KR101368838B1 - Illuminating device - Google Patents

Abstract

The present invention includes at least one light emitting unit formed on a printed circuit board, a resin layer formed on the light emitting unit to bury the light emitting unit and to diffuse the light emitted from the light emitting unit to the front, wherein the resin layer By providing a lighting device formed of a high heat-resistant resin containing an oligomer, the effect of improving the product reliability by minimizing the lowering of the brightness even under high temperature environment, the effect of reducing the overall thickness of the product and the product design by securing flexibility It has the effect of improving the design freedom.

Description

ILLUMINATING DEVICE

The present invention relates to the field of lighting devices, and more particularly, to a structure of a lighting device that can form a high heat-resistant resin layer instead of a light guide plate to reduce the overall thickness and ensure light efficiency.

The LED (Light Emitted Diode) device is a device that converts electrical signals to infrared rays or light using the characteristics of compound semiconductors. Unlike fluorescent light, unlike harmful substances such as mercury, it does not cause environmental stigma. It has a long lifetime advantage. In addition, it consumes low power compared to conventional light sources, has high visibility due to high color temperature, and has a small glare.

Therefore, the current illumination device has been developed to use a conventional light source such as a conventional incandescent lamp or a fluorescent lamp as a light source. In particular, as disclosed in Korean Patent Laid-Open No. 10-2012-0009209, A light emitting device that performs a surface light emitting function is provided.

1 and 2 schematically show a conventional lighting apparatus 1 which performs a surface light emitting function. 1 and 2, a conventional lamp device 1 includes a substrate 20 on which a planar light guide plate 30 is disposed and a plurality of side-type LEDs 10 are formed on a side surface of the light guide plate 30. [ (Only one) are arranged in an array form.

The light L incident on the light guide plate 30 from the LED 10 is reflected by the reflective sheet 40 in a fine reflection pattern provided on the bottom surface of the light guide plate 30 and is emitted from the light guide plate 30, 30 to provide light to the outside through the transparent outer housing 50 and the like. 2, a plurality of diffusion sheets 31, prism sheets 32, 33, and a protective sheet 34, etc. are provided between the light guide plate 30 and the outer housing 50, The optical sheet of the present invention may be further added.

The light guide plate 30 functions to improve the brightness of the illumination device 1 and to supply uniform light. The light guide plate 30 is provided with a light source It is one of the plastic molded lenses that uniformly transmits the diverging light. Therefore, although the light guide plate 30 is basically used as an essential part of the conventional lighting apparatus 1, the thickness of the overall product can be reduced due to the thickness of the light guide plate 30 itself, It is difficult to apply to the outer housing 50 formed by bending due to the inability of its own material to be flexible, and thus the product design and deformation of the design are not easy.

Korean Patent Publication No. 10-2012-0009209

The present invention has been proposed in order to solve the above-mentioned conventional problems, by using a resin layer without using a light guide plate, and forming a resin layer with a high heat resistant resin to prevent a decrease in luminance even in a high temperature environment, and to reduce the overall thickness. It is an object of the present invention to provide a lighting device structure.

Another object of the present invention is to provide a structure of a lighting apparatus which can ensure reliability while improving the degree of freedom of product design by making the lighting apparatus itself flexible.

According to an aspect of the present invention, there is provided a lighting apparatus comprising: at least one light emitting unit formed on a printed circuit board; And a resin layer formed on the light emitting unit to bury the light emitting unit and to diffuse the light emitted from the light emitting unit to the front. The resin layer may be made of a high heat resistant resin including an oligomer.

In the lighting device of the present invention, the oligomer is made of 40 to 55 parts by weight, urethane acrylate (Urethane Acrylate), epoxy acrylate (Epoxy Acrylate), polyester acrylate (Polyester Acrylate), polyether acrylate ( Polyether Acrylate), polybutadiene acrylate (Polybutadiene Acrylate), silicon acrylate (Silicon Acrylate) may comprise at least one.

In the lighting apparatus of the present invention, the resin layer may further comprise 65 to 90 parts by weight of the monomer.

In the lighting apparatus of the present invention, the monomer is 35 to 45 parts by weight of IBOA (isobornyl acrylate), 10 to 15 parts by weight of 2-Hydroxyethyl methacrylate (2-HEMA), and 2-HBA (2-Hydroxybutyl Acrylate) to 15 to 20 parts by weight. It may consist of a mixture comprising parts by weight.

