KR101419740B1 - Bi-layer ceramic substrate for heat dissipation and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a ceramic heat dissipating member having a dual structure and a manufacturing method thereof. More particularly, the present invention relates to a ceramic heat dissipating member having a dual structure, The second molded body having the second density higher than the first density and containing the ceramic can provide a more dense surface than the first molded body so that an electric circuit such as an electrode can be constructed and an excellent thermal conductivity can be obtained, It is possible to more efficiently emit heat generated in a high-performance and high-integration device of a lighting device, a mobile device, and a computer using LED and a semiconductor device, and at the same time, it can be manufactured at a low cost and a low price, To a ceramic heat dissipating member having a dual structure and a manufacturing method thereof.
The present invention relates to a first molded body having a first density and containing ceramics; And a second formed body coupled to a part or all of the surface of the first formed body and having a second density higher than the first density and containing ceramics.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic heat dissipating member having a double structure and a method of manufacturing the ceramic heat dissipating member.

The present invention relates to a ceramic heat dissipating member having a dual structure and a manufacturing method thereof,

More specifically, a first formed body having a first density and including ceramics is formed to maximize the emissivity of the ceramic, and a second formed body having a second density higher than the first density and including ceramics It is possible to constitute an electric circuit such as an electrode by providing a more dense surface than the first molded body and to obtain an excellent thermal conductivity so that the performance and high integration of lighting devices, mobile devices and computers using LED and semiconductor devices within a predetermined area or space The present invention relates to a ceramic heat dissipating member having a dual structure that can dissipate heat generated within a device and can be manufactured at a low cost and at a low cost, thereby securing market competitiveness of the product, and a manufacturing method thereof.

Generally, with the development of IT technology, the sizes of electronic information devices and devices are becoming smaller and slimmer, and various electronic parts used in these devices are becoming highly integrated and high output. Due to the slimness and high output of such devices, the heat generation by the elements is inevitably increased, and the temperature rise due to heat causes problems such as deterioration of functions and reliability of parts and devices, shortening of life span, and the like.

Particularly, in order to reduce the electric power consumption and improve the performance of the apparatus, it is necessary to suppress such heat generation or to effectively release the generated heat. Therefore, various radiator plates have been actively developed to solve such problems.

Currently, commercialized radiator plates are made of ceramic materials (alumina (0.32W / cmK), SiC (2.0W / cmK)) and aluminum (thermal conductivity: 2.4W / cmK) W / cmK)] exhibit significantly lower thermal conductivity than these metal materials and can not be used alone as a heat-radiating material, but are formed by forming a metal and a composite material. In addition, since the workability is remarkably low, it is applied only to special cases.

Up to now, a consideration of the radiator plate has been to provide a heat-sink for ultimately discharging the heat generated from a heat source to the outside (heat-sink: an aluminum substrate having a large heat capacity and having a fin- And has been concentrated on materials with good thermal conductivity.

Recently, however, due to the slimming of electronic devices, there is a growing demand for heat dissipation from the heat source directly without a separate heat sink. When the radiating plate is made slimmer (thickness is thinned), emissivity that directly emits heat to the outside becomes more important than heat conductivity in heat radiating performance.

Compared to metals, most ceramic materials have a high emissivity. Accordingly, in the present invention, an excellent emissivity of a ceramic material is applied to a radiator plate of a thin film, thereby improving heat dissipation ability due to slimming of electronic equipment.

As a conventional technique related to the present invention, the following techniques are known.

The present invention relates to a "high heat-dissipating low-temperature fired ceramic substrate" of Korean Patent Publication No. 10-2012-0012028 (published on February 09, 2012), and effectively transfers heat generated from various electronic circuits and electronic components to external The present invention relates to a high heat-dissipating low-temperature fired ceramic substrate, and more particularly, to a high-temperature fired ceramic substrate having a large number of open pores in a thermally conductive layer made of a metal substrate, To a heat-dissipating low-temperature co-fired ceramic substrate for electronic parts, which is improved in heat radiation effect and electrical insulation by lamination of a metal substrate and a high-heat-insulating insulating layer for improving thermal conductivity.

