KR101252847B1 - Fabricating Method Of Flexible Display - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible display. In particular, the present invention provides a method for adding a supporting force to a flexible substrate during the manufacturing process of the flexible display, and also provides stability of the manufacturing process of the flexible display. The present invention relates to a method for manufacturing a flexible display device that can be secured.

A method of manufacturing a flexible display device according to an embodiment of the present invention includes a first adhesive formed on a first surface of a support film, a second adhesive formed on a second surface of the support film, and having a weaker viscosity than the first adhesive material. 2 is more viscous than the adhesive and adhered to the first surface of the support film with an adhesive layer comprising a third adhesive that surrounds the edge of the second adhesive on the second surface of the support film, and the first adhesive therebetween. Providing an adhesive comprising a first protective film, and a second protective film attached on the second surface of the support film with the second adhesive material and the third adhesive material interposed therebetween; Removing the first protective film from the adhesive layer; Attaching a non-flexible substrate on the first adhesive; Removing the second protective film from the adhesive layer; Attaching a flexible substrate on the second and third adhesives.

Description

Fabrication Method Of Flexible Display

1 is a diagram briefly illustrating a manufacturing process of a flexible display device;

2A to 2C are views for explaining an attaching step.

3A to 3E are views for explaining a manufacturing process of the upper array substrate.

4A to 4D are views for explaining a manufacturing process of a lower array substrate.

5A and 5B are views for explaining the peeling process.

6a and 6b are views showing a cross-sectional structure and a planar structure of the pressure-sensitive adhesive according to a first embodiment of the present invention.

7 is a view showing a cross-sectional structure of the pressure-sensitive adhesive according to a second embodiment of the present invention.

8A and 8B illustrate a process of attaching a flexible display device according to a third exemplary embodiment of the present invention.

9A to 9C illustrate a process of attaching a flexible display device according to a fourth exemplary embodiment of the present invention.

10 is a view showing a part of a manufacturing process of a flexible display device;

11A and 11B illustrate a peeling process of a flexible display device according to a fourth exemplary embodiment of the present invention.

12A to 12F are views for explaining problems of the substrate attaching process.

13 illustrates a flexible substrate and a non-flexible substrate that have been surface treated according to a fifth embodiment of the present invention.

14A to 14E illustrate a substrate attaching process according to a fifth embodiment of the present invention.

15 is a schematic cross-sectional view of an organic light emitting display device;

<Explanation of symbols for main parts of the drawings>

11a, 11b, 111a, 111b, 211a, 211b: protective film

1, 5, 6, 101, 201: adhesive layer

82, 45, 45a, 45b, 103, 103a, 103b, 145, 245: flexible substrate

47, 47a, 47b, 147, 247: inflexible substrate

100, 100a, 100b: jig substrate 107: adhesive

113: first groove 117: second groove

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible display, and in particular, to provide a method for adding support to a flexible substrate during the manufacturing process of the flexible display and to improve the stability of the manufacturing process of the flexible display. The present invention relates to a method for manufacturing a flexible display device that can be secured.

Recently, the display device market is rapidly changing with a flat panel display (hereinafter, referred to as "FPD"), which has a large area, and is thin and lightweight.

Such FPDs include liquid crystal displays (LCDs), plasma display panels (PDPs), organic electroluminescent displays (OLEDs), and the like. However, the conventional liquid crystal display device, plasma display panel, organic light emitting display device, etc., because there is no flexibility because it uses a glass substrate, there is a limit in the application and use.

Therefore, a flexible display device manufactured to bend using a substrate made of a flexible material such as plastic or foil is emerging as a next-generation display device instead of a glass substrate having no conventional flexibility.

On the other hand, the flexible display device must use a flexible substrate to give flexibility to the display portion of the flexible display device. Since the flexible substrate mainly uses a plastic substrate, support capacity for supporting an array process for forming signal wirings is inferior to that of glass substrates used in existing display devices. Therefore, it is an important task to develop a method for adding a supporting force for an array process on a flexible substrate and to add a supporting force and to secure stability of a flexible display device manufacturing process.

Accordingly, an object of the present invention is to provide a method for adding a supporting force to a flexible substrate during the manufacturing process of a flexible display device and to ensure the stability of the flexible display device manufacturing process. It is to provide a manufacturing method.

In order to achieve the above object, a method of manufacturing a flexible display device according to a first exemplary embodiment of the present invention includes a first adhesive formed on a first surface of a support film and a second adhesive formed on a second surface of the support film. A second pressure-sensitive adhesive, a pressure-sensitive adhesive layer including a third pressure-sensitive adhesive stronger than the second pressure-sensitive adhesive and surrounding the edge of the second pressure-sensitive adhesive on the second surface of the support film, and the first pressure-sensitive adhesive; A pressure-sensitive adhesive comprising a first protective film attached on the first surface of the support film and a second protective film attached on the second surface of the support film with the second adhesive material and the third adhesive material interposed therebetween. Making a step; Removing the first protective film from the adhesive layer; Attaching a non-flexible substrate on the first adhesive; Removing the second protective film from the adhesive layer; Attaching a flexible substrate on the second and third adhesives.

The first and third adhesives are made of the same adhesive material.

The width of the third adhesive is characterized in that between 2mm to 8mm.

In addition, a method of manufacturing a flexible display device according to a second exemplary embodiment of the present invention may include a first adhesive formed on a first surface of a support film, a second adhesive formed on a second surface of the support film, and having a weaker viscosity than the first adhesive. 2 a pressure-sensitive adhesive, a pressure-sensitive adhesive layer containing a third pressure-sensitive adhesive is stronger than the second pressure-sensitive adhesive and formed on the second pressure-sensitive adhesive, and adhered on the first surface of the support film with the first adhesive therebetween Providing an adhesive comprising a first protective film, and a second protective film attached on the second surface of the support film with the second adhesive material and the third adhesive material interposed therebetween; Removing the first protective film from the adhesive layer; Attaching a non-flexible substrate on the first adhesive; Removing the second protective film from the adhesive layer; Attaching a flexible substrate on the second and third adhesives.

The first and third adhesives are made of the same adhesive material.

The third adhesive is formed in the form of a band on the edge of the second adhesive.

The width of the third adhesive is characterized in that between 2mm to 8mm.

