KR100969349B1 - Automatic optical inspection apparatus - Google Patents

Automatic optical inspection apparatus Download PDF

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KR100969349B1
KR100969349B1 KR1020080042561A KR20080042561A KR100969349B1 KR 100969349 B1 KR100969349 B1 KR 100969349B1 KR 1020080042561 A KR1020080042561 A KR 1020080042561A KR 20080042561 A KR20080042561 A KR 20080042561A KR 100969349 B1 KR100969349 B1 KR 100969349B1
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inspection object
image
beam splitter
filter
dimensional
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KR20090116552A (en
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전문영
김홍민
허정
윤상규
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주식회사 고영테크놀러지
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/254—Projection of a pattern, viewing through a pattern, e.g. moiré
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/60—Systems using moiré fringes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G01N2021/8893—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques providing a video image and a processed signal for helping visual decision

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

본 발명은 검사대상물을 다수의 방향에서 2차원과 3차원으로 촬영하여 검사하는 AOI 장치에 관한 것으로, 본 발명의 AOI 장치는 검사대상물(P)을 X축이나 Y축방향으로 이동시키는 X-Y 스테이지(10)와, X-Y 스테이지(10)의 상측에 설치되는 빔스플릿터(20)와, X-Y 스테이지(10)와 빔스플릿터(20) 사이에서 X-Y 스테이지(10)의 모서리방향에 위치되도록 각각 설치되어 다수의 방향으로 2차원조명을 검사대상물(P)로 조사하는 다수개의 제1조명부(30)와, 빔스플릿터(20)의 일측에 설치되어 빔스플릿터(20)를 통해 검사대상물(P)로 격자조명을 조사하는 제2조명부(40)와, 빔스플릿터(20)의 상측에 설치되어 빔스플릿터(20)를 투과하는 2차원조명에 의해 검사대상물(P)에서 반사되는 2차원이미지를 촬영하는 제1결상부(50)와, 다수개의 제1조명부(30) 사이에 위치되도록 각각 설치되어 격자조명에 의해 검사대상물(P)에서 반사되는 격자이미지를 촬영하는 다수개의 제2결상부(60)로 구성됨을 특징으로 한다.The present invention relates to an AOI apparatus for inspecting an object to be inspected by taking two-dimensional and three-dimensional images in a plurality of directions. 10) and the beam splitter 20 provided above the XY stage 10 and between the XY stage 10 and the beam splitter 20 so as to be located in the corner direction of the XY stage 10, respectively. The plurality of first lighting units 30 for irradiating two-dimensional lighting to the inspection object P in a plurality of directions, and the inspection object P is installed on one side of the beam splitter 20 through the beam splitter 20. 2D image is reflected from the inspection object (P) by the second lighting unit 40 for irradiating the lattice illumination and the two-dimensional illumination installed above the beam splitter 20 and transmitted through the beam splitter 20 Each of the first imaging unit 50 and the plurality of first lighting unit 30 to shoot the installed so as to be installed Characterized in that it consists of a plurality of second imaging unit 60 for taking a grid image reflected from the inspection object (P) by the grid light.

자동광학검사, AOI, 결상, 조명, 카메라, 격자 Auto Optics, AOI, Imaging, Lighting, Camera, Grid

Description

에이오아이（ＡＯＩ） 장치{Automatic optical inspection apparatus}AIO device {Automatic optical inspection apparatus}

본 발명은 AOI 장치에 관한 것으로, 더욱 상세하게는 검사대상물을 다수의 방향에서 2차원과 3차원으로 촬영하여 검사하는 AOI 장치에 관한 것이다.The present invention relates to an AOI device, and more particularly, to an AOI device for inspecting an object to be examined in two and three dimensions in a plurality of directions.