However, the above-mentioned patent discloses a high thermal conductive metal substrate having high thermal conductivity such as aluminum for improving the thermal conductivity. That is, a ceramic material having a low density is laminated on a metal substrate having an excellent thermal conductivity. The ceramic material is laminated on a metal to form a composite material, and the chemical bonding force of the two materials causes a discontinuous problem.

In addition, the chemical bonding force of the two materials inevitably causes a problem of discontinuity (fine pore layer formation) at the two material interfaces, which causes a serious problem in heat transfer between the two substrates. That is, the unstable contact at the interface sharply reduces the thermal conductivity, which results in a fatal disadvantage that is significantly lower than that of a single material (metal organs), which is practically impractical and has no market competitiveness.

The present invention relates to a ceramic composition for a heat sink and a heat sink excellent in heat radiation and heat absorption characteristics using the ceramic composition for a heat sink of Patent Application No. 10-0949786 (registered on March 19, 2010) The present invention relates to a ceramic composition for a heat sink excellent in heat absorption and heat dissipation properties used in a heat sink for radiating heat generated inside the product, and a heat sink using the ceramic composition. The present invention relates to a heat sink for a heat sink including a heat conductive portion provided in a heat generating portion and transmitting heat generated from the heat generating portion to the outside and having heat conductivity, and a heat sink having a heat radiating and insulating ceramic material and a heat absorbing phase change material And a heat absorbing layer formed by coating a ceramic composition on one side of the heat conduction part and absorbing heat transmitted to the heat conduction part. The patent also discloses a structure in which a heat absorbing layer including a ceramic composition having excellent heat absorbing property and exothermic property is formed on one side surface of a heat conduction part. This structure can increase the number of heat sinks, The heat sink can be efficiently manufactured and the manufacturing cost can be reduced.

However, the heat conductive part of the above-mentioned patent is formed of a metal foam such as an aluminum foam, a nickel foam or a copper foam having high heat conductivity so as to transmit heat generated from a heat generating part to the outside and have thermal conductivity, have. As a result, like the problems of the above-mentioned patents and registered patents,

It causes a problem of discontinuity (formation of a fine pore layer) at the interface between two materials, which causes a serious problem in heat transfer between the two substrates. That is, the unstable contact at the interface drastically reduces the thermal conductivity, which is rather lower than the heat dissipation property of a single material (metal substrate).

The present invention also relates to a module for solar cell power generation having a ceramic-coated heat-dissipating sheet of Patent Registration No. 10-0962642 (registered on June 03, 2010), wherein a ceramic coating layer formed on both sides or one surface of a heat- The heat generated from the solar cell is transferred to the solar EVA due to the difference of the emissivity, the thermal conductivity and the surface area of the material, and the heat is transferred to the thin sheet of the heat radiation sheet, A heat transfer phenomenon that is transmitted and radiated in one direction flows in one direction to have a high heat emissivity, thereby increasing the heat radiation performance, thereby increasing the cooling efficiency of the module for the solar power generation and the peripheral devices thereof, To maximize the amount of power generation and power generation efficiency through the use of the heat dissipating sheet, It possible to maintain the change in the power generation amount according to the existing surface temperature at a constant level can be obtained based on the annual power generation amount 3-5% synergy effect with the development of the summer 5 to 10%. In addition, it has the advantage that various applications can be secured by the same application in a hot or humid tropical climate region and a desert region.

However, the heat-radiating sheet of the above-mentioned patent uses a thin metal plate having a high thermal conductivity, such as aluminum, copper, brass, steel, stainless steel and the like,

The combination of the metal thin plate and the ceramic coating layer has a low thermal conductivity and the bonding with the metal thin plate necessarily causes a problem of discontinuity (fine pore layer formation) at the two material interfaces as in the problems of the aforementioned patents and registered patents, The heat transfer between the two substrates is seriously problematic. That is, the unstable contact at the interface drastically reduces the thermal conductivity, which is rather lower than the heat dissipation property of a single material (metal substrate).