In the lighting apparatus of the present invention, the resin layer may further include 0,5 to 1 parts by weight of the photoinitiator.

In the illumination device of the present invention, the resin layer may be formed of at least one selected from the group consisting of sillicon, silla, glass bubble, PMMA, urethane, Zn, Zr, Al ₂ O ₃ , acryl, And a bead made of any one selected from among the beads.

In the illuminating device of the present invention, the light emitting unit may be a side view type light emitting diode.

The lighting apparatus of the present invention may further include a diffusion plate formed on the resin layer.

In the illumination apparatus of the present invention, a first spacing portion may be formed between the resin layer and the diffusion plate, wherein the first spacing portion may be formed in a range of 0 to 20 micrometers or less.

The lighting apparatus of the present invention may further include a reflective sheet formed on the printed circuit board and having a structure penetrated by the light emitting unit.

In the illuminating device of the present invention, a reflection pattern may be further formed on the reflection sheet.

In the illumination apparatus of the present invention, the reflection pattern may be formed of a reflective ink containing any one of TiO ₂ , CaCo _{3 ,} BaSo 4, Al ₂ O _{3 ,} Silicon, and PS.

The illumination device of the present invention may further comprise a first optical sheet formed on the upper surface of the resin layer and dispersing the light emitted thereon, and a second optical sheet may be further formed on the first optical sheet.

The illumination device of the present invention may further include an adhesive layer formed between the first optical sheet and the second optical sheet.

In the illuminating device of the present invention, the adhesive layer may be formed of any one of a thermosetting PSA, a thermosetting adhesive, and a UV cured PSA type material.

In the illuminating device of the present invention, the adhesive layer may be provided with a second spaced portion.

In the illuminating device of the present invention, an optical pattern may be further formed on the upper surface of the first optical sheet or the lower surface of the second optical sheet to shield or reflect the light to be emitted.

In the illumination apparatus of the present invention, the optical pattern may be formed by a diffusion pattern formed using a light-shielding ink containing at least one material selected from TiO ₂ , CaCO ₃ , BaSO ₄ , Al ₂ O ₃ , and Silicon, A light shielding pattern formed by using a light shielding ink containing a mixed material of Al and TiO ₂ may have a superimposed structure.

In the illumination apparatus of the present invention, the diffusion pattern may be formed in a structure printed on at least one of the upper surface and the lower surface of the light-shielding pattern.

In the lighting apparatus of the present invention, the printed circuit board may be a flexible printed circuit board.

According to the present invention, by removing the light guide plate and guiding light by using the resin layer, it is possible to reduce the number of light emitting units and to reduce the overall thickness of the lighting apparatus.

In addition, according to the present invention, by forming a resin layer of a high heat-resistant resin, it has an effect that can provide a stable lighting effect and a reliable lighting device despite the heat emitted from the light emitting unit.

In addition, the lighting device can be implemented to have flexibility, thereby increasing the degree of freedom of product design.

In addition, according to the present invention, by providing a reflective sheet and a reflective pattern which is a structure capable of efficiently reflecting the light emitted from the light emitting unit, thereby providing a uniform surface light source and the effect of maximizing the luminance improvement with the improved light reflectance It can work.

Further, according to the present invention, by forming a first optical substrate or a second optical substrate having an optical pattern, and having an air gap in the adhesive layer, it is possible to eliminate the occurrence of hot spots and dark areas generated in the light shielding pattern portion. In addition, the reliability between the adhesive layer and the parts to be bonded is secured, and at the same time, it is possible to realize a lighting device without significant differences in optical characteristics, and precise alignment between parts is possible.

Figures 1 and 2 schematically illustrate a conventional illumination device structure.
3 shows a main part of a lighting apparatus according to the present invention.
Fig. 4 shows a structure in which a reflecting sheet is added to the lighting apparatus of the present invention shown in Fig.
Fig. 5 shows a structure in which an optical substrate is added to the illumination apparatus of the present invention shown in Fig.
6 schematically illustrates a structure in which the lighting apparatus according to the present invention is applied to a vehicle headlight.
7 is a graph showing the luminance reduction rate of the resin layer according to the present invention under a certain temperature.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the embodiments described herein and the configurations shown in the drawings are only a preferred embodiment of the present invention, and that various equivalents and modifications may be made thereto at the time of the present application. DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention. The following terms are defined in consideration of the functions of the present invention, and the meaning of each term should be interpreted based on the contents throughout this specification. The same reference numerals are used for portions having similar functions and functions throughout the drawings.

