The invention will be described in more detail by way of example with reference to the accompanying drawings.
1. First embodiment
The processing apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 6. 1 shows the outline structure of the punching (or drilling) device 11 (corresponding to the "treatment device" of the present invention), the arrow F indicates the forward direction. The punching device 11 comprises a punching unit 13 (corresponding to a “punching tool”), a die unit 15 (corresponding to a “mounting base”) positioned opposite the punching unit 13, and a die unit A moving unit which holds a printed substrate 17 having a flexible thin plate shape (corresponding to "treatment material") mounted on the 15 and allows the printing unit to be moved toward a designated position on the die unit 15 ( 19 and the image pick-up apparatus 21 which detects the position of the designated part of the printed board 17 located with respect to the die unit 15. As shown in FIG.
The punching unit 13 has a plurality of pressers 45 that protrude retractably to be proximate to or separated from the die unit 15. The designated portion of the printed board 17 refers to the reference mark given to the printed board 17 or the specific portion of the wiring pattern of the printed board 17, and is simply referred to as "reference mark". One or more reference marks are given to a designated portion of the printed board 17 to be imaged by the image pickup device 21 to detect the position of the printed board 17 relative to the die unit 15. Although not shown, the punching device 11 has a control unit for controlling the operation of various mechanisms and components installed therein, and an operator console for operating them.
The moving unit 19 includes the first holding mechanism 23 and the second holding mechanism 25, the holding mechanism supporting structure 27 for supporting the first and second holding mechanisms 23, 25, and the holding mechanism. It is composed of a support structure moving mechanism 28 that allows the support structure 27 to move freely. The support structure moving mechanism 28 has the holding mechanism support structure 27 together with the first and second holding mechanisms 23 and 25 in the X-axis direction (ie, the longitudinal direction of the die unit 15) and (in the horizontal plane). Free movement in the Y-axis direction (perpendicular to the X-axis direction). In addition, the support structure moving mechanism 28 permits axial rotation along the Z-axis direction (three-dimensionally perpendicular to the X-axis direction and the Y-axis direction). The details of the support structure moving mechanism 28 are well known, and the support structure moving mechanism 28 comprises a moving mechanism including an electric motor, a rail and a ball screw, and a rotating mechanism including an electric motor and a rotating shaft. do.
The first retaining mechanism 23 and the second retaining mechanism 25 are provided with holders 23a and 25a for retaining a designated end of the printed board 17 at the distal end. First, the printed board 17 is held by the holders 23a and 25a, and then the support structure moving mechanism 28 is operated to move the holding mechanism support structure 27 to print the die unit 15. The designated position of the substrate 17 is set.
The retaining mechanism support structure 27 can be moved to extend or reduce the distance between the first retaining mechanism 23 and the second retaining mechanism 25, so that the width of the printed board 17 lying in the X-axis direction. In this connection it is possible to appropriately adjust the distance between the first retaining mechanism 23 and the second retaining mechanism 25. That is, the first and second retaining mechanisms 23 and 25 holding the opposite corner portions of the printed board 17 are appropriately moved so that the distance therebetween is extended so that a wave form is formed in the printed board 17. Is prevented.
The image pickup device 21 is designed to be freely moved in the X-axis direction and the Y-axis direction by an additional moving mechanism (not shown) specifically applied to the image pickup device 21, and the CCD camera (not shown) is an image pickup device. It is attached to the distal end of the arm 21a extending on one side of 21. The details of the moving mechanism of the image pickup device 21 are well known, and the moving mechanism of the image pickup device 21 is composed of a moving member including an electric motor, a rail and a ball screw, and an electric motor unit.
In addition to the mechanism described above, the punching device 11 further includes an image processing device, various data storage memories, and a microcomputer. The microcomputer processes the image picked up by the CCD camera of the image pickup device 21 to calculate the position of the reference mark of the printed board 17 with respect to the die unit 15. On the basis of the calculated position of the reference mark, the moving unit 19 is operated so that the holding mechanism support structure 27 moves in the X-axis direction and the Y-axis direction or rotates about the Z-axis direction so that the die unit 15 ), The designated position of the printed circuit board 17 is set.
When positioning the printed board 17, the holders 23a, 25a of the first and second retaining mechanisms 23, 25 hold only opposite corners of one side of the printed board 17. As shown in FIG. In order to prevent the waveform from generating on the printed board 17 due to the movement, the moving unit 19 moves the printed board 17 backwards in the Y-axis direction with respect to the die unit 15 or tilts backwards. The holders 23a and 25a are controlled to move.
The punching unit 13 can move freely in the Z-axis direction by a punching unit moving mechanism (not shown) based on numerical control. As shown in FIGS. 2 to 5, the punching unit 13 includes a base frame 29, a punch base plate 31 fixed to a lower surface of the base frame 29, and a punch base plate 31. A punch plate 33 fixed to the lower surface, a punch 35 having a cylindrical shape passing through the punch plate 33 so that the upper end portion is fixed to the lower surface of the punch base plate 31, and a stripper 37 It consists of. The punch 35 is used to punch the printed board 17 mounted to the die unit 15 to form a designated hole. The stripper 37 is used to press the upper surface of the printed board 17 when the printed board 17 is punched by the punch 35.
The punch 35 is inserted into the through hole 37a passing through the center of the stripper 37 to move freely along the through hole 37a. The punch base plate 37, the punch plate 33 and the stripper 37 are formed in a rectangular shape, and the punch plate 33 and the stripper 37 both have the same rectangular shape smaller than the punch base plate 31, The thickness of the punch base plate 31 is smaller than the thickness of the stripper 37, and the thickness of the punch plate 33 is approximately half the thickness of the punch base plate 31.
Four guide pillars 39 having a cylindrical shape passing through the four corner portions of the punch base plate 31 are firmly fixed to the four corners of the punch base plate 31. The intermediate portion of the guide pillar 39 protruding downward from the punch base plate 31 is inserted into the through hole 37b passing through the four corner portions of the stripper 37. A mechanism (not shown) for restricting the stripper 37 from moving away from the punch plate 33 beyond the gap S is interposed between the punch base plate 31 or the punch plate 33 and the stripper 37.