자동광학검사(Automatic optical inspection: 이하 'AOI'로 칭함)장치는 반도체 패키지의 솔더 볼(solder ball), 인쇄회로기판이나 평판디스플레이 등의 다양한 검사대상물을 검사하는 데 적용된다. 이러한 AOI 장치는 각 검사대상물에서 검사대상물의 깨짐, 치수, 홀(hole)이나 비아(via) 치수, 도체 간격(pitch), 라인 폭 및 길이, 아트워크(artwork), 페이스트(paste), 소자 위치, 납땜 불량 및 특이점 등을 검사하게 된다. 이러한 다양한 항목을 검사하는 종래의 AOI 장치는 검사대상물을 여러 방향에서 촬영하기 위해 조명부나 결상부가 회전하여 촬영하여 검사하게 된다. Automatic optical inspection (hereinafter referred to as "AOI") devices are applied to inspect various inspection objects such as solder balls of semiconductor packages, printed circuit boards or flat panel displays. These AOI devices can be used to determine the cracks, dimensions, hole or via dimensions, conductor pitch, line width and length, artwork, paste, and device location of the specimen in each specimen. Check for defects in soldering and singularities. In the conventional AOI device for inspecting such various items, the lighting unit or the imaging unit rotates to photograph and inspect the inspection object in various directions.

이와 같이 종래의 AOI 장치는 검사대상물의 검사 시 조명부나 결상부가 회전동작하여 검사대상물을 촬영함으로써 검사작업의 효율성이 저하되는 문제점이 있 다. As described above, the conventional AOI device has a problem in that the efficiency of the inspection operation is reduced by photographing the inspection object by rotating the lighting unit or the imaging unit during the inspection of the inspection object.

본 발명의 목적은 전술한 문제점을 해결하기 위해 안출한 것으로, 검사대상물을 다수의 방향에서 2차원과 3차원으로 촬영하여 검사함으로써 검사대상물을 정밀하게 검사함과 아울러 검사작업의 생산성을 개선시키기 위한 AOI 장치를 제공함에 있다.An object of the present invention is to solve the above-mentioned problems, by inspecting the inspection object by taking a two-dimensional and three-dimensional inspection object in a plurality of directions for precisely inspecting the inspection object and to improve the productivity of the inspection work In providing an AOI device.

본 발명의 AOI 장치는 검사대상물을 X축이나 Y축방향으로 이동시키는 X-Y 스테이지와, X-Y 스테이지의 상측에 설치되는 빔스플릿터(beam splitter)와, X-Y 스테이지와 빔스플릿터 사이에서 X-Y 스테이지의 모서리방향에 위치되도록 각각 설치되어 다수의 방향으로 2차원조명을 검사대상물로 조사하는 다수개의 제1조명부와, 빔스플릿터의 일측에 설치되어 빔스플릿터를 통해 검사대상물로 격자조명을 조사하는 제2조명부와, 빔스플릿터의 상측에 설치되어 빔스플릿터를 투과하는 2차원조명에 의해 검사대상물에서 반사되는 2차원이미지를 촬영하는 제1결상부와, 다수개의 제1조명부 사이에 위치되도록 각각 설치되어 격자조명에 의해 검사대상물에서 반사되는 격자이미지를 촬영하는 다수개의 제2결상부로 구성됨을 특징으로 한다.The AOI device of the present invention includes an XY stage for moving an inspection object in the X-axis or Y-axis direction, a beam splitter provided above the XY stage, and an edge of the XY stage between the XY stage and the beam splitter. A plurality of first lighting units respectively installed to be positioned in the direction to irradiate the two-dimensional light to the inspection object in a plurality of directions, and second to be installed on one side of the beam splitter to irradiate the grid light to the inspection object through the beam splitter. Installed so as to be positioned between the illumination unit, the first imaging unit which is installed above the beam splitter and photographs the 2D image reflected from the inspection object by the 2D illumination passing through the beam splitter, and the plurality of first lighting units. And a plurality of second imaging units for photographing the grid image reflected from the inspection object by the grid illumination.

