KR101026356B1

KR101026356B1 - Laser scanning device

Info

Publication number: KR101026356B1
Application number: KR1020100095755A
Authority: KR
Inventors: 이석준
Original assignee: 이석준
Priority date: 2010-10-01
Filing date: 2010-10-01
Publication date: 2011-04-05

Abstract

PURPOSE: A laser scanning device is provided to reduce errors caused of inertia by operating a low mass reflecting mirror with a substrate and layer fixed. CONSTITUTION: A laser scanning device comprises a vibrator(110), a scanner(150), an optical system and a controller(180). The vibrator generates laser. The scanner includes a drive motor and moves the location of X and Y plane surface of a substrate(170). The optical system comprises a beam extension unit controlling the beam width of the laser emitted from the laser generator. The controller controls the output of the scanner, laser and optical system.

Description

Laser Scanning Device

The present invention relates to a laser scanning device for forming, cutting, or welding a pattern while scanning a workpiece, and more particularly, to configure a laser oscillator and a scanner by adjusting a laser beam width and output while enabling more accurate scanning. And a laser scanning device for forming scanning beams of various widths.

In recent years, the use of a laser is increasing in the process of cutting, welding, and forming a pattern on a material.

Since the method using the laser shows a sharp advantage in the processing speed and precision compared to the conventional processing method, the use of the laser has recently been applied to various fields.

On the other hand, in recent years, without using input devices such as a keyboard or a mouse, when a person's hand or an object touches a character or a specific location displayed on the screen, the use of the touch panel to fix a specific function is increased. The use of capacitive touch panels among the touch panels is increasing rapidly.

A transparent electrode is used for the capacitive touch panel. Conventionally, as illustrated in FIG. 1, processes such as deposition and cleaning, PR coating and exposure, development, etching, PR peeling, and inspection are performed to produce the transparent electrode. It was necessary to proceed sequentially.

However, the above-described method has a disadvantage in that the production cost is increased and the production speed is slow because the process is complicated and has to go through several processes, and there is a concern of environmental pollution due to the use of chemicals in the process.

Recently, a processing apparatus using a laser for producing a substrate such as a transparent electrode has been introduced. As shown in FIG. 2, the laser oscillator 10, the reflector 20, the homogenizer 30, and the substrate are illustrated. It consists of XY stage 40 etc. in which 50 is seated.

That is, the laser emitted from the laser oscillator 10 is incident to the homogenizer 30 through the reflecting mirror 20, and the laser beam passing through the homogenizer 30 is irradiated onto the substrate 50 to expose the substrate surface. To form a pattern.

At this time, a pattern is formed on the substrate 50 while the XY stage 40 moves in a plane.

However, the conventional laser processing apparatus as described above has the following problems.

First, when the beam passing through the homogenizer is moved in a path other than vertical, optical aberration occurs and the focus is not uniformly formed on a plane having the same height. Thus, the laser is placed on a substrate directly below the homogenizer. While the fixed XY stage moves while being fixed, this is because the high mass XY stage is moved, which may cause errors in movement-stop due to inertia, and there is a problem that many position distortions occur in curve processing and high speed machining. .

Second, in order to compensate for the above problems, the laser and the substrate are fixed, and a scanner is provided to control the angle of the reflector reflecting the laser to the substrate. As a result, a difference occurs in the distance to the substrate surface depending on the angle reflected by the reflector, thereby causing a problem in that the focal point is not formed on the substrate.

Third, in order to solve the second problem, a plan for further including a flat field lens such as an f-θ lens and a telecentric lens has been studied, but the flat field lens is generally expensive. Even if a flat field lens is provided, there is a problem that the focus is not all located at the same plane.

Fourth, the use of the homogenizer is very disadvantageous in the adjustment of the width to move the focus up and down is possible only processing a flat substrate, there is a problem that the substrate with a change in height, such as the bending of the substrate can not be processed. In addition, even when the substrate is not precise because the substrate is somewhat curved, there is a problem that the processing quality is poor.