The guide bush 40 allows the stripper 37 guided by the guide pillar 39 to freely move along the axial direction of the guide pillar 39 (ie, Z-axis direction in FIG. 1). ) Is placed on top of the through hole 37a to reduce the frictional resistance generated in the through hole 37 when the stripper 37 is moved along the guide pillar 39. The inner diameter of the through hole 37b of the stripper 37 under the guide bush 40 is slightly larger than the outer diameter of the guide pillar 39, and the inner diameter of the guide bush 40 is approximately equal to the outer diameter of the guide pillar 39. . Four compression springs 41 are disposed in the vicinity of the punch 35 and are disposed axially around the punch 35 at equal intervals.
The compression spring 41 passing through the punch plate 33 is compressed and interposed between the lower surface of the punch base plate 31 and the upper surface of the stripper 37. The stripper 37 is normally pressed by the compression spring 41 to be slightly spaced apart from the punch plate 33. Four stepped through holes 43 (FIG. 6) are formed to receive four compression springs 41 in the stripper 37 and are arranged axially at equidistant intervals (i.e., 90 [deg.]). The upper portion of the stepped through hole 43 (located opposite the punch plate 33) has a large diameter, the lower portion has a small diameter, and the stepped portion 43a has a stepped through hole 43 in the longitudinal direction. It is formed in the middle of the.
In Fig. 6, the presser 45 having a cylindrical shape in which the jaws 45a and jaw are formed on the substantially middle portion is inserted into the stepped through hole 43 and placed near the punch 35 of the punching unit 13. Is located. For the sake of convenience, the space between the presser 45 and the left and right guide pillars 39 is partially cut off using the dashed dashed line in FIGS. 2 to 6. The upper end of the jaw 45a of the presser 45 is pressed by the lower end of the compression spring 47, and the lower end of the jaw 45a is in contact with the step 43a of the stepped through hole 43.
In this structure, the compression spring 47 moves the presser 45 toward the die unit 15 so that the presser 45 moves in close proximity or spaced apart from the die unit 15. Protrude from). That is, before the punching unit 13 is lowered so that the stripper 37 contacts the printed board 17, the presser 45 is fixed to the punching unit 13 so that the distal end contacts the printed board 17. Compression spring 47 has a spring constant that produces a relatively small compressive load at maximum compression within the compression / extension range. Alternatively, an air spring using compressed air instead of the compression spring 47 may be used to press the presser 45, or the weight of the presser 45 may be set approximately without the compression spring 47. This allows the presser 45 to move downward due to its own weight.
The upper portion of the stepped through hole 43 has a larger diameter slightly larger than the outer diameter of the jaw portion 45a of the presser 45 and the outer diameter of the compression spring 47, but the lower portion of the stepped through hole 43 has a jaw portion ( 45a) has a small diameter slightly larger than the outer diameter of the presser 45 below. The upper portion of the compression spring 47 is inserted into the through hole of the punch plate 33 and the punch base plate 31 coaxially with the stepped through hole 43. The compression spring 47 is interposed between the lower end of the fixing screw 49 screwed with the inner screw of the upper part of the through hole of the punch base plate 31 and the upper end of the jaw 45a of the presser 45.
As described above, the compression spring 47 is inserted into the through hole of the punch base plate 31 and the punch plate 33 and the stepped through hole 43 of the stripper 37. This eliminates the need to prepare a special space for accommodating the compression spring 47. In this embodiment, the compression spring 47 is inserted only into the through hole of the punch plate 33 and the stepped through hole 43 of the stripper 37 or into the stepped mounting hole of the stripper 37 so that the fixed spring ( 49 may be deformed by appropriately changing the thickness and dimensions of the punch base plate 31 and the punch plate 33 and the spring constant of the compression spring 47 in the manner of attaching to the punch plate 33 or the stripper 37. Can be.
The die unit 15 is disposed below the stripper 37 and is fixed to the base 51, the die base plate 53 fixed to the upper surface of the base 51, and the upper surface of the die base plate 53. Die 55. The printed board 17 is mounted on the upper surface of the die 55, that is, the mounting surface. The die base plate 53 and the die 55 have a rectangular plate shape, and the thickness of the die base plate 53 is larger than the thickness of the die 55.
A punch hole 55a having a circular shape inserted into the lower end of the punch 35 is formed to pass through the center of the printed board 17 on the mounting surface of the die 55. The printed board 17 mounted on the die 55 is punched by the punch 35 inserted into the punch hole 55a of the die 55. The inner diameter of the punch hole 55a is slightly larger than the outer diameter of the punch 35. A through hole 53a larger than the punch hole 55a is formed to pass through the center of the die base plate 53 coaxially with the punch hole 55a of the die 55. In addition, the through hole 53a inserted into the lower end portion of the guide pillar 39 is formed at four corner portions of the die base plate 53.
As shown in FIG. 6, a stepped through hole 57 is formed at four corners of the die 55 and is coupled to a guide bush 59 inserted into the lower end of the guide pillar 39. The stepped through hole 57 is located coaxially with the through hole 53b of the die base plate 53. The inner diameter of the guide bush 59 is slightly smaller than the inner diameter of the through hole 53b, but slightly larger than the outer diameter of the guide pillar 39. The jaw portion 59a is formed at the lower end of the guide bush 59. The stepped through hole 57 has a stepped portion 57a such that the lower portion thereof has an increased diameter compared to the upper portion. The guide bush 59 is retained between the stepped portion 57a of the stepped through hole 57 and the upper surface of the die base plate 53. When the four guide pillars 39 are lowered while the lower portion is guided by the guide bush 59, the punch 35 can be precise in the Z-axis direction along the punch hole 55a of the die 55. .
The punching unit 11 having the above structure is used to punch the printed board 17 at a designated position along a series of steps (1) to (10).
(1) First, the distance between the holder 23a of the first holding mechanism 23 and the holder 25a of the second holding mechanism 25 is adjusted to match the distance between opposite ends of the printed board 17. . After the opposite corners of the printed board 17 are held by the holders 23a and 25a, the distance between the first holding mechanism 23 and the second holding mechanism 25 is such that a waveform is formed on the printed board 17. Slightly stretched to prevent.
(2) The support structure moving mechanism 28 is operated so that the holders 23a and 25a move the first and second holding mechanisms 23 and 25 holding the printed board 17 so that the support board 17 The designated position of the printed board 17 relative to the die unit 15 is set in such a manner that the reference mark is located directly below the punch 35 of the punching unit 13.