본 발명의 AOI 장치는 검사대상물을 다수의 방향에서 2차원과 3차원으로 촬영하여 검사함으로써 정밀하게 검사함과 아울러 검사작업의 생산성을 개선시킬 수 있는 이점을 제공한다.The AOI device of the present invention provides an advantage that the inspection object can be precisely inspected and the productivity of the inspection work can be improved by photographing and inspecting the inspection object in two and three dimensions in a plurality of directions.

본 발명의 AOI 장치의 실시예를 첨부된 도면을 참조하여 설명하면 다음과 같다.An embodiment of the AOI device of the present invention will be described below with reference to the accompanying drawings.

도 1은 본 발명의 AOI 장치의 사시도이고, 도 2는 도 1에 도시된 AOI 장치의 측면 구성도이며, 도 3은 도 2에 도시된 AOI 장치의 평면 구성도이다. 1 is a perspective view of the AOI device of the present invention, Figure 2 is a side configuration diagram of the AOI device shown in Figure 1, Figure 3 is a plan view of the AOI device shown in FIG.

도 1 내지 도 3에 도시된 바와 같이 본 발명의 AOI 장치는 X-Y 스테이지(10), 빔스플릿터(20), 다수개의 제1조명부(30), 제2조명부(40), 제1결상부(50) 및 다수개의 제2결상부(60)로 구성되며, 각 구성을 설명하면 다음과 같다.1 to 3, the AOI apparatus of the present invention includes an XY stage 10, a beam splitter 20, a plurality of first lighting units 30, a second lighting unit 40, and a first imaging unit ( 50) and a plurality of second imaging units 60, each of which will be described below.

X-Y 스테이지(10)는 수평 및 수직이송기구(도시 않음)에 의해 이동되도록 구성되어, 검사대상물(P)을 X축이나 Y축방향으로 이동시켜 검사위치로 로딩(loading)한다. 빔스플릿터(20)는 X-Y 스테이지(10)의 상측에 설치되어 격자조명을 분리하여 검사대상물(P)로 조사되도록 하며, 2차원이미지를 분리하여 제1결상부(50)로 조사한다. 다수개의 제1조명부(30)는 X-Y 스테이지(10)와 빔스플릿터(20) 사이에서 X-Y 스테이지(10)의 모서리방향에 위치되도록 각각 설치되어 다수의 방향으로 2차원조명을 검사대상물(P)로 조사한다. The X-Y stage 10 is configured to be moved by horizontal and vertical transfer mechanisms (not shown), and moves the inspection object P in the X-axis or Y-axis direction to load the inspection position. The beam splitter 20 is installed on the upper side of the X-Y stage 10 to separate the grid light to be irradiated to the inspection object P, and to separate the two-dimensional image and irradiate it to the first imaging unit 50. The plurality of first lighting units 30 are respectively installed between the XY stage 10 and the beam splitter 20 so as to be positioned at the corners of the XY stage 10 so as to inspect the two-dimensional light in a plurality of directions. Investigate with

제2조명부(40)는 빔스플릿터(20)의 일측에 설치되어 빔스플릿터(20)를 통해 검사대상물(P)로 격자조명을 조사한다. 제1결상부(50)는 빔스플릿터(20)의 상측에 설치되어 빔스플릿터(20)를 투과하는 2차원조명에 의해 검사대상물(P)에서 반사되는 2차원이미지를 촬영한다. 다수개의 제2결상부(60)는 다수개의 제1조명부(30) 사이에 위치되도록 각각 설치되어 격자조명에 의해 검사대상물(P)에서 반사되는 격자이미지를 촬영한다. The second lighting unit 40 is installed at one side of the beam splitter 20 to irradiate the grid light to the inspection object P through the beam splitter 20. The first imaging unit 50 is installed on the upper side of the beam splitter 20 to take a two-dimensional image reflected by the inspection object P by two-dimensional illumination penetrating the beam splitter 20. The plurality of second imaging units 60 are respectively installed to be positioned between the plurality of first lighting units 30 to photograph the grid image reflected from the inspection object P by the grid illumination.

