KR101446343B1 - Organic Light Emitting Diode - Google Patents

Abstract

The present invention provides a semiconductor device comprising: a substrate; A display including a plurality of sub-pixels located on a substrate; A driver positioned on an outer substrate of the display unit; A plurality of wirings connected to the display unit and the driving unit to transmit a signal supplied from the outside; And an insulating film located on the substrate and covering a part of the plurality of wirings, wherein the insulating film includes a protrusion in a region where an outer boundary line of the insulating film among the plurality of wirings forms an acute angle with the wiring .

Organic electroluminescent device, insulating film, wiring

Description

[0001] The present invention relates to an organic electroluminescent device,

1A and 1B are schematic plan views of an organic electroluminescent device according to the present invention.

Figures 2A and 2B are enlarged views according to an embodiment of the "Z1" region of Figures 1A and 1B.

Figures 3a and 3b are enlarged views according to another embodiment of the "Z1" region of Figures 1a and 1b.

DESCRIPTION OF THE REFERENCE NUMERALS

110: Substrate 120: Subpixel

130: Display 140: Multiple wirings

150: insulating film 160:

165: exposed region 170: pad portion

The present invention relates to an organic electroluminescent device.

An organic electroluminescent device used in an organic electroluminescent display device is a self-luminous device in which a light emitting layer is formed between two electrodes located on a substrate.

In addition, the organic electroluminescent device has a top-emission type and a bottom-emission type according to a direction in which light is emitted, and a passive matrix type and an active matrix type (Active Matrix).

Such an organic electroluminescent device has formed a plurality of wirings on a substrate to supply an electric signal or a power supply to the anode and the cathode located above and below the subpixel including the organic light emitting layer.

A plurality of wirings formed on a substrate are protected by an insulating film or the like in order to prevent corrosion or the like, and a plurality of wirings are usually formed in a multilayered structure to cause a step when an insulating film is formed on the wirings.

The step difference often appears in a variety of areas such as a bent area of the wiring, a region where the thickness of the wiring varies, and an area where the film-like circuit board is located for connection with an external device.

The occurrence of such a step causes a problem that the insulating film located on the wiring is peeled off as well as a signal or a power source can not flow smoothly through the wiring so that the display quality of the organic electroluminescent device is deteriorated .

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems, and it is an object of the present invention to improve the display quality by preventing a peeling phenomenon in which an insulating film located on a wiring of an organic electroluminescent device is peeled off, .

According to an aspect of the present invention, A display including a plurality of sub-pixels located on a substrate; A driver positioned on an outer substrate of the display unit; A plurality of wirings connected to the display unit and the driving unit to transmit a signal supplied from the outside; And an insulating film located on the substrate and covering a part of the plurality of wirings, wherein the insulating film includes a protrusion in a region where an outer boundary line of the insulating film among the plurality of wirings forms an acute angle with the wiring .

The insulating film is formed by the same process as that of the insulating film located in the display portion, and may further include exposing an outer portion of the driving portion.

The projecting portion can cover a part of the wiring.

The protruding portion is located in a concave-convex form on the wiring, and the concave-convex form can have a straight or curved form.

The insulating film may have a height ranging from 0.3 탆 to 3.0 탆 from the substrate.

And a plurality of wirings connected to the pad unit, the driving unit, and the display unit to transmit signals supplied from the outside.

The plurality of subpixels may include one or more capacitors and transistors.

<Embodiment>

1A and 1B are schematic plan views of an organic electroluminescent device according to the present invention.

As shown in FIGS. 1A and 1B, an organic light emitting device according to an exemplary embodiment of the present invention includes a substrate 110 on which a plurality of subpixels 120 are arranged in a matrix.

Here, when the organic electroluminescent device is a passive matrix type, the organic light emitting layer is positioned between the anode and the cathode located on the substrate 110 in the subpixel 120 included in the display unit 130.

When the organic electroluminescent device is of the active matrix type, the subpixel 120 included in the display unit 130 is connected between the anode or the cathode connected to the source or drain of the driving transistor included in the transistor array located on the substrate 110 The organic light-emitting layer is located.

The subpixel 120 included in the display unit 130 may be defined as one unit pixel of the red, green, and blue subpixels 120R, 120G, and 120B.

In the drawing, one subpixel 120 is shown to include only red, green, and blue colors, but this is only one embodiment of the present invention. Subpixel 120 may further include emission colors such as white, Or may emit other colors (for example, orange, yellow, etc.).

For reference, the subpixel 120 includes at least an organic emission layer, and may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, and further includes a buffer layer, a blocking layer, It is also possible to control the flow of holes or electrons between the anode and the cathode.

For reference, the above-described transistor array includes one or more transistors and capacitors at positions corresponding to one subpixel 120. [ The transistor can be roughly classified into a switching transistor for switching a scan signal and a driving transistor for driving a data signal.

