KR101104023B1

KR101104023B1 - Led package

Info

Publication number: KR101104023B1
Application number: KR1020040058352A
Authority: KR
Inventors: 강석훈
Original assignee: 엘지이노텍 주식회사
Priority date: 2004-07-26
Filing date: 2004-07-26
Publication date: 2012-01-06
Also published as: KR20060009684A

Abstract

The present invention discloses a light emitting diode package capable of obtaining white light having a uniform brightness by changing the traveling path of light generated from the LED chip by using an inclined lens. The disclosed invention includes a sub-mount including a light emitting diode and a reflecting hole in which a reflecting portion is disposed; An LED chip mounted on the reflection hole of the sub-mount; And an inclined lens formed on the reflective hole of the sub-mount in which the LED chip is mounted to have a predetermined inclination.

Here, the structure of the inclined lens is any one of a circle, an ellipse, a quadrangle, the inclined lens is generated in the mounted LED chip to have a height difference from the height of one side edge and the other edge of the sub-mount. Characterized in that the direction of the light can be adjusted.

LED, white light, brightness, R, G, B, package

Description

Light Emitting Diode Package {LED PACKAGE}

1 is a view showing a light emitting diode package according to the prior art.

2 shows a light emitting diode package according to the invention;

3 is a view showing a light emitting diode according to another embodiment of the present invention.

4 is a view showing a structure of an inclined lens used in the present invention.

5 is a view showing a light emitting diode package of the present invention applied to a luminaire.

* Description of the symbols for the main parts of the drawings *

100: light emitting diode package 101: tilting lens

105: LED chip 107: sub-mount

300: luminaire 305: globe

303: power supply terminal

The present invention relates to a light emitting diode package, and more specifically, to a light emitting diode package which can obtain white light with uniform luminance by changing the path of the light generated from the light emitting diode chip (LED) by using an inclined lens. It is about.

In general, a light emitting diode (LED) is used to transmit and receive signals by converting electricity into infrared rays or light using characteristics of compound semiconductors, which are used in home appliances, remote controls, electronic displays, It is used for an indicator, various automation devices, and the like.

The operating principle of the LED is that when a forward voltage is applied to a semiconductor of a specific element, electrons and holes move and recombine with each other through a junction portion of a positive and negative electrode, and an energy level is caused by the combination of electrons and holes. Fall and light is emitted.

In addition, the LED is generally 0.25 mm 2, which is very small and manufactured in size, and is mounted on an epoxy mold, a lead frame, and a PCB.

Currently, the most commonly used LEDs are 5mm (T 1 3/4) plastic packages or new types of packages depending on the specific application. The color of the light emitted by the LEDs creates wavelengths depending on the composition of the semiconductor chip components, and these wavelengths determine the color of the light.

In particular, LEDs are becoming smaller and smaller, such as resistors, capacitors, and noise filters, due to the trend toward miniaturization and slimming of information and communication devices, and directly mounting them on a PCB (Printed Circuit Board) board. In order to make the surface mount device (SMD) type.

Accordingly, LED lamps, which are used as display elements, are also being developed in SMD type. Such SMD can replace the existing simple lighting lamp, which is used for lighting indicators of various colors, character display and image display.

1 is a view showing a light emitting diode package according to the prior art.

1 is a view showing the structure of a light emitting diode package according to the prior art.

As shown in FIG. 1, the LED package 10 is flip chip bonding or wire bonding in a submount 7 in which a reflective hole is formed of silicon or the like. It is mounted by bonding.

A lens 1 made of epoxy resin is formed in the reflection hole area of the submount 7 on which the LED chip 5 is mounted.

The structure of the lens 1 has a circular or elliptical structure, and the function of the lens 1 is to emit light generated from the LED chip 5 mounted on the submount 7 to the outside, It serves to protect the chip 5 from external impact or moisture.

In addition, when the lens 1 is formed on the LED chip 5 mounted as described above, the light emitting diode package 10 is completed. When the LED chip 5 is a blue LED chip, white light is emitted. Phosphor is coated on the lens 1 to obtain.

In the LED package 10, the mounted LED chip 5 may be used as a red, green, and blue LED chip, and each of them is mounted together. White light can be obtained.

However, in order to obtain white light using a light emitting diode package manufactured in the prior art, white light was obtained by mounting light emitting diode packages mounted with R, G, and B LED chips at close intervals, respectively, but light loss due to optical interference was large. There are disadvantages.

In addition, even when a plurality of R, G, B LED chips are mounted in one LED package, the gaps between the LED chips are narrowly mounted so that there is a big problem of light loss due to optical interference.

In addition, as the LED light output is increased, it is difficult to obtain white light by mixing uniform R, G, and B colors due to poor light color mixing.

In addition, there is a method of adjusting the current value applied to the LED chip to obtain a uniform white light, which is to adjust the ratio of R, G, B in consideration of visibility to 1: 1: 1. However, even in this case, LEDs that are lower than the light output rating of the LED are generated by the current adjustment, so there is a problem that the light efficiency is lowered.

The present invention provides a light emitting diode package in which white light having uniform luminance is obtained by adjusting an optical path and transmittance by forming an inclined lens having a predetermined inclination angle in a reflection hole of a sub-mount in which R, G, and B LED chips are mounted. The purpose is to provide.