The present invention relates to a lighting apparatus using LED as a light source as a light emitting unit, and by removing the light guide plate, and replacing it with a resin layer made of a high heat-resistant resin, to realize a stable luminance even in a high temperature environment, innovatively reducing the overall thickness On the other hand, it is an object of the present invention to provide a lighting device structure that can secure flexibility and reduce the number of light sources.

In addition, the lighting device according to the present invention is applicable to various lamp devices requiring illumination, such as a vehicle lamp, a domestic lighting device, and an industrial lighting device. For example, when it is applied to a vehicle lamp, it can be applied to a headlight, a vehicle interior light, a door scarf, a rear light, and the like. In addition, the lighting apparatus of the present invention can be applied to a backlight unit field applied to a liquid crystal display, and can be applied to all lighting-related fields that are currently developed, used, or can be implemented according to future technological developments.

3 shows a main part of a lighting apparatus according to the present invention.

3, a lighting apparatus 100a according to the present invention includes at least one light emitting unit 130 formed on a printed circuit board 110 and a printed circuit board 110, and a light emitting unit 130 formed on the light emitting unit 130 And a resin layer 150 for embedding the light emitting unit 130 and guiding the emitted light forward. The diffuser plate 150 may be configured to diffuse the light incident from the resin layer 150 uniformly, (290). Although not shown in the drawings, a prism sheet, a protective sheet, or the like may be further provided on the upper or lower portion of the diffusion plate 290.

The printed circuit board 110 may be a flexible printed circuit board (FPCB) to secure certain flexibility in the present invention.

The light emitting units 130 are arranged on the printed circuit board 110 in at least one number and emit light. The light emitting unit 130 of the present invention may be a side view type light emitting diode. That is, a light emitting diode having a structure in which the direction of light to be emitted is not directed straight up directly but is emitted toward the side, can be used as the light emitting unit 130 of the present invention. According to the illumination apparatus 100a of the present invention, since the light emitting unit 130 including the side-type light emitting diode is disposed directly under the light emitting unit 100a, the resin layer realizing the light diffusion and reflection function is utilized, It is possible to reduce the total number of the light emitting units, and the total weight and thickness of the lighting apparatus can be innovatively reduced.

The resin layer 150 is formed on the printed circuit board 110 and the light emitting unit 130. The resin layer 150 spreads the light emitted from the light emitting unit 130 forward. That is, the resin layer 150 is formed to embed the light emitting unit 130, thereby performing the function of dispersing the light emitted laterally in the light emitting unit 130. That is, the function of the conventional light guide plate can be performed in the resin layer 150.

Such a resin layer 150 of the present invention, basically may be made of a resin of a material capable of diffusing light, in particular in the present invention may be made of a high heat-resistant resin containing an oligomer, the content of such oligomer is 40 to It may consist of 55 parts by weight. In addition, urethane acrylate (Urethane Acrylate) may be used as the material forming the oligomer, but is not limited thereto. In addition, epoxy acrylate, polyester acrylate, and polyether acrylate may be used. At least one material of polybutadiene acrylate (Polybutadiene Acrylate) and silicon acrylate (Silicon Acrylate) may be used.

Particularly, when urethane acrylate is used as an oligomer, two different types of urethane acrylate are mixed and used to realize different properties at the same time. For example, in the process of synthesizing urethane acrylate (Isocyanate) isocyanate (Isocyanate) is used, the physical properties of the urethane acrylate (Urethane Acrylate) is determined by the isocyanate (yellowing, weather resistance, chemical resistance, etc.) . At this time, any one type of urethane acrylate (Urethane Acrylate) is implemented as Urethane Acrylate type-Isocyanate, but the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is 37% (hereinafter referred to as 'first oligomer' Implement another type of urethane acrylate (Urethane Acrylate) as Urethane Acrylate type-Isocyanate, so that NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is 30-50% or 25-35% (Hereinafter, 'second oligomer'), an oligomer of the present invention can be formed. According to this, the first oligomer and the second oligomer having different physical properties can be obtained according to NCO% control, and the oligomer formed in the resin layer 150 of the present invention can be mixed by mixing them. At this time, the weight ratio of the first oligomer in the oligomer is 15 to 20, the weight ratio of the second oligomer may be implemented in the range of 25 to 35.

