KR100977685B1 - Variable inductor using micro elector mechanical system and various applicable device thereof - Google Patents

Abstract

The present invention relates to a variable inductor using a micro electro mechanical system (MEMS) and an application device using the same. More specifically, the present invention relates to a variable inductor, a variable passive element, a variable transformer and a stress measuring device using a microelectromechanical system.

The variable inductor using the microelectromechanical system according to the present invention includes an insulator substrate and a flow conductor unit formed on the insulator substrate and in which parallel flow conductors which are moved in position to change the separation distance are repeatedly formed.

The variable inductor using the microelectromechanical system according to the present invention can increase the rate of change of inductance by allowing the adjacent flow conductors to be freely deformed between the planar meander and the three-dimensional solenoid type.

Micro Electro Mechanical System (MEMS), Variable Inductor, Variable Transformer, Stress Sensor

Description

Variable inductor using micro electromechanical system and application device using the same {VARIABLE INDUCTOR USING MICRO ELECTOR MECHANICAL SYSTEM AND VARIOUS APPLICABLE DEVICE THEREOF}

The present invention relates to a variable inductor using a micro electro mechanical system (MEMS) and an application device using the same. More specifically, the present invention relates to a variable inductor, a variable passive element, a variable transformer and a stress measuring device using a microelectromechanical system.

In general, a variable inductor used in an integrated circuit includes a variable inductor largely driven by an electrical method and a mechanical method.

First, an electrical method of driving a variable inductor is a method of changing mutual inductance between two adjacent inductors by changing a current flowing in two adjacent inductors. That is, the overall inductance can be varied by changing the mutual inductance between two adjacent inductors. In the case of a variable inductor driven by an electrical method, there is a disadvantage in that it is difficult to integrate in a monolithic method.

The mechanical method is a method of changing the overall inductance by changing the length of the inductor using a mechanical switch using a transistor and a Micro Electro Mechanical System (hereinafter, MEMS). In the case of a variable inductor driven by a mechanical method, the configuration of a circuit for driving a mechanical switch is complicated. In addition, not only is it difficult to continuously change the inductance, but also the variable range of the inductance is not large.

SUMMARY OF THE INVENTION In order to solve this problem, an object of the present invention is to provide a variable inductor having a simple configuration, a large change rate of inductance, and a change in inductance continuously.

In addition, to provide a variable passive element, a variable transformer and a stress measuring device using a variable inductor.

A variable inductor using a micro electro mechanical system (MEMS) according to the present invention is formed on an insulating substrate and an insulating substrate, and the flow conductor portion repeatedly formed with parallel flow conductors which are moved to change their separation distances. It includes.

Flow lead part,

It comprises a connecting line for electrically connecting between the parallel and adjacent to each other the first flow line and the second flow line and each of the first flow line and the second flow line, the drive current is preferably applied to both ends of the flow lead portion Do.

The flow lead portion generates heat by an applied driving current, and when the heat flow occurs, the separation distance is changed as the first flow lead and the second flow lead are bent in different normal directions with respect to the first flow lead and the second flow lead. desirable.

Preferably, the first flow line and the second flow line include bimetals having different coefficients of thermal expansion.

A magnetic field generating unit is formed on both sides of the flow conductor to generate a magnetic field orthogonal to the direction of the driving current flowing in the first flow conductor and the second flow conductor. When the driving current is applied, the first flow conductor and the second flow As the conductive wire is bent in different normal directions with respect to the first flow line and the second flow line by the generated magnetic field, the separation distance may be changed.

A variable inductor using a micro electro mechanical system (MEMS) according to the present invention is formed on an insulating substrate, an insulating substrate, and has a flow conductor formed in the form of a solenoid with a flow conductor which is moved to change an internal gap. It includes an electrode portion formed adjacent to the flow lead portion.

The electrode portion is preferably formed adjacent to the outer one side of the flow conductor portion.

The electrode portion is preferably formed along the central axis of the flow lead portion.

When a driving voltage is applied between the flow lead portion and the electrode portion, the internal distance of the flow lead portion is preferably changed by moving the flow lead in the direction of the electrode portion by the electrostatic force between the flow lead portion and the electrode portion.

