KR101131445B1 - Apparatus for removing of solder ball on semiconductor package - Google Patents

Abstract

According to the present invention, instead of removing the solder balls by conventional manual work, the semiconductor package with the solder balls attached horizontally is mounted horizontally using a mechanical device, and the surface of the semiconductor package is simply rotated by rotating the clip handles in the front and rear directions. Accordingly, the present invention relates to a solder ball removing device of a semiconductor package which can easily remove solder balls by automatically moving the cutter forward.
In addition, the present invention can improve the work efficiency by simply rotating the operation handle without a large force compared to the conventional hand-held semiconductor package to hold the solder ball with the cutter blade to cut the cutting work, it is possible to improve the working efficiency by a cutter Since solder balls can be removed, the solder balls can be removed within a short time (1 to 2 seconds).
In addition, by using a spacer, the pressure plate is kept horizontally at a constant interval in the vertical direction with the bottom surface (always a constant reference plane A) of the slide plate, and the spacers are exchanged according to the size of the solder balls to replace the printed circuit board with the solder balls. By matching the surface (reference plane B, which varies depending on the size of the solder ball) with the bottom of the cutter, the cut surface of the solder ball cut by the cutter is flush with the surface of the printed circuit board to obtain a uniform measurement value for the subsequent warpage measurement. The reliability can be improved.

Description

Apparatus for removing of solder ball on semiconductor package

The present invention relates to a solder ball removing device of a semiconductor package, and more particularly to a solder ball removing device of a semiconductor package that can easily remove the solder ball attached to the semiconductor package.

In general, in a BGA semiconductor package, a semiconductor chip is mounted on a center portion of a printed circuit board, and the semiconductor chip is connected by a copper pattern and a conductive wire on a surface of the printed circuit board, and the printed circuit is protected to protect the semiconductor chip and the conductive wire. The surface of the board | substrate is sealed with sealing materials, such as a molding compound resin.

In order to mount such a semiconductor package on a motherboard or the like, a solder ball is attached to a ball land formed on the back of the printed circuit board and used as an external connection terminal.

During the manufacturing process of the semiconductor package, the heat is transferred from the manufacturing equipments between each process, and the high heat of the semiconductor chip generated for the electrical operation after mounting the completed semiconductor package on the motherboard of the electronic device is received. .

In this case, the printed circuit board, the semiconductor chip, and the encapsulant (molding compound resin) may have different thermal expansion coefficients, resulting in warpage phenomenon, which is a phenomenon of bending in one direction while repeating different thermal expansion and contraction. do.

For example, the thermal expansion coefficient of the copper pattern formed on the surface of the printed circuit board is known to be the largest, and since the semiconductor chip and the molding compound resin also have different thermal expansion coefficients, the entire semiconductor package including the printed circuit board. The warpage phenomenon in which is bent in one direction occurs.

Due to this warpage phenomenon, an interface delamination in which the interface between the printed circuit board and the semiconductor chip and the interface between the semiconductor chip and the molding compound resin is separated from each other results in defects and deterioration of the semiconductor package. Done.

Therefore, the warpage inspection is performed on the final product in which the semiconductor package is manufactured.

In order to check the degree of warpage of the final product, optical methods are mainly used.

For example, after irradiating the surface of the warpage measurement object using a light source such as an infrared ray source, the warpage is measured by detecting the reflected light.

However, since the solder ball is attached to the bottom surface of the printed circuit board as the warpage measurement object, even if the light source is irradiated on the surface of the printed circuit board, the surface of the printed circuit board is covered by the solder ball so that the warpage on the surface of the printed circuit board is measured. There is a disadvantage that can not.

In other words, the degree of bending of the warpage generated portion of the semiconductor package should be photographed by irradiating the light source, and the solder ball of the printed circuit board acts as a disturbing factor causing distortion when the degree of bending is taken. There was a disadvantage not to lose.

Therefore, in order to perform the warpage inspection, the solder ball attached to the ball land of the printed circuit board must be removed.

