KR101318434B1 - Led lighting apparatus - Google Patents

Abstract

An LED lighting device is disclosed. LED lighting device according to the present invention is a LED, a power supply unit for supplying power to the LED, a heat dissipation unit for cooling the heat generated by the LED, the cover surrounding the cover and the cover surrounding the LED, the power supply and the heat dissipation unit and the outside to cover the housing Include.

Description

LED lighting device {LED LIGHTING APPARATUS}

The present invention relates to an LED lighting device.

A light emitting diode (LED) is a semiconductor device that emits light when a voltage is applied in a forward direction. The principle of light emission is electroluminescence, which injects electrons and holes by an electric field and emits light upon recombination.

Compared to other lighting devices such as fluorescent lamps, halogen lamps and incandescent lamps, the LED lighting device consumes low power, has a fast response speed, and is environmentally friendly and has high efficiency. The trend is active.

However, LEDs need to be provided with heat dissipation means to generate a lot of heat when high power is required, and to dissipate this heat to the outside of the LED lighting device. The disadvantage is that performance is greatly reduced.

In general, LED lamps that are commonly encountered, as shown in Figure 1, by using a heat conducting medium having a large heat dissipation area such as heat sink (Heat Sink) heat conduction heat generated from the LED after the air circulation inside and outside the LED lamp It adopts heat dissipation structure that emits heat generated from LED to outside air.

By the way, in the case of the heat dissipation structure through the air circulation inside and outside the LED lamp, the heat dissipation efficiency may be higher than the heat dissipation structure only through the heat conduction, but foreign substances such as dust contained in the outside air are introduced into the LED lamp, Performance may be degraded.

International Publication No. WO2011 / 109088 (September 9, 2011)

The present invention is to provide an LED lighting device that can block the inside of the LED lighting device to the outside air to prevent foreign matters such as dust contained in the outside into the LED lighting device.

According to an aspect of the present invention, the LED, the power supply unit for supplying power to the LED, the heat dissipation unit for cooling the heat generated by the LED, the cover surrounding the cover and the cover surrounding the LED, the power supply unit and the heat dissipation unit and the outside to cover the housing Provided is an LED lighting device comprising.

Here, the cover includes a base formed with a ventilation hole, the heat dissipation portion is formed with an opening on one side and the other side is coupled to the base, an air flow passage for connecting the ventilation hole and the opening is formed inside the air flow passage It includes a guide member for guiding the flow of air, the LED is disposed on the outside of the guide member, it may be radiated by the air flowing through the air flow passage.

The heat dissipation part may further include an air circulation means for promoting the flow of air introduced into the air flow passage and a temperature sensor for sensing a temperature inside the air flow passage, and the air circulation means has a preset limit of the temperature detected by the temperature sensor. If it is above the value, it can be activated.

The heat dissipation part includes a heat sink, and may transfer heat generated from the LED to the heat sink.

The LED lighting device may further include an air circulation means installed between the cover and the housing to promote the flow of air in the housing.

The cover includes a base having a vent hole, and the heat dissipation part has a first insertion groove and a second insertion groove formed on both surfaces thereof, and a thermal base formed of a plate structure having an open central portion. A passage is formed and includes a first heat dissipation unit coupled to the center of the thermal base and a second heat dissipation unit coupled to the outer circumferential surface of the thermal base in the opposite direction to which the first heat dissipation unit is coupled in the thermal base, and the LED is stacked in the first insertion groove. It includes a printed circuit board and an LED chip mounted in the second insertion groove, the LED chip may be radiated by the air flowing through the air flow passage.

According to the embodiment of the present invention, the interior of the LED lighting device is blocked by the housing and the outside can be prevented from entering the interior of the LED lighting device foreign matters, such as dust contained in the outside air.

1 is a view showing a heat dissipation structure of a conventional LED lamp.
2 is a view showing an LED lighting apparatus according to a first embodiment of the present invention.
3 is a view showing the relationship between the area A and the surface temperature T2 at which convective heat transfer takes place in the LED lighting apparatus according to the first embodiment of the present invention.
4 is a view showing an LED lighting apparatus according to a second embodiment of the present invention.
5 is a view showing an LED lighting apparatus according to a third embodiment of the present invention.
6 is a view showing in detail the thermal base in the LED lighting apparatus according to the third embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, an embodiment of the LED lighting apparatus according to the present invention will be described in detail with reference to the accompanying drawings, in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and duplicated thereto The description will be omitted.