A variable passive element using a micro electro mechanical system (MEMS) according to the present invention includes an electrode part which is disposed on an insulating substrate so as to be opposed to each other, and is moved so that the mutual gap is changed, and a plurality of comb electrodes are formed. It includes a flow lead portion formed between the electrostatic drive portion and the electrostatic drive portion, the parallel flow conductor is moved repeatedly so that the separation distance is changed.

The electrostatic drive unit,

It is preferable to include a first electrode portion and a second electrode portion opposed to each other with a mutually spaced on the insulating substrate, the elastic member is formed in at least one place.

Flow lead part,

It is preferable to include a connecting line for electrically connecting the first and second flow lines and the first flow line and the second flow line in parallel and adjacent to each other.

When the driving voltage is applied between the electrostatic driving unit,

The first electrode portion and the second electrode portion are moved in the horizontal direction by the electrostatic force between the first electrode portion and the second electrode portion, so that the mutual spacing between the first electrode portion and the second electrode portion is changed, and the mutual spacing is changed. As a result, the capacitance between the comb electrodes is changed,

As the first flow line and the second flow line are bent in different normal directions with respect to the first flow line and the second flow line due to the horizontal stress caused by the positional movement of the first electrode portion and the second electrode portion, It is desirable to change.

A variable transformer using a micro electro mechanical system (MEMS) according to the present invention is formed on an insulating substrate and has a flow conductor portion and a flow diagram in which parallel flow conductors repeatedly moved to change their separation distance are repeatedly formed. It is preferred to include a high precision wire section having a high precision wire in the form of a solenoid disposed between parallel flow leads of the line.

Flow lead part,

It includes a connection line for electrically connecting between the parallel and adjacent to the first flow line and the second flow line and the first flow line and the second flow line, it is preferable that the drive current is applied to both ends of the flow line.

The flow lead portion generates heat by an applied driving current,

During heating, the separation distance may be changed as the first flow line and the second flow line are bent in different normal directions with respect to the first flow line and the second flow line.

Preferably, the first flow line and the second flow line include bimetals having different coefficients of thermal expansion.

Further comprising magnetic field generating portions formed on both sides of the flow conductor portion to generate a magnetic field orthogonal to the direction of the drive current flowing through the first flow conductor and the second flow conductor, when the magnetic field is generated, the first flow conductor and the second flow conductor It is preferable that the separation distance changes as the first flow line and the second flow line are bent in different normal directions.

It is preferable that the coupling coefficient between the flow lead portion and the high precision lead portion is changed according to the change of the separation distance of the flow lead portion.

Stress measuring apparatus using a micro electromechanical system (MEMS) according to the present invention is surrounded by a stress substrate, a stress substrate to which stress is applied, and a flow in which a flow conductor is positioned to be shifted so as to change an interval by stress. It includes a stress sensor unit for detecting the stress applied to the stress substrate in accordance with the change in the gap between the lead portion and the flow lead portion.

The flow lead portion is preferably formed in the form of a solenoid (Solenoid).

The stress sensor unit preferably detects a stress applied to the stress substrate by using an inductance value that varies according to a change in the distance between flow lines.

The variable inductor using the microelectromechanical system according to the present invention can increase the rate of change of inductance by allowing the adjacent flow conductors to be freely deformed between the planar meander and the three-dimensional solenoid type.

Hereinafter, a variable inductor using a micro electro mechanical system (MEMS) according to a first embodiment of the present invention will be described with reference to the accompanying drawings.

1 to 6 illustrate a variable inductor using a microelectromechanical system according to a first embodiment of the present invention.

Referring to FIG. 1, a variable inductor using a microelectromechanical system is formed on an insulating substrate 100 and an insulating substrate 100, and has a flow conductor part repeatedly formed with parallel flow conductors that are moved to change a separation distance. 110.