However, in the related art, since the operator removes the solder balls directly attached to the bottom surface of the printed circuit board manually by using a cutter blade by holding the printed circuit board by hand, it takes a long time to remove the solder balls.

As described above, when the solder ball is manually removed, the work efficiency decreases as the quantity of the warpage measurement object increases. In particular, a sharp cutter blade may cause a worker to be fatally injured by cutting a finger.

In addition, since the remainder of the solder ball cut by the cutter blade still remains on the printed circuit board and the cutting surface is not uniform, there is a problem that the warpage measurement value varies depending on the measurement position when the warpage is measured later. .

The present invention has been invented to solve the above problems, and instead of removing the solder balls by conventional manual work, the semiconductor package with a solder ball attached to the inside of the mechanical device is mounted horizontally, and the clip handle is rotated. Solder ball removal device of semiconductor package that makes it easy to remove solder balls attached to the board for warpage measurement by allowing the cutter to move forward and move automatically along the surface of the semiconductor package. The purpose is to provide.

In addition, the present invention improves work efficiency by removing a plurality of solder balls at a time by using a mechanical device, and the operator's hands are cut off by directly removing the solder balls directly attached to the semiconductor package by the cutter blade. Another object is to provide a solder ball removal apparatus of a semiconductor package that can prevent injury.

In addition, the present invention improves that the cutting surface of the solder ball is not uniform due to the removal of the solder ball by the cutter blade by manual operation to elastically support the supporting plate loaded with the semiconductor package by the coil spring, the solder ball of the semiconductor package loaded on the supporting plate It is another object of the present invention to provide a solder ball removing apparatus of a semiconductor package in which the surface of the semiconductor package with solder balls is aligned with the bottom of the cutter so that the cut surface of the solder balls is coplanar with the surface of the semiconductor package.

In order to achieve the above object of the present invention, an operation handle for generating a rotational driving force by the rotation operation; A rotating disc that rotates by receiving a rotational driving force through a hinge shaft hinged to the rear end of the manipulation handle; A connecting rod hinged to one side of an edge of the rotating disc to convert a rotational movement of the manipulation handle into a linear movement; A slide plate hinged to the front end of the connecting rod and movably mounted in the front and rear directions; A support plate on which a semiconductor package is loaded; It is mounted on the bottom surface of the slide plate, and provides a solder ball removal device of a semiconductor package including a cutter for cutting the solder ball of the semiconductor package loaded on the support plate while moving along the surface of the semiconductor package attached to the solder ball.

By the above configuration, when the operation handle is rotated backward, the rotating disc is converted into the linear motion of the slide plate by the connecting rod, and the cutter mounted on the bottom surface of the slide plate of the semiconductor package having the solder ball attached thereto. Solder balls can be easily removed while advancing along the surface.

In addition, by cutting and removing a plurality of solder balls at once without a large force by a simple rotation operation of the operation handle, it is possible to improve the work efficiency, it is possible to significantly shorten the working time.

In addition, by mounting a coil spring in the lower portion of the support plate to support the support plate to be movable in the vertical direction, by mounting a pressure plate on the bottom of the slide plate to press the fixed solder ball seated on the support plate to press the solder ball by the elastic force of the coil spring It is characterized in that the cutter's machinability can be improved by closely adhering and aligning horizontally.

In addition, by mounting a spacer between the slide plate and the pressure plate, and by using the spacer to replace the size of the solder ball, it is possible to reduce the time required to set the height of the cutter.

Through the above problem solving means, the present invention provides the following effects.

1) The solder ball can be easily moved by moving the cutter along the surface of the semiconductor package to which the solder ball is attached by a simple rotating operation by placing the semiconductor package horizontally on the support plate using a mechanical device and rotating the operation handle back and forth. Can be removed.

2) Compared to holding the semiconductor package by hand and pushing the solder ball with the cutter blade, it is possible to improve the work efficiency by simply rotating the operation handle without the need for great force. Because it can be removed, it can be shortened in a short time (1 to 2 seconds) to remove the solder ball.

