KR101453027B1 - Fingerprint sensor module, portable electronic device having the same, and manufacturing method therof - Google Patents

Abstract

According to an embodiment of the present invention, there is provided a fingerprint sensor comprising: a bracket; a fingerprint sensor located on the upper side of the bracket, the fingerprint sensor having a sensing unit formed on a flexible substrate and a sensor circuit unit electrically connected to the sensing unit; A fingerprint sensor module including a bezel and a fingerprint sensor disposed on an upper side of the fingerprint sensor, wherein the sensing unit is disposed on an upper surface of the flexible substrate and includes a driving electrode and an image receiving electrode formed of conductive lines, Wherein the circuit part is disposed on a lower surface of the flexible substrate, and the post-processing layer is formed of a thin film using paint.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a fingerprint sensor module, a portable electronic device including the same,

The present invention relates to a fingerprint sensor module, a portable electronic device including the same, and a method of manufacturing the same.

Background Art [0002] A fingerprint sensor is a sensor for detecting fingerprints of a human being and is widely used as a means for enhancing security in portable electronic devices such as a mobile terminal and a tablet PC. That is, the user is registered and authenticated through the fingerprint sensor, thereby protecting the data stored in the portable electronic device and preventing the security accident in advance.

On the other hand, in a portable electronic device, a navigation function for performing operation of a pointer such as a cursor is integrated into a fingerprint sensor. Such a fingerprint sensor is referred to as a biometric track pad (BTP). In addition, a switching function that receives information from a user may be incorporated into the fingerprint sensor.

Such a fingerprint sensor is manufactured as an integrated module of a fingerprint sensor, an IC, and a bezel, and is mounted on an electronic device. Recently, a fingerprint sensor module designed by COF (Chip-On-Flex) method has been developed in order to manufacture a fingerprint sensor module flexibly but at a low cost. In this fingerprint sensor module, the fingerprint detection IC is separated from the sensing area.

In manufacturing the fingerprint sensor module, all or a part of the sensing area of the fingerprint sensor is exposed to the outside of the product. Such an exposure area is subjected to processing steps such as printing, post-processing, and glass adhesion. Therefore, in manufacturing the fingerprint sensor module, if the effective sensing height required by the sensor, that is, the distance between the fingerprint recognition portion and the fingerprint is small, or the glass can not be used due to the characteristics of the final product, need.

That is, the fingerprint sensor module has a problem in that the thickness from the sensing area of the fingerprint sensor to the final cover contacting the user's finger does not affect the function of the electronic device, and there is no problem with the appearance and reliability of the electronic device. A portable electronic device and a manufacturing method thereof are required.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a fingerprint sensor module which efficiently manufactures a top surface of a fingerprint sensor module, And a method of manufacturing the same.

According to an aspect of the present invention, there is provided a fingerprint sensor comprising: a bracket; a fingerprint sensor positioned on the bracket, the fingerprint sensor having a sensing unit formed on a flexible substrate and a sensor circuit unit electrically connected to the sensing unit; A fingerprint sensor module including a bezel positioned on a side of the fingerprint sensor, a bezel and a post-processing layer positioned on the fingerprint sensor, wherein the sensing unit comprises a driving electrode composed of conductor lines and an image receiving electrode, Wherein the sensor circuit portion is located on a lower surface of the flexible substrate, and the post-processing layer is formed of a thin film using a paint.

In an embodiment of the present invention, the thin film layer is positioned on the top surface of the bezel and the fingerprint sensor, and the post-processing layer may be positioned on the top surface of the thin film layer.

In one embodiment of the present invention, the thin film layer may be formed of the same material as the bezel.

In one embodiment of the present invention, the sensing unit includes an image receiving electrode and a plurality of driving electrodes positioned on the upper surface of the flexible substrate, the image receiving electrode is electrically connected to the sensor circuit unit, One end of the electrode may be spaced apart from the image receiving electrode by a predetermined distance and the other end of the plurality of driving electrodes may be electrically connected to the sensor circuit unit.

In an embodiment of the present invention, the bezel may be formed to support a flexible portion of the fingerprint sensor.

In one embodiment of the present invention, the bracket and the bezel may be integrally formed.

In one embodiment of the present invention, the thickness of the post-processing layer may be 0.04 mm or more and 0.06 mm or less.

