KR101307553B1 - Organic Light Emitting Display - Google Patents

Abstract

The present invention provides a semiconductor device comprising: a substrate; A subpixel located on a substrate; And a multi passivation layer disposed to cover the subpixels, the organic layer and the inorganic layer alternately stacked, and the at least one moisture absorbing layer interposed therebetween.

Organic light emitting display, protective film, moisture absorption layer

Description

[0001] The present invention relates to an organic light emitting display,

The present invention relates to an organic light emitting display.

An organic light emitting display device used in an organic light emitting display device is a self-light emitting device having a light emitting layer formed between two electrodes positioned on a substrate.

In addition, the organic light emitting display device may include a top-emission method, a bottom-emission method, or a dual-emission method according to a direction in which light is emitted. It is divided into a passive matrix and an active matrix depending on the driving method.

The subpixels disposed in the organic light emitting display device include a switching transistor, a driving transistor, a capacitor, an anode, an organic light emitting layer, and a cathode. The subpixels having such a structure are susceptible to moisture or oxygen to form dozens of layers of multilayer protective films on the subpixels.

On the other hand, the conventional multi-layered protective film located on the sub-pixel is somewhat disadvantageous in terms of mass production, while minimizing the generation of pin holes and lengthening the path of moisture to penetrate to increase the penetration time into the cathode and the organic light emitting layer The life expectancy of the device was expected.

However, although the conventional multilayer protective film slightly increased the penetration time, it could not ultimately prevent the moisture to penetrate. For this reason, the protective film of the multilayer structure also showed below-expected results in terms of mass productivity and in terms of extending the life of the device, and an improvement solution to solve this problem should be provided.

SUMMARY OF THE INVENTION An object of the present invention is to provide an organic light emitting display device capable of preventing the deterioration of a device and extending the life of the device by applying a multi-protective film including a moisture absorbing layer. will be. In addition, the present invention provides an organic light emitting display device which can flexibly implement the device while minimizing the particle generation rate that can cause defects in the device during the manufacturing process.

The present invention as a problem solving means described above, the substrate; A subpixel located on a substrate; And a multi passivation layer disposed to cover the subpixels, the organic layer and the inorganic layer alternately stacked, and the at least one moisture absorbing layer interposed therebetween.

The multi-protective film may be stacked in order of a moisture absorbing layer, an organic layer, an inorganic layer, a moisture absorbing layer, an organic layer, and an inorganic layer so as to cover the subpixel.

The moisture absorption layer may have a thickness of 30 kPa to 500 kPa.

The moisture absorption layer may include lithium (Li), calcium (Ca), magnesium (Mg), barium (Ba), strontium (Sr), yttrium (Y), and cesium (Cs).

The inorganic layer may include aluminum oxide (Al 2 O 3), silicon nitride (SiN x), silicon oxide (SiO 2), silicon nitride (SiON), or silicon carbide (SiC).

The edge region of the multi passivation layer may be sealed with an inorganic barrier rib.

The edge region of the moisture absorbing layer may be located inward from the edge region of the inorganic layer.

The thickness of one of the moisture absorbing layers may be different from the other.

The thickness of the organic layer may be thicker than the thickness of the inorganic layer or the moisture absorbing layer.

The moisture absorbing layer can be deposited by a mask in a vacuum chamber.

On the other hand, the present invention, the substrate; A subpixel located on a substrate; And a multi passivation layer disposed to cover the subpixels and having at least one moisture absorbing layer interposed between the inorganic layer and the inorganic layer.

The moisture absorption layer may have a thickness of 0.05 μm to 1000 μm.

The moisture absorption layer may be formed of a polyvinyl alcohol or an organic metal compound.

The organometallic compound is a compound represented by the formula M (OR1) a, M consists of any one of Group 2, Group 3 or Group 4 elements, and R 1 is a substituted or unsubstituted monovalent chain hydrocarbon. Group, a monovalent aliphatic cyclic hydrocarbon group, a monocyclic or cyclic monovalent aromatic or heteroaromatic hydrocarbon group, wherein a is an integer of 2 when M is a group 2 element, a is a group of 3 In the case of an element, an integer 3 and a may be an integer 4 when M is a group 4 element.

The inorganic layer includes silicon oxide (SiO2), silicon oxynitride (SiOxNy), silicon nitride (SiNx), silicon carbide (SiOxCy), aluminum oxide (Al2O3), indium tin oxide (ITO), zinc oxide (ZnOx), It may be made of any one of aluminum zinc oxide (Al-ZnOx).

The inorganic layer and the moisture absorption layer may be formed of N (an integer of 2 or more).

The multi passivation layer may be stacked in order of an inorganic layer, a moisture absorption layer, an inorganic layer, a moisture absorption layer, and an inorganic layer so as to cover the subpixel.

The moisture absorbing layer may be formed by any one of dipping, spin coating, spray coating, dispensing, and screen printing.

The semiconductor device may further include a sealing substrate spaced apart from the substrate to seal the subpixel, wherein the substrate and the sealing substrate may be sealed by an adhesive member.

The adhesive member may include a first adhesive member positioned outside the substrate and the sealing substrate, and a second adhesive member positioned inside the first adhesive member and formed on the front surface of the substrate and the sealing substrate.