3) Using a spacer, the pressure plate is kept horizontally at a constant distance from the bottom surface (always a constant reference plane A) of the slide plate in the vertical direction, and the spacers are exchanged according to the size of the solder balls so that the printed circuit board By matching the surface (reference plane B, which varies depending on the size of the solder ball) with the bottom of the cutter, the cut surface of the solder ball cut by the cutter is flush with the surface of the printed circuit board to obtain a uniform measurement value for the subsequent warpage measurement. The reliability can be improved.

4) The support plate is elastically supported by the coil spring, and by pressing the solder ball of the semiconductor package seated on the upper surface of the support plate with the pressure plate, the solder ball is closely adhered to and aligned with the pressure plate arranged horizontally by the elastic force of the coil spring to cut the cutter. Work is smooth.

1 is a perspective view illustrating a bottom surface of a semiconductor package having a solder ball attached thereto, and the solder ball is removed using the solder ball removing device of the present invention.
Figure 2 is a perspective view showing the main components of the solder ball removing apparatus according to an embodiment of the present invention
Figure 3 is a perspective view showing a state that the slide plate is advanced by the rotation operation of the clip handle in Figure 2
4 is a cross-sectional view showing an operating state according to the operation of the clip handle in FIG.
Figure 5 is a perspective view showing the appearance of the solder ball removing apparatus according to an embodiment of the present invention
6 is an exploded perspective view of FIG.
FIG. 7 is a perspective view illustrating a state in which the upper frame is lifted to load the semiconductor package onto the support plate in FIG. 5; FIG.
8 is a perspective view showing a state in which the upper frame is closed in FIG.
FIG. 9 is a cross-sectional view illustrating a reference plane A of the slide plate and a reference plane B to which the cutter moves in FIG. 4; FIG.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

The present invention focuses on the fact that the solder ball of the semiconductor package is automatically removed instead of manually, so that the warpage test can be accurately performed.

That is, the solder ball removal apparatus of the semiconductor package of the present invention can easily remove the solder ball attached to the bottom surface of the printed circuit board in the semiconductor package such as BGA package by using a cutter to accurately perform the curved surface shooting in the warpage test It would be.

1 shows the solder balls before and after they are removed from the printed circuit board.

1, the solder ball 52 is attached to the printed circuit board 51 at regular intervals in the transverse and longitudinal directions.

Referring to the right figure of Figure 1, by removing the solder ball 52 attached to the printed circuit board 51 by using a solder ball removal device of a semiconductor package according to the present invention, the solder ball removed from the printed circuit board 51 ( 52 is formed on the same plane as the surface of the printed circuit board 51 and is formed of a uniform surface without bending as a whole.

2 and 3 are perspective views showing the main configuration of the solder ball removing device of the semiconductor package according to an embodiment of the present invention, Figure 4 is a cross-sectional view showing a state in which the solder ball is removed by the cutter in FIG.

2 to 4, since the cutter 43 is located at the right side of the solder ball 52 of the semiconductor package 50 to be cut and moves forward from right to left, the cutter 43 cuts the solder ball 52. The rear end or back of a component means the right end or right side of that component, and the front end or front of a component means the left end or left side of the component, .

Also, "turn forward and backward" means to rotate from right to left (forward) or from left to right (forward), and "move forward and backward" to move from right to left or from left It means to move to the right.

The solder ball removing device is a main component for cutting and removing the solder ball 52 of the semiconductor package 50 by using the cutter 43, the operation handle 10, the rotating disc 24, the connecting rod 44, The slide plate 27, the cutter 43, the spacer 28, the pressure plate 30, the support plate 33, the coil spring 35, the support block 36 is included.