2 is a view showing an LED lighting apparatus according to a first embodiment of the present invention. 3 is a view showing the relationship between the area A and the surface temperature T2 where convective heat transfer takes place in the LED lighting apparatus according to the first embodiment of the present invention.

As shown in FIG. 2, the LED lighting apparatus 1000 according to the first embodiment of the present invention includes an LED 100, a power supply unit 200, a heat radiating unit 300, a cover 400, and a housing 500. Include. The cover 400 may include a base 410, and the heat dissipation part 300 may include a guide member 310, an air circulation means 320, and a temperature sensor 330.

In this case, the LED lighting apparatus 1000 according to the first embodiment of the present invention may perform a function as a general LED lamp with only the remaining configuration except for the housing 500. However, when the housing 500 is not present, as described above, foreign matters such as dust included in the outside air may flow into the LED lamp, thereby degrading the life and performance of the LED lamp.

Therefore, the present invention is a method for overcoming the above problems, the LED lighting device 1000 that is blocked by the outside air through the housing 500 to prevent foreign substances such as dust contained in the outside to be introduced into the interior. To provide.

The LED 100 is a part that emits light using electrical energy, and includes a printed circuit board (120 of FIG. 5) and an LED chip (110 of FIG. 5), or a package board and an LED packaged therein. It may be an LED package composed of a chip (110 of FIG. 5). In this case, the type, number, and arrangement of the LEDs 100 may be variously selected as necessary.

The power supply unit 200 supplies power to the LED 100 and may include a power supply device that can be applied to the LED lighting device 1000, such as a switching mode power supply (SMPS). .

In this case, at least a part of the power supply unit 200 may be accommodated inside the guide member 310 so as to be positioned in the air flow passage of the guide member 310. Thus, heat generated from the power supply unit 200 may be effectively discharged to the outside through the air flowing through the air flow passage. As described above, since a continuous flow of air is formed in the air flow passage, it is possible to prevent the power supply unit 200 from overheating and deteriorating performance.

The heat dissipation unit 300 is a portion for cooling the heat generated by the LED 100, and may include various heat dissipation structures using heat conduction or tropical flow phenomenon. Here, the heat dissipation unit 300 may include a guide member 310, and may further include an air circulation means 320 and a temperature sensor 330.

The detailed description of the guide member 310, the air circulation means 320 and the temperature sensor 330 will be described later.

The cover 400 is a portion surrounding the LED 100, the power supply unit 200, and the heat dissipation unit 300, and may primarily be for protecting the inside of the LED lighting apparatus 1000. Here, the cover 400 may include a base 410. A detailed description of the base 410 will be described later.

In this case, the cover 400 may be made of a material having sufficient strength to protect the LED 100, the power supply unit 200, and the heat dissipation unit 300, and all or part of the cover 400 may be an LED. It may be made of a material capable of transmitting light emitted from the (100). In addition, the cover 400 may be made of a material capable of diffusing light emitted from the LED 100, including a diffusion lens.

The housing 500 is a portion surrounding the cover 400 so that the cover 400 is blocked from outside air, and the foreign matter such as dust contained in the outside air is blocked by blocking the inside of the LED lighting device 1000 from the outside and the LED lighting device 1000. ) Can be prevented from entering the inside.

In this case, the housing 500 may be made of a material having sufficient strength to protect the cover 400, and all or part of the housing 500 may transmit light emitted from the LED 100. It can be made of a material. In addition, the housing 500 may be made of a material capable of diffusing light emitted from the LED 100, including a diffusion lens.

In addition, the housing 500 may be separated into at least two parts, and a coupling part 510 may be formed to allow the respective parts to be combined and totally sealed. In addition, a socket 520 connected to the power supply unit 200 may be formed in any one portion of the housing 500.