상기 구성 중 다수개의 제1조명부(30), 제2조명부(40), 제1결상부(50) 및 다수개의 제2결상부(60)를 보다 상세히 설명하면 다음과 같다. The plurality of first lighting units 30, the second lighting units 40, the first imaging units 50, and the plurality of second imaging units 60 will be described in more detail as follows.

다수개의 제1조명부(30)는 각각 제1조명원(31) 및 제1반사거울(32)로 구성된다. 제1조명원(31)은 X-Y 스테이지(10)의 모서리 방향에 위치되도록 설치되어 2차원조명을 발생하여 조사하며, 제1반사거울(32)은 제1조명원(31)의 일측에 설치되어 2차원조명을 검사대상물(P)로 굴절시켜 조사한다. A plurality of first lighting unit 30 is composed of a first lighting source 31 and a first reflecting mirror 32, respectively. The first illumination source 31 is installed to be located in the corner direction of the XY stage 10 to generate and irradiate two-dimensional illumination, the first reflection mirror 32 is installed on one side of the first illumination source 31 Two-dimensional illumination is refracted by the inspection object (P) and irradiated.

제2조명부(40)는 제2조명원(41), 격자소자(42), 격자이송기구(43), 투영렌즈(44) 및 조명필터(45)로 구성된다. 제2조명원(41)은 조명을 발생하여 조사하며, 격자소자(42)는 제2조명원(41)의 일측에 설치되어 조명을 격자조명으로 변환시켜 조사한다. 이러한 격자소자(42)는 조명을 격자무늬를 갖는 격자조명으로 변환시켜 조사하기 위해 격자(grating)나 액정소자 중 하나가 적용된다.The second lighting unit 40 is composed of a second lighting source 41, a grating element 42, a grating transfer mechanism 43, a projection lens 44 and an illumination filter 45. The second illumination source 41 generates and irradiates the illumination, and the grid element 42 is installed on one side of the second illumination source 41 to convert the illumination into grid illumination and irradiate it. The grating element 42 is applied to one of the grating (grating) or liquid crystal element to convert the illumination into a grating light having a grid pattern.

격자이송기구(43)는 격자소자(42)에 연결되어 수직방향으로 피치(pitch) 이송시킨다. 예를 들어, 격자이송기구(43)는 본 발명의 AOI 장치에서 4-버킷 알고리즘을 이용하여 검사대상물(P)의 3차원형상을 측정하는 경우에 격자소자(42)를 수직방향으로 4번 이송시켜 다수개의 제2결상부(60)가 각각 격자이미지를 촬영할 수 있도록 한다. 이와 같이 격자소자(42)를 일정한 피치간격으로 이송시키는 격자이송기구(43)는 볼스크류, 리니어모터, PZT(Piezo electric) 이송기구 중 하나가 적용된다. The grating transfer mechanism 43 is connected to the grating element 42 to transfer the pitch in the vertical direction. For example, the grid transfer mechanism 43 transfers the grid element 42 four times in the vertical direction when measuring the three-dimensional shape of the inspection object P using the 4-bucket algorithm in the AOI device of the present invention. The plurality of second imaging units 60 may photograph grid images, respectively. In this way, the grid feed mechanism 43 for transferring the grid element 42 at a constant pitch interval is applied to one of a ball screw, a linear motor, and a piezo electric (PZT) feed mechanism.