Fifth, since the thickness (line width) of the laser beam irradiated onto the substrate is constant, only a certain width of the pattern may be formed when the pattern is formed on the substrate by using the laser, and the width of the laser beam is greater than the thickness of the laser. In this case, it is required to form a plurality of times, in this case, the processing time is long, as well as the laser overlaps the portion where the laser overlaps, there is a problem that the processing thickness is not uniform.

The present invention is to solve the above problems, has the following problem to be solved.

First, it is a problem to provide a laser scanning device capable of scanning a laser on a plane of a substrate without moving a heavy XY stage.

Second, it is an object of the present invention to provide a laser scanning device capable of vertically adjusting the focus of the laser so that the focus is exactly matched on the substrate and processing even the stepped portion and the curved surface.

Third, it is an object of the present invention to provide a laser scanning apparatus capable of scanning at one time even if the width of the pattern changes in response to the width of the laser beam (line width) and the output of the pattern to be processed.

In order to solve the above problems, according to an embodiment of the present invention, comprising a laser oscillator for generating a Gaussian type laser, an X-axis mirror and a Y-axis mirror and a drive motor provided to drive each mirror. And a combination of a convex lens and a concave lens to move a position on an XY plane of a position at which the laser generated from the laser oscillator is irradiated onto a substrate to be scanned, and provided between the laser oscillator and the scanner. An optical system including a beam expansion unit configured to adjust the distance between the convex lens and the concave lens to adjust the beam width of the laser emitted from the laser oscillator, and the laser at the corresponding position according to the position on the XY plane of the scan point on the substrate. Controlling the scanner to be irradiated, depending on the position of the laser being irradiated on the substrate The large laser is controlled to control the optical system to correct the focal length to form a focal point on the substrate, and to control the optical system to control the beam width of the laser according to the width of the line width scanned by the laser on the substrate. There is provided a laser scanning device including a control unit for controlling the output of the laser so that a constant energy is irradiated to the substrate irrespective of the beam width.

In addition, a focusing unit may be further comprised of a combination of a convex lens and a concave lens, and adjusts the position of the Z-axis focus of the laser emitted from the laser oscillator.

The control unit may be configured to control the focusing unit on the Z-axis by controlling the focusing unit so as to form a focus on the substrate by correcting a focal length that varies depending on a position at which the laser is irradiated on the substrate.

In addition, a beam mode converter for converting the laser beam power distribution emitted from the laser oscillator may be further provided.

The control unit may be configured to change the beam output distribution of the laser emitted through the beam mode converter while changing the position of the beam mode converter.

The beam mode converter may be a homogenizer.

The beam mode converter may be provided between the rear side of the beam expansion unit and the scanner.

In addition, a flat field lens may further include a focusing laser beam irradiated onto the substrate by the scanner on a flat substrate.

According to another embodiment of the present invention, an X-axis mirror and a Y-axis mirror of the scanner are controlled so that the laser is irradiated to the corresponding position according to the position on the XY plane of the scan point on the substrate, and the substrate is controlled by the scanner. The optical system is controlled so as to correct the focal length depending on the position at which the laser is irradiated onto the substrate so that the focus is formed on the substrate, and the beam width of the laser is controlled according to the width of the line width scanned by the laser on the substrate. There is provided a control method of a laser scanning device that controls an optical system and adjusts the output of the laser to irradiate constant energy to the substrate.

When the beam width of the laser scanned on the substrate is widened, the output of the laser can be increased.

According to the laser scanning device of the present invention as described above has the following effects.

First, since the laser is scanned on the plane of the substrate while the reflector of the mass is fixed with the substrate and the laser fixed, the heavy XY stage is not driven so that the error due to inertia is reduced, thereby enabling more accurate and faster processing speed. .

Second, since the laser focus can be adjusted up and down, the focus can be adjusted exactly on the substrate, which improves the processing precision and enables the processing of even the stepped portions and curved surfaces.

Third, since the focus can be adjusted up and down, there is no need to use an expensive flat field lens, and even when the flat field lens is used, distortion due to the flat field lens can be corrected, thereby enabling more precise processing.