In addition, a method of manufacturing a flexible display device according to a third exemplary embodiment of the present invention may include a first adhesive formed on a first surface of a support film, a second adhesive formed on a second surface of the support film, and having a weaker viscosity than the first adhesive. 2 a pressure-sensitive adhesive layer comprising an adhesive, a first protective film attached on the first surface of the support film with the first adhesive material interposed therebetween, and a second adhesive material on the second surface of the support film with the second adhesive material interposed therebetween. Providing an adhesive including the second protective film; Removing the first passivation layer from the adhesive layer; Attaching a non-flexible substrate on the first adhesive; Removing the second protective film from the adhesive layer; Forming a third adhesive material having a higher viscosity than the second adhesive material on the second adhesive material; Attaching a flexible substrate on the second and third adhesives.

The first and third adhesives are made of the same adhesive material.

The third adhesive is formed in the form of a band on the edge of the second adhesive.

The width of the third adhesive is characterized in that between 2mm to 8mm.

In addition, a method of manufacturing a flexible display device according to a fourth exemplary embodiment of the present invention may include forming first and second jig substrates including a first groove and a second groove formed under an edge of the first groove; ; Applying an adhesive to the second groove of each of the first and second jig substrates; Fixing first and second flexible substrates to the pressure-sensitive adhesive and the first groove of each of the first and second jig substrates, respectively; Fabricating an upper array substrate on the first flexible substrate and fabricating a lower array substrate on the second flexible substrate; Bonding the upper array substrate and the lower array substrate and injecting liquid crystal; Peeling the first and second flexible substrates from the first and second jig substrates.

The width of the second groove is formed from 5mm to 100mm, the thickness of the second groove is formed to the same thickness as the pressure-sensitive adhesive.

The width and thickness of the first groove are formed to be the same as the width and thickness of the flexible substrate.

The adhesive applied to the second groove may include a polyimide tape, and the peeling of the first and second jig substrates may include the first and second flexible sheets to which the polyimide tape is adhered using a laser. Proceed by cutting the edge of the substrate.

The pressure-sensitive adhesive applied to the second grooves includes a pressure-sensitive adhesive that loses adhesion in response to ultraviolet rays, and the peeling of the first and second flexible substrates from the first and second jig substrates may be performed on the pressure-sensitive adhesive. It is characterized by proceeding by irradiation with ultraviolet rays.

The adhesive applied to the second groove may include an adhesive having a property of losing adhesive force in response to temperature, and the peeling of the first and second flexible substrates from the first and second jig substrates may include: It is characterized by advancing by applying temperature.

A method of manufacturing a flexible display device according to a fifth embodiment of the present invention includes the steps of: providing a flexible substrate and a non-flexible substrate having a hydrophilic surface; Attaching a first surface of an adhesive layer to a hydrophilic surface of the non-flexible substrate; Attaching a hydrophilic treatment surface of the flexible substrate to a second surface of the adhesive layer.

The hydrophilic treatment is characterized in that it is made through a solvent containing any one of acetone, PGMEA, IPA.

Other objects and advantages of the present invention will become apparent from the following description of preferred embodiments of the present invention with reference to the accompanying drawings.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 1 to 15.

Referring to FIG. 1, the manufacturing process of the flexible liquid crystal display according to the present invention is largely based on a substrate attaching process (S1), an upper array substrate manufacturing process (S2), a lower array substrate manufacturing process (S3) and a liquid crystal process (S4). , The separation step (S5), and the module step (S6).

The substrate attaching process (S1) is a process of attaching a flexible substrate to provide flexibility to a non-flexible substrate and a display device so as to support the electrode formation precisely. Here, a glass substrate is used as the non-flexible substrate, and a plastic substrate having high heat resistance is used as the flexible substrate.

2A to 2C will be described in detail with reference to the substrate attaching process S1.

2A to 2C, the substrate attaching process S1 will be described in detail as follows.

An adhesive is used for the board | substrate adhesion process S1. The adhesive includes an adhesive layer 1 and first and second protective films 11a and 11b as shown in FIG. 2A.

The first and second passivation layers 11a and 11b are for preventing the adhesive layer 1 from being exposed to the outside and being contaminated.

The adhesive layer 1 shown in FIG. 2A is attached with a non-flexible substrate 47 to support the electrode formation precisely and a flexible substrate 45 to provide flexibility to the display device.

This adhesive layer 1 includes a supporting film 1b, a first adhesive and a second adhesive 1a, 1c as shown in FIG. 2A.

The supporting film 1b is positioned in the center of the adhesive layer 1 to support the adhesives 1a and 1c. As the material of the support film 1b, polymers having excellent heat resistance are used, and polyimide (PI) is mainly used.

The adhesives 1a and 1c are opposed to each other with the supporting film 1b interposed therebetween. These adhesives 1a and 1c are formed of a material having excellent heat resistance, and are mainly formed of an acrylic resin or a silicone series. The adhesion of the first adhesive 1a, which is a portion to which the non-flexible substrate 47 is attached, and the second adhesive 1c, which is a portion to which the flexible substrate 45 is attached, can be strongly or weakly formed depending on its composition. have. In FIG. 2A, the second adhesive 1c is relatively weak in viscosity than the first adhesive 1a.

Referring to FIG. 2B, the substrate attaching process S1 may first remove the first protective film 11a and attach the non-flexible substrate 47 to the first adhesive 1a.

Subsequently, referring to FIG. 2C, the second protective film 11b of the adhesive layer 1 to which the non-flexible substrate 47 is attached is detached and the flexible substrate 45 is attached (S1).

The reason why the adhesive layer 1 forms a double adhesive force between the first adhesive material 1a and the second adhesive material 1c as described above is due to the flexible substrate 45 and the inflexibility during the peeling process S5 to be described later. This is to remove the substrate 47 step by step.

The substrate attaching process S1 as described above may be performed by using the first flexible substrate 45a and the first flexible substrate 47a and the lower array substrate to support the first flexible substrate 45a to form the upper array substrate. A second flexible substrate 45b to be formed and a second non-flexible substrate 47b supporting the second flexible substrate 45b are formed.

The upper and lower array substrate manufacturing processes S2 and S3 are processes for forming R, G and B pixel pixels and basic electrodes. The lower array substrate is composed of a plurality of signal wires and a thin film transistor, and an alignment film coated thereon for liquid crystal alignment. The upper array substrate is composed of a color filter for color realization and a black matrix for light leakage prevention, and an alignment film coated thereon for liquid crystal alignment.

The upper and lower array substrate manufacturing processes S2 and S3 will be described in detail with reference to FIGS. 3A to 4D.

3A to 3E show step by step an example of an upper array substrate manufacturing process S2.