The present invention relates to a heat-dissipating ceramic film and a method for manufacturing the heat-dissipating ceramic film, and more particularly, to a method for manufacturing a heat-dissipating ceramic film, which comprises the steps of: i) Providing a mixture comprising a solvent, ii) applying the mixture onto a release paper, iii) heating the mixture to produce a heat-fusible ceramic film, and iv) peeling the heat-fusible ceramic film from the release paper, The heat-dissipating ceramic film can be simply attached to the bulk material or the substrate to efficiently emit heat. In addition, since there is no need to form a bulk material or a substrate by using a heat dissipation material, the heat dissipation effect by the heat dissipation ceramic film can be maximized at low cost, and the heat dissipation ceramic film is not broken well. And a manufacturing method thereof.

However, in the heat-dissipating ceramic film of the above-mentioned patent, the mixture is first heated to 70 ° C to 80 ° C, and then the primary heated mixture is heated to 90 ° C to 120 ° C secondarily. If the temperature at the first heating is too low, the mixture is vaporized during the second heating and bubbles are generated. If the temperature is too high during the first heating, a uniform heat-shrinkable ceramic film with uniform thickness and uniform thickness is produced due to the rapid vaporization of the mixture The manufacturing time and cost of the heat-dissipating ceramic film are increased, resulting in a further increase in manufacturing cost.

In order to solve such a problem,

A method of manufacturing a ceramic molded body, comprising: forming a first formed body having a first density and including ceramics to maximize emissivity, not a thermal conductivity of the ceramic; bonding to a part or all of the surface of the first shaped body, To provide a ceramic heat dissipating member having a dual structure that can be configured as an electronic circuit and can obtain an excellent thermal conductivity so that the production process is simple and the production cost is low and the market competitiveness of the product is ensured The purpose.

Also, the first formed body is formed by sintering a first mixed material composed of ceramics having an average particle diameter of 5 to 30 um, a frit and a binder of 0.1 to 10 um, thereby providing a low density substrate having a maximum specific surface area, Emissivity can be maximized,

The second formed body, which is bonded to a part or all of the surface of the first molded body and has a second density higher than the first density and contains ceramic, has a ceramic having an average particle diameter of 0.1 to 1.5 um and a frit frit and a binder to form a circuit such as an electrode and improve the thermal conductivity to absorb the heat discharged by the heating element to induce heat transfer to the first formed body,

It is a further object of the present invention to provide a ceramic heat dissipating member having a double structure which does not require a processing step of mixing a separate metallic material and is capable of mass production of the raw material powder at a very low cost, do.

In addition, the step of forming a diamond layer on a part or all of the exposed surface of the second molded body may further include a step of further increasing the thermal conductivity of the ceramic heat dissipating member. It is an object of the present invention to provide a ceramic heat dissipating member having a dual structure capable of remarkably increasing the heat radiation rate of the ceramic heat dissipating member together with the excellent thermal radiation rate of the ceramic having the first density.

In addition, the first and for the second formed body 1 and the second honhapjae each of alumina (Al ₂ O _3), mullite _{(3Al 2 O 3 · SiO 2} ), silicon carbide (SiC), aluminum nitride (AlN), diamond 3 to 30 parts by weight of a frit containing at least one of calcined clay, bentonite-based clay and low-temperature fused glass frit powder with respect to 100 parts by weight of a ceramic containing at least one of grains and c-BN (cubic boron nitride) , And 0.1 to 20 parts by weight of a binder,

It is an object of the present invention to provide a ceramic heat dissipating member having a dual structure which can reduce the production cost substantially by using a common material and secure a market competitiveness due to an inexpensive production cost.