Fourth, by adjusting the thickness (line width) and output of the laser beam, scanning can be performed at a time even if the width of the pattern changes to correspond to the width of the pattern to be processed, thereby increasing the processing speed and eliminating the part irradiated twice by the laser There is an effect that the processing thickness is constant.

Fifth, in order to produce and form a pattern on a transparent electrode provided in a capacitive touch panel, processes such as deposition, cleaning, PR coating and exposure, development, etching, PR peeling, and inspection have to be sequentially performed. The laser scanning device of the present invention can shorten the process of PR coating, exposure, development, etching, and PR peeling to one process, and there is no fear of environmental pollution since there is no need to use harmful chemicals.

Sixth, it is possible to adjust the mode of the laser beam to be irradiated by moving the beam mode converter, it is possible to provide a mode of the beam optimized for the process, such as patterning, welding, cutting, versatility that can be applied to various processes with a single device to provide.

1 is a view showing a manufacturing process of a conventional transparent electrode substrate;
2 shows a conventional laser scanning device;
3 is a diagram schematically showing a configuration of a laser scanning apparatus according to an embodiment of the present invention;
4 is a plan view showing a substrate patterned by the laser scanning device of the present invention;
5 is a side view briefly showing an example of the configuration of the beam expansion unit of FIG.
6 is a side view briefly showing another example of the configuration of the beam expansion unit of FIG.
7 is a perspective view briefly showing a configuration of the scanner of FIG. 4;
FIG. 8 is a view showing that the diameter of an input laser beam is inversely proportional to the diameter of the laser beam at a focus position;
9 is a view briefly showing a configuration of a laser scanning apparatus according to another embodiment of the present invention;
FIG. 10 is a side view briefly showing the configuration of the focusing unit of FIG. 8; FIG.
FIG. 11 is a side view briefly illustrating a form in which a position where a focal point of the laser is formed changes as the laser irradiated onto the substrate is scanned; FIG.
FIG. 12 is a side view briefly illustrating a form in which a position where a focal point of a laser is formed changes as a laser beam irradiated onto a stepped substrate is scanned; FIG.
FIG. 13 is a side view briefly illustrating a form in which a position where a focal point of a laser is formed changes as a laser beam irradiated onto a curved curved substrate is scanned; FIG. And,
14 is a diagram illustrating a mode in which a laser mode changes as the position of the beam mode converter changes.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of this embodiment, the same name and the same reference numerals are used for the same configuration and additional description thereof will be omitted.

As shown in FIG. 3, the laser scanning apparatus according to an exemplary embodiment of the present invention may include a laser oscillator 110, an optical system, a scanner 150, and a controller 180.

The laser scanning device is a device for forming a pattern on the substrate 170 to be processed, such as welding or cutting, and in the following description, forms a pattern of a transparent electrode on a glass substrate of a capacitive touch panel. The application will be described by way of example.

As shown in FIG. 4, the glass substrate 170 should have a predetermined pattern formed on one surface thereof. The patterns may have different line widths. That is, the narrow pattern 172 and the thick pattern 174 are mixed.

The laser oscillator 110 is generally output in a state indicating an output distribution in the form of a Gaussian-shaped center portion of the output is strong and the output is weakened toward the peripheral portion.

The optical system includes a beam expansion unit 120 that adjusts the beam width of the laser emitted from the laser oscillator 110.

As shown in FIGS. 5 and 6, the beam extension unit includes convex lenses 122 and 128 and concave lenses 124 and 126, and a concave lens 124 is provided on the rear side of the convex lens 122. Alternatively, the convex lens 128 may be provided on the rear side of the concave lens 126.

As the convex lens and the concave lens are moved in one or both of the convex lenses, the positions (or thicknesses) of the laser beams passing through each lens become wider or narrower as the position is moved toward or away from each other.