(3) The moving mechanism of the punching unit 13 lowers the punching unit 13 in the Z-axis direction so that the lower ends of the four pressers 45 directly press the reference mark (or near position) of the printed board 17. To reduce or eliminate curvature or wrinkles (represented by " W " in FIG. 2) present on the printed board 17. FIG. As shown in FIG. 3, the reference mark of the printed board 17 is in intimate contact with the upper surface of the die 55 of the die unit 15. At this time, the compression spring 47 causes the presser 45 to press the printed board 17 in close contact with the die 55.
(4) The arm 21a of the image pickup device 21 in a state where the printed board 17 is in intimate contact with the upper surface of the die 55 of the die unit 15 due to the pressurization of the presser 45. Is moved by the moving mechanism so that the CCD camera is positioned directly above the reference mark of the printed board 17.
(5) After the CCD camera picks up the image of the reference mark of the printed board 17, the image is processed to calculate the position of the reference mark of the printed board 17 with respect to the die unit 15.
(6) On the basis of the calculated position of the reference mark, the moving unit 19 Y-axis the first and second retaining mechanisms 23 and 25 in which the holders 23a and 25a hold the printed board 17. The support structure moving mechanism 28 is operated to move backward or backward in the direction so that the printed board 17 is positioned at the designated position of the upper surface of the die 55 of the die unit 15.
In the above, when the printed board 17 has one reference mark located at the center of the hole punched by the punch 35, the position of the printed board 17 is coaxial with the axis of the punch 35. Is adjusted to match. When the printed board 17 has a plurality of reference marks, the center of the hole of the printed board 17 punched by the punch 35 after the position of the reference mark relative to the die unit 15 is calculated is the reference mark. The printed board 17 is positioned so that each of the centers of the calculated holes coincides with the axis of the punch 35 calculated based on the calculated position of. In this regard, the relationship between the center position of the hole formed in the printed board 17 and the position of the reference mark is stored in advance in the memory (not shown). In the above, the printed circuit board 17 of the die 55 of the die unit 15 is moved by moving the holders 23a and 25a of the first and second holding mechanisms 23 and 25 holding the printed board 17. After being located at the designated position of the upper surface, the CCD camera of the image pickup device 21 prints on the die unit 15 in such a manner as to pick up the image of the reference mark of the printed board 17 so as to determine the position of the reference mark again. The precision of the positioning of the substrate 17 can be improved, whereby the first and second retaining mechanisms 23, 25 when the printed substrate 17 is not located at the designated position of the upper surface of the die 55. Is moved again so that the printed board 17 is positioned at the designated position. By repeatedly moving the first and second holding mechanisms 23 and 25 several times, the precision of positioning of the printed board 17 on the die unit 15 can be further improved.
(7) After that, in order not to disturb the punching operation of the punch 35, the arm 21a of the image pickup device 21 is moved outward from the lower side of the punch unit 13.
(8) The punch unit 13 is lowered in the Z-axis direction by the moving mechanism so that the lower end portion of the stripper 37 comes into contact with the upper surface of the printed board 17 as shown in FIG. At this time, the printed board 17 is pressed onto the upper surface of the die unit 15 by four pressers 45 having an increased compression load by the compression spring 47, and the printed board 17 is stripper ( 37) is further pressed against the upper surface of the die unit 15.
(9) The punching unit 13 is further lowered in the Z-axis direction by the moving mechanism to form a hole in the printed board 17 by the punch 35. The extract of the printed board 17 due to the punching drops through the punch hole 55a and the through hole 53a.
In the above, the stripper 37 in contact with the printed board 17 is not lowered but is raised toward the punch plate 33 due to the compression of the compression spring 41. Further, the four pressers 45 in contact with the printed board 17 are not lowered further, but the jaw portion 45a is retracted into the through hole of the punch plate 33 due to the compression of the compression spring 47.
After (10), the punching unit 13 is moved upward to the initial position in the Z-axis direction by the moving mechanism (see FIG. 1).
The punching operation of the printed board 17 is completed through the steps (1) to (10) described above.
The punching operation need not be limited to the steps (1) to (10) described above, and the order may be modified or changed. In the first embodiment, the punching unit 17 is lowered (step 3) so that the presser 45 presses the printed board 17 so as to come into contact with the upper surface of the die 55 of the die unit 15. Thereafter, it is designed to perform step 4 in which the arm 21 of the image pickup device 21 is moved by the moving mechanism to position the CCD camera on the printed board 17. Alternatively, step 3 may be performed after step 4.
In steps (3), (8), (9) and (10), the punching unit 13 is controlled to be lowered or raised. Alternatively, the die unit 15 may be controlled to be lowered or raised by the moving mechanism without the lowering / rising of the punching unit 13 or in connection with the lowering / rising of the punching unit 13. In brief, the present invention provides that the punching unit 13 is moved close to the die unit 15 so that the punching unit 13 of the die unit 15 is punched to punch the printed substrate 17 mounted on the die 55. It is required to be moved close to or spaced apart from the die 55.
In the above-described variant, before the die unit 15 descends or rises, the printed board 17 is removed from the holders 23a and 25a of the first and second holding mechanisms 23 and 25 regardless of step (1). You need to unjoin it. In order to punch another hole in the printed board 17 based on the position of the reference mark calculated in step 5, it is necessary to repeat steps 6, 8, 9 and 10. There is.
As described above, in the punching device 11 of the present embodiment, the presser 45 has the image pickup device 21 such that the printed board 17 is in close contact with the upper surface of the die 55 of the die unit 15. It is designed to directly press the near position in the vicinity of the reference mark of the printed board 17 detected by the. This point causes the designated position of the printed circuit board 17 on which the reference mark is detected by the image pickup device 21 to be in close contact with the upper surface of the die 55. That is, the CCD camera of the image pickup device 21 can accurately pick up the image of the reference mark of the printed board 17 whose upper surface is pressed by the stripper 37 before the punching operation. Thus, the position of the printed board 17 relative to the die 55 can be accurately detected before the punching operation.