The insulating substrate 100 may be formed of a glass substrate, a ceramic substrate, a silicon substrate, or the like so as to have an insulating property and be formed flat with high precision. The support 130 may be formed on the insulating substrate 100 so that the flow conductor 110 may be spaced apart from the insulating substrate 100. In addition, an insulating layer 140 may be formed on the support 130. Here, when the support 130 itself has insulation, the insulation layer 140 may be omitted. Both ends of the flow conductor 110 spaced apart from the insulating substrate 100 are fixed on the support 130. A driving current may be applied from the current source 150 to both ends of the flow conductor 110 fixed on the support 130.

The flow lead portion 110 includes a first flow lead 113 and a second flow lead 115 that are parallel and adjacent to each other. The first flow lead 113 and the second flow lead 115 are physically and electrically connected by the connection lead 117. The flow lead part 110 has a meander shape in which the first flow lead 113 and the second flow lead 115 connected by the connection lead 117 are repeatedly formed. One side of the connection wire 117 of the flow conductor 110 may be fixed by the support 130, and the other side may have a separate support 133 formed on the insulating substrate 100, as shown in FIG. 2. It can be fixed by. The separate support 133 may be bent according to the movement of the flow conductor 110. In addition, as shown in Figure 3, the other side of the connecting lead 117 may be formed with a support 119 that can be fixed or connected to the other side of the connecting lead 117. Here, the support 119 may be made of an insulator. In addition, the support 119 fixes the other side of the connection lead 117 to one to prevent the flow lead 110 from being deformed into an unset form.

The flow conductor 110 may generate heat by a driving current supplied from the current source 150. On the other hand, the flow conductor 110 may be further formed with a heat generating portion for generating heat through the supplied driving current. Here, the heat generating unit generates heat using the driving current, and conducts the generated heat to the first flow lead 113 and the second flow lead 115. Bimetals having different thermal expansion coefficients may be formed in the first flow line 113 and the second flow line 115, respectively. Accordingly, the first flow conductor 113 and the second flow conductor 115 may be bent in different directions when heat is generated by the driving current. That is, the first flow line 113 and the second flow line 115 that are parallel and adjacent to each other are different normals to the first flow line 113 and the second flow line 115, as shown in FIG. 4. Will be bent in the direction. In addition, the distance between the first flow line 113 and the second flow line 115 is changed as it is bent in different normal directions. Accordingly, the flow conductor 110 having a meander shape is transformed into a solenoid while each of the first flow conductors 113 and the second flow conductors 115 are moved in opposite directions. Here, unlike the meander inductor, the solenoid inductor is characterized by a large inductance value as the magnetic flux is concentrated in the center. Therefore, the flow conductor 110 is freely deformed between the meander shape and the solenoid shape having a large difference in inductance, thereby increasing the rate of change of inductance.

On the other hand, when the flow conductor 110 is deformed in the form of a solenoid, the first flow conductor 113 and the second flow conductor 115 is preferably formed to have a sufficient length so as to have a sufficiently large center cross-sectional area. Accordingly, more magnetic flux may be focused on the center of the flow conductor 110 that is deformed from the meander shape to the solenoid shape.

Referring to FIG. 5, magnetic field generating units 160 generating magnetic fields orthogonal to the direction of driving current flowing in the first flow conductor 113 and the second flow conductor 115 are provided at both sides of the flow conductor 110. Can be formed. Here, the magnetic field generating unit 160 is preferably a permanent magnet. In addition, the magnetic field generating unit 160 may be formed of an electromagnet that generates a magnetic field by an external current. In this case, the magnetic field generating unit 160 may be formed on both sides of the flow conductor unit 110 so that the direction of the magnetic field generated is perpendicular to the direction of the driving current flowing through each flow conductor. When a current is applied to the flow lead portion 110, the first flow lead 113 and the second flow lead 115 may flow in opposite directions. At this time, the magnetic field generating unit 160 generates a magnetic field in a direction perpendicular to the direction of the driving current flowing through the first flow conductor 113 and the second flow conductor 115. For example, the magnetic field may be formed in a direction from the N-pole magnetic field generator in FIG. 5 toward the magnetic field generator of the S pole. Accordingly, the first flow lead 113 and the second flow lead 115 through which current flows in the opposite directions receive the forces in the opposite directions. Therefore, the first flow lead 113 and the second flow lead 115 are each bent in the direction in which the force is applied. 6 is a cross-sectional view of the flow conductor 110 according to AA ′ of FIG. 5. 6A and 6B, the first flow line 113 and the second flow line 115 exert a force in opposite directions according to the current directions 173 and 175 and the magnetic field direction 180, respectively. I can see that I will receive. That is, the first flow line 113 and the second flow line 115 adjacent to each other are bent in different normal directions with respect to the first flow line 113 and the second flow line 115. Accordingly, the flow conductor 110 having a meander shape is transformed into a solenoid while each of the first flow conductors 113 and the second flow conductors 115 are moved in opposite directions.

