KR101348655B1 - Microfluid control device and method for manufacturing the same - Google Patents

Microfluid control device and method for manufacturing the same Download PDF

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Publication number
KR101348655B1
KR101348655B1 KR1020100077699A KR20100077699A KR101348655B1 KR 101348655 B1 KR101348655 B1 KR 101348655B1 KR 1020100077699 A KR1020100077699 A KR 1020100077699A KR 20100077699 A KR20100077699 A KR 20100077699A KR 101348655 B1 KR101348655 B1 KR 101348655B1
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South Korea
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control device
stage
microfluidic control
flow path
mold
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KR1020100077699A
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Korean (ko)
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KR20110107255A (en
Inventor
이대식
송현우
정광효
박선희
정문연
김승환
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한국전자통신연구원
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Priority to US13/050,106 priority Critical patent/US20110236277A1/en
Priority to CN201110071280.1A priority patent/CN102247786B/en
Publication of KR20110107255A publication Critical patent/KR20110107255A/en
Priority to US13/849,325 priority patent/US20130212882A1/en
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Publication of KR101348655B1 publication Critical patent/KR101348655B1/en

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Abstract

The present invention relates to a plastic microfluidic control device including a micro multi-stage channel and a manufacturing method thereof. The present invention provides a microfluidic control device comprising: a lower substrate; And a flow path substrate in contact with the lower substrate and having a multi-stage microchannel having at least two depths at a bonding surface with the lower substrate. According to the present invention, it is possible to provide a microfluidic control device for precisely controlling the fluid transfer by controlling the capillary force in the depth direction of the channel by controlling the fluid using a multi-stage microchannel having various channel depths. In addition, by repeating the photolithography process to form a multi-stage fine pattern and transfer it, it is possible to easily form a multi-stage micro-channel having a flat surface and precisely controlled channel height.

Description

Microfluidic control device and its manufacturing method {MICROFLUID CONTROL DEVICE AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a microfluidic control device and a method for manufacturing the same, and more particularly, to a plastic microfluidic control device including a multi-stage microchannel and a manufacturing method thereof.

Microfluidic control devices are important components in lab-on-a-chip applications such as protein chips, DNA chips, drug delivery systems, micro total analysis systems, and biological / Various applications have been made in chemical reactors.

According to the method of controlling the microfluid, a microactuating method for implementing a plastic micropump and a valve on a flow path or a chamber, and an electroosmotic method for driving a fluid by electroosmotic pressure by applying a voltage between the micro flow paths. The microfluidic control device can be implemented using an electrosmotic method, a capillary flow method, or the like.

For example, in the case of a microfluidic control element using a capillary flow method, the stopping, conveying, and conveying speed of the fluid are controlled by using attraction force or repulsive force generated by the surface tension between the inner surface of the fine tube and the fluid. As described above, in the case of controlling the fluid by using capillary force, there is an advantage that no separate driving body or additional power supply is required and there is almost no failure.

Recently, various structures of micro plastic microstructures applied to fluid control devices or biochips using capillary flow have been proposed. For example, a diagnostic biochip structure has been proposed in which a sample is transported using only a capillary force, the sample sequentially causes a reaction in a flow path and a chamber, and the reaction amount of the sample can be measured by an optical method. In addition, a method of controlling capillary force by providing a capillary force by installing a hexagonal micropillar structure having a uniform depth in the channel or by adjusting a channel width and an angle of a channel having a uniform depth is proposed.

Such a conventional microfluidic control device may be manufactured using a precision machining method such as a computer numerical control (CNC) process or a dry etching method of a semiconductor process.

However, the precision machining method has a problem that its surface is rough and there is a limit in producing a fine pattern, so that precise fluid control by capillary force is not easy. In addition, when manufacturing a microfluidic control device using a semiconductor process, there is a problem that the manufacturing cost is high because the difficulty of the process is high and the manufacturing time is long.

On the other hand, since the microfluidic control device used for disease diagnosis is mainly used for single use, it is mostly manufactured based on a polymer. Conventionally, a microfluidic control device based on a polymer is manufactured by directly processing a polymer or manufacturing a mold and transferring the polymer to the polymer.

