KR101434951B1 - Apparatus of inhalation type for stocking wafer at ceiling and inhaling type wafer stocking system having the same - Google Patents

Apparatus of inhalation type for stocking wafer at ceiling and inhaling type wafer stocking system having the same Download PDF

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Publication number
KR101434951B1
KR101434951B1 KR1020130116588A KR20130116588A KR101434951B1 KR 101434951 B1 KR101434951 B1 KR 101434951B1 KR 1020130116588 A KR1020130116588 A KR 1020130116588A KR 20130116588 A KR20130116588 A KR 20130116588A KR 101434951 B1 KR101434951 B1 KR 101434951B1
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KR
South Korea
Prior art keywords
intake
container
assembly
shelf
pipe
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Application number
KR1020130116588A
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Korean (ko)
Inventor
이호근
유동규
이재현
이정영
이준한
윤준필
조주식
권용환
최성구
Original Assignee
크린팩토메이션 주식회사
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Priority to KR1020130116588A priority Critical patent/KR101434951B1/en
Application granted granted Critical
Publication of KR101434951B1 publication Critical patent/KR101434951B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides an inhalation type apparatus to store a wafer on a ceiling comprising: a storage section fixated on a ceiling and equipped with a supporting shelf which supports a wafer container; and an inhalation assembly installed in the storage section to correspond to the shelf and intakes a gas leaked from the container, and an inhalation type storage system for the wafer having the same.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an intake type wafer ceiling storage device and an intake type wafer storage system having the same,

The present invention relates to an apparatus and system for storing wafers to be used in the next step during a semiconductor manufacturing process.

Generally, in a semiconductor manufacturing process, a wafer is produced, and the produced wafer is transferred to the next stage to manufacture a semiconductor package.

At this time, the produced wafers can not be used in the next step, and after being stored for a certain time, they are sequentially sent to the next step as needed. Therefore, facilities for such storage are needed.

The facilities for storing the above are installed on the ground of the semiconductor factory, and there is a problem that it occupies a lot of space.

Also, during storage in the above storage facility, the wafer may be damaged over time. In order to prevent this, when the gas is injected during storage in a storage facility or before storing, the gas may leak from the container housing the wafer, and the concentration of the gas in the air may be increased.

SUMMARY OF THE INVENTION An object of the present invention is to provide an intake type wafer ceiling storage device and an intake type wafer storage system including the same, which can remove gas leaked from a container accommodating a wafer while improving space availability.

In order to achieve the above object, there is provided an aspiration type wafer ceiling storage device relating to an aspect of the present invention, comprising: a beam relationship fixed to a ceiling and having a shelf supporting a container in which a wafer is embedded; And an intake assembly that is installed in the beam relationship to correspond to the shelf, and configured to intake gas leaking from the vessel.

Here, the intake assembly may include an intake module having an intake surface intersecting the main surface of the shelf.

Here, the intake module includes an intake plate having the intake surface and the intake slit formed therein; And an outer hood coupled to the intake plate to form an inner space.

Here, the intake slit may be formed at the edge of the intake plate.

Here, the intake slit may have a plurality of sides corresponding to the closed loop.

Here, the intake module may further include an inner hood disposed in the inner space, the inner hood being located in an area defined by the intake slit.

Here, the inner hood may have the same shape as the outer hood and may have a smaller size than the outer hood.

The intake module may further include a sealing member formed as a closed loop surrounding the inner hood and disposed between the intake plate and the outer hood.

Here, the intake assembly includes an intake pipe communicating with an inner space of the outer hood; And an intake pump connected to the intake pipe.

Here, the intake plate and the inner hood are respectively formed with corresponding removal portions, and the beam relationship may include a sensor bracket installed on the intake plate and positioned in the removal portion.

The purging assembly may further include a purging assembly that is installed in the beam connection to communicate with the vessel located on the shelf and purges the wafer by injecting gas into the vessel.

Here, the purge assembly may include: a supply unit configured to supply the gas into the interior of the container; And an exhaust unit configured to exhaust the gas injected into the interior of the container.

Here, the shelf includes a supply nozzle and an exhaust nozzle formed so as to communicate with the inside of the container, and the supply unit and the exhaust unit each include a main pipe formed such that the gas flows; And a sub pipe branched from the main pipe and connected to the supply nozzle or the exhaust nozzle.