투영렌즈(44)는 격자소자(42)의 일측에 설치되어 격자조명을 빔스플릿터(20)를 통해 검사대상물(P)로 조사하며, 조명필터(45)는 투영렌즈(44)의 일측에 설치되 어 격자조명을 여과시켜 조사한다. 이러한 조명필터(45)는 주파수 필터, 칼라필터, 편광필터 및 광세기 조절필터 중의 하나가 적용된다. The projection lens 44 is installed at one side of the grating element 42 and irradiates the grating illumination to the inspection object P through the beam splitter 20, and the illumination filter 45 is provided at one side of the projection lens 44. The grid lights are installed and filtered. The illumination filter 45 is applied to one of a frequency filter, a color filter, a polarization filter, and a light intensity control filter.

제1결상부(50)는 제1결상렌즈(51) 및 제1카메라(52)로 구성된다. 제1결상렌즈(51)는 빔스플릿터(20)의 상측에 설치되어 2차원이미지를 결상하며, 제1카메라(52)는 제1결상렌즈(51)의 상측에 설치되어 2차원이미지를 촬영한다. The first imaging unit 50 includes a first imaging lens 51 and a first camera 52. The first imaging lens 51 is installed on the image of the beam splitter 20 to form a two-dimensional image, and the first camera 52 is installed on the image of the first imaging lens 51 to photograph the two-dimensional image. do.

다수개의 제2결상부(60)는 각각 제2반사거울(61) 및 3차원촬영부(62)로 구성된다. 제2반사거울(61)은 다수개의 제1조명부(30) 사이에 위치되도록 설치되어 검사대상물(P)에서 반사되는 격자이미지를 굴절시켜 조사하며, 3차원촬영부(62)는 제2반사거울(61)의 일측에 설치되어 격자이미지를 촬영한다. The plurality of second imaging units 60 are each composed of a second reflecting mirror 61 and a three-dimensional imaging unit 62. The second reflecting mirror 61 is installed to be positioned between the plurality of first lighting units 30 to refract the lattice image reflected from the inspection object P, and the 3D photographing unit 62 may reflect the second reflecting mirror. It is installed on one side of 61 to take a grid image.

격자이미지를 촬영하는 3차원촬영부(62)는 이미지필터(62a), 제2결상렌즈(62b) 및 제2카메라(62c)로 구성된다. 이미지필터(62a)는 제2반사거울(61)의 일측에 설치되어 굴절되어 조사되는 격자이미지를 여과시켜 출력하기 위한 것으로, 주파수 필터, 칼라필터, 광세기 조절필터 중 하나가 적용된다. 제2결상렌즈(62b)는 이미지필터(62a)의 일측에 설치되어 여과된 격자이미지를 결상시키며, 제2카메라(62c)는 제2결상렌즈(62b)의 일측에 설치되어 격자이미지를 촬영한다. 이러한 제2카메라(62c)는 CCD 카메라나 CMOS 카메라 중 하나가 적용된다.The three-dimensional image pickup unit 62 for capturing a grid image includes an image filter 62a, a second imaging lens 62b, and a second camera 62c. The image filter 62a is installed at one side of the second reflection mirror 61 to filter and output a grid image that is refracted and irradiated. One of a frequency filter, a color filter, and a light intensity control filter is applied. The second imaging lens 62b is installed at one side of the image filter 62a to form a filtered grid image, and the second camera 62c is installed at one side of the second imaging lens 62b to photograph the grid image. . The second camera 62c is one of a CCD camera and a CMOS camera.

상기 구성을 갖는 본 발명의 AOI 장치의 작용을 설명하면 다음과 같다.Referring to the operation of the AOI device of the present invention having the above configuration is as follows.