Meanwhile, the resin layer 150 may further include a monomer and a photoinitiator. More specifically, 35 to 45 parts by weight of isobornyl acrylate (IBOA), 10 to 15 parts by weight of 2-HEMA (2-hydroxyethyl methacrylate), 2 to 2 parts by weight of 2-hydroxybutyl Acrylate) in an amount of 15 to 20 parts by weight. In addition, in the case of a photoinitiator (for example, 1-hydroxycyclohexyl phenyl-ketone, Diphenyl), Diphwnyl (2,4,6-trimethylbenzoyl phosphine oxide, etc.) may be composed of 0.5 to 1 parts by weight.

When the resin layer 150 is formed of the material as described above, the heat resistance is enhanced, so that the luminance deterioration due to heat can be minimized even when used in a lighting device that emits high temperature heat, thereby providing a reliable lighting device. Will be. In addition, by removing the light guide plate and replacing it with a resin layer, it is possible to innovatively reduce the thickness occupied by the conventional light guide plate, thereby realizing the thinning of the entire product and having a flexible material to the curved surface Benefits include ease of application, design freedom, and other flexible displays.

The resin layer 150 of the present invention may further include a plurality of beads 151 having hollows (or voids) formed therein in a mixed and diffused form. The beads 151 may reflect and diffuse light, It plays a role of improving the characteristics. For example, when the light emitted from the light emitting unit 130 is incident on the bead 151 inside the resin layer 150, the light is reflected and transmitted by the hollow of the bead 151 to be diffused and condensed, ). At this time, the reflectance and diffusivity of the light are increased by the beads 151, so that the light quantity and the uniformity of the outgoing light supplied to the diffusion plate 290 are improved. As a result, the brightness of the illumination device can be improved.

The content of the beads 151 may be appropriately adjusted in order to obtain a desired light diffusing effect, and more specifically, the content of the beads 151 may be adjusted in a range of 0.01 to 0.3% based on the total weight of the resin layer 150, but is not limited thereto. . That is, the light emitted from the light emitting unit 130 in the lateral direction is diffused and reflected through the resin layer 150 and the beads 151 so that the light can travel upward. The bead 151 may be composed of any one selected from silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al2O3, and acrylic. The particle diameter of the bead 151 may be formed in the range of 1㎛ ~ 20㎛, but is not limited thereto.

The diffusion plate 290 is formed on the resin layer 150 and serves to uniformly diffuse the light emitted through the resin layer 150 over the entire surface. The diffusion plate 290 may be formed of an acrylic resin, but is not limited thereto. The diffusion plate 290 may be formed of a material such as polystyrene (PS), polymethylmethacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate ), And high-permeability plastic such as resin.

At this time, an air layer (first spacing portion) 280 may be further formed between the diffusion plate 290 and the resin layer 150 and may be supplied to the diffusion plate 290 due to the presence of the first spacing portion 280 The uniformity of light can be increased, and as a result, the effect of improving the uniformity of the light diffused and emitted through the diffusion plate 290 can be realized. At this time, in order to minimize the deviation of the light transmitted through the resin layer 150, the thickness (H1) of the first separation portion 280 may be formed in the range of more than 0 to 20mm, but is not limited thereto and appropriately if necessary Design change is possible.

Fig. 4 shows a structure 100b with a reflection sheet added to the illumination apparatus of the present invention shown in Fig.