In addition, as described above, the beam extension unit including the convex lenses 122 and 128 and the concave lenses 124 and 126 may have a distance between the convex lenses 122 and 128 and the concave lenses 124 and 126 as well as the width of the laser beam. As an adjustment, the position and position where the focal point of the laser beam is formed can be adjusted to some extent in the advancing direction of the laser.

The scanner 150 is a component that reflects the laser beam such that the laser beam passing through the optical system is irradiated at the corresponding position according to the position on the XY plane of the scan point on the substrate 170.

As illustrated in FIG. 7, the scanner 150 may include an X-axis mirror 152, a Y-axis mirror 154, an X-axis motor 156, and a Y-axis motor 158.

That is, the X-axis mirror 152 whose angle is changed by the X-axis motor 156 and the Y-axis motor 158 while the laser beam is sequentially reflected to the X-axis mirror 152 and the Y-axis mirror 154. And the position reflected by the Y-axis mirror 154 to the substrate 170 while being irradiated to the substrate 170 is moved and scanned.

Here, the scanning means that the laser beam sweeps down the surface of the substrate 170, and may be patterned, welded, or cut at the point to be scanned according to variables such as the output and the irradiation amount of the laser beam. It may be.

Accordingly, the laser beam output from the laser oscillator 110 passes through the beam expansion unit 120 of the optical system, and the beam width thereof is adjusted, and the substrate 170 is reflected from the scanner 150 to the substrate 170. ) Will be scanned.

The controller 180 is a component that controls the laser oscillator 110, the optical system, and the scanner 150 described above.

The controller 180 may be previously inputted with the shape of the substrate 170 and data about the XY coordinates of the points to be scanned on the substrate 170 and the Z-axis coordinates of the corresponding points. In addition, data on the width to be scanned of the spot to be scanned may also be input.

Accordingly, the controller 180 controls the X-axis mirror 152 and the Y-axis mirror 154 of the scanner 150 to position the laser beam at the corresponding position according to the XY plane position of the scan point on the substrate 170. The scanner 150 may be controlled to irradiate this.

In addition, the controller 180 may adjust the width (thickness) of the focal point where the laser beam is formed on the substrate 170 according to the width to be scanned at the corresponding position of the substrate 170.

The diameter of the laser beam at the focal position is inversely related to the diameter of the beam, which can be expressed by the following equation with reference to FIG. 8.

That is, as the thickness of the laser beam controlled by the optical system becomes thicker, the width (thickness) of the laser beam formed at the focusing position becomes narrower. On the contrary, the thinner the laser beam, the wider the width of the laser beam formed at the focal position. This change occurs linearly, and by controlling the beam expansion unit 120 of the optical system can also control the width of the laser beam formed at the focus position.

Therefore, by controlling the beam expansion unit 120 of the optical system it is possible to control the beam width of the laser irradiated to the corresponding point according to the width of the point to be scanned of the substrate 170.

In addition, while adjusting the distance between the convex lens (122, 128) and the concave lens (124, 126) of the beam expansion unit 120, the position where the laser beam forms a focal point can also be adjusted. Therefore, the controller 180 controls the beam width of the laser beam while appropriately adjusting the position between the convex lenses 122 and 128 and the concave lenses 124 and 126 of the beam expansion unit 120 and at the same time. The position of the focus may be adjusted so that the focus is formed on the substrate 170.

On the other hand, the controller 180 may adjust the output of the laser. That is, as the beam width of the laser formed on the substrate 170 increases, the energy applied per unit area of the substrate 170 decreases, so that the energy applied per unit area of the substrate 170 also changes in the laser beam width. Is to change the output of the laser to be the same.

That is, when the beam width of the laser irradiated on the substrate 170 increases, the output of the laser increases, and when the beam width of the laser irradiated on the substrate 170 decreases, the output of the laser decreases to lower the substrate 170. The laser oscillator 110 may be controlled to have the same energy applied per unit area. At this time, the output control of the laser oscillator 110 may be achieved by adjusting the voltage or current applied to the laser oscillator 110.

Hereinafter, a laser scanning apparatus according to another embodiment of the present invention will be described.