The base 410 is a part of the cover 400 and is coupled to the guide member 310. The base 410 has a vent hole connected to the air flow passage of the guide member 310. Heat generated from the LED 100 may be discharged to the outside of the cover 400 through the air flow passage and the ventilation hole. The base 410 may be made of a material having high thermal conductivity, such as a metal such as aluminum, or may be made of an insulating material such as a synthetic resin.

The guide member 310 may provide an air flow passage required for heat dissipation of the LED 100. That is, an opening is formed at one side of the guide member 310, the other side of the guide member 310 is coupled to the base 410, and an air flow passage connecting the opening and the ventilation hole to the inside of the guide member 310. Since it can be formed, the air flowing into the opening or the vent hole is thereby able to form a flow along the air flow passage.

In this case, the LED 100 may be disposed outside the guide member 310 to radiate heat by air flowing through the air flow passage.

Specifically, the air introduced into the air flow passage, which is an empty space therein, through the opening of the guide member 310 is heated by the heat generated by the LED 100 and transferred through the inner wall of the guide member 310 to naturally rise. Is discharged into the vent hole.

As the air inside the air flow passage rises as described above, relatively cool air flows in through the opening of the guide member 310 to fill the empty space. That is, relatively cool air is introduced through the opening of the guide member 310, and the flow of air discharged by being heated by the LED 100 is continuously generated.

In this case, the guide member 310 may be made of a material such as metal (for example, aluminum) having excellent thermal conductivity similar to the base 410.

In the present exemplary embodiment, the guide member 310 may be formed with a reflective surface that reflects and diffuses at least a portion of the light generated by the LED 100. That is, the outer surface of the guide member 310 may be used as a reflector to diffuse light.

On the other hand, in order to further increase the heat dissipation performance, a heat dissipation member may be additionally installed on the air flow passage of the guide member 310 to absorb heat generated from the LED 100 and discharge it to the air flowing through the air flow passage. have.

As such a heat dissipation member, a vibrating tubular heat pipe which is formed in a tubular shape and into which a working fluid is injected may be used. Specifically, the heat dissipation member is a heat pipe loop having a heat transfer part for contacting the inner wall of the LED 100 side of the guide member 310 and a heat dissipation part spaced apart from the heat transfer part to dissipate heat absorbed by the heat transfer part. May be arranged repeatedly.

That is, the plurality of heat pipe loops may have a spiral structure that repeatedly reciprocates between portions of the LED 100 side of the air flow passage inner space and portions spaced upwardly therefrom. Accordingly, since the surface area required for heat dissipation in a limited space can be secured as much as possible, through the space between the spiral structures of the plurality of heat pipe loops, the air can freely move and absorb the heat of the LED 100.

In addition, the plurality of heat pipe loops may be disposed radially about the central axis of the guide member 310. That is, the plurality of heat pipe loops having a helical structure may be rolled in an annular shape so that the heat dissipation portion may be disposed radially.

In other words, the heat dissipation unit that performs heat dissipation is disposed radially about the central axis of the annular structure. Therefore, the flow of air required for heat dissipation can be freed and heat dissipation with higher efficiency can be achieved.

The air circulation means 320 is a portion for promoting the flow of air introduced into the air flow passage, it is possible to adjust the air circulation rate between the inside and outside the cover 400 through the air circulation means (320). In this case, the air circulation means 320 may include both a device capable of sucking or releasing air through a wing or the like, such as a fan.

The temperature sensor 330 is a part for sensing a temperature inside the air flow passage, and may be for controlling whether the air circulation means 320 is driven. Specifically, the air circulation means 320 may operate when the temperature sensed by the temperature sensor 330 is greater than or equal to a preset limit value. That is, in this embodiment, the air circulation means 320 can be operated only when the temperature of the air flowing into the guide member 310 is increased.

The LED lighting apparatus 1000 according to the present exemplary embodiment may cool the heat generated by the LED 100. Hereinafter, a process of cooling the heat generated from the LED 100 by the LED lighting apparatus 1000 according to the present embodiment will be described in more detail with reference to Equation 1, Table 1, and FIG. 3.

Equation 1

Q = h · A · (T2-T1)

Q: Calories

h: convective heat transfer coefficient

A: Area where convective heat transfer takes place

T1: fluid temperature

T2: surface temperature

Equation 1 is Newton's law of cooling: heat in convective heat transfer (Q), convective heat transfer coefficient (h), area in which convective heat transfer occurs (A), surface temperature (T2), and fluid temperature ( The relationship between T1) is specified.