According to another aspect of the present invention, there is provided an intake type wafer storage system comprising: a vehicle rail fixed to a ceiling; A vehicle movably connected to the vehicle rail and carrying a container with the wafer embedded along the vehicle rail; A beam relationship located on the side of the vehicle rail, the beam relationship being configured to take and store the container in the vehicle; A purge assembly installed in the beam relationship and configured to purged the wafer by injecting gas into the vessel; And an intake assembly that is installed in the beam relationship and is configured to intake gas leaking from the vessel.

Wherein the beam relationship includes a shelf supporting the container and having a supply nozzle and an exhaust nozzle connected to the purge assembly, wherein the intake assembly includes an intake port having an intake surface crossing the major surface of the shelf, Modules.

Here, the intake module includes an intake plate having the intake surface and the intake slit formed therein; And an outer hood coupled to the intake plate to form an inner space.

The purge assembly and the inspiratory assembly may be operated when the container is determined to be located on the shelf through the container detection sensor, have.

According to the intake-type wafer ceiling storage device and the intake-type wafer storage system including the same, the leakage of gas from the container accommodating the wafer can be removed while enhancing the space utilization.

1 is a perspective view showing an intake type wafer storage system 1000 according to an embodiment of the present invention.
FIG. 2 is a perspective view showing the coupling relationship of the active and passive beam relationship 300, the purge assembly 400, and the intake assembly 500 of FIG.
3 is an enlarged perspective view of the third sub-pipe 416 of FIG.
Figure 4 is a conceptual diagram illustrating a fuzzy operation on the vessel (S 2) by a fuzzy assembly 400 of FIG.
5 is a block diagram for explaining the control configuration of the purge assembly 400 and the intake assembly 500 of FIG.
6 is an exploded perspective view of the intake module 510 and the intake pipe 550 of FIG.
FIG. 7 is a perspective view showing a combined state of the fixed beam relationship 600, the purge assembly 700, and the intake assembly 800 according to another embodiment of the present invention.
8 is a side cross-sectional view of the intake module 810 in the engaged state in Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an intake type wafer ceiling storage apparatus and an intake type wafer storage system including the same according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are given to different embodiments in the same or similar configurations.

1 is a perspective view showing an intake type wafer storage system 1000 according to an embodiment of the present invention.

Referring to the drawings, an intake type wafer storage system 1000 includes a vehicle rail 110, a vehicle 200, an active / inactive beam relationship 300, a purge assembly 400, an intake assembly 500, . ≪ / RTI > Here, the active and passive beam relationship 300 and the inspiratory assembly 500, and further the purge assembly 400, may be referred to as an inspiratory wafer ceiling storage device. In addition, the active and inactive beam relationship 300 can be referred to simply as a beam relationship, in addition to the fixed beam relationship 600 (FIG. 7) to be described later.

The vehicle rail 110 is installed in the ceiling C so as to form a movement path of the vehicle 200. The vehicle rail 110 may be formed to form two lines, for example, a closed curve line. And the frame 150 is arranged next to the vehicle rail 110. Fig. The frame 150 may also be formed to form two lines, and is fixed to the ceiling (C).

And the vehicle 200 is connected to the vehicle rail 110 to move along the movement path. Vehicle 200, the container (S 1) for accommodating a wafer is loaded. The vehicle 200 is provided with means for unloading the container and means (S 1) for loading the container (S 1).

Back and forth between the active beam 300 is configured to, the ceiling (C) a type of the security relationship, and specifically is installed in the frame 150 hold the vessel (S 2). Here, the container S 2 is the same as the container S 1 loaded on the vehicle 200, but is distinguished from each other due to necessity of explanation. Specifically, the container (S 1) will be loaded on the vehicle 200, a container (S 2) is taking over the active beam back and forth between 300 moves forward toward the vehicle (200). Back and forth between the active beam 300 is configured to return to the original position to take over the container (S 2). The active and inactive beam relationship 300 may be arranged to be positioned next to the vehicle rail 110. [ In addition, several frames to several tens of active and inactive beam relationships 300 may be provided in one frame 150, so that a plurality of active and inactive beam relationships 300 may be associated with one vehicle 200.