Here, in the case of the driving transistor, the driving transistor may be driven in a linear region or a saturation region by a signal supplied from the driving unit 160. However, it is advantageous that the driving transistor included in the organic electroluminescent device according to the present invention employs a digital driving method for driving in the linear region. Here, the digital driving method refers to a method of driving the transistor by simply turning on or off the transistor.

The driving unit 160 is located on the outer substrate 110 of the display unit 130 and the pad unit 170 is located outside the substrate 110 adjacent to the driving unit 160.

The driving unit 160 drives the signal supplied from the pad unit 170 and supplies the driving signal to the sub pixel 120 located in the display unit 130 It plays a role.

The driving unit 160 includes a scan driver for supplying a scan signal to each of the sub pixels 120R, 120G and 120B included in the display unit 130 and a scan driver for supplying data to the scan subpixels 120R, 120G and 120B. And a data driver for supplying a signal.

The scan driver and the data driver may be located on the left or right side of the outer surface of the display unit 130. In the case of the data driver, It may be located on the lower side.

A plurality of wirings 140 connected to the display unit 130 are positioned on the outer substrate 110 of the display unit 130. The plurality of wirings 140 connect the driving unit 160 and the pad unit 170 in addition to connecting the driving unit 160 and the sub pixel 120 included in the display unit 130.

Here, when the organic electroluminescent device is a passive matrix type, the plurality of wirings 140 include a data line for supplying a data signal to the sub-pixel 120 and a scan line for supplying a scan signal.

On the other hand, when the organic electroluminescent device is of the active matrix type, the plurality of wirings 140 are connected to the power line (for example, VDD) for supplying a high power supply to the sub-pixel 120, A ground line (for example, GND) for supplying power, and a data line for supplying a data signal to the sub-pixel 120 and a scan line for supplying a scan signal.

On the other hand, the insulating layer 150 is located on the plurality of wirings 140 located on the substrate 110. The insulating film 150 is formed to have a height in the range of 0.3 to 3.0 mu m from the substrate 110. When the insulating film 150 has a height in the range of 0.3 mu m to 3.0 mu m, The thickness of the electrode located in the display unit 130 and the wiring located outside the display unit 130 are different in a specific region.

That is, when no structure is located on the substrate 110, or when the electrodes or the wirings are arranged in a single layer structure, the height of the insulating film 150 may be in the range of 0.3 μm, and the wirings may be located in a multi- The height of the insulating film 150 can be increased to a range of 3.0 占 퐉.

However, if the problem of heat generation can be minimized when a power source or a signal flows through the electrode or wiring located under the insulating film 150, the thickness of the insulating film 150 may be further lowered or increased. However, if the thickness of the insulating film 150 is lowered, it is difficult to solve the problem of heat generation from the electrode or the wiring, and if the thickness is increased, the thickness of the device becomes higher.

1A, the insulating film 150 is formed on the substrate (not shown) so as to insulate between electrodes (for example, anodes) positioned in the display unit 130 or a plurality of wirings 140 located outside the display unit 130 110).

The insulating layer 150 is formed on the substrate 110 by the same process so as to isolate the electrodes located in the display portion 130 and the plurality of wirings 140 located outside the display portion 130, Lt; / RTI &gt;

1B, the insulating layer 150 may include an insulating layer 150a for insulating electrodes located in the display portion 130 and a plurality of wires 140 located outside the display portion 130, And an insulating layer 150b.

In view of the process, the insulating layer 150 of FIG. 1B may be formed by the same process so as to isolate an electrode located in the display portion 130 and a plurality of wirings 140 located outside the display portion 130 It can be described as being patterned so as to be distinguished from each other. Here, the insulating film 150 located on the outer side of the display unit 130, particularly on the plurality of wirings 140 located in the area adjacent to the driving unit 160, may be described as being formed in a dummy shape.

1A and 1B, the insulating layer 150 located on the substrate 110 is formed to expose a part of the wiring.

1A, the insulating layer 150 is formed over the entire surface of the substrate 110, but has an exposed region 165 that exposes an outer portion of the driving portion 160. [ 1B, the insulating layer 150 has an exposed region 165 in which the periphery of the insulating layer 150 is exposed in a state in which the insulating layer 150 is patterned by being divided into a region adjacent to the display region 130 and a region adjacent to the driving unit 160.

1A and 1B, since the insulating layer 150 is patterned to expose the outer surface of the driving unit 160, the plurality of first wirings 140a connecting the display unit 130 and the driving unit 160 and the driving unit 160 And the pad portion 170 are exposed to the outside.