Here, two methods may be considered in order to increase the amount of heat Q transmitted convection. The first is to increase the convective heat transfer coefficient h, for example to increase the velocity of the fluid via forced circulation means. The second is to increase the area A in which convective heat transfer occurs.

In the case of the LED lighting apparatus 1000 according to the present embodiment, air convection occurs by the guide member 310 as described above, and in this process, heat generated from the LED 100 is transferred to the surface of the housing 500. I can deliver it.

On the other hand, when the heat generated from the LED 100 cannot be sufficiently transmitted to the surface of the housing 500 by the guide member 310 alone, the forced convection of air by the air circulation means 320 and the temperature sensor 330 In this process, heat generated in the LED 100 may be sufficiently transferred to the surface of the housing 500 in this process.

Here, as the power consumption W of the LED 100 increases, the amount of heat Q to be transmitted to the surface of the housing 500 also increases through forced convective heat transfer. In this case, the LED lighting apparatus 1000 according to the present exemplary embodiment increases the speed of forced convection in the housing 500 by using the air circulation means 320 and the temperature sensor 330, thereby increasing the speed of the LED 100. Heat generated in the can be smoothly transferred to the surface of the housing 500.

Meanwhile, natural convection of air is induced outside the surface of the housing 500 according to the temperature difference between the surface of the housing 500 and the outside air, and in this process, heat of the surface of the housing 500 may be cooled.

Here too, as the power consumption W of the LED 100 increases, the amount of heat Q to be cooled through natural convective transmission also increases. In this case, the LED lighting apparatus 1000 according to the present embodiment increases the area A in which natural convection heat transfer occurs by appropriately selecting the surface area of the housing 500, thereby smoothly cooling the heat on the surface of the housing 500. You can.

Area (A) Surface temperature (T2) 400㎡ 87.3 ℃ 500㎡ 75.1 ℃ 700㎡ 59.7 ℃ 950 mm2 50.3 ℃ 1,200㎡ 43.8 ℃

Table 1 is an experimental result of measuring the relationship between the area (A) and the surface temperature (T2) in which convective heat transfer occurs in the LED lighting apparatus 1000 according to the present embodiment. And this result is shown in FIG.

In this case, the LED 100 used a power consumption (W) of 125W, the experiment was performed with the temperature of the outside air of the fluid temperature (T1) is set to 24 ℃.

As shown in Table 1 and FIG. 3, it can be seen that the surface temperature T2 of the housing 500 decreases as the area A in which convective heat transfer occurs increases.

Based on the experimental results, since the LED lighting apparatus 1000 generally does not change the power consumption (W) of the LED 100 applied at the time of initial manufacture, when the surface area of the housing 500 is appropriately selected, the housing It can be seen that the surface temperature T2 of 500 can be adjusted within an acceptable range.

In particular, considering that the heat generated from the LED 100 is about 150 ° C., even if the surface area of the housing 500 in which convective heat transfer occurs is about 400 mm 2, there is a problem in the life and performance of the LED lighting device 1000. It can be seen that there is no.

4 is a view showing an LED lighting apparatus according to a second embodiment of the present invention.

As shown in FIG. 4, the LED lighting device 2000 according to the second embodiment of the present invention includes an LED 100, a power supply unit 200, a heat radiating unit 300, a cover 400, and a housing 500. It includes, and may further include an air circulation means 321 is installed between the cover 400 and the housing 500, unlike the LED lighting device 1000 according to the first embodiment of the present invention, the heat dissipation unit 300 ) May include a heat sink 340.

The heat sink 340 is a portion that receives heat generated from the LED 100 and emits it into the air. The heat sink 340 may be installed on a surface opposite to the light emitting surface of the LED 100. In this case, the heat sink 340 may be formed in a plurality of irregularities to increase the air contact area. In addition, similar to the guide member 310, the heat sink 340 may be made of a material such as a metal having excellent thermal conductivity (for example, aluminum).