Therefore, the flow conductor 110 is free from the meander shape having a relatively small inductance value and the magnetic flux is concentrated in the center core than the meander shape so that the structure is freely changed between inductance, inductance, Can increase the rate of change.

Hereinafter, a variable inductor using a micro electro mechanical system (MEMS) according to a second embodiment of the present invention will be described with reference to the accompanying drawings.

7 and 9 illustrate a variable inductor using a microelectromechanical system according to a second preferred embodiment of the present invention.

FIG. 8 is a cross-sectional view of the variable inductor according to BB ′ of FIG. 7.

7 and 9, the variable inductor using the microelectromechanical system according to the present invention is formed on the insulating substrate 200, the insulating substrate 200, the flow conductor is moved so that the internal interval is changed solenoid It includes a flow conductor 210 formed in the shape and the electrode portion 220 formed adjacent to the flow conductor 210.

The insulating substrate 200 may be formed of a glass substrate, a ceramic substrate, a silicon substrate, or the like so as to have an insulating property and be formed flat with high precision. In addition, an insulating layer 203 may be formed on the insulating substrate 200 to electrically insulate the insulating substrate 200 and the flow conductor 210.

First, referring to FIG. 7, the electrode part 220 may be formed adjacent to an outer side of the flow conductor part 210. More specifically, the electrode unit 220 may be formed on the surface of the insulating substrate 200 adjacent to the flow conductor 210 in a form corresponding to each flow conductor of the flow conductor 210.

When a driving voltage is applied between the flow conductor 210 and the electrode 220, the flow conductor 210 is formed by the electrostatic force generated between the flow conductor 210 and the electrode 220. The position moves in the direction of the electrode part 220 shown in a and 8-b. Accordingly, as the separation distance or the center cross-sectional area of each of the flow conductors 210 transformed from the meander shape to the solenoid form changes, the inductance value of the flow conductor 210 may be greatly changed.

Referring to FIG. 9, the electrode unit 223 may be formed along the central axis of the flow conductor 210 formed in the form of a solenoid. When a driving voltage is applied between the flow lead portion 210 and the electrode portion 223, the flow lead portion 210 is formed by the electrostatic force generated between the flow lead portion 210 and the electrode portion 223. 223) is moved in the direction. Accordingly, the internal spacing of the flow conductor 210 formed in the solenoid shape is changed. In addition, as the internal spacing of the flow lead portion 210 is changed, the center cross-sectional area of the flow lead portion 210 is changed, thereby changing the inductance value.

Hereinafter, a variable passive device using a micro electro mechanical system (MEMS) according to a third embodiment of the present invention will be described with reference to the accompanying drawings.

10 is a view showing a variable passive device using a microelectromechanical system according to a third embodiment of the present invention.

Referring to FIG. 10, the variable passive elements using the microelectromechanical system according to the present invention are disposed on the insulating substrate 300, are mutually disposed, and are moved to change their mutual spacing, and a plurality of comb electrodes 323 and 327 are formed. Between the electrostatic driving unit 320 and the electrostatic driving unit 320, including the electrode unit 321, 325, and the parallel flow conductors (313, 315) are repeatedly formed to move the position so that the separation distance is changed, Include.

The insulating substrate 300 may be formed of a glass substrate, a ceramic substrate, a silicon substrate, or the like so as to have an insulating property and be formed flat with high precision.