먼저, 검사대상물(P)이 X-Y 스테이지(10)에 로딩(loading)되면 X-Y 스테이지(10)는 이를 검사위치로 이송시킨다. 검사대상물(P)이 검사위치로 이송되면 제어장치(도시 않음)는 다수개의 제1조명부(30)를 각각 순차적으로 온/오프(on/off)시 켜 검사대상물(P)로 2차원조명을 조사한다. 검사대상물(P)로 2차원조명이 조사되면 제1결상부(50)는 검사대상물(P)에서 반사되는 2차원이미지를 빔스플릿터(20)를 통해 촬영하여 검사대상물(P)의 특이점을 검사하게 된다. 즉, 다수개의 제1조명부(30)가 도 1 내지 3에서와 같이 4개가 구비되는 경우에 제1결상부(50)는 제1조명부(30)의 회전 동작 없이 4 방향에서 검사대상물(P)로 조사되어 반사되는 2차원이미지를 촬영함으로써 검사작업 속도를 개선시킬 수 있게 되다. First, when the inspection object P is loaded in the X-Y stage 10, the X-Y stage 10 transfers it to the inspection position. When the inspection object P is transferred to the inspection position, the control device (not shown) turns on / off the plurality of first lighting units 30 sequentially, respectively, to provide two-dimensional illumination to the inspection object P. Investigate. When the two-dimensional light is irradiated onto the inspection object P, the first imaging unit 50 photographs the two-dimensional image reflected by the inspection object P through the beam splitter 20 to detect the singularity of the inspection object P. Will be examined. That is, when the plurality of first lighting unit 30 is provided with four as shown in Figures 1 to 3, the first imaging unit 50 is the inspection object (P) in four directions without the rotation operation of the first lighting unit 30 It is possible to improve the inspection work speed by photographing the reflected 2D image.

검사대상물(P)의 2차원 검사가 완료되면 제2조명부(40)는 온되어 빔스플릿터(20)를 통해 검사대상물(P)로 격자조명을 조사한다. 검사대상물(P)로 격자조명이 조사되면 다수개의 제1조명부(30) 사이에 위치되도록 각각 설치된 다수개의 제2결상부(60)는 검사대상물(P)의 3차원형상을 검사할 수 있도록 검사대상물(P)에서 반사되는 격자이미지를 촬영한다. 즉, 도 1 내지 도 3에서와 같이 다수개의 제2결상부(60)가 4개가 구비되는 경우에 다수개의 제2결상부(60)는 4방향에서 검사대상물(P)로 조사되는 격자조명에 의해 반사되는 격자이미지를 각각 촬영하여 검사대상물(P)을 보다 정밀하게 검사할 수 있도록 한다. When the two-dimensional inspection of the inspection object P is completed, the second lighting unit 40 is turned on and irradiates the grid illumination to the inspection object P through the beam splitter 20. When the grid light is irradiated to the inspection object (P), the plurality of second imaging units (60) respectively installed to be positioned between the plurality of first lighting units (30) may inspect the three-dimensional shape of the inspection object (P). The grid image reflected from the object P is photographed. That is, as shown in FIGS. 1 to 3, when the plurality of second imaging units 60 is provided with four, the plurality of second imaging units 60 is applied to the grid light irradiated to the inspection object P in four directions. Each of the grid images reflected by the photographed to be able to inspect the inspection object (P) more precisely.

본 발명의 AOI 장치는 반도체 패키지의 솔더 볼, 인쇄회로기판 및 평판디스플레이 등과 같은 다양한 검사대상물의 불량여부나 치수를 검사하는 분야에 적용할 수 있다. The AOI device of the present invention can be applied to a field for inspecting defects or dimensions of various inspection objects such as solder balls, printed circuit boards, and flat panel displays of semiconductor packages.

도 1은 본 발명의 AOI 장치의 사시도,1 is a perspective view of an AOI device of the present invention,

도 2는 도 1에 도시된 AOI 장치의 측면 구성도,2 is a side configuration diagram of the AOI device shown in FIG. 1;

도 3은 도 2에 도시된 AOI 장치의 평면 구성도.3 is a plan view of the AOI device shown in FIG.