The purge assembly 400 is a configuration for supplying a gas, for example nitrogen (N 2 ), for purging into a container S 2 stored in the active and inactive beam relationship 300. To this end, the purge assembly 400 may communicate with the vessel S 2 through the active and inoperative beam relationship 300.

The intake assembly 500 is installed on the beam back and forth between the active (300) is configured to suction the gas from leaking from the container (S 2). In this case, the gas leakage is or is leaked out of the gas injected into the container (S 2) by a fuzzy assembly 400, a container (S 2) is implanted in the previous step being moved to an active retractable beams relationship 300 It may be leaked in gas.

According to this configuration, the vehicle 200 is moved along the vehicle rail 110 by loading the container S 1 containing the wafers produced in the previous step. Vehicle 200 stops, in transit, in response to a designated active advancement beam relationship 300. The active / retracted beam relationship 300 moves forward toward the vehicle 200 (to the state of FIG. 1 ) and receives the container S 1 backward to its original position (move to the state of FIG. 2) S 2 ). Wafers in by the action of the purge assembly 400 for the storage container (S 2), the container (S 2) is purged.

Thereby, the accommodated in the container (S 2) the wafer is purged with the gas, it can be stored than if no purging is long. In addition, since the beam back and forth between the active 300 and purge the vessel for a longer assembly by (400) (S 2) is stored at the ceiling (C) side, the utilization of the bottom surface near the area is increased.

In addition, the gas from leaking from the container (S 2) by a purge by the purge assembly 400 may be collected separately by the intake assembly 500. Thereby, the leaked gas can be prevented from being released to the space in which the active and inactive beam relationship 300 is installed without any restriction.

The active advancement beam relationship 300, the purge assembly 400, and the intake assembly 500 will be described in more detail with reference to FIG.

FIG. 2 is a perspective view showing the coupling relationship of the active and passive beam relationship 300, the purge assembly 400, and the intake assembly 500 of FIG.

Referring to the drawing, first, the active and inactive beam relationship 300 may include a fixed body 310 and a moving body 350. [

And the fixture 310 is fixed to the ceiling C via the frame 150. [ The fixing body 310 may include a mounting base 311 and a moving rail 321. The mounting base 311 is configured to be coupled to the frame 150. The forward / backward rail 321 is a rail installed on the mounting base 311. The extending direction of the rail on the forward / backward rail 321 will be the direction toward the lower side of the vehicle 200 (the forward and backward directions M).

The moving body 350 is configured to be movably connected to the fixing body 310, specifically, the retractable rail 321. The moving body 350 may include a shelf 351 and a connecting rod 361. The shelf 351 is spaced apart from the advancing / retreating rail 321 and is formed to support the container S 2 (Fig. 1). Specifically, the shelf 351 is disposed substantially parallel to the ceiling C. The shelf 351 is provided with a supply nozzle 352 and an exhaust nozzle 353 formed to communicate with the inside of the container S 2 (FIG. 1). The connecting rod 361 has a configuration in which one end portion thereof connects one edge side of the shelf 351 to the forward / backward rail 321. The other end of the linkage 361 can be slidably inserted into the forward / backward rail 321.

Next, the purge assembly 400 may include a supply unit 410 and an exhaust unit 430. The supply unit 410 is formed to supply the gas into the interior of the container S 2 (FIG. 1). On the contrary, the exhaust unit 430 is formed to exhaust the gas filled in the container S 2 (FIG. 1).

Each of the supply unit 410 and the exhaust unit 430 may include main pipes 411 and 431 and sub pipes 413 and 433. [

The main piping 411 of the supply unit 410 is connected to the tank for supplying the gas and the main piping 431 of the exhaust unit 430 is connected to the tank for recovering the gas. The main pipes 411 and 431 may be installed so as to extend along the frame 150 (see Fig. 1).

The sub pipes 413 and 433 connect the main pipes 411 and 431 to the shelf 351 (specifically, the supply nozzle 352 and the exhaust nozzle 353). If the main pipelines 411 and 431 are provided for one frame 150, the sub-pipelines 413 and 433 are divided into a plurality of branches in the main piping 411 and 431 corresponding to each active / .