The electrostatic driving part 320 is formed on the insulating substrate 300. In addition, the first fixing anchor 330 and the second fixing anchor 340 for fixing the electrostatic driving part 320 may be formed to face each other on the insulating substrate 300. The electrostatic driving part 320 includes a first electrode part 321 and a second electrode part 325 formed on the insulating substrate 300 so as to face each other with a gap therebetween. An elastic member 328 formed of a spring or the like is formed at any one of the first electrode part 321 and the second electrode part 325. That is, an elastic member 328 connected to the first fixing anchor 330 or the second fixing anchor 340 may be formed in any one of the first electrode part 321 and the second electrode part 325. .

The flow lead part 310 is formed between the first electrode part 321 and the second electrode part 325. An insulating layer 350 may be formed on the first electrode part 321 and the second electrode part 325, respectively. Accordingly, the flow lead part 310 is formed on the insulating layer 350 to be electrically insulated from the first electrode part 321 and the second electrode part 325. The flow lead portion 310 includes a first flow lead 313 and a second flow lead 315 parallel and adjacent to each other. In addition, it includes a connection line 317 for electrically and physically connecting between the first flow line 313 and the second flow line 315. That is, the flow lead part 310 has a meander shape in which the first flow lead 313, the second flow lead 315, and the connection lead 317 are repeatedly formed. Here, the connection wire 317 is fixed to the first electrode portion 321 and the second electrode portion 325, respectively, so that the meander-shaped flow lead portion 310 is the first electrode portion 321 and the second electrode It can be fixed between the portions (325).

The driving voltage by the voltage source 360 may be applied to the electrostatic driver 320. Accordingly, electrostatic force is generated between the comb electrodes 323 and 327 formed in the first electrode portion 321 and the second electrode portion 325. The first electrode part 321 or the second electrode part 325 may be moved in a horizontal direction with respect to the insulating substrate 300 by the electrostatic force generated by the comb electrodes 323 and 327. When the electrode parts formed on the electrostatic driving part 320 are horizontally moved, the plurality of comb electrodes 323 and 327 are moved to engage with each other. Accordingly, the capacitance between the comb electrodes 323 and 327 formed in the first electrode part 321 and the second electrode part 325 is changed. Here, as the area where the comb electrodes overlap, the capacitance increases. The position movement of the electrostatic driving part 320 is moved in the direction of the electrode part in which the electrode part in which the elastic member 328 is formed among the first electrode part 321 and the second electrode part 325 is fixed. Accordingly, the mutual spacing between the first electrode portion 321 and the second electrode portion 325 is changed. In addition, the first flow lead 313 and the second flow lead 315 are subjected to a horizontal stress in accordance with the positional movement of the first electrode 321 or the second electrode 325. Accordingly, the first flow lead 313 and the second flow lead 315 are bent in different normal directions with respect to the first flow lead 313 and the second flow lead 315 by horizontal stress, respectively. Therefore, the distance between the first flow line 313 and the second flow line 315 is changed as it is bent in different normal directions. Accordingly, the first flow lead 313 and the second flow lead 315 may be deformed in the form of solenoids as they bend in different normal directions.

As a result, not only the capacitance is changed by the driving of the electrostatic driver 320, but also the variable conductor device in which the inductance value is simultaneously changed by the flow conductor 310 can be functioned. Here, the inductor structure 310 is freely changed between the meander shape having a relatively small inductance value and the magnetic flux is concentrated in the center core than the meander shape so that the inductor structure is freely changed, The rate of change of inductance can be greatly increased.

Hereinafter, with reference to the accompanying drawings will be described a variable transformer using a Micro Electro Mechanical System (MEMS) according to a fourth embodiment of the present invention.

11 and 12 illustrate a variable transformer using a microelectromechanical system according to a fourth preferred embodiment of the present invention.

FIG. 13 is a cross-sectional view of a variable transformer taken along line CC ′ in FIGS. 11 and 12.

Referring to FIG. 11, a variable transformer using a microelectromechanical system according to the present invention is formed on an insulating substrate 400, and has a flow conductor 410 repeatedly formed with parallel flow conductors which are moved to change their separation distances. And a high-conductivity wire part 420 having a high-precision wire in the form of a solenoid disposed between the parallel flow wires of the flow wire part 410.