The present embodiment is a presser in a punching unit 13 for punching holes in a printed board 17 that is properly moved close to or spaced apart from the die 55 and then precisely mounted to the top surface of the die 55. 45 is designed to be installed. That is, as the punching unit 13 is moved closer to the die 55 or spaced apart, the presser 45 is moved closer to the printed board 17 mounted on the upper surface of the die 55 or Or moved apart. This eliminates the need to place the specified additional mechanism for the movement of the presser 45. Therefore, the overall size of the punching device 11 can be reduced by reducing the number of parts.
The punching unit 13 is moved by the moving mechanism according to the numerical control, and the moving distance is controlled with high precision. In consideration of the characteristics, curvature, and wrinkles of the printed board 17, the pressing force can be finely adjusted, and the presser 45 can appropriately press the printed board 17. In a state where the presser 45 applies a small amount of pressing force to the printed board 17 so that the printed board 17 is in intimate contact with the upper surface of the die 55, the holders 23a and 25a are connected to the printed board ( The first and second retaining mechanisms 23, 25 holding 17 are controlled to be moved to precisely set the designated position of the printed board 17 on the upper surface of the die 55. Therefore, the positioning precision of the printed board 17 with respect to the die 55 of the die unit 15 can be improved further.
The positioning accuracy is determined when only the die unit 15 is moved upward in the Z-axis direction by the moving mechanism based on the numerical control or both the die unit 15 and the punching unit 13 move based on the numerical control. Can be adjusted using a presser 45 to pressurize the printed board 17. Since the punching unit 13 has a "retractable" presser 45 which is moved in proximity to the die 55 of the die unit 15 or spaced apart, the presser 45 is the die 55. The presser 45 can be prevented from interfering with a punching operation in which holes are punched in the printed board 17 by the punching unit 13 when retracted from and spaced apart. Therefore, the hole can be formed in the printed circuit board 17 by the punching apparatus 11 without inconvenience.
The punching device of this embodiment is designed such that the compression spring 47 causes the presser 45 to press the printed board 17 into close contact with the upper surface of the die 55. With this simple and low cost structure, the printed board 17 can be brought into close contact with the upper surface of the die 55, and the presser 45 can be retracted from the die 55 with certain distance. In the punching device of the present embodiment, before the punching unit 13 moves close to the printed board 17 mounted on the upper surface of the die 55 and comes into contact with the printed board 17, the presser 45 is placed on the printed board. It is characterized by pressing 17.
That is, after the printed board 17 is pressed by the presser 45 to be in close contact with the upper surface of the die 55, the punching unit 13 may form a hole in the printed board 17. In addition, the printed board 17 is pressed by the presser 45 protruding from the punching unit 13 before the stripper 37 of the punching unit 13 contacts the printed board 17. This makes it possible to form a gap between the stripper 37 of the punching unit 13 and the printed board 17 in a state where the printed board 17 is in intimate contact with the upper surface of the die 55. That is, the CCD camera of the image pickup device 21 is located in the gap to pick up the image of the reference mark of the printed board 17.
In addition, the punching apparatus 11 of this embodiment arranges the presser 45 in the vicinity of the punch 35 of the punching unit 13. This point is in the state where the printed board 17 comes into close contact with the upper surface of the die 55 while the position near the position of the hole formed in the printed board 17 is pressed by the presser 45, The punch 35 of the punching unit 13 makes it possible to form a hole in the printed board 17. This further improves the precision of the hole formation of the printed board 17 by the punching apparatus 11.
2. Second Embodiment
Next, the second embodiment of the present invention will be described in more detail with reference to FIGS. 7 to 11, and the same parts as those shown in FIGS. 1 to 6 are denoted by the same reference numerals, and redundant descriptions may be omitted as necessary. Keep it simple. 7 shows the configuration of a substrate inspection apparatus 61 corresponding to the processing apparatus according to the second embodiment of the present invention. The board | substrate test | inspection apparatus 61 test | inspects whether electrical conduction is made suitably in the wiring pattern (not shown) of the printed circuit board 63 which has a flexible plate shape. In particular, a plurality of inspection probes in contact with the plurality of electrical contacts on the printed board 63 cause electrical conduction to be inspected.
The substrate inspection device 61 has a mounting base 64 for mounting the printed board 63 and a printed board 63 mounted on the upper surface of the mounting base 64 and mounts the printed board on the mounting base 64. A moving unit 19 for moving toward a designated position on the upper surface of the upper and lower surfaces thereof, and an inspection probe moving unit (not shown) to move simultaneously or separately in a vertical direction perpendicular to the upper surface of the mounting base 64. Control for controlling various units and components installed in the upper inspection probe unit 65 and the lower inspection probe unit 66 and the substrate inspection apparatus 61 and the determination unit 67a (described in detail later) driven by Inspection unit 67 having a unit, an upper connection structure 69 for connecting the inspection unit 67 to the upper inspection probe 65, and a designated portion of the printed board 63 to the mounting base 64. Image picker for detecting position It consists of a lower connecting unit 71 for connecting the testing unit 67 to the device 21 and the bottom probe 66.
The inspection probe moving unit is controlled to perform numerical control of the upper inspection probe unit 65 and the lower inspection probe unit 66 to move in the vertical direction. The designated portion of the printed board 63 is a specific mark of the reference mark attached to the printed board 63 or the wiring pattern of the printed board 63. For convenience, it is referred to as "reference mark" in the following specification. In particular, one or more reference marks are given to the designated positions of the printed board 63 and are imaged by the image pickup device 21 to detect the position of the printed board 63 on the mounting base 64. Although not shown, the substrate inspection apparatus 61 includes a control unit for controlling various units and components, and an operation console that allows a user to operate various units and components of the substrate inspection apparatus 61. The control unit includes a CPU, a RAM, and a ROM that stores various programs for operating various units and components of the board inspection apparatus 61.
In addition to the units and apparatus described above, the substrate inspection apparatus 61 also includes an image processing unit, a memory for storing various data, and a microcomputer. The microcomputer performs image processing of the image picked up by the CCD camera of the image pickup device 21 to calculate the position of the reference mark of the printed board 63 with respect to the mounting base 64. Based on the calculated position of the reference mark, the moving unit 19 moves the retaining mechanism support structure 27 in the vertical direction perpendicular to the left and right direction in FIG. 7 or the seat in FIG. 7 and the axis about the vertical direction. To rotate, the support structure moving mechanism 28 is operated to set a designated position of the printed board 63 with respect to the upper surface of the mounting base 64.