According to another aspect of the present invention, there is provided a portable electronic device having the fingerprint sensor module.

According to another aspect of the present invention, there is provided a method of manufacturing a bracket, comprising the steps of: a) mounting a fingerprint sensor having a sensing unit and a sensor circuit unit on a bracket; b) Applying a curing agent on the fingerprint sensor and the bracket using a molding frame, c) curing the curing agent to form a thin layer on the bezel and the fingerprint sensor on the bracket, d) Wherein the sensing unit is disposed on the upper surface of the flexible substrate and includes a driving electrode formed of a conductive line and an image receiving electrode, and the sensor circuit unit is disposed on the upper surface of the flexible substrate, And is electrically connected to the sensing unit on the lower surface of the substrate, and the post-processing layer is formed of a thin film using paint And the fingerprint sensor module is mounted on the fingerprint sensor module.

In one embodiment of the present invention, the curing agent applying step (step b) includes injecting a hardening agent into the inner surface of the molding frame in advance, and then moving the molding frame toward the bracket and the fingerprint sensor, And then applying a curing agent onto the substrate.

In one embodiment of the present invention, the curing agent applying step (step b) includes moving the molding frame toward the bracket and the fingerprint sensor, injecting a hardener between the molding frame and the bracket and the fingerprint sensor, And applying a curing agent on the sensor and the bracket.

In one embodiment of the present invention, the step of forming the post-treatment layer (step d) may be performed using at least one of a printing process, a color spray process, a primer process, and an ultraviolet coating process.

In one embodiment of the present invention, the thickness of the post-processing layer may be 0.04 mm or more and 0.06 mm or less.

In one embodiment of the present invention, the curing agent may be an epoxy resin or a putty.

According to an embodiment of the present invention, a fingerprint sensor module, a portable electronic device including the fingerprint sensor module, and a method of manufacturing the same can be provided, while improving the top surface characteristics of the fingerprint sensor module while modularizing the fingerprint sensor, the bracket and the bezel.

In particular, a fingerprint sensor module capable of stably supporting a fingerprint sensor designed in a COF system, a portable electronic device including the fingerprint sensor module, and a method of manufacturing the fingerprint sensor module can be provided.

According to an embodiment of the present invention, there is provided a fingerprint sensor module, a portable electronic device including the fingerprint sensor module, and a method of manufacturing the same, wherein the top surface of the fingerprint sensor module is efficiently manufactured while the external appearance, function, and reliability of the electronic device are not problematic can do.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a perspective view of a fingerprint sensor module according to an embodiment of the present invention.
FIG. 2 is a schematic view illustrating a manufacturing process of the fingerprint sensor module of FIG. 1; FIG.
FIG. 3 is a schematic configuration diagram of a fingerprint sensor provided in the fingerprint sensor module of FIG. 1;
4 is a diagram schematically showing the operation of the fingerprint sensor of FIG.
5 is a cross-sectional view illustrating a fingerprint sensor module according to an exemplary embodiment of the present invention.
6 to 10 are schematic cross-sectional views illustrating a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a fingerprint sensor module according to an embodiment of the present invention. As shown, the fingerprint sensor module 10 includes a fingerprint sensor 200 and a post-processing layer 500. These constituent elements represent the main features of the present invention, and details thereof will be described later.

FIG. 2 is a schematic view illustrating a manufacturing process of the fingerprint sensor module. 2, the bezel 300 is formed on a side surface of the fingerprint sensor 200 (see FIG. 2 (a)), and then the fingerprint sensor 200 is mounted on the bracket 100 b)). 2 (c)), the post-processing layer 500 is formed (refer to FIG. 2 (d)). Then, the post-processing is performed on the upper surface of the bezel 300 and the fingerprint sensor 200 (see FIG. The details of each of these steps will be described later.

FIG. 3 is a schematic configuration diagram of a fingerprint sensor, and FIG. 4 is a view schematically showing the operation of a fingerprint sensor.

3, the fingerprint sensor 200 includes a sensing unit 210 provided on an upper surface of a substrate 201 and a sensor circuit unit 220 provided on a lower surface of the substrate 201. [ 3 (a) shows the upper surface of the substrate 201, and FIG. 3 (b) shows the lower surface of the substrate 201. FIG. 3 (c) 220 of the first embodiment of the present invention.