The present invention has the effect of providing an organic light emitting display device which can prevent the deterioration of the device and extend the life of the device by applying a multi-protective film including a moisture absorption layer. Furthermore, the present invention has the effect of providing an organic light emitting display device which may satisfy both aspects of not only the life of the device but also the mass production and the life of the device. In addition, there is an effect of providing an organic light emitting display device which can flexibly implement the device while minimizing the particle generation rate that can cause a defect in the device during the manufacturing process.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

≪ Embodiment 1 >

1 is a schematic cross-sectional view of an organic light emitting display device according to a first embodiment of the present invention, FIG. 2 is an enlarged view of region A of FIG. 1, FIG. 3 is an exemplary view of a multi passivation layer, and FIG. 4 is FIG. 5 is an enlarged view of region B of FIG. 6.

Referring to FIG. 1, an organic light emitting display device according to a first embodiment of the present invention may include a substrate 110. In addition, the substrate 110 may include a sub pixel 150 positioned on the substrate 110. In addition, the multi-layer protective layer 160 may be disposed to cover the sub-pixel 150 and the organic layer and the inorganic layer are alternately stacked, and the at least one moisture absorbing layer may be interposed therebetween.

The substrate 110 can be selected to have excellent mechanical strength and dimensional stability as a material for forming devices. As the material of the substrate 110, a glass plate, a metal plate, a ceramic plate or a plastic plate (polycarbonate resin, acrylic resin, vinyl chloride resin, polyethylene terephthalate resin, polyimide resin, polyester resin, epoxy resin, silicone resin, fluorine) Resin, etc.) is mentioned.

The subpixel 150 positioned on the substrate 110 may include a transistor including a switching transistor, a driving transistor, and a capacitor, and an organic light emitting diode positioned on the transistor.

Hereinafter, the subpixel 150 positioned on the substrate 110 will be described with reference to FIG. 2.

The buffer layer 111 may be positioned on the substrate 110. The buffer layer 111 may be formed to protect a thin film transistor formed in a subsequent process from an impurity such as an alkali ion or the like flowing out from the substrate 110. The buffer layer 111 may use silicon oxide (SiO ₂ ), silicon nitride (SiNx), or the like.

The gate 112 may be located on the buffer layer 111. The gate 112 is selected from the group consisting of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be made of one or an alloy thereof. In addition, the gate 112 is formed of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a multilayer made of any one or alloys thereof. In addition, the gate 112 may be a bilayer of molybdenum / aluminum-neodymium or molybdenum / aluminum.

The first insulating layer 113 may be positioned on the gate 112. The first insulating layer 113 may be, but is not limited to, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof.

The active layer 114 may be positioned on the first insulating layer 113. The active layer 114 may include amorphous silicon or polycrystalline silicon crystallized therefrom. Although not illustrated, the active layer 114 may include a channel region, a source region, and a drain region, and the source region and the drain region may be doped with P-type or N-type impurities. In addition, the active layer 114 may include an ohmic contact layer to lower the contact resistance.

The source 115a and the drain 115b may be positioned on the active layer 114. The source 115a and the drain 115b may be formed of a single layer or multiple layers. When the source 115a and the drain 115b are a single layer, molybdenum (Mo), aluminum (Al), chromium (Cr), and gold may be used. (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) may be made of any one or an alloy thereof. In addition, when the source 115a and the drain 115b are multiple layers, the double layer of molybdenum / aluminum-neodymium and the triple layer of molybdenum / aluminum / molybdenum or molybdenum / aluminum-neodymium / molybdenum may be used.

The second insulating layer 116 may be positioned on the source 115a and the drain 115b. The second insulating layer 116 may be a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof, but is not limited thereto. The second insulating layer 116 may be a passivation layer.

The above is a description of the batam gate type transistor as an example of a transistor located on the substrate 110. Hereinafter, the organic light emitting diode on the transistor will be described.

The first electrode 117 may be positioned on the second insulating layer 116. The first electrode 117 may be selected as an anode and may be made of transparent indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

The bank layer 120 may be positioned on the first electrode 117. The bank layer 120 may include an organic material such as benzocyclobutene (BCB) resin, acrylic resin, or polyimide resin. The bank layer 120 has an opening on the first electrode 117.

The organic emission layer 121 may be located in the opening of the bank layer 120. The organic emission layer 121 may be formed to emit one of red, green, and blue colors according to the sub-pixel 150.

The second electrode 122 may be positioned on the organic emission layer 121. The second electrode 122 may be selected as a cathode, and aluminum (Al) may be used, but is not limited thereto.

The multi passivation layer 160 is positioned on the sub pixel 150 to cover the sub pixel 150.

Hereinafter, the multi passivation layer 160 will be described in more detail with reference to FIGS. 3 and 4.

Referring to FIG. 3, the multi passivation layer 160 is formed by alternately stacking the organic layers 162 and 165 and the inorganic layers 163 and 166 and interposing at least one moisture absorbing layer 161. The moisture absorbing layer 161 may be deposited by a mask in the vacuum chamber, but the method is not limited thereto.

The thickness d1 of the moisture absorbing layer 161 may be 30 kPa to 500 kPa. When the thickness d1 of the moisture absorbing layer 161 is formed to be 30 kPa or more, the moisture absorbed into the organic layers 162 and 165 and the inorganic layers 163 and 166 positioned outside the moisture absorbing layer 161 may be absorbed. It is possible to solve the problem of deterioration or lifetime of pixels. When the thickness d1 of the moisture absorbing layer 161 is 500 kPa or less, the organic layers 162 and 165 and the inorganic layer positioned outside the moisture absorbing layer 161 within the range in which the transmittance of light formed from the subpixels does not decrease. Moisture and the like penetrated into the layers 163 and 166 can be absorbed more effectively.