First, an opaque material such as an opaque metal or an opaque resin is deposited on the flexible substrate 45a adhered to the non-flexible substrate 47a, and then an organic material is patterned by a photolithography process and an etching process. Black matrix 3 is formed as shown in FIG. As the opaque metal, chromium (Cr) is generally used, and an organic material is used as the opaque resin.

After the red resin is deposited on the flexible substrate 45a on which the black matrix 3 is formed, the red resin is patterned by a photolithography process and an etching process to form a red color filter R as shown in FIG. 3B. do.

After the green resin is deposited on the flexible substrate 45a on which the red color filter R is formed, the green resin is patterned by a photolithography process and an etching process, thereby as shown in FIG. 3C. Is formed. After the blue resin is deposited on the flexible substrate 45 on which the green color filter G is formed, the blue resin is patterned by a photolithography process and an etching process, thereby providing a blue color filter B as shown in FIG. 3D. Is formed.

A transparent conductive material is entirely deposited on the flexible substrate 45a on which the red, green, and blue color filters are formed, and then patterned, thereby forming a common electrode 35 as shown in FIG. 3E.

4A to 4D show an example of the lower array substrate manufacturing process S3 step by step.

First, the gate line 2, the gate electrode 8, and the gate pad lower portion of the flexible substrate 45b adhered to the non-flexible substrate 47b using the first mask process as shown in FIG. 4A. The first conductive pattern group including the electrode 26 is formed.

In detail, the gate metal layer is formed on the flexible substrate 45b through a deposition method such as a sputtering method. Subsequently, the gate metal layer is patterned by a photolithography process and an etching process using a first mask to form a first conductive pattern group including the gate line 2, the gate electrode 8, and the gate pad lower electrode 26. . Here, an aluminum metal or the like is used as the gate metal layer.

Referring to FIG. 4B, a gate insulating layer 46 is coated on the flexible substrate 45b on which the first conductive pattern group is formed. A semiconductor pattern including an active layer 48 and an ohmic contact layer 50 on the gate insulating layer 46 using a second mask process; A second conductive pattern group including the data line 4, the source electrode 10, the drain electrode 12, the data pad lower electrode 32, and the storage electrode 22 is formed.

In detail, the gate insulating layer 46, the amorphous silicon layer, the n + amorphous silicon layer, and the source / drain metal layer may be formed on the flexible substrate 45b on which the first conductive pattern group is formed by a deposition method such as PECVD or sputtering. Are formed sequentially. Here, an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx) is used as the material of the gate insulating film 46. As the source / drain metal, molybdenum (Mo), titanium, tantalum, molybdenum alloy (Mo alloy) and the like are used.

Subsequently, a photoresist pattern is formed on the source / drain metal layer by a photolithography process using a second mask. In this case, by using a diffraction exposure mask having a diffraction exposure portion in the channel portion of the thin film transistor, the photoresist pattern of the channel portion has a lower height than other source / drain pattern portions.

Subsequently, the source / drain metal layer is patterned by a wet etching process using a photoresist pattern, so that the data line 4, the source electrode 10, the drain electrode 12 integrated with the source electrode 10, and the storage electrode 22 are formed. A second conductive pattern group including a is formed.

Then, the ohmic contact layer 50 and the active layer 48 are formed by simultaneously patterning the n + amorphous silicon layer and the amorphous silicon layer by a dry etching process using the same photoresist pattern.

In addition, after the photoresist pattern having a relatively low height is removed from the channel part by an ashing process, the source / drain metal pattern and the ohmic contact layer 50 of the channel part are etched by a dry etching process. Accordingly, the active layer 48 of the channel portion is exposed to separate the source electrode 10 and the drain electrode 12.

Subsequently, the photoresist pattern remaining on the second conductive pattern group is removed by a stripping process.

Referring to FIG. 4C, a passivation layer 52 including first to fourth contact holes 13, 21, 27, and 33 on the gate insulating layer 46 on which the second conductive pattern group is formed by using a third mask process. ) Is formed.

In detail, the protective film 52 is entirely formed on the gate insulating film 46 on which the second conductive pattern group is formed by a deposition method such as PECVD. Subsequently, the passivation layer 52 is patterned by a photolithography process and an etching process using a third mask to form first to fourth contact holes 13, 21, 27, and 33. The first contact hole 13 penetrates through the passivation layer 52 to expose the drain electrode 12, and the second contact hole 21 penetrates through the passivation layer 52 to expose the storage electrode 22. The third contact hole 27 penetrates the passivation layer 52 and the gate insulating layer 46 to expose the gate pad lower electrode 26, and the fourth contact hole 33 penetrates the passivation layer 52 to lower the data pad. The electrode 32 is exposed. Here, when a dry etch ratio metal such as molybdenum (Mo) is used as the source / drain metal, each of the first, second, and fourth contact holes 12, 21, and 33 may have a drain electrode 12 and a storage electrode ( 22) through the data pad lower electrode 32 to expose their sides.

As the material of the protective film 52, an inorganic insulating material such as the gate insulating film 46, an acryl based organic compound having a small dielectric constant, or an organic insulating material such as BCB or PFCB is used.

Referring to FIG. 4D, a third conductive pattern group including the pixel electrode 14, the gate pad upper electrode 28, and the data pad upper electrode 34 is formed on the passivation layer 52 using a fourth mask process. do.

In detail, the transparent conductive film is apply | coated on the protective film 52 by the vapor deposition method, such as sputtering. Subsequently, the transparent conductive layer is etched through a photolithography process and an etching process using a fourth mask, thereby forming a third conductive pattern group including the pixel electrode 14, the gate pad upper electrode 28, and the data pad upper electrode 34. Is formed. The pixel electrode 14 is electrically connected to the drain electrode 12 through the first contact hole 13 and electrically connected to the storage electrode 22 through the second contact hole 21. The gate pad upper electrode 28 is electrically connected to the gate pad lower electrode 26 through the third contact hole 37. The data pad upper electrode 34 is electrically connected to the data lower electrode 32 through the fourth contact hole 33.

Herein, materials of the transparent conductive film include indium tin oxide (ITO), tin oxide (TO), indium tin zinc oxide (IZO), and indium zinc oxide (IZO). Is used. (S3)

In the liquid crystal process S4, the two substrates manufactured in the upper array substrate manufacturing process S2 and the lower array substrate manufacturing process S3 are bonded together and a liquid crystal is injected into the liquid crystal layer space 49 therein. It includes.

Peeling process S5 is a process of peeling the upper and lower flexible substrate 45 and the non-flexible board | substrate 47 which completed liquid crystal process S4 from the adhesion layer.