As shown in FIG. 9, a laser scanning apparatus according to another embodiment of the present invention may include a laser oscillator 110, an optical system, a beam mode converter 130, a scanner 150, and a controller 182. have.

Since the laser oscillator 110 and the scanner 150 are the same as the above-described embodiment, detailed description will be replaced with the description of the above-described embodiment.

The optical system may include a beam expansion unit 120 and a focusing unit 140. Since the beam expansion unit 120 is the same as the beam expansion unit 120 of the above-described embodiment, a description thereof will be omitted and the focusing unit 140 will be described.

The focusing unit 140 may be provided between the beam expansion unit 120 and the scanner 150, and the laser beam of the focal point of the laser beam emitted from the laser oscillator 110 and irradiated onto the surface of the substrate 170. It is a component that controls the position on the traveling direction.

As shown in FIG. 10, the focusing unit 140 is a combination of the concave lens 142 and the convex lens 144, and any one of the concave lens 142 and the convex lenses 144 moves or both. The position of the laser beam passing through each lens may be adjusted in real time so that the position of the laser beam passing through each lens moves away from each other.

At this time, the focusing unit 140 is preferably made to have a wider focusing ability and superior to the focusing ability of the above-described beam expansion unit 120.

As shown in FIG. 11, the laser beam l reflected by the scanner 150 to the substrate may be closer or closer to the distance from the scanner 150 depending on the position irradiated on the substrate 170. have. That is, the distance of the point corresponding to the lower part of the scanner 150 is the shortest, and the further away from it, the farther the distance from the scanner 150 becomes.

Therefore, in order to always form the focus of the laser beam 1 on the surface of the substrate 170 in the plane, the distance at which the focus of the laser beam 1 is formed under the control of the focusing unit 140 is approached or close. It's far away.

In addition, by adjusting the distance at which the focal point of the laser beam 1 is formed as described above, the position where the focal point is focused in the vertical direction (Z axis) direction from the substrate 170 may be adjusted.

That is, even if the stepped portion 176 is present on the substrate as shown in FIG. 12, or the substrate that is the object to be processed is formed as shown in FIG. 13, the focusing unit 140 is formed. By controlling the distance at which the focal point of the laser beam 1 is formed, it is possible to accurately focus the laser beam 1 on the processing surface of the substrate 170.

This means that the laser scanning device of the present invention can scan not only a flat substrate but also a stepped substrate, as well as a curved substrate surface. The plane may be slightly distorted depending on whether it is stored, which means that the substrate can be scanned accurately.

Of course, in order to scan the stepped, curved or somewhat error-like substrate as described above, data about the stepped shape, the curved shape and the error shape of the substrate should be input to the controller 182. And, there is provided a measuring device (not shown) for measuring the numerical information on the shape of the processing surface of the separate substrate may be made to measure in real time.

The beam mode converter 130 is a component that provides a laser beam in a mode optimized for a process to be processed by patterning, welding, cutting by converting an output distribution of the laser beam output from the laser oscillator 110. .

The laser beam emitted from the laser oscillator 110 represents a Gaussian type output distribution. The power distribution of the laser beam is peaked at the center and becomes lower toward the periphery. When the Gaussian laser beam is irradiated onto a substrate made of a material such as a thin film or a weak strength, the processing thickness is not uniform. There are problems such as being lost or undesirably punctured.

Therefore, the beam mode converter 130 converts the Gaussian-type laser beam into a laser beam in a mode optimized for the process and the material of the substrate, so that the process can be efficiently performed.

The beam mode converter 130 may be a kind of homogenizer, and is a component that converts the incident laser beam to have another form of output distribution such as a top-flat form.

Meanwhile, as illustrated in FIG. 14, the beam mode converter 130 may have a different mode formed while the position thereof is moved. Here, the mode means a form of the output distribution of the laser beam.