The sub pipe 413 of the supply unit 410 is connected to the first sub pipe 414 connected to the main pipe 411 and the second sub pipe 414 connecting the first sub pipe 414 and the supply nozzle 352 415). Furthermore, the sub-pipe 413 may further include a third sub-pipe 416 connecting the first sub-pipe 414 and the second sub-pipe 415, and at least a part of which is formed of a flexible material. Similarly, the sub-pipe 433 of the exhaust unit 430 includes a first sub-pipe 434 connected to the main pipe 431 and a second sub-pipe 434 connected to the first sub-pipe 434 and the supply nozzle 333 2 sub-pipe 435. The sub- The sub-pipe 433 may further include a third sub-pipe 436 connecting the first sub-pipe 434 and the second sub-pipe 435 and formed at least partly of a flexible material. Here, as compared with the first sub-pipes 414 and 434, the second sub-pipes 415 and 435 may have a small flow cross-sectional area.

Further, the third sub-pipes 416 and 436 can be protected by the cable bear 416 '. The cable bear 416 'is in the form of a hollow chain, and houses the third sub-pipes 416 and 436 therein. The cable bear 416 'may be installed to connect the moving body 350, specifically, the connecting rod 361 and the fixing body 310, specifically, the moving rail 321. Unlike the above one cable bearing 416 ', it is also possible to have two cable bearings to accommodate each of the third sub-pipes 416 and 436 individually.

An exhaust unit 430 is above may further include an exhaust pump 440 for the recovery by the gas pumped into the tank in the container (S 2). On the other hand, if the supply unit 410 if the gas flows toward the container (S 2) only by applying a nitrogen gas of high pressure in the main pipe 411, may not require a separate pump.

Finally, the intake assembly 500 may include an intake module 510, an intake pipe 550, and an intake pump 570.

Intake module 510 is a configuration diagram of the role of collecting the gas from leaking from the container (S 2). For this purpose, the intake module 510 may be located on the side of the shelf 351 where the container S 2 is located. In this embodiment, the intake module 510 is installed in the linkage 361. [ The intake module 510 generally has the shape of a square horn. Thereby, the surface of the large - surface square of the intake module 510 - the intake side (512) is facing the side of the container (S 2).

The intake pipe 550 communicates with the intake module 510 to allow the collected gas collected at the intake module 510 to flow to another place. The intake pipe 550 can be fixed at one portion with respect to the active and inoperative beam relationship 300. The intake pipe 550 is fixed to the frame 150 and can also be extended along the frame 150.

The intake pump 570 is configured to communicate with the intake pipe 550 and collect the leaking gas flowing along the intake pipe 550 into the tank.

Among the above configurations, one of the third sub-pipes 416 and 436 will be described first with reference to Fig. The other one 436 may have the same configuration as the one above 416.

3 is an enlarged perspective view of the third sub-pipe 416 of FIG.

Referring to this figure, the third sub-pipe 416 may include a pipe portion 416a and an adapter 416d.

The pipe portion 416a has a ductility as a hollow body having a space through which gas flows. The pipe portion 416a may specifically include an inner pipe 416b and an outer pipe 416c. The inner pipe 416b may be formed of a Teflon material. The outer pipe 416c is disposed so as to surround the inner pipe 416b, and can be in a concentric relation with the inner pipe 416b. The outer pipe 416c may be formed of a silicon material.

The adapter 416d is provided at both ends of the pipe portion 416a. The adapter 416d may be made of a metal such as stainless steel. The adapter 416d is sandwiched between the first sub pipe 414 and the second sub pipe 415 so that the third sub pipe 416 is communicated with the first sub pipe 414 and the second sub pipe 415 do.

The third sub-pipe 416 is configured to stably communicate the first sub-pipe 414 and the second sub-pipe 415 even when the moving body 350 is moved forward and backward by the deformation of the pipe portion 416a .

Next, the purging operation of the purge assembly 400 will be described with reference to FIG.

Figure 4 is a conceptual diagram illustrating a fuzzy operation on the vessel (S 2) by a fuzzy assembly 400 of FIG.