The peeling process S5 will be described with reference to FIGS. 5A and 5B.

As shown in FIG. 5A, the flexible substrates 45a and 45b attached to the viscous adhesive surface are weak. Thereafter, as shown in Fig. 5B, the inflexible substrates 47a and 47b attached to the viscous adhesive surface are removed. 5A and 5B, the electrodes and the color filters formed after the upper and lower array substrate processes on the flexible substrates 45a and 45b are not shown.

The module step (S6) is a step of finally completing the module by attaching a polarizing plate to the panel completed through the steps S1 to S5 and mounting a driving circuit.

On the other hand, as described in the upper and lower array substrate manufacturing process (S2, S3) described above, there are a deposition method for forming each electrode, PECVD (Plasma Enhanced Chemical Vapor Deposition) method, sputtering method and the like. These methods require conditions such as vacuum state, substrate temperature, reaction gas, reaction pressure, and the like.

In addition, after the substrate attaching step S1 is performed, the surfaces of the flexible substrates 45a and 45b attached to the second adhesive 1c and the surfaces of the non-flexible substrates 47a and 47b attached to the first adhesive 1a are small. Bubbles are likely to occur. These small bubbles may be agglomerated during formation of the vacuum state when the upper / lower array substrate manufacturing processes S2 and S3 require the above vacuum state, thereby increasing the size of the bubbles. The phenomenon that bubbles are agglomerated and large is caused by the viscosity of the surfaces of the flexible substrates 45a and 45b attached by the second adhesive 1c to the viscosity of the surfaces of the flexible substrates 47a and 47b attached by the first adhesive 1a. Compared with each other, it is relatively inferior, and therefore occurs at the attachment surface of the second adhesive 1c and the flexible substrates 45a and 45b. Due to the bubbles expanded due to the above, the flexible substrates 45a and 45b may be peeled off from the adhesive layer 1 during the manufacturing process.

In addition, the upper and lower array substrate manufacturing processes S2 and S3 are performed on the flexible substrates 45a and 45b which are relatively weaker than the glass substrates of the conventional liquid crystal display, and thus the upper and lower array substrate manufacturing processes S2 and S3. The flexible substrates 45a and 45b attached to the second adhesive 1c, which are relatively vulnerable to stress due to temperature, pressure, and the like, may be reduced.

In addition, due to the weak viscosity of the second adhesive 1c during the wet etching or the cleaning process during the upper and lower array substrate manufacturing processes S2 and S3, the flexible substrate 45a and the second adhesive 1c are attached. 45b) may be peeled off from the adhesive layer 1.

6A through 15 illustrate a method of manufacturing a flexible display device to prevent the flexible substrate from being peeled off during the manufacturing process of the flexible display device.

6A and 6B are views illustrating a structure of an adhesive used in a method of manufacturing a flexible substrate according to a first embodiment of the present invention. 6A and 6B, the pressure-sensitive adhesive according to the first embodiment of the present invention may include a first adhesive 5a, a support film 5b, a second adhesive 5c, and a third adhesive 55. The adhesive layer 5 and the adhesive layer 5 which are included are provided with the 1st and 2nd protective films 11a and 11b for protecting from the exterior.

The second adhesive 5c is formed at a relatively weaker viscosity than the first adhesive 5a, and the third adhesive 55 is formed at a relatively strong viscosity compared to the second adhesive 5c. The viscosity of the third adhesive 55 may be formed to be the same as the viscosity of the first adhesive 5a.

The supporting film 5b provides a supporting force to the first to third adhesives 5a, 5c, and 55.

As described above with reference to FIG. 2A, the second adhesive 1c layer may generate a peeling phenomenon during the manufacturing process of the flexible display due to the weak viscosity. In order to prevent this, in the first embodiment of the present invention, the third adhesive 55 is formed to have an appropriate width on the edge of the second adhesive 5c layer and the upper portion of the supporting film 5b. FIG. 6B is a plan view showing the structure of the third adhesive material 55 formed on the edge of the second adhesive material 5c layer.

The process of attaching the flexible substrates 47a and 47b and the flexible substrates 45a and 45b to provide flexibility to the display device using the adhesive according to the first embodiment of the present invention is as described with reference to FIGS. 2B and 2C. same.

7 illustrates a structure of an adhesive in a method of manufacturing a flexible display device according to a second embodiment of the present invention.

In the second embodiment of the present invention, the pressure-sensitive adhesive is attached to the pressure-sensitive adhesive layer 6 including the first adhesive 6a, the supporting film 6b, the second adhesive 6c, and the third adhesive 66. First and second protective films 11a and 11b are provided for protecting the layer 6 from the outside.

The second adhesive 6c is formed with a relatively weaker viscosity than the first adhesive 6a, and the third adhesive 66 is formed with a relatively strong viscosity compared to the second adhesive 6c. The viscosity of the third adhesive 66 may be formed to be the same as the viscosity of the first adhesive 6a. And the third adhesive 66 according to the second embodiment of the present invention is formed on the edge of the upper surface of the second adhesive (6c).

The supporting film 6b provides the supporting force to the first and second adhesives 6a and 6c.

Like the third adhesive 55 according to the first exemplary embodiment of the present invention, the third adhesive 66 is formed to prevent peeling of the flexible substrate generated during the process of manufacturing the flexible display device. .

The process of attaching the flexible substrates 47a and 47b and the flexible substrates 45a and 45b to provide flexibility to the display device using the adhesive according to the second embodiment of the present invention is as described with reference to FIGS. 2B and 2C. same.

8A and 8B illustrate a method of manufacturing a flexible display device according to a third exemplary embodiment of the present invention.

Substrate attaching process (S1) according to a third embodiment of the present invention is the step of removing the first protective film (11a) from the pressure-sensitive adhesive described above in Figures 2a and 2b and attaching the non-flexible substrate (47a, 47b), Up to the step of removing the second protective film 11b from the pressure-sensitive adhesive with the non-flexible substrates 47a and 47b is the same as described with reference to FIGS. 2A and 2B. However, the third embodiment of the present invention further includes the step of printing the third adhesive 77 with an appropriate width on the upper edge of the second adhesive 1c from which the second protective film 11b is removed. The method of forming the third adhesive 77 includes a method of forming the seal material in addition to the printing method. After the third adhesive 77 is formed, the flexible substrates 45a and 45b are attached onto the second adhesive 1c and the printed third adhesive 77. Here, the third adhesive 77 is formed with a relatively strong viscosity compared to the second adhesive 1c. The viscosity of the third adhesive 77 may be formed to be the same as the viscosity of the first adhesive 1a.

