push-
Wherein a roughness is formed on a surface of the portion to be adhered to the adhesive surface of the tape to reduce the contact area with the tape.
The method according to claim 1,
Wherein the interleaving module comprises:
An air blower for blowing air from both sides of the stacked sheets to separate sheets from each other; And
And an ion blower for discharging the accumulated charge in the separator.
15. The method of claim 14,
The ion blowers are installed so that the pair faces each other,
And the height of the wafer packing system is different from the height of the wafer packing system.
15. The method of claim 14,
Further comprising a suction pipe for sucking the foreign substance generated from the separator.
1. A taping unit for tapping a boundary between a stored wafer box packed with a separator and a wafer and a wafer box cover coupled to an upper end of the wafer box,
The taping unit
A tape support module for supporting the wound tape;
A turntable module for supporting the wafer box to which the wafer box cover is coupled;
A turntable rotation module that rotates the turntable module and winds the tape at the boundary when one end of the tape of the tape supporting module is attached to the boundary between the wafer box cover and the wafer box; And
A tape cutting module for cutting the tape;
≪ / RTI >
18. The method of claim 17,
Wherein the tape cutting module comprises:
A push bar (PUSH BAR) pushing in contact with the adhesive surface of the tape;
A compression plate including a fixed plate and a drive plate which is driven toward the fixed plate to press the tape pushed by the push bar to adhere the tapes to each other; And
A cutter for cutting the tape pressed by the compression plate;
Wherein the taping unit comprises:
19. The method of claim 18,
With the virtual horizontal plane as a reference, the push bars disposed at the lower portion are raised and arranged at the same height as the tape,
The push bar pushes the tape between the fixed plate and the compression plate,
Wherein the compression plate is moved toward the fixed plate to adhere the tape,
Wherein the push bar is detached from the tape,
And the cutter cuts the tape.
19. The method of claim 18,
The push-
A vertical bar extending in a vertical direction; And
A pair of contact bars protruding in the horizontal direction at the upper and lower ends of the vertical bars to push and come in contact with the adhesive surface of the tape;
Wherein the taping unit comprises:
21. The method of claim 20,
The pair of contact bars may include:
And a width in the horizontal direction decreases as the distance from the vertical bar increases.
21. The method of claim 20,
Wherein the spacing distance between the pair of contact bars is greater than the height of the drive plate.
19. The method of claim 18,
The push-
Wherein a portion of the tape contacting the adhesive surface is surface-treated so as not to adhere to the tape.
24. The method of claim 23,
The push-
Wherein a roughness is formed on a surface of a portion contacting the adhesive surface of the tape to reduce the contact area with the tape.

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