Referring to this figure, the supply unit 410 further includes a supply valve 417, a supply flow meter 419, and a gas filter 421 in addition to the main pipe 411 and the sub pipe 413 described above . The supply valve 417, the supply flow meter 419, and the gas filter 421 are both provided so as to communicate with the second sub pipe 415. The supply valve 417 is formed to open and close the flow path for the gas flow in the second sub pipe 415. The supply valve 417 is an electric valve, and is formed to perform an operation for opening and closing by an electrical signal. The feed flow meter 419 is disposed between the feed valve 417 and the feed nozzle 352 to set the flow rate of the gas toward the feed nozzle 352 to a predetermined value. A gas filter 421 is provided between the feed flow meter 419 and the feed nozzle 352 to filter foreign matter in the gas that is fed into the vessel S 2 through the feed nozzle 352. Here, the supply valve 417 and the feed flow meter 419 may be integrated into a digital mass flow controller. In this case, the digital mass flow meter can set the amount of gas supplied over time and can be electronically controlled by a computer.

The exhaust unit 430 may further include an exhaust valve 437 and an exhaust flow meter 439 in addition to the main pipe 431 and the sub pipe 433 described above. Both the exhaust valve 437 and the exhaust flow meter 439 are provided so as to communicate with the second sub-pipe 435. The exhaust valve 437 is formed to open and close the flow path for the gas flow in the second sub-pipe 435. The exhaust valve 437 is an electric valve, and is configured to perform an operation for opening and closing by an electrical signal. The exhaust flowmeter 439 is disposed between the exhaust valve 437 and the exhaust nozzle 353 to adjust the flow rate of the gas exhausted to the outside of the container S 2 through the exhaust nozzle 353 to a predetermined value.

The manner in which the purge assembly 400 and the intake assembly 500 are operated will be further described with reference to FIG. Here, FIG. 5 is a block diagram for explaining a control configuration of the purge assembly 400 and the intake assembly 500 of FIG.

4 and 5, the shelf 351 may further include a container detection sensor 355. The container detecting sensor 355 is provided on the upper surface side of the shelf 351 so as to detect whether the container S 2 is positioned on the shelf 351.

 The purge assembly 400 may further include a control unit 450 for controlling the operations of the supply unit 410 and the exhaust unit 430 described above. The control unit 450 can receive various information from the supply flow meter 419, the exhaust flow meter 439 and the container detection sensor 355 and can control the operation of the supply valve 417 and the exhaust valve 437 .

For example, the control unit 450 controls the opening and closing of the supply valve 417 and the exhaust valve 437 based on the difference between the supply flow rate measured at the supply flow meter 419 and the exhaust flow rate measured at the exhaust flow meter 439 Can be controlled. Specifically, in the supply flow rate by subtracting the exhaust flow rate, the amount of the gas filled in the container (S 2) is calculated. When the amount of the charged gas is below the reference value, the supply valve 417 can be closed and the exhaust valve 437 can be closed. Conversely, if the amount of the charged gas exceeds the criterion, the supply valve 417 can be opened while the exhaust valve 437 is closed.

The control unit 450 can also control the opening and closing of the supply valve 417 and / or the exhaust valve 437 based on the detection result of the container detection sensor 355. [ Specifically, the container sensor 355, a container (S 2) if it detects to be present on the shelf 351, may open the supply valve (417). The control unit 450 can control the opening of the exhaust valve 437 when a certain amount of the gas is charged in the container S 2 after a certain period of time after controlling the opening of the supply valve 417.

In addition to the purge assembly 400, the above control unit 450 may also control the intake assembly 500. Specifically, when the container S 2 (see FIG. 1) is located on the shelf 351 and the purge assembly 400 is activated, the control unit 450 operates the intake pump 570 of the intake assembly 500 .

If when the intake pump (570) movable, the intake module 510 is to collect the gas leaking from the container (S 2). The collected leaked gas flows through the intake pipe 550 and is finally collected by the intake pump 570 in a tank connected thereto.

Next, the intake module 510 of the above-described intake assembly 500 will be described with reference to Fig.

6 is an exploded perspective view of the intake module 510 and the intake pipe 550 of FIG.

Referring to this figure, the intake module 510 may include an intake plate 511, an outer hood 521, and an inner hood 531.

The intake plate 511 may be a substantially rectangular plate. The intake surface 512, which is the outer surface of the intake module 510, is disposed to face the side surface of the container S 2 (see FIG. 1). At the end of the intake plate 511, an intake slit 513 may be formed. The intake slit 513 may be formed continuously on the edge to form a generally closed loop. The closed loop is generally rectangular in shape depending on the shape of the intake plate 511, and is broken at the portion which becomes the four vertexes. A part of the intake plate 511 is formed with a removal part 515.