However, when manufacturing a microfluidic control device using a polymer, there is a problem that it is not easy to control the surface shape of the microchannel. In addition, since static or small particles adhere to the surface of the channel or the characteristics of the surface of the channel change with time, there is a problem in that reproducibility is low in controlling the moving speed of the fluid.

The present invention has been proposed to solve the above problems, and an object of the present invention is to provide a microfluidic control device and a manufacturing method for controlling the microfluid using a multi-stage microchannel.

The present invention proposed to achieve the above object is a microfluidic control device, the lower substrate; And a flow path substrate in contact with the lower substrate and having a multi-stage microchannel having at least two depths at a bonding surface with the lower substrate.

In addition, the present invention provides a method for manufacturing a microfluidic control device, comprising: forming a mold having a multi-stage fine pattern; Transferring the multistage fine patterns of the mold to the flow path substrate to form multistage fine channels having at least two depths; And bonding the flow path substrate and the lower substrate on which the multi-stage microchannels are formed.

According to the present invention, it is possible to provide a microfluidic control device for precisely controlling the fluid transfer by controlling the capillary force in the depth direction of the channel by controlling the fluid using a multi-stage microchannel having various channel depths. In addition, by repeating the photolithography process to form a multi-stage fine pattern and transfer it, it is possible to easily form a multi-stage micro-channel having a flat surface and precisely controlled channel height.

Therefore, it is possible to control fluids reproducibly and precisely by using a vertical ultra-multi-level structure, and the microfluidic control device of the present invention and its manufacturing method are protein chip, DNA chip, drug delivery system, microbiological / chemical analysis system. It can be applied to various lab-on-a-chip biodevices including micro biochemical reactors.

1A and 1B are views showing the structure of a microfluidic control device according to an embodiment of the present invention.
1C and 1D are diagrams illustrating the microfluidic control principle of the microfluidic control device according to an embodiment of the present invention.
2A to 2F are cross-sectional views illustrating a method for manufacturing a mold prototype according to an embodiment of the present invention.
3 is a cross-sectional view illustrating a method of forming a mold according to an embodiment of the present invention.
4A to 4D are cross-sectional views illustrating a method of forming a flow path substrate according to an exemplary embodiment of the present invention.
5A and 5B are cross-sectional views illustrating a bonding step between a flow path substrate and a lower substrate according to an exemplary embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments described below can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to enable those skilled in the art to more fully understand the present invention. In the drawings, the thicknesses of the layer regions can be exaggerated relative to the actual thickness in order to make it clear. Also, where a layer is said to be on another layer or substrate, it may be formed directly on another layer or substrate, or a third layer may be placed therebetween. Throughout the examples, the same reference numerals denote the same elements.

1A and 1B are views showing the structure of a microfluidic control device according to an embodiment of the present invention. FIG. 1A is a perspective view and FIG. 1B is a sectional view taken along line II ′ of FIG. 1A.

As shown, the microfluidic control device 100 according to an embodiment of the present invention is in contact with the lower substrate 120 and the lower substrate 120 and has a multi-stage having at least two depths at the bonding surface with the lower substrate 120. It includes a flow path substrate 110 having a fine channel 150 of. Here, the flow path substrate 110 may further include a fluid inlet 130 and an outlet 140, and may further include a separate hole for circulating air to help transport of the fluid. In addition, the lower substrate 120 may further include a sensor, a reaction unit, and the like.

The flow path substrate 110 and the lower substrate 120 are preferably formed of a polymer, and may be formed of a polymer of the same structure or a polymer of a different structure.

The multi-stage microchannel 150 is a microchannel 150 having various depths according to positions, and the depth of the channel is adjusted by a plurality of multi-steps. Here, the width (W) and the height (H) of each stage (152, 154, 156, 158) can be variously changed depending on the purpose of use and application of the microfluidic control device. Therefore, the capillary force can be precisely controlled according to the position of the channel through the width and height of each stage (152, 154, 156, 158).