3 and 4, the reflective sheet 120 of the present invention is formed on a top surface of a printed circuit board 110 and has a structure in which a light emitting unit 130 is formed to pass through. The reflective sheet 120 of the present invention is formed of a material having a high reflection efficiency, thereby reflecting light emitted from the light emitting unit 130 to an upper portion where the diffusion plate 290 is positioned, thereby reducing light loss. The reflective sheet 120 may be formed in a film form, and may include a synthetic resin dispersedly containing a white pigment in order to realize light reflection characteristics and light scattering characteristics. Examples of the white pigment include titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate and the like. As the synthetic resin, polyethyleneterephthalate, polyethylene naphthalate, acrylic resin, colicarbonate, polystyrene, polyolefin , Cellulosic acid acetate, weather-resistant vinyl chloride, and the like can be used, but the present invention is not limited thereto.

A reflection pattern 121 may be formed on the surface of the reflection sheet 120 and the reflection pattern 221 may scatter light and scatter the incident light to uniformly transmit light to the diffusion plate 290 . The reflection pattern 121 may be formed by printing on the surface of the reflective sheet 120 using a reflective ink containing any one of TiO ₂ , CaCo ₃ , BaSo 4, Al ₂ O _{3 ,} Silicon, and PS, no. In addition, the structure of the reflection pattern 121 may include a plurality of protruding patterns, and may be formed in a prism shape, a lenticular shape, a lens shape, or a combination thereof in order to increase the light scattering effect. It is not. In addition, the cross-sectional shape of the reflection pattern 121 may have a structure having various shapes such as a triangle, a quadrangle, a semicircle, and a sine wave.

Fig. 5 shows a structure 100c with an optical sheet added to the illuminating device of the present invention shown in Fig. Hereinafter, an optical sheet is described as being added to the structure shown in FIG. 4, but this is merely an example, and an optical sheet may be added to the illuminating device shown in FIG. 3, which is a structure without a reflective sheet.

3 to 5, the illumination apparatus 100c according to the present invention includes a first optical sheet 170 formed between a resin layer 150 and a diffusion plate 290 and formed on a resin layer upper surface 150, A second optical sheet 190 formed on the first optical sheet 170 and an adhesive layer 180 formed between the first optical sheet 170 and the second optical sheet 190, The second spacing portion 181 may be further formed on the second spacer 180. That is, the adhesive layer 180 forms a space (second spacing portion) 181 spaced around the optical pattern 183, and an adhesive material is applied to the other portion to form the first optical sheet 170 and the second optical sheet 183, (190) to each other. Further, an optical pattern 183 may be further formed on the upper surface of the first optical sheet 170 or on the lower surface of the second optical sheet 190, and one or more additional optical sheets may be additionally formed on the second optical sheet 190 It is also possible to do. The structure including the first optical sheet 170, the second optical sheet 190, the adhesive layer 180 and the optical pattern 183 can be defined as the optical pattern layer A. [

The optical pattern 183 may be formed as a light shielding pattern formed to prevent the light emitted from the light emitting unit 130 from concentrating. For this purpose, the optical pattern 183 may be arranged between the optical pattern 183 and the light emitting unit 130 And the first optical sheet 170 and the second optical sheet 190 are bonded to each other by using the adhesive layer 180 for securing the fixation force.

The first optical sheet 170 and the second optical sheet 190 can be formed using a material having a high light transmittance. For example, PET can be used.

The optical pattern 183 disposed between the first optical sheet 170 and the second optical sheet 190 basically functions to prevent the light emitted from the light emitting unit 130 from being concentrated. The optical pattern 153 may be formed in a light-shielding pattern so that a light-shielding effect can be realized in order to prevent the phenomenon that the light is excessively strong in strength and the optical characteristics are deteriorated or the yellow light is yellowish. The pattern may be formed by performing a printing process on the upper surface of the first optical sheet 170 or the lower surface of the second optical sheet 190 using light shielding ink.

The optical pattern 183 is not a function to completely block the light, but can be implemented so that the light shielding degree and the diffusing degree of the light can be controlled by one optical pattern so as to perform a function of partial shielding and diffusion of light. Furthermore, more particularly, the optical pattern 183 according to the present invention may be implemented with a superimposed printing structure of a complex pattern. The structure of superimposed printing refers to a structure in which one pattern is formed and another pattern is printed on the pattern.