The operation handle 10 is formed of a "one" shaped bar (bar) structure, the rear end of the operation handle 10 is hinged to the upper end of the rotary shaft 26 disposed in the vertical direction, the operation handle Since the front end of the 10 is horizontally disposed at the free end, when the front end of the operation handle 10 is rotated forward and backward, the rotational force generated by the rotation operation of the operation handle 10 is rotated through the rotation shaft 26 ( 24) is delivered.

In addition, the rear end of the operation handle 10 is hinged to the upper end of the hinge shaft 23 in a serration or gear type, and the lower end of the hinge shaft 23 is serrated above the central portion of the rotating disc 24. Alternatively, by inwardly hinged by the gear type, the amount of rotation (rotation angle) of the operation handle 10 is transmitted to the rotation disc 24 as it is through the rotation shaft 26, when the operation handle 10 is rotated. 24 rotates the same as the rotation angle of the operation handle (10).

The connecting rod 44 has a bar structure having a “one” shape, and a rear end of the connecting rod 44 is hinged to a side of an edge portion of the rotating disk 24 by a hinge pin. By rotating along the trajectory of the circular motion, the front end of the connecting rod 44 is hinged to the rear end of the slide plate 27 by a hinge pin to move forward and backward along the trajectory of the front and back linear motion of the slide plate 27 , And converts the rotational movement of the rotary disk 24 to the linear movement of the slide plate 27.

At this time, the rod receiving groove 25 is formed in the radially concave in the circumferential direction at least 180 or more in the rotation disc 24, the rear end of the connecting rod 44 through the rod receiving groove 25 It is inserted and hinged to one side of the edge of the rotating plate.

The slide plate 27 is mounted to be movable in the front-rear direction, the rear end of the slide plate 27 is hinged to the front end of the connecting rod 44, the connecting rod 44 from the rotating disk 24 It moves in the front-rear direction by the linear force converted through.

At this time, the rear end of the slide plate 27 is formed with a projection horizontally, the bottom portion of the rear end of the slide plate 27 is formed in the form of the bent portion protrudes in parallel with the protrusion, the protrusion and the bent portion Between the front end of the connecting rod 44 is inserted, the hinge shaft 23 is hinged through the protrusion from the top of the slide plate 27, through the front end and the bent portion of the connecting rod 44.

The cutter 43 is mounted on the bottom surface of the slide plate 27 through a cutting block to move forward and backward with the slide plate 27, and the semiconductor package 50 having the cutter 43 horizontally disposed at the front side thereof. The lower solder ball 52 is cut along the surface of the printed circuit board 51 while pushing the solder ball 52.

The cutter 43 has a flat plate structure having a “b” shape, and the body of the cutter 43 is vertically arranged to be fastened by a fastening means such as a bolt to the front surface of the cutting block 29, and the cutter 43. ) Blades are bent horizontally forward from the lower end of the body of the cutter 43, and when cutting the solder ball 52, while the blade portion of the cutter 43 is interviewed and moved to the surface of the semiconductor package 50 of the solder ball 52 Cut the bottom part.

The cutting block 29 is mounted on the top surface and the rear end surface to be interviewed on the rear bottom surface of the slide plate 27 and the front vertical surface of the bent portion.

The spacer 28 has a rectangular-shaped structure having a predetermined thickness and size, and a permanent magnet is inserted and mounted through a through hole formed therein so that the spacer 28 is mounted on the bottom surface of the slide plate 27 without a separate fastening device. 27) and one body is moved back and forth.

At this time, the spacer 28 is fixed to the front bottom surface of the slide plate 27 at regular intervals in the front-rear direction in front of the cutter 43.

The pressure plate 30 has a mounting groove on an upper surface thereof, and the bottom surface of the spacer 28 is inserted into and fixed to the mounting groove, so that the pressure plate 30 is mounted on the bottom surface of the spacer 28, and the pressure plate 30 is formed of iron or the like. It is made of the same magnetic material and is fixed to the bottom of the spacer 28 by a permanent magnet embedded in the spacer 28.