According to an aspect of the present invention, there is provided a ceramic heat dissipating member comprising:

A first formed body having a first density and including a ceramic;

And a second formed body coupled to a part or all of the surface of the first formed body and having a second density higher than the first density and including ceramics,

The first formed body is formed by sintering a first mixed material composed of ceramics having an average particle diameter of 5 to 30 um, a frit and a binder of 0.1 to 10 um,

The second formed body is formed by sintering a ceramic material having an average particle diameter of 0.1 to 1.5 um, a frit having a frit of 0.1 to 10 um, and a second mixed material composed of a binder,

And a diamond layer is further included in part or all of the exposed surface of the second molded body.

Each of the first and second mixing materials for the first and second formed bodies

Consist of any or all of the alumina (Al ₂ O _3), mullite _{(3Al 2 O 3 · SiO 2} ), silicon carbide (SiC), aluminum nitride (AlN), diamond particles, c-BN (cubic boron nitride) Based on 100 parts by weight of the ceramic,

3 to 30 parts by weight of frit composed of a part or all of clay, bentonite clay and low temperature melting glass frit powder and 0.1 to 20 parts by weight of a binder are mixed,

Wherein all of the pores in the first molding material of the ceramic heat dissipating member are present as open pores and have a relative density of 50% to 93%.

On the other hand, as a method for manufacturing the ceramic heat radiation member according to claim 1,

(a) having an average particle size 10um SiC _powder, Al ₂ O _3, the frit (firt) powder _{(composition; CaO: Na 2 O: B} 2 O 3: SiO 2 = 20: 10: 25: 45), the water Preparing a 10% aqueous solution of a dissolved organic polymer binder (PVA); and

(b) SiC: Al ₂ O ₃ : frit: PVA = 80: 5: 14: 1 (weight ratio) and water milling using alumina balls for 8 to 12 hours to obtain a raw material powder And proceeding with the mixing.

(C) After drying in step (b), water is completely removed, molded using a square metal mold having a diameter of 20 mm, and sintered in air at 500 to 700 ° C for 1 to 3 hours using a sintering furnace 1 < / RTI >

Either side of the first formed body formed by plasticization is thinly coated with a slurry (mixed with water) mixed with SiC particles in an amount of 0.1 to 1.5 탆 or less in the step (a), dried, and then dried at 800 to 1200 Lt; 0 > C for 0.5 to 2 hours to form a second formed body.

The present invention provides a ceramic heat dissipating member having a dual structure and a manufacturing method of the ceramic heat dissipating member and a method of manufacturing the ceramic heat dissipating member according to the present invention by providing a first molded body having a first density and a ceramic at a low density, By forming the second formed body including ceramics having a second density higher than the first density and being bonded to a part or all of the surface of the first formed body so as to effectively increase the emissivity by maximizing the thickness of the first molded body, It is possible to manufacture a ceramic heat-radiating member having a dual structure of a certain size or thickness without using a common molding material and using a common material in a continuous process, thereby greatly reducing the production cost, Competitiveness can be secured.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a ceramic heat dissipating member having a dual structure according to the present invention. FIG.
2 is a cross-sectional photograph and enlarged view of a ceramic heat dissipating member having a dual structure according to the present invention.
Fig. 3 [A] is a perspective view of a heat generating body bonded example of a ceramic heat dissipating member having a dual structure according to the present invention.
Fig. 3 [B] is a perspective view of a bonding example of a heating element and a diamond layer of a ceramic radiating member having a dual structure according to the present invention.
4 (A) is a result table according to an embodiment of a ceramic heat dissipating member having a dual structure according to the present invention.
4 (B) is a flow chart of a method of manufacturing a ceramic heat radiation member having a dual structure according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

While the present invention has been described in connection with certain embodiments, it is obvious that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term " comprising " or " consisting of ", or the like, refers to the presence of a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

In describing a ceramic heat-radiating member having a dual structure according to the present invention and a method of manufacturing the ceramic heat-radiating member according to the present invention,

In the state as it is, the vertical and horizontal directions are divided, and in the detailed description of the onset related to the other drawings and the claims, the direction is specified according to this standard.