FIG. 14 is a diagram illustrating an output distribution of a laser beam at a corresponding position when the laser beam converted by the homogenizer, which is a type of the beam mode converter 130, is shorter or longer than a set distance. As can be seen in the figure, the laser beam mode has a flat top surface in the front when it matches the set distance, and the intensity decreases and becomes rounder as the distance goes shorter than the set distance, and the distance longer than the set distance. As the direction of the beam is distributed, the output of the beam is formed in the form of a ring having a high side and a low center.

On the other hand, the mode of the laser beam which shows better efficiency differs according to processes, such as patterning, welding, and cutting. For example, in the patterning process, the top flat laser beam mode is generally suitable, and in the welding process, the ring type laser beam mode may be appropriate.

Therefore, the position of the beam mode converter 130 may be moved according to a process to provide a laser beam mode optimized for the corresponding process.

And, the beam mode converter 130 is preferably located between the beam expansion unit 120 and the focusing unit 140, the present invention is not limited to this, the laser oscillator 110 and the beam expansion unit It may be provided between the 120, may be located between the focusing unit 140 and the scanner 150, and the installation position is not limited.

In addition, a flat field lens 160 may be further provided between the scanner 150 and the substrate 170. The flat field lens 160 is a component that assists the laser beam reflected from the scanner 150 and irradiated onto the substrate 170 to be positioned more precisely on the plane of the substrate 170. When the flat field lens 160 is provided, the laser beam may be focused at a more accurate position on the plane of the substrate 170.

As the flat field lens 160, an f-θ lens and a telecentric lens may be used.

Therefore, the thickness of the laser beam output from the laser oscillator 110 is adjusted while passing through the beam expansion unit 120 of the optical system, the mode of the laser beam is converted while passing through the beam mode converter 130, The focal length is adjusted while passing through the focusing unit 140 and the substrate is scanned by the scanner 150 while being reflected from the scanner 150.

The controller 182 is a component that controls the laser oscillator 110, the beam expansion unit 120, the beam mode converter 130, the focusing unit 140, and the scanner 150 described above.

The controller 182 may be previously inputted with the shape of the substrate 170 and data regarding the XY coordinates of the points to be scanned on the substrate 170 and the Z-axis coordinates of the corresponding points. In addition, data on the width of the point to be scanned may also be input.

In addition, the step information and the curved surface information or the error information of the scanned surface of the substrate 170 may be input together with the material and the type of the process of the target substrate 170 to be scanned.

Accordingly, the controller 182 controls the X-axis mirror and the Y-axis mirror of the scanner 150 so that the laser beam is irradiated to the corresponding position according to the position on the XY plane of the scan point on the substrate 170. 150) can be controlled.

In addition, the controller 182 may adjust the width (thickness) of the focal point where the laser beam 1 forms on the substrate according to the width of the point to be scanned of the substrate 170.

That is, the thicker the thickness of the laser beam 1 controlled by the optical system, the narrower the width of the laser beam formed at the focal position. On the contrary, the thinner the laser beam, the wider the width of the laser beam formed at the focal position. This change occurs linearly, and by controlling the beam expansion unit 120 of the optical system can also control the width of the laser beam formed at the focus position.

Therefore, by controlling the beam expansion unit 120 of the optical system it is possible to control the beam width of the laser beam irradiated to the corresponding point according to the width of the width of the point to be scanned of the substrate.

In addition, the focal length of the laser beam is calculated based on the information on the Z-axis of the point to be scanned of the substrate 170 previously input to the controller 182, and the focusing unit 140 is adjusted based on the laser beam. The distance between the lenses of the focusing unit 140 may be adjusted such that the focal point of the beam is formed on the processed surface of the substrate 170.

In addition, the laser beam mode optimized for the material and the process may be provided by adjusting the position of the beam mode converter 130 according to the type of the material and the process of the substrate 170 previously input to the controller 182. .

Meanwhile, the controller 182 may adjust the output of the laser oscillator. In other words, when the width of the laser beam formed on the substrate 170 is increased, the energy applied per unit area of the substrate 170 decreases, and thus the energy applied per unit area of the substrate 170 even when the laser beam width is changed. Is to change the output of the laser oscillator 110 to be the same.