In addition, the pressing plate 30 maintains a constant distance from the slide plate 27 by the spacer 28 in the vertical direction, and uniformly presses the solder ball 52, thereby aligning the position of the solder ball 52 on a horizontal plane. When the solder ball 52 is cut by the cutter 43 to facilitate cutting.

The support plate 33 has a rhombus-like structure, and the semiconductor package 50 having the solder ball 52 attached thereto is placed on the upper surface of the support plate 33.

The supporting plate 33 is disposed below the pressing plate 30, and the lower surface of the supporting plate 33 is elastically supported by the coil spring 35, so that the pressing plate 30 presses the supporting plate 52 when the pressing plate 30 presses the solder ball 52. 33) the printed circuit board 51 having the solder ball 52 attached to the lower surface of the pressure plate 30 in close contact with the pressure plate 30 by the elastic force of the coil spring 35 to adjust the position of the solder ball 52. Aligning to the reference plane B (see FIG. 5), the solder ball 52 may be easily cut at the time of cutting by the cutter 43.

In addition, the lower support frame 31 is fixedly mounted in the front, rear, left and right directions on the periphery of the support plate 33, and an insertion portion 32 having a rhombus shape is formed at the center of the lower support frame 31 at the connection bar. It is connected by one body, and the support plate 33 is inserted in this insertion part 32, and is guided so that it can be linearly moved up and down.

At this time, the support bar 34 is integrally formed in the bottom of the support plate 33 in a straight downward direction, and the lower end of the support bar 34 passes through the coil spring 35 to guide holes 37 formed in the support block 36. By being inserted into the guide), it is guided in a linear movement in the vertical direction.

In addition, the coil spring 35 is penetrated by the support bar 34 to be disposed between the bottom surface of the support plate 33 and the upper surface of the support block 36, thereby supporting the support plate 33 by the elastic force of the coil spring 35. It is elastically supported to be movable in the vertical direction.

Figure 5 is an assembled perspective view showing the overall configuration of the solder ball removal device of the semiconductor package according to an embodiment of the present invention, Figure 6 is an exploded view of Figure 5, Figure 7 is lifting the upper frame in Figure 1 loading the semiconductor package 8 is a perspective view showing a state in which the upper frame is seated on the lower support 39 after the semiconductor package is loaded in FIG. 1.

The solder ball removing device is largely composed of the upper frame 11 and the lower support (39).

The upper frame 11 has a side bar 12 disposed parallel to the front and rear sides on both sides, a handle portion 21 connecting the front end of the side bar 12, and a rear end portion of the side bar 12. It consists of a hinge bracket 20 for connecting.

The lower portion of the handle portion 21 is made of a flat plate structure is fastened to the front end of the side bar 12 by a fastening means such as a bolt, the upper portion of the handle portion 21 is a bar of the "C" shape at the top of the plate (Bar) It is made of a structure can be easily lifted by the operator holding the bar of the handle portion 21 by hand.

The bottom plate of the hinge bracket 20 is formed in one body of the flat plate structure, the protrusion plate of the hinge bracket 20 is fastened to the upper surface of the rear end of the lower support 39 by a fastening means such as bolts, The hinge pin penetrates through the hinge hole formed in the hinge bracket 20 and is hinged to the rear end of the side bar 12, thereby holding the handle 21 of the upper frame 11 and lifting the semiconductor package 50. The semiconductor package 50 is seated on the pedestal of the lower support 39.

 Fixing guide rails 13 having guide grooves in the longitudinal direction are mounted and fixed to the side bars 12, respectively, to guide the slide plate 27 to be linearly movable in the front and rear directions.

On both inner surfaces of the fixed guide rail 13, the front and rear frame 17 is slidably mounted in the front and rear directions by the ball bearing 15.

At this time, the movement guide rail 16 is fixed to both sides of the front and rear movement frame 17, the ball bearing 15 in the guide groove formed on the outer surface of the movement guide rail 16 bearing spacing plate 14 By being mounted at regular intervals, the front and rear movement frame 17 moves in the front and rear directions along the fixed guide rail 13.