Air circulation means 321 is installed between the cover 400 and the housing 500 to promote the flow of air in the housing 500, the only flow of air in the housing 500 through the heat sink 340 When the heat dissipation performance is insufficient, forced convection is caused to increase the heat dissipation performance.

Meanwhile, although FIG. 4 illustrates a configuration in which the air circulation means 321 is installed on one side of the inside of the housing 500, the air circulation means 321 is not necessarily limited thereto and may be installed on both sides as necessary. 321 may be variously arranged in the housing 500.

In the case of the LED lighting apparatus 2000 according to the present embodiment, as described above, after conducting heat generated from the LED 100 to the heat sink 340, such heat is transferred by air circulation in the housing 500. It may be delivered to the surface of the housing 500.

On the other hand, if the heat generated from the LED 100 by the heat sink 340 alone can not sufficiently transfer to the surface of the housing 500, forced convection of air occurs by the air circulation means 321, LED in this process Heat generated in the 100 can be sufficiently transferred to the surface of the housing 500.

Here, as the power consumption W of the LED 100 increases, the amount of heat Q to be transmitted to the surface of the housing 500 also increases through forced convective heat transfer. In this case, the LED lighting device 2000 according to the present embodiment increases the speed of forced air convection in the housing 500 by using the air circulation means 321, thereby housing the heat generated by the LED 100. It can be delivered smoothly to the surface of 500.

Meanwhile, natural convection of air is induced outside the surface of the housing 500 according to the temperature difference between the surface of the housing 500 and the outside air, and in this process, heat of the surface of the housing 500 may be cooled.

Here too, as the power consumption W of the LED 100 increases, the amount of heat Q to be cooled through natural convective transmission also increases. In this case, the LED lighting apparatus 2000 according to the present embodiment increases the area A where natural convective heat transfer occurs by appropriately selecting the surface area of the housing 500, thereby smoothly cooling the heat on the surface of the housing 500. You can.

In the LED lighting apparatus 2000 according to the second embodiment of the present invention, except that the heat dissipation unit 300 includes a heat sink 340, the LED lighting apparatus 1000 according to the first embodiment of the present invention. ) Are the same as or similar to each other, so a detailed description thereof will be omitted.

5 is a view showing an LED lighting apparatus according to a third embodiment of the present invention. 6 is a view showing in detail the thermal base in the LED lighting apparatus according to the third embodiment of the present invention.

5 and 6, the LED lighting device 3000 according to the third embodiment of the present invention includes the same or similar configuration as the LED lighting device 1000 according to the first embodiment of the present invention. The heat dissipation part 300 may include a thermal base 350, a first heat dissipation part 360, and a second heat dissipation part 370.

The thermal base 350 is made of a thermally conductive material, for example, aluminum, and may function as a part of the heat dissipation part 300 for dissipating heat generated from the LED chip 110 to the outside. In this case, the thermal base 350 may be formed in a plate-like structure in which first insertion grooves 351 and second insertion grooves 353 are formed on both surfaces thereof, and central portions thereof are open.

The first heat dissipation part 360 may have an air flow passage formed therein to allow air to flow in and out, and may be coupled to a central portion of the thermal base 350, and the second heat dissipation part 370 may have first heat dissipation in the thermal base 350. The unit 360 may be coupled to the outer circumferential surface of the thermal base 350 in the opposite direction to which the unit 360 is coupled.

Specifically, the first heat dissipation part 360 and the second heat dissipation part 370 are respectively coupled to the central portion and the outer circumferential surface of the thermal base 350 to perform a function of one heat dissipation part 300. That is, an opening is formed at one side of the first heat dissipation part 360 and the other side is coupled to the center of the thermal base 350, one side of the second heat dissipation part 370 is coupled to the base 410 and the other side is the thermal base. It may be coupled to the outer circumferential surface of (350).

As a result, since an air flow passage connecting the opening of the first heat dissipating part 360 and the second heat dissipating part 370 to the vent hole of the base 410 may be formed, the air flowing into the opening or the vent hole is It is possible to form a flow along the airflow passage.