FIG. 1 is a cross-sectional view of a ceramic heat dissipating member having a dual structure according to an embodiment of the present invention and a cross section of the heat dissipating member according to an embodiment of the present invention. ≪ / RTI > The manufacturing method of the ceramic heat dissipating member having the dual structure of FIG. 1 and the sectional structure of the heat dissipating member are merely for illustrating the present invention, and the present invention is not limited thereto. The manufacturing method of the ceramic heat dissipating member Sectional structure of the heat-radiating member can be modified into various forms.

As can be seen in Figure 1,

The ceramic heat-radiating member having a dual structure according to the present invention forms a first formed body having a first density and containing ceramics,

A ceramic heat dissipating member having a dual structure can be manufactured by forming a second formed body coupled to a part or all of the surface of the first molded body and having a second density higher than the first density and including a ceramic.

In the ceramic heat dissipating member having a dual structure according to the present invention, the first formed body and the second formed body are formed by sintering a first mixed material and a second mixed material,

The first mixed material is composed of a ceramic having an average particle diameter of 5 to 30 μm, a frit having a particle size of 0.1 to 10 μm, and a binder. The ceramics and the frit may have the same or different diameters. The binder may be composed of 10% aqueous solution binder by mixing water.

The second mixed material is composed of a ceramic having an average particle diameter of 0.1 to 1.5 .mu.m, a frit of 0.1 to 10 .mu.m, and a binder. The ceramics and the frit may have the same or different diameters. The binder may be composed of 10% aqueous solution binder by mixing water. More preferably, the second mixed material is composed of ceramics having an average particle diameter of 0.2 to 1.0 μm, 0.1 to 10 μm frit, and a binder.

The first and for the second formed body 1 and the second honhapjae each of alumina (Al ₂ O _3), mullite _{(3Al 2 O 3 · SiO 2} ), silicon carbide (SiC), aluminum nitride (AlN), diamond 3 to 30 weight of frit composed of part or all of the clay, bentonite-based clay, low-temperature melting glass frit powder raised with respect to 100 parts by weight of ceramics consisting of particles or part of c-BN (cubic boron nitride) And 0.1 to 20 parts by weight of a binder.

As shown in FIG. 3, a diamond layer may be further included on part or all of the exposed surface of the second molded body to drastically increase the thermal conductivity of the ceramic heat dissipating member.

The diamond layer is located on the exposed surface of the second molded body and directly contacts the heating member to conduct heat. This heat moves through the diamond layer to the second formed body having the second density and the first formed body having the first density. The heat transferred to the first molded body having the first density having a high emissivity is rapidly diffused and the temperature of the heating member can be drastically lowered. The diamond particles of the diamond layer have a size of 0.2 mm or more and 2 mm or less.

All of the pores in the first molding material of the ceramic heat dissipating member are present as open pores while the relative density of the first molding material is 50 to 93% to maximize heat dissipation of the first molding, The heat can be efficiently discharged.

As a method for manufacturing a ceramic heat-radiating member having a dual structure,

(SiC powder _, Al ₂ O _{3 ,} firt powder (composition: CaO: Na ₂ O: B ₂ O _3: SiO ₂ = 20: 10: 25: 45) _, a step (a) of preparing a 10% aqueous solution of an organic polymer binder (PVA) dissolved in water and

(B) (step (b)) in which water is used as a dispersion medium and ball milling is performed using alumina balls to make mixing of the raw material powders with a molar ratio of SiC: Al ₂ O ₃ : frit: PVA = 80: 5: . The ball milling is preferably carried out at an average of 9 hours to 11 hours. It is more preferable that the ball milling is performed for 10 hours.

The method of manufacturing a ceramic heat dissipating member having a double structure according to the present invention

After the step (b), the water is completely removed by drying, and the resultant is molded using a square metal mold having a diameter of 20 mm, and is sintered in air at 500 to 700 ° C. for 1 to 3 hours using a sintering furnace to form a first formed body and,

Either side of the first formed body formed by plasticization is thinly coated with a slurry (mixed with water) mixed with SiC particles in an amount of 0.1 to 1.5 탆 or less in the step (a), dried, and then dried at 800 to 1200 Lt; 0 > C for 0.5 to 2 hours to form a second formed body.