On the rear end side of the side bar 12, the rotating shaft support plate 22 is fixed and mounted in the width direction, and the rotating shaft support plate 22 is disposed between the operation handle 10 and the rotating disc 24, and on the rotating shaft 26. It penetrates and supports the rotating shaft 26 rotatably.

The fixing plate 18 is attached to the middle of the side bar of the front and rear frame 17, the slide plate 27, the spacer 28, and the pressing plate 30 through the fixed plate 18 through the fixed shaft It is movable in the front and rear direction by being combined with one body.

At this time, the reinforcing bar 19 is further attached to the rear of the fixing plate 18 to connect the rear of the middle portion of the side bar of the front and rear frame 17, thereby reinforcing the structure of the front and rear frame 17 more robustly. .

The lower support 39 is disposed on both sides and is composed of a low side plate and a horizontal plate connecting the upper end of the side plate, an opening is formed in the middle of the horizontal plate, the mounting portion on both inner sides of the opening 40 is protruded and the lower support frame 31 is inserted and fixed to the seating portion 40 of the lower support (39).

In addition, a first fastening hole is formed in the middle of the side plate of the lower support 39, a second fastening hole is formed on both sides of the support block 36, and the support block 36 is formed of the first and the first. 2 is fastened to the side plate of the lower support 39 by fastening means such as bolts passing through the fastening holes 41 and 38.

The support block 36 is mounted in the lower support 39 at regular intervals upwards from the lower end of the lower support 39.

Then, the chip storage container 42 is inserted into the lower portion of the support block 36, the solder ball 52 cut by the cutter 43 is received and stored in the chip storage container 42, the semiconductor package 50 It is possible to keep the surroundings of the solder ball removing apparatus clean without the need to separately clean the solder balls 52 cut and removed from the apparatus.

Referring to the operation state and the use method of the solder ball removing device according to the present invention by such a configuration as follows.

First, when grasping the handle portion 21 formed in the front end of the upper frame 11 and lifted upwards, the support plate 33 of the rhombus shape is shown in the center of the lower support 39, the solder ball on the support plate 33 The semiconductor package 50 is placed so that the 52 faces upward.

Then, when the upper frame 11 is lowered to its original position, the pressure plate 30 disposed on the bottom surface side of the upper frame 11 uniforms the solder balls 52 of the semiconductor package 50 loaded on the support plate 33. Pressurized.

At this time, the front and rear movement frame 17 is mounted on both inner surfaces of the side bars 12 of the upper frame 11 so as to be movable in the front and rear directions, and the slide plate 27 is mounted on the bottom of the front and rear movement frame 17. As a result, the bottom surface of the slide plate 27 is kept horizontal with the reference plane A as shown in FIG. 9.

9 is a cross-sectional view illustrating a reference plane A as a reference when the cutter 43 moves forward and backward and a reference plane B as a reference when the semiconductor package 50 is loaded.

Here, the spacer 28 serves to maintain a constant interval in the vertical direction between the bottom surface of the slide plate 27 and the top surface of the printed circuit board 51.

By the thickness of the spacer 28 mounted on the bottom of the slide plate 27, the pressing plate 30 maintains a constant distance from the bottom surface of the slide plate 27, that is, the reference plane A, so that the pressing plate 30 also has the reference plane A It remains parallel and horizontal, and the reference plane A is always constant.

In addition, the solder ball 52 of the printed circuit board 51 loaded on the support plate 33 is in close contact with the bottom surface of the pressure plate 30 by the elastic force of the coil spring 35 positioned below the support plate 33. 52 is aligned on the horizontal line of the reference plane B, and the position of the reference plane B varies depending on the size of the solder ball 52 because there is a difference in the size of the solder ball 52 according to the type of the semiconductor package 50. .

Therefore, in the present invention, the spacers 28 having different thicknesses according to the size of the solder balls 52 are provided, and the size of the solder balls 52 differs depending on the type of the semiconductor package 50, which is a measurement object of warpage. By using the spacers 28 interchangeably, the time required to adjust the height of the cutter 43 to the size of the solder ball 52 can be saved.