For example, by differently defining channel depths such as a part to which the fluid is to be transferred quickly and a part to stop the fluid for the reaction, the fluid can be precisely and reproducibly controlled. Therefore, it is preferable that the height H of each stage 152,154,156,158 is 1-1000 micrometers, and the width W of each stage 152,154,156,158 is 1-100000 micrometers.

In addition, the surface of the multi-stage microchannel 150 is preferably chemically or physically treated for hydrophobicity or hydrophilicity control.

1C and 1D are diagrams illustrating the microfluidic control principle of the microfluidic control device according to an embodiment of the present invention. FIG. 1C is a perspective view of a multistage microchannel, and FIG. 1D is a view comparing the cross-sectional areas of the multistage microchannels. to be.

As shown in FIG. 1C, the microfluidic control device 100 according to an exemplary embodiment adjusts channel depths D1 and D2 of the microchannels. That is, the capillary force can be controlled in the depth direction by forming the channel of the microfluidic control device 100 in a multistage structure to have various depths.

In addition, the microfluidic control device 100 according to an embodiment of the present invention may adjust the channel widths W1, W2, and W3 together with the depths D1 and D2 of the channels. Therefore, the capillary force can be more precisely controlled by simultaneously adjusting the channel widths W1 and W2 and the channel depths D1 and D2.

For example, the capillary force may be reduced by increasing the channel depth D1 and / or the channel width W1 in the section to increase the conveying speed of the fluid. In addition, the capillary force may be increased by reducing the channel depth D2 and / or the channel widths W2 and W3 in the fluid stop, the valving section, or the section to reduce the feed rate.

As shown in FIG. 1D, by simultaneously adjusting the channel widths W1> W3> W2 and the channel depths D1> D2, the cross-sectional area of the microchannels through which the microfluid passes can be effectively reduced. For example, rather than controlling only the channel width W1> W3> W2 to reduce the cross-sectional area (W1 * D1> W3 * D1> W2 * D1) of the fine channel, the channel width (W1> W3> W2) and the channel are reduced. In the case of controlling the depths D1> D2 simultaneously, the cross-sectional area W1 * D1> W3 * D2> W2 * D2 of the microchannels can be more effectively reduced.

In this way, by using the adjustment factors in the horizontal direction and the depth direction, it is possible to more precisely and reproducibly control the stopping, valving, conveying, and merging of the fluid. In particular, when it is necessary to control an extremely small amount of fluid, such as a chip used for early diagnosis of a disease, chemical analysis, etc. in the field of bio-microelectromechanical devices (Bio-MEMS), a multi-stage microchannel according to an embodiment of the present invention is provided. The application enables more precise analysis by precisely and reproducibly controlling very small amounts of fluid.

In addition, in the case of controlling the capillary force only in the horizontal direction, the size of the chip is increased because the width and shape of the channel must be adjusted. However, the present invention does not increase the size of the chip because the capillary force can be controlled in the depth direction. There is an advantage.

On the other hand, in manufacturing a microfluidic control device including a multi-stage microchannel, a machining or a semiconductor process can be used. However, when machining is used, the reproducibility of fluid control may be inferior because of the roughness of the channel due to the nature of the process. In addition, in the case of a semiconductor process, a smoother surface may be realized than in machining, but due to the nature of the process, only a channel having a depth of 1 μm or less can form a channel, thereby limiting the formation of channels having various depths. It is expensive and has low productivity compared to disposable plastic chip products. Hereinafter, a method of manufacturing a microfluidic control device suitable for forming a multistage microchannel will be described with reference to the drawings.

2A through 5B are cross-sectional views illustrating a method of manufacturing a microfluidic control device according to an embodiment of the present invention.

According to one embodiment of the present invention, after forming a mold prototype having a multi-stage fine pattern, a mold having a multi-stage fine pattern is formed using the mold prototype. Subsequently, the multi-stage fine pattern of the mold is transferred to the flow path substrate to form multi-stage fine channels having at least two depths. Subsequently, the microfluidic control apparatus is manufactured by bonding the flow path substrate and the lower substrate on which the multistage microchannels are formed.