For example, when the optical pattern 183 is implemented, at least one selected from TiO ₂ , CaCO ₃ , BaSO ₄ , Al ₂ O ₃ , and Silicon is formed on the lower surface of the polymer film (for example, the second optical sheet) A light-shielding pattern formed by using a light-shielding ink including a diffusion pattern formed using a light-shielding ink containing a substance and a mixed material of Al or Al and TiO ₂ . That is, it is also possible to form a diffusion pattern on the surface of a polymer film by white printing, and then form a light-shielding pattern thereon or a double structure in the reverse order. Of course, it will be obvious that the formation design of such a pattern can be variously modified in consideration of light efficiency, intensity, and shading ratio. Alternatively, it is also possible to form a light-shielding pattern, which is a metal pattern, in the middle layer in a sequential laminated structure, and to form a triplet in which a diffusion pattern is formed on the upper and lower portions, respectively. In such a triple structure, it is possible to select and implement the above-mentioned materials. As a preferable example, one of the diffusion patterns is realized by using TiO ₂ having excellent refractive index, and CaCO ₃ excellent in light stability and color is used together with TiO ₂ The light diffusing pattern can be realized and the light efficiency and homogeneity can be ensured through the triple structure which realizes a light shielding pattern by using Al which is excellent in concealment. Particularly, CaCO ₃ functions to reduce the exposure of yellow light and finally realize white light. Thus, it is possible to realize light with more stable efficiency. In addition to CaCO ₃ , particles such as BaSO ₄ , Al ₂ O ₃ , It is also possible to utilize inorganic materials having a large size and a similar structure. In addition, it is preferable that the optical pattern 183 is formed by adjusting the pattern density so that the pattern density becomes lower as the distance from the LED light source emission direction increases.

The adhesive layer 180 has a structure that surrounds the periphery of the optical pattern 183 and forms a second spacing portion 181 in the other portion or a structure in which the second spacing portion 181 is formed in the periphery of the optical pattern 183 So that the two optical sheets can be adhered to each other to form an array. In other words, the adhesive structure of the first optical sheet 170 and the second optical sheet 190 can also realize the function of fixing the printed optical pattern 183.

At this time, the adhesive layer 180 may be a thermosetting PSA, a thermosetting adhesive, or a UV cured PSA type material, but is not limited thereto.

The first spacing portion 280 may be formed between the second optical sheet 190 and the diffusion plate 170 in the description of FIG. 3, The uniformity of the light supplied to the plate 290 can be increased and consequently the uniformity of the light diffused and emitted through the diffuser plate 290 can be improved. At this time, in order to minimize the deviation of light transmitted through the resin layer 150, the thickness H1 of the first spacing part 280 may be formed in a range of 0 to 20 mm, but the present invention is not limited thereto. The design change is as described above in the description of FIG.

Although not shown in the drawings, it is described above that at least one optical sheet may be additionally formed on the optical pattern layer A as necessary.

6 schematically illustrates a structure in which the lighting apparatus according to the present invention is applied to a vehicle headlight.

Referring to FIG. 6, the lighting apparatus 100a according to the present invention is formed by using a flexible circuit board and a resin layer, and thus has a certain flexibility. Accordingly, as shown in FIG. 6, the curved headlight housing 300 can be easily mounted, and thus, even though the design freedom and the effect of improving the design freedom of the finished product combined with the housing are improved, the uniformity is uniform. It is possible to achieve the effect of ensuring the brightness and illuminance. Meanwhile, although FIG. 6 shows that the lighting device shown in FIG. 3 is mounted, this is only one example and the lighting device shown in FIGS. 4 and 5 may be mounted.

FIG. 7 is a graph illustrating a luminance reduction rate of a resin layer according to the present invention at a constant temperature, and more specifically, a luminance reduction rate Ra of a resin layer applied to a backlight unit according to a time change in an environment of 90 degrees Celsius, and the present invention. The graph shows a comparison of the luminance reduction rate R2 of the resin layer.

The resin layer applied to the backlight unit is made of a resin including 20 to 41% of a mixture of urethane acrylate oligomer and polyacryl, 30 to 63% of a monomer, and 1.5 to 6% of an additive. IBOA (isobornyl Acrylate) 10-21%, HBA (Hydroxybutyl Acrylate) 10-21%, HEMA (Hydroxy Metaethyl Acrylate) was made to include 10-21%.