The reason why the spacer 28 is replaced and used according to the size of the solder ball 52 is that the solder ball 52 is aligned by matching a horizontal plane on which the cutter 43 moves in the front-rear direction with a reference plane B on which the solder balls 52 are aligned. This is to ensure that the cut surface of the cut portion 53 of the solder ball 52 is formed on the same surface as the surface of the printed circuit board 51 when the cutter 43 is cut by the cutter 43.

For example, when the size of the solder ball 52 is large, the position of the reference plane B is lowered because the reference plane A is constant, which causes the reference plane B to be lower than the bottom of the cutter 43, thereby cutting the solder ball by the cutter 43. The cut portion 53 of the 52 protrudes more than the surface of the printed circuit board 51 to which the solder balls 52 are attached, so that the cut portion 53 of the cut portion 53 is curved on the surface of the printed circuit board 51 by the cut portion 53 of the solder ball 52. Occurs.

Therefore, when the size of the solder ball 52 is increased, the cutter 43 for moving the reference plane B upwards and backwards by using the spacer 28 having a thin thickness as the size of the solder ball 52 increases. By coinciding with the bottom surface, the cut surface of the cut portion 53 of the solder ball 52 cut by the cutter 43 forms the same plane as the surface of the printed circuit board 51.

In this way, the spacer 28 having a thickness appropriate to the size of the solder ball 52 is replaced and used to match the reference plane B to the bottom of the cutter 43, and then the operation handle 10 is rotated clockwise.

When the manipulation handle 10 is rotated, the rotating shaft 26 hinged to the rear end of the manipulation handle 10 rotates, and the rotation disc 24 is rotated clockwise at the same angle as the rotation angle of the manipulation handle 10. Rotate

At the same time, while the rear end of the connecting rod 44 hinged to one side of the edge of the rotating disk 24 has a circular motion, the front end of the connecting rod 44 moves forward, and is converted by the connecting rod 44. The slide plate 27 is moved forward by the straight movement.

At this time, the cutter 43 mounted on the bottom surface of the slide plate 27 cuts the lower end of the solder ball 52 while moving forward along the reference plane B on which the solder balls 52 are aligned, as shown in FIG. 1. The cut surface of the cut portion 53 of the solder ball 52 forms the same plane as the surface of the printed circuit board 51.

Therefore, according to the solder ball removing device according to the present invention, the solder ball 52 can be easily removed by the cutter 43 only by rotating the operation handle 10 in the front-back direction.

In other words, when the operation handle 10 is rotated in the rearward direction, the rotational movement of the operation handle 10 is converted into a straight motion by the connecting rod 44 and transmitted to the slide plate 27, and the cutter is driven by this force. 43 may remove the solder balls 52 attached to the printed circuit board 51 while closely moving along the surface of the printed circuit board 51.

In addition, by using the spacer 28 to maintain the horizontal state by maintaining a constant distance in the vertical direction and the bottom surface (always constant reference plane A) of the slide plate 27 in the vertical direction, and the size of the solder ball 52 Replace the spacer 28 so that the surface of the printed circuit board 51 to which the solder ball 52 is attached (the reference plane B that varies depending on the size of the solder ball 52) coincides with the bottom of the cutter 43, thereby cutting the cutter ( The cutting surface of the solder ball 52 cut by the 43) is formed on the same plane as the surface of the printed circuit board 51, so that a uniform measured value can be obtained later in the warpage measurement, thereby improving reliability.

Then, the support plate 33 is elastically supported by the coil spring 35 and the solder ball 52 of the semiconductor package 50 seated on the upper surface of the support plate 33 is pressed by the pressure plate 30, thereby solder ball 52. ) Is closely adhered to and aligned with the pressure plate 30 arranged horizontally by the elastic force of the coil spring 35 so that the solder ball 52 can be easily cut by the cutter 43.