It is preferable that the first compact is sintered in the air at 600 ° C for 1 to 3 hours by using a sintering furnace and more preferably is calcined in air at 600 ° C for 2 hours.

When the slurry is coated with the slurry after the step (c) and then dried, it is preferable to leave 5% of the total physical components in order to increase the formability, rather than completely dry the physical component. More preferably, it is dried to leave 4% of the total mass. Even more preferably, it is dried to leave 3% of the total amount of the components. Even more preferably to leave 2% of the total mass. Most preferably, it is preferable to dry to leave 1% of the entire physical component.

The present invention can be produced through various manufacturing processes, but specific embodiments are described.

Example 1

SiC powder having a ceramic average particle size of 10 [mu] m is prepared in order to produce a first compact having a first density. A glass frit powder (composition: CaO: Na ₂ O: B ₂ O _3: SiO ₂ = 20: 10: 25: 45) and a press which is added to give a large grain SiC powder to give a bonding force under low- An organic polymer binder (PVA) to be added for imparting moldability during molding is prepared. Organic polymer binders (PVA) are dissolved in water to make a 10% PVA solution.

The first molded product had a composition of SiC: Al ₂ O ₃ : frit: PVA = 80: 5: 14: 1 (weight ratio), and water was used as a dispersion medium for 10 hours by ball milling with alumina balls, . Thereafter, the material components were dried and molded using a square metal mold having a diameter of 20 mm. In this case, leaving 1 ~ 5% of the total material content increases the formability, rather than completely drying the physical component. The final shape of the molded first ceramic formed article was 20 X 20 X 2.5 mm. The first formed body thus produced was first sintered in air at 600 for 2 hours using a sintering furnace.

Generally, in the case of carbide (SiC), sintering is performed in an inert atmosphere to prevent oxidation during sintering. However, in the present invention, thermal emissivity is used rather than thermal conductivity. Partial oxidation at the surface of carbide greatly affects .

And the second density is higher than the first density of the first molded body and is densified without any open pores. Thus, the circuit structure of the electrode or the like A step of forming a second formed body is prepared.

The second molded body is configured to have the same composition as that of the first molded body, except that only one side of the first molded body subjected to the calcination at 600 ° C in a slurry (mixed with water) in which only SiC particles are mixed using raw material powder of 0.2 to 1um or less Apply thinly. The first formed body thinly coated with the slurry of the same composition is dried and then sintered at 1000 ° C for 1 hour to form a second formed body.

The second molded body may have a densified surface on which one surface of the first formed body is discarded, and the electrode configuration is not problematic.

In order to evaluate the function of the ceramic heat-radiating member made of the above-described double structure, the heat radiation characteristics were evaluated using a simple and effective evaluation method of heat radiation characteristics.

First, the heat dissipation at the high temperature side of a Peltier thermoelectric device that emits heat of 3 W (drive current I x drive voltage V = 3 W) is applied to a ceramic heat dissipating member (Size: 20 x 20 x 2.5 mm), applying a driving power of 3 watt to the thermoelectric element for 15 minutes, and then heating the opposite side of the thermal element (the lower temperature side: the opposite surface to which the ceramic heat radiation member is adhered) And measured using a thermocouple.

Next, the temperature of the terminal surface of the low temperature side of the Peltier thermoelectric device was measured using the same thermocouple 15 minutes after the application of the thermoelectric element alone with the driving power of 3 W (W). At this time, the surface temperature of the low-temperature side terminal of the thermoelectric element to which the ceramic heat-radiating member was not attached increased to 96 to 98. When the ceramic heat radiation member manufactured by the present invention was attached, the same low temperature side surface temperature of the thermoelectric element was reduced to 65 to 67. On the other hand, when the aluminum metal radiator plate of the same size (20 × 20 × 2.5 mm) was attached and measured under the same conditions, the surface temperature of the thermoelectric device was 73~76. Therefore, it can be seen that the ceramic heat-radiating member made of the double structure manufactured by the present invention has better heat radiation ability (T = 8) than the metallic aluminum radiating plate.