Since the position is set by the movement of the printed board 63 held by the holders 23a and 25a of the first and second holding mechanisms 23 and 25, the holders 23a and 25a are shown in FIG. It is normally moved back in the direction across the sheet and can be spaced apart from the mounting base 64 to prevent the formation of waviness in the printed board 63. The substrate inspection device 61 measures the detection signal output from the upper inspection probe 73 of the upper inspection probe unit 65 and the detection signal output from the lower inspection probe 74 of the lower inspection probe unit 66. It also includes a measuring unit having a circuit.
The measuring unit outputs a test signal to the upper test probe 73 through the upper connection line 69a of the upper connection unit 69, and also the lower test probe through the lower connection line 71a of the lower connection unit 71. After the test signal is output to 74, a detection signal detected at the electrical contact of the printed board 63 from the upper test probe 73 and the lower test probe 74 is received. The RAM of the control unit installed in the substrate inspection device 61 reloadably stores various data used to conduct conductivity inspection of the detection signal. Based on the programs and data stored in the RAM and ROM, the CPU of the control unit determines the electrical conduction based on the measurement results of the measuring unit. The determination unit 67a of the inspection unit 67 is composed of a CPU and a measurement unit.
In relation to the specification of the printed board 63, the upper inspection probe unit 65, the lower inspection probe unit 66 and the mounting base 64 may be replaced with new ones. The upper inspection probe unit 65 includes three rectangular plates arranged in parallel with each other, that is, the upper base plate 75a, the first upper plate 76a and the second upper plate 77a, and the plurality of upper inspection probes ( 73). As shown in FIG. 11, the plurality of through holes 81 passing through the first top plate 76a are positioned opposite the plurality of through holes 83 passing through the second top plate 77a. The upper inspection probe 73 is inserted into the through hole 81 and the through hole 83.
Since the alignment of the through holes 81 and the alignment of the through holes 83 coincide with the alignment of the electrical contacts formed on the surface of the printed board 63, the alignment of the upper inspection probe 73 is similar to that of the printed board 63. Matches the alignment of the contacts. The lower end of the upper wiring cable 85a composed of flexible nichrome wiring is electrically connected to the upper end of the upper inspection probe 73 and the upper end is electrically connected to the upper connection unit 69, so that the upper connection wiring of the upper connection unit 69 is connected. 69a is electrically connected to the inspection unit 67.
Four through holes 78 (see FIG. 11) are formed in the first top plate 76a to surround a portion of the upper inspection probe 73 selectively disposed in the center of the first top plate 76a. The upper part of the four cylindrical spring holders 87 with the upper end closed and the lower end open is engaged with the four through holes 87. The lower ends of the four cylindrical spring holders 87 holding the compression springs 47 are joined with the upper surface of the second upper plate 77a. That is, the four spring holders 87 are bridged and fixed across the first top plate 76a and the second top plate 77a. The through-hole 89 whose inner diameter is smaller than the inner diameter of the spring holder 87 is a 2nd surface whose surface is joined to the lower end part of the spring holder 87 in the designated position arrange | positioned axially corresponding to the axis of the spring holder 87. FIG. It is formed in the upper plate 77a.
A stepped cylindrical presser 45 having a jaw 45a at its upper end is inserted into the through hole 89, and an upper end of the jaw 45a is provided at the lower end of the compression spring 47 provided in the spring holder 87. The lower end of the jaw 45a is in contact with the upper end of the opening of the through hole 89. The inner diameter of the through hole 89 is slightly larger than the outer diameter of the lower portion of the presser 45 lower than the jaw portion 45a. That is, the compression spring 47 is compressed and interposed between the closed upper end of the spring holder 87 and the upper end of the jaw 45a of the presser 45.
The compression spring 47 presses the presser 45 to descend toward the mounting base 64, and the presser 45 moves the upper inspection probe unit 65 so as to move close to or spaced apart from the mounting base 64. Protrude downward from. The presser 45 lowers the upper inspection probe 73 before the upper inspection probe unit 65 descends so that the presser 45 presses the printed board 63 while compressing the compression spring 47. Protrudes normally. That is, the presser 45 has a lower end portion of the upper inspection probe 73 substantially lower than the printed circuit board 63 when the upper press probe unit 65 is lowered when the presser 45 in contact with the printed circuit board 63 is lowered. It is attached to the upper inspection probe unit 65 at a designated position that causes the printed board 63 to be pressed before being contacted with each other. In particular, the presser 45 is arranged near and between the upper inspection probes 73.
The upper base plate 75a has a frame shape with a rectangular through hole 91 passing through the center portion. The first top plate 76a is thinner and smaller than the top base plate 75a. Four corner portions of the first upper plate 76a are fixed to the lower surface of the upper base plate 75a through four first upper pillars 93a. The second top plate 77a has the same thickness as the first top plate 76a but is smaller than the first top plate 76a. The second upper plate 77a is fixed to four corner portions of the lower surface of the first upper plate 76a through four second upper pillars 95a.
The outer threaded portion formed on the upper end of the first upper pillar 93a is engaged with the inner threaded portion formed on the upper base plate 75a, and the inner threaded portion formed on the lower end of the first upper pillar 93a is formed through a bolt (not shown). 1 is coupled to the upper plate (76a). In addition, the outer thread formed on the upper end of the second upper pillar 95a is coupled to the inner thread formed on the first upper plate 76a, and the inner thread formed on the lower end of the second upper pillar 95a is bolted (not shown). It is coupled to the second upper plate 77a through.
As shown in Fig. 11, the upper inspection probe 73 is composed of a probe 73a made of a thin rod-shaped tungsten material and an insulating tube 73b for coating the center of the probe 73a. The upper end of the probe 73a passes through the through hole of the first upper plate 76a to protrude toward the upper base plate 75a, and the lower end of the probe 73a protrudes downward from the second upper plate 77a. 2 It passes through the through-hole of the upper plate 77a. That is, the insulating tube 73b is interposed between the first upper plate 76a and the second upper plate 77a.