The substrate 201 may be a flexible substrate, and may be formed of, for example, a polymide film, but is not limited thereto.

The sensing unit 210 includes a plurality of driving electrodes 211 and an image receiving electrode 212 formed on a substrate 201. The driving electrode 211 and the image receiving electrode 212 may be formed of conductor lines.

The driving electrode 211 receives the driving signal from the sensor circuit unit 220 and transmits a signal to the image receiving electrode 212 side. The image receiving electrode 212 receives a signal transmitted from the driving electrode 211 via the user (more precisely, the user's finger).

One end of the image receiving electrode 212 located on the upper surface of the substrate 201 is formed to extend in the horizontal direction. A plurality of driving electrodes 211 are formed so as to extend in parallel to each other so as to be perpendicular to the extending direction of the image receiving electrode 212 (see Fig. 3 (a)). The image receiving electrode 212 is electrically connected to the sensor circuit unit 220 on the lower surface of the substrate 201.

One end of the plurality of driving electrodes 211 is spaced apart from the image receiving electrode 212 by a predetermined distance. The other end of the plurality of driving electrodes 211 is electrically connected to the sensor circuit unit 220 on the lower surface of the substrate 201.

4, the driving electrode 211 and the image receiving electrode 212 are spaced apart from each other, and the driving signal transmitted from the driving electrode 211 is received by the image receiving electrode 212 through the user U, do. At this time, it is possible to recognize the fingerprint by measuring the change in the electric field according to the presence or absence of the fingerprint bone or fingerprints located on the finger of the user U as a signal.

Although only nine drive electrodes 211 are shown in the accompanying drawings, this is an example, and 200 drive electrodes, for example, may be provided. Divided signal is supplied to the plurality of driving electrodes 211, the signal is sequentially received from the image receiving electrode 212, and the fingerprint information of one line is received. When the user slides the finger on the fingerprint sensor 200, the entire fingerprint image is obtained by stacking the fingerprint information described above.

3 (b) and 3 (c), the sensor circuit unit 220 may have an external interface connection unit 221 electrically connected to the outside. The external interface connection unit 221 may be, for example, a USB (Universal Serial Bus) or SPI (Serial Peripheral Interface) connection unit.

As described above, the fingerprint sensor 200 can be implemented by a COF (Chip-On-Flex) method. In particular, only the sensing unit 210, that is, the driving electrode 211 and the image receiving electrode 212 are formed on the upper surface of the substrate 201, and the sensor circuit unit 220 connected to the sensing unit 210 is formed on the lower surface of the substrate 201 ), It is possible to make the overall contour compact. In addition, it is easier to provide the glass on the fingerprint sensor module by not providing the sensor circuit portion on the upper surface of the substrate 201, which is a particularly useful effect in a portable electronic device such as a smart phone. In addition, unlike the prior art, the fingerprint sensor 200 is implemented on a flexible substrate, but does not necessarily require a metal bezel for a driving electrode, thereby contributing to softening of a fingerprint sensor module and further electronic equipment. .

Next, on the upper side of the fingerprint sensor 200, a post-processing layer 500 made of a thin film is formed (see FIGS. 1 and 2). Details thereof will be described later.

Hereinafter, a fingerprint sensor module and a manufacturing method thereof according to an embodiment of the present invention will be described in detail. 5 is a cross-sectional view illustrating a fingerprint sensor module according to an exemplary embodiment of the present invention.

As shown, the fingerprint sensor module 10 includes a bracket 100, a fingerprint sensor 200, a bezel 300, a thin film layer 400, and a post-processing layer 500.

The fingerprint sensor module 10 may be provided in an electronic device, particularly a portable electronic device. Here, the portable electronic device includes a portable phone, a smart phone, a PDA, a tablet PC, a notebook computer, a portable sound recorder (MP3 player), and the like.

The bracket 100 is a member for fixing the fingerprint sensor 200 and determines the overall shape of the fingerprint sensor module 10. [ When the fingerprint sensor module 10 is used in a flexible substrate or a flexible display, the bracket 100 is preferably formed of a flexible material. Meanwhile, a through hole (not shown) for injecting a hardening agent may be formed in the bracket 100.

The fingerprint sensor 200 is a member having a fingerprint detection function and is positioned on the upper side of the bracket 100. Since the schematic configuration of the fingerprint sensor 200 has been described above, the function thereof will be described here.