The insulating substrate 400 may be formed of a glass substrate, a ceramic substrate, a silicon substrate, or the like so that the insulating substrate 400 can be formed flat with high insulation. The support part 430 may be formed on the insulating substrate 400 so that the flow conductor part 410 may be spaced apart from the insulating substrate 400. In addition, an insulating layer 433 may be further formed on the support part 430. Here, when the support part 430 itself has insulation, the insulation layer 433 may be omitted. Therefore, when the support 430 itself has insulation, both ends of the flow conductor 410 spaced apart from the insulating substrate 400 may be directly fixed on the support 430. A driving current may be applied from the current source 440 to both ends of the flow conductor 410 fixed on the support 430.

The flow lead portion 410 includes a first flow lead 413 and a second flow lead 415 parallel and adjacent to each other. The first flow line 413 and the second flow line 415 may be physically and electrically connected by the connection line 417. Accordingly, the flow lead portion 410 has a meander shape in which the first flow lead 413 and the second flow lead 415 connected by the connection lead 417 are repeatedly formed.

The high-conductivity wire part 420 has a high-conductivity wire in the form of a solenoid and is formed on the insulating substrate 400. Each of the fixed wires of the high conductive wire part 420 may be disposed between the first flow conductive wire 413 and the second flow conductive wire 415 of the flow conductive wire part 410, respectively. In addition, since the first and second flow lines 413 and the second flow line 415 are spaced at predetermined intervals by the connecting line 417, the fixed wires may have the first and flow lines 413 and the second flow. It may be disposed between the conductive lines 415.

Hereinafter, as described above, a method of driving the flow conductor 410 for deforming the structure of the flow conductor 410 between the meander shape and the solenoid shape will be described.

First, with reference to FIG. 11, the driving method of the flow lead part 410 using a thermal drive method is demonstrated.

First, a driving current is applied to both ends of the flow conductor 410. Here, the first flow line 413 and the second flow line 415 may include bimetal having different thermal expansion coefficients. Accordingly, the flow conductor 410 generates heat by the driving current applied thereto. Meanwhile, the heating part may be further formed on the first flow line 413 and the second flow line 415 of the flow line part 410. Here, the heat generating unit may generate heat by using a driving current, and may conduct the generated heat to the first flow lead 413 and the second flow lead 415. Therefore, the flow conductor 410 may be heated by the heat generating unit. As the flow lead portion 410 is heated, the first flow lead 413 and the second flow lead 415 are bent in different normal directions with respect to the first flow lead 413 and the second flow lead 415. You lose. Accordingly, the flow lead 410 may be deformed into a solenoid shape in which a separation distance between the first flow lead 413 and the second flow lead 415 is changed. That is, as shown in FIGS. 13A and 13B, the central cross-sectional area of the flow conductor 410 corresponding to the central cross-sectional area of the high-conductor portion 450 is changed. Accordingly, the coupling coefficient between the flow conductor 410 and the high conductor 420 is changed, so that the variable transformer can be driven.

Secondly, with reference to FIG. 12, the driving method of the flow conductor 410 using a magnetic field will be described.

First, the magnetic field generator 450 may be formed at both sides of the flow conductor 410 such that a magnetic field orthogonal to the direction of the driving current flowing in the first flow conductor 413 and the second flow conductor 415 is generated. . Here, the magnetic field generating unit 450 is preferably a permanent magnet. In addition, the magnetic field generating unit 450 may be formed of an electromagnet that generates a magnetic field by an external current. The magnetic field generating unit 450 may be formed on both sides of the flow conductor 410 so that the direction of the magnetic field generated is perpendicular to the direction of the driving current flowing through each flow conductor.