Like the third adhesive 55 according to the first exemplary embodiment of the present invention, the third adhesive 77 is formed to prevent peeling of the flexible substrate generated during the manufacturing process of the flexible display device. .

Widths of the third adhesives 55, 66, and 77 formed on the edges of the second adhesives 6c and 1c and the upper portions of the second adhesives 6c and 1c in the first to third embodiments of the present invention. 2-8 mm is preferable. If the thickness is less than 2 mm, the peeling phenomenon occurring during the manufacturing process of the flexible display device, which is an object of the present invention, may not be prevented. If the thickness exceeds 8 mm, the flexible substrates 45a and 45b and the flexible substrate during the peeling process S5 may be prevented. There is a difficulty in the stepwise peeling of (47a, 47b).

9A to 9C illustrate an attaching process S1 of a flexible display device according to a fourth exemplary embodiment of the present invention. First, as shown in FIGS. 9A and 9B, a jig substrate 100 including a first groove 113 and a second groove 117 is prepared through an etching process. Thereafter, the adhesive 101 is applied to the second groove 117 of the jig substrate 100, and then the flexible substrate 103 is fixed to the first groove 113 of the jig substrate 100 as shown in FIG. 8C. The flexible substrate 103 is attached to the pressure-sensitive adhesive 107 applied to the second groove 117.

In order to fix and attach the flexible substrate 103 in detail, first, the jig substrate 100 will be described. The jig substrate 100 is a groove formed in the non-flexible substrate. In the fourth embodiment of the present invention, the jig substrate 100 includes a first groove 113 on which the flexible substrate is to be fixed and a second groove 117 on which the adhesive 107 is to be filled. The first groove 113 and the second groove 117 are formed by performing an etching process on the glass substrate. The use of the glass substrate as the non-flexible substrate is because it is not easy to manufacture the jig substrate 100 because a separate coating treatment is required to prevent chemical damage when using a metal substrate. In addition, the jig substrate 100 may be formed as a non-flexible substrate because the support substrate may be provided to precisely proceed the wiring forming process in which the non-flexible substrate is formed on the flexible substrate 103.

On the other hand, the width and the thickness of the first groove 113 is formed to be the same as the width and thickness of the flexible substrate 103 so that the flexible substrate 103 is fixed. The first groove 113 may fix the flexible substrate 103 in the manufacturing process of the flexible display device to prevent the flexible substrate 103 from moving during the manufacturing process of the flexible display device. In addition, the second groove 117 may be formed under the edge of the first groove 113 to provide a space where the adhesive 107 may be applied to allow the flexible substrate 103 to be attached to the jig substrate 100. do. The width x of the second groove 117 is formed to 5mm ~ 100mm. When the width x of the second groove 117 is less than 5 mm, since the adhesive force is not sufficiently provided, the flexible substrate is peeled off during the manufacturing process of the flexible display device, so 5 mm or more is appropriate. In addition, if the width (x) of the second groove 117 exceeds 100mm, since it is difficult to proceed the peeling step (S5) in the future, less than 100mm is appropriate. The thickness y of the second groove 117 has the same thickness as that of the pressure-sensitive adhesive 101 to be applied. The second groove 117 having the same thickness as the pressure-sensitive adhesive 101 has the flexible substrate 103 attached to the pressure-sensitive adhesive 101 applied to the second groove 117, and then the flexible substrate 103 and the jig substrate ( It is possible to avoid the step between 100). That is, the second groove 117 prevents a step generated in the flexible substrate 103 due to the thickness of the adhesive 107 applied to the jig substrate 100. Since no step is generated between the flexible substrate 103 and the jig substrate, the upper and lower array substrate processes to be described later may be stably performed on the flexible substrate 103.

In the attaching step S1 of the flexible substrate 103 and the jig substrate 100, the first flexible substrate 103a and the first jig substrate 100a and the lower array which have passed through the upper array substrate manufacturing process S2 are performed. It progresses in the 2nd flexible board | substrate 103b and the 2nd jig board | substrate 100b which respectively passed the board | substrate manufacturing process S3.

FIG. 10 is a view briefly illustrating processes after a flexible display device attaching process S1 according to a fourth exemplary embodiment of the present invention. In addition, the electrodes and the color filters formed after the upper and lower array substrate processes on the flexible substrates 103a and 103b shown in FIGS. 11A and 11B are not shown.

Referring to FIG. 10, upper and lower array substrate manufacturing processes S2 and S3 are performed on a flexible substrate attached to a jig substrate.

Detailed descriptions of the upper and lower array substrate manufacturing processes S2 and S3 are omitted since they have been described above with reference to FIGS. 3A to 4D.

Then, the liquid crystal process (S4) of bonding the two substrates produced in the upper array substrate manufacturing process (S2) and the lower array substrate manufacturing process (S3) into one and injecting liquid crystal into the liquid crystal layer 149 space therein. Proceed).

After completing the liquid crystal process (S4), the upper and lower array substrates are subjected to a peeling process (S5) in which the adhesive is peeled off.

11A and 11B, the peeling step S5 will be described in detail. The peeling step S5 may be slightly different depending on the type of the adhesive 107 applied to the second groove 117.

The pressure-sensitive adhesive 107 applied to the second grooves 117 may include pressure-sensitive adhesives of ultraviolet (UV) type and thermal type and polyimide (PI) adhesive tape having strong heat resistance.

In the case of using the ultraviolet-ray type adhesive, when the adhesive 101 is irradiated with ultraviolet rays during the peeling process (S5), the adhesive 107 loses the adhesive force, and thus the first and second jig substrates 100a and 100b are used. The two flexible substrates 103a and 103b are separated.

The thermal type adhesive includes an adhesive which loses the adhesive force at a temperature below room temperature and an adhesive which loses the adhesive force at a temperature of 20 ° C to 200 ° C. When using the pressure-sensitive adhesive at a temperature below room temperature, the peeling process (S5) is performed in a cool-off manner by applying a temperature below room temperature to the pressure-sensitive adhesive 107 to lose the adhesive force. When using the pressure-sensitive adhesive at a temperature of 20 ℃ ~ 200 ℃ peeling step (S5) by applying a temperature of 20 ℃ ~ 200 ℃ to the pressure-sensitive adhesive 101 to lose the adhesive force (warm-off) method Proceed.

In the case of using the polyimide adhesive tape, the edges of the first and second flexible substrates 103a and 103b having the polyimide adhesive tape are peeled off with a laser during the peeling process (S5).