The outer hood 521 is configured to be coupled with the intake plate 511 to form the inner space S. In this embodiment, the outer hood 521 has the shape of a square horn corresponding to the rectangular intake plate 511. Specifically, the outer hood 521 may have a rectangular front portion 522, a rectangular rear portion 523, and a side portion 525 connecting them. Here, the front portion 522 and the rear portion 523 form a rectangular opening. An intake pipe 550 is connected to the rear portion 523. The side portion 525 is made up of a total of four trapezoids.

The inner hood 531 is disposed in the inner space S. The inner hood 531 has a shape similar to that of the outer hood 521, but may be smaller than the outer hood 521. Thereby, the inner hood 531 can be provided with the front portion 532 and the side portion 533. At this time, the front portion 522 forms a rectangular opening and the side portion 525 is formed of four triangles. The size of the front portion 522 is determined at a level at which the intake slit 513 can be located within the confined area. Unlike the outer hood 521, the rear surface of the inner hood 531 is closed. At one portion of the inner hood 531, a removal unit 535 corresponding to the removal unit 515 of the intake plate 511 may be formed. Corresponding to these dispensers 515 and 535, the active and inactive beam relationship 300 further includes a sensor bracket 370 that is a mark for recognizing the active and inactive beam relationship 300 of the vehicle 200 (FIG. 1) can do. The sensor bracket 370 is installed on the intake plate 511 and the removal units 515 and 535 expose the sensor bracket 370 and form a space for its escape.

In the above, the intake plate 511, the outer hood 521, and the inner hood 531 can be made of a lightweight material such as acrylic. Bonded together therebetween to prevent gas from leaking through them.

According to this configuration, the intake slit 513 is positioned corresponding to the portion where the gas leakage occurs in the container S2 (Fig. 1). The leakage gas flowing into the internal space S through the intake slit 513 flows into the intake pipe 550 through the flow path between the inner hood 531 and the outer hood 521. [ In other words, the inner hood 531 reduces the cross-sectional area through which the leaking gas flows in the inner space S, thereby increasing the flow rate of the leaking gas.

7 and 8, the purging assembly 700, and the inspiratory assembly 800 for the active retraction beam relationship 300 and the other fixed beam relationship 600 will now be described. Here, the fixing configuration of the beam between 600 active retractable beams between 300 than phase one, are installed next to the vehicle rail 110 points to storage take over the container (S 2) from the vehicle (200) is common . Further, the purge assembly 700 and the intake assembly 800 are substantially the same as those of the previous embodiment, but differ in part.

FIG. 7 is a perspective view showing a combined state of the fixed beam relationship 600, the purge assembly 700, and the intake assembly 800 according to another embodiment of the present invention.

Referring to this figure, the fixed beam relationship 600 may first include a body 610, a shelf 630, and a fastening unit 650.

The body 610 is the skeleton part of the beam relationship 600. Specifically, the main body 610 may include a bottom frame 611, a vertical frame 613, and a horizontal frame 615. The floor frame 611 is arranged to be substantially horizontal to the ceiling C (Fig. 1). The vertical frame 613 and the horizontal frame 615 constitute the side walls of the main body 610. The vertical frame 613 is substantially perpendicular to the bottom frame 611 and the horizontal frame 615 is disposed substantially parallel to the bottom frame 611.

The shelf 630 is installed on the main body 610 and is formed to support the container S 2 (Fig. 1). Specifically, the shelf 630 is installed in the bottom frame 611 of the main body 610, and is arranged substantially parallel to the ceiling C. For one bottom frame 611, one or more shelves 630 may be provided. In this embodiment, it is illustrated that three shelves 630 are installed on one floor frame 611. The shelf 630 is provided with a supply nozzle 632 and a discharge nozzle 633 which are formed to communicate with the inside of the container S 2 (FIG. 1).

The fastening unit 650 is installed on the main body 610, specifically the vertical frame 613, so that the main body 610 is fastened to the ceiling C. This fastening unit 650 may be the same as the structure for fastening the vehicle rail 110 (Fig. 1) to the ceiling C.