The protruding length of the upper end of the probe 73a protruding upward from the upper surface of the first upper plate 76a is relatively longer than the protruding length of the lower end of the probe 73a protruding downward from the second upper plate 77a. The upper inspection probe unit 65 is lowered downward in the vertical direction, so that the lower end portion of the probe 73a is in contact with the electrical contact formed on the surface of the printed board 63. The lower end of the upper wiring cable 85a is joined to the upper end of the probe 73a protruding upward from the upper surface of the first upper plate 76a.
The number of upper connection wirings 69a of the upper connection unit 69, the number of upper inspection probes 73, the number of upper wiring cables 85a, and the number of electrical contacts formed on the surface of the printed board 63. And all the same. For convenience, FIGS. 7 to 10 show a small number. When the upper inspection probe 73 is in contact with an electrical contact formed on the surface of the printed board 63, electrical conduction is made to the upper inspection probe 73, and based on the electrical resistance, It is determined whether the electrical conduction formed between the printed boards 63 is appropriately made. In particular, the upper inspection probe 73 outputs a detection signal to the determination unit 67a of the inspection unit 67 through the upper connection unit 69, so that the detection unit 67a is electrically conducting with the printed board 63. Determine.
After the inspection threshold is previously determined based on the electrical resistance of the printed board 63 of the high quality product, the electrical resistance of the inspection item of the printed board 63 is detected to determine the ratio of the detected electrical resistance to the inspection threshold. It is determined whether good electrical conduction with respect to the inspection item of the printed board 63 was made. In the conduction inspection regarding the electrical conduction of the inspection item of the printed board 63, the detected electrical resistance with respect to the inspection limit value is judged to be a good product when the ratio is less than the preset predetermined ratio value, but the ratio is larger than the specified ratio value. At that time, it is determined to be defective. In the insulation inspection regarding the insulation characteristic of the inspection item of the printed board 63, when the detected electric resistance with respect to the inspection limit value is larger than the designated ratio value, it is judged as a good product, but when the ratio is smaller than the designated ratio value It is determined to be defective. The determination method is similarly applied to the conductivity inspection in the lower inspection probe unit 66 described in detail later. Likewise, various electrical tests can be performed, such as insulation tests and capacitance tests.
The basic structure of the lower inspection probe unit 66 is similar to the part of the upper inspection probe unit 65 except for the spring holder 87, the presser 45 and the compression spring 47, and is structurally reversed in the vertical direction. . In particular, the upper base plate 75a, the first upper plate 76a, the second upper plate 77a, the first upper pillar 93a, and the second upper pillar 95a included in the upper inspection probe unit 65. , The upper inspection probe 73 and the upper wiring cable 85a include the lower base plate 75b, the first lower plate 76b, the second lower plate 77b, and the first included in the lower inspection probe unit 66. It is equal to the lower pillar 93b, the second lower pillar 95b, the lower inspection probe 74 and the lower wiring cable 85b.
The lower inspection probe 74 is electrically connected to the inspection unit 67 through the lower wiring cable 85b and the lower connection structure 71. The number of the lower connection wirings 71a of the lower connection structure 71, the number of the lower inspection probes 74, the number of the lower wiring cables 85b, and the electricity formed on the back surface of the printed board 63 to be inspected. It is equal to the number of contacts. For convenience, FIGS. 7 to 10 show fewer numbers than actual numbers.
As shown in FIG. 11, the plurality of through holes 64a are formed in the mounting base 64 at a designated position corresponding to the arrangement position of the lower inspection probe 74 of the lower inspection probe unit 66. When the upper end of the lower inspection probe 74 is inserted into the through hole 64a of the mounting base 64 so as to contact the electrical contact formed on the back side of the printed board 63, electrical conduction is between the lower inspection probes 74. By making a determination of whether or not electrical conduction has been made to the printed board 63, it is determined based on the electrical resistance. In this connection, the number of electrical contacts formed on the back side of the printed board 63 is the same as or different from the number of electrical contacts formed on the surface of the printed board 63.
Conductivity inspection is performed on the printed board 63 using the substrate inspection apparatus 61 according to steps (1) to (10).
(1) The distance between the holders 23a and 25a of the first and second holding mechanisms 23 and 25 is set equal to the distance between both ends of the printed circuit board 63, so that the opposite corners of the printed board 63 are opposite. The part is held by holders 23a and 25a. Thereafter, the distance between the first retaining mechanism 23 and the second retaining mechanism 25 is widened to prevent the waveform from being formed on the printed board 63.
(2) The support structure moving unit 28 operates so that the holders 23a and 25a move the first and second holding mechanisms 23 and 25 holding the printed board 63 toward the mounting base 64 and Therefore, the reference mark sets the designated position of the printed board 63 located below the upper inspection probe 73 of the upper inspection probe unit 65 at the mounting base 64.
(3) The moving mechanism operates by lowering the upper inspection probe unit 65 in the vertical direction so that the lower ends of the four pressers 45 directly press the position near the reference mark of the printed board 63. As shown in FIGS. 7 to 11, curvature and wrinkles W that may occur in the printed board 63 are arranged. Thus, the rear surface of the printed board 63 including the reference marks is brought into overall contact with the upper surface of the mounting base 64, as shown in FIG. At the same time, the compression spring 47 causes the presser 45 to press the printed board 63 into contact with the upper surface of the mounting base 64.
(4) With the printed board 63 pressed by the presser 45 and in contact with the upper surface of the mounting base 64, similarly to the above steps of the first embodiment, the moving mechanism is the image pickup device 21. And the CCD camera of the image pick-up apparatus 21 are positioned directly above the reference mark of the printed board 63.
(5) After the CCD camera picks up the image of the reference mark of the printed board 63, the image is processed to calculate the position of the reference mark of the printed board 63 with respect to the mounting base 64. FIG.
(6) On the basis of the position of the reference mark calculated in step (5), the moving unit 19 is configured to hold the printed board 63 in the direction in which the holders 23a and 25a cross the sheet of FIG. The support structure moving mechanism 28 is operated to properly move the first and second holding mechanisms 23 and 25 back, so as to set a designated position of the printed board 63 on the upper surface of the mounting base 64.
In the above, two or more reference marks are given to the printed board 63 so that the position with respect to the mounting base 64 is calculated, so as to print for the regular positions of the printed board 63 regularly mounted on the mounting base 64. The inclination angle and the positional deviation of the substrate 63 are calculated and used in such a manner as to set the designated position of the printed substrate 63 on the mounting base 64.