10: operation handle 11: upper frame
12: side bar 13: fixed guide rail
14: bearing spacing plate 15: ball bearing
16: moving guide rail 17: front and rear moving frame
18: fixing plate 19: reinforcing bar
20: hinge bracket 21: handle portion
22: rotating shaft support plate 23: hinge shaft
24: rotating disc 25: rod receiving groove
26: axis of rotation 27: slide plate
28: spacer 29: cutting block
30: pressure plate 31: lower support frame
32: insertion portion 33: support plate
34: support bar 35: coil spring
36: support block 37: guide hole
38: second fastening hole 39: lower support
40: seating portion 41: the first fastening hole
42: chip storage 43: cutter
44: connecting rod 50: semiconductor package
51: printed circuit board 52: solder ball
53: cutting part

Claims (9)

delete An operation handle 10 which generates a rotational driving force by a rotation operation;
A rotating disc 24 which rotates by receiving a rotation driving force through a hinge shaft 23 hinged to a rear end of the manipulation handle 10;
A connecting rod 44 hinged to one side of an edge of the rotating disc 24 to convert a rotational movement of the manipulation handle 10 into a linear movement;
A slide plate (27) hinged to the front end of the connecting rod (44) and movably mounted in the front and rear directions;
A support plate 33 on which the semiconductor package 50 is loaded;
The solder ball 52 of the semiconductor package 50 loaded on the support plate 33 is cut while being mounted on the bottom surface of the slide plate 27 and moving along the surface of the semiconductor package 50 to which the solder ball 52 is attached. A cutter 43;
Including;
A coil spring 35 mounted on a bottom surface of the support plate 33 to elastically support the support plate 33 in a vertical direction;
A pressing plate 30 mounted on the bottom surface of the slide plate 27 to press down the solder balls 52 of the semiconductor package 50 loaded on the upper surface of the support plate 33;
More,
The cutter 43 is a solder ball removal device of a semiconductor package, characterized in that for cutting the solder ball 52 in close contact with the bottom surface of the pressure plate 30 by the elastic force of the coil spring (35).
The support plate of claim 2, further comprising a spacer 28 mounted between the slide plate 27 and the pressure plate 30, and replacing the spacer 28 having a corresponding thickness to match the size of the solder ball 52. By adjusting the height of the 33, the cut portion 53 of the solder ball 52 cut by the cutter 43 by matching the surface of the semiconductor package 50 with the solder ball 52 to the bottom surface of the cutter 43. The solder ball removing device of the semiconductor package, characterized in that the cut surface of the) is made on the same surface as the surface of the semiconductor package (50).
The solder ball of the semiconductor package of claim 2, wherein the cutter 43 is disposed on the same plane as the surface of the semiconductor package 50 to which the solder balls 52 are attached, and cuts the lower end of the solder ball 52. Removal device.
3. The method of claim 2, further comprising a lower support frame 31 having an insertion portion 32 in the center to surround the edge of the support plate 33 to fix the semiconductor package 50 loaded on the support plate 33. Solder ball removal device for semiconductor packages.
The solder ball removal apparatus of claim 2, further comprising a lower support (39) having a support block (36) mounted therein to fix the support plate (33) to a predetermined height.
7. The solder ball removing apparatus of claim 6, further comprising a chip storage container (42) disposed under the support block to store solder balls (52) cut by the cutter (43).
According to claim 6, The rear end is coupled to the rear end of the lower support (39) in the hinge structure, rotatable in the vertical direction upper frame (11);
Fixed guide rails 13 mounted on both sides of the upper frame 11; And
A front and rear movement frame 17 mounted to the front and rear directions along the fixed guide rail 13 and having a slide plate 27 mounted on a bottom thereof;
Solder ball removal device of a semiconductor package, characterized in that it further comprises.
4. The solder ball removing apparatus of claim 3, wherein a permanent magnet is mounted on the spacer and detachable on a bottom surface of the slide plate.

Images