According to the present invention, when manufacturing the microfluidic control device by transferring the multi-stage fine pattern of the mold to the flow path substrate, the surface of the channel is smooth, the advantages of high fluid control reproducibility, low manufacturing cost and high productivity have. In addition, since the depth of the channel can be adjusted in a variety of micro to centimeters, the capillary force can be precisely controlled to more precisely control the fluid.

2A to 2F are cross-sectional views illustrating a method for manufacturing a mold prototype according to an embodiment of the present invention.

As shown in FIG. 2A, after the photoresist 220 is coated on the silicon substrate 210, a mask pattern 230 is formed on the photoresist 220.

Here, the photoresist 220 may be an epoxy-based photoresist. The epoxy-based photoresist 220 may easily form a desired pattern by an exposure process, and may not be damaged or deformed even after additionally performing an exposure operation after thermal curing, and thus an accurate pattern may be formed. It is preferable to use a photoresist of the SU-8 series, which is a representative epoxy photoresist.

The thickness of the applied photoresist 220 is adjusted according to the viscosity of the photoresist, the number of revolutions per minute of the spin coating equipment, and the time. For example, it is preferable to apply the photoresist 220 at a rotational speed of 500 to 5000 rpm, and the thickness of the applied photoresist 220 is preferably in the range of 1 to 100 μm.

The width W of the fine pattern is determined according to the width W4 of the mask pattern 230, and the width W2 of the mask pattern 230 is preferably 1 to 100,000 μm.

As illustrated in FIG. 2B, the mask pattern 230 may be exposed and developed as an etch barrier to form a primary pattern 220A. In this case, the forming of the primary pattern 220A is preferably performed by a photolithography process having a resolution of 1 μm or more.

Subsequently, the primary pattern 220A is solidified through thermosetting. Here, the thermosetting process is preferably performed before and after the developing process.

As a result, a mold prototype having a fine pattern is formed, and the photoresist coating, mask pattern formation, fine pattern formation, and curing steps may be repeatedly performed to form a multistage fine pattern.

As shown in FIG. 2C, after the photoresist 240 is applied on the entire structure of the resultant including the solidified primary pattern 220A, a mask pattern 250 is formed on the photoresist 240.

As illustrated in FIG. 2D, the mask pattern 250 may be exposed and developed as an etch barrier to form a second pattern 240A. Subsequently, the secondary pattern 240A is solidified through thermosetting.

As shown in FIG. 2E, after the photoresist 260 is applied to the entire structure of the resultant including the solidified secondary pattern 240A, a mask pattern 270 is formed on the photoresist 260.

As shown in FIG. 2F, the third pattern 260A is formed by performing exposure and development processes on the mask pattern 270 as an etch barrier. Subsequently, through the thermosetting, the tertiary pattern 260A is solidified.

As a result, a mold prototype 200 having three fine patterns is manufactured. Here, the number of stages of the fine pattern may be variously adjusted according to the number of repetitions of the process, and the shape of the fine pattern may be variously adjusted according to the shape of the mask patterns 230, 250, and 270.

3 is a cross-sectional view illustrating a method of forming a mold according to an embodiment of the present invention.

As shown in FIG. 3, the mold 300 is formed by using the mold prototype 200 having multiple fine patterns. For example, the metal mold may be formed by an electroplating process, and after forming the seed thin film on the mold prototype 200, it is preferable to form the metal mold by the electroplating process.

Here, the seed thin film may be formed of a metal such as Ti, Cr, Al, Au, or the like, and may be formed of a single layer or a double layer or more of these metals. In addition, the mold 300 is preferably formed to a sufficient thickness so as not to bend or break during the subsequent transfer process.

Subsequently, although not shown in the drawing, the mold prototype 200 is removed by a wet etching process.

4A through 4D are cross-sectional views illustrating a method of forming a flow path substrate according to an exemplary embodiment of the present invention.

As shown in FIG. 4A, a mold 300 having multiple fine patterns and a substrate 400 for transferring multiple fine patterns formed on the surface of the mold 300 are prepared.