After the first and second retaining mechanisms 23, 25, in which the holders 23a, 25a hold the printed board 63, are positioned relative to the mounting base 64, the reference mark of the printed board 63 is positioned. Is picked up by the CCD camera of the image pickup device 21 so as to detect the shape, and when the printed board 63 is not disposed at the designated position on the mounting base 64, the holders 23a and 25a open the printed board 63. The holding first and second holding mechanisms 23, 25 retain the position of the printed board 63 on the mounting base 64 in such a way as to be moved again to set the designated position of the printed board 63 on the mounting base 64. The accuracy of the setting can be improved. The first and second retaining mechanisms 23 and 25 may be repeatedly moved several times to further improve the accuracy of positioning of the printed board 63 on the mounting base 64.
(7) In order to prevent the upper inspection probe 73 from disturbing the conductive inspection, the arm 21a of the image pickup device 21 is moved outward from the printed board 63 mounted on the mounting base 64.
(8) After that, the moving mechanism operates the upper inspection probe unit 65 to descend further in the vertical direction, so that the lower end portion of the upper inspection probe 73 is on the surface of the printed board 63 as shown in FIG. Make contact with the formed electrical contacts. In this state, the conductivity test is performed on the surface of the printed board 63. At this time, the four pressers 45 whose lower ends contact the printed circuit board 63 do not lower to pressurize the compression spring 47 so that the upper end of the presser 45 is in close contact with the upper end of the spring holder 87. When approaching, a compressive load is applied to the presser 45 to further press the printed board 63 toward the upper surface of the mounting base 64.
(9) After that, the moving mechanism operates the lower inspection probe unit 66 to rise in the vertical direction, so that the upper end portion of the lower inspection probe 74 of the lower inspection probe unit 66 is a through hole of the mounting base 64. After being inserted into 64a, as shown in FIG. 10, it comes into contact with the electrical contact formed on the back surface of the printed board 63. As shown in FIG. In this state, the conductivity test is performed on the back side of the printed board 63.
Lower inspection probes 74 (of the same number as the upper inspection probes 73) come into contact with the electrical contacts on the back of the printed board 73 and the upper inspection probes 73 Since the lower contact probe 74 is in contact with the electrical contact, the lower inspection probe 74 may be electrically connected to the upper inspection probe 73 through the printed board 63, thereby performing conductivity inspection of the probes 73 and 74.
(10) Finally, the upper inspection probe unit 65 is raised to the original position by the mobile unit, and the lower inspection probe unit 66 is lowered to the original position by the mobile unit, so that the substrate inspection apparatus 61 is shown in FIG. Return as shown in 7.
Therefore, the conductive test of the printed board 63 may be completed according to the steps (1) to (10).
This embodiment can be modified in various ways by appropriately changing the order and items of steps (1) to (10). In this embodiment, after the step (3) in which the upper inspection probe 65 is lowered so that the presser 45 presses the printed circuit board 63 and comes into close contact with the upper surface of the mounting base 64, the image pickup device The arm 21a of 21 is designed to perform step 4, in which the CCD camera is moved to be positioned directly above the printed board 63. Alternatively, step (3) may be performed after step (4).
In this embodiment, after the upper inspection probe unit 65 is lowered (8) so that the upper inspection probe 73 is in contact with an electrical contact on the surface of the printed board 63 to perform the conductive inspection of the printed board 63. Designed to perform step 9 in which the lower inspection probe unit 66 is raised so that the lower inspection probe 73 contacts the electrical contacts on the back side of the printed substrate 63 to perform the conductive inspection of the printed substrate 63. do. The order of steps 8 and 9 can be changed as follows.
First, the lower inspection probe 74 is raised so that the lower inspection probe unit 66 is in contact with the electrical contact on the rear surface of the printed board 63, and then the upper inspection probe 73 is electrically connected to the surface of the printing substrate 63. The upper inspection probe unit 65 is lowered to contact the contacts. Alternatively, the upper inspection probe unit 65 allows the upper inspection probe 73 and the lower inspection probe 74 to contact the electrical contacts on the surface and the back of the printed board 63 at the same time to perform the conductive inspection of the printed board 63. Can be performed simultaneously with the lowering and lowering of the lower inspection probe unit 66.
In order to perform further conductivity checks at other electrical contacts formed on the printed board 63 based on the position of the reference mark of the printed board 63 detected in step 5, steps (6), (8), ( 9) and 10 are repeatedly performed to move the next inspection portion of the printed board 63 to the designated position of the upper surface of the mounting base 64 to perform additional conductivity inspection.
As described above, the substrate inspection device 61 of the present embodiment has the mark of the reference mark of the printed circuit board 63 picked up by the image pickup device 21 to bring the printed circuit board 63 into contact with the mounting base 64. The presser 45 is designed to directly press the vicinity position in the vicinity. This allows the reference mark of the printed board 63 (imaged by the image pickup device 21) to reliably contact the upper surface of the mounting base 64. That is, the CCD camera of the image pickup device 21 makes it possible to image the reference mark of the printed board 63 whose surface is pressed by the upper inspection probe 73 of the upper inspection probe unit 65 in the conductive inspection, The image pickup device 21 can be used to accurately detect the position of the printed board 63 on the mounting base 64 before the conductivity test.
This embodiment is designed such that the upper inspection probe unit 65, which can be moved in proximity or spaced apart from the mounting base 64, has a presser 45, and the upper inspection probe unit 65 has a mounting base 64. Is moved close to the mounting base 64 to perform conductivity inspection of the electrical contacts of the surface of the printed board 63 mounted on the upper surface of Alternatively, by simply moving spaced apart, the presser 45 can be moved in proximity or spaced apart from the printed board 63 mounted on the top surface of the mounting base 64. This eliminates the need for using a particular additional instrument to move the presser 45, thereby reducing the overall size of the substrate inspection apparatus 61 by reducing the number of parts.