The moisture absorption layer 161 may include lithium (Li), calcium (Ca), magnesium (Mg), barium (Ba), strontium (Sr), yttrium (Y), cesium (Cs), the moisture absorption Any material that can be used is possible.

When the moisture absorption layer 161 is calcium (Ca), the reaction formula of calcium (Ca) and water (H 2 O) will be 2Ca + O 2 + H 2 O-> Ca (OH) 2 + CaO. In this scheme, since the moisture absorbing layer 161 generates a transparent material after the reaction with water (H 2 O), the transmittance of the light emitted from the sub-pixel does not matter.

The organic layers 162 and 165 positioned on the moisture absorbing layer 161 may be any material that can be deposited. However, it is advantageous to adopt a compact molecular structure so that little or no pinholes appear after deposition.

The inorganic layers 163 and 166 disposed on the organic layers 162 and 165 include aluminum oxide (Al 2 O 3), silicon nitride (SiN x), silicon oxide (SiO 2), silicon oxide (SiON), and silicon carbide (SiC). It may include, but is not limited to.

Referring to FIG. 4, the multi passivation layer 160 is formed by alternately stacking the organic layers 162 and 165 and the inorganic layers 163 and 166 and interposing at least one moisture absorbing layer 161 and an edge of the inorganic barrier rib 168. Can be sealed).

The inorganic partition wall 168 may be formed of aluminum oxide (Al 2 O 3), silicon nitride (SiN x), silicon oxide (SiO 2), silicon oxide nitride (SiON), and silicon carbide (SiC) as the materials included in the inorganic layers 163 and 166. ), But is not limited thereto.

The reason for sealing the edge region of the multi passivation layer 160 with the inorganic barrier rib 168 is to prevent the problem of moisture permeating through the sidewall of the multi passivation layer 160 having a relatively thin moisture penetrating from the outside.

3 and 4, the thickness of the organic layers 162 and 165 may be thicker than the thickness of the inorganic layers 163 and 166 or the moisture absorbing layer 161. The reason for making the thickness of the organic layers 162 and 165 thicker than other layers is to delay the penetration path of moisture penetrating from the outside without maintaining flexibility, which is one of the characteristics of the organic light emitting display device.

Meanwhile, referring to FIG. 5, the multi-protective layer 160 described above with reference to FIG. 4 is illustrated in more detail.

Referring to the figure shown, it can be seen that the edge region of the moisture absorbing layer 161 is located inward of the edge regions of the inorganic layers 163 and 166. The reason why the edge region of the moisture absorbing layer 161 is formed inward of the edge regions of the inorganic layers 163 and 166 is to reinforce it because the sidewall edge region is relatively thinner than the upper portion of the multi passivation layer 160.

Here, although the lengths of the edge regions of the organic layers 162 and 165 and the edge regions of the moisture absorbing layer 161 are shown to be similar, the organic layers 162 and 165 may be formed to be located outside the moisture absorbing layer 161. It may be.

Meanwhile, the inorganic partition wall 168 formed to seal the edge region of the multi passivation layer 160 is formed to cover and seal a portion of the inorganic layer 166 positioned at the top of the multi passivation layer 160. The inorganic barrier rib 168 may cover and seal a part or part or more of any one layer included in the multi passivation layer 160.

≪ Embodiment 2 >

FIG. 6 is a schematic cross-sectional view of an organic light emitting display device according to a second embodiment of the present invention. FIG. 7 is an enlarged view of region C of FIG. 6, FIG. FIG. 10 is an enlarged view of region D of FIG. 6.

Referring to FIG. 6, the organic light emitting display device according to the second embodiment of the present invention may include a substrate 210. In addition, it may include a sub pixel 250 positioned on the substrate 210. In addition, the multi-layer protective layer 260 may be disposed to cover the sub-pixel 250 and the organic layer and the inorganic layer are alternately stacked, and the at least one moisture absorbing layer may be interposed therebetween.

The substrate 210 may be selected to be a material for forming an element having excellent mechanical strength or dimensional stability. As the material of the substrate 210, a glass plate, a metal plate, a ceramic plate or a plastic plate (polycarbonate resin, acrylic resin, vinyl chloride resin, polyethylene terephthalate resin, polyimide resin, polyester resin, epoxy resin, silicone resin, fluorine) Resin, etc.) is mentioned.

The subpixel 250 positioned on the substrate 210 may include a transistor including a switching transistor, a driving transistor, and a capacitor, and an organic light emitting diode positioned on the transistor.

Hereinafter, the subpixel 250 positioned on the substrate 210 will be described with reference to FIG. 7.

The buffer layer 211 may be positioned on the substrate 210. The buffer layer 211 may be formed to protect the thin film transistor formed in a subsequent process from impurities such as alkali ions flowing out of the substrate 210. The buffer layer 211 may use silicon oxide (SiO ₂ ), silicon nitride (SiNx), or the like.

The active layer 214 may be located on the buffer layer 211. The active layer 214 may include amorphous silicon or polycrystalline silicon crystallized therefrom. Although not illustrated, the active layer 214 may include a channel region, a source region, and a drain region, and the source region and the drain region may be doped with P-type or N-type impurities. In addition, the active layer 214 may include an ohmic contact layer to lower the contact resistance.