12A through 14E illustrate a method of manufacturing a flexible display device according to a fifth exemplary embodiment of the present invention.

The method of manufacturing the flexible display device according to the fifth exemplary embodiment of the present invention is manufactured through the process described above with reference to FIG. 1.

Meanwhile, a defective pattern may be formed on the flexible substrate by bubbles generated between the adhesive layer and the flexible substrate or the adhesive layer and the non-flexible substrate during the substrate attaching process S1.

Defect pattern formation by bubbles will be described in detail with reference to 12a to 12f.

As shown in FIG. 12A, the substrate attaching process S1 is performed using an adhesive including the adhesive layer 101, the first passivation layer 111a, and the second passivation layer 111b.

The first and second passivation layers 111a and 111b are for preventing the adhesion layer 101 from being exposed to the outside and being contaminated.

The adhesive layer 101 is attached with a flexible substrate to provide flexibility to the display device and a non-flexible substrate to support the electrode formation precisely.

As a non-flexible board | substrate, the glass substrate which can provide a support force is used, and as a flexible board | substrate, a flexible plastic board | substrate is used, which is strong in heat resistance.

Referring to the process of attaching the flexible substrate and the non-flexible substrate in stages, first, as shown in FIG. 12B, the first protective layer 111a of the adhesive is removed and the first surface of the adhesive layer 101 is exposed.

Referring to FIG. 12C, the exposed first surface of the adhesive layer 101 is attached to the non-flexible substrate 147 by bringing it into close contact with the roll 105.

During the process of being in close contact with the roll 105 as described above, as shown in FIG. 12D, adhesion between the inflexible substrate 147 and the adhesive layer 101 may not be performed properly, and thus fine bubbles may occur. Such bubbles may cause irregularities on the pressure-sensitive adhesive surface attached to the non-flexible substrate 147.

Thereafter, as shown in FIG. 12E, the second protective film 111b of the adhesive attached to the non-flexible substrate 147 is removed, the second surface of the adhesive layer 101 is exposed, and then the exposed adhesive layer 101 is exposed. The second surface of the flexible substrate 145 and the pressure-sensitive adhesive layer 101 is brought into close contact through the roll 105 so that the flexible substrate 145 is attached to the second surface of the flexible substrate 145. In this process, even though the second surface of the flexible substrate 145 and the adhesive layer 101 is not properly adhered as shown in FIG. 12F, bubbles may occur.

The bubbles have a hydrophilicity of the flexible substrate 145 and the non-flexible substrate 147 exposed to the outside compared to the hydrophilicity of the adhesive layer 101 protected by the first and second passivation layers 111a and 111b. Since it is weak, it is a phenomenon which arises because the adhesive strength of each adhesive surface falls. The adhesive strength can be increased only if the degree of hydrophilicity is similar.

The bubbles generated in the above-described processes of FIGS. 12C to 12E are problematic because the uneven parts A are generated on the surface of the flexible substrate 145 to be arrayed.

The uneven portion A lowers the stability of the thin film transistor array process and the color filter array process performed after the substrate attaching process S1. That is, the uneven portion A interferes with the normal formation of the wirings formed during the thin film transistor array process and the color filter array process, thereby forming a defective pattern, thereby reducing the stability of the manufacturing process of the flexible display device. Since the thin film transistor array process and the color filter array process have been described above with reference to FIGS. 3A to 4D, they will be omitted.

13 to 14E are views for explaining a manufacturing process of a flexible liquid crystal display according to a fifth embodiment of the present invention including a process for preventing the generation of bubbles.

Referring to FIG. 13, in the fifth embodiment of the present invention, chemical treatment is performed on the surfaces of the non-flexible substrate 247 and the flexible substrate 245 used for manufacturing the flexible display device.

The chemically treated surfaces of the non-flexible substrate 247 and the flexible substrate 245 are surfaces adhered to the adhesive layer in the substrate attaching step S1.

Chemical treatment of the surfaces of the inflexible substrate 247 and the flexible substrate 245 is made inflexible using a solvent having high hydrophilicity and a high volatility such as acetone, propylene glycol monomethyl ether acetate (PGMEA) and isopropyl alcohol (IPA). This is accomplished by cleaning the surfaces of the substrate 247 and the flexible substrate 245.

As described above, when the surfaces of the non-flexible substrate 247 and the flexible substrate 245 are treated using a solvent having a strong hydrophilicity, the surface-treated surfaces of the non-flexible substrate 247 and the flexible substrate 245 have high hydrophilicity.

14A to 14E are views for explaining a step of attaching a substrate according to a fifth embodiment of the present invention step by step.

The substrate attaching process S1 according to the fifth embodiment of the present invention is performed using an adhesive including an adhesive layer 201, a first passivation layer 211a, and a second passivation layer 211b as illustrated in FIG. 13A. .

The first and second passivation layers 211a and 211b are for preventing the adhesion layer 201 from being exposed to the outside and being contaminated.

The adhesive layer 201 is attached with a flexible substrate that provides flexibility to the display device and a non-flexible substrate to support the electrode formation precisely.

As a non-flexible board | substrate, the glass substrate which can provide a support force is used, and as a flexible board | substrate, a flexible plastic board | substrate is used, which is strong in heat resistance.

In addition, the inflexible substrate and the flexible substrate used in the fifth embodiment of the present invention are surface treated as described above in FIG.

A process of attaching the flexible substrate and the non-flexible substrate is described step by step. First, as shown in FIG. 14A, the first passivation layer 211a is removed and the first surface of the adhesive layer 201 is exposed.

Referring to FIG. 14B, the exposed first surface of the adhesive layer 201 is brought into close contact with the inflexible substrate 247 through the roll 205 to attach to the inflexible substrate 247.

Referring to FIG. 14C, the second protective film 211b of the adhesive attached to the non-flexible substrate 247 is removed to expose the second surface of the adhesive layer 201. The second surface of the flexible substrate 245 and the adhesive layer 201 are brought into close contact with the second surface of the exposed adhesive layer 211b through the roll 205 to attach the flexible substrate 245.

Referring to FIG. 14D, the second protective film 211b of the adhesive adhered on the non-flexible substrate 247 is removed to expose the second surface of the adhesive layer 201. As shown in FIG. 13E, the flexible substrate 245 and the second surface of the adhesive layer 201 are brought into close contact with each other through the roll 105 to attach the flexible substrate 245 to the exposed second surface of the adhesive layer 201. Substrate attachment process S1 is completed.