* 도면의 주요 부분에 대한 부호 설명 *Explanation of symbols on the main parts of the drawings

10: X-Y 스테이지 20: 빔스플릿터10: X-Y stage 20: beam splitter

30: 제1조명부 31: 제1조명원 30: Article 1 lighting 31: Article 1 lighting

32: 제1반사거울 40: 제2조명부32: first reflection mirror 40: second lighting unit

41: 제2조명원 42: 격자소자41: second light source 42: grid element

43: 격자이송기구 44: 투영렌즈43: grid transfer mechanism 44: projection lens

45: 조명필터 50: 제1결상부45: light filter 50: the first imaging unit

51: 제1결상렌즈 52: 제1카메라51: first imaging lens 52: first camera

60: 제2결상부 61: 제2반사거울60: second imaging unit 61: second reflection mirror

62: 3차원촬영부62: 3D filming unit

Claims (6)

검사대상물을 X축이나 Y축방향으로 이동시키는 X-Y 스테이지와,An X-Y stage for moving the inspection object in the X-axis or Y-axis direction, 상기 X-Y 스테이지의 상측에 설치되는 빔스플릿터와,A beam splitter installed above the X-Y stage, 상기 X-Y 스테이지와 상기 빔스플릿터 사이에서 X-Y 스테이지의 모서리방향에 위치되도록 각각 설치되어 다수의 방향으로 2차원조명을 검사대상물로 조사하는 다수개의 제1조명부와, A plurality of first lighting units disposed between the X-Y stage and the beam splitter so as to be positioned at the corners of the X-Y stage and irradiating the two-dimensional light to the inspection object in a plurality of directions; 상기 빔스플릿터의 일측에 설치되어 빔스플릿터를 통해 검사대상물로 격자조명을 조사하는 제2조명부와,A second lighting unit installed at one side of the beam splitter and radiating grid light to an inspection object through the beam splitter; 상기 빔스플릿터의 상측에 설치되어 빔스플릿터를 투과하는 2차원조명에 의해 검사대상물에서 반사되는 2차원이미지를 촬영하는 제1결상부와,A first imaging unit installed at an upper side of the beam splitter and photographing a two-dimensional image reflected from an inspection object by two-dimensional illumination passing through the beam splitter; 상기 다수개의 제1조명부 사이에 위치되도록 각각 설치되어 격자조명에 의해 검사대상물에서 반사되는 격자이미지를 촬영하는 다수개의 제2결상부로 구성됨을 특징으로 하는 AOI 장치.AOI device, characterized in that composed of a plurality of second imaging unit which is installed so as to be positioned between the plurality of first lighting unit, respectively photographing the grid image reflected from the inspection object by the grid light. 제1항에 있어서, 상기 다수개의 제1조명부는 각각 X-Y 스테이지의 모서리 방향에 위치되도록 각각 설치되어 2차원조명을 발생하여 조사하는 제1조명원과, According to claim 1, wherein the plurality of first lighting unit is respectively installed so as to be positioned in the corner direction of the X-Y stage, respectively, the first lighting source for generating and irradiating two-dimensional lighting, 상기 제1조명원의 일측에 각각 설치되어 2차원조명을 검사대상물로 굴절시켜 조사하는 제1반사거울로 구성됨을 특징으로 하는 AOI 장치.AOI apparatus, characterized in that the first reflection mirror is installed on each side of the first illumination source is configured to irradiate and irradiate the two-dimensional light to the inspection object. 제1항에 있어서, 상기 제2조명부는 조명을 발생하는 제2조명원과,According to claim 1, wherein the second lighting unit and the second lighting source for generating illumination, 상기 제2조명원의 일측에 설치되어 조명을 격자조명으로 변환시켜 조사하는 격자소자와,A lattice element installed at one side of the second illumination source and converting illumination into a lattice illumination and irradiating the light; 상기 격자소자에 연결되어 수직방향으로 피치 이송시키는 격자이송기구와, A lattice transfer mechanism connected to the lattice element and for pitch transfer in a vertical direction; 상기 격자소자의 일측에 설치되어 격자조명을 빔스플릿터를 통해 검사대상물로 조사하는 투영렌즈와,A projection lens installed at one side of the