The first insulating layer 213 may be positioned on the active layer 214. The first insulating layer 213 may be a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof, but is not limited thereto.

The gate 212 may be positioned on the first insulating layer 213. Gate 212 is selected from the group consisting of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) It may be made of any one or alloys thereof. In addition, the gate 212 is in the group consisting of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu). It may be a multilayer made of any one or alloys thereof. In addition, the gate 212 may be a bilayer of molybdenum / aluminum-neodymium or molybdenum / aluminum.

The second insulating layer 216a may be positioned on the gate 212. The second insulating layer 216a may be a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof, but is not limited thereto. The second insulating layer 216a may be a passivation layer.

The source 215a and the drain 215b may be in contact with the active layer 214 on the second insulating layer 216a. The source 215a and the drain 215b may be formed of a single layer or multiple layers. When the source 215a and the drain 215b are a single layer, molybdenum (Mo), aluminum (Al), chromium (Cr), and gold may be used. (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) may be made of any one or an alloy thereof. In addition, when the source 215a and the drain 215b are multiple layers, the double layer of molybdenum / aluminum-neodymium and the triple layer of molybdenum / aluminum / molybdenum or molybdenum / aluminum-neodymium / molybdenum may be used.

The third insulating layer 216b may be positioned on the source 215a and the drain 215b. The third insulating layer 216b may be an organic layer or an inorganic layer, and may be a planarization layer for increasing flatness.

The above is the description of the transistor located on the substrate 210. Hereinafter, the organic light emitting diode on the transistor will be described.

The first electrode 217 connected to the source 215a or the drain 215b may be positioned on the third insulating layer 216b. The first electrode 217 may be selected as an anode and may include transparent indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

The bank layer 220 may be positioned on the first electrode 217. The bank layer 220 may include an organic material such as benzocyclobutene (BCB) resin, acrylic resin, or polyimide resin. The bank layer 220 has an opening on the first electrode 217.

The organic emission layer 221 may be located in the opening of the bank layer 220. The organic emission layer 221 may be formed to emit one of red, green, and blue colors according to the sub-pixel 250.

The second electrode 222 may be positioned on the organic emission layer 221. The second electrode 222 may be selected as a cathode, and may be aluminum, but is not limited thereto.

The multi passivation layer 260 is disposed on the sub pixel 250 to cover the sub pixel 250.

Hereinafter, the multi passivation layer 260 will be described in more detail with reference to FIGS. 8 and 9.

Referring to FIG. 8, in the multi-protective film 260, a moisture absorbing layer 261, an organic layer 262, an inorganic layer 263, a moisture absorbing layer 264, an organic layer 265, and an inorganic layer 266 are sequentially stacked. . The moisture absorbing layers 261 and 264 may be deposited by a mask in a vacuum chamber, but the method is not limited thereto.

The thicknesses d1 and d2 of the moisture absorbing layers 261 and 264 may be 30 kPa to 500 kPa. When the thicknesses d1 and d2 of the moisture absorbing layers 261 and 264 are formed to be greater than or equal to 30 μs, the moisture absorbing layers 261 and 264 penetrate into the organic layers 262 and 265 and the inorganic layers 263 and 266 located outside the moisture absorbing layers 261 and 264. By absorbing moisture or the like, it is possible to solve a problem of deterioration of a subpixel or a decrease in lifespan. When the thicknesses d1 and d2 of the moisture absorbing layers 261 and 264 are formed to be 500 Å or less, the organic layers positioned outside the moisture absorbing layers 261 and 264 within a range in which the transmittance of light formed from the subpixels does not decrease ( The moisture penetrated through the 262 and 265 and the inorganic layers 263 and 266 may be more effectively absorbed.

The moisture absorption layers 261 and 264 may include lithium (Li), calcium (Ca), magnesium (Mg), barium (Ba), strontium (Sr), yttrium (Y), and cesium (Cs). It is possible if the material can absorb moisture.

When the moisture absorbing layers 261 and 264 are calcium (Ca), the reaction formula of calcium (Ca) and water (H 2 O) will be 2Ca + O 2 + H 2 O-> Ca (OH) 2 + CaO. In this scheme, since the moisture absorbing layers 261 and 264 produce a transparent material after the reaction with the water (H 2 O), the transmittance of the light emitted from the sub-pixel does not matter.

The organic layers 262 and 265 positioned on the moisture absorbing layers 261 and 264 may be any material that can be deposited. However, it is advantageous to adopt a compact molecular structure so that little or no pinholes appear after deposition.

The inorganic layers 263 and 266 on the organic layers 262 and 265 may include aluminum oxide (Al 2 O 3), silicon nitride (SiN x), silicon oxide (SiO 2), silicon oxide (SiON), and silicon carbide (SiC). It may include, but is not limited to.

Referring to FIG. 9, the multi passivation layer 260 includes a moisture absorbing layer 261, an organic layer 262, an inorganic layer 263, a moisture absorbing layer 264, an organic layer 265, and an inorganic layer 266. In addition, the edge region may be sealed by the inorganic barrier rib 268.

The inorganic partition wall 268 is made of aluminum oxide (Al 2 O 3), silicon nitride (SiN x), silicon oxide (SiO 2), silicon oxide nitride (SiON), and silicon carbide (SiC) as the materials included in the inorganic layers 263 and 266. ), But is not limited thereto.