The fingerprint sensor 200 basically has a fingerprint detection function. Meanwhile, the fingerprint sensor 200 may be a biometric trackpad (BTP) having a fingerprint detection function and a pointer operation function at the same time. That is, the fingerprint sensor 200 may include a pointer manipulation function for detecting an input signal or static electricity according to whether or not a user's finger, which is a subject, is moving or moving, and moving a pointer such as a cursor based on the movement.

In addition, the fingerprint sensor 200 may include an input function for receiving information or commands desired by the user. For example, the fingerprint sensor 200 may be integrally or separately provided with a dome switch used for selecting a menu or an icon that is pointed to.

The fingerprint sensor 200 basically has a fingerprint detection function. To this end, the fingerprint sensor 200 may store information on the characteristic points of the fingerprint (for example, a portion where the fingerprint is divided, such as the 'Y' point), and compare the characteristic points to detect whether the fingerprint matches have. In this case, the time taken to detect the fingerprint can be shortened, and the miniaturization can be achieved through simplification of the processor, so that the mountability to the electronic apparatus can be improved.

The bezel 300 is positioned on the side surface of the fingerprint sensor 200 and forms the edge of the fingerprint sensor 200. Therefore, the user can recognize the area where the fingerprint sensor module 10 is located in the portable electronic device through the bezel 300. [ The bezel 300 may be formed to cover all or a part of the edges of the fingerprint sensor 200. The bezel 300 is generally made of resin or rubber, but is not particularly limited thereto.

The bezel 300 may be formed to be integrated with the bracket 100. For example, the bezel 300 and the bracket 100 may be formed simultaneously by injection molding. Here, the bezel 300 may be formed to support a flexible portion of the fingerprint sensor 200. The bezel 300 may serve as a support for fixing the substrate 201 so as to prevent the flexible substrate 201 from swinging due to a step generated by the sensor circuit unit 220.

The thin film layer 400 is formed on the upper surface of the fingerprint sensor 200 and the bezel 300 and the post-processing layer 500 is formed on the upper surface of the thin film layer 400. The post-processing layer 500 is formed of a thin film using a paint, that is, a coating film. That is, the post-processing layer 500 simultaneously performs the protective coating function and the color implementation function of the fingerprint sensor 200.

By forming the thin film layer 400 between the fingerprint sensor 200 and the post-processing layer 500 as described above, as compared with the case where the post-processing layer 500 is formed directly on the sensing area of the fingerprint sensor 200, As well as a variety of designs can be achieved. However, the thin film layer 400 may be omitted.

In order to enable appropriate fingerprint sensing, the total thickness of the thin film layer 400 and the post-processing layer 500 is preferably 0.1 mm or less. For this, the thickness of the post-processing layer 500 is preferably 0.04 to 0.06 mm. When the total thickness of the thin film layer 400 and the post-processing layer 500 is more than 0.1 mm, there is a danger that the effective sensing may not be performed when detecting the fingerprint.

The thin film layer 400 may be formed of the same material as the bezel 300. That is, the bezel 300 and the thin film layer 400 may be formed of a single component.

Also, the bracket 100, the fingerprint sensor 200, and the bezel 300 may be integrally formed. This means that the bracket 100, the fingerprint sensor 200, and the bezel 300 are connected to each other so strongly that it is difficult to separate them from each other even if they are not a single component or component. The bracket 100, the fingerprint sensor 200, and the bezel 300 may be fixed to the bezel 300 when the non-hardened resin material is injected around the bracket 100 and the fingerprint sensor 200, It can be seen that they are formed to be integrated with each other.

Next, a method of manufacturing a fingerprint sensor module according to an embodiment of the present invention will be described with reference to the drawings. 6 to 10 are schematic cross-sectional views illustrating a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention.

First, the fingerprint sensor 200 is mounted on the bracket 100 as shown in FIG. Here, the fingerprint sensor 200 may be attached by, for example, attaching an adhesive tape (not shown) on the bracket 100 and attaching the fingerprint sensor 200 on the adhesive tape.

The fingerprint sensor 200 may have a sensing unit 210 and a sensor circuit unit 220 (see FIG. 3). The sensor unit 220 is located on the lower surface of the substrate 201 and is electrically connected to the sensing unit 210. The sensor circuit unit 220 is electrically connected to the sensing unit 210, May have an external interface connection part 221.