grating element and radiating grating light to an inspection object through a beam splitter; 상기 투영렌즈의 일측에 설치되어 격자조명을 여과시켜 조사하는 조명필터로 구성되며, It is installed on one side of the projection lens is composed of an illumination filter for filtering and illuminating the grid light, 상기 격자소자는 격자나 액정소자 중 하나가 적용되고, 상기 격자이송기구는 볼스크류, 리니어모터 및 PZT(Piezo electric) 이송기구 중 하나가 적용되며, 상기 조명필터는 주파수 필터, 칼라필터, 편광필터 및 광세기 조절필터 중의 하나가 적용됨을 특징으로 하는 AOI 장치.The lattice element is applied to one of the lattice or liquid crystal element, the lattice transfer mechanism is applied to one of the ball screw, linear motor and PZT (Piezo electric) transfer mechanism, the illumination filter is a frequency filter, color filter, polarization filter And a light intensity control filter is applied. 제1항에 있어서, 상기 제1결상부는 빔스플릿터의 상측에 설치되어 2차원이미지를 결상하는 제1결상렌즈와,The image forming apparatus of claim 1, wherein the first imaging unit is provided at an image side of the beam splitter and forms a two-dimensional image; 상기 제1결상렌즈의 상측에 설치되어 2차원이미지를 촬영하는 제1카메라로 구성됨을 특징으로 하는 AOI 장치.An AOI device, characterized in that configured as a first camera installed on the image side of the first imaging lens to take a two-dimensional image. 제1항에 있어서, 상기 다수개의 제2결상부는 각각 다수개의 제1조명부 사이에 위치되도록 설치되어 검사대상물에서 반사되는 격자이미지를 굴절시켜 조사하는 제2반사거울과,The method of claim 1, wherein the plurality of second imaging unit is installed so as to be positioned between each of the plurality of first lighting unit each of the second reflection mirror for refracting and irradiating the grid image reflected from the inspection object, 상기 제2반사거울의 일측에 설치되어 격자이미지를 촬영하는 3차원촬영부로 구성됨을 특징으로 하는 AOI 장치.The AOI apparatus, characterized in that the three-dimensional photographing unit is installed on one side of the second reflection mirror to take a grid image. 제5항에 있어서, 상기 3차원촬영부는 제2반사거울의 일측에 설치되어 굴절되어 조사되는 격자이미지를 여과시켜 출력하는 이미지필터와,The image filter of claim 5, wherein the three-dimensional photographing unit is installed at one side of the second reflecting mirror to filter and output a grid image irradiated and refracted; 상기 이미지필터의 일측에 설치되어 여과된 격자이미지를 결상시키는 제2결상렌즈와,A second imaging lens installed at one side of the image filter to form a filtered grid image; 상기 제2결상렌즈의 일측에 설치되어 격자이미지를 촬영하는 제2카메라로 구성되며, A second camera installed at one side of the second imaging lens and photographing a grid image; 상기 이미지필터는 주파수 필터, 칼라필터, 광세기 조절필터 중 하나가 적용되며, 상기 카메라는 CCD 카메라나 CMOS 카메라 중 하나가 적용됨을 특징으로 하는 AOI 장치.The image filter is one of a frequency filter, a color filter, a light intensity control filter is applied, the camera is an AOI device, characterized in that one of the CCD camera or CMOS camera.
KR1020080042561A 2008-05-07 2008-05-07 Automatic optical inspection apparatus KR100969349B1 (en)

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US11120544B2 (en) 2018-10-18 2021-09-14 Samsung Display Co., Ltd. Display panel inspection system, inspection method of display panel and display panel using the same

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KR102108724B1 (en) * 2019-03-07 2020-05-08 문준호 inspection system using infrared light and visible light
CN114815280A (en) * 2022-06-29 2022-07-29 深圳市信润富联数字科技有限公司 Method and system for multi-faceted focused imaging

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