That is, when the width of the laser beam formed on the substrate 170 increases, the output of the laser increases, and when the width of the laser beam formed on the substrate decreases, the output of the laser decreases so that the unit of the substrate 170. The laser oscillator 110 may be controlled to have the same energy applied per area. At this time, the output control of the laser oscillator 110 may be achieved by adjusting the voltage or current applied to the laser oscillator 110.

As described above, a preferred embodiment according to the present invention has been described, and the fact that the present invention can be embodied in other specific forms in addition to the above-described embodiments without departing from the spirit or scope thereof has ordinary skill in the art. It is obvious to them. Therefore, the above-described embodiments should be regarded as illustrative rather than restrictive, and thus, the present invention is not limited to the above description and may be modified within the scope of the appended claims and their equivalents.

110: laser oscillator 120: beam expansion unit
122, 128: convex lens 124, 126: concave lens
130: beam mode converter 140: focusing unit
142: concave lens 144: convex lens
150: scanner 152: X-axis mirror
154: Y-axis mirror 156: X-axis motor
158: Y-axis motor 160: flat field lens
170: substrate 172: pattern of narrow width
174: Pattern of wide width 176: Substrate with stepped surface
178: substrate with curved surface 180, 182: control unit

Claims

A laser oscillator for generating a laser;
And a driving motor provided to drive the X-axis mirror, the Y-axis mirror, and each mirror, wherein the laser beam generated by the laser oscillator is irradiated onto the substrate to be scanned to position on the X and Y planes. A moving scanner;
Consists of a combination of convex and concave lenses, the beam expansion unit is provided between the laser oscillator and the scanner to adjust the distance between the convex lens and the concave lens to adjust the beam width of the laser emitted from the laser oscillator An optical system made up of;
The scanner is controlled so that the laser is irradiated to the position according to the position on the X, Y plane of the scan point on the substrate,
The optical system is controlled to form a focal point on the substrate by correcting a focal length that varies depending on the position at which the laser is irradiated on the substrate.
The optical system is controlled to control the beam width of the laser according to the width of the line width scanned by the laser on the substrate,
A controller configured to control an output of the laser such that constant energy is irradiated onto the substrate irrespective of the laser beam width irradiated;
Laser scanning device comprising a.

The method of claim 1,
And a focusing unit, comprising a combination of a convex lens and a concave lens, for adjusting a position of a Z-axis focus of the laser emitted from the laser oscillator.

The method of claim 2,
The control unit,
And a focal point on the Z-axis by controlling the focusing unit so as to form a focal point on the substrate by correcting a focal length that varies depending on the position at which the laser is irradiated on the substrate.

The method of claim 1,
And a beam mode converter for converting a laser beam output distribution emitted from the laser oscillator.

The method of claim 4, wherein
The control unit,
And varying the beam power distribution of the laser emitted through the beam mode converter while changing the position of the beam mode converter.

The method of claim 4, wherein
And the beam mode transducer is a homogenizer.

The method of claim 4, wherein
And the beam mode converter is provided between the rear side of the beam expansion unit and the scanner.

The method of claim 1,
And a flat field lens for converging the focus of the laser irradiated onto the substrate by the scanner on a flat substrate.

It controls the X-axis mirror and Y-axis mirror of the scanner including the X-axis mirror and the Y-axis mirror so that the laser is irradiated to the position according to the position on the X, Y plane of the scanning point on the substrate,
The optical system is controlled so that the focal point is formed on the substrate by correcting a focal length that varies depending on the position at which the laser is irradiated onto the substrate by the scanner.
The optical system is controlled to control the beam width of the laser according to the width of the line width scanned by the laser on the substrate,
The control method of the laser scanning device for adjusting the output of the laser so that a constant energy is irradiated to the substrate.

10. The method of claim 9,
And increasing the output of the laser when the beam width of the laser beam scanned on the substrate is widened.

10. The method of claim 9,
A method of controlling a laser scanning device, comprising moving a beam mode converter to provide an output distribution of a laser beam optimized for a required process.