After the fingerprint sensor 200 is mounted on the bracket 100, the bracket 100 and the fingerprint sensor 200 are mounted using the molding frame 20 corresponding to the outer shape of the bracket 100 and the fingerprint sensor 200. [ The curing agent 30 is applied. The reason that the molding frame 20 corresponds to the outer shape of the bracket 100 and the fingerprint sensor 200 is that the shape of the inner side of the molding frame 20 is different from that of the bracket 100 And a shape similar to the outer shape of the fingerprint sensor 200.

Here, the curing agent 30 may be an epoxy resin or a putty.

The process of applying the curing agent 30 will be described in more detail as follows. First, as shown in Fig. 7, the hardener 30 is injected into the inner surface of the molding frame 20 in advance. Next, the molding frame 20 is moved toward the bracket 100 and the fingerprint sensor 200 so that the hardening agent 30 is evenly spread between the molding frame 20 and the bracket 100 and the fingerprint sensor 200 .

The reason why the molding frame 20 moves toward the bracket 100 and the fingerprint sensor 200 is that the bracket 100 and the fingerprint sensor 200 are positioned on the upper side The molding frame 20 may be moved downward in a state where the bracket 100 and the fingerprint sensor 200 are fixed or the molding frame 20 may be moved from the molding frame 20 to the bracket 100 and the fingerprint sensor 200. [ (200) are all moving close to each other.

It is also possible to apply the curing agent 30 in a different manner. 8, the molding frame 20 is moved toward the bracket 100 and the fingerprint sensor 200 to maintain a gap therebetween. Then, the mold frame 20 is inserted between the bracket 100 and the fingerprint sensor 200 The hardener 30 can be coated on the bracket 100 and the fingerprint sensor 200 by injecting the hardener 30. At this time, the hardening agent 30 can be injected through the through holes formed in the bracket 100.

After the curing agent 30 is applied onto the bracket 100 and the fingerprint sensor 200 by the above-described methods, the applied curing agent 30 is cured to form the bezel 300 on the bracket 100, Thereby forming a thin film layer 400 on the substrate 200 (see FIG. 9). It is also possible to form the thin film layer 400 to be extremely thin or not to form the thin film layer 400 by appropriately adjusting the distance between the bracket 100 and the fingerprint sensor 200 and the molding frame 20.

The bezel 300 is disposed on the side of the fingerprint sensor 200 on the bracket 100 to form the rim of the fingerprint sensor 200. The thin film layer 400 is disposed on the upper side of the fingerprint sensor 200, Thereby forming the base surface of the base 500.

By forming the bezel 300 and the thin film layer 400 in this manner, manufacturing reliability can be improved as compared with the conventional method using the injection technique or the like. In particular, it becomes possible to maintain the thickness of the thin film layer 400 appropriately.

In addition, by forming the bezel 300 and the thin film layer 400 at the same time, it is possible to reduce the number of process steps. In this case, the bezel 300 and the thin film layer 400 may be formed as a single piece, and the bezel 300 may be positioned on the side of the fingerprint sensor 200, the thin film layer 400 may be the bezel 300, And a portion located on the upper surface of the substrate 200.

Finally, as shown in FIG. 10, a post-processing layer 500 is formed on the thin film layer 400. The post-processing layer 500 performs various functions such as implementing colors on the fingerprint sensor module 10 or reinforcing the upper surface side strength of the fingerprint sensor module 10. [ Particularly, since the fingerprint sensor 200 includes the sensing unit 210 and the sensor circuit unit 220 located on the upper and lower surfaces of the flexible substrate, the above effect is more advantageous.

The post-processing layer 500 may be formed by, for example, a printing process, a color spray process, a primer process, or an ultraviolet (UV) coating process. Here, the total thickness of the thin film layer 400 and the post-processing layer 500 may be 0.1 mm or less, and the thickness of the post-processing layer 500 may be 0.04 mm or more and 0.06 mm or less. The details thereof are as described above.

As described above, by forming the thin film layer 400 first and forming the post-processing layer 500 thereon, the reliability of the product is higher than when the printing process or the coating process is carried out directly on the fingerprint sensor 200, It can be diversified, and durability can also be improved.