The purge assembly 700 may include a supply unit 710 and an exhaust unit 730, similar to the previous embodiment. The supply unit 710 is connected to the supply nozzle 632, and the exhaust unit 730 is connected to the exhaust nozzle 633. [ Unlike the purge assembly 400 of the previous embodiment, the purge assembly 700 may not require the same configuration as the flexible third sub pipes 416 and 436. This is because the fixed beam relationship 600 does not move unlike the active /

The intake assembly 800 may be secured with respect to the bottom frame 611 and the transverse frame 615 of the fixed beam relationship 600. The intake assembly 800 may include an intake module 810, an intake pipe 850, and an intake pump 870, similar to the intake assembly 500 of the previous embodiment.

The intake module 810 mainly in the intake assembly 800 will be described with reference to FIG.

8 is a side cross-sectional view of the intake module 810 of FIG.

The intake module 810 includes an intake plate 811 having an intake slot, an outer hood 821, and an inner hood 831, as in the intake module 510 of the previous embodiment. .

Thereby, the leaked gas introduced into the intake slot flows to the intake pipe 850 side through the flow path between the inner hood 831 and the outer hood 821.

At this time, the intake plate 811, the outer hood 821 and the inner hood 831 may be formed of a metallic material such as stainless steel, unlike the intake module 510 of the prior art. In this case, welding may be used for joining them.

Further, a sealing member 841 of a closed loop type may be provided between the intake plate 811 and the outer hood 821 to prevent leakage. The sealing member 841 may be, for example, a gasket.

The above-described intake-type wafer ceiling storage device and the intake-type wafer storage system including the same are not limited to the configuration and operation of the embodiments described above. The embodiments may be configured so that all or some of the embodiments may be selectively combined so that various modifications may be made.

110: vehicle rail 150: frame
200: Vehicle 300: Active moving type beam relationship
310: Fixture 350: Moving body
351: Shelf 352: Supply nozzle
353: exhaust nozzle 400, 700: purge assembly
410, 710: Supply unit 411: Main piping
413: Sub-pipe 417: Supply valve
419: Supply flow meter 430, 730: Exhaust unit
431: Main piping 433: Sub piping
437: exhaust valve 439: exhaust flow meter
450: control unit 500,800: intake assembly
510,810: intake module 550,850: intake pipe
570,870: Intake pump 600: Fixed beam relationship
610: Main body 630: Shelf
650: fastening unit

Claims (17)