In this case, the LED chip 110 is mounted on the thermal base 350, it may be radiated by the air flowing through the air flow passage. Specifically, the air introduced into the air flow passage, which is an empty space therein, through the opening of the first heat dissipation part 360 is heated by the heat generated by the LED chip 110 and transmitted through the thermal base 350 to be natural. As it rises up to be discharged to the vent hole of the base 410.

When the air inside the air flow passage rises as described above, relatively cool air flows in through the opening of the first heat dissipation part 360 to fill the empty space. That is, relatively cool air flows in through the opening of the first heat dissipation part 360, and the flow of air discharged by being heated by the LED chip 110 is continuously generated.

In this case, the first heat dissipation part 360 and the second heat dissipation part 370 may be made of a material such as a metal having excellent thermal conductivity (for example, aluminum), similar to the thermal base 350.

The printed circuit board 120 may be stacked in the first insertion groove 351, and the LED chip 110 may be mounted in the second insertion groove 353. In this case, at least one LED chip 110 may be connected to a circuit pattern of the printed circuit board 120 through an electrical connection means such as a wire 130, and each LED chip 110 may also be wired to each other. The LED chip 110 may be electrically connected to the circuit pattern of the printed circuit board 120 by being connected by an electrical connection means such as.

Meanwhile, although FIG. 6 illustrates a configuration in which one printed circuit board 120 is stacked on the thermal base 350, the present invention is not limited thereto, and the number and arrangement of the printed circuit boards 120 may be varied as necessary. You can choose.

As described above, the LED lighting apparatus 3000 according to the present embodiment conducts heat generated from the LED chip 110 to the thermal base 350 and then transfers the heat to the housing 500 through the air flow passage. By the internal air circulation it can be delivered to the surface of the housing 500.

In particular, the LED lighting device 3000 according to the present embodiment, since the air circulation through the air flow passage through the above-described structure can occur more efficiently, does not include a separate air circulation means (320 of FIG. 2). High heat dissipation can be achieved without the need.

In the LED lighting apparatus 3000 according to the third exemplary embodiment of the present invention, the heat dissipating unit 300 includes a thermal base 350, a first heat dissipating unit 360, and a second heat dissipating unit 370. Since the configuration is the same as or similar to the LED lighting apparatus 1000 according to the first embodiment of the present invention, a detailed description thereof will be omitted.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit of the invention as set forth in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.

100: LED
110: LED chip
120: printed circuit board
130: wire
200: power supply
300: heat dissipation unit
310: Guide member
320, 321: air circulation means
330: temperature sensor
340: heatsink
350: thermal base
351: first insertion groove
353: second insertion groove
360: first heat dissipation unit
370: second heat dissipation unit
400: cover
410: base
500: housing
510: coupling part
520: socket
1000, 2000, 3000: LED lighting device

Claims (6)

LED;
A power supply unit supplying power to the LED;
A heat dissipation unit for cooling the heat generated by the LED;
A cover surrounding the LED, the power supply unit, and the heat dissipation unit; And
A housing surrounding the cover to block the outside air from the cover;
Including,
The cover includes a base formed with a ventilation hole,
The heat-
An opening is formed at one side and the other side is coupled to the base, and an air flow passage connecting the vent hole and the opening is formed at the inside thereof to guide the flow of air introduced into the air flow passage;
Air circulation means for promoting the flow of air introduced into the air flow passage;
It includes a temperature sensor for sensing the temperature inside the air flow passage,
The LED is disposed outside the guide member, the LED is radiated by the air flowing through the air flow passage,
The air circulation means is activated when the temperature detected by the temperature sensor is more than a predetermined threshold value LED lighting device.
delete delete delete delete LED;
A power supply unit supplying power to the LED;
A heat dissipation unit for cooling the heat generated by the LED;
A cover surrounding the LED, the power supply unit, and the heat dissipation unit;
A housing surrounding the cover to block the outside air from the cover; And
A thermal base formed of a plate-like structure in which the center is open;
Including,
The cover includes a base formed with a ventilation hole,
The heat dissipation unit is formed in the air flow passage to enable the inflow and outflow of air is coupled to the thermal base,
The LEDs
A printed circuit board stacked on the thermal base and
It includes an LED chip mounted on the printed circuit board,
The LED chip is characterized in that the heat radiated by the air flowing through the air flow passage.

Images