Here, the substrate 400 is preferably a polymer substrate, for example, cyclo olefin copolymer (COC), polymethylmethacrylate (PMMA), polycarbonate (PC), cyclo olefin polymer (COP), liquid crystalline polymers (LCP), or PDMS. (polydimethylsiloxane), PA (polyamide), PE (polyethylene), PI (polyimide), PP (polypropylene), PPE (polyphenylene ether), PS (polystyrene), POM (polyoxymethylene), PEEK (polyetheretherketone), PES (polyethylenephthalate), Polyethylenephthalate (PET), polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polyvinylidene fluoride (PVDF), polybutyleneterephthalate (PBT), fluorinated ethylenepropylene (FEP) or perfluoralkoxyalkane (PFA). Or it may be formed of a heterogeneous material combining them.

In addition, the substrate 400 may be formed by injection molding, hot embossing, casting, stereolithography, laser ablation, rapid prototyping, and silk screen processing. Or by conventional machining methods such as NC (Numerical Control) machining or semiconductor processing methods using a photolithography process.

As shown in FIG. 4B, the multi-stage fine pattern of the mold 300 is transferred to the substrate 400.

For example, when using the substrate 400 formed of a polymer, it is preferable to transfer multiple fine patterns using injection molding, hot embossing, or casting. Through this, the multi-stage fine pattern having a complicated shape can be easily transferred to the polymer substrate 400 to form the flow path substrate 400A having the multi-stage fine channels. As such, when the multi-stage fine channels are formed on the polymer substrate 400 by a transfer method, channel depths of several micrometers to several centimeters may be realized.

As shown in FIG. 4C, after the transfer of the multi-stage fine pattern to the flow path substrate 400A is completed, the mold 300 is removed. In this drawing, a multistage microfluidic channel formed on the surface of the flow path substrate 400A is indicated by reference numeral 410.

As shown in FIG. 4D, the flow path substrate 400A is etched to form a fluid inlet 420 for fluid injection and a fluid outlet 430 for fluid outflow. In this drawing, the flow path substrate on which the fluid inlet 420 and the fluid outlet 430 are formed is shown by reference numeral 400B. In addition, although not shown in the drawing, it may further form a hole for the distribution of air.

5A and 5B are cross-sectional views illustrating a bonding step between a flow path substrate and a lower substrate according to an exemplary embodiment of the present invention.

As shown in FIG. 5A, the flow path substrate 400B and the lower substrate 500 provided with the multi-stage microfluidic channel 410 are prepared.

Here, the lower substrate 500 is preferably formed of a polymer like the flow path substrate 400B, and the flow path substrate 400B and the lower substrate 500 may be the same or different polymer substrates. Examples of the material of the lower substrate 500 are the same as described above with respect to the flow path substrate 400B.

In addition, the flow path substrate 400B and the lower substrate 500 may be formed of a material having the same hydrophobicity or hydrophilicity, or may be formed of a material having different hydrophobicity or hydrophilicity. Alternatively, portions of the surfaces of the flow path substrate 400B and the lower substrate 500 may be formed of materials having different hydrophobicity or hydrophilicity. As such, the surface velocity of the flow path substrate 400B and the lower substrate 500 may be adjusted to control the moving speed of the fluid.

As shown in FIG. 5B, the microfluidic control device is manufactured by bonding the flow path substrate 400B and the lower substrate 500 to each other.

Here, when the flow path substrate 400B and the lower substrate 500 are formed of the same material, it is preferable to join the flow path substrate 400B and the lower substrate 500 by a fusion bonding method using heat, chemicals, or ultrasonic waves.

In addition, when the flow path substrate 400B and the lower substrate 500 are formed of different materials, the flow path substrate 400B and the lower substrate (using a liquid adhesive material or a thin plate-like adhesive material such as powder or paper) may be used. It is preferable to join 500).

In particular, it is possible to use an ultraviolet curing agent, it is preferable to use a pressure sensitive adhesive (bonding) to proceed only in the case where the bonding at room temperature or low temperature is required in order to prevent the biochemical material is modified in the bonding step.