The reason for sealing the edge region of the multi passivation layer 260 with the inorganic barrier rib 268 is to prevent a problem of moisture permeating through the sidewall of the multi passivation layer 260 formed with relatively thin moisture penetrating from the outside.

8 and 9, the thicknesses of the organic layers 262 and 265 may be thicker than those of the inorganic layers 263 and 266 or the moisture absorbing layers 261 and 264. The reason for making the thickness of the organic layers 262 and 265 thicker than other layers is to delay the penetration path of moisture penetrating from the outside without maintaining flexibility, which is one of the characteristics of the organic light emitting display device.

Here, the thickness d2 of the first moisture absorption layer 261 which is one of the moisture absorption layers 261 and 264 included in the multi-protective film 260 is different from the thickness d2 of the second moisture absorption layer 264 which is the other moisture absorption layer 261. Can be. For example, in order to increase the transmittance of light emitted from the subpixel, the thickness d1 of the first moisture absorption layer 261 may be formed to be thinner than the thickness d2 of the second moisture absorption layer 264. However, in some cases, the thickness d2 of the second moisture absorption layer 264 may be smaller than the thickness d1 of the first moisture absorption layer 261.

Meanwhile, referring to FIG. 10, the multi-protective film 260 described above with reference to FIG. 9 is illustrated in more detail.

Referring to the drawing, it can be seen that the edge regions of the moisture absorbing layers 261 and 264 are located inward of the edge regions of the inorganic layers 263 and 266. The reason why the edge regions of the moisture absorbing layers 261 and 264 are formed inward of the edge regions of the inorganic layers 263 and 266 is to reinforce the sidewall edge region because the sidewall edge region is relatively thinner than the upper portion of the multi passivation layer 260. to be.

Here, although the lengths of the edge regions of the organic layers 262 and 265 and the edge regions of the moisture absorbing layer 261 are similar, the organic layers 262 and 265 may be located outside the moisture absorbing layers 261 and 264. It may be formed.

Meanwhile, the inorganic barrier rib 268 formed to seal the edge region of the multi passivation layer 260 is formed to cover and seal a portion of the inorganic layer 266 positioned at the top of the multi passivation layer 260. Alternatively, the inorganic barrier rib 268 may cover and seal a part or part or more of any one layer included in the multi passivation layer 260.

Third Embodiment

FIG. 11 is a schematic cross-sectional view of an organic light emitting display device according to a third exemplary embodiment of the present invention. FIG. 12 is an enlarged view of region E of FIG. 11, FIG. Another example of a multi passivation film is shown.

Referring to FIG. 11, an organic light emitting display device according to a third embodiment of the present invention may include a substrate 310. In addition, the sub-pixel 350 may be disposed on the substrate 310. In addition, the multi-protection layer 360 may be disposed to cover the sub-pixel 350 and interpose at least one moisture absorption layer between the inorganic layer and the inorganic layer.

The subpixel 350 disposed on the substrate 310 may include a transistor including a switching transistor, a driving transistor, and a capacitor, and an organic light emitting diode positioned on the transistor.

The subpixel 350 illustrated in FIG. 12 may have a structure as described above with reference to FIG. 2. The multi passivation layer 360 is positioned on the sub pixel 350 to cover the sub pixel 350.

Hereinafter, the multi passivation layer 360 will be described in more detail with reference to FIGS. 13 and 14.

Referring to FIG. 13, at least one moisture absorption layer 362 is interposed between the inorganic layer 361 and the inorganic layer 363 in the multi passivation layer 360. The moisture absorbing layer 362 may be formed by any one of dipping, spin coating, spray coating, dispensing, and screen printing, depending on the material. It is not limited to this.

The thickness d1 of the moisture absorbing layer 362 may be 0.05 μm to 1000 μm. When the thickness d1 of the moisture absorbing layer 362 is formed to be 0.05 μm or more, moisture or oxygen penetrated into the inorganic layers 361 and 363 surrounding the moisture absorbing layer 362 may be absorbed to deteriorate the sub-pixel or reduce its lifespan. The problem of deterioration can be solved. When the thickness d1 of the moisture absorbing layer 362 is 1000 μm or less, it penetrates into the inorganic layers 361 and 363 surrounding the moisture absorbing layer 362 within a range in which the transmittance of light formed from the subpixels does not decrease. Moisture and oxygen can be absorbed more effectively.

The moisture absorbing layer 362 may be formed of polyvinyl alcohol or an organometallic compound. Here, when the adhesive layer is included in the moisture absorbing layer 362, the adhesive layer may be attached onto the inorganic layer 361. Alternatively, when the adhesive layer is not included in the moisture absorbing layer 362, the inorganic layer 361 may be stretched by applying heat. Can be adhered to).

When the moisture absorption layer 362 is formed of an organic metal compound, the organic metal compound is a compound represented by the formula M (OR1) a, and M is any one of Group 2, Group 3 or Group 4 elements. R1 is composed of a substituted or unsubstituted monovalent chain hydrocarbon group, a monovalent aliphatic cyclic hydrocarbon group, a single ring or a plurality of monovalent aromatic or heteroaromatic hydrocarbon groups, and a is M In the case of a group 2 element, an integer 2, a may be an integer 3 when M is a group 3 element, and a may be an integer 4 when M is a group 4 element.