By adhering the flexible substrate 245 and the non-flexible substrate 247 with improved hydrophilicity by surface treatment in the above-described processes of FIGS. 14B to 14E to the adhesive layer 201, bubbles generated due to poor adhesion are remarkably remarkable. Can be reduced. The bubble generation is reduced because the adhesion strength of the adhesive and adhesive layers 201 and 247 of the flexible and non-flexible substrates 245 and 247 with improved hydrophilicity is increased by surface treatment.

Significantly reduced bubbles improve the stability of the thin film transistor array process and the color filter array process performed after the substrate attach process (S1). In other words, wiring defects formed during the thin film transistor array process and the color filter array process are reduced by bubbles, thereby improving the stability of the manufacturing process of the flexible display device. Since the thin film transistor array process and the color filter array process are described above with reference to FIGS. 3A to 4D, they will be omitted.

In addition, as described above with reference to FIG. 13, the surface treatment of the flexible substrate 245 and the non-flexible substrate 247 using a highly volatile solvent may be performed using the adhesive layer 201, the flexible substrate 245, and the non-flexible substrate ( This is to prevent the length of time 247) from sticking.

As described above, the manufacturing method of the flexible display device according to the embodiments of the present invention includes not only the liquid crystal display panel of the IPS mode and the liquid crystal display panel of the TN mode, but also of the ECB (Electric Controlled Birefringence) and VA (Vertical Alignment) modes. The liquid crystal display panel can also be easily applied. Furthermore, the present invention can also be used in a method of manufacturing an organic light emitting display device which is a self-luminous element.

A cross-sectional structure of an organic light emitting display device manufactured by applying the embodiments of the present invention will be described with reference to FIG. 15.

The schematic structure of the flexible organic light emitting display device is an organic light emitting layer formed on the flexible substrate 82 at the intersection of the anode electrode 84 and the cathode electrode 86, and the anode electrode 84 and the cathode electrode 86. 80 is provided. When driving signals are applied to the anode electrode 84 and the cathode electrode 86 of the organic light emitting display device having such a structure, electrons and holes are emitted, and electrons and holes emitted from the anode electrode 84 and the cathode electrode 86 Jeonggok generates visible light while recombining in the organic light emitting layer (80). At this time, the visible light is emitted to the outside through the anode electrode 84 to display a predetermined image or image.

As described above, the method of manufacturing the flexible display device according to the present invention includes the third adhesive on the edge of the adhesive layer and the upper edge of the adhesive layer used in the substrate attaching process or during the attachment process. And printing the third adhesive on the upper edge of the second adhesive. As the adhesive force of the third adhesive is stronger than that of the second adhesive, the risk of peeling caused by the weak adhesive force of the second adhesive during the manufacturing process of the flexible display device is reduced. In addition, since the third adhesive protects the weak side of the flexible substrate attached with the second adhesive, it is possible to prevent the shrinkage of the flexible substrate formed due to the stress of the deposition film generated during each process.

Therefore, the stability and productivity of the flexible display device manufacturing process can be expected.

In addition, the present invention enables a flexible display device manufacturing process to be more stable by using a jig substrate having a first groove to which the flexible substrate is fixed and a second groove to which the adhesive is applied. The second grooves are formed to have the same thickness as the pressure-sensitive adhesive applied to the second grooves, so that even if the flexible substrate is attached, a step does not occur between the flexible substrate and the jig substrate. That is, the second groove prevents a step generated due to the thickness of the adhesive applied to the jig substrate. Since no step occurs between the flexible substrate and the jig substrate, the upper and lower array substrate processes can be stably performed on the flexible substrate. In addition, the first groove of the jig substrate is manufactured to be the same size as the flexible substrate, thereby reducing the probability that the flexible substrate can flow during the manufacturing process. Since the jig substrate is easy to manufacture, it is possible to secure productivity and process stability of the flexible substrate.

The present invention also improves the hydrophilicity of the adhesion surface of the adhesive layer and the flexible substrate or the adhesion surface of the adhesive layer and the non-flexible substrate by attaching the flexible and non-flexible substrates surface-treated through a hydrophilic solvent to the adhesive layer. Improve the adhesive properties of the adhesive face. As the adhesive property is improved, the number of bubbles generated on the adhesive surface is remarkably reduced, thereby reducing the occurrence of defective patterns caused by bubbles, thereby stabilizing the manufacturing process of the flexible display device.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (28)