Example 2

SiC powder having an average particle size of 10 [mu] m is prepared in order to prepare a first compact having a first density. A frit powder (composition: CaO: Na ₂ O: B ₂ O ₃ : SiO ₂ = 20: 10: 25: 45) was added to give SiC powder having an average particle size of 10 袖 m in order to impart a bonding force under low temperature sintering conditions. And kaolin (bentonite) = 2: 1 weight ratio blend, bentonite is added to increase moldability and moldability in molding to give formability in press molding.

The composition of the member was as follows: SiC: Al ₂ O ₃ : frit: clay = 65: 15: 6.6: 13.4 (weight ratio), and water milling using alumina balls for 10 hours . The water was then completely dried and molded using a square metal mold 15 mm in diameter. The final shape of the molded first molded product was 20 x 20 x 2.5 mm. The first formed body thus produced was usually sintered in the air at 1050 ° C for 3 hours using a sintering furnace. In the case of carbide (SiC), sintering is generally performed in an inert atmosphere to prevent oxidation during sintering. However, in the present invention, thermal emissivity is used rather than thermal conductivity. Partial oxidation at the surface of carbide greatly affects the final heat dissipation characteristics. I can not go crazy.

And the second density is higher than the first density of the first molded body and is densified without any open pores. Thus, the circuit structure of the electrode or the like A step of forming a second formed body is prepared.

The second molded body is formed to have the same composition as that of the first molded body, and only one side of the first molded body is thinly coated with a slurry (mixed with water) mixed with SiC raw material powder having an average particle size of 0.2 to 1 um. The first formed body thinly coated with the slurry of the same composition is dried and then sintered at 1000 캜 for one hour, which is lower than the sintering temperature of the first formed body, to form the second formed body. By making the sintering temperature of the second formed article lower than the sintering temperature of the first formed article, the dimension after sintering of the ceramic heat dissipating member can be controlled more precisely.

The second molded body may have a densified surface that does not cause a problem in the electrode configuration and has a similar result as the effect measured in the first embodiment can do.

Also, as can be seen in Figure 1,

The ceramic heat-radiating member made of a double structure according to the present invention is composed of a first formed body and a second formed body.

The first shaped body having the first density and containing ceramic maximizes the emissivity, not the thermal conductivity of the ceramic, and is bonded to a part or all of the surface of the first shaped body and has a second density higher than the first density of the first shaped body The second molded body including ceramics can be configured as an electronic circuit and can obtain excellent thermal conductivity, so that the production process is simple and the production cost is low, thereby securing the market competitiveness of the product.

Unlike the conventional method of manufacturing the ceramic heat dissipating member, the first formed body is formed by sintering a first mixed material composed of ceramics having an average particle diameter of 5 to 15 μm, a frit having a thickness of 0.1 to 10 μm, and a binder It is possible to provide a low-density substrate having a maximized specific surface area and make full use of the emissivity of the ceramic,

The second formed body is formed by sintering a second mixed material composed of ceramics having an average particle diameter of 0.1 to 1.5 um and a frit and a binder of 0.1 to 10 um so that a circuit configuration such as an electrode can be formed and a thermal conductivity is improved, It is possible to absorb heat to be discharged and to more easily induce heat transfer to the first molded body,

As a result, there is no need for a separate metal material mixing process, and the cost of raw material powder is extremely low, and mass production is possible, which can greatly enhance price competitiveness of the product.

In order to maximize the heat dissipation effect, the present invention minimizes the heat transfer resistance due to the interface between the heat generating component and the heat dissipating ceramic heat dissipating member and forms a single layer of diamond particles having a predetermined size or more on the ceramic heat dissipating member Or by chemical vapor deposition (CVD).