In order to achieve the above object, a light emitting diode package according to the present invention,

A sub-mount including a light emitting diode and a reflecting hole in which a reflecting portion is disposed;

An LED chip mounted on the reflection hole of the sub-mount;

And an inclined lens formed on the reflective hole of the sub-mount in which the LED chip is mounted to have a predetermined inclination.

The light emitting diode package according to the present invention,

A plurality of LED chips mounted on the reflection hole of the sub-mount;

Here, the plurality of LED chips are R, G, B LED chips, characterized in that to generate white light by a plurality of LED chips mounted on the sub-mount.

According to the present invention, by forming an inclined lens having a predetermined inclination angle in the reflection hole of the sub-mount in which the R, G, and B LED chips are mounted, the light path and the transmittance can be adjusted to obtain white light with uniform luminance.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a view showing a light emitting diode package according to the present invention.

As shown in FIG. 2, the LED package 100 may be flip chip bonded or wire bonded to a submount 107 in which a reflective hole is formed of silicon or the like. It is mounted by bonding.

Here, a reflective film 110 for reflecting light is formed in the reflective hole area on the sub-mount 107.

The reflective film 110 is coated with a metal having high reflectance such as Ag or Al.

An inclined lens 101 is formed in the reflection hole area of the sub-mount 107 on which the LED chip 105 is mounted.

The inclined lens 101 has a circular, elliptical, or rectangular shape, and the function of the inclined lens 101 is to transmit light generated from the LED chip 105 mounted on the sub-mount 107 to the outside. While outputting, it protects the LED chip 105 from the outside.

The inclined lens 101 may adjust the light direction generated by the mounted LED chip 105 to have a height difference at one edge of the sub-mount 107 and a height at the other edge of the sub-mount 107.

That is, the inclination angle θ can be increased by increasing the height difference of the inclined lens 101 or by increasing the height difference.

As such, by adjusting the inclination angle θ of the inclined lens 101, the optical path generated from the LED chip 105 mounted on the submount 107 can be adjusted.

3 is a diagram illustrating a light emitting diode according to another embodiment of the present invention.

As shown in FIG. 3, the LED package 200 includes flip chip bonding in which a plurality of LED chips 205a, 205b, and 205c are mounted in a submount 207 in which reflection holes are formed of silicon. ) Or by wire bonding.

Here, a reflective film 210 for reflecting light is formed in the reflective hole area on the sub-mount 207.

The reflective film 210 is coated with a metal having high reflectance such as Ag or Al.

An inclined lens 201 having a predetermined inclination angle θ is formed in the reflection hole area of the submount 207 on which the LED chips 205a, 205b, and 205c are mounted.

The plurality of LED chips 205a, 205b, and 205c selectively mount R, G, and B LED chips, and light generated from the R, G, and B LED chips is mixed to generate white light.

In the description of FIG. 2, a single LED chip is mounted on one LED package, and then a plurality of LED packages are combined to obtain uniform white light. However, in FIG. By mounting B LED chips, uniform white light was obtained.

4 is a diagram illustrating a structure of an inclined lens used in the present invention.

As shown in FIG. 4, the inclination lens formed on the reflective hole of the LED package may have a circular, rectangular, elliptical, or the like structure.

In this case, in the case of the inclined lens having the structure as shown in (a), the area in contact with the submount of the LED package is circular, and the upper surface on which the inclination angle is formed has an elliptical structure.

In addition, in the case of the inclined lens having the structure as shown in (b), the area in contact with the sub-mount of the light emitting diode package has a square or quadrangular structure, and the top surface on which the inclined angle is formed has a square or rhombus structure.

As shown in FIG. 5, the light emitting diode package 301 described with reference to FIG. 2 or FIG. 3 is used as the lighting apparatus 300.

The light emitting diode package 301 is a package in which one of the R, G, and B LED chips is mounted or a package in which a plurality of LED chips are mounted, and a combination of these packages or a package having a uniform luminance. White light was generated.

The light emitting diode package 301 is mounted on the power supply terminal 303, and the globe 305 is fastened on the mounted light emitting diode package 301, thereby improving light efficiency generated from the light emitting diode package. .

Accordingly, in the light emitting diode package of the present invention, the color path of the R, G, and B light is improved by switching the optical paths to obtain white light having a uniform luminance value.

As described in detail above, the present invention forms an inclined lens having a predetermined inclination angle in the reflection hole of the sub-mount in which the R, G, and B LED chips are mounted, thereby adjusting the optical path and transmittance so that white light of uniform luminance is provided. There is an effect that can be obtained.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

Claims

A plurality of R, G, and B LED chips mounted on the reflection holes of the sub-mounts;

The light emitting diode package is formed to have a predetermined inclination on the reflecting hole in which the LED chip is mounted, and includes an inclined lens for generating white light by mixing the light emitted from the R, G, B LED chip. .

The method of claim 1,

The light emitting diode package of the inclined lens is characterized in that any one of a circular, oval, square.

The method of claim 1,

The inclined lens has a height difference between the height at one edge of the sub-mount and the other edge surface of the sub-mount can be adjusted to the direction of the light generated from the mounted LED chip.

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