Therefore, the insulating film 150 is removed from the first and second wirings 140a and 140b located in the exposed region 165. [ In the case of FIG. 1A, however, the exposed region 165 is shown as being exposed widely around the driving unit 160, but this is for convenience of explanation, and is not limited to this. 1B, the insulating layer 150 is shown to be located only between the driving unit 160 and the display unit 130. However, it is noted that the insulating layer 150 may be positioned between the driving unit 160 and the pad unit 170. [

1A and 1B, the insulating film 150 is formed on the wirings having an acute angle with the end of the insulating film 150 among the plurality of wirings 140 located in the exposed region 165, Protrusions 152 are included. At this time, the protrusion 152 is formed so as to protrude further in the outer direction of the insulating film 150, and may have a protruding shape more than that shown in the drawing.

In such a structure, the protruding portion 152 is provided on the wiring formed on the substrate 110 so as to pass through the exposed region 165 with an acute angle, so that the insulating film 150 located on the wiring is influenced by the step difference or the bent angle It is possible to prevent the peeling problem easily.

When the plurality of wirings 140 is exposed to the exposed region 165, placing the protruding portion 152 at the acute angle with the end of the insulating film 150 is not limited to the "Z1" region, Quot; Z2 "area.

Hereinafter, this will be described in more detail with reference to FIGS. 2A and 2B showing only the "Z1" region.

2A and 2B are enlarged views according to an embodiment of the "Z1" region of Figs. 1A and 1B.

2A and 2B, the insulating layer 150 is located on the first wirings 140a connected to the driving portion 160 of the plurality of wirings 140, and the insulating layer 150 is electrically connected to the driving portion 160, And an exposed area 165 that exposes the surroundings.

When the first wirings 140a pass through the exposed region 165, the protruding portions 152 are located at an acute angle with the ends of the insulating film 150 and the wirings.

2A, the protrusion 152 may be formed in a curved shape in a region where an insulating film 150 located at an end of the exposed region 165 has an acute angle with the wiring. 2B, the protrusion 152 may be formed in a curved convexo-concave shape so that the insulating film 150 and the wiring line have an acute angle and cover a part of the bent line.

Needless to say, such a protrusion 152 may protrude to occupy a wider area than that shown in FIG. 2A or FIG. 2B.

3A and 3B are enlarged views according to another embodiment of the region "Z1" in Figs. 1A and 1B.

3A and 3B, an insulating layer 150 is disposed on first wirings 140a connected to the driver 160 among the plurality of wirings 140. The insulating layer 150 is electrically connected to the driver 160, And an exposed area 165 that exposes the surroundings.

The protruding portion 152 is located on the wiring line at an acute angle with the end of the insulating film 150 when the first wiring 140a passes through the exposed region 165. [

3A, the protrusions 152 may be formed in a curved shape in a region where the wiring lines form an acute angle with the insulating layer 150 located at the end of the exposed region 165. [ 3B, the protrusion 152 may be formed in a straight concavo-convex shape so that the insulating film 150 and the wiring line have an acute angle and cover a part of the bent line.

It is needless to say that such a protrusion 152 may protrude to occupy a wider area than that shown in FIG. 3A or FIG. 3B.

As described above, the present invention has the effect of preventing the peeling phenomenon in which the insulating film located on the wiring of the organic electroluminescent device is peeled off and allowing the signal or power supply to smoothly flow through the wiring, thereby improving the display quality.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

As described above, the present invention has an effect of preventing the peeling phenomenon in which the insulating film located on the wiring of the organic electroluminescent device is peeled off and allowing a signal, a power source, or the like to smoothly flow through the wiring, thereby improving the display quality.

Claims (7)

Board; A display unit including a plurality of sub-pixels positioned on the substrate; A driver positioned on an outer substrate of the display unit; A plurality of wirings formed on the substrate and connected to the display unit and the driving unit to transmit a signal supplied from the outside; And And an insulating film formed on the substrate and covering a part of the plurality of wirings, Wherein the insulating film includes a protrusion in a region where an outer boundary line of the insulating film among the plurality of wiring lines forms an acute angle with the wiring, The projecting portion prevents peeling of the insulating film from peeling due to a step between the insulating film and the wiring or an angle at which the wiring is bent, The insulating film is formed by the same process as that of the insulating film located in the display portion, and exposes an outer portion of the driving portion, Wherein the protruding portion is positioned in a straight or curved concavo-convex shape on the wiring so as to cover a part of the wiring. delete delete delete The method according to claim 1, Wherein the insulating film has a height from 0.3 mu m to 3.0 mu m from the substrate. The method according to claim 1, And a pad portion located on an outer side substrate of the driving portion, Wherein the plurality of wirings are connected to the pad portion, the driving portion, and the display portion to transmit a signal supplied from the outside. The method according to claim 1, Wherein the plurality of subpixels comprise one or more capacitors and transistors.

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