Providing a first adhesive layer comprising a support film, first and second adhesives formed on each of the first and second surfaces of the support film, and a third adhesive material surrounding an edge of the second adhesive material; Attaching a first non-flexible substrate on the first adhesive of the first adhesive layer; Attaching a first flexible substrate on the second and third adhesives of the first adhesive layer; And Fabricating an upper array substrate on the first flexible substrate; Providing a second adhesive layer comprising a support film, first and second adhesives formed on each of the first and second surfaces of the support film, and a third adhesive material surrounding an edge of the second adhesive material; Attaching a second non-flexible substrate on the first adhesive of the second adhesive layer; Attaching a second flexible substrate on the second and third adhesives of the second adhesive layer; And Fabricating a lower array substrate on the second flexible substrate; Bonding the upper array substrate and the lower array substrate and injecting liquid crystal; And peeling the first flexible substrate and the first non-flexible substrate from the first adhesive layer and peeling the second flexible substrate and the second non-flexible substrate from the second adhesive layer. The providing of the first and second adhesive layers may include: a first passivation layer attached on the first surface of the support layer with the first adhesive interposed therebetween; and the second and third adhesive layers interposed therebetween. A method of manufacturing a flexible display device, the method comprising: providing an adhesive including a second passivation layer on a second surface of the support layer. The method according to claim 1, And the first and third adhesives are made of the same adhesive material. The method according to claim 1, The width of the third adhesive is a manufacturing method of the flexible display device, characterized in that between 2mm to 8mm. Providing a first adhesive layer comprising a support film, first and second adhesives formed on each of the first and second surfaces of the support film, and a third adhesive formed on the second adhesive; Attaching a first non-flexible substrate on the first adhesive of the first adhesive layer; Attaching a first flexible substrate on the second and third adhesives of the first adhesive layer; And Fabricating an upper array substrate on the first flexible substrate; Providing a second adhesive layer comprising a support film, first and second adhesives formed on each of the first and second surfaces of the support film, and a third adhesive formed on the second adhesive; Attaching a second non-flexible substrate on the first adhesive of the second adhesive layer; Attaching a second flexible substrate on the second and third adhesives of the second adhesive layer; And Fabricating a lower array substrate on the second flexible substrate; Bonding the upper array substrate and the lower array substrate and injecting liquid crystal; And peeling the first flexible substrate and the first non-flexible substrate from the first adhesive layer and peeling the second flexible substrate and the second non-flexible substrate from the second adhesive layer. The providing of the first and second adhesive layers may include: a first passivation layer attached on the first surface of the support layer with the first adhesive interposed therebetween; and the second and third adhesive layers interposed therebetween. A method of manufacturing a flexible display device, the method comprising: providing an adhesive including a second passivation layer on a second surface of the support layer. 5. The method of claim 4, And the first and third adhesives are made of the same adhesive material. 5. The method of claim 4, The third adhesive is formed in the form of a band on the edge of the second adhesive, the manufacturing method of the flexible display device. The method of claim 6, The width of the third adhesive is a manufacturing method of the flexible display device, characterized in that between 2mm to 8mm. Providing a first adhesive layer composed of a support film and first and second adhesives formed on each of the first and second surfaces of the support film; Attaching a first non-flexible substrate on the first adhesive of the first adhesive layer; Attaching a first flexible substrate on the second adhesive of the first adhesive layer; And Fabricating an upper array substrate on the first flexible substrate; Providing a second adhesive layer composed of a support film and first and second adhesives formed on each of the first and second surfaces of the support film; Attaching a second non-flexible substrate on the first adhesive of the second adhesive layer; Attaching a second flexible substrate on the second adhesive of the second adhesive layer; And Fabricating a lower array substrate on the second flexible substrate; Bonding the upper array substrate and the lower array substrate and injecting liquid crystal; And peeling the first flexible substrate and the first non-flexible substrate from the first adhesive layer and peeling the second flexible substrate and the second non-flexible substrate from the second adhesive layer. The preparing of the first and second adhesive layers may include forming a first passivation layer attached on the first surface of the support layer with the first adhesive interposed therebetween, and the support layer having the second adhesive interposed therebetween. A method of manufacturing a flexible display device, the method comprising: providing an adhesive including a second passivation layer attached on two surfaces. delete delete delete Forming first and second non-flexible substrates including a first groove and a second groove formed under the edge of the first groove; Applying an adhesive to the second groove of each of the first and second non-flexible substrates; Fixing first and second flexible substrates to the pressure-sensitive adhesive and the first groove of each of the first and second non-flexible substrates, respectively; Fabricating an upper array substrate on the first flexible substrate and fabricating a lower array substrate on the second flexible substrate; Bonding the upper array substrate and the lower array substrate and injecting liquid crystal; Peeling the first and second flexible substrates from the first and second non-flexible substrates. 13. The method of claim 12, The width of the second groove is formed to 5mm to 100mm, The thickness of the second groove is formed in the same thickness as the pressure-sensitive adhesive manufacturing method of a flexible display device. 13. The method of claim 12, The width and thickness of the first groove is formed to be the same as the width and thickness of the flexible substrate. 13. The method of claim 12, The adhesive applied to the second groove includes a polyimide tape, Peeling the first and second flexible substrates from the first and second non-flexible substrates, cutting edges of the first and second flexible substrates to which the polyimide tape is adhered using a laser. Method of manufacturing a flexible display device characterized in that the progress. 13. The method of claim 12, The pressure-sensitive adhesive applied to the second groove includes a pressure-sensitive adhesive that loses adhesion in response to ultraviolet rays, Peeling the first and second flexible substrates from the first and second non-flexible substrates by irradiating the adhesive with ultraviolet rays. 13. The method of claim 12, The pressure-sensitive adhesive applied to the second groove includes a pressure-sensitive adhesive that loses adhesive strength in response to temperature. Peeling the first and second flexible substrates from the first and second non-flexible substrates, by applying temperature to the pressure-sensitive adhesive. Providing first and second flexible substrates on which the surface is hydrophilized and first and second non-flexible substrates on the surface; Attaching a first surface of a first adhesive layer to a hydrophilic surface of the first non-flexible substrate and attaching a second surface of the first adhesive layer to a hydrophilic surface of the first flexible substrate; Fabricating an upper array substrate on the first flexible substrate; Attaching a first surface of a second adhesive layer to a hydrophilic treatment surface of the second flexible substrate and attaching a second surface of a second adhesive layer to a hydrophilic treatment surface of the second flexible substrate; Fabricating a lower array substrate on the second flexible substrate; Bonding the upper array substrate and the lower array substrate and injecting liquid crystal; And peeling the first flexible substrate and the first non-flexible substrate from the first adhesive layer and peeling the second flexible substrate and the second non-flexible substrate from the second adhesive layer. Each of the first and second adhesive layers includes a support film, first and second adhesive materials formed on each of the first and second surfaces of the support film, and a third adhesive material formed on the second adhesive material. Method of manufacturing a flexible display device characterized in that. The method of claim 18, The hydrophilic treatment A method of manufacturing a flexible display device, characterized in that it is made through a solvent containing any one of acetone, PGMEA, IPA. The method according to claim 1, And the second adhesive is less viscous than the first adhesive, and the third adhesive is more viscous than the second adhesive. The method according to claim 1, The attaching of the first and second non-flexible substrates may include attaching the first and second adhesive layers on the first adhesive after removing the first protective layer from each of the first and second adhesive layers. Manufacturing method. The method according to claim 1, The attaching of the first and second flexible substrates may include attaching the first and second flexible substrates to the second and third adhesives after removing the second protective layer from each of the first and second adhesive layers. Method for manufacturing a display device. 5. The method of claim 4, And the second adhesive is less viscous than the first adhesive, and the third adhesive is more viscous than the second adhesive. 5. The method of claim 4, The attaching of the first and second non-flexible substrates may include attaching the first and second adhesive layers on the first adhesive after removing the first protective layer from each of the first and second adhesive layers. Manufacturing method. 5. The method of claim 4, The first and second flexible substrates may be attached onto the second and third adhesive materials after removing the second protective layer from each of the first and second adhesive layers. Way. The method of claim 8, And the first and second non-flexible substrates are attached onto the first adhesive after removing the first passivation layer from each of the first and second adhesive layers. The method of claim 8, Attaching the first and second flexible substrate, Removing the second protective film from each of the first and second adhesive layers; And Forming a third adhesive having a viscosity higher than that of the second adhesive on the second adhesive. The method of claim 27, And the second adhesive is less viscous than the first adhesive, and the third adhesive is more viscous than the second adhesive.

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