On the other hand, when forming the condensation agent by applying the organometallic compound solution on the sub-pixel during the formation of the moisture-absorbing layer 362 and using one or more of heat or ultraviolet (UV), one of the following (1) or (2) It may contain the above materials. (1) Compounds forming zeolites, silicas, aluminas, alkali metal oxides, alkali metal oxides, nickel zinc cadmium oxides, chlorides, perchlorates, sulfates, epoxides, Lewis and carbon cations that can absorb moisture (H2O) , Alkoxide and acyl halide. (2) Alkali metals, alkaline earth metals or other metals capable of absorbing oxygen (O2) (iron, tin, copper, manganese oxides, copper oxides, phosphites, salts with phosphinite anions, phenols, secondary aromatic amines) It may include any one or more of, thioether and aldehyde, wherein the metal particles contained in the material corresponding to (1) or (2) may have a size within 10nm ~ 500nm.

In the case of using the organometallic compound solution when forming the moisture absorption layer 362, the material used as the organic binder base material (water transfer layer) may be polyacrylate, polymethacrylate, polyetherimide (PEI), or polyamide (PA). , Cellulose acetate (CA), cellulose triacetate (TCA), polysiloxane, polyvinyl alcohol (PVA), polyethylene oxide (PEO), polyethylene glycol (PEG), polypropylene glycol (PPG), polyvinyl acetate (PVAC), poly Oxymethylene (POM), Poly (ethylene Vinyl Alcohol) Copolymer (EVAL, EVOH), Poly (amide-Ethylene Oxide) Copolymer (PA-PEO), Poly (Urethane-Ethylene Oxide) Copolymer (PUR-PEO) , Poly (ethylene-vinyl acetate) copolymers (EVA, EVAC). As the solvent, polar solvents such as alcohols and ketones are possible, and nonpolar solvents such as aromatic hydrocarbons, aliphatic hydrocarbons and aliphatic hydrocarbon-based organic solvents may be used.

When the moisture absorption layer 362 is formed using the organometallic compound solution as described above, the coated thin film may be subjected to a heat treatment to form a condensation agent, and the condensate formed therefrom has a function of stress relaxation, external gas absorption and removal. .

The inorganic layers 361 and 363 may be formed using any one of chemical vapor deposition (CVD), sputtering, and evaporation on the subpixels depending on the material, but is not limited thereto. The inorganic layers 361 and 363 may use an inorganic oxide or an inorganic nitride. For example, the inorganic layers 361 and 363 may be formed of silicon oxide (SiO 2), silicon oxynitride (SiO x N y), silicon nitride (SiN x), silicon carbide oxide (SiO x Cy), aluminum oxide (Al 2 O 3), and indium tin oxide (ITO). , Zinc oxide (ZnOx), aluminum zinc oxide (Al-ZnOx) may be made of any one, but is not limited thereto.

Referring to FIG. 14, the organic light emitting display device formed as described above may further include a sealing substrate 380 spaced apart from the substrate 310 so as to seal the subpixels, and the substrate 310 and the sealing substrate ( The 380 may be sealed by the adhesive member 370. The adhesive member 370 is positioned on the inner side of the first adhesive member 371 and the first adhesive member 371, which is located at the outer side of the substrate 310 and the sealing substrate 380, and the substrate 310 and the sealing substrate ( It may include a second adhesive member 372 formed on the front of the 380. Here, an edge sealant may be used as the first adhesive member 371, and a transparent front sealant may be used as the second adhesive member 372, but is not limited thereto.

<Fourth Embodiment>

FIG. 15 is a schematic cross-sectional view of an organic light emitting display device according to a fourth embodiment of the present invention. FIG. 16 is an enlarged view of region F of FIG. 15, FIG. 17 is an exemplary view of a multi passivation layer, and FIG. Another example of a multi passivation film is shown.

Referring to FIG. 15, an organic light emitting display device according to a fourth embodiment of the present invention may include a substrate 410. In addition, the substrate 410 may include a sub-pixel 450. In addition, the multi-layer protective layer 460 is disposed to cover the sub-pixel 450 and interposed at least one moisture absorption layer between the inorganic layer and the inorganic layer, wherein the inorganic layer and the moisture absorption layer is formed of N (an integer of 2 or more). Can be.

The subpixel 450 positioned on the substrate 410 may include a transistor including a switching transistor, a driving transistor, and a capacitor, and an organic light emitting diode positioned on the transistor.

The subpixel 450 illustrated in FIG. 16 may have a structure as described above with reference to FIG. 7. The multi passivation layer 460 is disposed on the sub pixel 450 to cover the sub pixel 450.

Hereinafter, the multi passivation layer 460 will be described in more detail with reference to FIGS. 17 and 18.

Referring to FIG. 17, an inorganic layer 461, 463, and 465 are alternately stacked with the moisture absorbing layers 462 and 464 interposed therebetween. For example, the multi passivation layer 460 may be stacked in the order of the inorganic layer 461, the moisture absorption layer 462, the inorganic layer 463, the moisture absorption layer 464, and the inorganic layer 465 to cover the subpixels.

The moisture absorbing layers 462 and 464 may be formed by any one of dipping, spin coating, spray coating, dispensing, and screen printing. The method is not limited to this.