A beam relationship fixed to the ceiling and having a shelf for supporting a container having a wafer therein; And
And an intake assembly that is installed in the beam relationship to correspond to the shelf and configured to intake gas leaking from the vessel,
The intake assembly includes:
And an intake module having an intake surface intersecting with the main surface of the shelf.
delete The method according to claim 1,
The intake module includes:
An intake plate forming the intake surface and formed with an intake slit; And
And an outer hood coupled to the intake plate to form an inner space.
The method of claim 3,
Wherein the intake slit is formed at an edge of the intake plate.
5. The method of claim 4,
Wherein the intake slit has a plurality of sides corresponding to closed loops.
5. The method of claim 4,
The intake module includes:
Further comprising an inner hood disposed in the inner space, the inner hood being located in an area defined by the intake slit.
The method according to claim 6,
Wherein the inner hood has the same shape as that of the outer hood and has a smaller size than the outer hood.
The method according to claim 6,
The intake module includes:
Further comprising a sealing member formed of a closed loop that surrounds the inner hood and disposed between the intake plate and the outer hood.
The method of claim 3,
The intake assembly includes:
An intake pipe communicating with an inner space of the outer hood; And
Further comprising an intake pump connected to the intake pipe.
The method according to claim 6,
Wherein the intake plate and the inner hood are formed with respective removing portions corresponding to each other,
The beam-
And a sensor bracket installed on the intake plate, the sensor bracket positioned in the removal unit.
The method according to claim 1,
Further comprising a purging assembly installed in the beam connection in communication with the vessel located on the shelf and purging the wafer by injecting gas into the vessel.
12. The method of claim 11,
Wherein the purge assembly comprises:
A supply unit configured to supply the gas into the interior of the container; And
And an exhaust unit configured to exhaust the gas injected into the interior of the container.
13. The method of claim 12,
Wherein the shelf includes a supply nozzle and an exhaust nozzle formed to communicate with the inside of the container,
Wherein the supply unit and the exhaust unit each comprise:
A main pipe formed such that the gas flows; And
And a sub-pipe branching from the main pipe and connected to the supply nozzle or the exhaust nozzle.
A vehicle rail fixed to the ceiling;
A vehicle movably connected to the vehicle rail and carrying a container with the wafer embedded along the vehicle rail;
A beam relationship located on the side of the vehicle rail, the beam relationship being configured to take and store the container in the vehicle;
A purge assembly installed in the beam relationship and configured to purged the wafer by injecting gas into the vessel; And
And an intake assembly installed in the beam relationship and configured to intake gas leaking from the vessel,
The beam-
And a shelf supporting the container and having a supply nozzle and an exhaust nozzle connected to the purge assembly,
The intake assembly includes:
And an intake module having an intake surface intersecting the major surface of the shelf.
delete 15. The method of claim 14,
The intake module includes:
An intake plate forming the intake surface and formed with an intake slit; And
And an outer hood coupled to the intake plate to form an inner space.
15. The method of claim 14,
Wherein the retention relationship further comprises a container sensing sensor for sensing that the container is located,
Wherein the purge assembly and the air intake assembly are actuated when it is determined that the container is located on the shelf through the container detection sensor.
KR1020130116588A 2013-09-30 2013-09-30 Apparatus of inhalation type for stocking wafer at ceiling and inhaling type wafer stocking system having the same KR101434951B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101609338B1 (en) * 2015-03-16 2016-04-05 크린팩토메이션 주식회사 Apparatus for storing and handling wafer carrier at ceiling
KR101841925B1 (en) * 2017-07-28 2018-03-26 크린팩토메이션 주식회사 Ground furging station for wafer accomodating foup
CN110957237A (en) * 2018-09-27 2020-04-03 大福自动化洁净设备公司 Wafer blowing type shelf assembly and buffer module with same
CN116588683A (en) * 2023-07-19 2023-08-15 常州协创智联电子有限公司 Suction nozzle assembly for carrying battery cell, carrying mechanism using suction nozzle assembly and carrying method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007091463A (en) * 2005-08-30 2007-04-12 Daifuku Co Ltd Article conveyance facility
JP2009087972A (en) * 2007-09-27 2009-04-23 Tokyo Electron Ltd Substrate-storing structure and semiconductor manufacturing apparatus
JP2010147451A (en) * 2008-12-18 2010-07-01 Nippon Cambridge Filter Kk N2 purge apparatus for foup
KR20120018062A (en) * 2010-08-20 2012-02-29 가부시키가이샤 다이후쿠 Container storage facility

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007091463A (en) * 2005-08-30 2007-04-12 Daifuku Co Ltd Article conveyance facility
JP2009087972A (en) * 2007-09-27 2009-04-23 Tokyo Electron Ltd Substrate-storing structure and semiconductor manufacturing apparatus
JP2010147451A (en) * 2008-12-18 2010-07-01 Nippon Cambridge Filter Kk N2 purge apparatus for foup
KR20120018062A (en) * 2010-08-20 2012-02-29 가부시키가이샤 다이후쿠 Container storage facility

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101609338B1 (en) * 2015-03-16 2016-04-05 크린팩토메이션 주식회사 Apparatus for storing and handling wafer carrier at ceiling
US10141213B2 (en) 2015-03-16 2018-11-27 Daifuku Co., Ltd. Apparatus for storing and handling article at ceiling
US10453724B2 (en) 2015-03-16 2019-10-22 Daifuku Co., Ltd. Apparatus for storing and handling article at ceiling
KR101841925B1 (en) * 2017-07-28 2018-03-26 크린팩토메이션 주식회사 Ground furging station for wafer accomodating foup
CN110957237A (en) * 2018-09-27 2020-04-03 大福自动化洁净设备公司 Wafer blowing type shelf assembly and buffer module with same
CN116588683A (en) * 2023-07-19 2023-08-15 常州协创智联电子有限公司 Suction nozzle assembly for carrying battery cell, carrying mechanism using suction nozzle assembly and carrying method
CN116588683B (en) * 2023-07-19 2023-09-12 常州协创智联电子有限公司 Suction nozzle assembly for carrying battery cell, carrying mechanism using suction nozzle assembly and carrying method

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