 When a current is applied from the current source 440 to the flow lead portion 410, current flows in the opposite directions to the first flow lead 413 and the second flow lead 415. Here, the magnetic field generating unit 450 generates a magnetic field orthogonal to the first flow lead 413 and the second flow lead 415. Accordingly, the first flow lead 413 and the second flow lead 415 having different current directions receive a force in different directions. Accordingly, the first flow line 413 and the second flow line 415 are each bent in the direction of the corresponding force. FIG. 13 is a cross-sectional view of a variable transformer according to CC ′ shown in FIG. 12. 13A shows a state before the flow conductor 410 is driven by the magnetic field generator 450. Thereafter, as described above, a magnetic field orthogonal to the first flow lead 413 and the second flow lead 415 is generated by the magnetic field generator 450. The first flow line 413 and the second flow line 415 are forced in opposite directions by the generated magnetic field, and thus may be deformed in the form of a solenoid as it is bent in the direction of the force. That is, as the first flow line 413 and the second flow line 415 are bent in different normal directions with respect to the first flow line 413 and the second flow line 415, respectively, in the meander shape, the solenoid shape is formed. Will be transformed into Therefore, the center cross-sectional area of the flow conductor 410 deformed in the form of a solenoid is changed, so that the coupling coefficient between the flow conductor 410 and the high-conductor portion 420 may be changed.

Hereinafter, a stress measuring apparatus using a microelectromechanical system according to a fifth embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 14 is a diagram illustrating a stress measuring apparatus using a micro electro mechanical system (MEMS) according to a fifth embodiment of the present invention.

FIG. 15 is a cross-sectional view of the stress measuring device according to D ′ ′ ′ in FIG. 14.

FIG. 16 is a cross-sectional view of the stress measuring device according to E ′ ′ ′ in FIG. 14.

Referring to FIG. 14, a stress measuring apparatus using a microelectromechanical system is surrounded by a stress substrate 500 and a stress substrate 500 to which stress is applied, and a flow conductor which is moved in position to change an internal interval by stress is formed. It includes a stress sensor unit 520 for detecting the stress applied to the stress substrate 500 in accordance with the change in the inner space of the flow conductor 510 and the flow conductor 510.

The stress substrate 500 may be made of a polymer substrate whose shape is changed by compressive or tensile stress applied from the outside. The stress substrate 500 is three-dimensionally formed to surround the flow conductor 510. For example, the stress substrate 500 may be formed in the form of a cube or a cylinder. Accordingly, the stress substrate 500 may receive a compressive stress or a tensile stress applied from the outside in various directions.

The flow conductor 510 is formed in the form of a solenoid. More specifically, the flow lead portion 510 may have a solenoid form repeatedly formed by connecting adjacent flow leads of semicircular shapes curved in opposite directions to each other by the connection lead 517.

As shown in Fig. 15 or 16, when compressive stress 535 or tensile stress 530 is applied to each surface of the stress substrate 500, the flow chart formed inside the stress substrate 500 by the applied stress The separation distance between the conductive lines formed by the line part 510 is changed. Accordingly, the inductance value of the flow conductor 510 is changed as the flow conductor 510 is deformed from the solenoid to the flat meander shape. Therefore, the stress sensor unit 520 can detect the compressive stress 535 or the tensile stress 530 applied to the stress substrate 500 by using the inductance value of the changed flow conductor.

Therefore, the variable inductor using the microelectromechanical system according to the present invention can increase the rate of change of inductance by allowing the adjacent flow conductors to be freely deformed between the planar meander and the three-dimensional solenoid type.

In addition, the variable transformer and the stress measuring apparatus using the microelectromechanical system according to the present invention can improve the performance as a variable transformer and a stress sensor by using a variable inductor.

As described above, those skilled in the art to which the present invention pertains will understand that the present invention may be implemented in other specific forms without changing the technical spirit or essential features. Therefore, the embodiments described above are to be understood in all respects as illustrative and not restrictive, and the scope of the present invention is indicated by the following claims rather than the above description, and the meaning and scope of the claims And all changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

1 to 6 illustrate a variable inductor according to a first embodiment of the present invention.

7 and 9 illustrate a variable inductor according to a second embodiment of the present invention.

10 is a view showing a variable passive device according to a third embodiment of the present invention.

11 to 13 illustrate a variable transformer according to a fourth embodiment of the present invention.