Since the upper inspection probe unit 65 is numerically controlled by the moving unit, the moving distance is controlled with high precision. This makes it possible to finely adjust the pressing force of the presser 45 applied to the printed board 63 in consideration of the bending, wrinkles and characteristics of the printed board 63. In addition, the first holder 23a, 25a holds the printed board 63 while the presser 45 applies a " sensitive " pressing force on the printed board 63 so as to contact the upper surface of the mounting base 64. And the designated positions of the printed circuit board 63 can be set on the upper surface of the mounting base 64 by appropriately moving the second holding mechanisms 23 and 25. As a result, the positional precision of the printed circuit board 63 on the mounting base 64 can be further improved.
Since the upper inspection probe unit 65 has a presser 45 which is retractably moved close to or spaced from the mounting base 64, the upper inspection probe unit 65 is formed by the surface of the printed substrate 63. The presser 45, which is retracted to be spaced apart from the mounting base 64 when descending to perform the conductivity test of the electrical contact, can be prevented from interfering with the conductivity test, and thus, the surface of the printed board 63 Conductivity testing can be performed reliably without problems. Since the substrate inspection device 61 is designed so that the presser 45 presses the printed board 63 so that the compression spring 47 is in close contact with the upper surface of the mounting base 64, the printed board 63 is removed. It is possible to reliably make close contact with the upper surface of the mounting base 64, and the presser 45 can be retracted away from the mounting base 64 in a simple low cost structure.
According to the substrate inspection device 61, the upper inspection probe unit 65 is lowered to the printing substrate 63 of the upper surface of the mounting base 64 so that the lower end portion of the upper inspection probe 73 contacts the printing substrate 63. The presser 45 presses the printed board 63 before approaching. This allows the presser 45 to press the printed circuit board 63 in close contact with the upper surface of the mounting unit 64 and then conducts a conductive test of the electrical contact on the surface of the printed board 63 with the upper inspection probe 73. It is possible to perform the conductivity test of the printed circuit board 63 accordingly.
The presser 45 protrudes from the upper inspection probe unit 65 which presses the printing substrate 63 before the upper inspection probe 73 contacts the printing substrate 63, so that the upper surface of the mounting base 64 is pressed. The gap between the printed board 63 and the lower end of the upper inspection probe 73 which are previously placed in close contact with each other may be formed by pressing by the presser 45. In other words, the CCD camera of the image pickup device 21 may be located in the gap to image the reference mark of the printed board 63.
In the substrate inspection apparatus 61, the presser 45 is disposed between and near the upper inspection probes 73 of the upper inspection probe unit 65. That is, the upper inspection probe 73 has a presser 45 so as to introduce a printed substrate 63 in intimate contact with the upper surface of the mounting unit 64, at the surface of the printed substrate 63 on which the conductive inspection is performed. By contacting the printed circuit board 63 while pressing the near position, which is near the contact, it is possible to perform conduction inspection of the electrical contact on the surface of the printed board 63 with high precision.
The first and second embodiments are illustrative and not limiting of the invention, which can be further modified in various ways within the essential context of the invention, and thus various modifications relating to the punching device 11 and the substrate inspection device 61. Modifications are classified within the scope of the present invention. Although the first and second embodiments are shown with four pressers 45 in the figure, the number of pressers is not limited to four, but may be changed to, for example, one, three, five or more.
When there are four or less pressers, there is a tendency that bending and wrinkles can be easily generated at designated positions for printed boards having the same specifications. For that reason, the position is tested in advance so as to attach the presser to the upper inspection probe unit of the substrate inspection apparatus and the punching unit of the punching apparatus corresponding to the designated position for each printed substrate on which the conductive inspection is made. In the case of a plurality of pressers, the pressers are aligned at predetermined intervals of the lattice structure in the punching unit and the upper inspection probe unit, and the lower ends of the pressers are uniformly distributed in the positions so as to selectively contact the relatively wide areas of the printed board. .
The first and second embodiments are designed to perform punching and inspection on a printed board, but are not limiting. That is, the printed board can be replaced with a flexible thin resin sheet or paper. The first and second embodiments are not limited to the punching device and the substrate inspection device, but can be changed to a printing device that prints characteristics and images on designated portions on the surface of the processing material.
In the punching mechanism 11 of the first embodiment, four compression springs 41 are disposed at an equidistant distance (ie 90 °) between them so as to surround the punch 35, and also the compression spring 47 and the presser. 45 is arranged to surround the compression spring 41. Instead, the presser 45 and the compression spring 47 may be disposed between the compression springs 41. That is, the punch 35 is surrounded by the presser 45 and the compression springs 47 and 41 while the presser 45 and the compression spring 47 are disposed in close proximity to the punch 35. This allows the printed circuit board 17 to be in intimate contact with the top surface of the die 55 while the presser 45 further presses near the position of the printed board 63 which is very close to the position of the hole punched with the punch 35. Can be introduced. In such a structure, the punch 35 of the punching unit 13 can form a hole in the printed board 17 with very high precision.
In the substrate inspection mechanism 61 of the second embodiment, the presser 45 is disposed between and near the upper inspection probes 73 in the upper inspection probe unit 65. This can be changed in such a way that instead of placing the presser 45 between the upper inspection probes 73, the presser 45 is simply placed near the upper inspection probe 73. In such a structure, the upper inspection probe 73 in contact with the printed board 63 is a printed board on which the presser 45 is subjected to conductivity inspection to introduce the printed substrate 63 in contact with the top surface of the mounting base 64. Since the pressurization can be introduced into the vicinity of the position near the designated position of 63, the conductivity inspection of the electrical contact can be performed at the surface of the printed board 63 with high precision.
In the substrate inspection apparatus 61 of the second embodiment, the moving unit performs numerical control of the upper inspection probe unit 65 to move in the vertical direction. The moving unit may be changed in such a way as to perform numerical control of the mounting base 64 so that the upper inspection probe unit 65 does not move or moves vertically together with the upper inspection probe unit 65. That is, the second embodiment controls the upper inspection probe unit 65 and the mounting base 64 to move close to each other or spaced apart from each other to perform the conductive inspection of the printed board 63 on the upper surface of the mounting base 64. do. In such a structure, the height and position of the image pickup device 21 in the vertical direction are appropriately determined in consideration of the movement distance achieved by the mounting base 64 and the upper inspection probe unit 65.
Finally, the present invention is not necessarily limited to the above-described embodiments and modifications, and may be modified in various ways within the scope of the present invention as defined by the appended claims.