The thicknesses d1 and d2 of the moisture absorbing layers 462 and 464 may be 0.05 μm to 1000 μm. When the thicknesses d1 and d2 of the moisture absorbing layers 462 and 464 are formed to be 0.05 μm or more, moisture or oxygen permeated into the inorganic layers 461, 463 and 465 surrounding the moisture absorbing layers 462 and 464 are absorbed. This can solve the problem of deterioration of the subpixels or deterioration of the lifetime. When the thicknesses d1 and d2 of the moisture absorbing layers 462 and 464 are formed to be 1000 μm or less, the moisture absorbing layers absorbing layers 462 and 464 are wrapped within a range in which the transmittance of light formed from the subpixels does not decrease. Moisture, oxygen, or the like penetrated into the inorganic layers 461, 463, 465 can be more effectively absorbed.

The moisture absorbing layers 462 and 464 may be formed of polyvinyl alcohol or an organometallic compound. Here, when the adhesive layers are included in the moisture absorbing layers 462 and 464, the adhesive layers may be pasted on the inorganic layers 461 and 464. Alternatively, when the adhesive layers are not included in the moisture absorbing layers 462 and 464, the stretching may be performed by applying heat. It may be adhered to the inorganic layers 461 and 464 in the form.

Meanwhile, the thickness d1 of the first moisture absorption layer 462 positioned below the moisture absorption layers 462 and 464 and the thickness of the second moisture absorption layer 464 positioned above the same may be the same or different. As an example of the embodiment, the thickness d2 of the second moisture absorbing layer 464 may be thicker than the thickness d1 of the first moisture absorbing layer 462 when considering the amount of water or oxygen penetrating from the outside. .

When the moisture absorbing layers 462 and 464 are formed of an organic metal compound, the organic metal compound is a compound represented by the formula M (OR1) a, and M is a group 2, 3, or 4 element. Wherein R1 is one of a substituted or unsubstituted monovalent chain hydrocarbon group, a monovalent aliphatic cyclic hydrocarbon group, a single ring or a plurality of monovalent aromatic or heteroaromatic hydrocarbon groups, a May be an integer 2 when M is a group 2 element, a may be an integer 3 when M is a group 3 element, and a may be an integer 4 when M is a group 4 element.

On the other hand, in the case of forming the moisture absorbing layer (462, 464) when applying the organometallic compound solution on the sub-pixel, and then forming a condensing agent using one or more of heat or ultraviolet (UV), the following (1) or (2) It may include one or more of the materials. (1) Compounds forming zeolites, silicas, aluminas, alkali metal oxides, alkali metal oxides, nickel zinc cadmium oxides, chlorides, perchlorates, sulfates, epoxides, Lewis and carbon cations that can absorb moisture (H2O) , Alkoxide and acyl halide. (2) Alkali metals, alkaline earth metals or other metals capable of absorbing oxygen (O2) (iron, tin, copper, manganese oxides, copper oxides, phosphites, salts with phosphinite anions, phenols, secondary aromatic amines) It may include any one or more of, thioether and aldehyde, wherein the metal particles contained in the material corresponding to (1) or (2) may have a size within 10nm ~ 500nm.

In the case of using the organometallic compound solution when forming the moisture absorbing layers 462 and 464, the material used as the organic binder base material (water transfer layer) may be polyacrylate, polymethacrylate, polyetherimide (PEI), polyamide ( PA), cellulose acetate (CA), cellulose triacetate (TCA), polysiloxane, polyvinyl alcohol (PVA), polyethylene oxide (PEO), polyethylene glycol (PEG), polypropylene glycol (PPG), polyvinyl acetate (PVAC) , Polyoxymethylene (POM), poly (ethylene vinyl alcohol) copolymers (EVAL, EVOH), poly (amide-ethylene oxide) copolymers (PA-PEO), poly (urethane-ethylene oxide) copolymers (PUR- PEO), poly (ethylene-vinyl acetate) copolymers (EVA, EVAC). As the solvent, polar solvents such as alcohols and ketones are possible, and nonpolar solvents such as aromatic hydrocarbons, aliphatic hydrocarbons and aliphatic hydrocarbon-based organic solvents may be used.

When forming the moisture absorbing layer (462, 464) using the organometallic compound solution as described above, the coated thin film can be subjected to a heat treatment to form a condensation agent, the condensate formed through the stress relief, external gas absorption and removal function Has

The inorganic layers 461, 463, and 465 may be formed using any one of chemical vapor deposition (CVD), sputtering, and evaporation, depending on the material, but are not limited thereto. Do not. The inorganic layers 461, 463, and 465 may use an inorganic oxide or an inorganic nitride. For example, the inorganic layers 461, 463, and 465 may include silicon oxide (SiO 2), silicon oxynitride (SiO x N y), silicon nitride (SiN x), silicon carbide oxide (SiO x Cy), aluminum oxide (Al 2 O 3), and indium tin oxide. (ITO), zinc oxide (ZnOx), aluminum zinc oxide (Al-ZnOx) may be made of any one, but is not limited thereto.

As described above, each embodiment of the present invention has an effect of providing an organic light emitting display device capable of preventing the deterioration of a device and extending the life of the device by applying a multi-protective film including a moisture absorbing layer. Furthermore, each embodiment of the present invention has the effect of providing an organic light emitting display device which may satisfy both aspects of not only the life of the device but also the mass production and the life of the device. In addition, each embodiment of the present invention to provide an organic light emitting display device that can flexibly implement the device while minimizing the particle generation rate that can cause defects in the device during the manufacturing process.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. In addition, all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be construed as being included in the scope of the present invention.

1 is a schematic cross-sectional view of an organic light emitting display device according to a first embodiment of the present invention.