Referring to FIG. 7, in the case of the resin layer applied to the backlight unit, it can be seen that the luminance decrease rate increases with time in a high temperature environment (90 degrees Celsius), and the luminance decrease occurs more than 20% even at room temperature. You can check it. On the other hand, in the case of the resin layer according to the present invention, it can be seen that the luminance reduction rate is wisely lower than that of the R1 graph under the same conditions, and even if the time of 1000hr is increased, the luminance reduction rate at room temperature is formed within 6%. have. According to this, the resin layer of the present invention can be seen that the reliability is secured even if applied to the lighting device is a high temperature heat dissipation, and as a result it can be confirmed that it is possible to provide a thin, flexible and improved reliability lighting device.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Those skilled in the art will appreciate that many suitable modifications and variations are possible in light of the present invention. Accordingly, all such modifications and variations as fall within the scope of the present invention should be considered.

110: printed circuit board
120: reflective sheet
121: reflection pattern
130: Light emitting unit
150: Resin layer
151: Bead
170: first optical substrate
180: Adhesive layer
181: second separation part
183: Optical pattern
190: second optical substrate
280: first separator
290: diffusion plate
300: housing

Claims (22)

One or more light emitting units on a printed circuit board;
And a resin layer filling the light emitting unit on the light emitting unit and diffusing the light emitted from the light emitting unit.
The resin layer includes an oligomer,
The oligomer,
40 to 55 parts by weight,
Urethane Acrylate, Epoxy Acrylate, Polyester Acrylate, Polyether Acrylate, Polybutadiene Acrylate, Silicon Acrylate Lighting device comprising at least any one of.
delete The method according to claim 1,
Wherein the resin layer comprises:
Lighting device further comprising 65 to 90 parts by weight of monomer.
The method of claim 3,
The monomer,
IBOA (isobornyl acrylate) 35 to 45 parts by weight, 2-HEMA (2-Hydroxyethyl methacrylate) 10-15 parts by weight, 2-HBA (2-Hydroxybutyl Acrylate) lighting device comprising 15 to 20 parts by weight.
The method of claim 4,
Wherein the resin layer comprises:
Lighting apparatus further comprises 0.5 to 1 part by weight of the photoinitiator.
The method according to claim 1,
Wherein the resin layer comprises:
And further comprising a bead made of any one selected from the group consisting of silicon (sillicon), silica (silla), glass bubble, PMMA, urethane, Zn, Zr, Al ₂ O ₃ , .
The method according to claim 1,
The light-
A lighting device comprising a side view type light emitting diode.
The method according to claim 1,
Lighting device further comprises a diffusion plate on the resin layer.
The method according to claim 8,
And a first spacing between the resin layer and the diffuser plate.
The method of claim 9,
Wherein the first spacing is in the range of greater than 0 to 20 micrometers.
The method according to claim 1,
And a reflective sheet on said printed circuit board.
The method of claim 11,
And a reflection pattern on the reflection sheet.
The method of claim 12,
Wherein the reflective pattern comprises a reflective ink comprising any one of TiO ₂ , CaCo ₃ , BaSo ₄ , Al ₂ O _3, Silicon, and PS.
The method according to claim 1,
And a first optical sheet for dispersing light on an upper portion of the resin layer.
The method according to claim 14,
And a second optical sheet on the first optical sheet.
16. The method of claim 15,
And an adhesive layer between the first optical sheet and the second optical sheet.
18. The method of claim 16,
The adhesive layer
Lighting device which is any one of thermosetting PSA, thermosetting adhesive, and UV curing PSA type material.
18. The method of claim 16,
Wherein the adhesive layer comprises a second spacing.
16. The method of claim 15,
And an optical pattern that shields or reflects light on the upper surface of the first optical sheet or the lower surface of the second optical sheet.
The method of claim 19,
In the optical pattern,
A diffusion pattern including a light shielding ink containing at least one material selected from TiO ₂ , CaCO ₃ , BaSO ₄ , Al ₂ O ₃ , and Silicon,
Wherein the light-shielding pattern including the light-shielding ink containing Al or a mixed material of Al and TiO ₂ has an overlapping structure.
The method of claim 20,
Wherein the diffusion pattern
And the light-shielding pattern is printed on at least one of the upper surface and the lower surface of the light-shielding pattern.
The method according to any one of claims 1 to 3,
And the printed circuit board is a flexible printed circuit board.

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