In addition, the height of the thin film layer 400 can be appropriately adjusted according to the request of the user or the seller, and the function of the fingerprint sensor module 10 can be performed normally by forming the post layer 500 on the thin film layer 400 have.

After the fingerprint sensor module 10 is manufactured, processes such as attaching a glass to the upper side of the fingerprint sensor module 10 or mounting it on an electronic device may be continued. The description thereof will be omitted because it is beyond the scope of the present invention.

INDUSTRIAL APPLICABILITY As described above, according to the embodiments of the present invention, it is possible to provide a fingerprint sensor module, a portable electronic device including the fingerprint sensor module, and a portable electronic device including the fingerprint sensor module, And a manufacturing method thereof can be provided.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

10: Fingerprint sensor module
20: Molding frame
30: Hardener
100: Bracket
200: fingerprint sensor
300: Bezel
400: thin film layer
500: Finish layer

Claims (14)

Bracket,
A fingerprint sensor positioned above the bracket and having a sensing unit formed on a flexible substrate and a sensor circuit unit electrically connected to the sensing unit;
A bezel disposed on a side surface of the fingerprint sensor,
A fingerprint sensor module including a bezel and a post-processing layer located on an upper side of the fingerprint sensor,
Wherein the sensing unit is formed on the upper surface of the flexible substrate and includes a driving electrode composed of conductive lines and an image receiving electrode, the sensor circuit unit is located on a lower surface of the flexible substrate,
Wherein the post-processing layer is formed of a thin film using paint.
The method according to claim 1,
Wherein the thin film layer is positioned on the top surface of the bezel and the fingerprint sensor, and the post-processing layer is positioned on the top surface of the thin film layer.
3. The method of claim 2,
Wherein the thin film layer is formed of the same material as the bezel.
The method according to claim 1,
Wherein the sensing unit comprises an image receiving electrode and a plurality of driving electrodes positioned on an upper surface of the flexible substrate, the image receiving electrode is electrically connected to the sensor circuit unit, and one end of the plurality of driving electrodes is connected to the image receiving electrode And the other end of the plurality of driving electrodes is electrically connected to the sensor circuit unit.
The method according to claim 1,
Wherein the bezel is configured to support a flexible portion of the fingerprint sensor.
The method according to claim 1,
Wherein the bracket and the bezel are integrally formed.
The method according to claim 1,
Wherein the thickness of the post-processing layer is 0.04 mm or more and 0.06 mm or less.
A portable electronic device having the fingerprint sensor module according to any one of claims 1 to 7.
a) mounting a fingerprint sensor having a sensing part and a sensor circuit part on a bracket;
b) applying a curing agent onto the fingerprint sensor and the bracket using a molding frame corresponding to the outer shape of the bracket and the fingerprint sensor,
c) curing the curing agent to form a bezel on the bracket and a thin film layer on the fingerprint sensor,
d) forming a post-processing layer on the bezel and the fingerprint sensor, the method comprising:
Wherein the sensing unit is formed on the upper surface of the flexible substrate and includes a driving electrode formed of a conductive line and an image receiving electrode, the sensor circuit unit being located on a lower surface of the flexible substrate and electrically connected to the sensing unit,
Wherein the post-processing layer is formed of a thin film using a paint.
10. The method of claim 9,
The step (b) of applying the curing agent is a step of applying a curing agent onto the fingerprint sensor and the bracket by injecting a hardening agent into the inner surface of the molding frame in advance and then moving the molding frame toward the bracket and the fingerprint sensor Wherein the fingerprint sensor module comprises:
10. The method of claim 9,
The step (b) of applying the curing agent may include applying the curing agent onto the fingerprint sensor and the bracket by moving the molding frame to the bracket and the fingerprint sensor, and injecting a hardener between the molding frame and the bracket and the fingerprint sensor Wherein the step of forming the fingerprint sensor module comprises the steps of:
10. The method of claim 9,
Wherein the step (d) of forming the post-treatment layer is performed using at least one of a printing process, a color spray process, a primer process, and an ultraviolet coating process.
10. The method of claim 9,
Wherein the thickness of the post-processing layer is 0.04 mm or more and 0.06 mm or less.
10. The method of claim 9,
Wherein the hardening agent is an epoxy resin or a putty.

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