FIG. 2 is an enlarged view of area A of FIG. 1. FIG.

3 is an exemplary view of a multi passivation film.

4 is another exemplary view of a multi passivation film.

FIG. 5 is an enlarged view of region B of FIG. 6;

6 is a schematic cross-sectional view of an organic light emitting display device according to a second embodiment of the present invention;

FIG. 7 is an enlarged view of region C of FIG. 6;

8 is an exemplary view of a multi passivation film.

9 is another exemplary view of a multi passivation film.

FIG. 10 is an enlarged view of region D of FIG. 6;

11 is a schematic cross-sectional view of an organic light emitting display device according to a third embodiment of the present invention.

12 is an enlarged view of region E of FIG. 11;

13 is an exemplary view of a multi passivation film.

14 is another exemplary view of a multi passivation film.

15 is a schematic cross-sectional view of an organic light emitting display device according to a fourth embodiment of the present invention;

16 is an enlarged view of region F of FIG. 15;

17 is an exemplary view of a multi passivation film.

18 is another exemplary view of a multi passivation film.

DESCRIPTION OF THE REFERENCE NUMERALS

110, 210, 310, 410: substrate 112, 212, 312, 412: gate

113, 213, 313, 413: first insulating layer 117, 217, 317, 417: first electrode

120, 220, 320, 420: bank layer 121, 221, 321, 421: organic light emitting layer

122, 222, 322, 422: second electrode 150, 250, 350, 450: sub pixel

160, 260, 360, 460: Multi Shield

Claims (20)

Board; A subpixel on the substrate; And It includes a multi-protective film positioned to cover the sub-pixel and the organic layer and the inorganic layer are alternately stacked and interposed at least one moisture absorption layer, The multi protective film, A moisture absorbing layer, an organic layer, an inorganic layer, a moisture absorbing layer, an organic layer, and an inorganic layer are stacked in order to cover the subpixels. The thickness of one of the moisture absorption layers, An organic light emitting display device, characterized in that different from one another. delete The method of claim 1, An organic light emitting display device, wherein the moisture absorption layer has a thickness of 30 kPa to 500 kPa. The method of claim 1, The moisture absorption layer, An organic light emitting display device including lithium (Li), calcium (Ca), magnesium (Mg), barium (Ba), strontium (Sr), yttrium (Y), and cesium (Cs). The method of claim 1, The inorganic layer, An organic light emitting display device comprising aluminum oxide (Al 2 O 3), silicon nitride (SiN x), silicon oxide (SiO 2), silicon nitride (SiON), and silicon carbide (SiC). The method of claim 1, The edge area of the multi passivation layer, An organic light emitting display device comprising an inorganic barrier rib. The method of claim 1, The edge region of the moisture absorption layer, And an organic light emitting display device positioned inside the edge region of the inorganic layer. delete The method of claim 1, The thickness of the organic layer, The organic light emitting display device is thicker than the thickness of the inorganic layer or the moisture absorption layer. The method of claim 1, The moisture absorption layer, An organic light emitting display device which is deposited by a mask in a vacuum chamber. Board; A subpixel on the substrate; And And a multi passivation layer disposed to cover the subpixel, and having at least one moisture absorption layer interposed between the inorganic layer and the inorganic layer. 12. The method of claim 11, The thickness of the moisture absorption layer, An organic light emitting display device, characterized in that 0.05 ~ 1000㎛. 12. The method of claim 11, The moisture absorption layer, An organic light emitting display device, characterized in that formed of polyvinyl alcohol or an organic metal compound. 14. The method of claim 13, The organometallic compound, A compound represented by the formula M (OR1) a, M consists of any one of Group 2, Group 3 or Group 4 elements, R1 is composed of any one of a substituted or unsubstituted monovalent chain hydrocarbon group, a monovalent aliphatic cyclic hydrocarbon group, a monocyclic or several ring monovalent aromatic or heteroaromatic hydrocarbon group, A is an integer of 2 when M is the Group 2 element, a is an integer 3 when M is the Group 3 element, and a is an integer 4 when M is the Group 4 element An organic light emitting display device. 12. The method of claim 11, The inorganic layer, Silicon oxide (SiO2), silicon oxynitride (SiOxNy), silicon nitride (SiNx), An organic light emitting display device comprising any one of silicon carbide oxide (SiOxCy), aluminum oxide (Al2O3), indium tin oxide (ITO), zinc oxide (ZnOx), and aluminum zinc oxide (Al-ZnOx). 12. The method of claim 11, The inorganic layer and the moisture absorption layer, An organic light emitting display device comprising N (an integer of 2 or more). 12. The method of claim 11, The multi protective film, And an inorganic layer, a moisture absorbing layer, an inorganic layer, a moisture absorbing layer, and an inorganic layer so as to cover the subpixels. 12. The method of claim 11, The moisture absorption layer, An organic light emitting display device, characterized in that formed by one of dipping, spin coating, spray coating, dispensing, and screen printing. 12. The method of claim 11, A sealing substrate spaced apart from the substrate to seal the sub pixel; And the substrate and the sealing substrate are sealed by an adhesive member. 20. The method of claim 19, Wherein the adhesive member comprises: A first adhesive member positioned outside the substrate and the sealing substrate; An organic light emitting display device comprising: a second adhesive member positioned inside the first adhesive member and formed on an entire surface of the substrate and the sealing substrate.

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