14 and 16 show a stress measuring apparatus according to a fifth embodiment of the present invention.

******** Explanation of symbols for the main parts of the drawing ********

100,200,300,400: Insulation Board

110,210,310,510: fluid conductor

113,313,413: first flow line

115,315,415: second flow line

117,317,417: connecting leads

150,440: current source

230,360: voltage source

160: magnetic field generating unit

220,223: electrode portion

320: electrostatic drive unit

500: stress substrate

510: stress sensor

Claims (22)

Insulating substrate; And A meander-shaped flow conductor formed on the insulating substrate and repeatedly formed with parallel flow conductors that move in a position such that the separation distance is changed; The flow lead portion, First and second flow lines parallel and repetitively disposed; And And a connection line connecting the first flow line and the second flow line, The first flow line and the second flow line each includes a bimetal, The bimetal is, When the heat is generated by the driving current, the first flow line and the second flow line is configured to bend in different normal directions with respect to the first flow line and the second flow line, The flow lead portion, A variable inductor using a microelectromechanical system that is deformed from a meander form to a solenoid form as the first flow line and the second flow line are bent in different normal directions. delete delete delete The method of claim 1, And a magnetic field generating part formed on both sides of the flow conductor part so as to generate a magnetic field orthogonal to the direction of the driving current flowing in the first flow conductor and the second flow conductor, When the driving current is applied, the first flow lead and the second flow lead are separated by the generated magnetic field in the direction different from each other in the normal direction with respect to the first flow lead and the second flow lead. Variable inductor using a microelectromechanical system. delete delete delete delete An electrostatic drive unit disposed on an insulating substrate to face each other, and having a positional movement such that mutual gaps are changed, and including an electrode unit having a plurality of comb electrodes; And It is formed between the electrostatic drive unit, and includes a flow guide portion of the shape of the shape of the mander repetitively formed in parallel to move the position so that the separation distance is changed, The flow lead portion, First and second flow lines parallel and repetitively disposed; And And a connection line connecting the first flow line and the second flow line, When a driving voltage is applied between the electrostatic driving unit, The first electrode portion and the second electrode portion, Horizontal movement in a direction closer to each other by the electrostatic force generated between the comb electrodes, the mutual distance is changed in accordance with the horizontal movement to change the capacitance between the comb electrodes, The first flow line and the second flow line, Receives a horizontal stress caused by the horizontal movement of the first electrode portion and the second electrode portion is bent in a different normal direction with respect to the first flow line and the second flow line, The flow lead portion, A variable passive element using a microelectromechanical system that deforms from a meander form to a solenoid form as the first flow line and the second flow line are bent in different normal directions. The method of claim 10, The electrostatic drive unit, And a first electrode portion and a second electrode portion opposed to each other with the mutual gap therebetween on the insulating substrate, and having at least one elastic member formed thereon. delete delete A meander-shaped flow conductor formed on the insulating substrate and repeatedly formed with parallel flow conductors that move in a position such that the separation distance is changed; And It includes a high-conductivity wire portion having a high precision wire of the solenoid type disposed between the parallel flow wires of the flow lead portion, The flow lead portion, First and second flow lines parallel and repetitively disposed; And And a connection line connecting the first flow line and the second flow line, The first flow line and the second flow line each includes a bimetal, The bimetal is, When the heat is generated by the driving current, the first flow line and the second flow line is configured to bend in different normal directions with respect to the first flow line and the second flow line, The flow lead portion, A variable transformer using a microelectromechanical system that deforms from a meander form to a solenoid form as the first flow line and the second flow line are bent in different normal directions. delete delete delete The method of claim 14, And a magnetic field generating part formed on both sides of the flow conductor part so as to generate a magnetic field orthogonal to the direction of the driving current flowing through the first flow conductor and the second flow conductor. When the magnetic field is generated, the separation distance is changed as the first flow line and the second flow line bend in different normal directions with respect to the first flow line and the second flow line. Used variable transformer. The method of claim 18, And a coupling coefficient between the flow conductor part and the high conducting wire part is changed according to a change in the separation distance of the flow conductor part. delete delete delete

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