That is, diamond particles of a predetermined size or more having a good thermal conductivity are arranged on one surface of a ceramic heat-radiating member that contacts the heat-generating component to maximize the heat transfer from the heat-generating component (semiconductor and LED package) to the ceramic heat- Lt; / RTI &

And the diamond coating is coated through the vapor phase chemical synthesis method to increase the thermal conductivity at the contact surface. In this case, a separate step for forming a dense surface (second dense body) on at least one side of the low-density ceramic heat-dissipating member may be omitted, or may be coated on a dense face (a part or all of the second formed body) . That is, in the surface coated with the diamond coating, all of the open pores are filled with diamond particles to have a fully densified surface.

In the present invention, there is a difference in being able to provide a ceramic heat dissipating member made of a double structure and a ceramic heat dissipating member slimmed by bonding a diamond layer to the exposed surface of the first molded body or the second molded body of the ceramic heat dissipating member. It is possible to provide a ceramic heat dissipating member having a high emissivity at an inexpensive price.

In the above description, conventionally known techniques relating to the ceramic heat dissipating member and the manufacturing method thereof are omitted, but it is possible to easily guess, deduce, and reproduce the ceramic heat dissipating member.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention. Changes and substitutions are to be construed as falling within the scope of protection of the present invention.

S: a ceramic heat-radiating member made of a double structure M:
10: first formed article 20: second formed article
S100: a Step S200: Step b
S300: Step c

Claims (7)

delete A first formed body having a first density and including a ceramic;
And a second formed body coupled to a part or all of the surface of the first formed body and having a second density higher than the first density and including ceramics,
The first formed body is formed by sintering a first mixed material composed of ceramics having an average particle diameter of 5 to 30 um, a frit and a binder of 0.1 to 10 um,
Wherein the second molded body is formed by sintering a second mixed material composed of a ceramic having an average particle diameter of 0.1 to 1.5 um, a frit having a thickness of 0.1 to 10 um, and a binder. 3. The method of claim 2,
And a diamond layer is further formed on part or all of the exposed surface of the second molded body. The method according to claim 2 or 3,
Each of the first and second mixing materials for the first and second formed bodies
Consist of any or all of the alumina (Al ₂ O _3), mullite _{(3Al 2 O 3 · SiO 2} ), silicon carbide (SiC), aluminum nitride (AlN), diamond particles, c-BN (cubic boron nitride) 100 parts by weight of the ceramic

3 to 30 parts by weight of frit composed of a part or all of clay, clay of bentonite, and low-temperature melting glass frit powder,
And 0.1 to 20 parts by weight of a binder are mixed with each other.
3. The method of claim 2,
Wherein all of the pores in the first molding material of the ceramic heat dissipating member are present as open pores and the relative density of the first molding material is 50% to 93%.
A first formed body having a first density and including a ceramic;
And a second formed body coupled to a part or all of the surface of the first formed body and having a second density higher than the first density and containing ceramics, the method comprising:
(a) having an average particle size 10um SiC _powder, Al ₂ O _3, the frit (firt) powder _{(composition: CaO: Na 2 O: B} 2 O 3: SiO 2 = 20: 10: 25: 45), the water Preparing a 10% aqueous solution of dissolved organic polymeric binder (PVA);
(b) SiC: Al ₂ O ₃ : frit: PVA = 80: 5: 14: 1 (weight ratio) and water milling using alumina balls for 8 to 12 hours to obtain a raw material powder Progressing the mixing;
Wherein the ceramic heat-dissipating member has a double structure. The method according to claim 6,
(c) After the step (b), the material components are dried, molded using a square metal mold having a diameter of 20 mm, plasticized in air at 500 to 700 ° C for 1 to 3 hours using a sintering furnace, Forming,
Either side of the first formed body formed by plasticization is thinly coated with a slurry (mixed with water) in which only SiC particles are mixed in an amount of 0.1 to 1.5 .mu.m or less in the step (a), dried, and then dried at 800 to 1200.degree. And sintering the sintered body for 0.5 to 2 hours to form a second formed body.

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