It is to be noted that the technical spirit of the present invention has been specifically described in accordance with the above-described preferred embodiments, but it is to be understood that the above-described embodiments are intended to be illustrative and not restrictive. In addition, it will be understood by those of ordinary skill in the art that various embodiments are possible within the scope of the technical idea of the present invention.

100: microfluidic control device 110: flow path substrate
120: lower substrate 130: inlet
140: outlet 150: multistage microchannel
152,154,156,158: stage 200: mold prototype
210: silicon substrate 220,240,260: photoresist
220A: Primary Pattern 240A: Secondary Pattern
260A: 3rd pattern 230,250,270: mask pattern
300: mold 400: upper substrate
400A, 400B: Euro substrate 410: Multi-stage fine channel
420: fluid inlet 430: fluid outlet
500: lower substrate

Claims (14)

A lower substrate; And
A flow path substrate in contact with the lower substrate; And
Multi-stage microchannels positioned between the lower substrate and the flow path substrate and having different depths depending on positions by multi-stage fine patterns formed on the surface of the flow path substrate.
/ RTI >
And a capillary force in a depth direction of the microchannel according to the depth of the microchannel.
The method of claim 1,
The multi-stage fine channel is
Capillary force is adjusted in the depth direction of the channel
Microfluidic Control Device.
The method of claim 1,
The height of one stage of the multi-stage microchannel is 1 to 1000 μm
Microfluidic Control Device.
The method of claim 1,
The width of one stage of the multi-stage microchannel is 1 to 100000 μm
Microfluidic Control Device.
The method of claim 1,
The flow path substrate and the lower substrate are polymer substrates having the same or different polymer structure.
Microfluidic Control Device.
The method of claim 1,
The plurality of multistage microchannel surfaces are chemically treated for hydrophobicity or hydrophilicity control.
Microfluidic Control Device.
Forming a mold having a multi-stage fine pattern having a different depth depending on the position;
Transferring the multi-stage fine pattern of the mold to the bottom surface of the flow path substrate to form multi-stage fine channels having different depths according to positions; And
Bonding the bottom surface and the lower substrate of the flow path substrate on which the multi-stage microchannels are formed;
Method of manufacturing a microfluidic control device comprising a.
The method of claim 7, wherein
The flow path substrate and the lower substrate are polymer substrates having the same or different polymer structure.
Method for manufacturing microfluidic control device.
The method of claim 7, wherein
The bonding step is to bond the flow path substrate and the lower substrate using an adhesive or ultrasonic bonding method.
Method for manufacturing microfluidic control device.
The method of claim 7, wherein
The mold forming step,
Forming a mold prototype having a multi-stage fine pattern; And
Forming a metal mold by an electroplating process using the mold prototype.
Method for manufacturing microfluidic control device.
The method of claim 10,
The mold circle forming step,
Applying a photoresist to the surface of the silicon substrate;
Patterning the photoresist to form a fine pattern; And
Curing the fine pattern
Lt; / RTI >
Repeating the photoresist coating step, the mask pattern forming step, the fine pattern forming step and the curing step to form the multi-stage fine pattern
Method for manufacturing microfluidic control device.
12. The method of claim 11,
The photoresist is epoxy series or SU-8 series
Method for manufacturing microfluidic control device.
The method of claim 10,
The metal mold forming step,
Forming a seed thin film on the mold prototype;
Forming the metal mold by the electroplating process; And
Removing the mold prototype by a wet etching process
Method of manufacturing a microfluidic control device comprising a.
The method of claim 7, wherein
The transfer step is performed by casting, injection molding, hot embossing or casting
Method for manufacturing microfluidic control device.
KR1020100077699A 2010-03-24 2010-08-12 Microfluid control device and method for manufacturing the same KR101348655B1 (en)

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US13/050,106 US20110236277A1 (en) 2010-03-24 2011-03-17 Microfluid control device and method of manufacturing the same
CN201110071280.1A CN102247786B (en) 2010-03-24 2011-03-24 Microfluid control device and method for manufacturing the same
US13/849,325 US20130212882A1 (en) 2010-03-24 2013-03-22 Microfluid control device and method of manufacturing the same

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